Laminated assembly equipment based on switch reed and assembly process thereof

Abstract

The invention discloses laminated assembly equipment based on a switch reed and an assembly process thereof. The laminated assembly equipment based on the switch reeds is used for carrying out laminated assembly on a plurality of switch reeds, each switch reed is provided with a reed body and an annular extension edge, and the laminated assembly equipment comprises a base station, a three-axis manipulator, a rolling device and a laminating jig. The three-axis mechanical arm comprises a cantilever hanging frame, an X-axis moving assembly used for driving the cantilever hanging frame to reciprocate in the horizontal X-axis direction, a Y-axis moving assembly used for driving the cantilever hanging frame to reciprocate in the horizontal Y-axis direction and a Z-axis moving assembly used for driving the cantilever hanging frame to reciprocate in the vertical Z-axis direction. The stacking jig is installed on the base table, and the rolling device is installed on the cantilever hanging frame and located above the stacking jig. According to the laminated assembly equipment based on the switch reeds and the assembly process of the laminated assembly equipment, the plurality of switch reeds are quickly and accurately laminated on the circuit board.

Description

Technical Field

[0001] The present invention relates to the technical field of switch reed production, in particular to a stacking assembly device based on switch reeds and an assembly process thereof. Background Art

[0002] like Figure 1 and Figure 2 The figure shows the structure and cross-sectional view of a conventional switch reed 10. This switch reed 10 is primarily used in electronic circuit technology, utilizing its elasticity to achieve on / off switching or signal control. This switch reed 10 is approximately 2 mm long, 1.5 mm wide, and 0.2 mm thick, making it very thin and lightweight.

[0003] For example, a common mobile phone side button uses a switch reed 10 to realize circuit control. When the side button of the mobile phone is pressed with a finger, the switch reed 10 is elastically deformed by the force, thereby triggering the contact on the circuit board 20 (such as Figure 3 As shown), when the finger no longer presses the side button of the mobile phone, the switch reed 10 recovers its elastic deformation.

[0004] A silver coating will be formed at the contact position between the switch reed 10 and the circuit board 20. Silver has good electrical conductivity. Figure 3 As shown, when the switch reed 10 is subjected to force and elastically deforms, the switch reed 10 will slide left and right relative to the circuit board 20, generating sliding friction. Since the contact area between the switch reed 10 and the circuit board 20 is very small, the silver plating layer is easily scraped off during long-term use, resulting in poor contact.

[0005] The present invention adds a ring-shaped extension edge 12 (such as Figure 4 and Figure 5 As shown), the contact area with the circuit board 20 can be increased, thereby extending the service life of the electronic components.

[0006] In addition, in conventional technology, only one switch reed is usually provided on the circuit board 20, which results in insufficient elasticity of the switch reed and poor tactile feedback. However, the present invention provides a plurality of switch reeds stacked on each other on the circuit board 20 (such as Figure 6 As shown), the overall elastic force is increased by increasing the number of switch reeds.

[0007] As can be seen from the above, on the one hand, the switch reeds are very small and are randomly stacked together, making it difficult for ordinary robots to pick up and assemble the switch reeds; on the other hand, if several switch reeds are stacked on each other on the circuit board 20, assembly is even more difficult. Summary of the Invention

[0008] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a switch reed based stacking assembly device and an assembly process thereof, so as to quickly and accurately stack a plurality of switch reeds on a circuit board.

[0009] The object of the present invention is achieved through the following technical solutions:

[0010] A stacking assembly device based on switch reeds is used to stack and assemble a plurality of switch reeds. The switch reeds have a reed body and an annular extension edge, and include: a base, a three-axis manipulator, a rolling device, and a stacking jig;

[0011] The three-axis manipulator includes: a cantilever hanger, an X-axis moving assembly for driving the cantilever hanger to reciprocate along the horizontal X-axis direction, a Y-axis moving assembly for driving the cantilever hanger to reciprocate along the horizontal Y-axis direction, and a Z-axis moving assembly for driving the cantilever hanger to reciprocate along the vertical Z-axis direction;

[0012] The stacking jig is installed on the base, and the rolling device is installed on the cantilever hanger and is located above the stacking jig.

[0013] In one embodiment, the rolling device is a universal ball structure.

[0014] In one embodiment, the X-axis moving assembly, the Y-axis moving assembly, and the Z-axis moving assembly are all motor screw drive structures.

[0015] In one embodiment, the stacking jig includes a circuit board placement frame and a spring placement frame stacked on the circuit board placement frame;

[0016] The circuit board placement frame includes a bottom frame body and a plurality of circuit boards arranged in the bottom frame body; the spring placement frame includes a top frame body and a plurality of spring semi-finished panels stacked in sequence along the vertical direction and accommodated in the top frame body;

[0017] Each of the semi-finished reed panels is obtained by stamping and comprises a waste mesh frame and a plurality of switch reeds temporarily retained on the waste mesh frame; the plurality of switch reeds in each semi-finished reed panel corresponds one to one with the plurality of circuit boards.

[0018] In one embodiment, a plurality of the circuit boards are arranged in a rectangular array within the bottom frame body, and a plurality of the switch reeds are arranged in a rectangular array on the waste mesh frame.

[0019] A stacking assembly process based on switch reeds is implemented by the above-mentioned stacking assembly equipment based on switch reeds, comprising the following steps:

[0020] Step 1: obtain a circuit board placement frame and arrange several circuit boards in the bottom frame body;

[0021] Step 2: Fix the circuit board placement frame on the base;

[0022] Step 3: Obtain a reed placement frame, stack several semi-finished reed panels in sequence along the vertical direction and accommodate them in the top frame body;

[0023] Step 4: stack the spring placement frame on top of the circuit board placement frame;

[0024] Step 5: The Z-axis moving assembly drives the cantilever bracket to descend along the vertical Z-axis direction so that the rolling device is pressed against the semi-finished panel of the spring sheet;

[0025] Step 6: The X-axis moving assembly and the Y-axis moving assembly respectively drive the cantilever bracket to move along the horizontal X-axis direction and the horizontal Y-axis direction, so that the rolling device moves along the surface of the reed semi-finished panel, thereby pressing all the switch reeds on several reed semi-finished panels onto the circuit board at one time.

[0026] The present invention provides a switch reed-based stacking assembly device and an assembly process thereof, which can quickly and accurately stack a plurality of switch reeds on a circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0028] Figure 1 This is a structural diagram of a traditional switch reed;

[0029] Figure 2 for Figure 1 A cross-sectional view of a conventional switch reed is shown;

[0030] Figure 3 For the general Figure 1 The schematic diagram of a conventional switch reed mounted on a circuit board is shown;

[0031] Figure 4 The structural diagram of the switch reed after the structural improvement of the present invention (1);

[0032] Figure 5 The structural diagram (2) of the switch reed after the structural improvement of the present invention;

[0033] Figure 6 For the general Figure 4 A schematic diagram showing several switch reeds stacked and mounted on a circuit board;

[0034] Figure 7 This is a structural diagram of a stacking assembly device based on a switch reed according to an embodiment of the present invention;

[0035] Figure 8 for Figure 7 The structural diagram of the stacking fixture shown;

[0036] Figure 9 for Figure 8 Exploded view of the stacking jig shown;

[0037] Figure 10 A schematic diagram of using a rolling device to press each set of switch reeds into the circuit board;

[0038] Figure 11 This is a schematic diagram of using a punching rod to punch each set of switch reeds into the circuit board. DETAILED DESCRIPTION

[0039] To facilitate understanding of the present invention, the present invention will be described more fully below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present invention. However, the present invention may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present disclosure.

[0040] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly attached to the other element or there may be an intermediate element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0041] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used herein in the specification of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0042] The present invention discloses a stacking assembly device 30 based on a switch reed (such as Figure 7 As shown), it is used to stack and assemble a plurality of switch reeds 10. The switch reed 10 has a reed body 11 and an annular extension edge 12 (as shown Figure 4and Figure 5 The present invention adds an annular extension edge 12 to the edge of a conventional switch reed structure, thereby increasing the contact area with the circuit board 20. During prolonged use, the silver plating between the switch reed 10 and the circuit board 20 is not easily scraped off, thereby extending the service life of the electronic component.

[0043] like Figure 7 As shown, the stacking assembly equipment 30 based on the switch reed includes: a base 100 , a three-axis robot 200 , a rolling device 300 , and a stacking jig 400 .

[0044] like Figure 7 As shown, the three-axis manipulator 200 includes: a cantilever hanger 210, an X-axis moving assembly 220 for driving the cantilever hanger 210 to move back and forth along the horizontal X-axis, a Y-axis moving assembly 230 for driving the cantilever hanger 210 to move back and forth along the horizontal Y-axis, and a Z-axis moving assembly 240 for driving the cantilever hanger 210 to move back and forth along the vertical Z-axis. In this embodiment, the X-axis moving assembly 220, the Y-axis moving assembly 230, and the Z-axis moving assembly 240 are all motor-screw driven structures.

[0045] The stacking jig 400 is mounted on the base 100, and the rolling device 300 is mounted on the cantilever hanger 210 and is located above the stacking jig 400. In this embodiment, the rolling device 300 is a universal ball structure.

[0046] Next, the specific structure of the stacking jig 400 is described:

[0047] like Figure 8 As shown, the stacking jig 400 includes a circuit board placement frame 410 and a spring placement frame 420 stacked on the circuit board placement frame 410 .

[0048] like Figure 9 As shown, the circuit board placement frame 410 includes a bottom frame body 411 and a plurality of circuit boards 412 arranged in the bottom frame body 411; the spring placement frame 420 includes a top frame body 421 and a plurality of spring semi-finished panels 422 stacked in sequence along the vertical direction and accommodated in the top frame body 421.

[0049] like Figure 9 As shown, each semi-finished reed panel 422 is obtained by stamping, and each semi-finished reed panel 422 has a waste mesh frame 423 and a plurality of switch reeds 10 temporarily retained on the waste mesh frame 423; the plurality of switch reeds 10 in each semi-finished reed panel 422 corresponds one-to-one to a plurality of circuit boards 20.

[0050] In this embodiment, a plurality of circuit boards 20 are arranged in a rectangular array within the bottom frame body 411 , and a plurality of switch reeds 10 are arranged in a rectangular array on the waste mesh frame 423 .

[0051] Next, the working principle of the switch reed-based stacking assembly device 30 is described:

[0052] Obtain a circuit board placement frame 410, and arrange a plurality of circuit boards 20 in a bottom frame body 411. Preferably, the plurality of circuit boards 20 are arranged in a rectangular array in the bottom frame body 411.

[0053] Fix the circuit board placement frame 410 on the base 100;

[0054] A reed placement frame 420 is obtained, and several semi-finished reed panels 422 are stacked in sequence along the vertical direction and accommodated in a top frame body 421. Preferably, three layers of semi-finished reed panels 422 are stacked in sequence along the vertical direction and accommodated in the top frame body 421.

[0055] The spring placement frame 420 is stacked on the circuit board placement frame 410;

[0056] The three-axis manipulator 200 is started, and the Z-axis moving assembly 240 drives the cantilever hanger 210 to descend along the vertical Z-axis direction, so that the rolling device 300 is pressed on the semi-finished spring panel 420;

[0057] Next, the X-axis moving assembly 220 and the Y-axis moving assembly 230 drive the cantilever hanger 210 to move along the horizontal X-axis direction and the horizontal Y-axis direction respectively, so that the rolling device 300 moves along the surface of the semi-finished reed panel 420, thereby pressing all the switch reeds 10 on the plurality of semi-finished reed panels 420 onto the circuit board 20 at one time. Specifically, the rolling device 300 first moves forward along the horizontal X-axis direction to press all the switch reeds 10 in one row onto the circuit board 20, then moves along the horizontal Y-axis direction to the next adjacent row of switch reeds 10, and then moves backward along the horizontal X-axis direction to press all the switch reeds 10 in the next row onto the circuit board 20. It can be seen that the rolling device 300 moves in a circuitous route to press all the switch reeds 10 on the semi-finished reed panel 420 onto the circuit board 20 at one time.

[0058] like Figure 10As shown, it is worth noting that when the rolling device 300 approaches each group of switch reeds 10 (for example, three stacked switch reeds 10 are referred to as one group), during the process of the rolling device 300 pressing each group of switch reeds 10 together, due to the elastic deformation of the switch reeds 10, one end of the switch reed 10 will first sink into the groove 21 of the circuit board 20 under the guidance of the annular extension edge 12. Then, as the rolling device 300 moves forward, the remaining portion of the switch reed 10 will gradually sink into the groove 21 of the circuit board 20 under the guidance of the annular extension edge 12. As a result, the switch reed 10 can be completely pressed into the groove 21 of the circuit board 20.

[0059] like Figure 11 As shown, if a punching rod is used from top to bottom to punch each set of switch reeds 10 into the groove 21 of the circuit board 20, the following problems may arise: on the one hand, before the switch reeds 10 fall into the groove 21 of the circuit board 20, the annular extension edge 12 of the switch reed 10 will be tightly pressed against the edge of the groove 21 of the circuit board 20. The entire groove 21 is sealed by the annular extension edge 12 and cannot be quickly and effectively vented. As a result, air bulging occurs in the groove 21, making it difficult for the switch reeds 10 to fall into the groove 21 of the circuit board 20. On the other hand, before the switch reeds 10 fall into the groove 21 of the circuit board 20, the annular extension edge 12 of the switch reed 10 is completely pressed against the edge of the groove 21 of the circuit board 20. This requires a greater punching force to cause the switch reeds 10 to deform so that they can enter the groove 21. However, a greater punching force may cause severe deformation of the switch reeds 10.

[0060] To this end, the present invention utilizes a rolling device 300, coupled with a three-axis manipulator 200. The rolling device 300 utilizes a rolling motion to flexibly press each set of switch reeds 10 into the grooves 21 of the circuit board 20, thereby avoiding the various drawbacks associated with the use of a punching rod. Furthermore, the rolling device 300's circuitous motion allows all switch reeds from several semi-finished reed panels to be pressed onto the circuit board simultaneously, resulting in extremely high efficiency.

[0061] The present invention also discloses a stacking assembly process based on switch reeds, which is implemented by the above-mentioned stacking assembly device 30 based on switch reeds, and includes the following steps:

[0062] Step 1: obtain a circuit board placement frame 410 and arrange a plurality of circuit boards 20 in the bottom frame body 411;

[0063] Step 2: Fix the circuit board placement frame 410 on the base 100;

[0064] Step 3: Obtain a spring placement frame 420, stack several semi-finished spring panels 422 in sequence along the vertical direction and accommodate them in the top frame body 421;

[0065] Step 4: stack the spring placement frame 420 on top of the circuit board placement frame 410;

[0066] Step 5: The Z-axis moving assembly 240 drives the cantilever hanger 210 to descend along the vertical Z-axis direction, so that the rolling device 300 is pressed against the semi-finished spring panel 420;

[0067] In step six, the X-axis moving assembly 220 and the Y-axis moving assembly 230 drive the cantilever bracket 210 to move along the horizontal X-axis direction and the horizontal Y-axis direction respectively, so that the rolling device 300 moves along the surface of the reed semi-finished panel 420, thereby pressing all the switch reeds 10 on several reed semi-finished panels 420 onto the circuit board 20 at one time.

[0068] The above-described embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. A stacking assembly device based on switch reeds, used for stacking and assembling a plurality of switch reeds, wherein the switch reeds have a reed body and an annular extension edge, characterized in that: include: Abutment, three-axis manipulator, rolling device, stacking jig; The three-axis manipulator includes: a cantilever hanger, an X-axis moving assembly for driving the cantilever hanger to reciprocate along the horizontal X-axis direction, a Y-axis moving assembly for driving the cantilever hanger to reciprocate along the horizontal Y-axis direction, and a Z-axis moving assembly for driving the cantilever hanger to reciprocate along the vertical Z-axis direction; The stacking jig is installed on the base, and the rolling device is installed on the cantilever hanger and is located above the stacking jig.

2. The stacking assembly device based on switch reeds according to claim 1, characterized in that: The rolling device is a universal ball structure.

3. The stacking assembly device based on switch reeds according to claim 1, characterized in that: The X-axis moving assembly, the Y-axis moving assembly and the Z-axis moving assembly are all motor screw drive structures.

4. The stacking assembly device based on switch reeds according to claim 1, characterized in that: The stacking jig includes a circuit board placement frame and a spring placement frame stacked on the circuit board placement frame; The circuit board placement frame includes a bottom frame body and a plurality of circuit boards arranged in the bottom frame body; the spring placement frame includes a top frame body and a plurality of spring semi-finished panels stacked in sequence along the vertical direction and accommodated in the top frame body; Each of the semi-finished reed panels is obtained by stamping and comprises a waste mesh frame and a plurality of switch reeds temporarily retained on the waste mesh frame; the plurality of switch reeds in each semi-finished reed panel corresponds one to one with the plurality of circuit boards.

5. The switch reed based stacking assembly device according to claim 4, characterized in that: A plurality of the circuit boards are arranged in a rectangular array in the bottom frame body, and a plurality of the switch reeds are arranged in a rectangular array on the waste mesh frame.

6. A stacking assembly process based on switch reeds, characterized in that: The method is implemented by the switch reed-based stacking assembly device according to any one of claims 4 to 5, comprising the following steps: Step 1: obtain a circuit board placement frame and arrange several circuit boards in the bottom frame body; Step 2: Fix the circuit board placement frame on the base; Step 3: Obtain a reed placement frame, stack several semi-finished reed panels in sequence along the vertical direction and accommodate them in the top frame body; Step 4: stack the spring placement frame on top of the circuit board placement frame; Step 5: The Z-axis moving assembly drives the cantilever bracket to descend along the vertical Z-axis direction so that the rolling device is pressed against the semi-finished panel of the spring sheet; Step 6: The X-axis moving assembly and the Y-axis moving assembly respectively drive the cantilever bracket to move along the horizontal X-axis direction and the horizontal Y-axis direction, so that the rolling device moves along the surface of the reed semi-finished panel, thereby pressing all the switch reeds on several reed semi-finished panels onto the circuit board at one time.

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