A manufacturing method of a pseudo-rigid-flex combination plate for intelligent vehicle lights of new energy vehicles

Abstract

The application discloses a manufacturing method of a pseudo rigid-flex combination plate for an intelligent vehicle lamp of a new energy vehicle, takes a flexible copper-clad plate, manufactures a first circuit pattern containing a bonding pad, processes the bonding pad to form a top connection circuit, and forms a flexible top connection plate; takes a cover film and opens a window, and is pressed and combined to one side of the first circuit pattern, takes a rigid plate, manufactures a blind hole corresponding to the distribution position of the top connection circuit, performs whole plate electroplating to form a through blind hole, then manufactures a second circuit pattern, further manufactures a surface protection pattern layer, and forms a rigid interface plate; takes a fixing plate, and sequentially and layer by layer stacks the fixing plate, the flexible top connection plate and the rigid interface plate, and the top connection through circuit corresponds to the through blind hole; performs whole fixing, and forms the pseudo rigid-flex combination plate; the flexible top connection plate and the rigid interface plate are separately manufactured, the top connection through circuit and the through blind hole are mutually connected through the stacking fixing mode, the processing efficiency of the rigid-flex combination plate is effectively improved, the processing difficulty is reduced, and the maintenance cost of application damage is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of rigid-flexible combination board processing, in particular to a manufacturing method of a pseudo rigid-flexible combination board for a new energy vehicle intelligent vehicle lamp. BACKGROUND

[0002] A type of intelligent vehicle lamp of a new energy vehicle not only provides basic functions of lighting and turning indicator, but also can provide diversified functions such as intelligent avoidance of oncoming vehicles and human-vehicle interaction, so that an implementation mode of replacing a traditional single vehicle lamp with an LED lamp group is used to form the effect of an intelligent vehicle lamp with multiple LED arrays.

[0003] Due to the space requirement for installation and the adaptability requirement of the space structure, the LED lamp group is generally installed on a flexible circuit board, and since the intelligent vehicle lamp needs a more powerful control module than the traditional vehicle lamp, a rigid board is needed as a carrier for installing components and welding chips of the control module, and therefore, more and more application scenarios of the intelligent vehicle lamp prefer to use rigid-flexible combination boards.

[0004] A traditional rigid-flexible combination board is obtained by stacking and pressing the rigid board layer and the flexible board layer in the processing process, i.e., pressing the flexible board to the interlayer or surface of the rigid board, and then uncovering the rigid board layer of the area that needs to be flexible to expose the flexible board layer of the uncovered area, thereby forming the structure and effect of the rigid-flexible combination board.

[0005] Since the rigid board layer generally uses a board material such as epoxy resin with a low Tg value and a large expansion and contraction, and the flexible board generally uses a board material such as polyimide with a high Tg value and a small expansion and contraction, due to the differences in the performance of the board materials and other factors, the processing flow is relatively complicated and the processing difficulty is relatively large.

[0006] In addition, the flexible board layer and the rigid board layer of the formed rigid-flexible combination board are in a pressed state and are firmly bonded to form an integral structure, and in the use of the new energy vehicle, if a module has a problem (for example, after a minor collision accident, some LED lamp beads have a problem), the entire rigid-flexible combination board mold needs to be replaced, which requires a high maintenance cost, and for this problem, if a simple mathematical splitting method is used to solve the problem (for example, a large-area rigid-flexible combination board is split into several small-area rigid-flexible combination boards, which are then spliced and installed for application), the material utilization rate of the small-size rigid-flexible combination board is reduced, the processing difficulty is increased, and the welding and assembly costs are increased.

[0007] Based on the above background and problems, it is necessary to provide a manufacturing method of a pseudo rigid-flexible combination board that can realize independent splitting of the rigid board and the flexible board and effectively reduce the processing difficulty. SUMMARY

[0008] The application aims at a rigid-flexible combination board of an intelligent vehicle lamp applied to a new energy vehicle, and provides a manufacturing method of a pseudo rigid-flexible combination board of an intelligent vehicle lamp of a new energy vehicle to solve the problems of high processing difficulty and high maintenance cost if damaged.

[0009] S10: take a flexible copper-clad plate stacked by a first copper layer and a first insulating medium layer, which includes a plug-in area and a flexible circuit pattern area in other areas; make a first circuit pattern including a pad on the first copper layer to form a flexible pattern plate, and the pad is located in the plug-in area; process the pad to form a top connection circuit, and the height of the top connection circuit is higher than that of the first circuit pattern; and form a top connection circuit core plate;

[0010] S20: take a cover film, make a cover film opening window pattern corresponding to the top connection circuit to form an opening window cover film, and press the opening window cover film to one side of the first circuit pattern to form a top connection conductive circuit; and form a flexible top connection plate;

[0011] S30: take a rigid plate stacked by a second copper layer and a second insulating medium layer, which includes an interface area and a rigid circuit pattern area in other areas; make a blind hole corresponding to the distribution position of the top connection circuit to the interface area to form a rigid blind hole plate; perform plate electroplating on the rigid blind hole plate, the blind hole forms a conductive blind hole, and the diameter of the opening end of the conductive blind hole is greater than that of the top end of the top connection conductive circuit; then make a second circuit pattern on the second copper layer, make a surface protection pattern layer on the surface of the second circuit pattern, and form a rigid interface plate;

[0012] S40: take a fixed plate, stack the fixed plate, the flexible top connection plate and the rigid interface plate in sequence, and the top connection conductive circuit corresponds to the conductive blind hole; then perform overall fixing; and form the pseudo rigid-flexible combination board.

[0013] Further, forming the flexible top connection plate includes: stacking the opening window cover film to one side of the first circuit pattern to form a stacking plate structure; and sequentially arranging a first release film and a first steel plate outward from one side of the top connection circuit core plate; sequentially arranging a second release film, a cover film, a third release film and a second steel plate outward from one side of the opening window cover film; form an arrangement structure; and press the arrangement structure to form the flexible top connection plate.

[0014] Further, forming the top connection circuit includes: attaching a dry film to one side of the first circuit pattern, making a dry film opening window pattern corresponding to the pad, and forming a dry film pattern plate; electroplating the dry film pattern plate, the pad is electroplated to form a copper column with a height higher than that of the first circuit pattern, then remove the dry film, and the pad forms the top connection circuit.

[0015] Further, the thickness of the dry film is greater than the thickness of the cover film.

[0016] Further, after forming the flexible top interconnection plate, the flexible top interconnection plate is micro-etched.

[0017] Optionally, forming the top interconnection circuit includes: making a stamping die, the stamping die includes a top die and a bottom die, the surface of the top die is provided with a raised punch pin corresponding to the pad; the bottom die is provided with a buffer pad on the side facing the top die; the flexible graphic plate is arranged between the top die and the buffer pad, the pad faces the buffer pad, and the punch pin faces the flexible graphic plate; stamping processing is performed; and the pad is formed into the top interconnection circuit through stamping.

[0018] Further, the material of the fixing plate is stainless steel, aluminum, iron, copper, epoxy resin, PP, PVC, PTFE or PET.

[0019] Further, the overall formation of the pseudo rigid-flexible combination plate includes: taking a fixing plate, making a fixing plate fixing hole on the fixing plate; making a flexible plate fixing hole on the plug-in area; making a rigid plate fixing hole on the interface area; the sequential layer-by-layer stacking includes sequentially aligning and layer-by-layer stacking the fixing plate fixing hole, the flexible plate fixing hole and the rigid plate fixing hole to form a stacked hole, and the whole plate is formed into a layer-by-layer stacking structure; and the fixing includes fixing the layer-by-layer stacking structure through the stacked hole by using screws, pins, rivets or glue pouring.

[0020] Further, the fixing plate and the flexible top interconnection plate are adhered through a glue layer.

[0021] Optionally, the overall formation of the layout structure includes: arranging a filling glue layer or a second cover film between the top interconnection circuit core plate and the first release film.

[0022] The technical scheme of the present application forms a top interconnection circuit on a flexible top interconnection plate (i.e., a flexible plate) and a conductive blind hole on a rigid interface plate (i.e., a rigid plate), matches the top interconnection circuit and the conductive blind hole, uses a fixing plate as an auxiliary layer to firmly fix the flexible top interconnection plate and the rigid interface plate to each other, forms a pseudo rigid-flexible combination plate, separately makes the flexible plate and the rigid plate without using the traditional rigid-flexible combination plate making method, greatly reduces the processing difficulty of the plate body, improves the processing efficiency, and uses a simple stacking method to connect and conduct the flexible plate and the rigid plate through the top interconnection circuit corresponding to the conductive blind hole, forms a plate body structure that can be simply disassembled, and in the application process, if the flexible plate is damaged, the flexible plate module can be simply replaced, if the rigid plate is damaged, the rigid plate module can be simply replaced, and the maintenance cost is greatly reduced. BRIEF DESCRIPTION OF DRAWINGS

[0023] The technical solutions in the embodiments of the present application or the prior art will be clearly and completely described below with reference to the accompanying drawings that need to be used in the embodiments or the prior art description. Obviously, the accompanying drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by one of ordinary skill in the art without any creative effort based on the structures shown in the drawings.

[0024] Figure 1 A main process flowchart of the embodiment of the present application;

[0025] Figure 2 A sectional structure schematic diagram of the flexible graphic board of the embodiment of the present application;

[0026] Figure 3 A sectional structure schematic diagram of the electroplated copper column board of the embodiment of the present application;

[0027] Figure 4 A sectional structure schematic diagram of the top contact line core board of the embodiment of the present application;

[0028] Figure 5 A sectional structure schematic diagram of the press-fit layout structure of the embodiment of the present application;

[0029] Figure 6 A sectional structure schematic diagram of the press-fit board of the embodiment of the present application;

[0030] Figure 7 A sectional structure schematic diagram of the flexible top contact board of the embodiment of the present application;

[0031] Figure 8 A sectional structure schematic diagram of the rigid blind hole board of the embodiment of the present application;

[0032] Figure 9 A sectional structure schematic diagram of the rigid conductive blind hole board of the embodiment of the present application;

[0033] Figure 10 A sectional structure schematic diagram of the rigid interface board of the embodiment of the present application; Figure 9

[0034] Figure 11 A sectional structure schematic diagram of the false rigid-flex combination board of the embodiment of the present application;

[0035] Figure 12 A sectional structure schematic diagram of the false rigid-flex combination board of the embodiment of the present application;

[0036] Figure 13 A sectional structure schematic diagram of the false rigid-flex combination board of the embodiment of the present application; Figure 12

[0037] ​​Figure 14 A cross-sectional structure schematic diagram of a stamping layout structure of an embodiment of the present application;

[0038] Figure 15 A cross-sectional structure schematic diagram of another top contact line core board of an embodiment of the present application.

[0039] Explanation of reference numerals:

[0040] 10~flexible graphic board; 110~first line pattern; 1110~solder pad; 120~first insulating medium layer; 20~electroplated copper column board; 210~copper column; 220~dry film; 30~top contact line core board; 310~top contact line; 40~layout structure; 400~stacked layout structure; 410~windowed cover film; 400A~first compression auxiliary structure; 420~first release film; 430~first steel plate; 400B~second compression auxiliary structure; 440~second release film; 450~cover film; 460~third release film; 470~second steel plate; 50~flexible top contact board; 320~top contact via line; 50A~flexible top contact etching board; 3110~top contact etching line; 60~rigid blind hole board; 610~second copper layer; 620~second insulating medium layer; 630~blind hole; 640~via blind hole; 650~second line pattern; 650A~inner layer line; 70~rigid via blind hole board; FD~enlarged area; 80~rigid interface board; 810~surface protection pattern layer; 90~pseudo rigid-flex combination board; 910~fixing plate; 920~screw; 40A~stamping layout structure; 4110A~top mold; 4111A~punch pin; 4120A~bottom mold; 4130A~cushion pad; 30A~another top contact line core board; 310A~another top contact line.

[0041] The implementation, functional features and advantages of the embodiments of the present application will be further described with reference to the accompanying drawings in conjunction with the embodiments. DETAILED DESCRIPTION

[0042] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the present application.

[0043] It should be noted that all directionality indications (such as up, down, left, right, front, back, inside, outside, etc.) in the embodiments of the present application are only used to explain the relative positional relationship, movement condition, etc. between components in a certain specific posture (as shown in the drawings), and if the specific posture changes, the directionality indications also change accordingly.

[0044] In addition, the descriptions such as "first", "second" and the like in the present application are only for the purpose of description, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features; therefore, the features defined with "first", "second" can be explicitly or implicitly included at least one of the features; in the description of the present application, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise explicitly and specifically limited.

[0045] In addition, the technical solutions among various embodiments of the present application can be combined with each other, but it must be based on the fact that a person skilled in the art can realize it, when the combination of technical solutions appears contradictory or cannot be realized, it should be considered that the combination of technical solutions does not exist, nor within the protection scope required by the present application.

[0046] Please refer to Figure 1 , Figure 1 The main process flowchart included in the embodiment of the present application.

[0047] The overall process of the present embodiment is to separately manufacture the flexible top interface plate 50 (i.e. the flexible plate in the rigid-flexible combined plate) and the rigid interface plate 80 (i.e. the rigid plate in the rigid-flexible combined plate), set the top interface conductive circuit 320 on the flexible top interface plate 50, and correspondingly set the conductive blind hole 640 (i.e. the interface circuit) on the rigid interface plate 80, then stack the flexible top interface plate 50 and the rigid interface plate 80, the top interface conductive circuit 320 corresponds to the conductive blind hole 640, and then set the fixing plate 910 to fix the whole, forming a pseudo rigid-flexible combined plate 90.

[0048] The implementation process of the embodiment of the present application includes Figure 1 The process flow listed will be described in detail in the following steps.

[0049] Please refer to Figure 2 , Figure 3 and Figure 4 ; Figure 2 The cross-sectional structure diagram of the flexible graphic plate of the embodiment of the present application; Figure 3 The cross-sectional structure diagram of the copper-plated column plate of the embodiment of the present application; Figure 4 The cross-sectional structure diagram of the top interface circuit core plate of the embodiment of the present application.

[0050] Step S10:

[0051] Take the flexible copper-clad plate with the first copper layer and the first insulating medium layer 120, which includes a plug-in area and other areas as flexible circuit pattern areas; make the first circuit pattern 110 including the pad 1110 on the first copper layer to form the flexible pattern plate 10, and the pad 1110 is located in the plug-in area; process the pad 1110 to form the top contact circuit 310, and the height of the top contact circuit 310 is higher than that of the first circuit pattern 110; and form the top contact circuit core plate 30.

[0052] In this embodiment, the pad 1110 is first made, and then the top contact circuit 310 is formed, thereby forming the conduction basis for subsequent lamination installation.

[0053] In one embodiment of the present application, forming the top contact circuit 310 includes: attaching the dry film 220 to one side of the first circuit pattern 110, making a dry film window pattern corresponding to the pad 1110, and forming a dry film pattern plate; electroplating the dry film pattern plate, electroplating the pad 1110 to form a copper column 210 with a height higher than that of the first circuit pattern 110, forming an electroplated copper column plate 20, and then removing the dry film 220 to form the top contact circuit 310, and forming the top contact circuit core plate 30.

[0054] In this embodiment, the dry film pattern making method is used in combination with the electroplating method to thicken the pad 1110 by electroplating, thereby forming the copper column 210 protruding from the first circuit pattern 110, and further forming the top contact circuit 310 to make the contact circuit of the flexible top contact plate 50.

[0055] Optionally, the dry film 220 is an anti-electroplating dry film, which can effectively resist the impact of electroplating and prevent the dry film 220 from falling off during electroplating of the precise pad 1110.

[0056] Please refer to Figure 5 , Figure 6 and Figure 7 ; Figure 5 for the cross-sectional structure diagram of the pressing layout structure of the embodiment of the present application; Figure 6 for the cross-sectional structure diagram of the pressing plate of the embodiment of the present application; Figure 7 for the cross-sectional structure diagram of the flexible top contact plate of the embodiment of the present application.

[0057] Step S20:

[0058] Take the cover film, make a cover film window pattern corresponding to the top contact circuit 310, form the windowed cover film 410, press the windowed cover film 410 to one side of the first circuit pattern 110, and form the top contact conduction circuit 320 of the top contact circuit 310; and form the flexible top contact plate 50.

[0059] In one embodiment, the flexible top-plate 50 is formed by: stacking the windowing cover film 410 to one side of the first circuit pattern 110 to form a stacking plate structure 400; and sequentially arranging the first release film 420 and the first steel plate 430 to one side of the top-plate circuit core 30 outwardly to form a first pressing auxiliary structure 400A; sequentially arranging the second release film 440, the cover film 450, the third release film 460, and the second steel plate 470 to one side of the windowing cover film 410 outwardly to form a second pressing auxiliary structure 400B; forming an overall layout structure 40; and pressing the layout structure 40 to form the flexible top-plate 50.

[0060] When pressing the cover film, the top-plate circuit 310 exists and needs to ensure that the characteristics thereof are not changed, and thus different pressing auxiliary structures need to be used. The key factor is that the cover film 450 is arranged to one side of the first circuit pattern 110 (i.e., one side of the windowing cover film 410), and the cover film 450 is not arranged to one side of the top-plate circuit core 30. The rigidity of the first pressing auxiliary structure 400A is stronger than that of the second pressing auxiliary structure 400B, and the cover film 450 can provide a good buffering effect for the top-plate circuit 310 during pressing to prevent the top-plate circuit 310 from being bent or broken.

[0061] Optionally, the material of the cover film 450 is a silica gel pad, a PET film, a PP film, an epoxy resin plate, a PI film, or a polyolefin film.

[0062] In one embodiment, the thickness of the dry film 220 is greater than the thickness of the cover film, i.e., greater than the thickness of the windowing cover film 410.

[0063] Under this condition, the height of the copper pillar 210 after electroplating is higher than the height of the windowing cover film 410, so that after the cover film is attached, the height of the top-plate conductive circuit 320 is higher than the height of the windowing cover film 410, thereby providing a height basis of the top-plate conductive circuit 320 for subsequent installation.

[0064] Optionally, the height of the top-plate conductive circuit 320 exposed after pressing the windowing cover film 410 is 25 μm to 0.1 mm higher than the surface of the windowing cover film 410; and the appropriate height can better match the subsequent installation and contact with the conductive blind hole 640.

[0065] In one embodiment of the present application, after the flexible top plate 50 is formed, micro-etching is performed to form a flexible top micro-etching plate 50A. The micro-etching not only trims the surface of the top conducting line 320 to remove unevenness and other textures on the surface, but also forms a top micro-etching line 3110 in the shape of a truncated cone after micro-etching of the top conducting line 320. The surface of the top micro-etching line 3110 is smoother, and the structure is convenient for subsequent docking with the rigid interface plate 80.

[0066] It should be noted that, in one embodiment, the windowed cover film 410 can be first laminated to the top line core plate 30, and then a dry film 220 is attached to the surface of the windowed cover film 410 to form a dry film windowing pattern. After that, electroplating is performed to form the copper column 210. This method of manufacture helps to reduce the difficulty of lamination of the windowed cover film 410, but due to the expansion and contraction of the plate body after lamination, the processing precision of the dry film windowing pattern is reduced, which leads to a decrease in the electroplating processing precision and quality. That is, this method is more suitable for situations with relatively low line layout density and relatively low precision requirements, compared to the method of first electroplating and then laminating the windowed cover film 410.

[0067] Please refer to Figure 8 , Figure 9 , Figure 10 and Figure 11 ; Figure 8 is a cross-sectional structure schematic diagram of a rigid blind hole plate of an embodiment of the present application; Figure 9 is a cross-sectional structure schematic diagram of a rigid conducting blind hole plate of an embodiment of the present application; Figure 10 is a structure schematic diagram of an enlarged area of Figure 9 ; Figure 11 is a cross-sectional structure schematic diagram of a rigid interface plate of an embodiment of the present application;

[0068] Step S30:

[0069] Take a rigid plate with a second copper layer 610 and a second insulating medium layer 620 laminated, which includes an interface area and other areas as rigid line pattern areas. Blind holes 630 are made in the interface area of the rigid plate corresponding to the distribution position of the top line 310, and the whole plate forms a rigid blind hole plate 60. The blind holes 630 are made by laser drilling or drilling countersunk holes. The whole plate is electroplated, and the blind holes 630 form conducting blind holes 640 (see the diagram of the enlarged area FD). The diameter of the opening end of the conducting blind hole 640 is larger than the diameter of the top end of the top conducting line 320. The whole plate forms a rigid conducting blind hole plate 70. Then, a second line pattern 650 is made on the second copper layer 610, and a surface protection pattern layer 810 is made on the surface of the second line pattern 650 to form a rigid interface plate 80. The surface protection pattern layer 810 is generally a solder mask pattern layer.

[0070] The rigid plate is made with the through blind hole 640, which can match the top contact through circuit 320 of the flexible top contact plate 50, and form the subsequent effective laminated contact through effect.

[0071] Optionally, after the flexible top contact plate 50 is formed, surface treatment is performed on the flexible top contact plate 50, and preferably, electroplated gold surface treatment is performed, so that the top contact through circuit 320 is covered with a surface treatment layer; after the rigid interface plate 80 is formed, surface treatment is also performed on the rigid interface plate 80, and preferably, electroplated gold surface treatment is performed, so that the through blind hole 640 is covered with a surface treatment layer. The surface treatment layer (especially the electroplated gold layer) can effectively protect the circuit copper layer, prevent the copper layer from being oxidized and damaged, and because the top contact through circuit 320 and the through blind hole 640 are in contact with each other in the embodiment, the electroplated gold layer has good wear resistance and good through performance.

[0072] It is worth noting that if the rigid plate is a multilayer plate, the internal layer circuit 650A is made inside, and the through blind hole 640 can be interconnected with the internal layer circuit 650A; the through blind hole 640 can not only provide mutual contact through with the top contact through circuit 320, but also form a high-density interconnection connection effect between the internal layer circuit 650A, further improve the density of the plate body, and improve the intelligent space density of the plate body.

[0073] If the precision requirement is high or the wiring density is high, the blind hole 630 is preferably processed by laser drilling, and the copper layer corresponding to the position of the blind hole 630 of the second copper layer 610 can be etched off, and then the second insulating medium layer 620 at the etching position can be drilled off by laser drilling to form the blind hole 630; if the processing precision requirement is low, the blind hole 630 can be drilled by a mechanical drilling method.

[0074] The diameter of the opening end of the through blind hole 640 is greater than the diameter of the top end of the top contact through circuit 320, and when the subsequent laminated plate is fixed, the top contact through circuit 320 can be inserted into the through blind hole 640, so that the combination of the two is more firm and accurate, and problems such as poor contact due to vibration and shaking during application are avoided.

[0075] Please refer to Figure 12 , Figure 13 ; Figure 12 is a cross-sectional structure diagram of a pseudo-rigid-flex combination plate according to the embodiment of the present application; Figure 13 is a planar structure diagram corresponding to Figure 12 .

[0076] Step S40:

[0077] Take the fixed plate 910, the fixed plate 910, the flexible top plate 50 and the rigid interface plate 80 are stacked in turn, and the top plate 320 is correspondingly connected to the blind hole 640. Then fix it as a whole; The whole forms a pseudo rigid-flexible combination plate 90.

[0078] Because the plate body of the flexible top plate 50 is relatively soft, the fixed plate 910 is arranged to clamp and fix the flexible top plate 50 with the rigid interface plate 80, thereby providing stronger and more secure fixing effect for the contact point of the top plate 320 and the blind hole 640, preventing loose fixing from causing open circuit and other problems during application.

[0079] In one embodiment, the material of the fixed plate 910 is stainless steel, aluminum, iron, copper, epoxy resin, PP, PVC, PTFE or PET; Such hard materials can form the fixed plate 910, which is selected according to actual application requirements.

[0080] In one embodiment, the whole pseudo rigid-flexible combination plate 90 includes: taking the fixed plate 910, making the fixed plate fixed hole on the fixed plate 910; And making flexible plate fixed hole on the plug-in area; Make rigid plate fixed hole on the interface area; In turn, the fixed plate fixed hole, the flexible plate fixed hole and the rigid plate fixed hole are aligned and stacked in layers to form a stacked hole, and the whole plate is formed into a stacked structure; Fixing includes using screws 920, pins, rivets or glue to fix the stacked structure through the stacked hole.

[0081] Punching each layer of plate body and then fixing with screws 920, pins, etc. can effectively enhance the firmness of the fixing and improve the reliability of the plate body. Alternatively, several fixed holes of each plate body are dispersed on each plate body to form different point fixings.

[0082] In one embodiment, the fixed plate 910 and the flexible top plate 50 are adhered by a glue layer. Alternatively, the glue layer is epoxy resin glue or acrylic glue.

[0083] The fixed plate 910 can be directly adhered to the surface of the flexible top plate 50 to form a flexible plate reinforcing effect, improve the strength of the plug-in area of the flexible top plate 50, and make the stacked fixing more secure.

[0084] It is worth noting that the flexible top plate 50 and the rigid interface plate 80 can be welded and mounted with electronic components respectively, and then fixed, for example: for the pseudo rigid-flexible combination plate 90 of the intelligent car lamp, the LED lamp group can be welded to the flexible top plate 50, and the electronic components such as control chip can be welded to the rigid interface plate 80, and then the above fixing and installation is performed to form a circuit board application module.

[0085] Please refer to Figure 14 ,Figure 15 ; Figure 14 A cross-sectional structure diagram of a stamping layout structure of an embodiment of the present application; Figure 15 A cross-sectional structure diagram of another top contact line core board of an embodiment of the present application.

[0086] In another embodiment, forming another top contact line 310A includes: making a stamping die, the stamping die including a top die 4110A and a bottom die 4120A, the surface of the top die 4110A being provided with a raised punch pin 4111A corresponding to the pad 1110; the bottom die 4120A being provided with a buffer pad 4130A facing the top die 4110A; disposing the flexible graphic board 10 between the top die 4110A and the buffer pad 4130A, the pad 1110 facing the buffer pad 4130A, and the punch pin 4111A facing the flexible graphic board 10, which forms a stamping layout structure 40A; performing stamping processing; the pad 1110 is formed into another top contact line 310A through stamping; and the whole board is formed into another top contact line core board 30A.

[0087] Since the first copper layer and the first insulating medium layer 120 are both relatively soft and have good ductility, in the case of relatively low requirements for wiring density and processing precision, the stamping method can be used to form another top contact line 310A, the punch pin 4111A is not a non-knife type but a film pressing type, and the stamping processing causes the first copper layer and the first insulating medium layer 120 to be pressed to a certain protrusion, and after further pressing the window covering film 410, the top contact line 320 can also be formed.

[0088] The buffer pad 4130A can provide good buffering and stamping buffer layer effect during the stamping of another top contact line 310A.

[0089] In another embodiment, the whole stamping layout structure 40 includes: disposing a filling adhesive layer or a second covering film between another top contact line core board 30A and the first release film 420, and optionally, the adhesive layer is epoxy resin adhesive or acrylic adhesive.

[0090] Since the stamping method is used, the side of another top contact line core board 30A that is stamped will be recessed, so the adhesive layer or the second covering film can be pressed to the plug-in area during pressing, filling the recess, balancing the board, and providing reliable support for another top contact line 310A to prevent problems such as line collapse during subsequent application.

[0091] It is worth noting that the adhesive layer can also be disposed between the fixing plate 910 and another top contact line core board 30A.

[0092] ​It is worth mentioning that, due to the fact that the circuit board in the actual design and processing process is more precise, the actual structure diagram and the thickness between layers, the line width and other sizes are micron level, for example, the thickness of each layer is generally 5-50 μm, if the attached drawings of the specification are made according to the actual proportion, there is a problem of unclear illustration, therefore, in order to more clearly represent the implementation process of the manufacturing method, the drawings of the embodiment are schematic diagrams of the technical features, which do not represent the size of the actual structure diagram, nor represent the enlarged diagram of the actual structure diagram in proportion.

[0093] The above is only the preferred embodiment of the present application, and does not limit the patent scope of the present application, and any equivalent structural transformation made under the inventive concept of the present application, using the content of the specification and drawings, or directly / indirectly applied in other related technical fields is included in the patent protection scope of the present application.

Claims

1. A method for manufacturing a pseudo-rigid-flex combination plate for an intelligent vehicle light of a new energy vehicle, characterized in that, The manufacturing method comprises the following steps: S10: taking a flexible copper-clad plate with a first copper layer and a first insulating medium layer, which comprises a plug-in area and a flexible circuit pattern area; manufacturing a first circuit pattern comprising a pad on the first copper layer to form a flexible pattern plate, wherein the pad is located in the plug-in area; processing the pad to form a top connection circuit, wherein the height of the top connection circuit is higher than that of the first circuit pattern; and forming a top connection circuit core plate; S20: taking a cover film, manufacturing an opening window pattern on the cover film corresponding to the top connection circuit to form an opening window cover film, and pressing the opening window cover film to one side of the first circuit pattern to form a top connection conductive circuit; and forming a flexible top connection plate; S30: taking a rigid plate with a second copper layer and a second insulating medium layer, which comprises an interface area and a rigid circuit pattern area; manufacturing a blind hole in the interface area corresponding to the distribution position of the top connection circuit to form a rigid blind hole plate; performing electroplating on the rigid blind hole plate, wherein the blind hole forms a conductive blind hole, and the diameter of the opening end of the conductive blind hole is greater than that of the top end of the top connection conductive circuit; then manufacturing a second circuit pattern on the second copper layer, manufacturing a surface protection pattern layer on the surface of the second circuit pattern, and forming a rigid interface plate; S40: taking a fixing plate, stacking the fixing plate, the flexible top connection plate and the rigid interface plate in sequence, wherein the top connection conductive circuit corresponds to the conductive blind hole; then performing overall fixing; and forming the pseudo rigid-flexible combination plate.

2. The method for manufacturing a pseudo-rigid-flex combined plate for an intelligent vehicle light of a new energy vehicle according to claim 1, characterized in that, Forming the flexible top connection plate comprises the following steps: stacking the opening window cover film to one side of the first circuit pattern to form a stacking plate structure; sequentially arranging a first release film and a first steel plate outward from one side of the top connection circuit core plate; sequentially arranging a second release film, a cover film, a third release film and a second steel plate outward from one side of the opening window cover film; forming an arrangement structure; and pressing the arrangement structure to form the flexible top connection plate.

3. The method for manufacturing a pseudo-rigid-flex combined plate for an intelligent vehicle light of a new energy vehicle according to claim 2, characterized in that, Forming the top connection circuit comprises the following steps: attaching a dry film to one side of the first circuit pattern, manufacturing a dry film opening window pattern corresponding to the pad, and forming a dry film pattern plate; electroplating the dry film pattern plate, wherein the pad is electroplated to form a copper column with a height higher than that of the first circuit pattern; then removing the dry film, and the pad forms the top connection circuit.

4. The method for manufacturing the pseudo-rigid-flex combined plate for the intelligent vehicle light of the new energy vehicle according to claim 3, characterized in that, The thickness of the dry film is greater than that of the cover film.

5. The method for manufacturing the pseudo-rigid-flex combined plate for the intelligent vehicle light of the new energy vehicle according to claim 3, characterized in that, After forming the flexible top connection plate, micro-etching is performed on the flexible top connection plate.

6. The method for manufacturing a pseudo-rigid-flex combined plate for an intelligent vehicle light of a new energy vehicle according to claim 2, characterized in that, Forming the top connection circuit comprises the following steps: manufacturing a stamping die, wherein the stamping die comprises a top die and a bottom die, the surface of the top die is provided with a protruding punch pin corresponding to the pad, and the bottom die is provided with a buffer pad on the side facing the top die; arranging the flexible pattern plate between the top die and the buffer pad, wherein the pad faces the buffer pad and the punch pin faces the flexible pattern plate; and performing stamping processing; the pad is stamped to form the top connection circuit.

7. The method for manufacturing a pseudo-rigid-flex combination plate for an intelligent vehicle light of a new energy vehicle according to claim 1, characterized in that, The material of the fixing plate is stainless steel, aluminum, iron, copper, epoxy resin, PP, PVC, PTFE or PET.

8. The method for manufacturing a pseudo-rigid-flex combined plate for an intelligent vehicle light of a new energy vehicle according to claim 1, characterized in that, The whole formation of the false rigid-flexible combined plate comprises: taking a fixed plate, making fixed plate fixing holes on the fixed plate, and making flexible plate fixing holes on the plug-in area; making rigid plate fixing holes on the interface area; the sequential layer-by-layer stacking comprises: sequentially aligning and layer-by-layer stacking the fixed plate fixing holes, the flexible plate fixing holes and the rigid plate fixing holes to form a stacking hole, and forming a layer-by-layer stacking structure; the fixing comprises: fixing the layer-by-layer stacking structure through the stacking hole by using screws, pins, rivets or glue pouring.

9. The method for manufacturing a pseudo-rigid-flex combination plate for an intelligent vehicle light of a new energy vehicle according to claim 1, characterized in that, The fixed plate and the flexible top cover plate are adhered through a glue layer.

10. The method for manufacturing a pseudo-rigid-flex combined plate for an intelligent vehicle light of a new energy vehicle according to claim 6, characterized in that, The whole formation of the layout structure comprises: arranging a filling glue layer or a second covering film between the top cover circuit core plate and the first release film.

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