Preparation method of semiconductor packaging structure

Abstract

The invention provides a preparation method of a semiconductor packaging structure, and relates to the technical field of semiconductor packaging, and the method comprises the following steps: S1, covering a crystal plate with fluorescent glue, and cutting a plurality of fluorescent glue films on the fluorescent glue; s2, a defoaming glue discharging device is used for conducting glue dispensing on the multiple fluorescent glue films; (S3); enabling the top of the LED chip to be in contact with the dispensing glue, pressing the LED chip, standing for 3-5min, and then drying; s4, a blue film adhesive tape is attached to the bottom of the LED chip, so that the LED chip, the dispensing adhesive and the fluorescent adhesive film are separated from the crystal plate, and mold reversing is carried out; s5, carrying out die bonding on the LED chip on the substrate, filling white glue between the dispensing glue and the substrate, and carrying out injection molding to form a lens; and S6, segmenting the plurality of LED chips. By arranging the defoaming glue discharging device, the quantity of glue can be strictly controlled, and waste and optical pollution caused by excessive overflow of glue liquid to a cutting channel are avoided; in addition, bubbles in the glue solution can be treated, and the problem of uneven light refraction caused by the bubbles is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to a method for preparing a semiconductor packaging structure. Background Art

[0002] The LED semiconductor chip is the core component of a light-emitting diode (LED). Its core structure is a PN junction, composed of P-type and N-type semiconductors, connected to external P-pole (anode) and N-pole (cathode) electrodes. It is made by growing epitaxial layers on substrates such as sapphire and silicon, which determine the wavelength and efficiency of the light. The principle of light emission is that when current passes through the PN junction, electrons and holes recombine to release energy in the form of photons. The color of the light is determined by the energy band gap of the semiconductor material. Its high efficiency, energy saving, long life, and fast response make it widely used in lighting, display, backlighting and other fields.

[0003] For example, the patent application with publication number CN 115425124 A discloses a method for preparing a flip-chip white light LED package structure, comprising the following steps: Step S1: applying a fluorescent glue film to a wafer substrate; Step S2: pre-cutting the fluorescent glue, and separating a plurality of fluorescent films on the fluorescent glue by cutting lines formed by the pre-cutting; Step S3: applying transparent silicone glue on the upper side of the fluorescent films... Step S10: cutting the substrate in units of one LED chip to separate the individual LED chips and form a plurality of flip-chip white light LED package structures.

[0004] However, the above patent is prone to the following problems when dispensing glue: 1) If too much glue is dispensed, the glue will overflow into the cutting path, which will not only waste materials but also may penetrate into the LED light-emitting area and affect the optical performance; 2) If too little glue is dispensed, when the LED chip contacts the transparent silicone, if the surrounding area is not completely covered, the heat generated by the chip will be directly transferred to the fluorescent film, accelerating the light decay phenomenon; 3) If there are too many bubbles, the transparent silicone will reflect light due to uneven refraction, resulting in inconsistent brightness distribution of the light source, affecting the uniformity of light output. Summary of the Invention

[0005] The present invention provides a method for preparing a semiconductor packaging structure to solve at least one of the problems raised in the above background technology.

[0006] To solve the above technical problems, the present invention discloses a method for preparing a semiconductor packaging structure, comprising the following steps: S1: covering a crystal plate with fluorescent glue, and cutting a plurality of fluorescent glue films on the fluorescent glue; S2: dispensing the plurality of fluorescent glue films using a defoaming glue dispensing device;

[0007] S3: Contact the top of the LED chip with the glue, press the LED chip, let it stand for 3-5 minutes and then dry it; S4: Apply blue film tape to the bottom of the LED chip to separate the LED chip, glue and fluorescent film from the crystal plate, and then perform a mold reversal; S5: Fix the LED chip to the substrate, fill the space between the glue and the substrate with white glue, and then use injection molding to form a lens; S6: Segment multiple LED chips.

[0008] Preferably, the thickness of the crystal plate is 500-800 μm, and the surface adhesion is 50-150 gf / 25 mm width.

[0009] Preferably, in step S2, the defoaming and glue discharging device includes a base plate, a glue storage box is fixedly arranged on the base plate, a drive box is fixedly arranged on the glue storage box, one side of the glue storage box is connected to a glue discharging channel, the other end of the glue discharging channel is connected to a glue discharging pipe, and the glue discharging pipe passes through the base plate.

[0010] Preferably, a motor is fixedly installed in the driving box, and the lower output end of the motor is fixedly connected to a rotating rod, a gear 1 is fixedly installed on the rotating rod, and a gear 2 is meshed with the gear 1, and a rotating shaft is fixed through the gear 2, and the rotating shaft rotates and extends into the glue storage box, and the lower end of the rotating shaft is fixedly connected to a threaded rod, and a filter plate is threadedly connected to the threaded rod, and the filter plate is slidably connected to the inner wall of the glue storage box.

[0011] Preferably, a raised portion is symmetrically fixedly provided on the rotating shaft, a mounting block is slidably mounted on the raised portion, a through pipe is symmetrically rotatably connected to the mounting block, the other end of the through pipe is fixedly connected to an adsorption cylinder, and a groove is provided on the adsorption cylinder.

[0012] Preferably, a concave cavity is provided in the rotating shaft, a removable end cover is provided at the upper end of the concave cavity, the concave cavity is filled with a defoaming agent, through grooves are symmetrically provided on the rotating shaft, and a first channel is symmetrically provided on the mounting block, the first channel cooperates with the through groove, and the first channel is connected to the through pipe.

[0013] Preferably, an annular groove with an opening at the lower end is provided on the mounting block, the annular groove is connected to the first channel, an elastic member is symmetrically fixedly arranged in the annular groove, the lower end of the elastic member is fixedly connected to a stopper, the stopper is slidably connected to the annular groove, a second channel is provided through the stopper, and the second channel cooperates with the first channel; a sleeve is fixedly provided on the filter plate, the sleeve is sleeved on the threaded rod, and the sleeve cooperates with the annular groove.

[0014] Preferably, an opening is provided on one side wall of the drive box, gear one extends out of the drive box from the opening, a fixed plate is fixedly provided on one side wall of the glue storage box, a rotating rod is fixedly provided on the fixed plate, gear three is fixedly provided on the upper end of the rotating rod, and gear three is meshed and connected with gear one.

[0015] Preferably, a rotating shaft is provided on the glue outlet channel for rotation and penetration, a limiting block is fixedly provided on the rotating shaft, the limiting block is provided in the glue outlet channel, the limiting block is used to control the on and off of the glue outlet channel, a glue machine is also provided in the glue outlet channel, a matching wheel is fixedly provided on the upper end of the rotating shaft, a cam is fixedly provided on the rotating rod, the cam cooperates with the matching wheel, and a torsion spring is provided at the connection position between the rotating shaft and the glue outlet channel.

[0016] Preferably, the rotating shaft rotates through the bottom plate, and a gear four is fixedly provided at the lower end of the rotating shaft. A funnel-shaped cavity is provided in the glue outlet pipe, and the funnel-shaped cavity is connected with the glue outlet channel. A baffle is slidably inserted on the glue outlet pipe, and the baffle is used to control the on and off of the funnel-shaped cavity. A tooth plate is fixedly provided on one section of the baffle, and the tooth plate is meshed with gear four.

[0017] Compared with the prior art, the present invention provides a method for preparing a semiconductor packaging structure. By setting a defoaming and glue discharging device, the amount of glue dispensed can be strictly controlled to prevent excessive glue from overflowing onto the cutting path, causing waste and optical pollution; the heat dissipation risk caused by too little glue is eliminated, which accelerates light decay; in addition, the bubbles in the glue can be processed to avoid the problem of uneven light refraction caused by bubbles, effectively improving the glue dispensing effect, thereby further enhancing the lighting effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0019] Figure 1 It is a structural schematic diagram of the defoaming and glue discharging device of the present invention;

[0020] Figure 2 For the present invention Figure 1 A magnified view of point A;

[0021] Figure 3 Schematic diagram of the internal structure of the glue storage box of the present invention;

[0022] Figure 4 Schematic diagram of the cooperation between the annular groove and the first channel of the present invention;

[0023] Figure 5 A bottom view of the mating wheel of the present invention;

[0024] Figure 6 This is a schematic diagram of the installation of the glue outlet pipe and the glue outlet channel of the present invention;

[0025] Figure 7 This is a schematic diagram of the installation of the tooth plate and the baffle of the present invention;

[0026] Figure 8It is a schematic diagram of the cooperation between the cam and the cooperation wheel of the present invention.

[0027] In the figure: 1. glue storage box; 2. bottom plate; 3. drive box; 4. gear 2; 5. rotating shaft; 6. motor; 7. gear 1; 8. rotating rod; 9. rotating shaft; 10. glue discharge channel; 11. glue discharge pipe; 12. gear 3; 13. cam; 14. rotating rod; 15. fixed plate; 16. matching wheel; 17. raised part; 18. through pipe; 19. adsorption cylinder; 20. threaded rod; 21. sleeve; 22. filter plate; 23. mounting block; 24. first channel; 25. stopper; 26. annular groove; 27. second channel; 28. elastic member; 29. ​​concave cavity; 30. glue dispenser; 31. groove; 32. limiting block; 33. gear 4; 34. tooth plate; 35. baffle; 36. funnel-shaped cavity. DETAILED DESCRIPTION

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0029] In the description of the present invention, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," "the other end," and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate and simplify the description of the present invention. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0030] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "provided with," "connected," etc., should be understood in a broad sense. For example, "connected" may refer to a fixed connection, a detachable connection, or an integral connection; it may refer to a mechanical connection or an electrical connection; it may refer to a direct connection or an indirect connection through an intermediate medium; it may refer to internal communication between two components. Those skilled in the art will be able to understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0031] Example 1

[0032] An embodiment of the present invention provides a method for preparing a semiconductor packaging structure, comprising the following steps: S1: covering a crystal plate with fluorescent glue, and cutting a plurality of fluorescent glue films on the fluorescent glue; S2: using a defoaming glue dispensing device to dispense glue on the plurality of fluorescent glue films; S3: contacting the top of an LED chip with the dispensed glue, pressing the LED chip, and drying it after standing for 3-5 minutes; S4: applying a blue film tape to the bottom of the LED chip to separate the LED chip, the dispensed glue, and the fluorescent glue film from the crystal plate, and performing a mold reversal; S5: fixing the LED chip to a substrate, filling white glue between the dispensed glue and the substrate, and then injection molding to form a lens; S6: segmenting the plurality of LED chips.

[0033] Preferably, the thickness of the crystal plate is 500-800 μm, and the surface adhesion is 50-150 gf / 25 mm width.

[0034] The working principle and beneficial effects of the above technical solution are as follows: S1: Cover the crystal plate with fluorescent glue and cut multiple fluorescent glue films on the fluorescent glue; S2: Use a defoaming glue dispensing device to dispense glue on the multiple fluorescent glue films; S3: Contact the top of the LED chip with the glue, press the LED chip, let it stand for 3-5 minutes, and then dry it; S4: Apply blue film tape to the bottom of the LED chip to separate the LED chip, glue and fluorescent glue film from the crystal plate, and then perform a mold reversal; S5: Bond the LED chip to the substrate, fill the space between the glue and the substrate with white glue, and then use injection molding to form a lens; S6: Segment the multiple LED chips;

[0035] By setting up a defoaming and glue discharging device, this application can strictly control the amount of glue dispensed, prevent excessive glue from overflowing onto the cutting path to cause waste and optical pollution; eliminate the heat dissipation risks caused by too little glue and accelerate light decay; in addition, the bubbles in the glue can also be processed to avoid the problem of uneven light refraction caused by bubbles, effectively improve the glue dispensing effect, and thus further enhance the lighting effect.

[0036] Example 2

[0037] Based on the above embodiment 1, in step S2, as Figures 1-8 As shown, the defoaming and glue discharging device includes a base plate 2, a glue storage box 1 is fixedly provided on the base plate 2, a driving box 3 is fixedly provided on the glue storage box 1, one side of the glue storage box 1 is connected to a glue discharging channel 10, and the other end of the glue discharging channel 10 is connected to a glue discharging pipe 11, and the glue discharging pipe 11 passes through the base plate 2.

[0038] Among them, preferably, a motor 6 is fixedly provided in the drive box 3, and the lower output end of the motor 6 is fixedly connected to the rotating rod 8, and a gear 1 7 is fixedly provided on the rotating rod 8, and the gear 1 7 is meshed with the gear 2 4, and the gear 2 4 is fixed with a rotating shaft 5 that passes through the rotating shaft 5. The rotating shaft 5 rotates and extends into the glue storage box 1, and the lower end of the rotating shaft 5 is fixedly connected to the threaded rod 20, and the threaded rod 20 is threadedly connected to the filter plate 22, and the filter plate 22 is slidably connected to the inner wall of the glue storage box 1.

[0039] The working principle and beneficial effects of the above technical solution are as follows: the motor 6 drives the rotating rod 8 to rotate, the rotating rod 8 drives the gear 1 7 to rotate, the gear 1 7 drives the gear 2 4 to rotate, the gear 2 4 drives the rotating shaft 5 to rotate, the rotating shaft 5 drives the threaded rod 20 to rotate together, and the threaded rod 20 causes the filter plate 22 to move up and down in the glue storage box 1 (in the initial position, the filter plate 22 is at the bottom). During the rising process, the filter plate 22 will leave impurities in the glue liquid on the upper surface of the filter plate 22; and during the up and down movement of the filter plate 22, the bubbles in the glue liquid are removed by physical squeezing and filtering, thereby significantly reducing the bubble content of the glue liquid.

[0040] This design integrates impurity filtration and bubble elimination functions into a single moving component. Through the stable output of mechanical transmission, the impurity retention rate of the glue liquid is higher and the bubble content is significantly reduced, effectively avoiding dispensing defects caused by impurity blockage and bubble residue, and significantly improving the stability of the packaging process.

[0041] Example 3

[0042] On the basis of the above embodiment 2, Figure 3 、 Figure 5 As shown, a protrusion 17 is symmetrically fixedly provided on the rotating shaft 5, a mounting block 23 is slidably mounted on the protrusion 17, a through-tube 18 is symmetrically rotatably connected to the mounting block 23, and the other end of the through-tube 18 is fixedly connected to an adsorption cylinder 19, and a groove 31 is provided on the adsorption cylinder 19.

[0043] The working principle and beneficial effects of the above technical solution are as follows: when the filter plate 22 is rising, the filter plate 22 will contact the adsorption cylinder 19 (the adsorption cylinder 19 is similar to an activated carbon rod), and the rotation of the rotating shaft 5 will drive the mounting block 23 to rotate through the protrusion 17, and the mounting block 23 will drive the through tube 18 to rotate, and the through tube 18 will drive the adsorption cylinder 19 to rotate (revolution and rotation) and roll on the filter plate 22. During the rolling process, the glue particles and bubbles remaining on the surface of the filter plate 22 are captured by physical adsorption; in addition, even if the filter plate 22 continues to rise, the mounting block 23 will rise together under the action of the protrusion 17, which will not affect the contact and adsorption of the filter plate 22 with the adsorption cylinder 19, ensuring that the cleaning effect is not affected by the stroke change; the scraping effect of the adsorption cylinder 19 on the surface of the filter plate 22 causes the trapped bubbles to be released and float up, further reducing the glue bubble rate; this design combines mechanical motion with physical adsorption, significantly improving the cleaning efficiency of the filter plate 22, significantly improving the glue bubble removal rate, and significantly reducing the risk of packaging defects caused by residual bubbles.

[0044] Example 4

[0045] On the basis of the above embodiment 3, Figure 3-Figure 5 As shown, a concave cavity 29 is provided in the rotating shaft 5, and a detachable end cover is provided at the upper end of the concave cavity 29. The concave cavity 29 is filled with a defoaming agent. Through grooves are symmetrically provided on the rotating shaft 5, and a first channel 24 is symmetrically provided on the mounting block 23. The first channel 24 cooperates with the through groove, and the first channel 24 is connected to the through pipe 18.

[0046] Among them, preferably, an annular groove 26 with an opening at the lower end is provided on the mounting block 23, the annular groove 26 is connected to the first channel 24, and an elastic member 28 is symmetrically fixedly arranged in the annular groove 26, the lower end of the elastic member 28 is fixedly connected to the stopper 25, the stopper 25 is slidably connected to the annular groove 26, and a second channel 27 is provided through the stopper 25, and the second channel 27 cooperates with the first channel 24; a sleeve 21 is fixedly provided on the filter plate 22, the sleeve 21 is sleeved on the threaded rod 20, and the sleeve 21 cooperates with the annular groove 26.

[0047] Among them, it is necessary to select a defoaming agent that is compatible with the glue (such as silicone, mineral oil), and the addition amount is usually 0.1% to 1%. The optimal ratio needs to be determined through preliminary testing.

[0048] The concave cavity 29 inside the rotating shaft 5 serves as a defoaming agent storage bin, which can be quickly replenished through a detachable end cover.

[0049] The working principle and beneficial effects of the above technical solution are as follows: when the filter plate 22 gradually rises, the sleeve 21 enters the annular groove 26, and the sleeve 21 pushes the stopper 25 to squeeze the elastic member 28. The elastic member 28 contracts, and the stopper 25 moves upward so that the second channel 27 is aligned with the first channel 24, forming a conductive path. When the rotating shaft 5 rotates, under the action of centrifugal force and weight, the defoaming agent passes through the through groove, the first channel 24, the second channel 27 and the through pipe 18 and enters the adsorption cylinder 19, and flows out from the groove 31. The defoaming agent then remains on the filter plate 22. When the filter plate 22 descends, the filter plate 22 will fully contact the glue liquid in the glue storage box 1, thereby effectively reducing the number of glue bubbles in the glue storage box 1.

[0050] Example 5

[0051] On the basis of the above-mentioned embodiments 1-2, Figure 2 、 Figure 6-Figure 8 As shown, an opening is provided on one side wall of the drive box 3, and gear 1 7 extends out of the drive box 3 from the opening. A fixing plate 15 is fixedly provided on one side wall of the glue storage box 1, and a rotating rod 14 is fixedly provided on the fixing plate 15. A gear 3 12 is fixedly provided on the upper end of the rotating rod 14, and the gear 3 12 is meshed and connected with the gear 1 7.

[0052] Among them, preferably, a rotating shaft 9 is rotatably provided on the glue outlet channel 10, a limiting block 32 is fixedly provided on the rotating shaft 9, the limiting block 32 is provided in the glue outlet channel 10, the limiting block 32 is used to control the on and off of the glue outlet channel 10, and a glue machine 30 is also provided in the glue outlet channel 10, a mating wheel 16 is fixedly provided on the upper end of the rotating shaft 9, a cam 13 is fixedly provided on the rotating rod 14, the cam 13 cooperates with the mating wheel 16, and a torsion spring is provided at the connection position between the rotating shaft 9 and the glue outlet channel 10.

[0053] The working principle and beneficial effects of the above technical solution are as follows: when the motor 6 drives the gear 1 7 to rotate, the gear 1 7 drives the gear 3 12 to rotate, the gear 3 12 drives the rotating rod 14 to rotate, the rotating rod 14 drives the cam 13 to rotate, and the cam 13 periodically drives the mating wheel 16 to rotate, causing the rotating shaft 9 to swing back and forth; the swinging of the rotating shaft 9 drives the limiting block 32 (similar to the valve plate structure) to rotate in the glue outlet channel 10, thereby realizing the opening and closing adjustment of the glue outlet channel 10; and the setting of the torsion spring will cause the limiting block 32 to return to the initial position when the cam 13 is not mated with the mating wheel 16, forming a periodic on-off cycle;

[0054] When the limiting block 32 opens the channel, the glue dispensing machine 30 (such as a peristaltic pump) delivers the glue to the glue outlet pipe 11; when it is closed, the flow of glue is interrupted. Through the cooperation of the cam 13 and the matching wheel 16, the opening and closing time ratio of the limiting block 32 is accurately controlled to achieve pulsed output of glue, which can effectively control the accuracy of the dispensing amount, and is more accurate and practical.

[0055] Example 6

[0056] On the basis of the above embodiment 5, Figure 2 、 Figure 6-Figure 8 As shown, the rotating shaft 9 rotates through the bottom plate 2, and a gear four 33 is fixedly provided at the lower end of the rotating shaft 9. A funnel-shaped cavity 36 is provided in the glue outlet pipe 11, and the funnel-shaped cavity 36 is connected with the glue outlet channel 10. A baffle 35 is slidably inserted on the glue outlet pipe 11, and the baffle 35 is used to control the on and off of the funnel-shaped cavity 36. A section of the baffle 35 is fixedly provided with a tooth plate 34, and the tooth plate 34 is meshed with the gear four 33.

[0057] The working principle and beneficial effects of the above technical solution are as follows: when the rotating shaft 9 swings under the action of the cam 13 and the matching wheel 16, it drives the lower end gear 43 to rotate synchronously; the gear 43 drives the baffle 35 to move, which will open the opening of the funnel-shaped cavity 36; when the limiting block 32 opens the glue outlet channel 10, the glue flows into the funnel-shaped cavity 36 and then flows out of the funnel-shaped cavity 36. When the limiting block 32 closes the glue outlet channel 10, the baffle 35 will completely close the funnel-shaped cavity 36, effectively reducing the glue dripping from the funnel-shaped cavity 36 after the glue outlet channel 10 is closed. Under the dual action of the limiting block 32 and the baffle 35, the glue discharge amount of the glue can be accurately and effectively controlled, and the probability of glue residue or dripping can be reduced. In addition, by adjusting the profile of the cam 13 and the stroke of the baffle 35, glue with different viscosities and different usage requirements can be adapted, and the practicality and use effect are better.

[0058] Through a "dual-stage linkage control + adaptive adjustment" mechanism, precise glue delivery and efficient leak prevention are achieved: when the rotating shaft 9 is driven by the cam 13 and the mating wheel 16 to swing, it drives gear 4 33 to rotate, which in turn pushes the baffle 35 to slide and open the funnel-shaped cavity 36. At this time, if the limiting block 32 simultaneously opens the glue outlet channel 10, the glue, under the action of pressure, flows steadily through the two-stage path. At the end of glue dispensing, the limiting block 32 first closes the main channel to cut off the glue flow, and then the baffle 35 completely seals the funnel-shaped cavity 36, preventing residual glue from dripping. This dual-cutoff design of "rapid main line disconnection + precise branch line blocking" reduces the glue residue rate to below 0.1%, far exceeding the control level of traditional single-stage valves.

[0059] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention.

Claims

1. A method for preparing a semiconductor packaging structure, characterized in that: The method comprises the following steps: S1: covering a crystal plate with fluorescent glue, and cutting a plurality of fluorescent glue films on the fluorescent glue; S2: Use a defoaming glue dispensing device to dispense glue on multiple fluorescent adhesive films; S3: Place the top of the LED chip in contact with the glue, press the LED chip, let it stand for 3-5 minutes, and then dry it; S4: Apply blue film tape to the bottom of the LED chip to separate the LED chip, glue and fluorescent film from the crystal plate, and then perform inverted molding; S5: Fix the LED chip to the substrate, fill white glue between the glue and the substrate, and then perform injection molding to form a lens; S6: Segment multiple LED chips.

2. The method for preparing a semiconductor package structure according to claim 1, wherein: The thickness of the crystal plate is 500-800 μm, and the surface adhesion is 50-150 gf / 25 mm width.

3. The method for preparing a semiconductor packaging structure according to claim 1, wherein: In step S2, the defoaming and glue discharging device comprises a bottom plate (2), a glue storage box (1) is fixedly arranged on the bottom plate (2), a driving box (3) is fixedly arranged on the glue storage box (1), one side of the glue storage box (1) is connected to a glue discharging channel (10), the other end of the glue discharging channel (10) is connected to a glue discharging pipe (11), and the glue discharging pipe (11) passes through the bottom plate (2).

4. The method for preparing a semiconductor packaging structure according to claim 3, wherein: A motor (6) is fixedly arranged in the driving box (3), and the lower output end of the motor (6) is fixedly connected to a rotating rod (8). A gear 1 (7) is fixedly arranged on the rotating rod (8), and a gear 2 (4) is meshedly connected to the gear 1 (7). A rotating shaft (5) is fixedly passed through the gear 2 (4), and the rotating shaft (5) rotates and extends into the glue storage box (1). The lower end of the rotating shaft (5) is fixedly connected to a threaded rod (20), and a filter plate (22) is threadedly connected to the threaded rod (20), and the filter plate (22) is slidably connected to the inner wall of the glue storage box (1).

5. The method for preparing a semiconductor packaging structure according to claim 4, wherein: A protrusion (17) is symmetrically fixedly provided on the rotating shaft (5), a mounting block (23) is slidably mounted on the protrusion (17), a through-tube (18) is symmetrically rotatably connected to the mounting block (23), the other end of the through-tube (18) is fixedly connected to an adsorption cylinder (19), and a groove (31) is provided on the adsorption cylinder (19).

6. The method for preparing a semiconductor packaging structure according to claim 5, wherein: A concave cavity (29) is provided in the rotating shaft (5), an end cap is detachably provided at the upper end of the concave cavity (29), and a defoaming agent is filled in the concave cavity (29). Through grooves are symmetrically provided on the rotating shaft (5), and a first channel (24) is symmetrically provided on the mounting block (23). The first channel (24) matches the through groove, and the first channel (24) is connected to the through pipe (18).

7. The method for preparing a semiconductor package structure according to claim 6, wherein: The mounting block (23) is provided with an annular groove (26) with an opening at the lower end, the annular groove (26) is connected to the first channel (24), an elastic member (28) is symmetrically fixedly arranged in the annular groove (26), the lower end of the elastic member (28) is fixedly connected to the stopper (25), the stopper (25) is slidably connected to the annular groove (26), a second channel (27) is provided through the stopper (25), and the second channel (27) is matched with the first channel (24); a sleeve (21) is fixedly provided on the filter plate (22), the sleeve (21) is sleeved on the threaded rod (20), and the sleeve (21) is matched with the annular groove (26).

8. The method for preparing a semiconductor packaging structure according to claim 4, wherein: An opening is provided on one side wall of the driving box (3), and the gear 1 (7) extends out of the driving box (3) from the opening. A fixing plate (15) is fixedly provided on one side wall of the glue storage box (1), a rotating rod (14) is fixedly provided on the fixing plate (15), and a gear 3 (12) is fixedly provided on the upper end of the rotating rod (14), and the gear 3 (12) is meshed and connected with the gear 1 (7).

9. The method for preparing a semiconductor packaging structure according to claim 8, wherein: A rotating shaft (9) is rotatably provided on the glue outlet channel (10), a limiting block (32) is fixedly provided on the rotating shaft (9), the limiting block (32) is provided in the glue outlet channel (10), and the limiting block (32) is used to control the on and off of the glue outlet channel (10). A glue discharging machine (30) is also provided in the glue outlet channel (10), a matching wheel (16) is fixedly provided on the upper end of the rotating shaft (9), a cam (13) is fixedly provided on the rotating rod (14), the cam (13) and the matching wheel (16) are matched, and a torsion spring is provided at the connection position between the rotating shaft (9) and the glue outlet channel (10).

10. The method for preparing a semiconductor packaging structure according to claim 9, wherein: The rotating shaft (9) rotates and passes through the bottom plate (2). A gear four (33) is fixedly provided at the lower end of the rotating shaft (9). A funnel-shaped cavity (36) is provided in the glue outlet pipe (11). The funnel-shaped cavity (36) is connected to the glue outlet channel (10). A baffle (35) is slidably inserted on the glue outlet pipe (11). The baffle (35) is used to control the opening and closing of the funnel-shaped cavity (36). A tooth plate (34) is fixedly provided on a section of the baffle (35). The tooth plate (34) is meshed with the gear four (33).

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