Pressure sensor

Abstract

The invention relates to the technical field of sensors, and provides a pressure sensor, which comprises a pressure-sensitive assembly and an electrode assembly, and is characterized in that the pressure-sensitive assembly covers the electrode assembly; the electrical parameter of the pressure-sensitive component changes along with the magnitude of the received pressure; the electrode assembly comprises an assembly substrate and an electrode array, the electrode array is arranged on a first surface and a second surface opposite to the first surface of the assembly substrate, the electrode array comprises a plurality of sensing electrodes, and the sensing electrodes are used for collecting electrical parameters of the pressure-sensitive assembly; wherein the sensing electrodes are conducted along a first direction on a first electrode structure of the first surface, and are arranged at intervals along a second direction; a second electrode structure of the sensing electrode on the second surface is conducted along the second direction and is arranged at intervals along the first direction; a first via hole is formed in the component substrate in the thickness direction, and the first electrode structure and the second electrode structure of the sensing electrode are conducted through the first via hole.

Description

Technical Field

[0001] The present application relates to the field of sensor technology, and in particular to a pressure sensor. Background Art

[0002] With the development and widespread adoption of bionic robots, such as industrial robotic arms, service robots, and medical robots, an increasing number are being equipped with flexible, bendable pressure sensors to simulate the skin's tactile sense and enable precise manipulation. The dense arrangement of pressure sensing electrodes on a complex, multi-curved substrate complicates electrode wiring. Therefore, improving the electrode structure of pressure sensors and effectively reducing the complexity of their wiring has become a pressing issue. Summary of the Invention

[0003] The main purpose of this application is to provide a pressure sensor, aiming to reduce the complexity of pressure sensor electrode wiring.

[0004] In a first aspect, the present application provides a pressure sensor, comprising a pressure-sensitive component and an electrode component, wherein the pressure-sensitive component covers the electrode component; The electrical parameters of the pressure-sensitive component vary with the pressure applied; The electrode assembly includes: an assembly substrate, an electrode array, wherein the electrode array is disposed on a first surface and a second surface opposite to the assembly substrate, and the electrode array includes a plurality of sensing electrodes, wherein the sensing electrodes are used to collect electrical parameters of the pressure-sensitive assembly; The first electrode structure of the sensing electrodes on the first surface is conductive along the first direction and spaced apart along the second direction; the second electrode structure of the sensing electrodes on the second surface is conductive along the second direction and spaced apart along the first direction; A first via hole is formed in the thickness direction of the component substrate, and the first electrode structure and the second electrode structure of the sensing electrode are electrically connected via the first via hole.

[0005] In some embodiments, the first electrode structure includes a power supply unit and a signal acquisition unit; The power supply unit is used to provide an electrical signal to the signal acquisition unit, and the electrical signal of the power supply unit is transmitted to the signal acquisition unit via the pressure sensitive component, and the signal acquisition unit is used to acquire the magnitude of the electrical signal; Wherein, the power supply unit is arranged around the signal acquisition unit.

[0006] In some embodiments, the power supply unit forms a power supply ring, and the signal acquisition unit is located in an inner circle area of ​​the power supply ring and is spaced apart from the power supply ring.

[0007] In some embodiments, the power supply unit and the signal collection unit are polygonal in shape, and are arranged at intervals on the first surface to form a grid structure.

[0008] In some embodiments, the power supply unit forms a first comb-shaped electrode, the signal acquisition unit forms a second comb-shaped electrode, and the first electrode fingers of the first comb-shaped electrode and the second electrode fingers of the second comb-shaped electrode are arranged in an alternating manner.

[0009] In some embodiments, the power supply parts are conductive along the first direction on the first surface and spaced apart along the second direction; The first via hole is located in the signal collection part. The signal collection part is connected to the second electrode structure via the first via hole. The second electrode structure is connected along the second direction on the second surface and is spaced apart along the first direction.

[0010] In some embodiments, the component substrate further has a second via formed in the thickness direction, and the sensing electrodes of the first electrode structure conductive along the first direction form a first acquisition mechanism, and the first acquisition mechanism is connected to the first signal line of the second surface via the second via. The sensing electrodes of the second electrode structure that are conductive along the second direction form a second collection mechanism, and the second collection mechanism is connected to the second signal line of the second surface.

[0011] In some embodiments, the pressure sensor also includes a signal processing component, which is provided with a signal processing module and a power supply module. The first signal line and the second signal line are respectively connected to the signal processing module, and the first signal line is also connected to the power supply module.

[0012] In some embodiments, the resistance of the pressure-sensitive component decreases as the pressure applied increases.

[0013] In some embodiments, the first surface and the second surface of the component substrate are curved surfaces.

[0014] In some embodiments, the electrode array is formed on the component substrate by surface laser direct structuring.

[0015] The pressure sensor provided in the embodiment of the present application connects the first electrode structure on the first surface of the component substrate to the second electrode structure on the second surface through metallized vias, allowing the sensing electrodes to conduct signals in different directions on different surfaces. This avoids the problem of complex electrode structures caused by wiring in different directions on the same surface, reduces the complexity of the pressure sensor electrode wiring, and increases the density of the individual sensing electrodes in the electrode array. By placing the pressure sensor provided in the embodiment of the present application on the surface of a biomimetic mechanical structure such as a robotic arm, the density of the collected signals can be increased, thereby improving the tactile perception accuracy of the robotic arm, etc. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0017] Figure 1 An exploded diagram of a pressure sensor provided in one embodiment of the present application; Figure 2 A structural wireframe diagram of a pressure sensor provided in one embodiment of the present application; Figure 3 A schematic diagram of the three-dimensional structure of a pressure sensor provided in one embodiment of the present application; Figure 4 A front view of a pressure sensor provided in one embodiment of the present application; Figure 5 A side view of a pressure sensor provided in one embodiment of the present application; Figure 6 A top view of a pressure sensor provided in one embodiment of the present application; Figure 7 This is an enlarged schematic diagram of the first surface of the electrode assembly provided in Example 1 of the present application; Figure 8 A cross-sectional view of an electrode assembly provided in Example 1 of the present application; Figure 9 A schematic diagram of the three-dimensional structure of an electrode assembly provided in Example 1 of the present application; Figure 10 A schematic diagram of the first surface of the electrode assembly provided in Example 2 of the present application; Figure 11 This is an enlarged schematic diagram of the first surface of the electrode assembly provided in Example 2 of the present application; Figure 12 A cross-sectional view of an electrode assembly provided in Example 2 of the present application; Figure 13 A schematic diagram of the second surface of the electrode assembly provided in Example 2 of the present application; Figure 14 A schematic diagram of projections of the first signal line and the second signal line on the first surface of the second surface provided in the second embodiment of the present application; Figure 15 A schematic diagram of the first surface of the electrode assembly provided in Example 3 of the present application; Figure 16 This is an enlarged schematic diagram of the first surface of the electrode assembly provided in Example 3 of the present application; Figure 17 A cross-sectional view of an electrode assembly provided in Example 3 of the present application; Figure 18 A schematic diagram of the second surface of the electrode assembly provided in Example 3 of the present application; Figure 19 This is a schematic diagram of the projection of the first signal line and the second signal line on the first surface of the second surface provided in the third embodiment of the present application.

[0018] Description of reference numerals: 1, pressure-sensitive component; 2, electrode component; 3, signal acquisition component; 4, lower cover component; 21, component base; 22, electrode array; 220, first electrode structure; 2201, power supply unit; 2202, signal acquisition unit; 210, first via hole; 211, second via hole; DETAILED DESCRIPTION The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0019] The flowcharts shown in the accompanying drawings are for illustrative purposes only and do not necessarily include all contents and operations / steps, nor must they be executed in the order described. For example, some operations / steps may be decomposed, combined, or partially merged, so the actual execution order may vary depending on the actual situation.

[0020] An embodiment of the present application provides a pressure sensor.

[0021] The following describes some embodiments of the present application in detail with reference to the accompanying drawings. In the absence of conflict, the following embodiments and features therein may be combined with each other.

[0022] Please refer to Figure 1 、 Figure 2 , Figure 1 An exploded diagram of a pressure sensor provided in one embodiment of the present application; Figure 2A structural wireframe diagram of a pressure sensor provided in one embodiment of the present application.

[0023] like Figure 1 、 Figure 2 As shown, the pressure sensor includes a pressure-sensitive component 1 and an electrode component 2, wherein the pressure-sensitive component 1 covers the electrode component 2; The electrical parameters of the pressure-sensitive component 1 change with the pressure applied; The electrode assembly 2 includes: an assembly substrate 21, an electrode array 22, the electrode array 22 is provided on a first surface and a second surface opposite to the assembly substrate 21, and the electrode array 22 includes a plurality of sensing electrodes, which are used to collect the electrical parameters of the pressure-sensitive assembly 1; The first electrode structure of the sensing electrodes on the first surface is conductive along the first direction and spaced apart along the second direction; the second electrode structure of the sensing electrodes on the second surface is conductive along the second direction and spaced apart along the first direction; A first via hole 210 is formed in the thickness direction of the component substrate 21 , and the first electrode structure and the second electrode structure of the sensing electrode are electrically connected via the first via hole 210 .

[0024] It is understandable that the pressure sensor may also include more structures, such as Figure 3 The signal processing component 3 and the lower cover component 4 shown in the figure are not limited here.

[0025] For example, the pressure-sensitive component 1 may be a pressure-sensitive film, and the electrical parameters at various locations on the pressure-sensitive film change with the amount of pressure applied. Specifically, the pressure-sensitive film may be a resistive pressure-sensitive film, whose resistance changes when deformed by pressure, thereby enabling the pressure applied at each location to be determined based on the resistance at that location. The pressure-sensitive film may also be a capacitive pressure-sensitive film, whose capacitance changes when deformed by pressure. This is not a limitation here.

[0026] Exemplarily, the pressure-sensitive component 1 is covered on the first surface of the component base 21 of the electrode component 2. The first surface of the component base 21 is provided with an electrode array 22. The electrode array 22 is composed of densely arranged sensing electrodes, which can collect the changes in the size of electrical parameters at various positions of the pressure-sensitive component 1, thereby determining the size of the pressure exerted on the pressure-sensitive component 1 based on the changes in the size of the electrical parameters.

[0027] For example, measuring pressure in only a single direction cannot fully reflect the actual force situation of the pressure-sensitive component 1. Collecting pressure in different directions can avoid the errors that may be caused by measurement in a single direction. Therefore, in the pressure sensor provided in the embodiment of the present application, the sensing electrodes are conductive along the first direction and the second direction, thereby collecting the force distribution in the first direction and the second direction.

[0028] For example, in related art, in order to make the sensing electrodes conductive along different directions, the wiring between the sensing electrodes is usually complicated, and the density of the sensing electrodes is limited. The pressure sensor provided in the embodiment of the present application connects the first electrode structure on the first surface of the component substrate 21 and the second electrode structure on the second surface through the metallized first via 210, and the first electrode structure is conductive along the first direction on the first surface, and the second electrode structure is conductive along the second direction on the second surface. This avoids the problem of complex wiring caused by wiring in different directions on the same surface of the electrode substrate 21, reduces the complexity of the wiring between the sensing electrodes, and improves the density of each sensing electrode in the electrode array 22. Exemplarily, the first direction and the second direction are perpendicular to each other. The first direction may be, for example, the X direction, and the second direction may be, for example, the Y direction. The X direction and the Y direction are perpendicular to each other, thereby reducing the error that may be caused by measuring in a single direction and providing a more comprehensive and accurate understanding of the force applied to the surface of the pressure-sensitive component. Of course, this is not limited to this, and the first direction may also be the Y direction and the second direction may be the X direction. This is not limited here.

[0029] Please refer to Figure 3-Figure 6 , Figure 3 A schematic diagram of the three-dimensional structure of a pressure sensor provided in one embodiment of the present application; Figure 4 A front view of a pressure sensor provided in one embodiment of the present application; Figure 5 A side view of a pressure sensor provided in one embodiment of the present application; Figure 6 A top view of a pressure sensor provided in accordance with an embodiment of the present application.

[0030] In some embodiments, the first surface and the second surface of the module substrate 21 are curved surfaces.

[0031] like Figure 3-Figure 6 As shown, the side of the component substrate 21 used to set the electrode array 22 is a curved surface with a certain curvature, wherein the first surface and the second surface are the front and back of the side, respectively. It is understandable that the component substrate 21 can be of other shapes, and the first surface and the second surface can also be curved surfaces of other shapes. Figure 3-Figure 6 The shapes shown in the figure are for example only and do not limit the pressure sensor provided in the embodiments of the present application.

[0032] In some embodiments, the electrode array 22 is formed on the component substrate 21 by surface laser direct structuring.

[0033] Illustratively, the electrode assembly 2 provided in the embodiment of the present application may be a molded interconnect device (MID), in which a conductive structure is directly formed on the surface of a three-dimensional plastic device by laser direct structuring (LDS) technology.

[0034] For example, a molded interconnect device (MID) is a specialized printed circuit. The MID process interconnects circuits within injection-molded plastic components, combining conductive and insulating materials to form a conductive structure. This replaces traditional two-dimensional circuit board structures and enables the creation of circuit structures on complex curved surfaces. Compared to traditional PCBs (Printed Circuit Boards), laser direct structuring eliminates the need for complex molds and etching processes. Changes to the circuit pattern require only adjustments to the laser processing program, eliminating the need for mold redesign. This improves production efficiency and reduces costs.

[0035] Please refer to Figure 7 , Figure 7 This is a schematic diagram of the first surface of the electrode assembly provided in Example 1 of the present application.

[0036] like Figure 7 As shown, the electrode assembly 2 includes an assembly substrate 21 and an electrode array 22. The assembly substrate 21 is the foundation of the electrode assembly 2 and is used to support the structure of the electrode array 22. In the pressure sensor provided in the embodiment of the present application, the assembly substrate 21 can be made of a resin material, such as a resin material with laser engraving and chemical plating capabilities.

[0037] like Figure 7 As shown, the electrode array 22 includes a plurality of sensing electrodes. The sensing electrodes are connected along a first direction in a first electrode structure 220 on a first surface. The first direction can be, for example, Figure 7 The Y direction is shown in FIG.

[0038] In some embodiments, the first electrode structure 220 includes a power supply unit 2201 and a signal acquisition unit 2202 ; The power supply unit 2201 is used to provide an electrical signal to the signal acquisition unit 2202. The electrical signal of the power supply unit 2201 is transmitted to the signal acquisition unit 2202 via the pressure sensitive component 1. The signal acquisition unit 2202 is used to collect the magnitude of the electrical signal. The power supply unit 2201 is arranged around the signal collection unit 2202 .

[0039] Illustratively, the power supply unit 2201 is used to transmit the electrical signal output by the power supply from the power supply to the sensing electrode, and the signal acquisition unit 2202 is used to acquire the magnitude of the electrical signal.

[0040] Illustratively, the power supply unit 2201 arranged around the signal acquisition unit 2202 isolates signal interference between the densely arranged signal acquisition units 2202, so that the sensing electrodes in the electrode array 22 can be arranged at a smaller spacing distance, while reducing mutual interference.

[0041] In the related art, because the electrical signal is transmitted from the power supply unit 2201 to the signal acquisition unit 2202 via the pressure-sensitive component 1, the electrical signal of the power supply unit 2201 easily overflows through the pressure-sensitive component 1 to the signal acquisition units 2202 of other surrounding sensing electrodes, thereby affecting the magnitude of the electrical signal detected by other sensing electrodes and causing mutual interference between different sensing electrodes. In the pressure sensor provided in the embodiment of the present application, the power supply unit 2201 is arranged around the signal acquisition unit 2202, so that the power supply unit 2201 can, to a certain extent, isolate the electrical signal interference between different signal acquisition units 2202, thereby reducing the mutual interference between the various sensing electrodes and enabling the various sensing electrodes in the electrode array 22 to be arranged at a smaller spacing.

[0042] The shapes of the power supply unit 2201 and the signal acquisition unit 2202 can be square, rectangular, rhombus, ellipse, circle or polygons with five or more sides, and these shapes can have rounded corners. Figure 7 The shapes of the power supply unit 2201 and the signal acquisition unit 2202 shown in the figure are only for illustration, and the shapes of the power supply unit 2201 and the acquisition unit 2202 are not limited herein.

[0043] In some embodiments, the resistance of the pressure-sensitive component decreases as the pressure applied to it increases.

[0044] Exemplarily, the pressure-sensitive component 1 can be a resistive pressure-sensitive film. When not under pressure, the pressure-sensitive component 1 has a large resistance, and at this time there is a break between the power supply part 2201 and the signal acquisition part 2202; when under pressure, the resistance of the pressure-sensitive component 1 decreases, so that the power supply part 2201 and the signal acquisition part 2202 are connected.

[0045] Furthermore, since there is a negative correlation between the resistance of the pressure-sensitive component 1 and the pressure, that is, the resistance between the power supply unit 2201 and the signal acquisition unit 2202 is negatively correlated with the pressure. Therefore, the greater the pressure on the pressure-sensitive component 1, the smaller the resistance between the power supply unit 2201 and the signal acquisition unit 2202, and the greater the current between the power supply unit 2201 and the signal acquisition unit 2202. The pressure at the location can be determined based on the current collected by the signal acquisition unit 2202, thereby achieving pressure detection.

[0046] Example 1 of the pressure sensor provided by this application In some embodiments, the power supply unit 2201 forms a power supply ring, and the signal acquisition unit 2202 is located in the inner circle area of ​​the power supply ring and is spaced apart from the power supply ring.

[0047] Please continue to refer to Figure 7 Since a circle has an isoperimetric property, meaning that it has the largest area among all plane figures with equal circumference, the distance between the signal acquisition units 2202 can be maximized by providing a circular power supply unit 2201 surrounding the signal acquisition unit 2202. For example, the signal acquisition portion 2202 may also be circular. By providing the circular signal acquisition portion 2202 , the area of ​​the signal acquisition portion 2202 can be increased as much as possible, thereby improving the detection area of ​​each sensing electrode.

[0048] In some embodiments, the power supply parts 2201 are conductive along the first direction on the first surface and spaced apart along the second direction; The first via 210 is located in the signal collection unit 2202 . The signal collection unit 2202 is connected to the second electrode structure via the first via 210 . The second electrode structure is connected along the second direction on the second surface and spaced apart along the first direction.

[0049] Please continue to refer to Figure 7 A first via 210 formed along the thickness of the component substrate 21 is located in the signal collection unit 2202, for example, at the geometric center of the signal collection unit 2202. It will be appreciated that the surface of the first via 210 is covered with metal, thereby connecting and conducting the signal collection unit 2202 to the second electrode structure on the second surface, thereby transmitting the electrical signal from the signal collection unit 2202 to the second surface of the component substrate 21.

[0050] Please refer to Figure 8 , Figure 8 This is a cross-sectional view of an electrode assembly provided in Example 1 of the present application.

[0051] like Figure 8 As shown, the first via hole 210 passes through the thickness direction between the first surface and the second surface.

[0052] like Figure 7 As shown, the power supply rings formed by the power supply portion 2201 are conductive along the Y direction on the first surface and are spaced apart along the X direction.

[0053] Please refer to Figure 9 , Figure 9 This is a schematic diagram of the three-dimensional structure of an electrode assembly provided in Example 1 of the present application.

[0054] like Figure 9 As shown, the second electrode structures that are in electrical contact with the signal acquisition unit 2202 through the first via 210 are electrically connected along the X direction on the second surface and are spaced apart along the Y direction.

[0055] In some embodiments, the component substrate 21 further has a second via 211 formed in the thickness direction. The sensing electrodes of the first electrode structure that are conductive along the first direction form a first acquisition mechanism, and the first acquisition mechanism is connected to the first signal line 201 on the second surface via the second via 211. The sensing electrodes of the second electrode structure that are conductive along the second direction form a second collection mechanism, and the second collection mechanism is connected to the second signal line 202 on the second surface.

[0056] like Figure 7-Figure 9 As shown, each power supply ring is connected and conducted on the first surface to form a first collection mechanism along the Y direction. The first collection mechanism is connected to the first signal line 201 on the second surface of the component substrate 20 through the second via 211. The first signal line 201 is used to transmit electrical signals in the Y direction.

[0057] The second electrode structures, which are electrically connected to the signal collection unit 2202 via the first vias 210, are connected and electrically connected along the X direction on the second surface to form a second collection mechanism. Each second collection mechanism is connected to a second signal line 202 on the second surface, which is used to transmit electrical signals in the X direction.

[0058] In some embodiments, the pressure sensor also includes a signal processing component 3, which is provided with a signal processing module and a power supply module. The first signal line 201 and the second signal line 202 are respectively connected to the signal processing module, and the first signal line 201 is also connected to the power supply module.

[0059] like Figure 1As shown, the signal processing component 3 may be a signal acquisition board, and the signal processing module may be a processor on the signal acquisition board. It should be understood that the processor may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor may be a microprocessor or any conventional processor, etc.

[0060] Exemplarily, the first signal line 210 is also connected to the power supply module. Since the first signal line 210 is connected to the power supply ring formed by each power supply part 2201 on the first surface via the second via 211, the current output by the power supply module can be transmitted to the power supply part 2201 of each sensing electrode in the first acquisition mechanism on the first surface via the first signal line 210, so that the power supply part 2201 can provide the electrical energy required for the operation of the sensing electrodes.

[0061] Exemplarily, the first signal line 201 and the second signal line 202 are connected to the signal processing module respectively, and the pressure signals collected along the X direction and the Y direction are respectively transmitted to the signal processing module for processing and analysis.

[0062] Embodiment 2 of the pressure sensor provided by this application Please refer to Figure 10 , Figure 10 This is a schematic diagram of the first surface of the electrode assembly provided in Example 2 of the present application.

[0063] like Figure 10 As shown, in some embodiments, the power supply unit 2201 and the signal acquisition unit 2202 are polygonal in shape, and the power supply unit 2201 and the signal acquisition unit 2202 are arranged at intervals on the first surface to form a grid structure.

[0064] Illustratively, the power supply unit 2201 and the signal acquisition unit 2202 are densely laid on the first surface to form a grid structure, thereby improving the space utilization of the first surface and enabling the first electrode structure 220 to collect as many dense pressure signals as possible on the first surface.

[0065] It is understandable that the shapes of the power supply unit 2201 and the signal acquisition unit 2202 in this embodiment include but are not limited to Figure 10The rhombus shown in the figure can also be a triangle, a quadrilateral, a hexagon, etc. that can be densely laid on the first surface to form a grid structure. The shape of the first surface is also not limited to Figure 10 The spherical surface shown in can also be other curved surfaces or planes.

[0066] In some embodiments, the power supply parts 2201 are conductive along the first direction on the first surface and spaced apart along the second direction; The first via 210 is located in the signal collection unit 2202 . The signal collection unit 2202 is connected to the second electrode structure via the first via 210 . The second electrode structure is connected along the second direction on the second surface and spaced apart along the first direction.

[0067] Please refer to Figure 11 , Figure 11 This is an enlarged schematic diagram of the first surface of the electrode assembly provided in Example 2 of the present application.

[0068] like Figure 11 As shown, the power supply parts 2201 are connected and conducted along the X direction on the first surface and are spaced apart along the Y direction.

[0069] Please refer to Figure 12 , Figure 12 This is a cross-sectional view of an electrode assembly provided in Example 2 of the present application.

[0070] like Figure 12 As shown, the first via hole 210 passes through the thickness direction between the first surface and the second surface.

[0071] Please refer to Figure 13 , Figure 13 This is a schematic diagram of the second surface of the electrode assembly provided in Example 2 of the present application.

[0072] like Figure 13 As shown, the second electrode structures that are conductive with the signal acquisition unit 2202 through the first via 210 are conductive along the Y direction on the second surface and are spaced apart along the X direction.

[0073] In some embodiments, the component substrate 21 further has a second via 211 formed in the thickness direction. The sensing electrodes of the first electrode structure that are conductive along the first direction form a first acquisition mechanism, and the first acquisition mechanism is connected to the first signal line 201 on the second surface via the second via 211. The sensing electrodes of the second electrode structure that are conductive along the second direction form a second collection mechanism, and the second collection mechanism is connected to the second signal line 202 on the second surface.

[0074] like Figure 13As shown, the first electrode structure of each sensing electrode on the first surface is connected along the X direction to form a first acquisition mechanism. Specifically, as shown Figure 11 As shown, each power supply portion 2201 on the first surface is connected along the X direction to form a first collection mechanism. Each first collection mechanism is connected to the first signal line 201 on the second surface via a second via hole 211, as shown in FIG. Figure 13 As shown, the second via holes 211 are arranged along a diagonal line on the second surface.

[0075] like Figure 13 As shown, the second electrode structure of the sensing electrode is connected along the Y direction on the second surface to form a second collection mechanism, and each second collection mechanism is connected to the second signal line 202 on the second surface.

[0076] like Figure 13 As shown, the first signal lines 201 and the second signal lines 202 are arranged alternately on the second surface.

[0077] In some embodiments, the pressure sensor also includes a signal processing component 3, which is provided with a signal processing module and a power supply module. The first signal line 201 and the second signal line 202 are respectively connected to the signal processing module, and the first signal line 201 is also connected to the power supply module.

[0078] Exemplarily, the first signal line 210 is also connected to the power supply module. Since the first signal line 210 is connected to the various power supply parts 2201 on the first surface via the second via 211, the current output by the power supply module can be transmitted through the first signal line 210 to the power supply parts 2201 of the various sensor electrodes on the first acquisition mechanism, so that the power supply parts 2201 can provide the electrical energy required for the operation of the sensor electrodes.

[0079] Exemplarily, the first signal line 201 and the second signal line 202 are connected to the signal processing module respectively, and the pressure signals collected along the X direction and the Y direction are respectively transmitted to the signal processing module for processing and analysis.

[0080] Please refer to Figure 14 , Figure 14 This is a schematic diagram of the projection of the first signal line and the second signal line on the first surface of the second surface provided in the second embodiment of the present application.

[0081] Please combine Figure 13 、 Figure 14 ,like Figure 14 As shown, the blue dotted line represents the routing of the second collection mechanism on the second surface, and the red dotted line represents the routing of the second collection mechanism on the second surface.

[0082] Example 3 of the pressure sensor provided by this application Please refer to Figure 15 , Figure 15A schematic diagram of the first surface of the electrode assembly provided in Example 3 of the present application; Figure 16 This is an enlarged schematic diagram of the first surface of the electrode assembly provided in Example 3 of the present application.

[0083] like Figure 15 As shown, in some embodiments, the power supply unit 2201 forms a first comb-shaped electrode, the signal acquisition unit 2202 forms a second comb-shaped electrode, and the first electrode fingers of the first comb-shaped electrode and the second electrode fingers of the second comb-shaped electrode are arranged in an alternating manner.

[0084] For example, the electrode array 22 on the first surface of the component substrate 21 can also be as follows Figure 15 The interdigitated electrodes shown. The first comb-shaped electrode formed by the power supply unit 2201 is arranged around the second comb-shaped electrode formed by the signal acquisition unit 2202, and the first electrode fingers of the first comb-shaped electrode and the second electrode fingers of the second comb-shaped electrode are arranged in an interlaced manner. The comb-shaped structure of the interdigitated electrodes makes the electric field distribution between the electrodes more concentrated, which can effectively improve the sensitivity of pressure detection.

[0085] In some embodiments, the power supply parts 2201 are conductive along the first direction on the first surface and spaced apart along the second direction; The first via 210 is located in the signal collection unit 2202 . The signal collection unit 2202 is connected to the second electrode structure via the first via 210 . The second electrode structure is connected along the second direction on the second surface and spaced apart along the first direction.

[0086] like Figure 16 As shown, the first comb-shaped electrodes formed by the power supply portion 2201 are connected and conductive along the X direction on the first surface.

[0087] Please refer to Figure 17 , Figure 17 This is a cross-sectional view of an electrode assembly provided in Example 3 of the present application.

[0088] like Figure 17 As shown, the first via hole 210 is located in the signal collection portion 2202 , for example, located in the geometric center of the signal collection portion 2202 , and the first via hole 210 passes through the thickness direction between the first surface and the second surface.

[0089] The second via hole 211 is located at the connection portion between the power supply parts 2201 , and the second via hole 211 passes through the thickness direction between the first surface and the second surface.

[0090] Please refer to Figure 18 , Figure 18 This is a schematic diagram of the second surface of the electrode assembly provided in Example 3 of the present application.

[0091] like Figure 18As shown, the second electrode structures that are conductive with the signal acquisition unit 2202 through the first via 210 are conductive along the Y direction on the second surface and are spaced apart along the X direction.

[0092] In some embodiments, the component substrate 21 further has a second via 211 formed in the thickness direction. The sensing electrodes of the first electrode structure that are conductive along the first direction form a first acquisition mechanism, and the first acquisition mechanism is connected to the first signal line 201 on the second surface via the second via 211. The sensing electrodes of the second electrode structure that are conductive along the second direction form a second collection mechanism, and the second collection mechanism is connected to the second signal line 202 on the second surface.

[0093] like Figures 15-18 As shown, the first comb-shaped electrodes are connected and conducted on the first surface through the connecting portion, forming a first collection mechanism along the X direction. The first collection mechanism is connected to the first signal line 201 on the second surface of the component substrate 21 through the second via 211 located on the connecting portion. The first signal line 201 is used to transmit the electrical signal in the X direction.

[0094] The second electrode structure, which is conductive with the second comb-shaped electrode via the first via 210, is connected and conductive along the Y direction on the second surface to form a second collection mechanism, and each second collection mechanism is connected to the second signal line 202 on the second surface, and the second signal line 202 is used to transmit the electrical signal in the Y direction.

[0095] In some embodiments, the pressure sensor also includes a signal processing component 3, which is provided with a signal processing module and a power supply module. The first signal line 201 and the second signal line 202 are respectively connected to the signal processing module, and the first signal line 201 is also connected to the power supply module.

[0096] Exemplarily, the first signal line 210 is also connected to the power supply module. Since the first signal line 210 is connected to the various power supply parts 2201 on the first surface via the second via 211, the current output by the power supply module can be transmitted through the first signal line 210 to the power supply parts 2201 of the various sensor electrodes on the first acquisition mechanism, so that the power supply parts 2201 can provide the electrical energy required for the operation of the sensor electrodes.

[0097] Exemplarily, the first signal line 201 and the second signal line 202 are connected to the signal processing module respectively, and the pressure signals collected along the X direction and the Y direction are respectively transmitted to the signal processing module for processing and analysis.

[0098] Please refer to Figure 19 , Figure 19 This is a schematic diagram of the projection of the first signal line and the second signal line on the first surface of the second surface provided in the third embodiment of the present application.

[0099] Please combine Figure 18 、 Figure 19 ,like Figure 19 As shown, the blue dotted line is the routing of the first collection mechanism on the second surface, and the red dotted line is the routing of the second collection mechanism on the second surface. The pressure sensor provided in the embodiment of the present application connects the first electrode structure on the first surface of the component substrate to the second electrode structure on the second surface through metallized vias, allowing the sensing electrodes to conduct signals in different directions on different surfaces. This avoids the problem of complex electrode structures caused by wiring in different directions on the same surface, reduces the complexity of the pressure sensor electrode wiring, and increases the density of the individual sensing electrodes in the electrode array. By placing the pressure sensor provided in the embodiment of the present application on the surface of a biomimetic mechanical structure such as a robotic arm, the density of the collected signals can be increased, thereby improving the tactile perception accuracy of the robotic arm, etc.

[0100] It should be understood that the terms used in this specification are only for the purpose of describing specific embodiments and are not intended to limit the present application. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms unless the context clearly indicates otherwise.

[0101] It should also be understood that the term "and / or" used in this specification and the appended claims refers to any combination of one or more of the associated listed items and all possible combinations, including these combinations. It should be noted that, in this article, the terms "include", "comprise" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or system that includes a series of elements includes not only those elements, but also other elements that are not explicitly listed, or also includes elements that are inherent to such process, method, article or system. In the absence of further limitations, an element defined by the sentence "including a..." does not exclude the presence of other identical elements in the process, method, article or system that includes the element.

[0102] The serial numbers of the embodiments of the present application are for description only and do not represent the advantages or disadvantages of the embodiments. The above description is only a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in this application, and these modifications or replacements should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A pressure sensor, characterized in that: The pressure sensor includes a pressure-sensitive component and an electrode component, wherein the pressure-sensitive component covers the electrode component; The electrical parameters of the pressure-sensitive component vary with the pressure applied; The electrode assembly includes: an assembly substrate, an electrode array, wherein the electrode array is disposed on a first surface and a second surface opposite to the assembly substrate, and the electrode array includes a plurality of sensing electrodes, wherein the sensing electrodes are used to collect electrical parameters of the pressure-sensitive assembly; The first electrode structure of the sensing electrodes on the first surface is conductive along the first direction and spaced apart along the second direction; the second electrode structure of the sensing electrodes on the second surface is conductive along the second direction and spaced apart along the first direction; A first via hole is formed in the thickness direction of the component substrate, and the first electrode structure and the second electrode structure of the sensing electrode are electrically connected via the first via hole.

2. The pressure sensor according to claim 1, characterized in that The first electrode structure includes a power supply part and a signal acquisition part; The power supply unit is used to provide an electrical signal to the signal acquisition unit, and the electrical signal of the power supply unit is transmitted to the signal acquisition unit via the pressure sensitive component, and the signal acquisition unit is used to acquire the magnitude of the electrical signal; Wherein, the power supply unit is arranged around the signal acquisition unit.

3. The pressure sensor according to claim 2, wherein: The power supply part forms a power supply ring, and the signal acquisition part is located in the inner circle area of ​​the power supply ring and is spaced apart from the power supply ring.

4. The pressure sensor according to claim 2, wherein: The power supply part and the signal collection part are polygonal in shape, and are arranged at intervals on the first surface to form a grid structure.

5. The pressure sensor according to claim 2, wherein: The power supply unit forms a first comb-shaped electrode, the signal acquisition unit forms a second comb-shaped electrode, and the first electrode fingers of the first comb-shaped electrode and the second electrode fingers of the second comb-shaped electrode are arranged in an alternating manner.

6. The pressure sensor according to any one of claims 2 to 5, characterized in that: The power supply parts are conductive along the first direction on the first surface and spaced apart along the second direction; The first via hole is located in the signal collection part. The signal collection part is connected to the second electrode structure via the first via hole. The second electrode structure is connected along the second direction on the second surface and is spaced apart along the first direction.

7. The pressure sensor according to any one of claims 1 to 5, characterized in that: The component substrate is further formed with a second via hole in the thickness direction, and the sensing electrodes of the first electrode structure that are conductive along the first direction form a first acquisition mechanism, and the first acquisition mechanism is connected to the first signal line of the second surface via the second via hole; The sensing electrodes of the second electrode structure that are conductive along the second direction form a second collection mechanism, and the second collection mechanism is connected to the second signal line of the second surface.

8. The pressure sensor according to claim 7, characterized in that The pressure sensor also includes a signal processing component, which is provided with a signal processing module and a power module. The first signal line and the second signal line are respectively connected to the signal processing module, and the first signal line is also connected to the power module.

9. The pressure sensor according to any one of claims 1 to 5, characterized in that: The resistance of the pressure-sensitive component decreases as the pressure applied to it increases.

10. The pressure sensor according to any one of claims 1 to 5, characterized in that: The first surface and the second surface of the component substrate are curved surfaces.

11. The pressure sensor according to any one of claims 1 to 5, characterized in that: The electrode array is formed on the component substrate by surface laser direct structuring.

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