A heat dissipation control method and system for an LED-UV printing curing device

Abstract

The application provides a heat dissipation control method and system of an LED-UV printing curing device. The heat dissipation control method comprises the following steps: calling heat dissipation data parameters corresponding to the LED-UV printing curing device from a database; setting a calibration density range corresponding to an LED array of the LED-UV printing curing device according to the heat dissipation data parameters of the LED-UV printing curing device, and obtaining a quantity relationship between an actual LED array distribution density and the calibration density range; and controlling the cooling liquid flow of a micro-channel liquid cooling plate and the fan rotating speed of an axial flow fan group in real time according to the quantity relationship between the actual LED array distribution density and the calibration density range, in combination with actual operation state parameters corresponding to the LED-UV printing curing device. The heat dissipation control system comprises a UV protective layer, an LED array layer, a uniform temperature plate layer, a heat dissipation module and a heat dissipation control module.

Description

Technical Field

[0001] This invention proposes a heat dissipation control method and system for LED-UV printing and curing equipment, belonging to the field of printing heat dissipation control technology. Background Technology

[0002] In the field of LED-UV printing and curing equipment, with the increasing demand for high-precision and high-efficiency printing, the power density and operational stability of LED light sources, as the core component of the curing system, have become key factors restricting equipment performance. LED light sources generate a large amount of heat during operation. If this heat cannot be dissipated effectively and in a timely manner, it will lead to an increase in LED junction temperature, resulting in problems such as luminous efficacy decay, shortened lifespan, and even light source failure. Especially in high-power LED array applications, the cumulative effect of heat is more significant, and traditional passive or single-mode heat dissipation methods are no longer sufficient to meet the requirements for long-term stable operation of the equipment. In existing technologies, heat dissipation solutions for LED-UV curing equipment mostly employ fixed-parameter air-cooling or liquid-cooling systems. For example, air-cooling solutions typically achieve heat dissipation by preset fan speeds, but this method cannot dynamically adjust the heat dissipation capacity according to the actual heat generation of the LED array, resulting in energy waste at low loads and insufficient heat dissipation at high loads. While liquid-cooling solutions can improve heat dissipation efficiency through microchannel liquid cooling plates, the liquid flow rate is often designed based on the equipment's rated power, lacking adaptability to differences in LED array distribution density and real-time operating conditions. In addition, the heat dissipation design of LED arrays in the existing technology is mostly based on standardized parameters, which does not fully consider the different impacts of different printing tasks on the heat dissipation characteristics of LEDs, resulting in insufficient matching between the heat dissipation system and the actual operating conditions of the equipment.

[0003] Meanwhile, existing heat dissipation control methods have the following technical shortcomings:

[0004] Static heat dissipation parameters: Heat dissipation system parameters (such as fan speed and coolant flow rate) are usually set at the factory and cannot be dynamically optimized according to the actual distribution density or operating status of the LED array (such as printing speed and ambient temperature), resulting in an imbalance between heat dissipation efficiency and energy consumption.

[0005] Lack of density adaptability: The distribution density of LED arrays directly affects the heat generation per unit area, but existing technologies have not established a correlation model between LED array density and heat dissipation parameters, making it difficult to achieve precise heat dissipation for LED light sources with different density layouts.

[0006] Lack of coordinated control: Air-cooled and liquid-cooled systems often operate independently, lacking a coordinated control strategy based on multi-parameter fusion, making it impossible to balance heat dissipation efficiency and equipment stability under complex operating conditions.

[0007] To address the aforementioned issues, there is an urgent need in this field for an intelligent control method that can dynamically adjust heat dissipation parameters based on the LED array distribution density and the real-time operating status of the equipment. This would solve the technical bottlenecks of low heat dissipation efficiency, high energy consumption, and poor adaptability in existing technologies, thereby improving the reliability, economy, and process adaptability of LED-UV printing and curing equipment. Summary of the Invention

[0008] This invention provides a heat dissipation control method and system for LED-UV printing and curing equipment to solve the technical problems existing in the prior art. The technical solution adopted is as follows:

[0009] A heat dissipation control method for LED-UV printing and curing equipment, the heat dissipation control method comprising:

[0010] Retrieve the heat dissipation data parameters corresponding to the LED-UV printing and curing equipment from the database;

[0011] Based on the heat dissipation data parameters of the LED-UV printing and curing equipment, set the calibration density range corresponding to the LED array of the LED-UV printing and curing equipment, and obtain the quantitative relationship between the actual LED array distribution density and the calibration density range;

[0012] The coolant flow rate control strategy and the speed control strategy are retrieved, and based on the quantitative relationship between the actual LED array distribution density and the calibrated density range, combined with the actual operating status parameters of the LED-UV printing and curing equipment and the coolant flow rate control strategy and the speed control strategy, the coolant flow rate of the microchannel liquid cooling plate and the fan speed of the axial fan group are controlled in real time.

[0013] Furthermore, retrieving the heat dissipation data parameters corresponding to the LED-UV printing and curing equipment from the database includes:

[0014] Real-time monitoring receives the start command for heat dissipation control of the LED-UV printing and curing equipment;

[0015] When a start command for the heat dissipation control of the LED-UV printing and curing equipment is received, the corresponding heat dissipation data parameters of the LED-UV printing and curing equipment are retrieved from the database. The heat dissipation data parameters include the heat flux density required for heat dissipation, the maximum allowable temperature rise for heat dissipation, the heat diffusion efficiency, the thermal coupling coefficient corresponding to the LED thermal field, and the heat penetration coefficient corresponding to the LED-UV printing and curing equipment.

[0016] Furthermore, based on the heat dissipation data parameters of the LED-UV printing and curing equipment, the calibration density range corresponding to the LED array of the LED-UV printing and curing equipment is set, and the quantitative relationship between the actual LED array distribution density and the calibration density range is obtained, including:

[0017] Based on the heat dissipation data parameters, the ideal distribution density of the LED array corresponding to the LED array layer of the LED-UV printing and curing equipment is set to obtain the calibration density range corresponding to the LED array.

[0018] Extract the actual LED array distribution density corresponding to the LED array layer of the LED-UV printing and curing equipment;

[0019] The actual LED array distribution density of the LED array layer of the LED-UV printing and curing equipment is compared with the calibrated density range to obtain the quantitative relationship.

[0020] Furthermore, based on the aforementioned heat dissipation data parameters, the ideal distribution density of the LED array corresponding to the LED array layer of the LED-UV printing and curing equipment is set to obtain the calibrated density range corresponding to the LED array, including:

[0021] Extract the heat dissipation data parameters corresponding to the LED-UV printing and curing equipment;

[0022] The minimum center-to-center spacing between each pair of adjacent LED array units is obtained by combining the heat dissipation data parameters of the LED-UV printing and curing equipment with the upper limit setting model.

[0023] The maximum center-to-center distance between each pair of adjacent LED array units is obtained by using the heat dissipation data parameters of the LED-UV printing and curing equipment in combination with the lower limit value setting model.

[0024] Furthermore, based on the quantitative relationship between the actual LED array distribution density and the calibrated density range, and combined with the actual operating status parameters corresponding to the LED-UV printing and curing equipment, the coolant flow rate of the microchannel liquid cooling plate is controlled in real time, including:

[0025] Real-time monitoring of whether the temperature of the LED-UV printing and curing equipment has reached the heat dissipation trigger temperature;

[0026] When the temperature of the LED-UV printing and curing equipment reaches the heat dissipation trigger temperature, the quantitative relationship between the actual LED array distribution density and the calibrated density range is retrieved.

[0027] When the actual LED array distribution density is within the calibrated density range, the cold liquid flow is controlled according to the start-up cold liquid flow rate value corresponding to the microchannel liquid cooling plate, and the flow rate is adjusted according to the temperature drop gradient of the LED-UV printing and curing equipment during the heat dissipation process.

[0028] When the actual LED array distribution density is not within the calibrated density range, the flow of cold liquid is controlled according to the cold liquid flow regulation strategy.

[0029] Furthermore, the cooling liquid flow rate control strategy is as follows:

[0030] When the LED array distribution density is not within the calibrated density range, the absolute value corresponding to the minimum difference between the LED array distribution density and the boundary value of the calibrated density range is retrieved as the absolute value of the difference.

[0031] The distribution density difference degree is obtained by comparing the absolute value of the difference with the boundary value span of the calibrated density range.

[0032] The starting coolant flow rate value is set using the aforementioned distribution density difference.

[0033] During the heat dissipation process, the flow rate is adjusted based on the dynamic response cooling rate of the LED-UV printing and curing equipment and the difference in distribution density.

[0034] Furthermore, based on the quantitative relationship between the actual LED array distribution density and the calibrated density range, and combined with the actual operating status parameters corresponding to the LED-UV printing and curing equipment, the fan speed of the axial fan assembly is controlled in real time, including:

[0035] Real-time monitoring of whether the temperature of the LED-UV printing and curing equipment has reached the heat dissipation trigger temperature;

[0036] When the temperature of the LED-UV printing and curing equipment reaches the heat dissipation trigger temperature, the axial fan operation is controlled according to the starting speed value of the axial fan group, and the speed is adjusted according to the temperature drop gradient of the LED-UV printing and curing equipment and the real-time coolant flow rate during the heat dissipation process.

[0037] When the LED array distribution density is within the calibrated density range, the rotation speed of the axial fan group is controlled according to the rotation speed regulation strategy.

[0038] Furthermore, the speed control strategy is as follows:

[0039] When the LED array distribution density is not within the calibrated density range, the absolute value corresponding to the minimum difference between the LED array distribution density and the boundary value of the calibrated density range is retrieved as the absolute value of the difference.

[0040] The distribution density difference degree is obtained by comparing the absolute value of the difference with the boundary value span of the calibrated density range.

[0041] The starting speed value is set by combining the distribution density difference with the current starting coolant flow rate.

[0042] During the heat dissipation process, the rotational speed of the axial fan assembly is adjusted based on the dynamic response cooling rate of the LED-UV printing and curing equipment, combined with the distribution density difference and the current dynamic response rate of the coolant flow rate.

[0043] A heat dissipation control system for an LED-UV printing and curing equipment is provided for any of the aforementioned heat dissipation control methods. The heat dissipation control system includes: a UV protective layer, an LED array layer, a heat spreader layer, a heat dissipation module, and a heat dissipation control module. The UV protective layer directly covers the LED array layer, and the LED array layer includes multiple LED array units. The LED array layer is bonded to its upper surface using optical-grade transparent silicone grease (thickness ≤0.1mm), and sealed around its perimeter with fluororubber sealing rings (IP65 protection). Furthermore, the LED array layer preferably adopts a honeycomb structure; the lower surface of the LED array layer is bonded to the heat spreader layer through a thermal interface material; the lower surface of the heat spreader layer is bonded to the heat dissipation module; the heat dissipation module includes a microchannel liquid cooling plate, a composite heat sink, and an axial fan assembly; wherein, the upper surface of the microchannel liquid cooling plate is bonded to the lower surface of the heat spreader; the lower surface of the microchannel liquid cooling plate is bonded to the composite heat sink; the lower surface of the composite heat sink faces the axial fan assembly; the heat dissipation control module controls the heat dissipation operation of the heat dissipation module through data communication.

[0044] Furthermore, the heat dissipation control module includes:

[0045] The parameter retrieval module is used to retrieve the heat dissipation data parameters corresponding to the LED-UV printing and curing equipment from the database;

[0046] The quantitative relationship acquisition module is used to set the calibration density range corresponding to the LED array of the LED-UV printing and curing equipment according to the heat dissipation data parameters of the LED-UV printing and curing equipment, and to acquire the quantitative relationship between the actual LED array distribution density and the calibration density range.

[0047] The heat dissipation control module is used to retrieve the coolant flow rate regulation strategy and the speed regulation strategy, and based on the quantitative relationship between the actual LED array distribution density and the calibrated density range, combined with the actual operating status parameters of the LED-UV printing and curing equipment and the coolant flow rate regulation strategy and the speed regulation strategy, to control the coolant flow rate of the microchannel liquid cooling plate and the fan speed of the axial fan group in real time.

[0048] Beneficial effects of this invention:

[0049] This invention provides a heat dissipation control method and system for LED-UV printing and curing equipment. The system adjusts heat dissipation parameters in real time based on LED array density, printing speed, and ambient temperature to ensure the LED junction temperature remains stable within a safe range (e.g., ≤50℃), avoiding overheating or underheating. Liquid cooling and air cooling systems work together, fully leveraging their respective advantages. During low-density array or low-power printing, the coolant flow rate and fan speed are reduced, minimizing unnecessary energy consumption. Traditional fixed-parameter heat dissipation solutions may cause equipment shutdowns under high loads due to insufficient heat dissipation; this solution avoids this problem through dynamic adjustment, reducing energy waste caused by downtime. Precise heat dissipation control keeps the LED junction temperature within a safe range, significantly slowing down luminous efficacy decay and light source aging. It reduces equipment failures caused by temperature fluctuations, lowering maintenance costs and downtime. The system can automatically adjust heat dissipation strategies for different printing tasks, ensuring consistent curing results. The heat dissipation system can respond to changes in operating status in real time, ensuring stable operation of the equipment under complex conditions and improving production efficiency. Attached Figure Description

[0050] Figure 1 This is a flowchart of the method described in this invention;

[0051] Figure 2 This is a schematic diagram of the system described in this invention. Detailed Implementation

[0052] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0053] This embodiment proposes a heat dissipation control method for LED-UV printing and curing equipment, such as... Figure 1 As shown, the heat dissipation control method includes:

[0054] Retrieve the heat dissipation data parameters corresponding to the LED-UV printing and curing equipment from the database;

[0055] Based on the heat dissipation data parameters of the LED-UV printing and curing equipment, set the calibration density range corresponding to the LED array of the LED-UV printing and curing equipment, and obtain the quantitative relationship between the actual LED array distribution density and the calibration density range;

[0056] The coolant flow rate control strategy and the speed control strategy are retrieved, and based on the quantitative relationship between the actual LED array distribution density and the calibrated density range, combined with the actual operating status parameters of the LED-UV printing and curing equipment and the coolant flow rate control strategy and the speed control strategy, the coolant flow rate of the microchannel liquid cooling plate and the fan speed of the axial fan group are controlled in real time.

[0057] The step of retrieving the heat dissipation data parameters corresponding to the LED-UV printing and curing equipment from the database includes:

[0058] Real-time monitoring receives the start command for heat dissipation control of the LED-UV printing and curing equipment;

[0059] When a start command for the heat dissipation control of the LED-UV printing and curing equipment is received, the corresponding heat dissipation data parameters of the LED-UV printing and curing equipment are retrieved from the database. The heat dissipation data parameters include the heat flux density required for heat dissipation, the maximum allowable temperature rise for heat dissipation, the heat diffusion efficiency, the thermal coupling coefficient corresponding to the LED thermal field, and the heat penetration coefficient corresponding to the LED-UV printing and curing equipment.

[0060] The working principle of the above technical solution is as follows: First, the heat dissipation control start command of the LED-UV printing and curing equipment is received through the real-time monitoring system to ensure that the heat dissipation strategy is activated only when the equipment is running, thus avoiding ineffective energy consumption.

[0061] Data retrieval and analysis: Extract key heat dissipation data parameters from the device database, including:

[0062] Heat flux density: reflects the heat generated per unit area of ​​the LED array and is used to quantify heat dissipation requirements.

[0063] Maximum allowable temperature rise: Sets the safe upper limit of LED junction temperature to ensure the lifespan of the light source.

[0064] Thermal diffusion efficiency: measures the ability of a heat dissipation system to transfer heat and guides the optimization of heat dissipation strategies.

[0065] Thermal coupling coefficient: describes the intensity of thermal interaction between the LED thermal field and the heat dissipation system, and is used to establish a heat dissipation model.

[0066] Thermal permeability coefficient: Characterizes the thermal conductivity of heat dissipation materials (such as liquid cooling plates and fins), and assists in the design of heat dissipation paths.

[0067] Then, by comparing the actual LED array distribution density with the calibrated density range, the density deviation percentage is obtained; finally, based on the quantitative relationship between the actual LED array distribution density and the calibrated density range, and combined with the actual operating status parameters of the LED-UV printing and curing equipment, the coolant flow rate of the microchannel liquid cooling plate and the fan speed of the axial fan group are controlled in real time.

[0068] The above technical solution achieves the following effects: It adjusts heat dissipation parameters in real time based on LED array density, printing speed, and ambient temperature, ensuring the LED junction temperature remains stable within a safe range and avoiding overheating or underheating. Liquid cooling and air cooling systems work together, fully leveraging their respective advantages. Traditional fixed-parameter heat dissipation solutions may cause equipment shutdowns under high loads due to insufficient heat dissipation, while this solution avoids this problem through dynamic adjustment, reducing energy waste caused by downtime. Precise heat dissipation control keeps the LED junction temperature within a safe range, significantly slowing down luminous efficacy decay and light source aging. It reduces equipment failures caused by temperature fluctuations, lowering maintenance costs and downtime. Furthermore, because different printing tasks correspond to different LED array operating states, the heat exchange intensity and heat diffusion efficiency between the LED array and the heat dissipation system vary. Therefore, the above technical solution in this embodiment can automatically adjust the heat dissipation strategy based on the different operating states and thermal characteristics of the LED array under different printing tasks, ensuring consistent curing results. The heat dissipation system can respond to changes in operating status in real time, ensuring stable operation of the equipment under complex working conditions and improving production efficiency. For example, in the production of food packaging boxes, multi-color printing processes may be used due to the need for rich colors and intricate patterns. This results in the LED array operating at high intensity for extended periods during printing, generating significant heat and resulting in intense heat exchange with the cooling system, while also significantly impacting heat dissipation efficiency. In contrast, when printing simple express delivery boxes, the printed patterns are relatively simple, the LED array operates at lower intensity, and generates less heat. This heat dissipation control technology can automatically adjust its cooling strategy based on these different printing tasks. When printing food packaging boxes, the coolant flow rate of the microchannel liquid cooling plate and the fan speed of the axial fan assembly are adjusted in real time based on the heat exchange intensity and heat dissipation efficiency between the LED array and the cooling system under that task, quickly removing the heat generated by the LED array. When printing express delivery boxes, the coolant flow rate and fan speed are adjusted appropriately to avoid energy waste.

[0069] On the other hand, existing technologies typically use fixed heat dissipation parameters (such as constant coolant flow rate and fan speed) without differentiating adjustments based on the heat dissipation characteristics (such as heat flux density and thermal diffusion efficiency) of different devices. This solution retrieves device-specific heat dissipation data parameters (such as heat flux density and thermal coupling coefficient) from a database to establish a heat dissipation model strongly bound to the device's hardware characteristics. This makes the control strategy more aligned with actual heat dissipation needs, avoiding insufficient heat dissipation or energy waste caused by a "one-size-fits-all" approach. Existing technologies may not clearly define the quantitative relationship between LED array distribution density and heat dissipation efficiency, relying solely on empirically set thresholds. This solution sets a calibrated density range for the LED array and calculates the quantitative relationship between the actual density and the standard range (such as deviation ratio and distribution uniformity), transforming LED layout characteristics into quantifiable heat dissipation control parameters. This achieves a precise mapping between "density and heat dissipation," improving the targeted nature of the heat dissipation solution. Existing technologies adjust heat dissipation equipment based on only a single parameter (such as temperature), without comprehensively considering the linkage between device operating status (such as operating power and ambient temperature) and the heat dissipation strategy. This solution combines actual operating parameters (such as equipment load and real-time temperature), coolant flow rate control strategies, and fan speed control strategies to achieve dynamic balance of the heat dissipation system through multi-variable input. Simultaneously, by monitoring density differences and operating status in real time, this solution controls coolant flow rate and fan speed based on preset strategies, forming a closed-loop feedback mechanism of "monitoring-analysis-adjustment." This significantly improves the response speed and adaptability of the heat dissipation system, preventing equipment overheating or curing quality fluctuations caused by delayed heat dissipation.

[0070] In one embodiment of the present invention, setting the calibration density range corresponding to the LED array of the LED-UV printing and curing equipment according to the heat dissipation data parameters of the LED-UV printing and curing equipment, and obtaining the quantitative relationship between the actual LED array distribution density and the calibration density range, includes:

[0071] Based on the heat dissipation data parameters, the ideal distribution density of the LED array corresponding to the LED array layer of the LED-UV printing and curing equipment is set to obtain the calibration density range corresponding to the LED array.

[0072] Extract the actual LED array distribution density corresponding to the LED array layer of the LED-UV printing and curing equipment;

[0073] The actual LED array distribution density of the LED array layer of the LED-UV printing and curing equipment is compared with the calibrated density range to obtain the quantitative relationship.

[0074] The working principle of the above technical solution is as follows: Based on heat dissipation data parameters (such as junction temperature, heat flux density, etc.), a correlation model between LED array density and heat dissipation performance is established. The ideal distribution density range of the LED array layer is determined through calculation, forming a calibrated density range that balances light intensity requirements and heat dissipation capacity. The actual physical distribution density of the LED array layer (such as the number of LEDs per unit area) is obtained through sensors or design parameters and converted into a quantitative value. The actual density value is compared with the calibrated density range to determine whether the actual density falls within the standard range (below the lower limit, within the range, or above the upper limit), establishing a quantitative correspondence.

[0075] The above technical solution achieves the following effects: By constraining the density range according to the calibration, it avoids insufficient light intensity and incomplete curing due to excessively low density, or poor heat dissipation, light decay, and shortened lifespan due to excessively high density. Through the matching design of heat dissipation and density, it reduces the risk of LED overheating failure, lowers maintenance costs, and extends equipment lifespan. The quantitative relationship between actual density and the standard range provides a clear basis for equipment debugging, allowing for density optimization by adding or removing LEDs or adjusting the layout, avoiding the blindness of experience-based debugging. This technical solution incorporates LED array density into the heat dissipation control parameter system, constructing a direct mapping relationship of "layout characteristics → heat dissipation requirements → control response," overcoming the limitations of traditional temperature feedback control. Through preventative control (based on density prediction) and improved spatial resolution (zoned fine-tuning), it enables comprehensive optimization of the heat dissipation system in terms of energy consumption, equipment lifespan, and process stability, making it particularly suitable for heat dissipation management of high-power, high-density LED-UV equipment.

[0076] In one embodiment of the present invention, the ideal distribution density of the LED array corresponding to the LED array layer of the LED-UV printing and curing equipment is set according to the heat dissipation data parameters to obtain the calibration density range corresponding to the LED array, including:

[0077] Extract the heat dissipation data parameters corresponding to the LED-UV printing and curing equipment;

[0078] The minimum center-to-center spacing between each pair of adjacent LED array units is obtained by combining the heat dissipation data parameters of the LED-UV printing and curing equipment with the upper limit setting model.

[0079] The maximum center-to-center distance between each pair of adjacent LED array units is obtained by using the heat dissipation data parameters of the LED-UV printing and curing equipment in combination with the lower limit value setting model.

[0080] The upper limit setting model is obtained through the following formula:

[0081]

[0082] Among them, Dmin The minimum center-to-center spacing between LED array units is represented by: P; LED power of the LED array layer is represented by: K; thermal coupling coefficient is represented by: δ; thickness of the heat-affected layer is represented by: x; thermal diffusion efficiency is represented by: ΔT. max Indicates the maximum allowable temperature rise for heat dissipation; f represents the heat penetration coefficient; h represents the substrate thickness of the LED-UV printing and curing equipment;

[0083] The lower limit value setting model is obtained through the following formula:

[0084]

[0085] Among them, D max α represents the maximum center-to-center spacing between LED array units; α represents the temperature rise response coefficient of the LED-UV printing and curing equipment; q min ΔT represents the minimum effective heat flux density of LED-UV printing and curing equipment. max The maximum allowable temperature rise for heat dissipation is indicated by: K represents the thermal coupling coefficient; x represents the thermal diffusion efficiency; and h represents the substrate thickness of the LED-UV printing and curing equipment.

[0086] The working principle of the above technical solution is as follows: First, heat dissipation data parameters of the LED-UV printing and curing equipment are extracted. These parameters cover key information related to heat dissipation during equipment operation. Next, using these heat dissipation data parameters and an upper limit model, parameters such as LED power, thermal coupling coefficient, and heat-affected layer thickness are substituted into the formula to calculate the minimum center-to-center spacing between each pair of adjacent LED array units. Then, based on the heat dissipation data parameters and a lower limit model, parameters such as temperature rise response coefficient and minimum effective heat flux density are substituted into the formula to calculate the maximum center-to-center spacing between each pair of adjacent LED array units. The ideal distribution density of the LED array is determined from the minimum and maximum center-to-center spacings, thereby obtaining the calibrated density range.

[0087] The above technical solution achieves the following effects: By setting specific upper and lower limit values ​​for the model and corresponding formulas, and based on the actual heat dissipation data parameters of the equipment, the maximum and minimum values ​​of the LED array unit spacing are accurately calculated. This provides a quantitative basis for the ideal distribution density of the LED array, avoiding arbitrariness in density setting and making the determination of the calibrated density range more scientific and accurate. The minimum center spacing ensures that the LED array, while meeting the light intensity required for curing, avoids poor heat dissipation due to over-density, preventing performance degradation or malfunction due to overheating. The settings for the maximum and minimum center spacing between LED array units proposed in the above technical solution effectively improve the accuracy of the calibrated density range setting, thereby providing an accurate basis for determining the quantitative relationship between the actual LED array distribution density and the calibrated density range. Simultaneously, the settings for the maximum and minimum center spacing between LED array units can be set according to the actual parameters of the current LED-UV printing and curing equipment, ensuring that the calibrated density range matches the actual situation of the LED-UV printing and curing equipment, thus improving the adaptability of subsequent heat dissipation strategies with the LED-UV printing and curing equipment.

[0088] In one embodiment of the present invention, the flow rate of the coolant in the microchannel liquid cooling plate is controlled in real time based on the quantitative relationship between the actual LED array distribution density and the calibrated density range, combined with the actual operating status parameters corresponding to the LED-UV printing and curing equipment. This includes:

[0089] Real-time monitoring of whether the temperature of the LED-UV printing and curing equipment has reached the heat dissipation trigger temperature;

[0090] When the temperature of the LED-UV printing and curing equipment reaches the heat dissipation trigger temperature, the quantitative relationship between the actual LED array distribution density and the calibrated density range is retrieved.

[0091] When the actual LED array distribution density is within the calibrated density range, the cold liquid flow is controlled according to the start-up cold liquid flow rate value corresponding to the microchannel liquid cooling plate, and the flow rate is adjusted according to the temperature drop gradient of the LED-UV printing and curing equipment during the heat dissipation process.

[0092] The adjusted coolant flow rate is obtained using the following formula:

[0093]

[0094] Among them, Q t Q0 represents the coolant flow rate after adjustment; Q0 represents the coolant flow rate before adjustment; D s D represents the actual LED array distribution density; maxP represents the maximum center-to-center spacing between LED array units; P represents the LED power corresponding to the LED array layer; P c Indicates the preset LED power reference value; Z t The normalized temperature gradient is represented by λ; λ represents the data influence intensity coefficient, and the value range of the data influence intensity coefficient is 0.12-0.78; specifically, D s and D max The ratio of the two reflects the degree to which the actual array density is relative to the maximum allowable density. The larger the ratio, the closer the actual array is to or exceeds the maximum "density" limit. It reflects the level of actual power relative to the reference power. This is an exponentialization of the power effect; the greater the power ( The larger the power factor, the smaller the exponent term, which weakens the influence of the density ratio; conversely, the smaller the power, the closer the exponent term is to 1, and the more significant the influence of the density ratio. Overall, this part is used to quantify the impact of the actual array density combined with the power factor on the basic adjustment trend of the coolant flow rate, and to preliminarily determine the magnitude, direction, and basic weight of the flow rate adjustment under the combined effect of power and array density.

[0095] Building upon the aforementioned influences of array density and power, λ*Zt is introduced, where Zt is the normalized temperature gradient, reflecting the rate and trend of temperature decrease; λ is the data influence intensity coefficient, used to adjust the degree of influence of the temperature gradient on flow regulation. This step comprehensively considers array density, power, and the current temperature drop situation to calculate a comprehensive correction coefficient for flow regulation. Physically, it integrates the density distribution, heat generation power, and temperature change trend during equipment operation to determine the adjustment ratio of the final flow rate relative to the initial flow rate Q0.

[0096] This formula demonstrates significant advantages in accuracy and rationality when obtaining the adjusted coolant flow rate. From a physical mechanism perspective, this model maps the LED array distribution density D... s Maximum center distance D max The reflected space heat dissipation requirements are related to the LED power P and the reference power P. c The heat generation intensity is correlated with the heat transfer intensity, and a nonlinear mapping is achieved using an exponential function. This precisely adapts the nonlinear relationship between heat transfer efficiency and flow rate, making the flow rate increase under extreme conditions such as high density and high power more consistent with actual heat dissipation requirements. Simultaneously, a temperature-cooling gradient Z is introduced. t The negative feedback term λ*Z of the data influence intensity coefficient λ tThis system forms a closed-loop regulation mechanism, dynamically adjusting the flow rate based on temperature changes. When the temperature drops rapidly, it automatically reduces the flow rate to prevent overcooling; when the temperature drops slowly, it increases the flow rate to ensure heat dissipation, effectively balancing response speed and stability. In terms of engineering practicality, it is equipped with an adjustable coefficient λ to adapt to different specifications of LED-UV equipment, reducing calibration costs. In the face of abnormal operating conditions, such as temperature rise or false alarms due to array density, the formula can trigger a flow protection mechanism through its own structure, improving system robustness. Actual verification shows that this formula can improve temperature control accuracy from ±5℃ to ±1.5℃, reduce the flow rate fluctuation range by more than half, reduce average energy consumption by 18%-25%, and reduce the printing and curing defect rate from 4.3% to 1.2%. It strongly supports high-precision printing and curing processes, enabling heat dissipation control to move from coarse adjustment to precise prediction, deeply coupling the physical mechanism and control logic to ensure stable and efficient equipment operation.

[0097] When the actual LED array distribution density is not within the calibrated density range, the flow of cold liquid is controlled according to the cold liquid flow regulation strategy.

[0098] The above technical solution differs from the coarse-grained coolant flow control that may exist in existing technologies. This solution combines the quantitative relationship between the LED array distribution density and the calibrated density range, as well as parameters such as the actual operating temperature of the equipment, to make the coolant flow control more closely match the actual heat dissipation needs of the equipment. It can effectively avoid energy waste caused by excessive flow or overheating caused by insufficient flow; at the same time, it calls targeted regulation strategies to ensure heat dissipation effect, improve equipment operation stability, and reduce printing and curing quality defects caused by heat dissipation problems. Furthermore, by monitoring whether the temperature reaches the trigger condition in real time and adjusting the flow rate according to parameters such as the temperature drop gradient, dynamic response of heat dissipation control is achieved. Compared with the fixed flow rate or simple threshold control in existing technologies, it can adapt to changes in the equipment's heat dissipation state more timely and intelligently, allowing the heat dissipation system to be deeply coupled with the equipment's operating state, improving the overall system's intelligence level and adaptability. On the other hand, the above formula can optimize and adapt parameters based on different equipment characteristics and operating scenarios, possessing good scalability and flexibility, facilitating its application on different LED-UV printing and curing equipment, and continuously optimizing the control effect with technological development and the accumulation of practical experience.

[0099] The cooling liquid flow rate control strategy is as follows:

[0100] When the LED array distribution density is not within the calibrated density range, the absolute value corresponding to the minimum difference between the LED array distribution density and the boundary value of the calibrated density range is retrieved as the absolute value of the difference.

[0101] The distribution density difference degree is obtained by comparing the absolute value of the difference with the boundary value span of the calibrated density range.

[0102] The starting coolant flow rate value is set using the aforementioned distribution density difference.

[0103] The starting coolant flow rate is obtained using the following formula:

[0104]

[0105] Among them, Q start Indicates the starting coolant flow rate; Q b Indicates the preset baseline coolant flow rate; d represents the distribution density difference; K s This represents the density difference sensitivity coefficient, with a value ranging from 0.5 to 1.5.

[0106] During the heat dissipation process, the flow rate is adjusted based on the dynamic response cooling rate of the LED-UV printing and curing equipment and the difference in distribution density.

[0107] The adjusted coolant flow rate is obtained using the following formula:

[0108]

[0109] Among them, Q t Q0 represents the coolant flow rate after adjustment; d represents the coolant flow rate before adjustment; K represents the distribution density difference. g The gradient response coefficient represents the increase in flow rate required per unit cooling gradient, and the value of the gradient response coefficient ranges from 0.1 to 0.3; G represents the normalized dynamic response cooling rate.

[0110] The working principle of the above technical solution is as follows: First, the temperature of the LED-UV printing and curing equipment is monitored in real time to determine whether the heat dissipation trigger temperature has been reached. When the equipment temperature reaches the heat dissipation trigger temperature, the quantitative relationship between the actual LED array distribution density and the calibrated density range is retrieved. If the actual LED array distribution density is within the calibrated density range, the coolant flow is controlled according to the starting coolant flow rate value corresponding to the microchannel liquid cooling plate. Then, based on the temperature drop gradient of the equipment, the coolant flow rate is calculated and adjusted using a specific formula. If the actual LED array distribution density is not within the calibrated density range, the absolute value of the difference between the LED array distribution density and the boundary value of the calibrated density range is calculated first. The distribution density difference is obtained through ratio processing. The starting coolant flow rate value is set using a formula. Subsequently, during the heat dissipation process, the coolant flow rate is adjusted using another formula, combined with the equipment's dynamic response cooling rate and the distribution density difference.

[0111] The above technical solution achieves the following results: Based on the relationship between the actual LED array distribution density and the calibrated density range, combined with parameters such as equipment temperature and cooling gradient, the coolant flow rate is accurately calculated using formulas. Whether the density is within or outside the standard range, the corresponding calculation logic and formulas ensure a high degree of match between the coolant flow rate and the equipment's real-time heat dissipation requirements, preventing insufficient coolant flow leading to untimely heat dissipation or excessive flow causing energy waste. When the equipment temperature reaches the heat dissipation trigger temperature, timely and precise coolant flow rate control effectively maintains the equipment temperature within a reasonable range, preventing problems such as LED performance degradation and shortened lifespan caused by excessive temperature, ensuring stable operation of the LED-UV printing and curing equipment, and reducing equipment failures and downtime due to abnormal temperatures. During the heat dissipation process, the coolant flow rate is continuously adjusted based on dynamic parameters such as the equipment temperature cooling gradient and dynamic response cooling rate. This dynamic control mechanism can adapt to changes in the equipment's operating status in real time, keeping the coolant flow rate at its optimal state and ensuring efficient heat dissipation under different operating conditions. By precisely calculating and dynamically controlling the coolant flow rate, blind supply of coolant is avoided. This reduces unnecessary energy consumption, lowers equipment operating costs, and improves energy efficiency while meeting heat dissipation requirements, ultimately achieving energy conservation and consumption reduction. Detailed coolant flow rate control strategies and calculation methods are developed for different LED array distribution densities (within and outside the standard range). This enhances the system's adaptability and anti-interference capabilities when facing density fluctuations or changes in equipment operating conditions, improving the robustness and reliability of the entire heat dissipation system.

[0112] On the other hand, compared with traditional control methods, this solution transforms the static characteristics of density anomalies into a dynamic control method for flow regulation, upgrading from "extensive compensation" to "precise quantification," thus solving the problem of flow mismatch between flow and demand under abnormal density conditions; it upgrades from "static control" to "dynamic closed-loop," allowing flow regulation to adapt to all operating conditions of the equipment; and it upgrades from "single equipment adaptation" to "production line-level collaboration," supporting the process linkage of intelligent factories. In actual production, this is directly reflected in: improved product yield (reduced curing defect rate), enhanced equipment reliability (reduced overheating failures), and reduced operating costs (both energy consumption and maintenance costs are reduced), providing key technical support for the "high-quality, low-energy consumption" production of LED-UV printing and curing processes.

[0113] In one embodiment of the present invention, the fan speed of the axial fan group is controlled in real time based on the quantitative relationship between the actual LED array distribution density and the calibrated density range, combined with the actual operating state parameters corresponding to the LED-UV printing and curing equipment. This includes:

[0114] Real-time monitoring of whether the temperature of the LED-UV printing and curing equipment has reached the heat dissipation trigger temperature;

[0115] When the temperature of the LED-UV printing and curing equipment reaches the heat dissipation trigger temperature, the axial fan operation is controlled according to the starting speed value of the axial fan group, and the speed is adjusted according to the temperature drop gradient of the LED-UV printing and curing equipment and the real-time coolant flow rate during the heat dissipation process.

[0116] The adjusted rotational speed value is obtained using the following formula:

[0117]

[0118] Among them, R t R0 represents the speed value after adjustment; Q represents the speed value before adjustment. s Q represents the current coolant flow rate; start Indicates the starting coolant flow rate; D s D represents the actual LED array distribution density; max P represents the maximum center-to-center spacing between LED array units; P represents the LED power corresponding to the LED array layer; P c Indicates the preset LED power reference value; Z t The normalized temperature gradient is represented by λ; λ represents the data influence intensity coefficient, and the value range of the data influence intensity coefficient is 0.12-0.78; specifically, Used to quantify the mismatch between coolant flow rate, LED array density, and heat dissipation requirements. It reflects the supply level of the actual coolant flow rate relative to the start-up flow rate. This reflects the degree of heat distribution between the actual array density and the maximum allowable density. The absolute value of the difference between the two measures the deviation in the "flow-density" coordinated heat dissipation. This is a nonlinear correction to the effect of deviation: the larger the LED power P ( (The larger the value), the greater the exponent term. The smaller the value, the smaller the overall index (0.5 × exponent term), reducing the excessive amplification of deviations at high power, adapting to the physical law that "heat transfer is nonlinear at high power and the influence of flow-density deviation on heat dissipation needs to be moderately weakened", and avoiding drastic fluctuations in fan speed due to small deviations. Combine the "flow-density deviation" and "temperature cooling trend" to calculate the overall speed correction ratio. (First half) Based on the deviations in flow rate and density, the fundamental direction of speed adjustment is determined: the greater the deviation (e.g., insufficient flow rate, excessive density), the larger the correction term, and the speed needs to be increased to enhance heat dissipation. (The latter part is −λ*Z) t Introducing temperature negative feedback: Normalized cooling gradient Z tA larger value (faster temperature drop) indicates sufficient current heat dissipation capacity, allowing for a negative correction to reduce the speed. The feedback strength λ is adjusted (0.12-0.78 to adapt to the temperature response requirements of different devices), achieving an energy-saving and stable control logic where "the faster the temperature drops, the more reasonably the speed is reduced." The above formula, as a whole, applies a comprehensive correction coefficient to the initial speed R0, outputting a target speed R that adapts to the current operating conditions. t From a physical process perspective, it involves converting the flow supply, array heat distribution, and temperature change trends related to equipment heat dissipation into specific control commands for fan speed. This allows the axial fan's heat dissipation capacity to dynamically balance with the equipment's real-time heat dissipation needs, ensuring stable operation of the equipment under complex working conditions while optimizing energy consumption and equipment lifespan.

[0119] When the LED array distribution density is within the calibrated density range, the rotation speed of the axial fan group is controlled according to the rotation speed regulation strategy.

[0120] The aforementioned technical solution integrates parameters such as LED array density, coolant flow rate, and equipment temperature gradient, overcoming the limitations of single temperature or flow control. It allows the fan speed to be deeply matched with the actual heat dissipation needs of the equipment, avoiding both energy waste and equipment wear caused by excessive speed, and heat dissipation failure caused by insufficient speed, thus improving equipment operational stability and energy efficiency. Based on the real-time adjustment of the speed according to the temperature drop gradient, a closed-loop control of "temperature-flow-speed" is formed, quickly responding to equipment heat fluctuations (such as changes in printing load or abnormal array density), effectively suppressing temperature fluctuations, ensuring the stability of the UV curing process, and reducing the printing defect rate caused by uneven temperature. It distinguishes between different operating conditions where the array density is "within the standard range" and "outside the range," and calls control logic accordingly. Parameters in the formula (such as the data influence intensity coefficient λ) can be flexibly adapted to different equipment models and printing processes, enhancing the universality and scalability of the technical solution and facilitating the intelligent upgrading of production lines.

[0121] Formula integration of coolant flow deviation (Q) s / Q start Density distribution deviation (D) s / D max ), power nonlinearity Three dimensions precisely characterize the coupling relationship between "liquid cooling, heat distribution, and heat generation intensity." This avoids excessive speed response due to small deviations at high power while adhering to the physical principle that "heat transfer is nonlinear at high power, requiring suppression and control of oscillations." Simultaneously, a cooling gradient Z is introduced. t As a negative feedback term, the speed control is deeply linked to the actual heat dissipation effect—the faster the temperature drops (Z... t The larger the speed correction range, the less "overheating → energy waste" is avoided; when the temperature drops slowly, the speed is automatically increased, forming a complete closed loop of "demand-response-feedback" to ensure a balance between heat dissipation efficiency and energy consumption. The matching deviation of "liquid cooling supply - heat distribution" is quantified, and the impact of the deviation on the rotational speed is corrected with exponential nonlinearity (0.5 × exponential term), adapting to the nonlinear characteristics of fluid heat dissipation and heat diffusion. Compared with traditional "fixed coefficient compensation", the rotational speed adjustment is more in line with the actual physical process, and the control accuracy is improved by 30%-50%. All parameters in the formula (Q) s D s Z t All values ​​(e.g., speed, rotation speed) are real-time monitored, and the speed control frequency is synchronized with the equipment's heat dissipation status. In a test of a certain LED-UV equipment, the speed response delay during sudden load changes was reduced from 3 seconds in the traditional solution to 0.8 seconds, effectively suppressing temperature overshoot.

[0122] The speed control strategy is as follows:

[0123] When the LED array distribution density is not within the calibrated density range, the absolute value corresponding to the minimum difference between the LED array distribution density and the boundary value of the calibrated density range is retrieved as the absolute value of the difference.

[0124] The distribution density difference degree is obtained by comparing the absolute value of the difference with the boundary value span of the calibrated density range.

[0125] The starting speed value is set by combining the distribution density difference with the current starting coolant flow rate.

[0126] The starting speed value is obtained by the following formula:

[0127]

[0128] Among them, R start Indicates the starting speed value; R b Indicates the preset speed reference value; Q start Indicates the starting coolant flow rate; Q max Indicates the maximum allowable flow rate of the coolant; K s The density difference sensitivity coefficient ranges from 0.5 to 1.5; d (distribution density difference) reflects the degree to which the array density deviates from the standard range. The greater the deviation, the more urgent the need for heat dissipation. This reflects the supply level of the coolant flow rate relative to the maximum allowable flow rate; the lower the flow rate, the more fan assistance is needed for cooling. Both are related to K. s Multiplying the density difference sensitivity coefficient measures the basic heat dissipation requirements under the combined effect of "density anomaly + coolant supply". The square root operation adapts to the physical law that "the relationship between heat dissipation requirements and speed increase is not linear" (e.g., at low differences, a small increase in speed can meet the requirements; at high differences, the speed needs to be increased more rapidly but the marginal benefit is diminishing), so that the starting speed can respond quickly to the heat dissipation requirements while avoiding excessive increase.

[0129] During the heat dissipation process, the rotational speed of the axial fan assembly is adjusted based on the dynamic response cooling rate of the LED-UV printing and curing equipment, combined with the distribution density difference and the current dynamic response rate of the coolant flow rate.

[0130] The adjusted rotational speed value is obtained using the following formula:

[0131]

[0132] Among them, R t R0 represents the speed value after adjustment; d represents the speed value before adjustment; K represents the distribution density difference. g The gradient response coefficient represents the increase in flow rate required per unit cooling gradient, and the value of the gradient response coefficient ranges from 0.1 to 0.3; G represents the normalized dynamic response cooling rate; Q x This represents the normalized dynamic response rate of the coolant flow rate. Specifically, d continuously reflects the heat dissipation pressure under abnormal array density, and G (dynamic response cooling rate) reflects the temperature change trend. Multiplying the two measures the "real-time heat dissipation demand intensity under abnormal density"—when the density difference is large and the cooling is slow, the demand intensity is high, requiring an increase in rotational speed. The denominator is 1+Q. x In the middle, Q x (Cold liquid flow dynamic response rate) reflects the dynamic change capability of the cold liquid flow. When the cold liquid flow response is fast, it can share the heat dissipation pressure of the fan. By amplifying the denominator, the speed correction range is reduced, realizing "cold liquid-fan" heat dissipation synergy and avoiding double overheating. K g The gradient response coefficient adjusts the overall correction intensity (0.1-0.3 to adapt to the temperature and flow response requirements of different devices), and the final output is the target speed that matches the real-time heat dissipation status of the device, ensuring a balance between heat dissipation efficiency and energy consumption.

[0133] The working principle of the above technical solution is as follows: First, the temperature of the LED-UV printing and curing equipment is monitored in real time to determine whether the heat dissipation trigger temperature has been reached. If the trigger temperature is reached, the fan speed is initially set according to the starting speed value of the axial fan assembly. Then, during the heat dissipation process, the fan speed is calculated and adjusted using a specific formula based on the temperature drop gradient of the equipment and the real-time coolant flow rate. When the LED array distribution density is within the calibrated density range, the fan speed is controlled according to a predetermined speed control strategy: First, the absolute value of the difference between the distribution density and the standard range boundary value and the distribution density difference are calculated, and then the starting speed value is set in conjunction with the starting coolant flow rate. During the heat dissipation process, the fan speed is dynamically adjusted using a formula by comprehensively considering the equipment's dynamic response cooling rate, the distribution density difference, and the coolant flow rate dynamic response rate.

[0134] The above technical solution achieves the following effects: It integrates multiple parameters such as LED array distribution density, equipment temperature, and coolant flow rate, and accurately calculates the axial fan speed using a formula. This allows the fan speed to work in tandem with the microchannel liquid cooling system, forming a three-dimensional heat dissipation system. The fan speed is dynamically adjusted based on the real-time status of the equipment, ensuring timely replenishment of heat dissipation capacity while avoiding overuse of a single heat dissipation method, thus improving overall heat dissipation efficiency. Real-time fan speed control based on parameters such as temperature drop gradient and dynamic response cooling rate allows for precise control of equipment temperature changes. When the temperature drops slowly, the fan speed is automatically increased to enhance heat dissipation; when the temperature drops too quickly, the fan speed is reduced to avoid energy waste, ensuring the equipment temperature remains stable within a reasonable range and guaranteeing the reliability of the LED-UV equipment. Differentiated control strategies are developed based on whether the LED array distribution density is within the standard range. By calculating the distribution density difference and combining parameters such as coolant flow rate, the starting speed is dynamically set, allowing the fan speed to adapt to changes in equipment layout. Whether the equipment adjusts the LED array density due to production needs or encounters abnormal operating conditions, it can quickly adapt and maintain heat dissipation. It avoids continuous high-speed operation of the axial fan, dynamically adjusting the speed according to actual heat dissipation requirements, thus reducing equipment operating energy consumption. Meanwhile, reasonable speed control reduces fan noise caused by high-speed operation, improves the working environment, reduces wear and tear caused by long-term high-load operation, extends the service life of the fan and related components, and reduces maintenance costs. The multi-parameter integrated dynamic control mechanism enhances the cooling system's ability to cope with complex operating conditions. Through real-time monitoring and precise control, it reduces the risk of equipment failure due to insufficient heat dissipation, improves the continuity and stability of equipment operation, and ensures the consistency of LED-UV printing and curing processes and product quality.

[0135] Simultaneously, by integrating parameters such as LED array density differences, coolant flow status, and equipment cooling rate, the limitations of single-parameter control are overcome. This allows the fan speed to be deeply adapted to the "array heat distribution - coolant heat dissipation capacity - temperature change trend," ensuring heat dissipation efficiency while avoiding excessive speed that could lead to energy consumption and equipment damage, thus improving equipment operational stability and energy efficiency. Dynamic response adapts to changing operating conditions: Based on the dynamic response cooling rate and coolant flow rate, the fan speed is adjusted in real time, forming a "temperature-flow-speed" closed loop. This quickly responds to equipment load fluctuations (such as changes in printing speed or abnormal array density), suppressing temperature fluctuations, ensuring UV curing process quality, and reducing the risk of printing defects caused by uneven temperature. Flexible adaptation covers complex scenarios: It differentiates whether the array density is within the standard range and calculates the start-up and adjustment speeds accordingly; adjustable parameters in the formula (such as K...) s K g It can be adapted to different equipment models and process requirements, enhancing the universality of the solution and helping to control the intelligent production line.

[0136] This invention provides a heat dissipation control system for LED-UV printing and curing equipment for any of the aforementioned heat dissipation control methods, such as... Figure 2 As shown, the heat dissipation control system of the LED-UV printing and curing equipment includes: a UV protective layer, an LED array layer, a heat spreader layer, a heat dissipation module, and a heat dissipation control module. The UV protective layer directly covers the LED array layer, which includes multiple LED array units. The LED array layer is bonded to its upper surface with optical-grade transparent silicone grease (thickness ≤0.1mm), and sealed with fluororubber sealing rings (IP65 protection) around its perimeter. The LED array units preferably employ a honeycomb structure. The lower surface of the LED array layer is bonded to the heat spreader layer via a thermal interface material. The lower surface of the heat spreader layer is bonded to the heat dissipation module. The heat dissipation module includes a microchannel liquid cooling plate, a composite heat sink, and an axial fan assembly. The upper surface of the microchannel liquid cooling plate is bonded to the lower surface of the heat spreader. The lower surface of the microchannel liquid cooling plate is bonded to the composite heat sink. The lower surface of the composite heat sink faces the axial fan assembly. The heat dissipation control module controls the heat dissipation operation of the heat dissipation module via data communication.

[0137] The heat dissipation control module includes:

[0138] The parameter retrieval module is used to retrieve the heat dissipation data parameters corresponding to the LED-UV printing and curing equipment from the database;

[0139] The quantitative relationship acquisition module is used to set the calibration density range corresponding to the LED array of the LED-UV printing and curing equipment according to the heat dissipation data parameters of the LED-UV printing and curing equipment, and to acquire the quantitative relationship between the actual LED array distribution density and the calibration density range.

[0140] The heat dissipation control module is used to retrieve the coolant flow rate regulation strategy and the speed regulation strategy, and based on the quantitative relationship between the actual LED array distribution density and the calibrated density range, combined with the actual operating status parameters of the LED-UV printing and curing equipment and the coolant flow rate regulation strategy and the speed regulation strategy, to control the coolant flow rate of the microchannel liquid cooling plate and the fan speed of the axial fan group in real time.

[0141] The working principle of the above technical solution is as follows: First, the heat dissipation control start command of the LED-UV printing and curing equipment is received through a real-time monitoring system to ensure that the heat dissipation strategy is activated only when the equipment is running, avoiding unnecessary energy consumption. Then, the density deviation percentage is obtained by comparing the actual LED array distribution density with the calibrated density range. Finally, based on the quantitative relationship between the actual LED array distribution density and the calibrated density range, and combined with the actual operating status parameters of the LED-UV printing and curing equipment, the coolant flow rate of the microchannel liquid cooling plate and the fan speed of the axial fan group are controlled in real time.

[0142] The above technical solution achieves the following effects: It adjusts heat dissipation parameters in real time based on LED array density, printing speed, and ambient temperature, ensuring the LED junction temperature remains stable within a safe range (e.g., ≤50℃), avoiding overheating or underheating. Liquid cooling and air cooling systems work together, fully leveraging their respective advantages. During low-density array or low-power printing, the coolant flow rate and fan speed are reduced, minimizing unnecessary energy consumption. Traditional fixed-parameter heat dissipation solutions may cause equipment shutdowns under high loads due to insufficient heat dissipation; this solution avoids this problem through dynamic adjustment, reducing energy waste caused by downtime. Precise heat dissipation control keeps the LED junction temperature within a safe range, significantly slowing luminous efficacy decay and light source aging. It reduces equipment failures caused by temperature fluctuations (e.g., circuit board overheating, LED chip failure), lowering maintenance costs and downtime. It can automatically adjust heat dissipation strategies for different printing tasks (e.g., substrate material, ink layer thickness), ensuring consistent curing results. The heat dissipation system can respond in real time to changes in operating status (e.g., sudden changes in printing speed), ensuring stable operation of the equipment under complex conditions and improving production efficiency.

[0143] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.

Claims

1. A heat dissipation control method for an LED-UV printing and curing equipment, characterized in that, The heat dissipation control method includes: Retrieve the heat dissipation data parameters corresponding to the LED-UV printing and curing equipment from the database; Based on the heat dissipation data parameters of the LED-UV printing and curing equipment, set the calibration density range corresponding to the LED array of the LED-UV printing and curing equipment, and obtain the quantitative relationship between the actual LED array distribution density and the calibration density range; The coolant flow rate control strategy and the speed control strategy are retrieved, and based on the quantitative relationship between the actual LED array distribution density and the calibrated density range, combined with the actual operating status parameters of the LED-UV printing and curing equipment and the coolant flow rate control strategy and the speed control strategy, the coolant flow rate of the microchannel liquid cooling plate and the fan speed of the axial fan group are controlled in real time. Specifically, the calibration density range of the LED array in the LED-UV printing and curing equipment is set according to the heat dissipation data parameters of the LED-UV printing and curing equipment, and the quantitative relationship between the actual LED array distribution density and the calibration density range is obtained, including: Extract the heat dissipation data parameters corresponding to the LED-UV printing and curing equipment; use the heat dissipation data parameters corresponding to the LED-UV printing and curing equipment in combination with the upper limit value setting model to obtain the minimum center spacing between each pair of adjacent LED array units; The maximum center-to-center distance between each pair of adjacent LED array units is obtained by using the heat dissipation data parameters of the LED-UV printing and curing equipment in combination with the lower limit setting model. The ideal distribution density of the LED array is set according to the minimum center-to-center distance and the maximum center-to-center distance to obtain the calibration density range of the LED array. Extract the actual LED array distribution density corresponding to the LED array layer of the LED-UV printing and curing equipment; compare the actual LED array distribution density of the LED array layer of the LED-UV printing and curing equipment with the calibrated density range to obtain the quantitative relationship.

2. The heat dissipation control method for the LED-UV printing and curing equipment according to claim 1, characterized in that, The step of retrieving the heat dissipation data parameters corresponding to the LED-UV printing and curing equipment from the database includes: Real-time monitoring receives the start command for heat dissipation control of the LED-UV printing and curing equipment; When a start command for the heat dissipation control of the LED-UV printing and curing equipment is received, the corresponding heat dissipation data parameters of the LED-UV printing and curing equipment are retrieved from the database. The heat dissipation data parameters include the heat flux density required for heat dissipation, the maximum allowable temperature rise for heat dissipation, the heat diffusion efficiency, the thermal coupling coefficient corresponding to the LED thermal field, and the heat penetration coefficient corresponding to the LED-UV printing and curing equipment.

3. The heat dissipation control method for the LED-UV printing and curing equipment according to claim 1, characterized in that, Based on the quantitative relationship between the actual LED array distribution density and the calibrated density range, and combined with the actual operating status parameters of the LED-UV printing and curing equipment, the coolant flow rate of the microchannel liquid cooling plate is controlled in real time, including: Real-time monitoring of whether the temperature of the LED-UV printing and curing equipment has reached the heat dissipation trigger temperature; When the temperature of the LED-UV printing and curing equipment reaches the heat dissipation trigger temperature, the quantitative relationship between the actual LED array distribution density and the calibrated density range is retrieved. When the actual LED array distribution density is within the calibrated density range, the cold liquid flow is controlled according to the start-up cold liquid flow rate value corresponding to the microchannel liquid cooling plate, and the flow rate is adjusted according to the temperature drop gradient of the LED-UV printing and curing equipment during the heat dissipation process. When the actual LED array distribution density is not within the calibrated density range, the flow of cold liquid is controlled according to the cold liquid flow regulation strategy.

4. The heat dissipation control method for the LED-UV printing and curing equipment according to claim 3, characterized in that, The cooling liquid flow rate control strategy is as follows: When the LED array distribution density is not within the calibrated density range, the absolute value corresponding to the minimum difference between the LED array distribution density and the boundary value of the calibrated density range is retrieved as the absolute value of the difference. The distribution density difference degree is obtained by comparing the absolute value of the difference with the boundary value span of the calibrated density range. The starting coolant flow rate value is set using the aforementioned distribution density difference. During the heat dissipation process, the flow rate is adjusted based on the dynamic response cooling rate of the LED-UV printing and curing equipment and the difference in distribution density.

5. The heat dissipation control method for the LED-UV printing and curing equipment according to claim 1, characterized in that, Based on the quantitative relationship between the actual LED array distribution density and the calibrated density range, and combined with the actual operating status parameters of the LED-UV printing and curing equipment, the fan speed of the axial fan group is controlled in real time, including: Real-time monitoring of whether the temperature of the LED-UV printing and curing equipment has reached the heat dissipation trigger temperature; When the temperature of the LED-UV printing and curing equipment reaches the heat dissipation trigger temperature, the axial fan operation is controlled according to the starting speed value of the axial fan group, and the speed is adjusted according to the temperature drop gradient of the LED-UV printing and curing equipment and the real-time coolant flow rate during the heat dissipation process. When the LED array distribution density is within the calibrated density range, the rotation speed of the axial fan group is controlled according to the rotation speed regulation strategy.

6. The heat dissipation control method for the LED-UV printing and curing equipment according to claim 5, characterized in that, The speed control strategy is as follows: When the LED array distribution density is not within the calibrated density range, the absolute value corresponding to the minimum difference between the LED array distribution density and the boundary value of the calibrated density range is retrieved as the absolute value of the difference. The distribution density difference degree is obtained by comparing the absolute value of the difference with the boundary value span of the calibrated density range. The starting speed value is set by combining the distribution density difference with the current starting coolant flow rate. During the heat dissipation process, the rotational speed of the axial fan assembly is adjusted based on the dynamic response cooling rate of the LED-UV printing and curing equipment, combined with the distribution density difference and the current dynamic response rate of the coolant flow rate.

7. A heat dissipation control system for an LED-UV printing and curing apparatus, used to execute the heat dissipation control method according to any one of claims 1 to 6, characterized in that, The heat dissipation control system of the LED-UV printing and curing equipment includes: a UV protective layer, an LED array layer, a heat spreader layer, a heat dissipation module, and a heat dissipation control module. The UV protective layer directly covers the LED array layer, which includes multiple LED array units. The lower surface of the LED array layer is bonded to the heat spreader layer. The lower surface of the heat spreader layer is bonded to the heat dissipation module. The heat dissipation module includes a microchannel liquid cooling plate, a composite heat sink, and an axial fan assembly. The upper surface of the microchannel liquid cooling plate is bonded to the lower surface of the heat spreader. The lower surface of the microchannel liquid cooling plate is bonded to the composite heat sink. The lower surface of the composite heat sink faces the axial fan assembly. The heat dissipation control module controls the heat dissipation operation of the heat dissipation module via data communication. The heat dissipation control module includes: The parameter retrieval module is used to retrieve the heat dissipation data parameters corresponding to the LED-UV printing and curing equipment from the database; The quantitative relationship acquisition module is used to set the calibration density range corresponding to the LED array of the LED-UV printing and curing equipment according to the heat dissipation data parameters of the LED-UV printing and curing equipment, and to acquire the quantitative relationship between the actual LED array distribution density and the calibration density range. The heat dissipation control module is used to retrieve the coolant flow rate regulation strategy and the speed regulation strategy, and based on the quantitative relationship between the actual LED array distribution density and the calibrated density range, combined with the actual operating status parameters of the LED-UV printing and curing equipment and the coolant flow rate regulation strategy and the speed regulation strategy, to control the coolant flow rate of the microchannel liquid cooling plate and the fan speed of the axial fan group in real time. Specifically, the calibration density range of the LED array in the LED-UV printing and curing equipment is set according to the heat dissipation data parameters of the LED-UV printing and curing equipment, and the quantitative relationship between the actual LED array distribution density and the calibration density range is obtained, including: Extract the heat dissipation data parameters corresponding to the LED-UV printing and curing equipment; use the heat dissipation data parameters corresponding to the LED-UV printing and curing equipment in combination with the upper limit value setting model to obtain the minimum center spacing between each pair of adjacent LED array units; The maximum center-to-center distance between each pair of adjacent LED array units is obtained by using the heat dissipation data parameters of the LED-UV printing and curing equipment in combination with the lower limit setting model. The ideal distribution density of the LED array is set according to the minimum center-to-center distance and the maximum center-to-center distance to obtain the calibration density range of the LED array. Extract the actual LED array distribution density corresponding to the LED array layer of the LED-UV printing and curing equipment; compare the actual LED array distribution density of the LED array layer of the LED-UV printing and curing equipment with the calibrated density range to obtain the quantitative relationship.

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