Micromirror unit, micromirror array, optical system and preparation method of micromirror array

Abstract

The invention provides a micro-mirror unit, a micro-mirror array, an optical system and a preparation method of the micro-mirror array. The micromirror unit comprises a driver and a mirror surface assembly. The driver comprises a driving layer and a substrate, the driving layer comprises a supporting table and a plurality of driving pieces, the supporting table is provided with connecting holes, and the driving pieces are connected between the supporting table and the substrate and used for driving the supporting table to move. The mirror surface assembly comprises mirror surface layers and supporting pieces, the mirror surface layers are stacked on one side of the driver at intervals, the surfaces, back to the driver, of the mirror surface layers are used for reflecting light beams, the first ends of the supporting pieces are connected with the surfaces, facing the driver, of the mirror surface layers, and the second ends of the supporting pieces are inserted into the connecting holes. According to the micro-mirror unit provided by the invention, the duty ratio of the mirror surface layer in the micro-mirror unit is improved, and the assembling difficulty of the mirror surface assembly and the driver and the damage risk of the mirror surface layer are reduced.

Description

Technical Field

[0001] The present application relates to the field of optical systems, and in particular to a micromirror unit, a micromirror array, an optical system, and a method for manufacturing a micromirror array. Background Art

[0002] As a core subsystem in precision optomechanical systems, oscillating mirror systems can be used in fields such as scanning imaging, automotive radar, optical projection, and optical communications. These systems can guide light beams through the rotation of the mirrors within their micromirror structures. However, the current micromirror structures have a small mirror footprint, resulting in a small area within the micromirror structure dedicated to reflecting the light beam, leading to insufficient utilization of the micromirror structure's dimensions. Summary of the Invention

[0003] The present application provides a micromirror unit, a micromirror array, an optical system, and a method for manufacturing a micromirror array. The micromirror unit includes a mirror assembly and a driver. The mirror layer in the mirror assembly and the driver are stacked and connected to a connection hole in the driver via a support member. The design of the mirror assembly and the driver increases the duty cycle of the mirror layer in the micromirror unit, reduces the difficulty of assembling the mirror assembly and the driver, and reduces the risk of damage to the mirror layer.

[0004] In a first aspect, the present application provides a micromirror unit comprising a driver and a mirror assembly. The driver comprises a driver layer and a substrate. The driver layer comprises a support platform and a plurality of driver members. The support platform has a connection hole. The driver members are connected between the support platform and the substrate and are used to drive the support platform to move. The mirror assembly comprises a mirror layer and a support member. The mirror layer is stacked in intervals on one side of the driver. The surface of the mirror layer facing away from the driver is used to reflect a light beam. The first end of the support member is connected to the surface of the mirror layer facing the driver, and the second end of the support member is inserted into the connection hole.

[0005] In the present application, the mirror assembly and the driver can be prepared separately on two wafer substrates and then assembled, so that the mirror assembly can be mirror-coated before assembly, which helps to reduce the difficulty of the coating process and makes the coating type unrestricted. In addition, the mirror assembly and the driver are assembled by plugging, which can reduce the difficulty of connecting the mirror assembly and the driver, thereby reducing the difficulty of assembling the micromirror unit, and there is no need to specially consider the compatibility of the coating process or the damage of the film layer. Mature optical coating technology can be introduced to coat the mirror assembly separately to achieve high reflection of the working spectrum. By plugging the support member into the connecting hole, the mirror assembly and the driver can be positioned and installed by aligning the support member and the connecting hole, thereby improving the installation accuracy of the micromirror unit.

[0006] In the present application, since the mirror layer and the driver are stacked, the mirror layer and the driver are different layers, so that the mirror layer can cover at least part of the driver, thereby increasing the duty cycle of the mirror layer, thereby increasing the effective area ratio of the micromirror unit reflecting the light beam, and improving the size utilization of the micromirror unit.

[0007] In some possible implementations, there is a gap between the second end of the support member and the wall of the connecting hole. The micromirror unit further includes an adhesive, at least part of which is disposed in the gap for bonding the second end of the support member to the support platform.

[0008] In this embodiment, a gap exists between the second end of the support member and the wall of the connection hole to prevent the support member from squeezing the support platform after being inserted into the connection hole, thereby reducing the risk of damage to the support platform. After the second end of the support member is inserted into the connection hole, a dispensing process can be used to bond the second end of the support member to the support platform with an adhesive, thereby improving the stability of the connection between the support member and the support platform, thereby improving the stability of the actuator's movement of the mirror layer.

[0009] In some possible implementations, the width of the gap is in the range of 1 μm to 2 μm.

[0010] In this implementation, the size design of the gap is conducive to the alignment of the support member and the connecting hole, thereby facilitating the improvement of the installation accuracy of the mirror layer on the driver, and can provide sufficient space for the adhesive to flow in, and can prevent the support member from squeezing the support table and damaging the support table when it is plugged into the connecting hole. If the width of the gap is less than 1 μm, it will be difficult for the adhesive to flow into the gap before solidification, which may easily lead to insufficient bonding after solidification and affect the bonding stability between the support member and the support table, and will make the alignment accuracy requirements of the support member and the connecting hole higher, increasing the risk of the support member squeezing the support table. If the width of the gap is greater than 2 μm, there is a higher risk of misalignment between the support member and the connecting hole, which may easily lead to excessive positioning offset of the support member, thereby affecting the accuracy of the driver driving the mirror layer to rotate.

[0011] In some possible implementations, the mirror assembly further includes a reflective film layer disposed on a surface of the mirror layer facing away from the driver. The reflective film layer includes at least one of an aluminum film, an indium film, a titanium silicon dielectric film, and a molybdenum silicon dielectric film.

[0012] In this implementation, since the driver and mirror assembly can be prepared separately and then assembled, and assembled through plug-in and dispensing processes, the compatibility of the micromirror unit with the type of reflective film layer is improved, so that the reflective film layer can be selected from at least one of aluminum film, indium film, titanium silicon dielectric film, and molybdenum silicon dielectric film, thereby improving the reflective effect of the mirror layer.

[0013] In some possible implementations, along the stacking direction of the mirror layer and the driver, the mirror layer covers the driver layer and covers at least a portion of the substrate.

[0014] In this implementation, the mirror layer and the driver are stacked so that the mirror layer can cover the driver layer and at least a portion of the substrate, thereby increasing the duty cycle of the mirror layer and thereby improving the space utilization in the micromirror unit, which is beneficial for achieving the movement of a large-sized mirror layer under limited drive displacement.

[0015] In some possible implementations, along the stacking direction of the mirror layer and the driver, the ratio of the area of ​​the orthographic projection of the mirror layer on the plane where the driver is located to the area of ​​the driver is greater than or equal to 50%.

[0016] In some possible implementations, the substrate has a plurality of through-holes. The driver further includes a conductive member, the through-holes partially filled with the conductive member, a first end of the conductive member exposed on a side of the substrate facing the mirror layer and electrically connected to the driver, and a second end of the conductive member exposed on a side of the substrate facing away from the mirror layer and configured to be connected to an external circuit to receive a control signal.

[0017] In this implementation, by providing a through hole in the substrate for arranging a conductive member, and the conductive member is capable of conducting the circuit between the driver and the circuit module, the length of the wiring harness between the driver and the circuit board is shortened, thereby compressing the wiring space and achieving a compact electrical connection. This is in turn conducive to the packaging of large-scale micromirror arrays with high duty cycles, reducing the package size and packaging costs. For example, by providing a through hole in the substrate and providing a conductive member, the duty cycle of the mirror layer in the micromirror array can be achieved to be greater than or equal to 50%. The duty cycle of the mirror layer in the micromirror array refers to the ratio of the area of ​​all the mirror layers to the area of ​​the micromirror array.

[0018] In some possible implementations, the driving member includes a driving part and an elastic part, one end of the driving part is connected to the support platform through the elastic part, and the other end of the driving part is connected to the base; the elastic part is used to undergo elastic deformation under the drive of the driving part and drive the support platform to move.

[0019] In this implementation, the driving part is connected to the support platform via the elastic part, and the elastic deformation of the elastic part can be used to provide movement space for the support platform, thereby facilitating the movement of the mirror layer and realizing a larger-sized mirror layer design.

[0020] In some possible implementations, the driving unit includes a first substrate, a first bottom electrode, a piezoelectric layer and a first top electrode stacked in sequence. The driving unit drives the piezoelectric layer to deform through the voltage difference between the first bottom electrode and the first top electrode to drive the support platform to move.

[0021] In this implementation, the piezoelectric layer can be controlled to deform by controlling the voltage difference between the first bottom electrode and the first top electrode, thereby causing the entire driver to deform. This in turn causes the driver to move the support platform with the substrate as the support point, thereby driving the mirror layer to move. The piezoelectric layer can deform by, but is not limited to, warping or expanding, thereby causing the mirror layer to rotate about the first or second axis, as well as to translate along the stacking direction of the mirror layer and the driver.

[0022] In some possible implementations, there are multiple drive units, two adjacent drive units are arranged in parallel, and in the two adjacent drive units, one end of one drive unit is connected to one end of the other drive unit, and the other end of one drive unit extends toward the other end of the other drive unit.

[0023] In this implementation, by arranging multiple drive units side by side, not only can the installation dimensions of the drive member in a single direction be shortened, but the deformation of the piezoelectric layers in the multiple drive units can be superimposed, thereby increasing the overall deformation of the drive member and, in turn, increasing the angular range or displacement range over which the drive member can drive the mirror layer to rotate about a first axis. For example, if the deformation of the piezoelectric layer in each drive unit can drive the mirror layer to rotate about a first axis by a first angle, then the angle over which the drive member can drive the mirror layer to rotate about the first axis is the product of the first angle and the number of drive units in the drive member.

[0024] In some possible implementations, the driver further includes a connecting beam connected between two adjacent driver portions. The connecting beam includes a second bottom electrode and a second top electrode, the second bottom electrode electrically connected between the two first bottom electrodes of the two adjacent driver portions, and the second top electrode electrically connected between the two first top electrodes of the two adjacent driver portions.

[0025] In this implementation, the connecting beam not only electrically connects two adjacent drive units, but also structurally connects them. By preventing tilt and staggered cascading of the piezoelectric units within the piezoelectric element, the driver can drive the mirror layer to move in multiple degrees of freedom while maintaining a large static rotation angle, thereby increasing the amplitude of the mirror layer's movement. In each driver, the connecting beam connects two adjacent drive units, enabling multiple drive units to be connected in series, thus achieving unified signal control and simplifying control of each driver.

[0026] In some possible implementations, the driving member further includes a sensor, which is connected to the driving portion and is used to detect a deformation amount in the driving portion.

[0027] In this implementation, the deformation amount in the driving part is detected by a sensor, and the sum of the deformation amounts in the driving part can be fed back to the controller, so that the controller can calculate the current rotation angle or displacement of the mirror layer based on the deformation amount of the driving part, and compare it with the preset motion parameters, so as to calculate whether the current rotation angle or position of the mirror layer meets the conditions, which is conducive to timely feedback on the rotation or displacement of the mirror layer, thereby facilitating the correction of the rotation or displacement of the mirror layer and improving the motion accuracy of the mirror layer.

[0028] In some possible implementations, the driver further includes a shielding electrode, which is connected between the sensor and the driver and is used to shield the current signal between the sensor and the driver.

[0029] In this implementation, the shielding electrode is constructed of electromagnetic shielding material, thereby shielding the current signal between the sensor and the driver. This prevents the current in the sensor from affecting the voltage difference between the first top electrode and the first bottom electrode in the driver, thereby preventing the driver's deformation from being affected. Furthermore, this prevents the driver's current from crosstalking the sensor, thereby affecting the sensor's detection of the driver's deformation, and thus preventing the sensor from feeding back erroneous information about the mirror layer's motion.

[0030] In some possible implementations, the first end of the support member is connected to the center of the mirror layer, and the connection hole is located at the center of the support platform. In a plane perpendicular to the stacking direction of the mirror layer and the driver, the support platform has a first axis and a second axis passing through the center of the support platform and perpendicular to each other. The driver members located on either side of the first axis are symmetrical with respect to the first axis, and the driver members located on either side of the second axis are symmetrical with respect to the second axis.

[0031] In this implementation, the center setting of the support member and the connecting hole can provide a balanced and stable connection between the mirror assembly and the support platform pin. By symmetrically arranging the driving members, it is beneficial to drive the mirror layer to move through the symmetrically arranged driving members, thereby providing stability in the movement of the mirror layer. For example, in the driving members symmetrically arranged relative to the first axis, the driving member located on one side of the first axis drives the mirror layer to rotate around the first axis toward the Z direction, and the driving member located on the other side of the first axis drives the mirror layer to rotate around the first axis toward the -Z direction. By setting the driving forces of the driving members on both sides of the first axis to be the same, a balanced rotation of the mirror around the first axis can be achieved together.

[0032] In some possible implementations, all the driving members are located on both sides of the support platform along the second axis, and the angle between the driving member and the first axis is in the range of 30° to 60°.

[0033] In this implementation, by setting the angle between the driving part and the first axis, the driving part can achieve a larger yaw angle stroke, thereby driving the mirror layer to achieve a larger rotation angle, which is beneficial to the large-size design of the mirror layer.

[0034] In some possible implementations, the driving layer further includes a connecting block, the connecting block connecting opposite sides of the support platform along the first axis, the driving member connected to the connecting block, and the length of the connecting block along the first axis is less than the length of the support platform.

[0035] In this implementation, by providing the connecting block, the dimension of the support platform along the second axis direction can be lengthened, which can avoid structural interference between two adjacent driving members in the second axis direction and is beneficial to the spatial layout of the driving members.

[0036] In some possible implementations, all the driving members are arranged around the support platform, the extension direction of the driving members is parallel to the side of the corresponding support platform, and all the driving members are arranged in a clockwise or counterclockwise direction.

[0037] In this implementation, all the driving members are arranged around the support platform, which is beneficial to balancing the space occupied by the micromirror unit in the direction of the first axis and the second axis, making the overall structure of the micromirror unit more compact.

[0038] In some possible implementations, the driving member drives the mirror layer to rotate around a direction parallel to the first axis at an angle in the range of 0° to 15°, so that the driving member can drive the mirror layer to achieve a larger static rotation angle around a direction parallel to the first axis.

[0039] In some possible implementations, the driving member drives the mirror layer to rotate around a direction parallel to the second axis at an angle in the range of 0° to 15°, so that the driving member can drive the mirror layer to achieve a larger static rotation angle around a direction parallel to the second axis.

[0040] In some possible implementations, the driver drives the mirror layer to move in the range of 0 μm to 500 μm along the stacking direction of the mirror assembly and the driver, so that the driver can drive the mirror layer to achieve a larger translational displacement along the stacking direction of the mirror assembly and the driver.

[0041] In a second aspect, the present application also provides a micromirror array, which includes a circuit module and a plurality of micromirror units of any of the aforementioned items, wherein the plurality of micromirror units are arranged in an array and are all electrically connected to the circuit module.

[0042] In this implementation, each micromirror unit can be independently electrically connected to the circuit module so that each micromirror unit can be independently controlled, thereby enabling the micromirror array to reflect light beams at multiple angles at the same time.

[0043] In a third aspect, the present application further provides an optical system comprising a light source, a swing mirror system, and a receiving optical system. The light source is configured to emit a light beam, and the swing mirror system is configured to receive the light beam and change the propagation direction of the light beam to reflect the light beam to the receiving optical system. The swing mirror system comprises a micromirror unit as described above, or the swing mirror system comprises a micromirror array as described above.

[0044] In this implementation, the swing mirror system in the optical system can control the deflection directions of all micromirror units to be consistent to achieve large-area deflection of the light beam, or control the deflection of a single micromirror unit to achieve reflection of the light beam.

[0045] In a fourth aspect, the present application also provides a method for preparing a micromirror array, which includes: providing a driver and a mirror assembly, wherein the driver includes a driving layer and a substrate, the driving layer includes a support platform and a plurality of driving members, the support platform has a connecting hole, the driving member is connected between the supporting platform and the substrate, the mirror assembly includes a mirror layer and a supporting member, and the supporting member is connected to one side of the mirror layer; connecting the supporting member and the connecting hole to assemble the mirror assembly and the driver; and electrically connecting the substrate to the circuit module.

[0046] In this implementation, the driver and mirror assembly can be fabricated separately on two wafer substrates before assembly, allowing the mirror assembly to be mirror-coated before assembly, which helps reduce the difficulty of the coating process. The mirror assembly and driver are assembled by plugging them together, which reduces the difficulty of connecting the mirror assembly and driver, thereby reducing the difficulty of assembling the micromirror unit. By plugging the support member into the connection hole, the mirror assembly and driver can be positioned and installed by aligning the support member with the connection hole, thereby improving the installation accuracy of the micromirror unit.

[0047] In some possible implementations, "connecting the support member and the connecting hole" includes: aligning the support member and the connecting hole; inserting one end of the support member into the connecting hole; applying an adhesive to the gap between the support member and the connecting hole; and curing the adhesive.

[0048] In this implementation, the axis of the support member and the axis of the connecting hole can be aligned to achieve alignment between the support member and the connecting hole. This facilitates vertical insertion of the support member and the connecting hole, improves installation efficiency and accuracy, and reduces the risk of collision between the support member and the support platform. Applying an adhesive to the gap between the support member and the connecting hole strengthens the connection between the support member and the connecting hole. The adhesive can be applied using a dispensing process.

[0049] In some possible implementations, before “providing a mirror assembly and a driver”, the method for preparing a micromirror array further includes: coating a reflective film layer on a surface of the mirror layer facing away from the support member.

[0050] In this implementation, since the reflective film layer is deposited between the mirror assembly and the driver assembly, mask coating is not required, reducing the coating difficulty. Furthermore, there are no special considerations for coating process compatibility or film damage. Mature optical coating technologies can be used to coat the mirror assembly separately, achieving high reflectivity across the operating spectrum. For example, the reflective film layer can include at least one of an aluminum film, an indium film, a titanium-silicon dielectric film, and a molybdenum-silicon dielectric film.

[0051] In some possible implementations, before "providing a mirror assembly and a driver", the method for preparing a micromirror array also includes: etching a plurality of through holes in a substrate; filling a conductive medium in the through holes to form a conductive member; patterning a metal layer on one side of the substrate to electrically connect the conductive member and the driver; and arranging the conductive member on the other side of the substrate according to the electrode distribution of the circuit module.

[0052] In this implementation, through-silicon via (TSV) technology can be used to etch multiple vias into the substrate, shortening circuit routing distances. Because the driver can be electrically connected through the conductive member, vertical packaging technology can be used to electrically connect the second end of the electrical connector to the corresponding electrode on the circuit module via micro-solder balls or direct bonding, achieving a compact circuit connection structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] Figure 1 is a schematic diagram of an optical system provided by the present application in some embodiments;

[0054] Figure 2A yes Figure 1 A schematic structural diagram of a micromirror array in an optical system in some embodiments is shown;

[0055] Figure 2B yes Figure 2A The micromirror array shown is a schematic diagram of a portion of the structure in some embodiments when cut along line AA;

[0056] Figure 3A yes Figure 2A A schematic diagram of the structure of a micromirror unit in a micromirror array in some embodiments is shown;

[0057] Figure 3B yes Figure 3A A schematic structural diagram of the micromirror unit shown in another perspective;

[0058] Figure 3C yes Figure 3A The micromirror unit shown is a partial structural exploded schematic diagram in some embodiments;

[0059] Figure 4 yes Figure 3A The micromirror unit shown is a schematic diagram of a portion of the structure in some embodiments when cut along line BB;

[0060] Figure 5 yes Figure 3A The micromirror unit shown is a schematic diagram of a portion of the structure in some other embodiments cut along line BB;

[0061] Figure 6A yes Figure 3A A schematic structural diagram of a driving layer in a micromirror unit in some embodiments is shown;

[0062] Figure 6B yes Figure 6A A schematic diagram of the structure of a driving component in the driving layer shown in some embodiments;

[0063] Figure 7 yes Figure 6B The schematic diagram of the partial structure of the driving member shown is cut away along line CC;

[0064] Figure 8A yes Figure 2A Schematic diagram of the structure of the micromirror unit in the micromirror array in other embodiments;

[0065] Figure 8B yes Figure 8A A schematic structural diagram of the micromirror unit shown in another perspective;

[0066] Figure 9A yes Figure 2A Schematic diagram of the structure of the micromirror unit in the micromirror array in some further embodiments;

[0067] Figure 9B yes Figure 9A The micromirror unit shown is a partial structural exploded schematic diagram in some embodiments;

[0068] Figure 10A yes Figure 9A A schematic diagram of the structure of a driver in a micromirror unit in some embodiments is shown;

[0069] Figure 10B yes Figure 10A A schematic diagram of the structure of a driving member in the driver shown in some embodiments;

[0070] Figure 11 yes Figure 2B The preparation method of the micromirror array in some embodiments;

[0071] Figure 12 yes Figure 11 FIG. 1 is a schematic diagram of a specific process of step S20 in the method for preparing a micromirror array in some embodiments;

[0072] Figure 13 yes Figure 11A schematic diagram of steps before step S10 in some embodiments of the method for preparing a micromirror array is shown;

[0073] Figure 14 yes Figure 11 Schematic diagram of steps before step S10 in other embodiments of the method for preparing a micromirror array. DETAILED DESCRIPTION

[0074] The embodiments of the present application are described below in conjunction with the drawings in the embodiments of the present application.

[0075] In the description of the embodiments of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed" and "connected" should be understood in a broad sense. For example, "connected" can mean detachably connected or non-detachably connected; it can mean directly connected or indirectly connected through an intermediary. "Multiple" means at least two.

[0076] The directional terms mentioned in the embodiments of the present application, such as "upper", "lower", "inside", "outside", "top", "bottom", "side", etc., are only references to the directions in the drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of the present application, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0077] In the embodiments of the present application, the limitations of the relative position relationship mentioned, such as parallel, perpendicular, aligned, etc., are all for the current state of the art, rather than absolutely strict limitations, and a small amount of deviation is allowed, and it is possible to be approximately parallel, approximately perpendicular, approximately aligned, etc. For example, A and B are parallel, which means that A and B are parallel or approximately parallel, and the angle between A and B can be between 0 degrees and 10 degrees. For example, A and B are perpendicular, which means that A and B are perpendicular or approximately perpendicular, and the angle between A and B can be between 80 degrees and 100 degrees.

[0078] In the embodiments of this application, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature specified as "first," "second," "third," or "fourth" may explicitly or implicitly include one or more of the features.

[0079] See also Figure 1 , Figure 1 is a schematic diagram of the optical system 5000 provided in this application in some embodiments.

[0080] In some embodiments, the optical system 5000 may include a light source 2000 , a swing mirror system 3000 , and a receiving optical system 4000 . The light source 2000 is used to emit a light beam, and the swing mirror system 3000 is used to receive the light beam and change its propagation direction to reflect the light beam to the receiving optical system 4000 .

[0081] Among them, the optical system 5000 can be applied to scanning imaging, vehicle-mounted radar, optical projection, optical communication and other fields.

[0082] For example, the optical system 5000 is used in the field of scanning imaging, where the oscillating mirror system 3000 rapidly deflects the light beam emitted by the light source 2000 so that the light spot forms a scan on the target object. For example, the optical system 5000 can be used in optical coherence tomography (OCT).

[0083] In some examples, the optical system 5000 may include a micromirror array 1000 and a controller (not shown). The micromirror array 1000 may include a plurality of micromirror units 100 arranged in an array. The controller is configured to control the deflection of each micromirror unit 100.

[0084] The controller may control at least two micromirror units 100 to have different deflection directions, so that the optical system 5000 can reflect the light beam to the receiving optical system 4000 located at different positions.

[0085] The controller may also control the deflection directions of all the micromirror units 100 to be consistent, so as to achieve large-area deflection of the light beam.

[0086] In some other examples, the optical system 5000 may further include a controller and a micromirror unit 100. The controller is configured to control the deflection of the micromirror unit 100.

[0087] See also Figure 2A and Figure 2B , Figure 2A yes Figure 1 A schematic structural diagram of the micromirror array 1000 in the optical system 5000 in some embodiments is shown; Figure 2B yes Figure 2A The micromirror array 1000 shown is a schematic diagram of a partial structure in some embodiments when cut along line AA.

[0088] In some embodiments, the micromirror array 1000 may further include a circuit module 200, and the plurality of micromirror units 100 are electrically connected to the circuit module 200. The circuit module 200 is configured to electrically connect the plurality of micromirror units 100 to a controller, so that the controller can transmit control signals to the plurality of micromirror units 100 via the circuit module 200.

[0089] Each micromirror unit 100 can be independently electrically connected to the circuit module 200 so that each micromirror unit 100 can be independently controlled, thereby enabling the micromirror array 1000 to reflect light beams at multiple angles at the same time.

[0090] It should be noted that for the sake of illustration, Figure 2B In the embodiment, some structural dimensions of the micromirror array 1000 are magnified. It is understandable that Figure 2B The embodiment does not limit the size ratio between the various structures in the micromirror array 1000 .

[0091] Please refer to Figures 3A to 3C , Figure 3A yes Figure 2A A schematic structural diagram of a micromirror unit 100 in a micromirror array 1000 in some embodiments is shown; Figure 3B yes Figure 3A The structure diagram of the micromirror unit 100 shown in another viewing angle; Figure 3C yes Figure 3A FIG. 1 is a schematic diagram of a partial exploded structure of the micromirror unit 100 in some embodiments.

[0092] In some embodiments, the micromirror unit 100 may include a driver 10 and a mirror assembly 20. The driver 10 is used to drive the mirror assembly 20 to move, so that the mirror assembly 20 can be deflected to change the angle of the reflected light beam.

[0093] For example, the mirror assembly 20 can be inserted into the driver 10. In this embodiment, the mirror assembly 20 and the driver 10 can be prepared separately on two wafer substrates and then assembled, so that the mirror assembly 20 can be mirror-coated before assembly, which helps to reduce the difficulty of the coating process and makes the coating type unrestricted. In addition, the mirror assembly 20 and the driver 10 are assembled by plugging, which can reduce the difficulty of connecting the mirror assembly 20 and the driver 10, thereby reducing the difficulty of assembling the micromirror unit 100. There is no need to specifically consider the compatibility of the coating process or the damage of the film layer. Mature optical coating technology can be introduced to coat the mirror assembly 20 separately to achieve high reflection of the working spectrum.

[0094] The mirror assembly 20 may include a mirror layer 201 and a support member 202. The mirror layer 201 is stacked and arranged at intervals on one side of the driver 10. The surface of the mirror layer 201 facing away from the driver 10 is used to reflect the light beam. The support member 202 may include a first end and a second end 2022 disposed opposite each other. The first end of the support member 202 may be connected to the surface of the mirror layer 201 facing the driver 10, and the second end 2022 of the support member 202 may be inserted into the driver 10.

[0095] In this embodiment, the mirror layer 201 and the driver 10 are stacked so that the mirror layer 201 and the driver 10 are different layers. This allows the mirror layer 201 to cover at least a portion of the driver 10, thereby increasing the duty cycle of the mirror layer 201. This in turn increases the effective area ratio of the micromirror unit 100 for reflecting a light beam, thereby improving the size utilization of the micromirror unit 100.

[0096] It should be noted that the duty cycle of the mirror layer 201 is the ratio of the projected area of ​​the mirror layer 201 on the plane where the driver 10 is located to the area of ​​the driver 10 .

[0097] The thickness of the mirror layer 201 may be less than or equal to 500 μm to avoid excessive thickness of the mirror layer 201, which may result in excessive weight and hinder the design of a large-sized mirror layer 201. For example, the thickness of the mirror layer 201 may be, but is not limited to, 100, 200 μm, 300 μm, 400 μm, 500 μm, or other values ​​less than 500 μm.

[0098] The length of the support member 202 can be less than or equal to 1 mm, which is beneficial to the stability of the connection between the support member 202 and the support platform 11 and the mirror layer 201, and avoids the risk of bending deformation caused by the support member 202 being too long. For example, the length of the support member 202 can be, but is not limited to, 100 μm, 300 μm, 500 μm, 700 μm, 900 μm, 1 mm, or other values ​​less than 1 mm.

[0099] In some examples, the mirror layer 201 and the support member 202 are an integral structure to improve the structural strength of the mirror layer 201 and the support member 202. For example, the mirror layer 201 and the support member 202 can be formed by etching.

[0100] In other examples, the mirror layer 201 and the support member 202 may be separate structures to reduce the difficulty of manufacturing the mirror assembly 20. For example, the support member 202 may be formed by growing on the surface of the mirror layer 201.

[0101] Illustratively, the driver 10 may include a driver layer 1 and a substrate 2. The driver layer 1 may include a support platform 11 and a plurality of driver members 12. The support platform 11 has a connection hole 111. The driver members 12 are connected between the support platform 11 and the substrate 2 and are used to drive the support platform 11 to move. The second end 2022 of the support member 202 may be inserted into the connection hole 111. The driver members 12 may use the support platform 11 as a fulcrum to drive the support platform 11 to move, thereby driving the mirror layer 201 to move through the support member 202 to change the deflection angle of the mirror layer 201.

[0102] In this embodiment, by plugging the support member 202 into the connection hole 111 , the mirror assembly 20 and the driver 10 can be positioned and installed by aligning the support member 202 with the connection hole 111 , thereby improving the installation accuracy of the micromirror unit 100 .

[0103] The cross-sectional shape of the support member 202 perpendicular to the stacking direction of the mirror layer 201 and the driver 10 can be the same as the opening shape of the connection hole 111, so that the support member 202 can be connected to the connection hole 111. For example, the cross-sectional shape of the support member 202 can be a waist circle, an ellipse, a circle, a triangle, a polygon, etc.

[0104] The number of support members 202 and the number of connection holes 111 can be the same, with one support member 202 correspondingly connected to one connection hole 111. The number of support members 202 can be one or more. When there are multiple support members 202, the connection stability between the support member 202 and the support platform 11 can be improved. For example, when there are three or more support members 202, at least three support members 202 can be arranged nonlinearly to improve the connection stability between the support member 202 and the support platform 11.

[0105] In a plane perpendicular to the stacking direction of the mirror layer 201 and the driver 10, the support platform 11 may have a first axis 112 and a second axis 113 passing through the center of the support platform 11 and perpendicular to each other. For ease of description, in the embodiment of the present application, a rectangular coordinate system is established with the extension direction of the first axis 112 as the X-axis, the extension direction of the second axis 113 as the Y-direction, and the stacking direction of the mirror layer 201 and the driver 10 as the Z-direction to illustrate the orientation. It is understood that in other embodiments, other directions may be used as reference coordinate systems, which is not limited here.

[0106] In this embodiment, the driver 10 can drive the mirror layer 201 to rotate along the X-axis and the Y-axis to change the direction of the light beam reflected by the mirror layer 201. In addition, the driver 10 can also drive the mirror layer 201 to move along the Z-axis to reflect light beams at different convergence points.

[0107] Illustratively, along the stacking direction of the mirror layer 201 and the driver 10 , the mirror layer 201 may cover the driver layer 1 and at least a portion of the substrate 2 .

[0108] In this embodiment, the mirror layer 201 and the driver 10 are stacked so that the mirror layer 201 can cover the driver layer 1 and at least a portion of the substrate 2, thereby increasing the duty cycle of the mirror layer 201 and thereby improving the space utilization in the micromirror unit 100, which is beneficial for achieving the movement of a large-sized mirror layer 201 under limited driving displacement.

[0109] In the stacking direction of the mirror layer 201 and the driver 10, the ratio of the area of ​​the mirror layer 201's orthographic projection on the plane where the driver 10 is located to the area of ​​the driver 10 is greater than or equal to 50%. In other words, the duty cycle of the mirror layer 201 is greater than or equal to 50%. For example, the duty cycle of the mirror layer 201 can be, but is not limited to, 50%, 60%, 70%, 80%, 90%, or other values ​​greater than 50%. It should be noted that for the sake of illustration, Figures 3A to 3C Only a portion of the substrate 2 is shown.

[0110] Please refer to Figure 3A and Figure 4 , Figure 4 yes Figure 3A The micromirror unit 100 is shown as a schematic diagram of a portion of the structure in some embodiments, cut along line BB. Figure 4 The dotted line in the figure represents the division between the mirror layer 201 and the support member 202. It can be understood that in some other embodiments, the mirror layer 201 and the support member 202 can also be divided at other locations.

[0111] In some embodiments, a gap 114 may exist between the second end 2022 of the support member 202 and the wall of the connection hole 111. The micromirror unit 100 may further include an adhesive 30, at least part of which is disposed in the gap 114 for bonding the second end 2022 of the support member 202 to the support platform 11.

[0112] In this embodiment, a gap 114 exists between the second end 2022 of the support member 202 and the wall of the connection hole 111 to prevent the support member 202 from squeezing the support platform 11 after being inserted into the connection hole 111, thereby reducing the risk of damage to the support platform 11. After the second end 2022 of the support member 202 is inserted into the connection hole 111, a dispensing process can be used to bond the second end 2022 of the support member 202 to the support platform 11 with an adhesive to improve the stability of the connection between the support member 202 and the support platform 11, thereby improving the stability of the movement of the mirror layer 201 by the actuator 10.

[0113] Exemplarily, the width of gap 114 is in the range of 1 μm to 2 μm. For example, the width of gap 114 can be, but is not limited to, 1 μm, 1.2 μm, 1.4 μm, 1.6 μm, 1.8 μm, 2 μm, or other values ​​between 1 μm and 2 μm.

[0114] In this embodiment, the size design of the gap 114 facilitates the alignment of the support member 202 with the connection hole 111, thereby improving the installation accuracy of the mirror layer 201 on the driver 10, providing sufficient space for the adhesive 30 to flow in, and preventing the support member 202 from squeezing the support platform 11 and damaging the support platform 11 when inserted into the connection hole 111. If the width of the gap 114 is less than 1 μm, it will be difficult for the adhesive 30 to flow into the gap 114 before curing, which may result in insufficient bonding after curing, affecting the bonding stability between the support member 202 and the support platform 11. It will also increase the alignment accuracy requirements of the support member 202 and the connection hole 111, increasing the risk of the support member 202 squeezing the support platform 11. If the width of the gap 114 is greater than 2 μm, there is a higher risk of misalignment between the support member 202 and the connection hole 111, which may result in excessive positioning offset of the support member 202, thereby affecting the rotation accuracy of the mirror layer 201 driven by the driver 10.

[0115] It should be noted that the gap 114 between the support member 202 and the connection hole 111 is a unilateral gap 114 , that is, after the support member 202 and the connection hole 111 are aligned in center, there is a gap 114 between the support member 202 and the connection hole 111 in all directions.

[0116] The adhesive 30 may also be partially located outside the gap 114 , and the adhesive 30 located outside the gap 114 bonds the outer surface of the support member 202 and the surface of the support platform 11 facing the mirror layer 201 to strengthen the connection between the support member 202 and the support platform 11 .

[0117] In some embodiments, the mirror assembly 20 may further include a reflective film layer 203 . The reflective film layer 203 is disposed on a surface of the mirror layer 201 facing away from the driver 10 .

[0118] In this embodiment, by providing the reflective film layer 203 on the mirror layer 201 , the light beam reflection effect of the mirror layer 201 can be improved, thereby achieving high reflection of the working spectrum.

[0119] Exemplarily, the reflective film layer 203 may include at least one of an aluminum film, an indium film, a titanium silicon dielectric film, and a molybdenum silicon dielectric film.

[0120] In this embodiment, since the driver 10 and the mirror assembly 20 can be separately manufactured and then assembled, and assembled through plug-in and dispensing processes, the compatibility of the micromirror unit 100 with the type of reflective film layer 203 is improved, so that the reflective film layer 203 can be selected from at least one of aluminum film, indium film, titanium silicon dielectric film, and molybdenum silicon dielectric film, thereby improving the reflective effect of the mirror layer 201.

[0121] Please refer to Figure 2B and Figure 5 , Figure 5 yes Figure 3A The micromirror unit 100 is shown as a partial structural schematic diagram in other embodiments when cut along line BB.

[0122] In some embodiments, the substrate 2 may have a plurality of through-holes 21. The driver 10 may further include a conductive member 3, with portions of the conductive member 3 filling the through-holes 21. The conductive member 3 may have a first end 31 and a second end 32 disposed opposite each other. The first end 31 of the conductive member 3 is exposed on the side of the substrate 2 facing the mirror layer 201 and is electrically connected to the driver 12. The second end 32 of the conductive member 3 is exposed on the side of the substrate 2 facing away from the mirror layer 201 and is used to connect to an external circuit to receive control signals.

[0123] The through hole 21 on the substrate 2 is a through silicon via, and the conductive medium is filled into the through hole 21 by the through silicon via technology to form the conductive member 3. The circuit connected to the second end 32 of the conductive member 3 can be Figure 2B The circuit module 200 shown can receive a control signal transmitted by the circuit module 200 through the conductive element 3 and transmit the control signal to the driving element 12 , thereby enabling the driving element 12 to drive the movement of the mirror layer 201 .

[0124] In this embodiment, by providing a through hole 21 on the substrate 2 to accommodate the conductive member 3, and the conductive member 3 is capable of conducting the circuit between the driver 12 and the circuit module 200, the length of the wiring harness between the driver 12 and the circuit board is shortened, thereby compressing the wiring space and achieving a compact electrical connection. This is in turn conducive to the packaging of a large-scale micromirror array 1000 with a high duty cycle, reducing the package size and packaging cost. For example, by providing the through hole 21 and the conductive member 3 on the substrate 2, the duty cycle of the mirror layer 201 in the micromirror array 1000 can be greater than or equal to 50%. The duty cycle of the mirror layer 201 in the micromirror array 1000 refers to the ratio of the area of ​​all the mirror layers 201 to the area of ​​the micromirror array 1000.

[0125] Please refer to Figure 4 、 Figure 6A and Figure 6B , Figure 6A yes Figure 3A The schematic diagram of the structure of the driving layer 1 in the micromirror unit 100 in some embodiments is shown; Figure 6B yes Figure 6A Schematic diagram of the structure of a driving member 12 in the driving layer 1 in some embodiments.

[0126] In some embodiments, the first end 2021 of the support member 202 can be connected to the center of the mirror layer 201, and the connection hole 111 can be located at the center of the support platform 11. In this embodiment, the central arrangement of the support member 202 and the connection hole 111 can provide a balanced and stable latch connection between the mirror assembly 20 and the support platform 11.

[0127] For example, the driving members 12 located on both sides of the first axis 112 may be symmetrical with respect to the first axis 112 , and the driving members 12 located on both sides of the second axis 113 may be symmetrical with respect to the second axis 113 .

[0128] In this embodiment, the symmetrical arrangement of the driving members 12 facilitates driving the mirror layer 201 to move, thereby providing stability in the movement of the mirror layer 201. For example, among the driving members 12 symmetrically arranged relative to the first axis 112, the driving member 12 located on one side of the first axis 112 drives the mirror layer 201 to rotate about the first axis 112 in the Z direction, and the driving member 12 located on the other side of the first axis 112 drives the mirror layer 201 to rotate about the first axis 112 in the -Z direction. By arranging the driving forces of the driving members 12 on both sides of the first axis 112 to be the same, balanced rotation of the mirror surface about the first axis 112 can be achieved.

[0129] In this case, along the direction of the second axis 113 , all the driving members 12 may be located on both sides of the support platform 11 .

[0130] In this embodiment, by arranging all the driving components 12 to be located on both sides of the support platform 11 , the driving layer 1 can be adapted to the long strip mirror layer 201 , thereby realizing reflection to form a long strip light spot.

[0131] The driving layer 1 may further include a connecting block 13, which connects two opposite sides of the support platform 11 along the direction of the first axis 112, and the driving member 12 is connected to the connecting block 13. The length of the connecting block 13 along the direction of the first axis 112 (see Figure 6A L1 in the figure can be less than the length of the support platform 11 (see Figure 6A L2 in ).

[0132] In this embodiment, by providing the connecting block 13 , the dimension of the support platform 11 along the second axis 113 can be lengthened, thereby avoiding structural interference between two adjacent driving members 12 in the direction of the second axis 113 , which is beneficial to the spatial layout of the driving members 12 .

[0133] Illustratively, the driving member 12 may include a driving portion 121 and an elastic portion 122. One end of the driving portion 121 is connected to the support platform 11 via the elastic portion 122, and the other end of the driving portion 121 is connected to the base 2. The elastic portion 122 is configured to elastically deform under the drive of the driving portion 121 and drive the support platform 11 to move.

[0134] In this embodiment, the driving part 121 is connected to the support platform 11 through the elastic part 122, and can use the elastic deformation of the elastic part 122 to provide movement space for the support platform 11, thereby facilitating the movement of the mirror layer 201 and realizing a larger size of the mirror layer 201 design.

[0135] The driving portion 121 can be connected to the elastic portion 122 via a hollow connecting structure 123 , which is beneficial for the driving portion 121 to achieve a larger yaw angle stroke, thereby driving the mirror layer 201 to achieve a larger rotation angle, which is beneficial for a large-size design of the mirror layer 201 .

[0136] For example, the angle between the driving portion 121 and the first axis 112 (see Figure 6B The α in (a) can be in the range of 30° to 60°. For example, α can be, but is not limited to, 30°, or 40°, or 50°, or 60°, or other values ​​between 30° and 60°.

[0137] In this embodiment, by setting the included angle between the driving unit 121 and the first axis 112 , the driving unit 121 can achieve a larger yaw angle stroke, thereby driving the mirror layer 201 to achieve a larger rotation angle, which is beneficial to the large-size design of the mirror layer 201 .

[0138] Please refer to Figures 6A to 7 , Figure 7 yes Figure 6B The diagram shows a partial structural diagram of the driving member 12 after being cut away along line CC.

[0139] In some embodiments, the driving unit 121 may include a first substrate 1211, a first bottom electrode 1212, a piezoelectric layer 1213 and a first top electrode 1214 stacked in sequence. The driving unit 121 drives the piezoelectric layer 1213 to deform through the voltage difference between the first bottom electrode 1212 and the first top electrode 1214 to drive the support platform 11 to move.

[0140] In this embodiment, the piezoelectric layer 1213 can be controlled to deform by controlling the voltage difference between the first bottom electrode 1212 and the first top electrode 1214, thereby causing the entire driver 121 to deform. This in turn causes the driver 121 to move the support platform 11 with the substrate 2 as the support point, thereby driving the mirror layer 201 to move. The piezoelectric layer 1213 can deform by, but is not limited to, warping or expanding, thereby causing the mirror layer 201 to rotate about the first axis 112 or the second axis 113, and to translate along the stacking direction of the mirror layer 201 and the driver 10.

[0141] The material of the piezoelectric layer 1213 can be AlN, Sc x Al 1-x N, PZT, ZnO, PMN and other piezoelectric materials. Among them, in Sc x Al 1-x In N materials, x is any value between 0 and 1.

[0142] The thickness of the piezoelectric layer 1213 may be less than or equal to 100 μm, for example, 10 μm, or 30 μm, or 50 μm, or 70 μm, or 90 μm, or 100 μm, or other values ​​less than 100 μm.

[0143] The thickness of the first substrate 1211 may be less than or equal to 200 μm, for example, 10 μm, 50 μm, 90 μm, 130 μm, 170 μm, 200 μm, or other values ​​less than 200 μm.

[0144] The materials of the first bottom electrode 1212 and the first top electrode 1214 can be Pt, Mo, or the like.

[0145] Exemplarily, the number of driving parts 121 can be multiple, and two adjacent driving parts 121 are arranged in parallel, and in the two adjacent driving parts 121, one end of one driving part 121 is connected to one end of the other driving part 121, and the other end of one driving part 121 extends toward the other end of the other driving part 121.

[0146] In this embodiment, by arranging multiple driving units 121 side by side, not only can the installation dimensions of the driving member 12 in a single direction be shortened, but the deformations of the piezoelectric layers 1213 in the multiple driving units 121 can be superimposed, thereby increasing the overall deformation of the driving member 12 and, in turn, increasing the angular range or displacement range over which the driving member 12 can drive the mirror layer 201 to rotate about a first axis. For example, if the piezoelectric layer 1213 in each driving unit 121 generates deformation capable of driving the mirror layer 201 to rotate about a first axis by a first angle, then the angle over which the driving member 12 can drive the mirror layer 201 to rotate about the first axis is the product of the first angle and the number of driving units 121 in a single driving member 12.

[0147] In one driving member 12 , the plurality of driving portions 121 may be arranged in a manner of alternating between longer driving portions 121 and shorter driving portions 121 .

[0148] In this embodiment, because the driving portion 121 is arranged at an angle to the first axis 112, multiple driving portions 121 are arranged alternately in length within a single driving member 12. This facilitates the layout of the driving member 12 along the second axis 113 and improves space utilization. For example, a single driving member 12 may include four long driving portions 121 and three short driving portions 121.

[0149] Exemplarily, the driving member 12 may further include a connecting beam 124, which is connected between two adjacent driving portions 121. The connecting beam 124 includes a second bottom electrode 1241 and a second top electrode 1242, wherein the second bottom electrode 1241 is electrically connected between the two first bottom electrodes 1212 of the two adjacent driving portions 121, and the second top electrode 1242 is electrically connected between the two first top electrodes 1214 of the two adjacent driving portions 121.

[0150] In this embodiment, the connecting beam 124 can not only serve as an electrical connection between two adjacent driving parts 121, but also serve as a structural connection between the two adjacent driving parts 121. Through the tilt prevention and staggered cascade of the piezoelectric parts in the piezoelectric part, the driving part 12 can drive the mirror layer 201 to move with multiple degrees of freedom while ensuring a larger static rotation angle, that is, the amplitude of movement of the mirror layer 201 can be increased.

[0151] In this embodiment, in each driver 12 , two adjacent driver portions 121 are connected by a connecting beam 124 so that multiple driver portions 121 can be connected in series, thereby achieving unified signal control and simplifying control of each driver 12 .

[0152] The connecting beam 124 may further include a second substrate 1243 , and the second substrate 1243 is used to support the second bottom electrode 1241 and the second top electrode 1242 .

[0153] The connecting beam 124 may further include an insulating layer 1244 . The insulating layer 1244 is disposed between the second bottom electrode 1241 and the second top electrode 1242 to insulate the second bottom electrode 1241 from the second top electrode 1242 .

[0154] In some other embodiments, each driving portion 121 is individually wired to be electrically connected to the circuit module, so as to achieve independent control of the driving portion 121 in each driving element 12 , thereby improving the flexibility of controlling each driving element 12 .

[0155] The driving member 12 may drive the mirror layer 201 to rotate around the direction parallel to the first axis 112 at an angle in the range of 0° to 15°. For example, the driving member 12 may drive the mirror layer 201 to rotate around the direction parallel to the first axis 112 at an angle of 0°, 2°, 4°, 6°, 8°, 10°, 12°, 14°, 15°, or other values ​​between 0° and 15°.

[0156] The driving member 12 may drive the mirror layer 201 to rotate in a direction parallel to the second axis 113 at an angle in the range of 0° to 15°. For example, the driving member 12 may drive the mirror layer 201 to rotate in a direction parallel to the second axis 113 at an angle of 0°, 2°, 4°, 6°, 8°, 10°, 12°, 14°, 15°, or other values ​​between 0° and 15°.

[0157] The driving member 12 drives the mirror layer 201 to move in a direction in which the mirror assembly 20 and the driver 10 are stacked, and the displacement can be in a range of 0 μm to 500 μm. For example, the driving member 12 drives the mirror layer 201 to move in a direction in which the mirror assembly 20 and the driver 10 are stacked, and the displacement can be 0 μm, 100 μm, 200 μm, 300 μm, 400 μm, 500 μm, or other values ​​between 0 μm and 500 μm.

[0158] Exemplarily, the driving member 12 further includes a sensor 125 . The sensor 125 is connected to the driving portion 121 . The sensor 125 is used to detect the deformation amount in the driving portion 121 .

[0159] In this embodiment, the deformation variable in the driving part 121 is detected by the sensor 125, and the sum of the deformation variables in the driving member 12 can be fed back to the controller, so that the controller can calculate the current rotation angle or displacement of the mirror layer 201 based on the deformation variable of the driving member 12, and compare it with the preset motion parameters, so as to calculate whether the current rotation angle or position of the mirror layer 201 meets the conditions, which is conducive to timely feedback on the rotation or displacement of the mirror layer 201, thereby facilitating the correction of the rotation or displacement of the mirror layer 201 and improving the motion accuracy of the mirror layer 201.

[0160] The sensor 125 can employ a structure comprising two layers of electrodes wrapped around a layer of piezoelectric material, utilizing the direct piezoelectric effect for sensing. For example, when the driver 12 deforms, causing the mirror layer 201 to move, stress is generated in the driver 12, thereby generating an electric charge in the sensor 125. The amount of charge is proportional to the stress in the driver 12, reflecting the rotation angle or displacement of the mirror layer 201. By detecting the amount of charge generated in the sensor 125, the deformation information of the driver 12 can be obtained, and the feedback electrical signal can be output through the two layers of electrodes.

[0161] The sensor 125 may be disposed at any position in the driving member 12 . For example, the sensor 125 may be disposed between the driving portion 121 and the elastic portion 122 .

[0162] The driving member 12 may further include a shielding electrode 126 . The shielding electrode 126 is connected between the sensor 125 and the driving unit 121 and is used to shield the current signal between the sensor 125 and the driving unit 121 .

[0163] In this embodiment, the shielding electrode 126 is made of an electromagnetic shielding material, so that the shielding electrode 126 can shield the current signal between the sensor 125 and the driving part 121, thereby preventing the current in the sensor 125 from affecting the voltage difference between the first top electrode 1214 and the first bottom electrode 1212 in the driving part 121, thereby preventing the deformation of the driving part 121 from being affected. In addition, the current in the driving part 121 can be prevented from crosstalking the sensor 125, thereby preventing the sensor 125 from detecting the deformation of the driving element 12, thereby preventing the sensor 125 from feeding back erroneous information about the movement of the mirror layer 201.

[0164] The driver 12 may also include a non-functional portion 127, which is connected to the driver 121 and serves as a connecting support. For example, the non-functional portion 127 may be provided at both ends of the driver 121 to assist in connecting the driver 121 to the connecting beam 124, thereby strengthening the connection. It should be noted that the non-functional portion 127 is non-deformable, meaning that the non-functional portion 127 does not include the piezoelectric layer 1213.

[0165] It should be noted that the structure of the driver 10 provided in the embodiment of the present application is formed by growth, etching, etc. For example, the support platform 11 is formed by etching a connection hole 111 on a silicon wafer, and the elastic portion 122 can be formed into a continuously bent spring shape by etching the silicon wafer, wherein the support platform 11 and the elastic portion 122 can share the same silicon wafer.

[0166] Please refer to Figure 3A 、 Figure 6A and Figure 6BIn some embodiments, the number of driving members 12 can be four. Along the direction of the second axis 113, all driving members 12 can be located on both sides of the support platform 11, wherein two driving members 12 are symmetrical with respect to the first axis 112, and the other two driving members 12 are symmetrical with respect to the second axis 113, and each driving member 12 is connected to the support platform 11 via a connecting block 13. Each driving member 12 can include four longer driving portions 121 and three shorter driving portions 121, and the longer driving portions 121 and the shorter driving portions 121 are alternately connected one by one. The voltage difference between the first top electrode 1214 and the first bottom electrode 1212 is 120V.

[0167] The reflective surface of the mirror layer 201 measures 26 mm x 2 mm, and its thickness is 10 μm. The support member 202 is 400 μm long and has a rounded cross-section with an 80 μm radius. The drive layer 1 occupies a rectangular area measuring 7.77 mm x 1.96 mm, the support platform 11 occupies a 1 mm square, and the connecting block 13 occupies a 0.65 mm x 0.31 mm rectangle.

[0168] It should be noted that the area occupied by the above structure refers to the area occupied by the positive projection on the driver 10 along the stacking direction of the driver 10 and the mirror layer 201. The size of the occupied area is the size along the first axis 112 × the size along the second axis 113.

[0169] In this embodiment, the finite element simulation software simulation calculation shows that when the material of the piezoelectric layer 1213 in each driving part 121 is AlN, the mirror layer 201 can achieve a static rotation angle of 7.43° around the first axis 112, a static rotation angle of 5.34° around the second axis 113, and a translation displacement of 121.95 μm along the stacking direction of the driver 10 and the mirror layer 201. 0.15 Al 0.85 N, the mirror layer 201 can achieve a static rotation angle of 10.63° around the first axis 112, a static rotation angle of 6.77° around the second axis 113, and a translational displacement of 161.78 μm along the stacking direction of the driver 10 and the mirror layer 201. In addition, in this embodiment, when the micromirror units 100 form the micromirror array 1000, the duty cycle of the mirror layer 201 can be greater than or equal to 50%.

[0170] It should be noted that the static rotation angle that the mirror layer 201 can achieve is a bidirectional rotation angle, and the translational displacement of the mirror layer 201 is also a bidirectional displacement, that is, the mirror layer 201 can rotate about the first axis 112 in the Z direction and can also rotate about the first axis 112 in the -Z direction. The mirror layer 201 can also translate in the Z direction and can also translate in the -Z direction.

[0171] Please refer to Figure 3A 、 Figure 8A and Figure 8B , Figure 8A yes Figure 2A Schematic diagram of the structure of the micromirror unit 100 in the micromirror array 1000 in other embodiments; Figure 8B yes Figure 8A The schematic diagram of the structure of the micromirror unit 100 is shown in another perspective. Figure 8A and Figure 8B The micromirror unit 100 shown in the embodiment may include Figure 3A and Figure 3B Most of the technical features of the micromirror unit 100 shown in the embodiment are mainly described below to explain the differences between the two, and the same parts of the two are not repeated here.

[0172] In some embodiments (see Figure 3A ), the shape of the reflective surface of the mirror layer 201 can be a long rectangular strip to reflect and form strip-shaped light.

[0173] In this embodiment, strip lights can be used in applications requiring side lighting. They avoid strong reflections from frontal illumination while providing high-brightness illumination of edges. In applications such as dimensional measurement, appearance inspection, and image scanning, strip lights provide uniform, high-brightness illumination, clearly revealing surface details and contours, thereby improving measurement accuracy.

[0174] In some other embodiments (see Figure 8A and Figure 8B ), the shape of the reflective surface of the mirror layer 201 can be arc-shaped to reflect and form arc-shaped light.

[0175] In this embodiment, the arc light can be applied to inspection scenarios that require uniform and efficient lighting, such as printed circuit board inspection, chip component inspection, etc.

[0176] In particular, due to the shape of the mirror layer 201, the center of gravity of the mirror layer 201 is not at the center of the mirror layer 201. The initial position of the mirror layer 201 can be corrected by adjusting the deformation of the driving member 12 to drive the mirror layer 201 to a certain degree of deflection. It is understandable that when the mirror layer 201 has a special-shaped structure, the initial position of the mirror layer 201 can also be corrected by the driving member 12.

[0177] Please refer to 9A to 10A , Figure 9A yes Figure 2A Schematic diagrams of the structures of the micromirror unit 100 in the micromirror array 1000 in some further embodiments; Figure 9B yes Figure 9A The micromirror unit 100 is a partially exploded schematic diagram of some embodiments; Figure 10A yes Figure 9A The schematic diagram of the structure of the driver 10 in the micromirror unit 100 in some embodiments is shown. Figure 9A and Figure 9B The micromirror unit 100 shown in the embodiment may include Figure 3A and Figure 3B Most of the technical features of the micromirror unit 100 shown in the embodiment are mainly described below to explain the differences between the two, and the same parts of the two are not repeated here.

[0178] In some embodiments, all the driving members 12 may be arranged around the support platform 11 , and the extending direction of the driving members 12 may be parallel to the side of the corresponding support platform 11 , and all the driving members 12 may be arranged in a clockwise or counterclockwise direction.

[0179] In this embodiment, all the driving members 12 are arranged around the support platform 11, which is beneficial to balancing the space occupied by the micromirror unit 100 in the directions of the first axis 112 and the second axis 113, making the overall structure of the micromirror unit 100 more compact.

[0180] In some examples, the area occupied by the support platform 11 can be square, the number of driving members 12 can be 4, one end of each driving member 12 is connected to one side of the support platform 11 through the elastic portion 122, and the other end is connected to the base 2, and the extension direction of each driving member 12 is set parallel to the side of the corresponding support platform 11.

[0181] In this embodiment, the mirror layer 201 can be set to a square shape to reflect and form a square light spot, which is suitable for application scenarios with regular light spot patterns, making the micromirror unit 100 universal.

[0182] In other examples, the area occupied by the support platform 11 can be circular, the number of driving members 12 can be 4, the connection points between two adjacent driving members 12 and the support platform 11 are one-quarter arc apart, and each driving member 12 is arc-shaped, so as to better cooperate with the support platform 11 and achieve a compact structure.

[0183] Please refer to Figure 10A and Figure 10B , Figure 10B yes Figure 10AThe schematic diagram of the structure of a driving member 12 in the driver 10 in some embodiments is shown. It should be noted that, Figure 10A and Figure 10B The driving member 12 in the embodiment shown may include Figure 6A and Figure 6B Most of the technical features of the driving member 12 shown in the embodiment are mainly described below to explain the differences between the two, and the same parts of the two are not repeated here.

[0184] In some embodiments, the driving member 12 may include a plurality of driving portions 121 . In each driving member 12 , the plurality of driving portions 121 are stacked and spaced apart, and ends of two adjacent driving portions 121 are connected by a connecting beam 124 .

[0185] The two adjacent driving parts 121 are arranged in parallel, and the extension direction of each driving part 121 is parallel to the side of the corresponding support platform 11 , which is conducive to a compact structure of the driving member 12 .

[0186] Each driving member 12 may include three driving portions 121, which are arranged in a spiral arrangement parallel to each other, and two adjacent driving portions 121 are connected by a slender connecting beam 124. This effectively extends the effective length of each driving member 12 while maintaining a compact structure, thereby providing a large driving displacement in a compact space.

[0187] The sensor 125 may be disposed at any position in the driving member 12 . For example, the sensor 125 may be disposed between two adjacent driving parts 121 .

[0188] in, Figure 10A and Figure 10B The positions of the sensor 125, the shielding electrode 126 and the non-functional portion 127 in the driving member 12 shown in the embodiment can be different from those in FIG. Figure 6A and Figure 6B The positions of the sensor 125 , the shielding electrode 126 , and the non-functional portion 127 in the driving member 12 shown in the embodiment are the same or different.

[0189] Please refer to Figure 9A 、 Figure 10A and Figure 10B In some embodiments, the support platform 11 occupies a square area, and the number of driving elements 12 is four. Each driving element 12 includes three driving portions 121, and the middle driving portion 121 has the smallest length. The voltage difference between the first top electrode 1214 and the first bottom electrode 1212 in each driving portion 121 is 120V.

[0190] The mirror layer 201 occupies a square shape, with a reflective surface measuring 5 mm x 5 mm. A metal film layer is applied to the surface of the mirror layer 201 facing away from the drive layer 1. The support member 202 is 400 μm long, with a waist-shaped cross-section and an 80 μm radius. The drive layer 1 occupies a 4 mm x 4 mm area. The support platform 11 is constructed of a silicon block and occupies a 2.1 mm x 2.1 mm area.

[0191] It should be noted that the area occupied by the above structure refers to the area occupied by the orthographic projection on the driver 10 along the stacking direction of the driver 10 and the mirror layer 201.

[0192] In this embodiment, the finite element simulation software simulation calculation shows that when the material of the piezoelectric layer 1213 in each driving part 121 is AlN, the mirror layer 201 can achieve a static rotation angle of 4.69° around the first axis 112, a static rotation angle of 4.68° around the second axis 113, and a translation displacement of 123.65 μm along the stacking direction of the driver 10 and the mirror layer 201. 0.15 Al 0.85 N, the mirror layer 201 can achieve a static rotation angle of 6.28° around the first axis 112, a static rotation angle of 6.28° around the second axis 113, and a translational displacement of 171.60 μm along the stacking direction of the driver 10 and the mirror layer 201. In addition, in this embodiment, when the micromirror units 100 form the micromirror array 1000, the duty cycle of the mirror layer 201 can be greater than or equal to 50%.

[0193] It should be noted that the static rotation angle that the mirror layer 201 can achieve is a bidirectional rotation angle, and the translational displacement of the mirror layer 201 is also a bidirectional displacement, that is, the mirror layer 201 can rotate about the first axis 112 in the Z direction and can also rotate about the first axis 112 in the -Z direction. The mirror layer 201 can also translate in the Z direction and can also translate in the -Z direction.

[0194] Please refer to Figure 2B 、 Figure 3A and Figure 11 , Figure 11 yes Figure 2B The micromirror array 1000 is shown as a method for fabricating the micromirror array 1000 in some embodiments.

[0195] In some embodiments, the method for manufacturing the micromirror array 1000 includes steps S10 , S20 , and S30 .

[0196] S10 , providing a driver 10 and a mirror assembly 20 .

[0197] The driver 10 may include a driver layer 1 and a substrate 2. The driver layer 1 may include a support platform 11 and a plurality of driver elements 12. The support platform 11 has a connection hole, and the driver elements 12 are connected between the support platform 11 and the substrate 2. The mirror assembly 20 may include a mirror layer 201 and a support element 202. The support element 202 is connected to one side of the mirror layer 201.

[0198] In this embodiment, the driver 10 and the mirror assembly 20 can be separately prepared on two wafer substrates and then assembled, so that the mirror assembly 20 can be mirror-coated before assembly, which helps to reduce the difficulty of the coating process.

[0199] S20 , connecting the support member 202 and the connecting hole 111 to assemble the mirror assembly 20 and the driver 10 .

[0200] In this embodiment, the mirror assembly 20 and the driver 10 are assembled by plugging together, which can reduce the difficulty of connecting the mirror assembly 20 and the driver 10, thereby reducing the difficulty of assembling the micromirror unit 100. By plugging the support member 202 into the connection hole, the mirror assembly 20 and the driver 10 can be positioned and installed by aligning the support member 202 with the connection hole, thereby improving the installation accuracy of the micromirror unit 100.

[0201] S30 , electrically connecting the substrate 2 to the circuit module 200 .

[0202] In this embodiment, the control signal can be received through the circuit module 200 .

[0203] Please refer to Figure 4 and Figure 12 , Figure 12 yes Figure 11 FIG. 1 is a schematic diagram of a specific process of step S20 in the method for preparing the micromirror array 1000 in some embodiments.

[0204] In some embodiments, step S20 may include S21 , S22 , S23 and S24 .

[0205] S21 , aligning the support member 202 and the connecting hole 111 .

[0206] In this embodiment, the axis of the support member 202 can be aligned with the axis of the connecting hole 111 to achieve alignment of the support member 202 and the connecting hole 111, which is conducive to plugging the support member 202 and the connecting hole 111 in the vertical direction, can improve the installation efficiency and accuracy, and can reduce the risk of collision between the support member 202 and the support platform 11.

[0207] S22 , inserting one end of the support member 202 into the connecting hole 111 .

[0208] S23 , applying adhesive 30 to the gap 114 between the support member 202 and the connection hole 111 .

[0209] In this embodiment, the connection between the support member 202 and the connection hole 111 can be strengthened by applying the adhesive 30 to the gap 114 between the support member 202 and the connection hole 111. The adhesive 30 can be applied by using a dispensing process.

[0210] S24 , curing the adhesive 30 .

[0211] In this embodiment, the adhesive 30 is a curing adhesive, so that the adhesive 30 is in a liquid state before curing, which is conducive to filling the gap 114 and thus improving the bonding effect. The adhesive 30 can be cured by heating, UV light, or natural curing.

[0212] Please refer to Figure 4 and Figure 13 , Figure 13 yes Figure 11 Schematic diagram of steps before step S10 in the method for preparing the micromirror array 1000 in some embodiments.

[0213] In some embodiments, before step S10 , the method for preparing the micromirror array 1000 may further include step S40 .

[0214] S40 , coating a reflective film layer 203 on the surface of the mirror layer 201 facing away from the support member 202 .

[0215] In this embodiment, since the reflective film layer 203 is deposited between the mirror assembly 20 and the driver 10, masking is not required, which reduces the coating difficulty. Furthermore, there is no need to consider coating process compatibility or film damage. Mature optical coating techniques can be used to independently deposit the mirror assembly 20, achieving high reflectivity across the operating spectrum. For example, the reflective film layer 203 can include at least one of an aluminum film, an indium film, a titanium-silicon dielectric film, and a molybdenum-silicon dielectric film.

[0216] Please refer to Figure 2B 、 Figure 5 and Figure 14 , Figure 14 yes Figure 11 Schematic diagram of steps before step S10 in another embodiment of the method for preparing the micromirror array 1000 .

[0217] In some embodiments, before step S10 , the method for preparing the micromirror array 1000 may further include steps S50 , S60 , S70 , and S80 .

[0218] S50 , etching a plurality of through holes 21 in the substrate 2 .

[0219] In this embodiment, a plurality of through-holes 21 can be etched on the substrate 2 using through-silicon via (TSV) technology to shorten the circuit wiring distance. The number of the through-holes 21 is the same as the number of electrodes of the driving element 12 .

[0220] S60 , filling the through hole 21 with a conductive medium to form a conductive member 3 .

[0221] In this embodiment, a conductive medium is filled in the through hole 21 to form a conductive member 3, so that the conductive member 3 can conduct the circuits on both sides of the substrate 2. The conductive medium can be, but is not limited to, polysilicon, copper, tungsten, conductive glue, etc.

[0222] S70 , patterning the metal layer 4 on one side of the substrate 2 to electrically connect the conductive element 3 and the driving element 12 .

[0223] In this embodiment, the metal layer 4 is patterned on one side of the substrate 2 so that the metal layer 4 can electrically connect the first end 31 of the conductive element 3 and the driving element 12 to achieve circuit conduction.

[0224] S80 , disposing a conductive member 3 on the other side of the substrate 2 according to the electrode distribution of the circuit module 200 .

[0225] In this embodiment, since the driving member 12 can be connected through the conductive member 3, vertical packaging technology can be used in step S30 to achieve electrical connection between the second end of the electrical connector and the corresponding electrode on the circuit module 200 through micro-solder balls or direct bonding, thereby realizing a compact circuit connection structure 123.

[0226] In this embodiment, steps S50 to S80 are completed before steps S10 to S30. This eliminates the need to provide process space required for the through-silicon via 21 technology before step S30 is performed. This helps save assembly space and reduces the difficulty of assembling the micromirror array 1000.

[0227] It should be noted that steps S50 to S80 and step S40 can be performed simultaneously or sequentially.

[0228] In some other embodiments, steps S50 to S80 may also be performed after step S20.

[0229] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of this application can be combined with each other, and any combination of features in different embodiments is also within the scope of protection of this application. That is to say, the multiple embodiments described above can also be arbitrarily combined according to actual needs.

[0230] It should be noted that all the above drawings are for illustrative purposes only and do not represent the actual size of the product. Furthermore, the dimensional ratios between the components in the drawings are not intended to limit the actual product of the present application.

[0231] The above are only some of the embodiments and implementations of this application. The scope of protection of this application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A micromirror unit, characterized in that: Includes driver and mirror assembly; The driver includes a driving layer and a base, the driving layer includes a support platform and a plurality of driving members, the support platform has a connecting hole, the driving members are connected between the support platform and the base, and the driving members are used to drive the support platform to move; The mirror assembly includes a mirror layer and a support member. The mirror layers are stacked at intervals on one side of the driver. The surface of the mirror layer facing away from the driver is used to reflect the light beam. The first end of the support member is connected to the surface of the mirror layer facing the driver, and the second end of the support member is inserted into the connecting hole.

2. The micromirror unit according to claim 1, wherein There is a gap between the second end of the support member and the hole wall of the connecting hole; The micromirror unit further includes an adhesive, at least a portion of which is disposed in the gap and is used to bond the second end of the support member and the support platform.

3. The micromirror unit according to claim 2, wherein: The width of the gap is in the range of 1 μm to 2 μm.

4. The micromirror unit according to any one of claims 1 to 3, wherein The mirror assembly further includes a reflective film layer, which is arranged on a surface of the mirror layer facing away from the driver; The reflective film layer includes at least one of an aluminum film, an indium film, a titanium silicon dielectric film, and a molybdenum silicon dielectric film.

5. The micromirror unit according to any one of claims 1 to 4, characterized in that Along the stacking direction of the mirror layer and the driver, the mirror layer covers the driver layer and covers at least a portion of the substrate.

6. The micromirror unit according to claim 5, wherein: Along the stacking direction of the mirror layer and the driver, the ratio of the area of ​​the orthographic projection of the mirror layer on the plane where the driver is located to the area of ​​the driver is greater than or equal to 50%.

7. The micromirror unit according to any one of claims 1 to 6, characterized in that The substrate has a plurality of through holes; The driver also includes a conductive member, a portion of which fills the through hole, a first end of the conductive member exposed on the side of the substrate facing the mirror layer, and the first end of the conductive member is electrically connected to the driving member, and a second end of the conductive member exposed on the side of the substrate facing away from the mirror layer, and the second end of the conductive member is used for an external circuit.

8. The micromirror unit according to any one of claims 1 to 7, wherein: The driving member includes a driving portion and an elastic portion, one end of the driving portion is connected to the support platform through the elastic portion, and the other end of the driving portion is connected to the base; The elastic part is used to undergo elastic deformation under the driving of the driving part and drive the support platform to move.

9. The micromirror unit according to any one of claims 1 to 8, wherein: The driving unit includes a first substrate, a first bottom electrode, a piezoelectric layer and a first top electrode stacked in sequence. The driving unit drives the piezoelectric layer to deform through the voltage difference between the first bottom electrode and the first top electrode to drive the support platform to move.

10. The micromirror unit according to claim 9, wherein: There are multiple driving parts, and two adjacent driving parts are arranged in parallel. In the two adjacent driving parts, one end of one driving part is connected to one end of the other driving part, and the other end of one driving part extends toward the other end of the other driving part.

11. The micromirror unit according to claim 10, wherein: The driving member further includes a connecting beam, wherein the connecting beam is connected between two adjacent driving parts; The connecting beam includes a second bottom electrode and a second top electrode, the second bottom electrode is electrically connected between the two first bottom electrodes of two adjacent driving parts, and the second top electrode is electrically connected between the two first top electrodes of two adjacent driving parts.

12. The micromirror unit according to any one of claims 8 to 11, characterized in that The driving member further includes a sensor connected to the driving portion, and the sensor is used to detect the deformation amount in the driving portion.

13. The micromirror unit according to claim 12, wherein: The driving component further includes a shielding electrode, which is connected between the sensor and the driving part and is used to shield the current signal between the sensor and the driving part.

14. The micromirror unit according to any one of claims 8 to 13, characterized in that The first end of the support member is connected to the center of the mirror layer, and the connection hole is located at the center of the support platform; In a plane perpendicular to the stacking direction of the mirror layer and the driver, the support platform has a first axis and a second axis passing through the center of the support platform and perpendicular to each other, the driving members located on both sides of the first axis are symmetrical relative to the first axis, and the driving members located on both sides of the second axis are symmetrical relative to the second axis.

15. The micromirror unit according to claim 14, wherein: Along the direction of the second axis, all the driving members are located on both sides of the support platform; An included angle between the driving portion and the first axis is in a range of 30° to 60°.

16. The micromirror unit according to claim 15, wherein: The driving layer further includes a connecting block, wherein the connecting block connects two opposite sides of the supporting platform along the direction of the first axis, and the driving member is connected to the connecting block; Along the direction of the first axis, the length of the connecting block is smaller than the length of the supporting platform.

17. The micromirror unit according to claim 14, wherein: All the driving members are arranged around the support platform, the extension direction of the driving members is parallel to the side of the corresponding support platform, and all the driving members are arranged in a clockwise or counterclockwise direction.

18. The micromirror unit according to any one of claims 14 to 17, wherein: The driving member drives the mirror layer to rotate around a direction parallel to the first axis at an angle ranging from 0° to 15°; and / or, the driving member drives the mirror layer to rotate around a direction parallel to the second axis at an angle in a range of 0° to 15°; And / or, the driving member drives the mirror layer to move in a range of 0 μm to 500 μm along a stacking direction of the mirror assembly and the driver.

19. A micromirror array, characterized in that: The invention comprises a circuit module and a plurality of micromirror units according to any one of claims 1 to 18, wherein the plurality of micromirror units are arranged in an array and are electrically connected to the circuit module.

20. An optical system, characterized in that The optical system comprises a light source, a swing mirror system and a receiving optical system, wherein the light source is used to emit a light beam, the swing mirror system is used to receive the light beam and change the propagation direction of the light beam to reflect the light beam to the receiving optical system; The oscillating mirror system comprises the micromirror unit according to any one of claims 1 to 18, or the oscillating mirror system comprises the micromirror array according to claim 19.

21. A method for preparing a micromirror array, characterized in that: include: A driver and a mirror assembly are provided, wherein the driver includes a driver layer and a substrate, the driver layer includes a support platform and a plurality of driver members, the support platform has a connection hole, and the driver members are connected between the support platform and the substrate; the mirror assembly includes a mirror layer and a support member, and the support member is connected to one side of the mirror layer; connecting the support member and the connecting hole to assemble the mirror assembly and the driver; and The substrate is electrically connected to a circuit module.

22. The method for preparing a micromirror array according to claim 21, wherein: The “connecting the support member and the connecting hole” includes: aligning the support member with the connecting hole; inserting one end of the support member into the connecting hole; Applying adhesive to the gap between the support member and the connecting hole; and The adhesive is cured.

23. The method for preparing a micromirror array according to claim 21 or 22, wherein: Before the step of "providing a mirror assembly and a driver", the method for preparing the micromirror array further includes: A reflective film layer is plated on the surface of the mirror layer on a side facing away from the support member.

24. The method for preparing a micromirror array according to any one of claims 21 to 23, wherein: Before the step of "providing a mirror assembly and a driver", the method for preparing the micromirror array further includes: etching a plurality of through holes in the substrate; Filling a conductive medium in the through hole to form a conductive member; patterning a metal layer on one side of the substrate to electrically connect the conductive element and the driving element; and The conductive member is arranged on the other side of the substrate according to the electrode distribution of the circuit module.

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