Automatic chip lamination equipment and its lamination control method

Abstract

This invention provides an automatic chip bonding apparatus and its bonding control method. The automatic chip bonding apparatus includes a frame, a support platform, a bonding device, and a control system. The support platform is mounted on the frame, and the bonding device is located above the support platform. The bonding device includes a bonding mechanism and an adjustment mechanism. The bonding mechanism includes a fixed plate, a pressure plate, and a buffer unit. The buffer unit includes multiple springs arranged between the fixed plate and the pressure plate. Each spring has a first pressure sensor between it and the pressure plate, or each spring has a first pressure sensor between it and the fixed plate. During the bonding process, the control system controls the adjustment mechanism to adjust the bonding force of the pressure plate at each spring based on the detection signals from each first pressure sensor. This invention also provides a bonding control method for the above-mentioned automatic chip bonding apparatus, which can achieve dynamic compensation of the bonding force when a spring fails during the bonding test.

Description

Technical Field

[0001] This invention relates to the field of chip bonding testing technology, and more specifically to an automatic chip bonding device and a bonding control method for the automatic chip bonding device. Background Technology

[0002] Chip bonding testing is a crucial step in chip manufacturing and packaging. Its main function is to verify the connection quality between the chip and the substrate, lead frame, or other carriers, ensuring stable chip operation and meeting design performance requirements. Current chip bonding testing is typically performed by automated chip bonding equipment. This equipment includes a frame, bonding unit, platform, drive unit, and control system. The bonding unit comprises a connecting frame and a bonding mechanism. The connecting frame is slidably connected to the frame along its height. The platform is mounted on the frame and positioned below the bonding mechanism. The drive unit is mounted on the frame and connected to the connecting frame. The drive unit moves the bonding unit towards the platform, allowing the bonding mechanism to apply bonding force to the chip in conjunction with the platform, ensuring stable testing. The control system controls the drive unit to execute relevant driving actions. The pressing mechanism includes a fixed plate, a pressure plate, and a spring assembly. The fixed plate is connected to the connecting frame, and the spring assembly is located between the fixed plate and the pressure plate. This allows the spring assembly to buffer and dampen shocks during the pressing process to protect the chip. It also enables the pressure plate to apply uniform pressure to the chip during the pressing process and allows the chip pressing test to have thickness adaptability.

[0003] However, during the operation of automated chip bonding equipment, the springs are repeatedly compressed and released, which may cause them to fail at some point. Because existing automated chip bonding equipment lacks a mechanism to handle this failure, when a spring fails, the subsequent pressing of the chip by the pressure plate can easily cause overpressure at the location of the failed spring, leading to…

[0004] The presence of warping or a warping tendency results in the flatness of the pressure plate not meeting the standard, reducing the pressing accuracy. It also causes uneven pressing force of the pressure plate on the chip, which can easily lead to local over- or under-pressure of the chip, and thus damage the chip. Summary of the Invention

[0005] To address the aforementioned problems, the first objective of this invention is to provide an automatic chip pressing device capable of dynamically compensating for the pressing force when a spring fails.

[0006] The second objective of this invention is to provide a pressing control method for an automatic chip pressing device.

[0007] To achieve the first objective of this invention, this invention provides an automatic chip bonding device, including a frame, a support platform, a bonding device, and a control system. The support platform is mounted on the frame, and the bonding device is located above the support platform. The bonding device includes a bonding mechanism and an adjustment mechanism. The bonding mechanism includes a fixed plate, a pressure plate, and a buffer unit. The buffer unit includes multiple springs arranged between the fixed plate and the pressure plate. Each spring is provided with a first pressure sensor between itself and the pressure plate, or each spring is provided with a first pressure sensor between itself and the fixed plate. During the bonding process, the control system controls the adjustment mechanism to adjust the bonding force of the pressure plate at each spring based on the detection signals of each first pressure sensor.

[0008] As can be seen from the above, a first pressure sensor is configured for each spring to detect its elastic force. In conjunction with the adjustment mechanism, when a spring fails during the pressing process of the chip pressing device, the control system can promptly control the adjustment mechanism to adjust the pressing force at each spring on the pressure plate based on the feedback from each first pressure sensor. This avoids the pressing force in the area where the failed spring is located being greater than the pressing force in other pressing areas due to spring failure, ensuring that the chip is subjected to balanced force when it is pressed, reducing the probability of chip damage. At the same time, it can also prevent slightly failed springs from accelerating the failure rate and / or prevent other normal springs from accelerating the failure rate.

[0009] A preferred embodiment is that the adjustment mechanism includes multiple linear actuators, each corresponding to a multiple spring and a multiple first pressure sensor, with the linear actuators positioned at the corresponding springs.

[0010] As can be seen from the above, by configuring an independently controllable linear actuator for each spring, when a spring fails, each linear actuator can precisely adjust the pressing force of the pressure plate at each spring according to the pressure value of the failed spring, so as to ensure that the pressure plate can apply a balanced pressing force to the chip and avoid damage to the chip due to excessive local force.

[0011] A further option is to fix the housing of the linear actuator to the frame, and fix the drive end of the linear actuator to the fixed plate.

[0012] As can be seen from the above, this design enables the adjustment mechanism to not only adjust the pressing force of the pressure plate at each spring according to the failure spring, but also to drive the pressing mechanism to press and depress relative to the chip, and control the pressing mechanism to apply a set pressing force to the chip.

[0013] Another further embodiment is that the automatic chip bonding equipment also includes a drive unit and a sliding frame. The drive unit is mounted on the frame and electrically connected to the control system. The sliding frame is slidably connected to the frame and is connected between the drive end of the drive unit and the fixed plate. The housing of the linear actuator is fixedly connected to the fixed plate and / or the sliding frame, and the drive end of the linear actuator is fixedly connected to the pressure plate.

[0014] As can be seen from the above, the pressing mechanism applies a set pressing force to the chip through the cooperation of the drive device and the sliding frame, while the adjustment mechanism is mainly used to adjust the pressing force of the pressure plate at each spring. This design helps the adjustment mechanism to adjust the pressing force of the pressure plate at each spring more accurately, reducing the requirements on the linear actuator.

[0015] Another preferred embodiment is that the automatic chip bonding equipment further includes a drive unit and a sliding frame. The drive unit is mounted on the frame and electrically connected to the control system. The sliding frame is slidably connected to the frame and is connected between the drive end of the drive unit and the fixed plate. The spring is made of shape memory alloy. The adjustment mechanism includes multiple stimulation modules, each corresponding to a spring and a first pressure sensor. The stimulation module is a heater that can heat the corresponding spring, or the stimulation module is an electrode group that includes two conductive electrodes electrically connected to the corresponding spring.

[0016] As can be seen from the above, the pressing mechanism applies a set pressing force to the chip through the cooperation of the drive device and the sliding frame. Since the spring is made of shape memory alloy, when the spring fails, it can be stimulated by the stimulation module to restore the spring to its original state, thereby restoring the spring's buffering performance and ensuring that the pressure plate applies a balanced pressing force to the chip during the pressing process.

[0017] A further option is that the automatic chip bonding equipment also includes a laser rangefinder and a temperature probe. The laser rangefinder is electrically connected to the control system and is used to measure the flatness of the chip placement part on the carrier platform. The temperature probe is mounted on the pressure plate and is electrically connected to the control system.

[0018] As can be seen from the above, configuring a laser rangefinder to detect the chip placement part ensures that the flatness of the chip placement part meets the pressing requirements, thereby further preventing the chip from being damaged during the pressing process due to uneven force; the setting of the temperature probe makes it convenient for users and the control system to understand the chip temperature changes in a timely manner when conducting high and low temperature tests on the chip.

[0019] Another further embodiment is that the automatic chip bonding device also includes a second pressure sensor and a pressure buffer pad. The second pressure sensor is connected between the sliding frame and the drive device and is electrically connected to the control system. The pressure buffer pad is connected between the second pressure sensor and the drive device.

[0020] As can be seen from the above, when the source of the set pressing force applied to the chip by the pressing mechanism is the driving device, the second pressure sensor can be set so that the control system and the user can know the magnitude of the pressing force in real time; while the pressure buffer pad can buffer the pressure applied by the driving device to avoid damage to the sliding frame, chip, etc.

[0021] To achieve the second objective of this invention, this invention provides a pressing control method for an automatic chip pressing device, wherein the automatic chip pressing device is the aforementioned automatic chip pressing device, and the pressing control method includes: acquiring the spring pressure values ​​detected by each first pressure sensor, determining whether the corresponding spring is faulty based on each spring pressure value; if a spring is faulty, adjusting the pushing force of each linear actuator based on the spring pressure value of the faulty spring.

[0022] As can be seen from the above, the pressing control method provided by this invention enables the automatic chip pressing device to adjust the pressing force of each spring on the pressure plate by adjusting the adjustment mechanism when a spring fails. This avoids the pressing force in the area where the failed spring is located being greater than the pressing force in other pressing areas due to spring failure, ensuring that the chip is subjected to balanced force when it is pressed, reducing the probability of chip damage. At the same time, it can also prevent slightly failed springs from accelerating the failure rate and / or prevent other normal springs from accelerating the failure rate.

[0023] A further solution involves a buffer unit comprising four springs arranged in a rectangular array, with the number of linear actuators equal to the number of springs. The step of adjusting the pushing force of each linear actuator based on the spring pressure value of the failed spring includes: calculating a compensation amount, which is the arithmetic mean of the spring pressure values ​​of the other three non-failed springs minus the spring pressure value of the failed spring; if the compensation amount is less than a preset threshold, adjusting the pushing force of the two linear actuators not diagonally positioned relative to the failed spring according to the compensation amount, so that the pushing force of these two linear actuators is greater than that of the other two linear actuators; if the compensation amount is greater than or equal to the preset threshold, adjusting the pushing force of the linear actuator corresponding to the failed spring according to the compensation amount, so that the pushing force of this linear actuator is less than that of the other three linear actuators.

[0024] As can be seen from the above, by setting the number of springs, the chip testing requirements can be met, providing an excellent buffering effect while reducing equipment costs and control difficulty. Based on the distribution of springs, different dynamic compensation schemes can be provided according to the degree of failure of the failed springs, which can slow down the failure rate of slightly failed springs, extend the service life of springs in normal condition, and prevent chip damage and inaccurate test results due to uneven force.

[0025] To achieve the second objective of the present invention, the present invention also provides a pressing control method for an automatic chip pressing device, wherein the automatic chip pressing device is the aforementioned automatic chip pressing device, and the pressing control method includes: acquiring the spring pressure value detected by each first pressure sensor, determining whether the corresponding spring is faulty based on the spring pressure value; if a certain spring is faulty, controlling the stimulation module corresponding to the faulty spring to stimulate the faulty spring, so that the faulty spring returns to its original state.

[0026] As can be seen from the above, the pressing control method provided by the present invention is based on the spring being made of shape memory alloy. When the spring fails, the spring can be stimulated by the stimulation module, thereby causing the spring to return to its original state, and then restoring the spring's buffering performance, ensuring that the pressure plate applies a balanced pressing force to the chip during the pressing process. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the structure of the first embodiment of the automatic chip bonding equipment of the present invention.

[0028] Figure 2 This is a schematic diagram of the structure of the first embodiment of the automatic chip bonding equipment of the present invention, after omitting some components.

[0029] Figure 3 This is a schematic diagram of the structure of the second omitted component of the first embodiment of the automatic chip bonding equipment of the present invention.

[0030] Figure 4 This is a cross-sectional view of the third omitted component of the first embodiment of the automatic chip bonding device of the present invention.

[0031] Figure 5 This is a schematic diagram of the structure after omitting some components in the first part of the second embodiment of the automatic chip bonding equipment of the present invention.

[0032] Figure 6 This is a schematic diagram of the structure after omitting the second part of the components in the second embodiment of the automatic chip bonding equipment of the present invention.

[0033] The present invention will be further described below with reference to the accompanying drawings and embodiments. Detailed Implementation

[0034] First embodiment of automatic chip bonding equipment

[0035] Reference Figure 1 The automatic chip bonding equipment 100 includes a frame 1, a support platform 2, a bonding device 3, a drive device 4, a sliding frame 5, a temperature probe 6, a second pressure sensor 7, a pressure buffer pad 8, and a control system 9.

[0036] The support platform 2 is mounted on the rack 1. The support platform 2 provides space for the chip and positions it. During the pressing test, it works in conjunction with the pressing device 3 to fix the chip and apply a preset pressing force. The support platform 2 includes a chip placement board 21, support columns 22, support assemblies 23, and a base plate 24. The chip placement board 21 is typically a PCB board, which is electrically connected to the control system 9 to feed back relevant chip parameters to the control system 9 during the chip pressing test. This allows the control system 9 to determine whether the chip is qualified based on the feedback parameters.

[0037] Support column 22 connects the base plate 24 and the chip placement plate 21 to ensure the overall strength of the support platform 2 and facilitates the installation of support assembly 23. The base plate 24 is fixedly installed on the frame 1. Support assembly 23 is located between chip placement plate 21 and base plate 24. Specifically, support assembly 23 is located below the chip placement section 211 of chip placement plate 21. When the pressing device 3 applies pressing force to the chip, it ensures that the pressing force on the chip meets the test requirements. It also ensures that a stable communication is established between the chip and chip placement plate 21. In addition, it can enhance the structural strength of chip placement plate 21 at chip placement section 211 and prevent the chip from shifting position relative to chip placement section 211 or being damaged during the pressing test.

[0038] In some embodiments, the automatic chip bonding equipment 100 further includes a laser rangefinder, which is mounted on the frame 1 and electrically connected to the control system 9. The laser rangefinder is used to check the flatness of the chip placement portion 211 of the chip placement board 21 to ensure that the flatness of the chip placement portion 211 meets the bonding requirements, thereby preventing damage to the chip due to uneven force during bonding. Preferably, the height difference between the four corners of the chip placement portion 211 corresponding to the chip is less than or equal to 5 micrometers. Further, before each chip bonding test, the automatic chip bonding equipment 100 first detects the flatness of the chip placement portion 211 using the laser rangefinder, and when the flatness of the chip placement portion 211 does not meet the flatness requirements, an alarm is triggered through the display screen of the control system 9 and / or the audible and / or visual alarm set in the automatic chip bonding equipment 100, thereby reminding the user to adjust the chip placement board 21 in a timely manner.

[0039] The pressing device 3 is located above the support platform 2, and is combined with... Figures 2 to 4 The pressing device 3 includes a pressing mechanism 31 and an adjusting mechanism 32. The pressing mechanism 31 includes a fixed plate 311, a pressure plate 312, a buffer unit 313 and a first pressure sensor 314. Since the automatic chip pressing device 100 of this embodiment is equipped with a driving device 4 and a sliding frame 5, the fixed plate 311 in this embodiment is connected to the sliding frame 5.

[0040] The pressure plate 312 can move relative to the fixed plate 311 in the pressing direction of the pressing device 3. The sliding connection between the pressure plate 312 and the fixed plate 311 is existing technology and will not be described in detail here. The buffer unit 313 is disposed between the fixed plate 311 and the pressure plate 312 to relieve pressure and buffer pressure during the pressing test, thereby ensuring that the chip is subjected to balanced force during the pressing test and avoiding damage.

[0041] The buffer unit 313 includes multiple springs 3131, which are arranged between the fixed plate 311 and the pressure plate 312. For example, in this embodiment, there are four springs 3131, which are arranged in a rectangular array. The fixed plate 311 and the pressure plate 312 both have a rectangular four-corner structure. The four springs 3131 correspond one-to-one with the four corners of the pressure plate 312, so that one spring 3131 is set close to one corner of the pressure plate 312.

[0042] Furthermore, the bottom of the pressure plate 312 has a pressing part 3121, which allows the pressure plate 312 to contact the chip through the pressing part 3121 and apply a pressing force to the chip. The pressing part 3121 is rectangular in shape, and four springs 3131 are located at the four corners of the rectangular block to better ensure the balance of the pressure on the chip.

[0043] Furthermore, in this embodiment, the first pressure sensor 314 is disposed between the spring 3131 and the pressure plate 312. The number of first pressure sensors 314 is equal to the number of springs 3131, such that each spring 3131 is connected to the pressure plate 312 by a first pressure sensor 314. The first pressure sensor 314 is used to cyclically detect the elastic force of the spring 3131 connected to it according to a set detection cycle, and feeds it back to the control system 9, so that the control system 9 can determine whether the corresponding spring 3131 has failed based on the detection signal fed back by each first pressure sensor 314. It is understood that in other embodiments, the first pressure sensor 314 may also be disposed between the spring 3131 and the fixing plate 311.

[0044] When spring 3131 fails, the pressure plate 312 in the area where the failed spring is located loses its elastic support during the chip pressing process. Therefore, the pressure at the location of the failed spring will be directly transmitted by the driving force of the connecting plate 52 (as in this embodiment, the pressure at the location of the failed spring is directly transmitted by the downward driving force of the driving device 4), resulting in a sudden increase in local pressure (i.e., the area where the failed spring is located). At this time, since the pressure on the chip at the failed spring is greater than the pressure on other normal springs 3131, the chip and / or chip placement plate 21 are prone to overpressure in the area where the failed spring is located, which can easily lead to problems such as breakage, solder joint crushing, and circuit layer damage.

[0045] To address this, the present invention utilizes an adjustment mechanism 32 to dynamically compensate for the failure of springs during the pressing process. This ensures that even after a spring 3131 fails, the pressing device 3 can still maintain balanced pressure on the chip applied by the pressure plate 312, preventing chip damage. Simultaneously, the adjustment mechanism 32 can also slow down the failure rate of spring 3131 when the failure is only minor, extending its service life (see the first embodiment of the pressing control method described below). Therefore, during the pressing operation, the control system 9 controls the adjustment mechanism 32 to adjust the pressing force of the pressure plate 312 at each spring 3131 based on the detection signals from each first pressure sensor 314.

[0046] In this embodiment, the adjustment mechanism 32 includes multiple linear actuators 321, each corresponding to a spring 3131 and a first pressure sensor 314. Each linear actuator 321 is positioned at a corresponding spring 3131, facilitating the adjustment of the pressing force of the pressure plate 312 at each spring 3131 based on the failure status of the spring 3131. That is, in this embodiment, there are four linear actuators 321. By configuring an independently controllable linear actuator 321 for each spring 3131, when a spring 3131 fails, each linear actuator 321 can precisely adjust the pressing force of the pressure plate 312 at each spring 3131 based on the pressure value of the failed spring. This ensures that the pressure plate 312 can apply a balanced pressing force to the chip, preventing damage to the chip due to excessive localized force.

[0047] In this embodiment, the linear actuator 321 is a cylinder. As is well known to those skilled in the art, the pressing force of a cylinder can be adjusted by regulating the air pressure when the extension amount is constant. It is understood that in some embodiments, the linear actuator 321 may also be other types of linear actuators 321 such as servo electric cylinders or hydraulic cylinders. These linear actuators 321 can all meet the requirements of differentiated force control for the same extension amount.

[0048] Since this embodiment includes a drive device 4 and a sliding frame 5, the pressing force applied by the pressure plate 312 to the chip is mainly provided by the drive device 4. Therefore, the housing of the linear actuator 321 is fixedly connected to the fixed plate 311 and / or the sliding frame 5, while the drive end of the linear actuator 321 is fixedly connected to the pressure plate 312. It can be seen that in this embodiment, the pressing mechanism 31 applies a set pressing force to the chip through the cooperation of the drive device 4 and the sliding frame 5. Therefore, the adjustment mechanism 32 is mainly used to adjust the pressing force of the pressure plate 312 at each spring 3131. This design helps the adjustment mechanism 32 to more accurately adjust the pressing force of the pressure plate 312 at each spring 3131 (compared to fine-tuning the pushing force of the linear actuator 321 at a large pressing force upper limit, adjusting the pushing force only at a small pushing force upper limit is more precise and easier to control), reducing the requirements on the linear actuator 321.

[0049] The sliding frame 5 includes multiple sliding columns 51 and a connecting plate 52. The multiple sliding columns 51 are connected between the connecting plate 52 and the fixed plate 311 of the pressing mechanism 31. Preferably, the number of sliding columns 51 is equal to the number of linear actuators 321. For example, in this embodiment, there are four sliding columns 51, so that one sliding column 51 is provided at each spring 3131. Preferably, the sliding column 51 can be a hollow column. On the one hand, this can reduce the weight of the sliding frame 5. On the other hand, the hollow interior of the sliding column 51 can be used to accommodate the linear actuator 321, thereby making the size range of the linear actuator 321 more flexible and avoiding the need to design a linear actuator 321 of a specific size due to the small gap between the fixed plate 311 and the pressure plate 312. It also makes the types of linear actuators 321 more flexible and avoids the inability to manufacture certain types of linear actuators 321 due to the small gap between the fixed plate 311 and the pressure plate 312.

[0050] The connecting plate 52 serves two purposes: firstly, it connects to the drive end of the drive device 4, allowing the drive device 4 to move the pressing device 3 via the sliding frame 5; secondly, the connecting plate 52, in conjunction with the fixed plate 311, enhances the overall structural strength of the connecting frame and supports the multiple sliding columns 51. The sliding columns 51 are slidably connected to the frame 1 along the pressing direction of the pressing device 3.

[0051] The drive device 4 is preferably a hydraulic-pneumatic device, which has the advantages of low cost, high cleanliness, fast response and high safety. The drive device 4 is connected to the control system 9 and is driven and controlled by the control system 9. The second pressure sensor 7 is connected between the connecting plate 52 and the drive end of the drive device 4. The second pressure sensor 7 is electrically connected to the control system 9. The second pressure sensor 7 is used to detect the pushing force provided by the drive device 4 (i.e. the pressing force required in the chip pressing test), to ensure that the chip is pressed under the set pressing force, and also to avoid abnormal pushing force of the drive device 4, thus protecting the chip.

[0052] The pressure buffer pad 8 is connected between the second pressure sensor 7 and the drive end of the drive device 4. The pressure buffer pad 8 is used to buffer the pushing force applied by the drive device 4 during the pressing process to avoid damaging the sliding frame 5, chip, etc.

[0053] Temperature probe 6 is mounted on pressure plate 312 and is electrically connected to control system 9. The purpose of temperature probe 6 is to facilitate timely monitoring of chip temperature changes by the user and control system 9 during high and low temperature testing of the chip. A cable connects temperature probe 6 and control system 9. To prevent displacement and damage to temperature probe 6 caused by the vertical movement of pressing mechanism 31, a connecting tube 61 is provided between temperature probe 6 and control system 9 to accommodate the cable. A connecting tube bracket 11 is provided on frame 1 to limit and fix the connecting tube 61.

[0054] Furthermore, the control system 9 can incorporate an AI module to record the pressure feedback from each spring 3131 at each pressing node. Through a pre-set training program, the AI ​​module learns and analyzes the historical pressure data of each spring 3131, enabling it to predict the lifespan of the springs 3131 and proactively trigger the adjustment mechanism 32 to maintain or adjust them, preventing sudden failure. Additionally, by learning the historical pressure changes of each spring 3131, the AI ​​module can predict their failure trends based on this data, allowing the adjustment mechanism 32 to perform pre-compensation measures, such as buffer adjustments during the aging phase of the springs 3131. For instance, when the AI ​​module detects abnormal parameters in the springs 3131, it can provide pressing test adjustment suggestions based on the learned and analyzed results, such as reducing the pressing speed by 10% to extend the lifespan of the springs 3131.

[0055] In summary, by configuring a first pressure sensor 314 for each spring 3131 to detect the pressure of the spring 3131, and cooperating with the adjustment mechanism 32, when a spring 3131 fails during the pressing process of the pressing device 3, the control system 9 can promptly control the adjustment mechanism 32 to adjust the pressing force of each spring 3131 on the pressure plate 312 according to the feedback of each first pressure sensor 314. This dynamically compensates for the pressing force of the failed spring, thereby avoiding the pressing force in the area where the failed spring is located being greater than the pressing force in other pressing areas due to the failure of the spring 3131. This ensures that the overall force is balanced when the chip is pressed, reduces the probability of chip damage, and also prevents slightly failed springs from accelerating the failure rate and / or prevents other normal springs 3131 from accelerating the failure rate.

[0056] Based on the spring 3131 distribution in this embodiment, when a spring 3131 experiences a slight failure, the control system 9 calculates a compensation amount and adjusts the linear actuators 321 corresponding to the two normal springs 3131 (i.e., the two springs 3131 arranged non-diagonally to the failed spring) on ​​the adjacent side of the failed spring according to the compensation amount. This makes the pushing force of the two linear actuators 321 greater than the pushing force of the remaining two linear actuators 321 (i.e., the linear actuator 321 corresponding to the failed spring, and the linear actuator 321 corresponding to the spring 3131 on the same diagonal as the failed spring). When a spring 3131 experiences a severe failure, the control system 9 calculates a compensation amount and adjusts the linear actuator 321 corresponding to the failed spring according to the compensation amount.

[0057] Second embodiment of automatic chip bonding equipment

[0058] The difference between this embodiment and the first embodiment of the automatic chip bonding equipment is that, in this embodiment:

[0059] The drive device 4, sliding frame 5, second pressure sensor 7, and pressure buffer pad 8 provided in the first embodiment of the automatic chip bonding equipment have been removed; and, as... Figure 5 and Figure 6 As shown, the housing of the linear actuator 321A of the adjusting mechanism 32A is fixedly connected to the frame, and the drive end of the linear actuator 321A is fixedly connected to the fixed plate 311. In order to ensure the structural strength of the linear actuator 321A, the adjusting mechanism 32A also includes a fixed base 322, and each linear actuator 321A is connected to the fixed base 322.

[0060] In this embodiment, in addition to adjusting the pressing force of the pressure plate at each spring according to the failure spring, each linear actuator 321A of the adjustment mechanism 32A also has the function of the aforementioned driving device 4. That is, the adjustment mechanism 32A also drives the pressing mechanism 31 to press and depress relative to the chip, and controls the pressing mechanism 31 to apply a preset pressing force to the chip.

[0061] The above design can reduce the number of devices in the automatic chip bonding equipment, simplify the structure of the automatic chip bonding equipment, and reduce manufacturing costs.

[0062] Third embodiment of chip automatic lamination equipment

[0063] The difference between this embodiment and the first embodiment of the automatic chip bonding equipment lies in the pressure regulating mechanism. Specifically, in this embodiment:

[0064] The pressure regulating mechanism no longer includes multiple linear actuators, but instead includes multiple stimulation modules; and, in this embodiment, the springs are made of shape memory alloys, with each stimulation module corresponding to one of the multiple springs.

[0065] As an alternative, the stimulation module can be a heater, which can be controlled by the control system to heat the corresponding spring, so that the spring returns to its initial state.

[0066] As an alternative, the stimulation module can be an electrode assembly, which includes two conductive electrodes electrically connected to corresponding springs. The two conductive electrodes are preferably connected to the two ends of the springs. The electrode assembly can be controlled by a control system to apply voltage to the corresponding springs, thereby restoring the springs to their initial state.

[0067] By setting the pressure regulating mechanism in this embodiment, when a spring fails, the spring can be stimulated by the stimulation module. Since the spring is made of shape memory alloy, the spring returns to its initial state after being stimulated, thereby restoring the spring from the failed state to the normal state.

[0068] As can be seen, the pressing mechanism applies a set pressing force to the chip through the cooperation of the drive device and the sliding frame. Since the spring is made of shape memory alloy, when the spring fails, it can be stimulated by the stimulation module to restore the spring to its original state, thereby restoring the spring's buffering performance and ensuring that the pressure plate applies a balanced pressing force to the chip during the pressing process.

[0069] It should be noted that in some embodiments, the pressure regulating mechanism may simultaneously include multiple linear actuators and multiple stimulation modules. In this case, the multiple linear actuators can be configured as described in the first or second embodiment of the automatic chip bonding device, and the multiple stimulation modules can be configured as described in this embodiment, so that the multiple linear actuators and multiple stimulation modules complement each other, thereby making the maintenance of the automatic chip bonding device more convenient. It is understood that when the multiple linear actuators are configured as described in the second embodiment of the automatic chip bonding device, the drive device, sliding frame, second pressure sensor, and pressure buffer pad can be omitted.

[0070] First embodiment of the pressing control method

[0071] The pressing control method of this embodiment is applied to the automatic chip pressing equipment described in the first or second embodiment of the above-mentioned automatic chip pressing equipment. The pressing control method includes:

[0072] If the automatic chip bonding equipment is equipped with a drive unit, the drive unit is controlled to move the bonding mechanism toward the chip placed on the chip placement plate via a sliding frame, obtain the detection signal fed back by the second pressure sensor, and adjust the drive unit to drive the bonding mechanism according to a preset pushing force. If the automatic chip bonding equipment is not equipped with a drive unit, the adjustment mechanism is controlled to move the bonding mechanism toward the chip placed on the chip placement plate, and the adjustment mechanism is adjusted to drive the bonding mechanism according to a preset pushing force.

[0073] After the pressure plate contacts the chip, the spring pressure value detected by each first pressure sensor is obtained, and the corresponding spring is determined to be faulty based on the spring pressure value. If a spring fails, the pushing force of each linear actuator is adjusted according to the spring pressure value of the failed spring.

[0074] The steps for adjusting the thrust of each linear actuator based on the spring pressure value of the failed spring include:

[0075] Calculate compensation amount Compensation amount The compensation amount is calculated by subtracting the spring pressure of the failed spring from the arithmetic mean of the spring pressure values ​​of the other three non-failed springs. For example, after a spring fails, its elasticity usually decreases or it loses its elasticity. Assuming the spring pressure of the failed spring is F2, the spring pressure values ​​of the other three non-failed springs are F1, F3, and F4, respectively. .

[0076] Next, determine the amount of compensation. Is it less than the preset threshold? If so, the compensation amount... If it is less than the preset threshold, then the compensation amount will be used. Adjust the pushing force of the two linear actuators that are not diagonally positioned with the failure spring (this can be done by increasing or decreasing the pushing force at the drive end of the linear actuators, while keeping the elongation of each linear actuator consistent), so that the pushing force of these two linear actuators is greater than that of the other two linear actuators.

[0077] For example, if the spring with a spring pressure value of F1 is set diagonally opposite the failed spring (corresponding to spring pressure value F2), then during pressure balance compensation, the compensation amount will be... The force of the two linear actuators, which are not diagonally opposite to the failed spring, is increased to be greater than the force of the other two linear actuators (i.e., the linear actuator corresponding to the failed spring and the linear actuator corresponding to the spring diagonally opposite to the failed spring). Wherein, when the compensation amount... If the pressure is less than the preset threshold, it indicates that the spring is slightly faulty. Therefore, the spring pressure at the faulty spring will not be too high compared to the spring pressure of other normal springs during the pressing process. By increasing the pressure at the two corners adjacent to the faulty spring (which can be buffered and relieved by the normal springs to avoid excessive local pressing force), the pressing requirements can be met. The corner pressure opposite the faulty spring is not applied to avoid aggravating the uneven distribution of pressing force, which could lead to test failure and / or chip damage. It can be seen that when the spring is slightly faulty, the compensation is not directly applied to the corner where the faulty spring is located, which can prevent the aging faulty spring from aggravating the failure reaction (delaying aging, and at this time, it is not necessary to replace or repair the faulty spring).

[0078] If compensation amount If it is greater than or equal to the preset threshold, then the compensation amount will be used. Adjust the pushing force of the linear actuator corresponding to the failed spring so that its pushing force is less than that of the other three linear actuators. When the compensation amount... When the pressure is greater than or equal to a preset threshold, it indicates that the spring has severely failed. If the pushing force of the corresponding linear actuator is not reduced at this point, the pressure on the platen at the failed spring will be greater than the pressure at other locations, resulting in an uneven distribution of pressure force. This can easily damage the chip and affect the accuracy of the test results. Specifically, when a spring is severely failed, reducing the pushing force of the corresponding linear actuator sequentially replaces and compensates for the lost buffering and pressure-relieving functions of the failed spring. This ensures that the pressure force in the area where the failed spring is located is consistent with or within the required difference from other parts during the pressing process, thus balancing the pressure force on the chip. After the automatic chip pressing equipment completes the pressing test, the control system can alert the user via a display screen, audible and / or visual alarms, reminding the user to replace the severely failed spring.

[0079] It should be noted that the chip pressing test typically involves two pressing stages: a dynamic process stage and a balance stage. The adjustment mechanism intervenes during the dynamic process stage, in which the pressing mechanism initially contacts the chip and requires the use of a buffer unit for pressure relief and buffering to avoid causing a hard impact on the chip. Once the pressing mechanism moves relative to the chip to the preset position, the dynamic process stage is basically over, and each first pressure sensor can recheck the spring pressure value at each spring. If the pressure value at the failed spring still does not meet the requirements, it can be adjusted a second time through the adjustment mechanism.

[0080] It should be noted here that:

[0081] During the dynamic process phase, if the automatic chip pressing equipment uses the pushing force of the drive device as the pressing force source, then if the spring fails during the process of the drive device driving the pressing mechanism to apply the pressing force to the chip, the adjustment mechanism will intervene again to dynamically compensate for the pressing force. During the equilibrium phase, the (control system) controls the drive device to maintain the preset pushing force through the feedback of the second pressure sensor until the pressing test ends.

[0082] If the automatic chip bonding equipment is not equipped with a drive device, sliding frame, second pressure sensor, and pressure buffer pad, then during the process of the drive device driving the bonding mechanism to apply bonding force to the chip, the adjustment mechanism controls the bonding mechanism to apply bonding force to the chip. In the process, if the spring fails, the cylinder of the adjustment mechanism performs dynamic compensation of the bonding force. In the equilibrium stage, the (control system) controls the adjustment mechanism to maintain the preset pushing force until the bonding test ends by using the first pressure sensor or an additional pressure sensor (used to detect the bonding force applied to the chip).

[0083] Furthermore, if a spring fails during the pressing test, the control system records the failure time and compensation parameters, generates a log for storage, and alerts the user via a display screen, audible and / or visual alarm. The AI ​​module records the pressure feedback from each spring at each pressing node during the pressing test and learns and analyzes the historical pressure data of each spring through a pre-set training program. This allows the AI ​​module to predict the spring's lifespan and trigger the adjustment mechanism to maintain or adjust the springs in advance, preventing sudden spring failure. In addition, after learning the historical pressure changes of each spring, the AI ​​module can predict the failure trend of each spring based on the historical pressure data, enabling the adjustment mechanism to perform pre-compensation processing in advance, such as buffering adjustments during the spring aging stage. For example, when the AI ​​module detects abnormal spring parameters, it can provide pressing test adjustment suggestions based on the learning and analysis results, such as reducing the pressing speed by 10% to extend the spring's lifespan. Moreover, the control system can display relevant pressure and temperature data on the screen.

[0084] Second embodiment of the pressing control method

[0085] The pressing control method of this embodiment is applied to the automatic chip pressing equipment described in the third embodiment of the above-mentioned automatic chip pressing equipment. The pressing control method includes:

[0086] Obtain the spring pressure value detected by each of the first pressure sensors, and determine whether the corresponding spring is faulty based on the spring pressure value.

[0087] If one of the springs fails, the stimulation module corresponding to the failed spring is controlled to stimulate the failed spring, so that the failed spring returns to its original state.

[0088] If the adjustment mechanism does not include a linear actuator, the automatic chip pressing equipment is equipped with a drive device, a second pressure sensor, etc. The drive device drives the pressing mechanism to move towards the chip placed on the chip placement board. At the same time, by acquiring the detection signal fed back by the second pressure sensor, the drive device is adjusted to drive the pressing device according to the preset pushing force.

[0089] If the adjustment mechanism also includes multiple linear actuators, and the adjustment mechanism is only used for dynamic compensation of the pressing force (which is consistent with the function of the linear actuator in the first embodiment of the chip automatic pressing device), then the chip automatic pressing device is equipped with a drive device, a second pressure sensor, etc., and the drive device drives the pressing mechanism to move towards the chip placed on the chip placement board. At the same time, by obtaining the detection signal fed back by the second pressure sensor, the drive device is adjusted to drive the pressing device according to the preset pushing force.

[0090] If the adjustment mechanism also includes multiple linear actuators, and the adjustment mechanism is used not only for dynamic compensation of the pressing force, but also for controlling the pressing mechanism to apply a preset pressing force to the chip (the function of the linear actuators in the second embodiment of the automatic chip pressing device is the same), then the automatic chip pressing device no longer needs to be equipped with a drive device, sliding frame, second pressure sensor and pressure buffer pad, etc.; by controlling the adjustment mechanism to drive the pressing mechanism to move towards the chip placed on the chip placement plate, the adjustment mechanism is adjusted to drive the pressing mechanism according to the preset pushing force.

[0091] If the adjustment mechanism includes a linear actuator and a stimulation module, it can better compensate for the pressing force when the spring fails, and improve the service life and maintenance convenience of the automatic chip pressing equipment. It can also reduce the risk of inadequate compensation when only a stimulation module is set.

[0092] Finally, it should be emphasized that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An automatic chip bonding equipment, comprising a frame, a support platform, a bonding device, and a control system, wherein the support platform is mounted on the frame, and the bonding device is located above the support platform, characterized in that, The pressing device includes: A pressing mechanism, comprising a fixed plate, a pressure plate, and a buffer unit, wherein the buffer unit comprises a plurality of springs arranged between the fixed plate and the pressure plate, and each spring is provided with a first pressure sensor between itself and the pressure plate, or each spring is provided with a first pressure sensor between itself and the fixed plate; During the pressing operation, the control system controls the adjusting mechanism to adjust the pressing force of the pressure plate at each of the springs based on the detection signals of each of the first pressure sensors.

2. The automatic chip bonding equipment according to claim 1, characterized in that: The adjustment mechanism includes multiple linear actuators, each of which corresponds to a multiple spring and a multiple first pressure sensor, with the linear actuators positioned at the corresponding springs.

3. The automatic chip bonding equipment according to claim 2, characterized in that: The housing of the linear actuator is fixedly connected to the frame, and the drive end of the linear actuator is fixedly connected to the fixed plate.

4. The automatic chip bonding equipment according to claim 2, characterized in that: The automatic chip bonding equipment also includes: A drive unit is mounted on the frame and electrically connected to the control system; A sliding frame is slidably connected to the frame and connected between the drive end of the drive device and the fixed plate. The housing of the linear actuator is fixedly connected to the fixed plate and / or the sliding frame, and the drive end of the linear actuator is fixedly connected to the pressure plate.

5. The automatic chip bonding equipment according to claim 1, characterized in that: The automatic chip bonding equipment also includes a drive unit and a sliding frame. The drive unit is mounted on the frame and electrically connected to the control system. The sliding frame is slidably connected to the frame and is connected between the drive end of the drive unit and the fixed plate. The spring is made of shape memory alloy, and the adjustment mechanism includes multiple stimulation modules, each of which corresponds to one of the multiple springs and one of the multiple first pressure sensors. The stimulation module is a heater, which can heat the corresponding spring, or The stimulation module is an electrode assembly, which includes two conductive electrodes electrically connected to the corresponding spring.

6. The automatic chip bonding equipment according to any one of claims 1 to 5, characterized in that: The automatic chip bonding equipment also includes; A laser rangefinder, which is electrically connected to the control system, is used to measure the flatness of the chip placement portion of the support platform. A temperature probe is mounted on the pressure plate and is electrically connected to the control system.

7. The automatic chip bonding equipment according to claim 4 or 5, characterized in that: The automatic chip bonding equipment also includes: A second pressure sensor is connected between the sliding frame and the drive device, and the second pressure sensor is electrically connected to the control system. A pressure buffer pad is connected between the second pressure sensor and the drive device.

8. A pressing control method for an automatic chip pressing device, characterized in that: The automatic chip bonding equipment is the automatic chip bonding equipment according to any one of claims 2 to 4 above, and the bonding control method includes: Obtain the spring pressure value detected by each of the first pressure sensors, and determine whether the corresponding spring is faulty based on the spring pressure value. If one of the springs fails, the pushing force of each of the linear actuators is adjusted according to the spring pressure value of the failed spring.

9. The pressing control method according to claim 8, characterized in that: The buffer unit includes four springs arranged in a rectangular pattern, and the number of linear actuators is equal to the number of springs. The step of adjusting the pushing force of each linear actuator according to the spring pressure value of the failed spring includes: Calculate the compensation amount, which is the arithmetic mean of the spring pressure values ​​of the other three non-failed springs minus the spring pressure value of the failed spring; If the compensation amount is less than the preset threshold, the pushing force of the two linear actuators that are not diagonally arranged with the failure spring is adjusted according to the compensation amount, so that the pushing force of the two linear actuators is greater than the pushing force of the other two linear actuators. If the compensation amount is greater than or equal to the preset threshold, the pushing force of the linear actuator corresponding to the failed spring is adjusted according to the compensation amount, so that the pushing force of the linear actuator is less than the pushing force of the other three linear actuators.

10. A pressing control method for an automatic chip pressing device, characterized in that: The automatic chip bonding equipment is the automatic chip bonding equipment described in claim 5 above, and the bonding control method includes: Obtain the spring pressure value detected by each of the first pressure sensors, and determine whether the corresponding spring is faulty based on the spring pressure value. If one of the springs fails, the stimulation module corresponding to the failed spring is controlled to stimulate the failed spring, so that the failed spring returns to its original state.

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