Vaporizer, processing apparatus, processing method, and method for manufacturing semiconductor device

Abstract

The present invention is provided with: a main body for accommodating a liquid raw material at room temperature; a plurality of temperature sensors arranged on the side wall of the main body; and a collection unit which is formed so as to collect the raw material on the side wall side where the temperature sensor disposed at the lower end of the plurality of temperature sensors is provided.

Description

Technical Field

[0001] The present invention relates to a vaporizer, a processing device, a processing method, and a method for manufacturing a semiconductor device. Background Art

[0002] As an example of a processing apparatus for processing an object to be processed, a semiconductor manufacturing apparatus for manufacturing semiconductor devices is known. With the recent miniaturization of devices, various process gases, such as those obtained by vaporizing liquids or sublimating solids, are sometimes used as process gases for processing substrates. These process gases are required to be supplied stably at a predetermined flow rate. For example, Patent Document 1 describes a method for stably supplying process gases while switching between multiple containers, and Patent Document 2 describes a method for using a liquid level sensor to measure the remaining amount of a raw material.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: International Publication No. 2019 / 181603

[0006] Patent Document 2: International Publication No. 2018 / 056346 Summary of the Invention

[0007] Problems to be solved by the invention

[0008] The present disclosure provides a technology for estimating the remaining amount of a raw material based on a temperature detected by a temperature sensor.

[0009] Solutions to Problems

[0010] According to one embodiment of the present disclosure, a technology is provided, which has:

[0011] a main body for receiving the liquid raw material at room temperature;

[0012] a plurality of temperature sensors disposed on the side walls of the main body; and

[0013] The collecting portion is formed so as to collect the raw material on a side wall where a temperature sensor disposed at a lower end among the plurality of temperature sensors is provided.

[0014] Effects of the Invention

[0015] According to the present disclosure, the remaining amount of the raw material can be estimated based on the temperature detected by the temperature sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic structural diagram of a processing device applicable to one embodiment of the present disclosure.

[0017] Figure 2 It is used Figure 1 FIG. 8 is a cross-sectional view taken along line AA.

[0018] Figure 3 This is an explanatory diagram illustrating the structure of a gasification system applicable to one embodiment of the present disclosure.

[0019] Figure 4 It is a longitudinal sectional view of a storage tank applicable to one embodiment of the present disclosure.

[0020] Figure 5 1 is a schematic configuration diagram of a controller 41 applicable to a processing device according to one embodiment of the present disclosure, and is a diagram showing a control system of the controller 41 in a block diagram.

[0021] Figure 6 This is a diagram showing a display unit that displays transitions in temperature measured by a plurality of temperature sensors in one embodiment of the present disclosure.

[0022] Figure 7 This is a cross-sectional view of a storage tank according to one embodiment of the present disclosure.

[0023] Figure 8 It is a longitudinal sectional view of the storage tank according to the first modification of the present disclosure.

[0024] Figure 9 It is a longitudinal sectional view of a storage tank according to a second modification of the present disclosure.

[0025] Figure 10 (a) is a longitudinal sectional view of a storage tank according to a third modification of the present disclosure. Figure 10 (b) is a transverse sectional view of a storage tank according to Modification 3 of the present disclosure.

[0026] Figure 11 It is a longitudinal sectional view of a storage tank according to a fourth modification of the present disclosure.

[0027] Figure 12 (a) is a longitudinal sectional view of a storage tank according to a fifth modification of the present disclosure. Figure 12 (b) is a transverse sectional view of a storage tank according to a fifth modification of the present disclosure. DETAILED DESCRIPTION

[0028] <One aspect of the present disclosure>

[0029] Below, while referring to Figures 1 to 7 While describing one embodiment of the present disclosure, the following drawings are schematic. The dimensional relationships and proportions of the elements shown in the drawings are not necessarily consistent with the actual objects. Furthermore, the dimensional relationships and proportions of the elements shown in the drawings are not necessarily consistent across multiple drawings.

[0030] (1) Structure of processing device

[0031] A reaction tube 1 is provided on the inner side of a heater 42 serving as a heating device. A manifold 44 made of, for example, stainless steel is connected to the lower end of the reaction tube 1 via an O-ring 46 serving as an airtight component. The lower end opening (furnace mouth) of the manifold 44 is airtightly sealed by a sealing cover 35 serving as a cover body via an O-ring 18 serving as an airtight component. A processing chamber 2 serving as a processing space is divided by at least the reaction tube 1, the manifold 44, and the sealing cover 35.

[0032] The wafer boat 32 serving as a holder is erected on the seal cap 35 via a boat support 45 . The boat support 45 is a holding body that holds the wafer boat 32 .

[0033] Two gas supply pipes (a gas supply pipe 47 and a gas supply pipe 48 ) are provided as supply paths for supplying a plurality of types of, in this case, two types of, process gases to the process chamber 2 .

[0034] The gas supply pipe 47 is provided with, in order from upstream, a liquid raw material unit 71 serving as a liquid supply unit, a storage unit 51, a mass flow controller (hereinafter also referred to as MFC) 49, which is a liquid flow control device (flow control unit), and a valve 52, which serves as an on-off valve. A purge gas supply pipe 53, which supplies inert gas as a purge gas, merges downstream of the valve 52. The purge gas supply pipe 53 is provided with, in order from upstream, a purge gas source 72, an MFC 54, which is a flow control device (flow control unit), and a valve 55, which serves as an on-off valve.

[0035] At the front end of the gas supply tube 47, a nozzle 56 is provided along the inner wall of the reaction tube 1 from bottom to top. Gas supply holes 57 for supplying gas are provided on the side of the nozzle 56. The gas supply holes 57 are arranged at equal intervals from bottom to top and have the same opening area.

[0036] Here, the vaporizer 60 of this embodiment includes an MFC 49, a storage unit 51 including a storage tank (storage container) 200 for storing a liquid raw material, as described later, and a heater 215 for heating the liquid raw material. In the description of this embodiment, the pipe upstream of the storage tank 200 in the gas supply pipe 47 and located between the liquid raw material unit 71 is referred to as the supply pipe 47a. Furthermore, the downstream side of the storage tank 200 in the gas supply pipe 47 is referred to as the supply pipe 47b.

[0037] The gas supply pipe 47, MFC 49, reservoir 51, valve 52, and nozzle 56 are collectively referred to as the first gas supply unit (first gas supply line). Furthermore, the purge gas supply pipe 53, MFC 54, and valve 55 may also be included in the first gas supply unit. Furthermore, the liquid raw material unit 71 and purge gas source 72 may also be included in the first gas supply unit. The first gas supply line will be described later.

[0038] The gas supply pipe 48 is provided with, in order from upstream, a reaction gas source 73, a flow control device (flow control unit), namely MFC 58, and a valve 59 serving as an on-off valve. A purge gas supply pipe 61, which supplies purge gas, merges downstream of valve 59. The purge gas supply pipe 61 is provided with, in order from upstream, a purge gas source 74, a flow control device (flow control unit), namely MFC 62, and a valve 63 serving as an on-off valve. At the front end of the gas supply pipe 48, a nozzle 64 is provided parallel to the nozzle 56. Gas supply holes 65, which are gas supply ports, are provided on the side of the nozzle 64. The gas supply holes 65 are arranged at equal intervals from bottom to top and have the same opening area.

[0039] Here, the gas supply pipe 48, MFC 58, valve 59, and nozzle 64 are collectively referred to as the second gas supply line, which serves as the second gas supply unit. Furthermore, the purge gas supply pipe 61, MFC 62, and valve 63 may also be included in the second gas supply unit. Furthermore, the reaction gas source 73 and purge gas source 74 may also be included in the second gas supply unit.

[0040] The liquid raw material supplied from liquid raw material unit 71 passes through MFC 49, storage unit 51, and valve 52, merges with purge gas supply pipe 53, and is then supplied to process chamber 2 through nozzle 56. Furthermore, the raw material vaporized by vaporizer 60 is supplied to process chamber 2. The reaction gas supplied from reaction gas source 73 passes through MFC 58 and valve 59, merges with purge gas supply pipe 61, and is then supplied to process chamber 2 through nozzle 64.

[0041] The processing chamber 2 is connected to a vacuum pump 68, which serves as an exhaust device (exhaust unit), via a gas exhaust pipe 66 for exhausting gas, and is evacuated. Furthermore, a valve 67, which serves as an adjustment valve, is opened and closed to allow the vacuum exhaust of the processing chamber 2 to be performed and stopped. The valve 67 is also configured so that the pressure in the processing chamber 2 can be adjusted by adjusting the valve opening.

[0042] The sealing cap 35 is provided with a boat rotating mechanism 69 , which rotates the wafer boat 32 to improve processing uniformity.

[0043] Next, use Figure 3 and Figure 4 The first gas supply line having the gasifier 60 as the gasification system is described. Figure 3 In the figure, the wafer 31 of the processing chamber 2 is omitted. Figure 1 The same components are denoted by the same reference numerals, and description thereof will be omitted.

[0044] The vaporizer 60 includes: a storage tank 200 serving as a storage container for storing a liquid raw material (liquid raw material); an air valve 207; a pressure sensor P for detecting the pressure within the storage tank 200; a heater 215 provided on the outside of the side wall 201; a collection portion 218 on the side wall 201 side where a plurality of temperature sensors TC (collectively, temperature sensors TC1, TC2, TC3, and TC4) are provided so that, even if the remaining amount of liquid raw material 216 within the storage tank 200 decreases, the liquid raw material 216 is collected at the temperature sensor TC4 located at the lower end in the vertical direction; a storage portion 51 provided on the bottom wall 202 and including an opening 219 serving as a supply port for replenishing the liquid raw material; a heater 217 provided on the outside of the bottom wall 202 as a preheating portion; and an MFC 49. The vaporizer 60 further includes a display unit 300 (see FIG. 2 ). Figure 6 The display unit 300 will be described in detail later. In this specification, the liquid raw material stored in the storage tank 200 is referred to as liquid raw material 216.

[0045] Liquid raw material 216 is heated and vaporized by heater 215. The vaporized raw material then flows through air valve 207, MFC 49, vaporizer 60, and valve 52, merges with purge gas supply pipe 53, and is then supplied to processing chamber 2 via air valve V1 and nozzle 56. Furthermore, storage tank 200 is configured to estimate the remaining amount of liquid raw material 216 based on the temperatures detected by multiple temperature sensors TC1 to TC4 installed on sidewall 201. When the remaining amount of liquid raw material 216 decreases, liquid raw material is replenished from liquid raw material unit 71 through supply pipe 47a and opening 219 into storage tank 200.

[0046] The amount of vaporized gas generated by vaporizing liquid raw material 216 within storage tank 200 varies depending on the remaining amount of liquid raw material 216. For example, when the remaining amount of liquid raw material 216 decreases, the heat transfer area from heater 215 decreases, and the amount of vaporized gas generated also decreases. In this case, MFC 49 cannot adjust the flow rate to a flow rate that exceeds the amount of vaporized gas generated, making it difficult to supply the desired amount of vaporized gas into processing chamber 2. On the other hand, in vaporizer 60 of this embodiment, the remaining amount of liquid raw material 216 can be estimated using temperature changes detected by temperature sensors TC1 to TC4. Therefore, liquid raw material 216 can be replenished when it decreases to a certain level. Estimation of the remaining amount of liquid raw material 216 will be described later.

[0047] Collecting portion 218 is configured such that, when the remaining amount of liquid raw material 216 decreases, liquid raw material 216 flows toward opening 219 provided between bottom wall 202 of storage tank 200 and supply pipe 47a. This configuration makes it possible to minimize the influence of heating by heater 215 when the liquid raw material is introduced (supplied) into storage tank 200 through opening 219. This prevents the liquid raw material from vaporizing before being introduced into storage tank 200. Consequently, a predetermined flow rate of liquid raw material can be introduced (supplied) into storage tank 200 from liquid raw material unit 71.

[0048] Furthermore, heater 215 is provided so as to surround or cover sidewall 201 and is configured to heat liquid raw material 216. If the vaporized raw material reliquefies, this can cause defects such as the generation of particles. Therefore, to prevent this problem, the heating temperature of heater 215 is set slightly higher than the vaporization temperature of liquid raw material 216. This improves the effectiveness of preventing reliquefaction of liquid raw material 216 introduced into storage tank 200.

[0049] Meanwhile, heater 217 is provided so as to cover the outer periphery of supply pipe 47a and is configured to heat the liquid raw material introduced into storage tank 200. To supply the liquid raw material to storage tank 200 in a liquid state, the heating temperature of heater 217 is set to a temperature slightly lower than the vaporization temperature of the liquid raw material. This allows the liquid raw material to be supplied to storage tank 200 in a liquid state while being brought closer to its vaporization temperature, thereby improving the vaporization efficiency of liquid raw material 216.

[0050] Furthermore, the pressure sensor P can be used to confirm vacuuming when removing residual liquid raw materials from the gas supply pipe 47 described later, or to confirm gasification behavior during fault detection.

[0051] Here, when air valve 207 is closed, vaporized raw material remains between air valve 207 and valve 52. The remaining raw material stops flowing and reliquefies. To prevent this reliquefaction, air valve AV1 is opened to circulate an inert gas used to purge the piping between air valve 207 and MFC49 and the interior of MFC49, thereby purging the remaining raw material (raw material gas). For example, by heating the purge gas to a temperature above the vaporization temperature using a heater (not shown), the effect of preventing the reliquefaction of the raw material gas can be enhanced. In addition, the detection value of pressure sensor P can be used to confirm whether the purge is in progress.

[0052] The configuration is such that the raw material is supplied from the liquid raw material unit 71 to the reservoir 51 via the supply pipe 47a by opening and closing the air valve AV2. Furthermore, the configuration is such that the vaporized raw material is supplied to the processing chamber 2 and the reservoir 51 via the supply pipe 47b by opening and closing the air valve 207. Furthermore, the vaporized raw material in the supply pipe 47b is supplied to the processing chamber 2 when the air valve V1 is open and the air valves V2 and V3 are closed. When the air valve V1 is closed and the air valves V2 and V3 are open, the vaporized raw material is supplied to the gas exhaust pipe 66.

[0053] Furthermore, if the vaporized raw material remains as residue in the supply pipe 47b, it will adhere to and accumulate on the inner wall of the supply pipe 47b, forming particles. In this embodiment, the vaporized raw material is discharged from the supply pipe 47b by a vacuum pump 68 to prevent the vaporized raw material from remaining as residue.

[0054] For example, after the film formation step of the process recipe is completed, or after the process recipe is completed, valve 52, valve 55, and air valve V1 are closed, and air valves V2 and V3 are opened, and the vaporized raw material in the supply pipe 47b is exhausted by the vacuum pump 68. Alternatively, while valve 55 is opened to supply a purge gas (e.g., an inert gas) from the purge gas source 72, the air valve V1 may be closed, and air valves V2 and V3 may be opened to exhaust the vaporized raw material in the supply pipe 47b via the vacuum pump 68.

[0055] The manual valves H1 and H2 are provided to facilitate the replacement of the liquid raw material unit 71. First, close the manual valve H1 and the air valve V2, open the manual valve H2 and the air valve V3, and remove the raw material in the pipe using the vacuum pump 68. When the raw material in the pipe is removed, close the manual valve H2 and remove the raw material from the pipe. Figure 3 The first gas supply line shown is disconnected, and the liquid raw material unit 71 is replaced.

[0056] and Figure 1 Likewise, in Figure 3 Controller 41 as a control unit is shown in FIG. Controller 41 is configured to determine the remaining amount of liquid raw material 216 based on a change in temperature measured by temperature sensor TC.

[0057] For example, controller 41 is configured to determine the remaining amount of liquid raw material 216 based on changes in the temperature measured by temperature sensor TC. If the remaining amount determination results in a high remaining amount of liquid raw material 216, controller 41 continues to measure the temperature using temperature sensor TC. Furthermore, if the remaining amount of liquid raw material 216 is determined to be low, controller 41 can notify the user of the low remaining amount by issuing an alarm or by replenishing liquid raw material from liquid raw material unit 71 to storage tank 200, thereby managing the liquid raw material. Details of the remaining amount of liquid raw material 216 determined by temperature sensor TC will be described later.

[0058] (Storage tank)

[0059] Next, use Figure 4 The storage tank 200, which is a main part of the storage unit 51 and is a part of the vaporizer 60, will be described. Figure 4 This is a longitudinal cross-sectional view of the storage tank 200. Heater 215 and pressure sensor P are omitted here. In this specification, a longitudinal cross-sectional view of the storage tank 200 refers to a cross-sectional view of the storage tank 200 cut vertically, and a transverse cross-sectional view of the storage tank 200 refers to a cross-sectional view of the storage tank 200 cut horizontally. In this specification, "upper side" refers to the vertically upper side, and "lower side" refers to the vertically lower side. In this specification, "high position" refers to the vertically upper side, and "lower position" refers to the vertically lower side.

[0060] Retention tank 200 is used as a container for storing liquid raw materials. Retention tank 200 includes a main body (container) 221, which forms a storage chamber 210 for storing the liquid raw materials; multiple temperature sensors TC provided on sidewall 201; a collection portion 218 formed to collect liquid raw materials 216 on the side of sidewall 201, where temperature sensor TC4, located at the lower end (lowest side) of the multiple temperature sensors TC, is located; an opening 219 provided in bottom wall 202 for supplying liquid raw materials; and a lid 203, which provides a flow path (supply pipe 47b) for discharging the vaporized raw materials in storage chamber 210. Furthermore, sidewall 201, bottom wall 202, and lid 203 each constitute main body 221, which includes the inner wall of storage chamber 210.

[0061] According to this configuration, the remaining amount of liquid raw material 216 can be estimated by detecting (measuring) the temperature using temperature sensor TC. In particular, even if liquid raw material 216 is low, temperature sensor TC4 can detect the temperature of liquid raw material 216 and estimate the remaining amount of liquid raw material 216.

[0062] like Figure 4As shown, multiple temperature sensors TC are arranged in a row within sidewall 201 in the height direction (vertical direction) of sidewall 201. Specifically, temperature sensor TC1 is arranged at the vertically uppermost side (upper end) of sidewall 201, followed by temperature sensors TC2 and TC3 below it, and temperature sensor TC4 at the lowermost side (lower end). The multiple temperature sensors TC are arranged so as to be evenly spaced in the height direction of sidewall 201.

[0063] like Figure 6 As shown, a graph showing the transition of temperature (temperature change) measured by temperature sensor TC is displayed on the display unit 300. The vertical axis of the graph represents temperature, and the horizontal axis of the graph represents elapsed time. The dotted line (circle) of the graph represents the transition of temperature measured by temperature sensor TC1, and is represented by, for example, red (solid line) on the display unit 300. The dotted line (rectangle) of the graph represents the transition of temperature measured by temperature sensor TC2, and is represented by, for example, blue (solid line) on the display unit 300. The solid line of the graph represents the transition of temperature measured by temperature sensor TC3, and is represented by, for example, black (solid line) on the display unit 300. The long double-dashed line of the graph represents the transition of temperature measured by temperature sensor TC4, and is represented by, for example, yellow (solid line) on the display unit 300. In this way, the display unit 300 can display the transition (temperature change) of temperature measured by a plurality of temperature sensors TC arranged at different positions using different colors.

[0064] When the state of liquid raw material 216 changes from a liquid state to a vaporized gas state, the temperatures measured by each of temperature sensors TC1 to TC4 change (increase). Based on this temperature change, the remaining amount of liquid raw material 216 can be estimated. Specifically, at time (t) = 0, the temperature measured by temperature sensor TC1 among the temperatures measured by temperature sensors TC1 to TC4 is higher than the temperatures measured by the other temperature sensors TC2 to TC4. Therefore, it can be estimated that the surface (liquid level) of liquid raw material 216 is higher than the position of temperature sensor TC2 and lower than or near the position of temperature sensor TC1. Furthermore, at t = T, only the temperature measured by temperature sensor TC4 among the temperatures measured by temperature sensors TC1 to TC4 does not change (increase). Therefore, it can be estimated that the surface (liquid level) of liquid raw material 216 is higher than the position of temperature sensor TC4 and lower than or near the position of temperature sensor TC3.

[0065] like Figure 4As shown, collecting portion 218 is configured to have an inclined surface (surface) at a predetermined inclination angle relative to the horizontal plane, so that when the remaining amount of liquid raw material 216 decreases, the remaining liquid raw material 216 flows toward opening 219 located near temperature sensor TC4. In this embodiment, the uppermost side (topmost end) of the surface of collecting portion 218 is located above the location of temperature sensor TC4.

[0066] In this program, if Figure 4 As shown, in the longitudinal cross-sectional view of the storage tank 200 , the surface of the collecting portion 218 (the liquid contact surface of the liquid raw material 216 ) is represented by a straight line, and the collecting portion 218 is represented by a triangle.

[0067] Figure 7 This is a cross-sectional view of storage tank 200. The dashed line represents the lowest point (lower end) of the surface (inclined surface) of collection portion 218. The dashed circle represents opening 219. The cross-sectional shape of opening 219 may be a shape other than a circle, for example, an ellipse, a polygon, a star, a rhombus, or a trapezoid. Furthermore, the cross-sectional shape of storage tank 200 may be a shape other than a quadrilateral, for example, a circle, an ellipse, a triangle, a polygon with more than one pentagon, a star, a rhombus, or a trapezoid.

[0068] In addition, if Figure 7 As shown in FIG. 2 , the temperature sensor TC is arranged near the opening 219. Thus, even if the remaining amount of the liquid raw material 216 becomes low, the liquid raw material can be replenished based on the remaining amount management performed by the temperature sensor TC detecting the temperature of the liquid raw material 216, so that the liquid raw material can be effectively used. In addition, the temperature sensor TC4 arranged at the bottom (lower end) among the plurality of temperature sensors TC only needs to be arranged near the opening 219, and does not need to be arranged as shown in FIG. Figure 7 The plurality of temperature sensors TC shown are all arranged at the same position in a cross-sectional view.

[0069] The vaporization system of this embodiment includes at least: a storage tank 200 having a main body 221 for storing liquid raw material at room temperature; a plurality of temperature sensors TC provided on the side wall 201 of the main body 221; and a collection portion 218 configured to collect liquid raw material 216 on the side of the side wall 201 provided with the temperature sensor TC4; and a controller 41 configured to estimate the remaining amount of liquid raw material 216 based on changes in temperature measured by the plurality of temperature sensors TC.

[0070] The controller 41 is configured to replenish the liquid raw material from the liquid raw material unit 71 through the opening 219 based on the estimation of the remaining amount of the liquid raw material 216 according to the change in the temperature measured by the plurality of temperature sensors TC.

[0071] Controller 41 is configured to confirm the remaining amount of liquid raw material 216 based on changes in the temperature measured by temperature sensor TC4, and to determine whether liquid raw material 216 is insufficient and needs to be replenished. If liquid raw material 216 becomes insufficient and needs to be replenished, controller 41 is configured to replenish the liquid raw material from liquid raw material unit 71 through supply pipe 47a and opening 219.

[0072] Furthermore, controller 41 is configured to stop the supply of the liquid raw material from liquid raw material unit 71 when the temperature measured by temperature sensor TC1, located at the uppermost side (top end) of the plurality of temperature sensors TC, reaches a saturated state. Here, "the temperature measured by temperature sensor TC1 reaching a saturated state" means that the temperature measured by temperature sensor TC1 reaches the temperature at the time of measurement of the liquid raw material. Specifically, controller 41 is configured to stop the supply of the liquid raw material from liquid raw material unit 71 when the surface (liquid level) of liquid raw material 216 reaches near the position where temperature sensor TC1 is located.

[0073] The controller 41 is configured to supply the liquid raw material from the opening 219 based on the temperature detected by the temperature sensor TC4 disposed near the opening 219 provided in the bottom wall 202 of the storage tank 200 .

[0074] Furthermore, in this embodiment, the remaining amount of liquid raw material 216 is estimated based on a change in temperature detected by temperature sensor TC4, located at the bottom of the plurality of temperature sensors TC. However, this is not limiting. For example, the embodiment may be used such that liquid raw material 216 is replenished when the temperature detected by temperature sensor TC3, one of the plurality of temperature sensors TC, changes, i.e., when the remaining amount of liquid raw material 216 decreases to the level at which temperature sensor TC4 is located.

[0075] (Control Department)

[0076] Figure 5 The controller 41 is schematically shown. The controller 41, which serves as a control unit (control unit), is configured as a computer including a CPU (Central Processing Unit) 41a, a RAM (Random Access Memory) 41b, a storage device 41c, and an I / O port 41d. The RAM 41b, the storage device 41c, and the I / O port 41d are configured to exchange data with the CPU 41a via an internal bus 41e. The controller 41 is configured so that an input / output device 411 such as a touch panel and an external storage device 412 can be connected. Furthermore, a receiving unit 413 is provided that is connected to the host device 75 via a network. The receiving unit 413 can receive information from other devices from the host device 75.

[0077] The storage device 41c is composed of, for example, a flash memory, an HDD (Hard Disk Drive), etc. A control program for controlling the operation of the processing device, a process recipe that records the steps or conditions for substrate processing described later, etc. can be recorded and stored in a readable manner in the storage device 41c. In addition, the process recipe is a combination of the steps in the substrate processing process described later so that the controller 41 can execute and obtain a predetermined result, and functions as a program. In addition, the word "program" is used in this specification in the case where it only includes a process recipe unit, a control program unit, or both. In addition, the RAM 41b is configured as a storage area (work area) for temporarily holding programs or data read by the CPU 41a.

[0078] The I / O port 41 d is connected to the boat elevator, heaters 42 , 215 , 217 , MFCs 49 , 54 , 58 , 62 , valves 52 , 55 , 59 , 63 , 67 , and the like.

[0079] The controller 41 performs flow adjustment of MFC49, 54, 58, 62, opening and closing of valves 52, 55, 59, 63, 67, temperature adjustment of heaters 42, 215, 217, start and stop of vacuum pump 68, rotation speed adjustment of wafer boat rotating mechanism 69, and lifting and lowering control of wafer boat elevator.

[0080] In addition, the controller 41 is not limited to being configured as a dedicated computer, but can also be configured as a general-purpose computer. For example, an external storage device (for example, a semiconductor memory such as a USB memory, a memory card, etc.) 412 storing the above-mentioned program is prepared, and the program is installed on a general-purpose computer using the external storage device 412, thereby constituting the controller 41 of this solution. In addition, the unit for supplying the program to the computer is not limited to the case of supplying via the external storage device 412. For example, the program can also be supplied using a communication unit such as the Internet or a dedicated line without passing through the external storage device 412. In addition, the storage device 41c or the external storage device 412 is configured as a computer-readable storage medium. Hereinafter, they will be collectively referred to as storage media for short. In addition, the case where the term storage medium is used in this specification includes a case where only the storage device 41c monomer is included, a case where only the external storage device 412 monomer is included, or a case where both are included.

[0081] (2) Treatment methods

[0082] Next, an example of processing a substrate (processed object) such as a wafer 31 will be described. Here, as an example of a semiconductor device manufacturing process, a cyclic process of performing film processing by alternately supplying a source (raw material) and a reactant (reactant gas) to a processing chamber 2 will be described.

[0083] In the film forming process of this scheme, a film is formed on the wafer 31 by performing the following steps non-simultaneously for a predetermined number of times (one or more), and the above-mentioned steps are: a step of supplying raw material gas to the wafer 31 in the processing chamber 2 (step 1); a step of removing the raw material gas (residual gas) from the processing chamber 2 (step 2); a step of supplying reaction gas to the wafer 31 in the processing chamber 2 (step 3); and a step of removing the reaction gas (residual gas) from the processing chamber 2 (step 4).

[0084] (Step 1)

[0085] In step 1, the raw material is circulated while the heater 42 and the heater 215 are in operation. First, valves 52 and 67 are opened. The raw material is supplied to the storage portion 51 via the supply pipe 47a. The raw material is stored in the storage chamber 210 and is heated and vaporized by the heater 215. The gaseous raw material (raw material gas) is flow-controlled by the MFC 49 and supplied to the supply pipe 47b. The raw material gas is supplied to the processing chamber 2 from the gas supply hole 57 of the nozzle 56 and discharged from the gas exhaust pipe 66. At this time, the raw material gas is supplied to the wafer 31 from the side of the wafer 31. Thus, the first layer is formed on the wafer 31.

[0086] (Step 2)

[0087] In step 2, valve 52 of gas supply pipe 47 is closed to stop the supply of raw material gas. Valve 67 of gas exhaust pipe 66 remains open, and vacuum pump 68 is used to remove residual raw material gas from processing chamber 2. Furthermore, if an inert gas, such as N2 gas, is supplied as a purge gas to processing furnace 29 at this time, the removal of residual raw material gas is further enhanced.

[0088] (Step 3)

[0089] In step 3, the reaction gas valve 59 is opened to allow the reaction gas to flow into the gas supply pipe 48. The reaction gas is flow-regulated by the MFC 58 and supplied to the processing chamber 2 through the gas supply hole 65 of the nozzle 64 and exhausted through the gas exhaust pipe 66. At this time, the reaction gas is supplied to the wafer 31 from the side. As a result, the first layer on the wafer 31 reacts with the reaction gas and is modified, forming a second layer on the wafer 31, which is the modified first layer.

[0090] (Step 4)

[0091] In step 4, after the second layer is formed, valves 59 and 63 are closed, and the processing chamber 2 is evacuated by vacuum pump 68 to remove the remaining reaction gases. Furthermore, if an inert gas, such as N2 gas, is supplied to the processing chamber 2 as a purge gas at this time, the effect of removing the remaining reaction gases from the processing chamber 2 is further improved.

[0092] The above-described steps 1 to 4 are regarded as one cycle, and by repeating this cycle a plurality of times, a film having a predetermined thickness can be formed on the wafer 31 .

[0093] (3) Effect of this program

[0094] According to this aspect, one or more of the following effects can be obtained.

[0095] (a) The remaining amount of the liquid raw material 216 can be estimated based on the transition (temperature change) of the temperature measured by the plurality of temperature sensors T provided on the side wall 201 of the main body 221 .

[0096] Collecting portion 218 is configured to collect liquid raw material 216 on the side of sidewall 201 where temperature sensor TC4, located at the lowermost side (lower end) of the plurality of temperature sensors TC, is installed. Therefore, even if liquid raw material 216 decreases, temperature sensor TC4 can still detect the temperature of liquid raw material 216, for example. Thus, even if liquid raw material 216 decreases, the remaining amount can be estimated, thereby enabling management of the remaining amount of liquid raw material 216.

[0097] (b) When the remaining amount of liquid raw material 216 decreases, collecting portion 218 is configured to direct the remaining liquid raw material 216 toward opening 219, which is located near temperature sensor TC4, which is located at the lowest (lowest) end of the plurality of temperature sensors TC. Thus, even when liquid raw material 216 decreases, temperature sensor TC4 can detect the temperature of liquid raw material 216, for example. Therefore, liquid raw material 216 can be replenished based on the remaining amount of liquid raw material 216. This allows for efficient use of the liquid raw material.

[0098] Furthermore, since the opening 219 is provided in the bottom wall 202 , the liquid raw material can be replenished into the storage tank 200 at a predetermined flow rate without being affected by the heater 215 provided outside the side wall 201 .

[0099] (c) The top end of the collecting section 218 is positioned higher than the position of the temperature sensor TC4 located at the bottom of the plurality of temperature sensors TC. More specifically, the top end (uppermost side) of the inclined surface (surface) of the collecting section 218 is positioned above the position of the temperature sensor TC4. This allows the surface of the collecting section 218 (the surface contacting the liquid raw material 216) to have a greater inclination. Therefore, even if the amount of liquid raw material 216 decreases, the liquid raw material 216 can be easily collected toward the temperature sensor TC4. This facilitates temperature detection of the liquid raw material 216 by the temperature sensor TC4, making it easier to estimate the remaining amount of the liquid raw material 216. This facilitates managing the remaining amount of the liquid raw material 216.

[0100] (d) The plurality of temperature sensors TC are arranged so as to be equally divided in the height direction of the side wall 201 . This allows the temperature changes detected by the plurality of temperature sensors TC to occur over a constant period, thereby making it possible to easily estimate the remaining amount of the liquid raw material 216 .

[0101] (e) In the longitudinal cross-sectional view of storage tank 200, the surface of collecting portion 218 (the liquid contact surface of liquid raw material 216) is depicted as a straight line. By providing an inclination in collecting portion 218, liquid raw material 216 can be directed toward temperature sensor TC even if liquid raw material 216 decreases. This allows temperature sensor TC to detect the temperature of liquid raw material 216 and estimate the remaining amount of liquid raw material 216. This allows for management of the remaining amount of liquid raw material 216.

[0102] (f) Controller 41 is configured to determine that the remaining amount of liquid raw material 216 is insufficient when the temperature measured by temperature sensor TC4 changes. Thus, the remaining amount of liquid raw material 216 can be managed based on changes in the temperature detected by temperature sensor TC4, which is located at the bottom (lower end) of the plurality of temperature sensors TC, such as a temperature increase when liquid raw material 216 is vaporized.

[0103] (g) Controller 41 is configured to cause liquid raw material unit 71 to replenish the liquid raw material from opening 219. Specifically, controller 41 is configured to replenish the liquid raw material from liquid raw material unit 71 through opening 219 based on an estimation of the remaining amount of liquid raw material 216 in accordance with changes in temperature measured by a plurality of temperature sensors TC. This allows reliable management of the remaining amount of liquid raw material 216.

[0104] (h) Controller 41 is configured to stop supplying the liquid raw material from liquid raw material unit 71 when the temperature measured by temperature sensor TC1 reaches a saturated state. Specifically, controller 41 is configured to stop supplying the liquid raw material from liquid raw material unit 71 when the surface (liquid level) of liquid raw material 216 approaches the position of temperature sensor TC1, which is located at the uppermost (top) end of the plurality of temperature sensors TC. This maintains the liquid raw material 216 within main body 221 within a predetermined amount, thereby ensuring space for liquid raw material 216 to transform into vaporized gas. Furthermore, when replenishing liquid raw material into storage tank 200, an appropriate amount (predetermined amount) of liquid raw material can be replenished.

[0105] (i) Controller 41 is configured to replenish the liquid raw material from opening 219 based on the temperature detected by temperature sensor TC4, which is located near opening 219 in bottom wall 202 of storage tank 200. This allows management of the remaining amount of liquid raw material 216 based on changes in the temperature detected by temperature sensor TC4, such as a temperature increase when liquid raw material 216 is vaporized. Furthermore, replenishment of liquid raw material 216 is possible based on the remaining amount of liquid raw material 216.

[0106] (j) The display unit 300 displays the temperature changes measured respectively in different colors according to the positions where the plurality of temperature sensors TC are arranged, thereby making it possible to easily grasp the remaining amount of the liquid raw material 216 .

[0107] (k) The heater 217 for heating the liquid raw material introduced from the opening 219 into the main body 221 is provided, thereby enabling the liquid raw material to be supplied at a temperature close to the vaporization temperature, thereby improving the vaporization efficiency of the liquid raw material 216 .

[0108] (4) Modification

[0109] The storage tank 200 of this embodiment can be deformed as shown in the following modified examples. These modified examples can be combined arbitrarily. Figure 4 Components that differ from the storage tank 200 shown in FIG. Substantially identical components are designated by the same reference numerals, and their descriptions are omitted. Furthermore, in the following modified examples, heater 217 is omitted. It goes without saying that the modified examples can be used in combination with the above-described embodiment as appropriate. The processing steps and conditions in this case can be, for example, the same as those of the above-described embodiment or modified example.

[0110] (Variation 1)

[0111] like Figure 8This indicates that the uppermost side (topmost end) of the surface of collecting portion 218 may be positioned lower than the position of temperature sensor TC4, which is positioned at the lowermost side (bottom end) among the plurality of temperature sensors TC. This modification also achieves the same effects as described above. Furthermore, this modification can be applied such that the liquid raw material is replenished into storage tank 200 when the temperature detected by temperature sensor TC4 changes, that is, when the temperature detected by temperature sensor TC4 reaches the vaporization temperature of liquid raw material 216.

[0112] (Variation 2)

[0113] like Figure 9 Alternatively, sidewall 201 may be configured as a concave-convex shape, with multiple temperature sensors TC disposed within the convex portion protruding into main body 221. This modification also achieves the same effects as the aforementioned embodiment. Furthermore, the configuration of this modification allows for easy temperature detection of liquid raw material 216, for example, by temperature sensor TC4, even when the remaining amount of liquid raw material 216 decreases. This facilitates estimation of the remaining amount of liquid raw material 216 and facilitates management of the remaining amount of liquid raw material 216.

[0114] (Variation 3)

[0115] like Figure 10 As shown in (a), the surface of the collecting portion 218 (the liquid contact surface of the liquid raw material 216) can also be configured to be represented by multiple straight lines (for example, two straight lines) in the longitudinal cross-sectional view of the storage tank 200. Figure 10 As shown in (b), the collecting portion 218 may also be configured to be a polygon larger than a pentagon in the cross-sectional view of the storage tank 200. Figure 10 The position of the straight line indicated by the dotted line in (b) is the position of the lowest side (lower end) of the surface (inclined surface) of the collecting portion 218. In this modification, the same effects as those of the above-described embodiment can be obtained.

[0116] (Variation 4)

[0117] like Figure 11 As shown, collection portion 218 may also be configured to include at least one rod-shaped heater 250 therein. This variation also achieves the same effects as the aforementioned solution. Furthermore, this variation allows heater 250, such as a plug-in heater, to be positioned closer to liquid raw material 216 for heating, thereby further improving the vaporization efficiency of liquid raw material 216.

[0118] (Variant 5)

[0119] like Figure 12As shown in (a), the collecting portion 218 may be configured so as not to be visually recognized in the longitudinal cross-sectional view of the storage tank 200. Specifically, for example, Figure 12 As shown in (b), the collecting portion 218 may be formed in a mortar shape in a manner inclined toward the opening 219. In this modified example, the same effect as the above-mentioned solution can be obtained. Figure 12 In the case where the temperature sensor TC4 is provided in the center of the main body 221 in the cross-sectional view shown in (b), the same effect as the above-mentioned embodiment can be obtained by arranging the temperature sensor TC4 near the opening 219 .

[0120] <Other aspects of the present disclosure>

[0121] The embodiments of the present disclosure have been specifically described above. However, the present disclosure is not limited to the embodiments described above, and various modifications can be made without departing from the spirit and scope of the present disclosure.

[0122] For example, in the above embodiment, the following case is described as an example, that is, the uppermost end of the collecting portion 218 is arranged at a position higher than the arrangement position of the temperature sensor TC4 (see FIG. Figure 4 ) and when it is arranged at a position lower than the lower end of the temperature sensor TC4 (refer to Figure 8 However, the present disclosure is not limited to this embodiment. For example, the collection unit 218 may be arranged at a height opposite to the temperature sensor TC4. Here, the arrangement of the collection unit 218 at a height opposite to the temperature sensor TC4 means, for example, that the temperature sensor TC4 is arranged between the uppermost end and the lowermost end of the collection unit 218. This embodiment also achieves the same effects as the above embodiment.

[0123] For example, in the above-mentioned embodiment, the following case is described as an example, that is, in the longitudinal cross-sectional view of the storage tank 200, the surface (inclined surface) of the collecting portion 218 is constituted to be represented by a straight line (see FIG. Figure 4 ) and the case where the structure is represented by multiple straight lines (refer to Figure 10 However, the present disclosure is not limited to this embodiment. For example, in the longitudinal cross-sectional view of the storage tank 200, the surface of the collection portion 218 may be represented by a combination of straight lines and curves, or may be composed entirely of curves. This embodiment also achieves the same effects as the above-described embodiment.

[0124] For example, in the above embodiment, four temperature sensors TC1 to TC4 are used as the multiple temperature sensors. However, the present disclosure is not limited to this embodiment. For example, two temperature sensors, three temperature sensors, or five or more temperature sensors may be used as the multiple temperature sensors. This embodiment can also achieve the same effects as the above embodiment.

[0125] For example, in the above-described embodiment, multiple temperature sensors are installed on the sidewall 201 of the storage tank 200. However, the present disclosure is not limited to this embodiment. For example, while a protective tube, such as a structure to protect the temperature sensors TC, must be newly added, at least one of the four temperature sensors TC1 to TC4 can be installed in the storage chamber 210. In this case, the temperature sensors TC can also be in contact with the liquid raw material 216, thereby enabling estimation of the remaining amount of the liquid raw material 216. This embodiment also achieves the same effects as the above-described embodiment.

[0126] The recipes used for each treatment are preferably prepared individually based on the treatment content, recorded and stored in the storage device 41c via a telecommunications line or external storage device 412. Preferably, when each treatment is started, the CPU 41a appropriately selects an appropriate recipe based on the treatment content from the multiple recipes recorded and stored in the storage device 41c. This allows a single treatment device to reproducibly form films of various film types, composition ratios, film qualities, and film thicknesses. Furthermore, this reduces the burden on operators, allowing each treatment to be started quickly while avoiding operational errors.

[0127] The above-mentioned recipes are not limited to newly created ones; for example, they can also be prepared by modifying an existing recipe already installed in a processing device. When modifying a recipe, the modified recipe can be installed in the processing device via a telecommunications line or a storage medium containing the recipe. Alternatively, the input / output device 122 of the existing processing device can be operated to directly modify the existing recipe installed in the processing device.

[0128] Furthermore, while this embodiment describes a semiconductor manufacturing process, the present disclosure is not limited thereto. For example, the present disclosure may also be applied to substrate processing processes such as the manufacturing process of liquid crystal devices, the manufacturing process of solar cells, the manufacturing process of light-emitting devices, the processing process of glass substrates, the processing process of ceramic substrates, and the processing process of conductive substrates.

[0129] The above-mentioned embodiment describes an example of forming a film using a batch-type processing device that processes multiple substrates at a time. The present disclosure is not limited to the above-mentioned embodiment and can also be suitably applied to forming a film using a single-wafer processing device that processes one or more substrates at a time. Furthermore, the above-mentioned embodiment describes an example of forming a film using a processing device with a hot-wall processing furnace. The present disclosure is not limited to the above-mentioned embodiment and can also be suitably applied to forming a film using a processing device with a cold-wall processing furnace.

[0130] When these processing devices are used, each process can be performed using the same processing steps and processing conditions as those of the above-mentioned embodiments or modified examples, and the same effects as those of the above-mentioned embodiments or modified examples can be obtained.

[0131] The above-mentioned embodiments or modified examples can be used in combination as appropriate. The processing steps and processing conditions in this case can be, for example, the same as those in the above-mentioned embodiments or modified examples.

[0132] Explanation of symbols

[0133] 221—main body, 201—side wall, TC1~TC4—temperature sensors, 218—collection part.

Claims

1. A gasifier, characterized in that: have: a main body for receiving the liquid raw material at room temperature; a plurality of temperature sensors disposed on the side walls of the main body; and The collecting portion is formed so as to collect the raw material on a side wall where a temperature sensor disposed at a lower end among the plurality of temperature sensors is provided.

2. The gasifier according to claim 1, characterized in that A supply port for supplying the raw materials is provided on the bottom wall of the main body. The collecting portion has a structure for causing the raw material to flow toward the supply port.

3. The gasifier according to claim 2, characterized in that The supply port is provided at a position close to a temperature sensor disposed at a lower end among the plurality of temperature sensors.

4. The gasifier according to claim 1, wherein: The uppermost end of the collecting portion is lower than the temperature sensor disposed at the lower end among the plurality of temperature sensors.

5. The gasifier according to claim 1, characterized in that The uppermost end of the collecting portion is arranged higher than the temperature sensor arranged at the lower end.

6. The gasifier according to claim 5, characterized in that The collecting portion is arranged at a height facing the temperature sensor arranged at the lower end among the plurality of temperature sensors.

7. The gasifier according to claim 1, wherein: The side wall of the main body is formed into a concave-convex shape. The plurality of temperature sensors are arranged in the convex portion.

8. The gasifier according to claim 1, wherein: The plurality of temperature sensors are arranged so as to equally divide the side wall of the main body in a height direction in a longitudinal cross-sectional view.

9. The gasifier according to claim 1, wherein: The surface of the collecting portion is configured to be represented by at least one straight line in a longitudinal cross-sectional view.

10. The gasifier according to claim 9, characterized in that The surface of the collecting portion is configured so as to be represented by a combination of a plurality of the straight lines or a combination of the straight lines and a curved line in a longitudinal cross-sectional view.

11. The gasifier according to claim 1, wherein: The surface structure of the collecting portion is represented by a curved line in a longitudinal cross-sectional view.

12. The gasifier according to claim 2, characterized in that The device further includes a control unit configured to determine a remaining amount of the raw material in the main body based on changes in temperature measured by the plurality of temperature sensors.

13. The gasifier according to claim 12, characterized in that The control unit is configured to determine that the remaining amount of the raw material is insufficient when the temperature of a temperature sensor disposed at a lower end among the plurality of temperature sensors changes.

14. The gasifier according to claim 12, characterized in that It also has a liquid supply unit, The control unit is configured to cause the liquid supply unit to replenish the raw material from the supply port.

15. The gasifier according to claim 14, characterized in that The control unit is configured to control the liquid supply unit to stop supplying the raw material when the temperature of the temperature sensor disposed at the upper end among the plurality of temperature sensors reaches a saturated state.

16. The gasifier according to claim 12, wherein: The control unit is configured to supply the raw material from the supply port based on a temperature detected by a temperature sensor disposed near the supply port and arranged at a lower end among the plurality of temperature sensors.

17. The gasifier according to claim 1, wherein: It also includes a display unit that displays the transition of the temperature measured by the plurality of temperature sensors on a screen. The display unit is configured to display information in different colors according to the position of the temperature sensor.

18. The gasifier according to claim 1, wherein The main body is configured such that at least one rod-shaped heater is provided inside the collecting portion.

19. The gasifier according to claim 2, characterized in that A preheating portion is provided, the preheating portion being configured to heat the raw material introduced into the main body from the supply port.

20. The gasifier according to claim 1, wherein The collecting portion is formed of a polygon in a cross-sectional view.

21. The gasifier according to claim 1, wherein The collecting portion is formed in a mortar shape.

22. A processing device, characterized in that A vaporizer is provided, the vaporizer having: a main body for receiving the liquid raw material at room temperature; a plurality of temperature sensors disposed on the side walls of the main body; and The collecting portion collects the raw material on a side wall where a temperature sensor disposed at a lower end among the plurality of temperature sensors is provided.

23. A processing method, characterized in that: Has the following processes: The frame is disposed in the processing space by the processed object; and The raw materials are introduced into the above-mentioned processing space through the gasifier, The vaporizer includes a main body that stores the liquid raw material at room temperature; a plurality of temperature sensors provided on the side wall of the main body; and a collecting portion that collects the raw material on the side wall where the temperature sensor disposed at the lower end of the plurality of temperature sensors is provided.

24. A method for manufacturing a semiconductor device, characterized in that: The method comprises the step of supplying the raw material to a substrate including a semiconductor using the processing method according to claim 23 to perform a predetermined processing.

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