Packaging structure and electronic module

Abstract

The invention discloses a packaging structure and an electronic module. The packaging structure is used for packaging a semiconductor device and a peripheral assembly, the peripheral assembly comprises a substrate used for bearing an electronic component, the electronic component comprises a first electrode and a second electrode which are opposite to each other, the first electrode and the second electrode are arranged in the stacking direction of the electronic component and the substrate, and the second electrode is electrically connected with the substrate; the first external terminal is arranged on the electronic element and is electrically connected with the first electrode; and the second external terminal is arranged on the substrate and is electrically connected with the substrate. By directly arranging the external terminals on the electronic component or the substrate, the number of connecting points between the first external terminal and the electronic component and between the second external terminal and the substrate can be reduced, so that damage to peripheral components caused by falling off or fatigue of the connecting points is reduced, and the reliability of the packaging structure is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to a packaging structure and an electronic module. Background Art

[0002] In electronic modules, electronic components such as thermistors play a crucial role. For example, in power semiconductor modules, semiconductor devices generate significant heat during operation due to factors such as the high current flowing through them. Even slight temperature fluctuations can significantly impact the performance, stability, and lifespan of these devices. Thermistors, due to their sensitivity to temperature fluctuations, are widely used in power semiconductor modules. They can sense temperature changes around the semiconductor chip in real time and convert these changes into electrical signals for output. These signals ensure that the semiconductor device remains within the optimal operating temperature range, maintaining efficient and stable operation, and safeguarding the reliability and performance of the entire electronic module.

[0003] Traditional thermistors connect to the terminals by welding positive and negative electrodes with bonding wires, such as aluminum or copper wires. These wires are then led to external terminals. However, the soldering point between the thermistor and the bonding wire is small, making it difficult to ensure the reliability of the soldering point. The bonding wires also require a considerable amount of space. Furthermore, during the long-term operation of semiconductor devices, metal bonding wires are susceptible to deformation or even fracture due to long-term temperature cycling and mechanical stress, paralyzing the temperature monitoring and control functions of the entire semiconductor module. Summary of the Invention

[0004] In view of the above problems, the purpose of this application is to provide a packaging structure and an electronic module, which can improve the reliability of the packaging structure.

[0005] According to one aspect of the present application, a packaging structure is provided, wherein the packaging structure is used to package semiconductor devices and peripheral components, and the peripheral components include: a substrate for carrying electronic components, the electronic components including relative first and second electrodes, the first electrodes and the second electrodes are arranged along the stacking direction of the electronic components and the substrate, and the second electrode is electrically connected to the substrate; a first external terminal is arranged on the electronic component and electrically connected to the first electrode; and a second external terminal is arranged on the substrate and electrically connected to the substrate.

[0006] Optionally, the first external terminal includes a first part and a second part, the first part is electrically connected to the first electrode, the second part is connected to the first part and extends outside the packaging structure, and the second external terminal includes a third part and a fourth part, the third part is electrically connected to the substrate, and the fourth part is connected to the third part and extends outside the packaging structure.

[0007] Optionally, the first part and the third part extend along the second direction, one end of the first part is arranged on the first electrode, the second part extends from the other end of the first part toward the stacking direction, one end of the third part is arranged on the substrate, and the fourth part extends from the other end of the third part toward the stacking direction.

[0008] Optionally, the second portion and the fourth portion are aligned in a first direction and are spaced apart by at least a first distance in the second direction.

[0009] Optionally, the second portion and the fourth portion are spaced apart by at least a second distance in the first direction and are aligned in the second direction.

[0010] Optionally, in the stacking direction, the first portion and the third portion are spaced apart by at least a third distance.

[0011] Optionally, the first part is connected to the first electrode via a first connecting layer, the second electrode is connected to the substrate via a second connecting layer, and the third part is connected to the substrate via a third connecting layer, wherein the second connecting layer and the third connecting layer are an integral structure; or the second connecting layer and the third connecting layer are independent of each other.

[0012] Optionally, the first connecting layer and / or the second connecting layer and / or the third connecting layer are of a sintered structure; or the first connecting layer and / or the second connecting layer and / or the third connecting layer are of a welded structure.

[0013] Optionally, the electronic component includes a resistor, a capacitor and / or an inductor, the resistor includes a surface electrode type thermistor, and the semiconductor device includes a power semiconductor device.

[0014] According to another aspect of the present application, an electronic module is provided, wherein the electronic module includes at least one semiconductor device and at least one peripheral component, and also includes a packaging structure as described in any one of the above items, wherein the packaging structure is used to encapsulate the semiconductor device and the peripheral component.

[0015] According to the packaging structure and electronic module provided by this application, by directly placing the external terminals on the electronic component or substrate, the number of connection points between the first external terminal and the electronic component, and between the second external terminal and the substrate, can be reduced. This reduces the risk of electronic component disconnection due to disconnection or fatigue of the connection points, reduces the risk of damage to peripheral components, and helps improve the reliability of the packaging structure. Furthermore, by avoiding the use of bonding wires, the space occupied by peripheral components can be saved, which is conducive to the miniaturization of the packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above and other objects, features and advantages of the present invention will become more apparent through the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:

[0017] Figure 1 A schematic structural diagram showing an electronic component;

[0018] Figure 2A A top view of a peripheral component in a package structure in some embodiments of the present application is shown;

[0019] Figure 2B Show Figure 2A Front view of the central peripheral assembly;

[0020] Figure 2C Show Figure 2A a right side view of the peripheral components shown;

[0021] Figure 3A A top view of peripheral components in a packaging structure in some other embodiments of the present application is shown;

[0022] Figure 3B Show Figure 3A Front view of the central peripheral assembly;

[0023] Figure 3C Show Figure 3A a right side view of the peripheral components shown;

[0024] Figure 3D Show Figure 3A A top view of the first and third parts;

[0025] Figure 4 A schematic flow chart of the packaging method in an embodiment of the present application is shown. DETAILED DESCRIPTION

[0026] Various embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. In each of the accompanying drawings, identical elements are represented by identical or similar reference numerals. For the sake of clarity, the various parts in the accompanying drawings are not drawn to scale.

[0027] Certain terms are used in this specification and claims to refer to specific components. A person skilled in the art will appreciate that manufacturers may use different terms to refer to the same component. This specification and claims do not distinguish components by their names.

[0028] It should be understood that in the following description, when an element or circuit is said to be “connected to” another element or “connected between” two nodes, it can be directly coupled or connected to the other element or there can be intermediate elements, and the connection between the elements can be physical, logical, or a combination thereof. Conversely, when an element is said to be “directly coupled to” or “directly connected to” another element, it means that there are no intermediate elements between the two.

[0029] In addition, it should be noted that, in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element.

[0030] It should also be noted that, in the various methods and processes of the present application, the size of the step numbers does not mean the order of execution, nor does it constitute any limitation on the implementation process of the embodiments of the present application.

[0031] The present application provides a packaging structure, which can be used to package a semiconductor device and peripheral components, wherein the semiconductor device can be a power semiconductor device, and the peripheral components can be electronic components and a substrate carrying the electronic components.

[0032] Figure 1 Schematic diagram of the structure of the electronic component 220 is shown. Figure 1 The electronic component 220 includes a first electrode 223 and a second electrode 222 facing each other, and a substrate 221 located between the first electrode 223 and the second electrode 222. The first electrode 223 is exposed to the first surface 110 of the electronic component 220, and the second electrode 222 is exposed to the second surface 120 of the electronic component 220. The electronic component 220 may be a resistor, a capacitor, or an inductor. For example, in a package structure encapsulating a power semiconductor device, the electronic component 220 may be a thermistor. The thermistor transmits temperature changes within the package structure to maintain efficient and stable operation of the power semiconductor device.

[0033] The peripheral component also includes a first external terminal and a second external terminal. The first external terminal is arranged on the electronic component 220 and is electrically connected to the first electrode 223. The second external terminal is arranged on the substrate and is electrically connected to the substrate, and is further electrically connected to the second electrode 222 through the substrate. More specifically, the first external terminal includes a first part and a second part, the first part is electrically connected to the first electrode 223, the second part is connected to the first part, and extends outside the packaging structure. The second external terminal includes a third part and a fourth part, the third part is electrically connected to the substrate, and the fourth part is connected to the third part and extends outside the packaging structure. In a preferred embodiment, the first part and the second part of the first external terminal are integrally formed, and the third part and the fourth part of the second external terminal are integrally formed.

[0034] The electrical signal flows through the electronic component 220 via the first and second external terminals. For example, in the case of a thermistor, the electrical signal is input to the thermistor via one of the first and second external terminals and output via the other. For example, the thermistor may be a negative temperature coefficient (NTC) thermistor. When the temperature within the package changes, the resistance of the thermistor decreases as the temperature rises. When the input electrical signal remains unchanged, the temperature change within the package can be determined by detecting changes in the output electrical signal.

[0035] To facilitate understanding of this application, Figure 2A A top view of a peripheral component in a package structure in some embodiments of the present application is shown; Figure 2B Show Figure 2A Front view of the central peripheral assembly; Figure 2C Show Figure 2A The right side view of the peripheral components shown below. Figures 2A to 2C The packaging structure and peripheral components of the present application are further explained.

[0036] Package structure 1 is used to encapsulate a semiconductor device 10 and a peripheral component 200. The external terminals of peripheral component 200 extend from the interior of package structure 1 to the exterior of package structure 1. Specifically, the second portion 242 of first external terminal 240a and the fourth portion 244 of second external terminal 240b extend outside the package structure to facilitate receiving external input electrical signals or providing external output electrical signals. Semiconductor device 10 can be a power semiconductor device, such as a MOSFET, IGBT, diode, thyristor, or JFET device.

[0037] The peripheral component 200 includes a substrate 210, the electronic component 220 as described above, a first external terminal 240a, and a second external terminal 240b. The first external terminal 240a specifically includes a first portion 241 and a second portion 242, and the second external terminal 240b specifically includes a third portion 243 and a fourth portion 244. Figure 2C In order to more intuitively show the structure of the peripheral component 200 , the second portion 242 and the fourth portion 244 are omitted.

[0038] The electronic component 220 and the substrate 210 are stacked, and the stacking direction is the third direction, that is, Figures 2A to 2C The third direction is the Z direction or the opposite direction of the Z direction, and is also the direction between the first electrode 223 and the second electrode 222 .

[0039] The first part 241 and the third part 243 extend along the second direction. One end of the first part 241 is arranged on the electronic component 220, specifically, it can be arranged on the first surface 110, and is electrically connected to the first electrode 223. The second part 242 extends from the other end of the first part 241 in the stacking direction, that is, the third direction, and extends to the outside of the packaging structure 1. One end of the third part 243 is arranged on the substrate 210 and is electrically connected to the substrate. The fourth part 244 extends from the other end of the third part 243 in the stacking direction and extends to the outside of the packaging structure 1. The second direction is the Y direction shown in the figure or the opposite direction of the Y direction. The plane determined by the intersection of the second direction and the first direction, that is, the X direction shown in the figure or the opposite direction of the X direction is parallel to the first surface 110 and the second surface 120. In a preferred embodiment, the first direction, the second direction and the above-mentioned third direction are perpendicular to each other. For example, in Figures 2A to 2C In the illustrated embodiment, the first portion 241 and the third portion 243 are in the shape of strips extending in the second direction as a whole.

[0040] The substrate 210 is used to carry the electronic components 220. The substrate 210 is, for example, a direct bonded copper ceramic (DBC) substrate, an active metal brazing (AMB) ceramic substrate, or other types of substrates.

[0041] The second surface 120 of the electronic component 220 may be fixed on the substrate 210 via the second connection layer 232 , and the second electrode 222 exposed on the second surface 120 is electrically connected to the substrate 210 via the second connection layer 232 .

[0042] In some embodiments, the metal layer of the substrate 210 includes multiple independent and electrically insulated sub-metal layers, some of which are electrically connected to the second electrode 222 of the electronic component 220, and other sub-metal layers are electrically connected to the semiconductor device 10, especially the power semiconductor device.

[0043] The substrate 210 is further connected to one end of the third portion 243 via the third connection layer 233, thereby securing the second external terminal 240b to the substrate 210. The third connection layer 233 and the second connection layer 232 are located on the same sub-metal layer of the substrate 210, thereby electrically connecting the second external terminal 240b to the electronic component 220. Compared to traditional wirebond connections, directly securing the second external terminal 240b to the substrate 210 reduces the number of connection points between the second external terminal 240b and the substrate 210. This reduces the probability of disconnection in the electronic component 220 due to fatigue or detachment of the connection points, thereby further improving the reliability of the peripheral assembly 200.

[0044] The first portion 241 of the first external terminal 240a is fixed to the first surface 110 of the electronic component 220 via the first connection layer 231. The first electrode 223 exposed on the first surface 110 is electrically connected to the first portion 241 via the first connection layer 231. By fixing the first external terminal 240a to the electronic component 220, the number of connection points between the electronic component 220 and the first external terminal 240a can also be reduced, thereby improving the reliability of the peripheral component 200.

[0045] To achieve electrical connection between the first external terminal and the first surface 110 , between the second surface 120 and the substrate 210 , and between the second external terminal and the substrate 210 , the first connection layer 231 , the second connection layer 232 , and the third connection layer 233 should be conductive.

[0046] In some embodiments, the first connecting layer 231 and / or the second connecting layer 232 and / or the third connecting layer 233 may be a sintered structure formed by a sintering process. The constituent materials of the sintered structure are adapted to the type of electronic component 220. For example, for a negative temperature coefficient thermistor, the sintered structure may be formed by thoroughly mixing two or more metal oxides such as manganese, copper, silicon, cobalt, iron, nickel, and zinc.

[0047] In some other embodiments, the first connection layer 231 and / or the second connection layer 232 and / or the third connection layer 233 may be a welded structure formed by a welding process. For example, a copper layer with better electrical conductivity may be selected and connected to the electronic component 220 or the substrate 210 or corresponding external terminals using a welding material such as solder paste.

[0048] In some embodiments, the second connection layer 232 and the third connection layer 233 form an integral structure, and the electronic component 220 and the second external terminal 240b can be connected to the substrate 210 by coating the entire structure with a sintering material or a welding material in the same sintering or welding process. In other words, the electronic component 220 and the third portion 243 are respectively connected to different areas of the integral structure. In other embodiments, as shown in the figure, the second connection layer 232 and the third connection layer 233 are independent of each other and are not connected. The electronic component 220 and the second external terminal 240b can be connected to the substrate 210 by separately coating the electronic component 220 with a sintering material or a welding material in the same or independent sintering or welding process.

[0049] In some embodiments, as Figure 2B and Figure 2C As shown, the first part 241 is connected to the entire first surface 110 via the first connection layer 231, and the entire second surface 120 is connected to the substrate 210 via the second connection layer 232. At this time, the connection area between the first surface 110 and the first part 241 is the largest, and the connection area between the second surface 120 and the substrate 210 is the largest, which is beneficial to improving the mechanical connection strength between the first surface 110 and the first external terminal, and the mechanical connection strength between the second surface 120 and the substrate 210, thereby improving the reliability of the peripheral component 200 and the packaging structure 1.

[0050] Furthermore, the electronic component 220 is preferably a surface electrode type electronic component, such as a surface electrode type thermistor. That is, the entire first surface 110 of the electronic component 220 is the first electrode 223, and the entire second surface 120 is the second electrode 222. This maximizes the contact area between the first electrode 223 and the first portion 241, and the contact area between the second electrode 222 and the substrate 210. This improves both the mechanical connection strength and the reliability of the electrical connection.

[0051] Combine Figures 2A to 2C In a preferred embodiment, the first and third strip-shaped portions 241, 243 are aligned in a first direction, i.e., the X-direction, and the second and fourth portions 242, 244 are also aligned in the first direction. That is, in the first direction, the first and third portions 241, 243 are positioned identically relative to the substrate 210, and the second and fourth portions 242, 244 are positioned identically relative to the substrate 210. This facilitates achieving the maximum width of the first and third portions 241, 243 in the first direction. This maximum width also corresponds to the width of the electronic component 220 in the first direction. This reduces the required layout area for the first and second external terminals 240a, 240b while maintaining connection strength, facilitating miniaturization of the package structure.

[0052] Accordingly, in the second direction (i.e., the Y direction or the opposite direction of the Y direction), the length of the first portion 241 and / or the third portion 243 can be adjusted to separate the second portion 242 and the fourth portion 244 by at least a first distance w1, thereby providing a deformation margin for the second portion 242 and the fourth portion 244. The first distance w1 prevents direct contact between the second portion 242 and / or the fourth portion 244 when deformed by external forces or other factors. Similarly, in the third direction, the thickness of the first connection layer 231 can be adjusted to separate the first portion 241 and the third portion 243 by at least a third distance d1, thereby providing a deformation margin for the first portion 241 and the third portion 243 in the third direction. The third distance d1 prevents direct contact between the first portion 241 and / or the third portion 243 when deformed by external forces or other factors. Setting the first distance w1 and the third distance d1 can prevent device damage caused by shorting between two external terminals. The first distance w1 and the third distance d1 can be specifically selected in combination with the overall size requirements of the packaging structure. For example, the third distance d1 can be selected as the thickness d2 of the electronic component 220 in the third direction, and the first distance w1 can be selected as the width of the second part 242 or the fourth part 244 in the second direction.

[0053] It should be noted that the shapes and relative positions of the first external terminal 240a and the second external terminal 240b should not be limited to the above examples. Figure 3A A top view of peripheral components in a packaging structure in some other embodiments of the present application is shown; Figure 3B Show Figure 3A Front view of the central peripheral assembly; Figure 3C Show Figure 3A a right side view of the peripheral components shown; Figure 3D Show Figure 3A A top view of the first and third parts of the diagram. Figures 3A to 3D The first direction, the second direction and the third direction in Figures 2A to 2C The first direction, the second direction and the third direction are the same.

[0054] refer to Figure 3A The package structure 1 is used to encapsulate a semiconductor device 10 and a peripheral component 300. The external terminals of the peripheral component 300 extend from the interior of the package structure 1 to the exterior of the package structure 1. Specifically, the second portion 342 of the first external terminal and the fourth portion 344 of the second external terminal extend outside the package structure to receive external input electrical signals or provide external output electrical signals. The semiconductor device 10 may be a power semiconductor device.

[0055] exist Figures 3A to 3DIn the illustrated embodiment, the peripheral assembly 300 includes a substrate 210, an electronic component 220, a first external terminal 340a, and a second external terminal 340b. The first external terminal 340a may include a first portion 341 and a second portion 342, and the second external terminal 340b may include a third portion 343 and a fourth portion 344.

[0056] The substrate 210 can be electrically connected to the second electrode 222 of the electronic component 220 via the second connection layer 232, and electrically connected to the third portion 343 of the second external terminal via the third connection layer 233. The first electrode 223 of the electronic component 220 can be electrically connected to the first portion 341 of the first external terminal via the first connection layer 231. Figures 3A to 3D In the embodiment shown, the substrate 210, the electronic component 220, the first connection layer 231, the second connection layer 232 and the third connection layer 233 can be connected to the substrate 210. Figures 2A to 2C The embodiments shown are identical.

[0057] The first portion 341 and the third portion 343 extend along the second direction. One end of the first portion 341 is disposed on the first surface 110, and the second portion 342 extends from the other end of the first portion 341 in the stacking direction, i.e., the third direction, and extends outside the package structure 1. One end of the third portion 343 is disposed on the substrate 210, and the fourth portion 344 extends from the other end of the third portion 343 in the stacking direction and extends outside the package structure 1.

[0058] and Figures 2A to 2C Compared with the embodiment shown in Figures 3A to 3D In the illustrated embodiment, the first portion 341 and the third portion 343 may be in an L-shape, a quasi-L-shape, a T-shape, or a quasi-T-shape.

[0059] Specifically, taking the first portion 341 and the third portion 343 both being L-shaped as an example, Figure 3D (a) shows a top view of the first portion 341, and (b) shows a top view of the third portion 343. Figures 3B to 3D :

[0060] The first portion 341 includes a first side A1 and a second side A2 connected to each other. The first side A1 is electrically connected to the first surface 110. The second side A2 extends along the second direction. The second portion 342 extends from one end of the second side A2 away from the first side A1. Figure 3D The A3 area in the middle dotted box extends in the stacking direction, that is, the third direction.

[0061] The third portion 343 includes a third side B1 and a fourth side B2 connected to each other. The third side B1 is electrically connected to the substrate 210. The fourth side B2 extends along the second direction. The fourth portion 344 extends from the fourth side B2 away from the end of the third side B1. Figure 3D The B3 area in the middle dotted box extends in the third direction.

[0062] In some embodiments, the entire first side A1 is connected to the entire first surface 110 via the first connection layer 231 to be fixed to the first surface 110, thereby improving the connection strength between the first external terminal and the electronic component 220. The entire third side B1 is connected to the substrate 210 via the third connection layer 233 to be fixed to the substrate 210, thereby improving the connection strength between the second external terminal and the substrate 210.

[0063] In the second direction, the width h1 of the first side A1 and the width h2 of the third side B1 can be the same or different. In a preferred embodiment, the width h2 of the third side B1 in the second direction can be adjusted according to the size of the package structure 1 to improve the connection strength between the second external terminal and the substrate 210.

[0064] In some embodiments, as Figures 3A to 3D As shown, the second part 342 and the fourth part 344 are aligned in the second direction and are spaced at least a second distance w2 apart in the first direction. Specifically, the L-shaped first part 341 and the third part 343 are still taken as an example. The first side A1 and the third side B1 can be aligned in the first direction, and the second part 342 and the fourth part 344 can be aligned in the second direction by adjusting the length of the second side A2 and the fourth side B2 in the second direction. Furthermore, the above-mentioned spacing of at least the second distance w2 can be achieved by adjusting the position and width of the second side A2 and the fourth side B2 in the first direction. Therefore, the layout area required for the first external terminal 340a and the second external terminal 340b can be saved on the basis of taking into account the connection strength, which facilitates the miniaturization of the packaging structure. At the same time, a deformation margin can be left for the first external terminal 340a and the second external terminal 340b in the first direction. It should be noted that since the second part 342 and the fourth part 344 are aligned in the second direction, Figure 3B In the front view shown, the second portion 342 and the fourth portion 344 overlap in the portion indicated by the dotted line.

[0065] In the third direction, the thickness of the first connection layer 231 may be adjusted so that the first portion 341 and the third portion 343 are spaced at least by a third distance d1, thereby leaving a deformation margin for the first portion 341 and the third portion 343 in the third direction.

[0066] By setting the second distance w2 and the third distance d1, damage to the device caused by a short circuit between the two external terminals can be avoided. The second distance w2 and the third distance d1 can be specifically selected based on the overall size requirements of the package structure. For example, the third distance d1 can be selected to be the thickness d2 of the electronic component 220 in the third direction, and the second distance w2 can be selected to be the width of the second portion 342 or the fourth portion 344 in the first direction.

[0067] According to the packaging structure provided by this application, by directly placing the external terminals on the electronic component or substrate, the number of connection points between the first external terminal and the electronic component, and between the second external terminal and the substrate, can be reduced. This reduces the risk of electronic component disconnection due to disconnection or fatigue of the connection points, reduces the risk of damage to peripheral components, and helps improve the reliability of the packaging structure. Furthermore, by avoiding the use of bonding wires, the space occupied by peripheral components can be saved, which is conducive to the miniaturization of the packaging structure.

[0068] The present application also provides an electronic module. The electronic module includes at least one semiconductor device and at least one peripheral component. The electronic module also includes the aforementioned packaging structure for packaging the semiconductor device and the peripheral component. The semiconductor device may be a power semiconductor device, such as a MOSFET, an IGBT, a diode, a thyristor, a JFET, or the like. The electronic components in the peripheral component may include resistors, capacitors, inductors, and the like. Because the electronic module includes the aforementioned packaging structure, it also exhibits any of the aforementioned beneficial effects.

[0069] This application also provides a packaging method. Figure 4 A schematic flow chart of the packaging method of the present application is shown. The packaging method is used to package semiconductor devices and peripheral components. The semiconductor device may be a power semiconductor device. The packaging method can be specifically implemented to obtain the packaging structure in the above embodiment. Figure 4 , the packaging method comprises the following steps:

[0070] Step S11: Connecting the electronic components in the peripheral assembly to the substrate. The electronic components can be resistors, capacitors, or inductors, and in particular, in a package structure for packaging power semiconductor devices, the electronic components can be surface electrode type thermistors.

[0071] Electronic components such as Figure 1 As shown, the electronic component includes a first electrode and a second electrode facing each other. The first electrode is exposed to the first surface of the electronic component, and the second electrode is exposed to the second surface of the electronic component. The first and second electrodes are arranged along the stacking direction of the electronic component and the substrate, and the second electrode is electrically connected to the substrate. More specifically, the second surface of the electronic component can be fixed to the substrate via a second connecting layer, and the electrical connection between the second electrode and the substrate is achieved through the conductive second connecting layer.

[0072] In step S12, a first external terminal is provided on the electronic component, where the first external terminal is electrically connected to the first electrode. The first external terminal is secured to the first surface, for example, via a first conductive connection layer, to achieve electrical connection between the first external terminal and the first electrode. This reduces the number of connection points between the first external terminal and the first surface, thereby reducing the risk of disconnection of the electronic component due to connection point detachment or fatigue.

[0073] Step S13: providing a second external terminal on the substrate, the second external terminal being electrically connected to the substrate. The second external terminal is fixed to the substrate via a third conductive connection layer, for example, thereby reducing the number of connection points between the second external terminal and the substrate.

[0074] According to the packaging method provided by this application, by directly placing the external terminals on the electronic component or substrate, the number of connection points between the first external terminal and the electronic component, and between the second external terminal and the substrate, can be reduced. This reduces the risk of electronic component disconnection due to disconnection or fatigue of the connection points, reduces the risk of damage to peripheral components, and helps improve the reliability of the packaging structure. Furthermore, by avoiding the use of bonding wires, the space occupied by peripheral components can be saved, which is conducive to the miniaturization of the packaging structure.

[0075] The embodiments of the present application are as described above, and these embodiments do not describe all details in detail, nor do they limit the present application to specific embodiments. Obviously, based on the above description, many modifications and variations can be made. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present application, so that those skilled in the art can make good use of the present application and the modifications based on the present application. The scope of protection of the present application shall be based on the scope defined by the claims of the present application.

Claims

1. A packaging structure, wherein: The packaging structure is used to package semiconductor devices and peripheral components, and the peripheral components include: Substrate, used to carry electronic components, The electronic component comprises a first electrode and a second electrode facing each other, the first electrode and the second electrode are arranged along a stacking direction of the electronic component and the substrate, and the second electrode is electrically connected to the substrate; a first external terminal, provided on the electronic component and electrically connected to the first electrode; and The second external terminal is provided on the substrate and electrically connected to the substrate.

2. The packaging structure according to claim 1, wherein: The first external terminal includes a first portion and a second portion, the first portion is electrically connected to the first electrode, and the second portion is connected to the first portion and extends outside the packaging structure. The second external terminal includes a third portion and a fourth portion, the third portion is electrically connected to the substrate, and the fourth portion is connected to the third portion and extends outside the packaging structure.

3. The packaging structure according to claim 2, wherein: The first portion and the third portion extend along a second direction, One end of the first portion is disposed on the first electrode, and the second portion extends from the other end of the first portion toward the stacking direction. One end of the third portion is disposed on the substrate, and the fourth portion extends from the other end of the third portion toward the stacking direction.

4. The packaging structure according to claim 3, wherein: The second portion and the fourth portion are aligned in a first direction and are spaced apart by at least a first distance in the second direction.

5. The packaging structure according to claim 3, wherein: The second portion and the fourth portion are spaced apart by at least a second distance in the first direction and are aligned in the second direction.

6. The packaging structure according to any one of claims 2 to 5, wherein: In the stacking direction, the first portion and the third portion are spaced apart by at least a third distance.

7. The packaging structure according to any one of claims 2 to 5, wherein: The first portion is connected to the first electrode via a first connection layer, The second electrode is connected to the substrate via a second connection layer, The third portion is connected to the substrate via a third connection layer, wherein the second connecting layer and the third connecting layer are an integral structure; or The second connection layer and the third connection layer are independent of each other.

8. The package structure according to claim 7, wherein: The first connecting layer and / or the second connecting layer and / or the third connecting layer are / is a sintered structure; or The first connecting layer and / or the second connecting layer and / or the third connecting layer are / is a welded structure.

9. The package structure according to claim 1, wherein: The electronic components include resistors, capacitors and / or inductors, the resistors include surface electrode type thermistors, and the semiconductor devices include power semiconductor devices.

10. An electronic module, wherein: The electronic module includes at least one semiconductor device and at least one peripheral component. It also includes the packaging structure according to any one of claims 1 to 9, wherein the packaging structure is used to package the semiconductor device and the peripheral components.

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