Stacked piezoelectric ceramic and manufacturing method thereof

Abstract

The invention relates to the technical field of piezoelectric material preparation, and discloses stacked piezoelectric ceramic and a manufacturing method thereof. The stacked piezoelectric ceramic comprises a piezoelectric ceramic layer, an electrode layer and an extraction electrode, wherein the piezoelectric ceramic layer and the electrode layer are stacked with each other. And the positive electrode layers and the negative electrode layers are alternately arranged between the stacked piezoelectric ceramic layers. One side edge of the positive electrode layer is provided with a first gap. And a second gap is formed in one side edge of the negative electrode layer. The first notches and the second notches are arranged in columns on the two opposite sides of the piezoelectric ceramic layer. The positive extraction electrode is connected with all the positive electrode layers corresponding to the area of the second notch. The negative extraction electrode is connected with all the negative electrode layers corresponding to the area of the first notch. According to the structure of the first gap and the second gap, the area of an isolation region is greatly reduced, the stress is greatly reduced, and the service life of a product is prolonged. The manufacturing method has the advantages of being low in production cost, high in production precision, high in yield and long in product service life by optimizing the process route and the process parameters.

Description

Technical Field

[0001] The present invention belongs to the technical field of piezoelectric material preparation, and in particular relates to a stacked piezoelectric ceramic and a method for preparing the same. Background Art

[0002] As an important functional material, piezoelectric ceramics are widely used in many fields, such as ultrasonic transducers, sensors, and drivers. Piezoelectric ceramic drivers can achieve low voltage and large displacement driving, which is mainly achieved by increasing the number of piezoelectric ceramic layers and reducing the thickness of each piezoelectric ceramic layer. Figure 8-10 As can be seen from the multilayer structure, the piezoelectric ceramic actuator consists of piezoelectric ceramic layers 1, electrode layers 2, and lead electrodes 3. The electrode layers 2 are alternately connected to the lead electrodes 3 on either side of the piezoelectric ceramic layer 1. Thus, each piezoelectric ceramic layer 1 is sandwiched between the positive electrode layer 21 and the negative electrode layer 22, forming a displacement unit. These units are applied with equal voltage via the lead electrodes 3, and the total displacement of the piezoelectric ceramic actuator is the sum of the displacements of each unit. The entire structure is mechanically connected in series and electrically connected in parallel, resulting in a strong sense of integrity.

[0003] There are two main structures of the electrode layer 2 in the prior art: Figure 9 A rectangular electrode layer 2 is printed on the piezoelectric ceramic layer 1, and an isolation area 13 of a certain width is left between the three sides of the electrode layer 2 and the three sides of the piezoelectric ceramic layer 1, that is, the three strip-shaped isolation areas 13 are not printed with Ag slurry.

[0004] Prior art 2, refer to Figure 10 A rectangular electrode layer 2 is printed on the piezoelectric ceramic layer 1, and an isolation area 13 of a certain width is left between one side of the electrode layer 2 and one side of the piezoelectric ceramic layer 1, that is, a strip-shaped isolation area 13 is not printed with Ag slurry.

[0005] Isolation region 13 exerts a certain amount of stress. The larger the isolation region 13 and the higher the stack height of the piezoelectric ceramic 1 and electrode layer 2, the greater the stress, and the shorter the product's service life. In prior art 1 and prior art 2, however, isolation region 13 is larger, generating greater stress and impacting the product's service life.

[0006] Existing methods for producing multilayer piezoelectric ceramics involve directly stacking raw piezoelectric ceramic layers 1, each tens of microns thick, to a predetermined height, for example, 18 mm. The layers are then sintered and then thermally cut. This method presents the following problems: 1. The higher the stacking height, the more expensive the stacking equipment becomes, and the worse the stacking straightness and precision. 2. Each piezoelectric ceramic layer 1 must be hot-pressed after stacking. The more layers stacked, the more frequent the hot-pressing, making the bottom piezoelectric ceramic layer 1 susceptible to damage. 3. The higher the stacking height, the more difficult thermal cutting becomes, and the more expensive the cutting equipment becomes.

[0007] Based on the above, the purpose of the present invention is to provide a stacked piezoelectric ceramic with a stable structure and a long service life and a method for manufacturing the same, and to make the manufacturing method have low production cost and high yield, and the generated stacked piezoelectric ceramic has the characteristics of good straightness, high precision and long service life. Summary of the Invention

[0008] The purpose of the present invention is to provide a stacked piezoelectric ceramic, aiming to solve the problems in the prior art of high stress, poor structural stability, and short life of multilayer piezoelectric ceramics, as well as the problems of high equipment requirements, high production costs, low yield, and low manufacturing precision required for the production method of multilayer piezoelectric ceramics.

[0009] The present invention is achieved by providing a stacked piezoelectric ceramic comprising:

[0010] Piezoelectric ceramic layers and electrode layers stacked on each other, and lead electrodes;

[0011] The electrode layer includes a positive electrode layer and a negative electrode layer, and the positive electrode layer and the negative electrode layer are alternately arranged between the stacked piezoelectric ceramic layers;

[0012] A first notch is provided on one side of the positive electrode layer, and a second notch is provided on one side of the negative electrode layer, wherein the first notch and the second notch are arranged in a row on two opposite sides of the piezoelectric ceramic layer;

[0013] The lead-out electrodes include a positive lead-out electrode and a negative lead-out electrode. The positive lead-out electrode is connected to all positive electrode layers in the area corresponding to the second notch, and the negative lead-out electrode is connected to all negative electrode layers in the area corresponding to the first notch.

[0014] Furthermore, the length and width of the first notch and the second notch are L and W, respectively, 2mm≤L≤5mm, 0.4mm≤W≤0.8mm.

[0015] Furthermore, the first notch and the second notch are respectively arranged at the middle of one side of the positive electrode layer and the negative electrode layer; or the first notch and the second notch are respectively arranged at the end of one side of the positive electrode layer and the negative electrode layer.

[0016] Furthermore, the bottom layer and the top layer of the piezoelectric ceramic layer are respectively provided with a lower insulating layer and an upper insulating layer.

[0017] Furthermore, the lead-out electrode is welded with a conductive lead, and the outer surfaces of the piezoelectric ceramic layer, the electrode layer and the lead-out electrode are covered with an insulating adhesive layer.

[0018] A method for manufacturing a stacked piezoelectric ceramic comprises the following steps:

[0019] S1: Hot press the multilayer piezoelectric ceramic layer at a temperature of 60°C and a pressure of 4-5 kg / cm 2 , forming a lower insulating layer;

[0020] S2: Printing a positive electrode layer with a first notch on the lower insulating layer and drying it at 50-70°C for 5-10 minutes; after drying, laminating a piezoelectric ceramic layer on the positive electrode layer; then performing hot pressing, printing a negative electrode layer with a second notch on the piezoelectric ceramic layer, and drying it again; repeating the above process, repeatedly laminating the positive electrode layer, piezoelectric ceramic layer, and negative electrode layer to a predetermined unit height, and laminating an insulating layer on top;

[0021] S3: The stacked piezoelectric ceramics are plastic-sealed and then isostatically pressed at a temperature of 60°C and a pressure of 50 MPa for 10 minutes.

[0022] S4: After isostatic pressing, the stacked piezoelectric ceramics are thermally cut with a cutting knife temperature of 80°C.

[0023] S5: After thermal cutting, debinding the stacked piezoelectric ceramics;

[0024] S6: After debinding, the stacked piezoelectric ceramics are sintered;

[0025] S7: Grind the stacked piezoelectric ceramics to ensure that the parallelism of the upper and lower surfaces is less than 5 microns and the dimensional tolerance is less than 5 microns; the parallelism of the side surfaces is less than 10 microns and the dimensional difference is less than 10 microns;

[0026] S8: Screen-printing a positive lead electrode on the side of the positive electrode layer corresponding to the second notch. After printing, sintering the positive lead electrode at a temperature of 600-800° C.

[0027] S9: Screen-printing a negative lead-out electrode on the side of the negative electrode layer corresponding to the first notch. After printing, sintering the negative lead-out electrode at a temperature of 600-800° C.

[0028] S10: After the lead electrodes are sintered, the stacked piezoelectric ceramics are polarized.

[0029] Furthermore, in step S1, 10 layers of 45-micron-thick piezoelectric ceramic layers are stacked and hot-pressed to form a lower insulating layer; in step S2, 10 layers of 45-micron-thick piezoelectric ceramic layers are stacked and hot-pressed to form an upper insulating layer.

[0030] Furthermore, in step S2, the positive electrode layer, the piezoelectric ceramic layer and the negative electrode layer are repeatedly stacked until the unit height reaches 2-3 mm.

[0031] Furthermore, step S5.1 is further included between step S5 and step S6; S5.1: stacking a number of 2-3 mm stacked piezoelectric ceramics after debonding to a preset total height by adhesive.

[0032] Furthermore, step S10 further includes step S11;

[0033] S11: welding wires and sealing with insulating glue; welding conductive wires to the positive lead electrode and the negative lead electrode respectively; then dipping the stacked piezoelectric ceramic in insulating glue, and after curing, the insulating glue layer covers the outer surface of the stacked piezoelectric ceramic.

[0034] The stacked piezoelectric ceramic structure of the present invention features first and second notches in the positive and negative electrode layers. This significantly reduces the isolation area and stress compared to existing technologies. The alternating stacking of the piezoelectric ceramic sleeves and electrode layers ensures a stable connection and a long product life. The dimensions of the first and second notches, as well as their symmetric or diagonal arrangement, ensure a reliable connection between the electrode layers and the lead-out electrodes while minimizing stress.

[0035] The manufacturing method of the present invention uses a piezoelectric ceramic layer embryo with a thickness of tens of microns and an electrode layer to stack to a unit height of several millimeters. After the thermal cutting and debonding process, several stacked piezoelectric ceramics of several millimeters are bonded to a preset total height by adhesive, for example, stacked to 18 mm, and then sintered as a whole. The beneficial effects of the manufacturing method of the present invention are as follows: 1. Each stacked piezoelectric ceramic unit has good linearity due to the small number of stacked layers. The local linearity ensures the overall linearity and the manufacturing precision is high. 2. The small number of stacked layers has low requirements for stacking equipment and thermal cutting equipment, which greatly reduces the equipment cost. 3. It avoids hot pressing the piezoelectric ceramic layer stacked on the bottom layer for more than a hundred times, and the piezoelectric ceramics on the bottom layer are not easily damaged, the product yield is high, and the service life is long.

[0036] By optimizing the process route and process parameters, the stacked piezoelectric ceramic electrode layer produced by the manufacturing method of the present invention has good continuity and few defects. The junction between the electrode layer and the piezoelectric ceramic layer is mutually fused to improve the bonding strength, making the product structure stable and greatly improving the service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 This is a schematic diagram of the three-dimensional structure of the stacked piezoelectric ceramic provided by the present invention;

[0038] Figure 2 This is an exploded view of the stacked piezoelectric ceramic provided by the present invention;

[0039] Figure 3 is a top view of a stacked combination of a piezoelectric ceramic layer and an electrode layer provided by the present invention;

[0040] Figure 4 is a top view of another stacked combination of a piezoelectric ceramic layer and an electrode layer provided by the present invention;

[0041] Figure 5 This is a schematic diagram of the three-dimensional structure of another stacked piezoelectric ceramic provided by the present invention;

[0042] Figure 6 This is a process diagram of a method for manufacturing stacked piezoelectric ceramics provided by the present invention;

[0043] Figure 7 This is another partial process diagram of the method for manufacturing the stacked piezoelectric ceramic provided by the present invention;

[0044] Figure 8 This is a front view of a piezoelectric ceramic driver provided by the prior art;

[0045] Figure 9 It is a top view of a stacked combination of a piezoelectric ceramic layer and an electrode layer provided by prior art 1;

[0046] Figure 10 It is a top view of the stacked combination of the piezoelectric ceramic layer and the electrode layer provided by the second prior art;

[0047] In the figure: 1-piezoelectric ceramic layer; 11-lower insulating layer; 12-upper insulating layer; 13-isolation area; 2-electrode layer; 21-positive electrode layer; 211-first gap; 22-negative electrode layer; 221-second gap; 3-lead-out electrode; 31-positive lead-out electrode; 32-negative lead-out electrode; 4-conductive lead; 5-insulating adhesive layer. DETAILED DESCRIPTION

[0048] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0049] The implementation of the present invention is described in detail below with reference to specific embodiments.

[0050] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of the present invention, it should be understood that if the terms "up", "down", "left", "right", etc. indicate directions or positional relationships, they are based on the directions or positional relationships shown in the drawings. This is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as limiting the present invention. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0051] Reference Figure 1-7 The figure shows a preferred embodiment of the present invention.

[0052] A stacked piezoelectric ceramic comprises a piezoelectric ceramic layer 1, an electrode layer 2 and an extraction electrode 3, referring to Figure 1 . The piezoelectric ceramic layers 1 and the electrode layers 2 are stacked alternately with each other. The electrode layer 2 includes a positive electrode layer 21 and a negative electrode layer 22. The positive electrode layer 21 and the negative electrode layer 22 are alternately arranged between the stacked piezoelectric ceramic layers 1, that is, the positive electrode layer 21 and the negative electrode layer 22 are alternately connected to the piezoelectric ceramic layer 1. The bottom layer of the electric ceramic layer 1 is provided with a lower insulating layer 11, and the top layer of the electric ceramic layer 1 is provided with an upper insulating layer 12. The lower insulating layer 11 and the upper insulating layer 12 are both formed by hot pressing several layers of piezoelectric ceramic layers 1. Specifically, the stacked piezoelectric ceramics are, from bottom to top, the lower insulating layer 11, the positive electrode layer 21, the first piezoelectric ceramic layer 1, the negative electrode layer 22, the second piezoelectric ceramic layer 1... and so on and so forth to the Nth piezoelectric ceramic layer 1, the positive electrode layer 21 (or the negative electrode layer 22), and the upper insulating layer 12. Each piezoelectric ceramic layer 1 is sandwiched between the positive electrode layer 21 and the negative electrode layer 22 to form a displacement unit. The total displacement is the sum of each displacement unit.

[0053] A first notch 211 is provided on one side of the positive electrode layer 21, and a second notch 221 is provided on one side of the negative electrode layer 22. Figure 2. The area enclosed by the first notch 211 and the second notch 221 corresponds to the isolation area 13 of the prior art, and no Ag slurry is printed in the isolation area 13. The first notch 211 and the second notch 221 are arranged in a row on opposite sides of the piezoelectric ceramic layer 1. The lengths of the first notch 211 and the second notch 221 are respectively smaller than the side lengths of the corresponding positive electrode layer 21 and the negative electrode layer 22. The side lengths of the first notch 211 and the second notch 221 are preferably less than or equal to 1 / 2 of the side lengths of the positive electrode layer 21 and the negative electrode layer 22. The length and width of the first notch 211 and the second notch 221 are set to L and W, respectively, and the preferred range is: 2mm≤L≤5mm, 0.4mm≤W≤0.8mm, refer to Figure 4 The isolation area 13 formed by the first notch 211 and the second notch 221 of the present invention is much smaller than the area of ​​the prior art 1 and 2, which greatly reduces stress, improves the stability of the product connection, and thus extends the service life of the product.

[0054] The lead-out electrodes 3 are disposed on the sides of the piezoelectric ceramic layer 1 and the electrode layer 2, and include a positive lead-out electrode 31 and a negative lead-out electrode 32. The positive lead-out electrode 31 is connected to all positive electrode layers 21 in the region corresponding to the second notch 221, while the negative lead-out electrode 32 is connected to all negative electrode layers 22 in the region corresponding to the first notch 211. The two ends of the second notch 221 are exposed on either side of the positive lead-out electrode 31, preventing the positive lead-out electrode 31 from contacting the sides of the negative electrode layer 22. The two ends of the first notch 211 are exposed on either side of the negative lead-out electrode 32, preventing the negative lead-out electrode 32 from contacting the sides of the positive electrode layer 21.

[0055] Example 1: The first notch 211 and the second notch 221 are respectively provided in the middle of one side of the positive electrode layer 21 and the negative electrode layer 22, referring to Figure 3 The first notches 211 and the second notches 221 are stacked symmetrically on both sides of the piezoelectric ceramic layer 1 in a vertical row, that is, the first notches 211 and the second notches 221 are arranged along the length direction of the piezoelectric ceramic layer 1 when viewed from above.

[0056] Example 2: The first notch 211 and the second notch 221 are respectively provided at the ends of one side of the positive electrode layer 21 and the negative electrode layer 22, referring to Figure 4 The first notches 211 and the second notches 221 are stacked in a vertical row and staggered relative to each other on both sides of the piezoelectric ceramic layer 1 , that is, the first notches 211 and the second notches 221 are arranged along a diagonal direction in a top view of the piezoelectric ceramic layer 1 .

[0057] In order to protect the outer surface of the stacked piezoelectric ceramic, an insulating adhesive layer 5 is coated on its outer surface. There are two implementation methods: a. The outer surfaces of the piezoelectric ceramic layer 1, the electrode layer 2, the lower insulating layer 11 and the upper insulating layer 12 that are not covered by the lead electrodes 3 are covered with an insulating adhesive layer 5, and only the lead electrodes 3 are exposed for external electrical connection. Figure 5 b. Conductive leads 4 are welded to the lead electrodes 3. The outer surfaces of the piezoelectric ceramic layer 1, the electrode layer 2, and the lead electrodes 3 are covered with an insulating adhesive layer 5. The partially or fully exposed conductive leads 4 are used for external electrical connection.

[0058] The method for making the stacked piezoelectric ceramics of the present invention is as follows: Figure 6 , including the following steps:

[0059] S1: Hot press the multilayer piezoelectric ceramic layer 1 at a temperature of 60°C and a pressure of 4-5 kg / cm 2 , forming the lower insulating layer 11. Preferably, 10 layers of 45 micron thick piezoelectric ceramic layers 1 are stacked and hot-pressed to form the lower insulating layer 11.

[0060] S2: Print a positive electrode layer 21 with a first notch 211 on the lower insulating layer 11 and dry it at 50-70°C for 5-10 minutes. After drying, stack the piezoelectric ceramic layer 1 on the positive electrode layer 21 and then perform hot pressing. After hot pressing, print a negative electrode layer 22 with a second notch 221 on the piezoelectric ceramic layer 1 and dry it again. Repeat the above process, stack the positive electrode layer 21, piezoelectric ceramic layer 1, and negative electrode layer 22 repeatedly, stack them to a preset unit height, and stack the upper insulating layer 12 on top. Preferably, 25-38 layers of 45-micron-thick piezoelectric ceramic layers 1 are stacked between the lower insulating layer 11 and the upper insulating layer 12, and the unit height of the stacked piezoelectric ceramic is 2-3 mm.

[0061] S3: The stacked piezoelectric ceramics are plastic-sealed and then isostatically pressed at a temperature of 60° C., a pressure of 50 MPa, and an isostatic pressing time of 10 minutes.

[0062] S4: The stacked piezoelectric ceramics after static pressing are thermally cut, and the cutting knife temperature is 80°C.

[0063] S5: Debinding the stacked piezoelectric ceramics that have been hot-cut in S4, preferably at a debinding temperature of 0-550°C.

[0064] S6: After debinding in S5 is completed, the stacked piezoelectric ceramics are sintered. The preferred sintering temperature is 900-1000°C.

[0065] S7: Grind the stacked piezoelectric ceramics to ensure that the parallelism of the upper and lower surfaces is less than 5 microns and the dimensional tolerance is less than 5 microns; the parallelism of the side surfaces is less than 10 microns and the dimensional tolerance is less than 10 microns.

[0066] S8: Screen-print the positive lead electrode 31 on the side of the positive electrode layer 21 corresponding to the second notch 221. After printing, sinter the positive lead electrode 31 at a temperature of 600-800°C for 30 minutes.

[0067] S9: Screen-print the negative lead-out electrode 32 on the side of the negative electrode layer 22 corresponding to the first notch 211. After printing, sinter the negative lead-out electrode 32 at a temperature of 600-800° C. for 30 minutes.

[0068] S10: After the lead electrode 3 is sintered, the stacked piezoelectric ceramic is subjected to oil bath polarization at a polarization voltage of 300 V and a temperature of 110-130°C.

[0069] Preparation method embodiment 1: refer to Figure 7 Step S5 further includes stacking a number of 2-3 mm stacked piezoelectric ceramics after debonding to a preset total height, for example, stacking to 18 mm, and bonding adjacent stacked piezoelectric ceramics with adhesive.

[0070] Manufacturing Method Example 2: Step S10 also includes step S11: sealing with insulating adhesive. The outer surfaces of the piezoelectric ceramic layer 1, electrode layer 2, lower insulating layer 11, and upper insulating layer 12 not covered by the lead-out electrodes 3 are covered with an insulating adhesive layer 5. The exposed lead-out electrodes 3 are used for connection to an external power source.

[0071] Manufacturing Method Example 3: Step S10 also includes step S11: Wire bonding and sealing with insulating adhesive. Conductive leads 4 are welded to the positive lead electrode 31 and the negative lead electrode 32, respectively. Then, the conductive leads 4 are clamped and the stacked piezoelectric ceramic is dipped in insulating adhesive. After curing, an insulating adhesive layer 5 covers the outer surface of the stacked piezoelectric ceramic. Conductive leads 4 are partially or completely uncovered by the insulating adhesive layer 5 for connection to an external power source.

[0072] This does not limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A stacked piezoelectric ceramic, characterized in that: include: A piezoelectric ceramic layer (1) and an electrode layer (2) stacked on each other, and a lead electrode (3); The electrode layer (2) comprises a positive electrode layer (21) and a negative electrode layer (22), wherein the positive electrode layer (21) and the negative electrode layer (22) are alternately arranged between the stacked piezoelectric ceramic layers (1); A first notch (211) is provided on one side of the positive electrode layer (21), and a second notch (221) is provided on one side of the negative electrode layer (22), wherein the first notch (211) and the second notch (221) are arranged in a row on two opposite sides of the piezoelectric ceramic layer (1); The extraction electrode (3) comprises a positive extraction electrode (31) and a negative extraction electrode (32); the positive extraction electrode (31) is connected to all positive electrode layers (21) in an area corresponding to the second notch (221); and the negative extraction electrode (32) is connected to all negative electrode layers (22) in an area corresponding to the first notch (211).

2. The stacked piezoelectric ceramic according to claim 1, wherein: The length and width of the first notch (211) and the second notch (221) are L and W, respectively, 2mm≤L≤5mm, and 0.4mm≤W≤0.8mm.

3. The stacked piezoelectric ceramic according to claim 1, wherein: The first notch (211) and the second notch (221) are respectively arranged at the middle of one side of the positive electrode layer (21) and the negative electrode layer (22); or the first notch (211) and the second notch (221) are respectively arranged at the end of one side of the positive electrode layer (21) and the negative electrode layer (22).

4. The stacked piezoelectric ceramic according to claim 1, wherein: The bottom layer and top layer of the piezoelectric ceramic layer (1) are respectively provided with a lower insulating layer (11) and an upper insulating layer (12).

5. The stacked piezoelectric ceramic according to claim 1, wherein: The lead-out electrode (3) is welded with a conductive lead (4), and the outer surfaces of the piezoelectric ceramic layer (1), the electrode layer (2) and the lead-out electrode (3) are covered with an insulating adhesive layer (5).

6. A method for manufacturing a stacked piezoelectric ceramic, characterized in that: The manufacturing method is used to manufacture the stacked piezoelectric ceramic according to any one of claims 1 to 5, comprising the following steps: S1: Hot press the multilayer piezoelectric ceramic layer (1) at a temperature of 60°C and a pressure of 4-5 kg / cm 2 , forming a lower insulating layer (11); S2: printing a positive electrode layer (21) with a first notch (211) on the lower insulating layer (11), and drying at 50-70°C for 5-10 minutes; after drying, laminating a piezoelectric ceramic layer (1) on the positive electrode layer (21); then performing hot pressing, printing a negative electrode layer (22) with a second notch (221) on the piezoelectric ceramic layer (1), and drying again; repeating the above process, repeatedly laminating the positive electrode layer (21), the piezoelectric ceramic layer (1), and the negative electrode layer (22), laminating to a preset unit height, and laminating the insulating layer (12) on the top; S3: The stacked piezoelectric ceramics are plastic-sealed and then isostatically pressed at a temperature of 60°C and a pressure of 50 MPa for 10 minutes. S4: After isostatic pressing, the stacked piezoelectric ceramics are thermally cut with a cutting knife temperature of 80°C. S5: After thermal cutting, debinding the stacked piezoelectric ceramics; S6: After debinding, the stacked piezoelectric ceramics are sintered; S7: Grind the stacked piezoelectric ceramics to ensure that the parallelism of the upper and lower surfaces is less than 5 microns and the dimensional tolerance is less than 5 microns; the parallelism of the side surfaces is less than 10 microns and the dimensional difference is less than 10 microns; S8: screen-printing a positive lead-out electrode (31) on the side of the positive electrode layer (21) corresponding to the second notch (221), and after printing, sintering the positive lead-out electrode (31) at a temperature of 600-800°C; S9: screen-printing a negative lead-out electrode (32) on the side of the negative electrode layer (22) corresponding to the first notch (211), and after printing, sintering the negative lead-out electrode (32) at a temperature of 600-800°C; S10: After the lead electrode (3) is sintered, the stacked piezoelectric ceramic is polarized.

7. The method for manufacturing a stacked piezoelectric ceramic according to claim 6, wherein: In step S1, 10 layers of 45-micron-thick piezoelectric ceramic layers (1) are stacked and hot-pressed to form a lower insulating layer (11); in step S2, 10 layers of 45-micron-thick piezoelectric ceramic layers (1) are stacked and hot-pressed to form an upper insulating layer (12).

8. The method for manufacturing a stacked piezoelectric ceramic according to claim 6, wherein: In step S2, the positive electrode layer (21), the piezoelectric ceramic layer (1) and the negative electrode layer (22) are repeatedly stacked until the unit height reaches 2-3 mm.

9. The method for manufacturing a stacked piezoelectric ceramic according to claim 8, wherein: The method further includes step S5.1 between step S5 and step S6; S5.1: stacking a plurality of 2-3 mm stacked piezoelectric ceramics after debonding to a preset total height by adhesive.

10. The method for manufacturing a stacked piezoelectric ceramic according to claim 8, wherein: Step S10 and step S11 are also included; S11: welding wires and sealing with insulating glue; welding conductive wires (4) to the positive lead electrode (31) and the negative lead electrode (32), respectively; then dipping the stacked piezoelectric ceramic in insulating glue, and after curing, the insulating glue layer (5) covers the outer surface of the stacked piezoelectric ceramic.

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