Magnetoelectric dipole antenna, antenna array and communication equipment

Abstract

The invention provides a magnetoelectric dipole antenna, an antenna array and communication equipment, and relates to the technical field of antennas. In the magnetoelectric dipole antenna, a plurality of radiation sheets are arranged in a circumferential array around an original point, each radiation sheet comprises a first edge and a second edge which are adjacent to each other, and in two adjacent radiation sheets in the circumferential direction of the circumferential array, the first edge of one radiation sheet is opposite to the second edge of the other radiation sheet; the grounding layer is arranged on one side, far away from the first substrate, of the second substrate; one end of each short-circuit column is electrically connected with the radiation sheet, the other end of each short-circuit column is electrically connected with the grounding layer, and the first side and the second side of each radiation sheet are electrically connected with the short-circuit columns; the feed structure comprises a first wire and a second wire, the first wire and the second wire are located on the side, away from the grounding layer, of the second substrate, the first wire and the second wire intersect and are arranged in an insulated mode, the two ends of the first wire and the two ends of the second wire are electrically connected with conductive columns, and part or all of the conductive columns are arranged in the second substrate in a penetrating mode.

Description

Magnetoelectric dipole antenna, antenna array and communication equipment Technical Field

[0001] The present disclosure relates to the field of antenna technology, and in particular to a magnetoelectric dipole antenna, an antenna array, and a communication device. Background Art

[0002] Magnetoelectric dipole antennas offer superior performance, including broadband, symmetrical radiation patterns, low backlobes, and stable gain, making them popular in applications such as base station antennas. With the advancement of communications technology, millimeter-wave antennas, featuring wide bandwidth, high data rates, and low latency, are also gaining adoption. However, magnetoelectric dipole antennas used in the millimeter-wave band are often large in size and difficult to integrate and manufacture.

[0003] Summary of the Invention

[0004] Embodiments of the present disclosure provide a magnetoelectric dipole antenna, an antenna array, and a communication device.

[0005] In one aspect, a magnetoelectric dipole antenna is provided, comprising:

[0006] a first substrate and a second substrate, wherein the first substrate and the second substrate are stacked;

[0007] a plurality of radiating plates, the plurality of radiating plates being disposed on a side of the first substrate away from the second substrate and arranged in a circular array around an origin, the radiating plates including adjacent first and second sides, and wherein the first side of one of two adjacent radiating plates along the circumference of the circular array is opposite to the second side of the other radiating plate;

[0008] a ground layer, the ground layer being arranged on a side of the second substrate away from the first substrate;

[0009] a plurality of shorting posts, each of which is provided in the first substrate and the second substrate, and one end of each shorting post is electrically connected to the radiating plate, and the other end of each shorting post is electrically connected to the ground layer, and the first side and the second side of each radiating plate are electrically connected to the shorting post;

[0010] A feeding structure, wherein the feeding structure includes a first trace and a second trace, the first trace and the second trace are located on a side of the second substrate away from the ground layer, the first trace and the second trace are crossed and insulated, both ends of the first trace and the second trace are electrically connected to a conductive column, and part or all of the structure of the conductive column is passed through the second substrate.

[0011] In some embodiments, the conductive pillar includes a first conductive pillar and a second conductive pillar, wherein the first conductive pillar is connected to one end of the first trace, and the second conductive pillar is connected to one end of the second trace.

[0012] The second substrate is provided with a first blind hole and a second blind hole, the openings of the first blind hole and the second blind hole face the first substrate, at least part of the structure of the first conductive column is located in the first blind hole, and at least part of the structure of the second conductive column is located in the second blind hole.

[0013] In some embodiments, the second substrate is an integrally formed structure.

[0014] In some embodiments, the second substrate includes a first dielectric plate and a second dielectric plate stacked together, the first dielectric plate being closer to the first substrate, the first dielectric plate being provided with a first through hole and a second through hole, and the second dielectric plate blocking a side of the first through hole and the second through hole facing the ground layer to form the first blind hole and the second blind hole.

[0015] In some embodiments, the first dielectric plate and the second dielectric plate each include a plurality of stacked sub-dielectric plates, and each of the sub-dielectric plates has the same thickness.

[0016] In some embodiments, the thickness of the sub-dielectric plate is the same as the thickness of the first substrate.

[0017] In some embodiments, the conductive column further includes a third conductive column and a fourth conductive column, one end of the third conductive column is electrically connected to the other end of the first trace, one end of the fourth conductive column is electrically connected to the other end of the second trace, and the other ends of the third conductive column and the fourth conductive column are exposed from the ground layer.

[0018] In some embodiments, the ground layer is provided with a first avoidance hole and a second avoidance hole, the first avoidance hole is opposite to the third conductive column, and the second avoidance hole is opposite to the fourth conductive column.

[0019] In some embodiments, the first trace is provided on the same layer as the radiation plate, and the second trace is located between the first substrate and the second substrate.

[0020] In some embodiments, the magnetoelectric dipole antenna further includes a parasitic patch, which is located on a side of the first substrate facing the second substrate, and the orthographic projections of the radiation patch and the parasitic patch on the ground layer at least partially overlap.

[0021] In some embodiments, the magnetoelectric dipole antenna includes a plurality of parasitic patches, and the parasitic patches correspond one-to-one to the radiation patches.

[0022] In some embodiments, the parasitic patch and the second trace are disposed on the same layer.

[0023] In some embodiments, the radiation sheet is in the shape of a polygonal ring or a patch.

[0024] In some embodiments, when the radiation piece is annular, a chamfered structure is provided at the corners of the radiation piece.

[0025] In some embodiments, the first side and the second side are respectively connected to a plurality of shorting posts, and the plurality of shorting posts are arranged at intervals along the extending direction of the first side or the second side.

[0026] In some embodiments, the sum of the thicknesses of the first substrate and the second substrate is less than or equal to 0.1λ, where λ is the wavelength at the resonant frequency of the magnetoelectric dipole antenna.

[0027] In some embodiments, the first substrate and the second substrate are glass substrates or plastic substrates, and the shorting pillars and / or the conductive pillars are metallized vias provided on the first substrate and / or the second substrate.

[0028] In some embodiments, an end portion of the first trace and / or the second trace at least partially surrounds the metallized via.

[0029] On the other hand, an antenna array is provided, comprising a plurality of the aforementioned magnetoelectric dipole antennas, wherein the plurality of the aforementioned magnetoelectric dipole antennas are arranged in an array.

[0030] On the other hand, a communication device is provided, comprising the magnetoelectric dipole antenna and / or the antenna array. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0032] FIG1 is a front view of a magnetoelectric dipole antenna provided by an embodiment of the present disclosure;

[0033] FIG2 is a perspective schematic diagram of a magnetoelectric dipole antenna provided by an embodiment of the present disclosure;

[0034] FIG3 is an exploded view of a magnetoelectric dipole antenna provided in an embodiment of the present disclosure;

[0035] FIG4 is a cross-sectional view of FIG1 taken along line AA;

[0036] FIG5 is a cross-sectional rotation diagram of FIG1 about BB;

[0037] FIG6 is a cross-sectional view of CC in FIG1 ;

[0038] FIG7 is a cross-sectional rotation diagram of FIG1 about DD;

[0039] FIG8 is a partial structural diagram of a magnetoelectric dipole antenna provided by an embodiment of the present disclosure;

[0040] FIG9 is a V1-direction view of FIG8 ;

[0041] FIG10 is a V2-direction view of FIG8 ;

[0042] FIG11 is a front view of another magnetoelectric dipole antenna provided in an embodiment of the present disclosure;

[0043] FIG12 is a front view of another magnetoelectric dipole antenna provided in an embodiment of the present disclosure;

[0044] FIG13 is a front view of another magnetoelectric dipole antenna provided in an embodiment of the present disclosure;

[0045] FIG14 is a front view of a first substrate in a magnetoelectric dipole antenna provided by an embodiment of the present disclosure;

[0046] FIG15 is a partial structural diagram of a magnetoelectric dipole antenna provided by an embodiment of the present disclosure;

[0047] FIG16 is a front view of a second substrate in a magnetoelectric dipole antenna provided by an embodiment of the present disclosure;

[0048] FIG17 is a partial structural diagram of a magnetoelectric dipole antenna provided by an embodiment of the present disclosure;

[0049] FIG18 is a partial structural diagram of a magnetoelectric dipole antenna provided by an embodiment of the present disclosure;

[0050] FIG19 is a diagram showing a manufacturing process of a magnetoelectric dipole antenna according to an embodiment of the present disclosure;

[0051] FIG20 is a front view of a first substrate in another magnetoelectric dipole antenna provided by an embodiment of the present disclosure;

[0052] FIG21 is a front view of a magnetoelectric dipole antenna provided in an embodiment of the present disclosure;

[0053] FIG22 is an exploded view of a magnetoelectric dipole antenna provided in an embodiment of the present disclosure;

[0054] FIG23 is a cross-sectional view of EE in FIG21;

[0055] FIG24 is a cross-sectional view of FF in FIG21;

[0056] FIG25 is a cross-sectional view of GG in FIG21;

[0057] FIG26 is a cross-sectional view of HH in FIG21 ;

[0058] FIG27 is a front view of a first dielectric plate in a magnetoelectric dipole antenna provided by an embodiment of the present disclosure;

[0059] FIG28 is a partial structural diagram of a magnetoelectric dipole antenna provided by an embodiment of the present disclosure;

[0060] FIG29 is a front view of a second medium in a magnetoelectric dipole antenna provided by an embodiment of the present disclosure;

[0061] FIG30 is a diagram showing a manufacturing process of a magnetoelectric dipole antenna according to an embodiment of the present disclosure;

[0062] FIG31 is a front view of a magnetoelectric dipole antenna provided in an embodiment of the present disclosure;

[0063] FIG32 is a cross-sectional view of JJ in FIG31 ;

[0064] FIG33 is a cross-sectional view of KK in FIG31 ;

[0065] FIG34 is a front view of a magnetoelectric dipole antenna provided in an embodiment of the present disclosure;

[0066] FIG35 is an exploded view of a magnetoelectric dipole antenna provided in an embodiment of the present disclosure;

[0067] FIG36 is a schematic diagram of a partial structure of a magnetoelectric dipole antenna provided in an embodiment of the present disclosure;

[0068] FIG37 is an S11 simulation diagram of a magnetoelectric dipole antenna provided by an embodiment of the present disclosure;

[0069] FIG38 is a gain simulation diagram of a magnetoelectric dipole antenna provided by an embodiment of the present disclosure;

[0070] FIG39 is a front view of an antenna array provided in an embodiment of the present disclosure;

[0071] Figure 40 is a front view of another antenna array provided in an embodiment of the present disclosure. Specific embodiments

[0072] The following will be combined with the accompanying drawings in the embodiments of the present disclosure to clearly and completely describe the technical solutions in the embodiments of the present disclosure. Obviously, the embodiments described are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present disclosure.

[0073] In the embodiments of the present disclosure, words such as "first", "second", "third", and "fourth" are used to distinguish between identical or similar items with substantially the same functions and effects. This is only for the purpose of clearly describing the technical solutions of the embodiments of the present disclosure, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features.

[0074] In the embodiments of the present disclosure, “a plurality of” means two or more, and “at least one” means one or more, unless otherwise clearly and specifically defined.

[0075] In the embodiments of the present disclosure, the orientations or positional relationships indicated by terms such as “upper” and “lower” are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present disclosure and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present disclosure.

[0076] The magnetoelectric dipole antenna provided by the present disclosure is described in detail below with reference to specific embodiments.

[0077] Example 1

[0078] Figure 1 is a front view of a magnetoelectric dipole antenna provided in an embodiment of the present disclosure, Figure 2 is a stereoscopic schematic diagram of a magnetoelectric dipole antenna provided in an embodiment of the present disclosure, Figure 3 is an exploded view of a magnetoelectric dipole antenna provided in an embodiment of the present disclosure, Figure 4 is a cross-sectional view of AA in Figure 1, Figure 5 is a rotated cross-sectional view of BB in Figure 1, Figure 6 is a cross-sectional view of CC in Figure 1, Figure 7 is a rotated cross-sectional view of DD in Figure 1, Figure 8 is a partial structural diagram of a magnetoelectric dipole antenna provided in an embodiment of the present disclosure, Figure 9 is a view in the direction of V1 in Figure 8, and Figure 10 is a view in the direction of V2 in Figure 8.

[0079] As shown in FIG. 1 to FIG. 10 , the magnetoelectric dipole antenna includes a first substrate 2 , a second substrate 3 , and a feeding structure 70 , a ground layer 4 , a plurality of radiation plates 11 , and a plurality of shorting posts 60 disposed thereon.

[0080] 2 to 7 , the first substrate 2 and the second substrate 3 serve as the skeleton of the magnetoelectric dipole antenna, and are used to support and connect other structures of the antenna, such as the feeding structure 70 , the grounding layer 4 , the radiation plate 11 , and the shorting post 60 .

[0081] The first substrate 2 and the second substrate 3 are both thin plate structures, and are stacked along the thickness direction of the first substrate 2 and the second substrate 3. For example, the first substrate 2 and the second substrate 3 each include an inner side surface and an outer side surface perpendicular to the thickness direction, and the inner side surface of the first substrate 2 is arranged opposite the inner side surface of the second substrate 3.

[0082] The first substrate 2 and the second substrate 3 can be connected to form an integral structure, for example, the inner side surface of the first substrate 2 is connected to the inner side surface of the second substrate 3. The inner side surface of the first substrate 2 and the inner side surface of the second substrate 3 can be directly in contact with and connected to each other. For example, the first substrate 2 and the second substrate 3 are both glass substrates, and the first substrate 2 and the second substrate 3 are connected to form an integral structure through a glass bonding process. Other film layers can also be provided between the inner side surface of the first substrate 2 and the inner side surface of the second substrate 3. For example, an adhesive can be provided between the inner side surface of the first substrate 2 and the inner side surface of the second substrate 3 to achieve the connection between the first substrate 2 and the second substrate 3 through the adhesive.

[0083] The first substrate 2 and the second substrate 3 are connected into an integrated structure, which improves the structural rigidity of the magnetoelectric dipole antenna and makes the antenna less likely to deform.

[0084] In practical applications, the first substrate 2 and the second substrate 3 can be made of a rigid material, such as glass, polytetrafluoroethylene (PTFE), or other hard plastics, to prevent deformation of the first substrate 2 and the second substrate 3, which could degrade antenna performance. The materials of the first substrate 2 and the second substrate 3 can be the same or different.

[0085] When the material of the first substrate 2 and the second substrate 3 is glass, the magnetoelectric dipole antenna can be prepared using a glass-based semiconductor process, thereby improving the production efficiency of the magnetoelectric dipole antenna, improving the product dimensional accuracy, and improving the degree of product integration.

[0086] The shapes of the first substrate 2 and the second substrate 3 can be polygonal, such as a rectangle, hexagon, or octagon, or circular, or irregular, and the shapes of the first substrate 2 and the second substrate 3 can be the same or different. The present embodiment does not limit the shapes of the first substrate 2 and the second substrate 3. For example, the shapes of the first substrate 2 and the second substrate 3 are centrally symmetrical. For ease of illustration, the drawings in the description of the present embodiment illustrate only the example of the first substrate 2 and the second substrate 3 being both square.

[0087] Continuing with Figures 1 to 7 , radiating plate 11 is a thin, conductive structure that can radiate electromagnetic waves into free space when stimulated by an electrical signal. It can also receive electromagnetic waves propagating in free space and convert them into electrical signals. In practical applications, radiating plate 11 can be made of a low-resistance metal material such as copper or aluminum.

[0088] The shape of the radiating plate 11 may be polygonal, elliptical, or irregular. For example, when the shape of the radiating plate 11 is polygonal, the shape of the radiating plate 11 may be triangular, trapezoidal, rectangular, pentagonal, hexagonal, heptagonal, octagonal, etc. For another example, when the shape of the radiating plate 11 is irregular, the shape of the radiating plate 11 may be teardrop-shaped, i.e., one end of the radiating plate 11 is sharper and the other end of the radiating plate 11 is blunter.

[0089] The radiating plate 11 can be a ring-shaped structure or a patch-shaped structure. When the radiating plate 11 is a ring-shaped structure, the shape of the radiating plate 11 refers to the shape of the area enclosed by the outer contour of the radiating plate 11. The circumference of the ring structure can be half the wavelength at the resonant frequency of the magnetoelectric dipole antenna.

[0090] The radiating plate 11 shown in Figures 1 to 3 is square and annular. Specifically, the outer contour of the radiating plate 11 is square, and a square hollow region is defined within the radiating plate 11, with the outer square being concentric with the hollow region. The hollow region is shaped identically to the region enclosed by the outer contour of the radiating plate 11, ensuring that the cross-sectional dimensions of all portions of the radiating plate 11 are substantially uniform, and thus, the resistance of all portions of the radiating plate 11 is substantially uniform. For example, if the region enclosed by the outer contour of the radiating plate 11 is hexagonal, the hollow region is also hexagonal, and both hexagons have the same shape.

[0091] Figure 11 is a front view of another magnetoelectric dipole antenna provided in an embodiment of the present disclosure, Figure 12 is a front view of another magnetoelectric dipole antenna provided in an embodiment of the present disclosure, and Figure 13 is a front view of another magnetoelectric dipole antenna provided in an embodiment of the present disclosure.

[0092] As shown in Figure 11 , the radiating plate 11 can also be a square patch. Compared with the square patch shown in Figure 11 , when the radiating plate 11 is in a square ring shape, the electrical length of the radiating plate 11 can be increased, thereby reducing the outer dimensions of the radiating plate 11 while maintaining a constant electrical length, thereby contributing to miniaturization of the antenna.

[0093] As shown in FIG12 , when the radiating plate 11 is in a square ring shape, one or more corners of the radiating plate 11 may be provided with a chamfered structure 111. The provision of the chamfered structure 111 can adjust the electrical length of the radiating plate 11 and the impedance matching characteristics of the radiating plate 11. The number of chamfered structures 111 can be one or more; the chamfered structure 111 can be provided in the inner ring, the outer ring, or both; and the chamfered structure 111 can be either a rounded chamfered structure 111 or a straight-edge chamfered structure 111.

[0094] As shown in FIG13 , when the radiation plate 11 is in a ring structure, another square ring structure can be connected at one corner of the square ring structure, so that the two square ring structures are connected together to form the radiation plate 11. This can adjust the electrical length and impedance matching characteristics of the radiation plate 11.

[0095] It should be noted that the shape of the radiation sheet 11 is not limited to this. In actual application, the radiation sheet 11 can also be set to other shapes as needed, which are not listed here one by one.

[0096] The plurality of radiating plates 11 are disposed on a side of the first substrate 2 away from the second substrate 3. For example, the radiating plates 11 are connected to the outer side surface of the first substrate 2. The structures and dimensions of the plurality of radiating plates 11 may be identical or different. In the present embodiment, the embodiment in which the plurality of radiating plates 11 have identical structures and dimensions is used as an example.

[0097] The plurality of radiation plates 11 are arranged in a circular array around an origin, where the origin is a virtual point on the first substrate 2. For example, the origin is the geometric center of the first substrate 2. For example, when the first substrate 2 is a square, the origin is the intersection of two diagonals of the first substrate 2.

[0098] Exemplarily, the magneto-electric dipole antenna includes four radiating plates 11 , which are arranged in a circular array around an origin, such that the four radiating plates 11 form two pairs of electric dipoles.

[0099] For example, the outer side surface of the first substrate 2 has a plane rectangular coordinate system, the origin of the plane rectangular coordinate system is the origin of the circular array, and the plane rectangular coordinate system divides the outer side surface of the first substrate 2 into four quadrants, each of which is provided with a radiation plate 11.

[0100] It should be noted that a gap is provided between any two adjacent radiating plates 11. The "any two adjacent radiating plates 11" herein may be radially adjacent radiating plates 11 or circumferentially adjacent radiating plates 11. Providing a gap between any two adjacent radiating plates 11 prevents short circuits caused by contact between the radiating plates 11.

[0101] 11 , the radiation piece 11 includes adjacent first edges 112 and second edges 113 . Of the two radiation pieces 11 adjacent to each other along the circumference of the circular array, the first edge 112 of one radiation piece 11 is opposite to the second edge 113 of the other radiation piece 11 .

[0102] The first side 112 and the second side 113 of the radiation piece 11 refer to the sides on the outer contour of the radiation piece 11. For example, when the outer contour of the radiation piece 11 is a square, the first side 112 and the second side 113 refer to the sides of the square closer to the origin of the circular array.

[0103] When the first side 112 of one radiating plate 11 is opposite the second side 113 of another radiating plate 11, the first side 112 and the second side 113 are opposite and spaced apart. For example, referring again to Figure 11, when the outer contour of the radiating plate 11 is a square, the first side 112 and the second side 113 of two adjacent radiating plates 11 are parallel and spaced apart. Of course, the first side 112 and the second side 113 of two adjacent radiating plates 11 may also form a certain angle. For example, as the distance away from the origin increases, the distance between the first side 112 and the second side 113 of two adjacent radiating plates 11 gradually increases.

[0104] Exemplarily, when four radiation pieces 11 are arranged in a circular array around the origin, a cross-shaped middle area is formed between the four radiation pieces 11, and the midpoint of the middle area is the origin of the circular array.

[0105] The grounding layer 4 serves as the grounding structure of the magnetoelectric dipole antenna and is a thin sheet structure made of a conductor. For example, the grounding layer 4 is made of a metal material with relatively low resistance, such as copper or aluminum.

[0106] 1 to 7 , the ground layer 4 is disposed on a side of the second substrate 3 away from the first substrate 2 . For example, the ground layer 4 is disposed on an outer side of the second substrate 3 , so that the ground layer 4 is opposite to and spaced from the plurality of radiation plates 11 .

[0107] Exemplarily, the ground layer 4 is parallel to the plurality of radiation plates 11 and spaced apart, so that the distance between the ground layer 4 and each radiation plate 11 is the same.

[0108] In the disclosed embodiment, the distance between the radiating plate 11 and the grounding layer 4 can be less than or equal to 0.1λ, where λ is the wavelength of the magnetoelectric dipole antenna at its resonant frequency. For example, when the magnetoelectric dipole antenna is used in the millimeter wave frequency band, the distance between the radiating plate 11 and the grounding layer 4 can be less than or equal to 1mm. In this case, the sum of the thicknesses of the first substrate 2 and the second substrate 3 is less than or equal to 0.1λ.

[0109] In conventional magnetoelectric dipole antennas, the distance between the radiating layer and the ground plane is typically greater than or equal to 0.4λ, resulting in a large cross-sectional dimension that hinders antenna miniaturization and integration. In the magnetoelectric dipole antenna provided in the present embodiment, the distance between the radiating plate 11 and the ground plane 4 can be less than or equal to 0.1λ, reducing the antenna's cross-sectional dimension, making the antenna smaller and improving its integration.

[0110] In practical applications, the first substrate 2 and the second substrate 3 can be made of materials with low dielectric constants, which can further reduce the distance between the radiation plate 11 and the ground layer 4 .

[0111] The ground layer 4 may have an area facing each of the radiating plates 11. Furthermore, the areas facing each of the radiating plates 11 may be equal. For example, the ground layer 4 may be symmetrical, with the orthographic projection of the origin of the circular array on the ground layer 4 located at the geometric center of the ground layer 4.

[0112] The shape of the ground layer 4 can be circular, or a regular polygon such as a square or a regular octagon, and the orthographic projections of the radiation plates 11 on the ground layer 4 have the same shape and size. The drawings of the embodiments of the present disclosure only illustrate the ground layer 4 as a square.

[0113] The disclosed embodiment does not limit the size of the ground layer 4; the ground layer 4 may be aligned with a portion of the radiating plate 11, or the entire radiating plate 11. For example, the shape of the ground layer 4 is the same as that of the second substrate 3, for example, the outer edge of the ground layer 4 coincides with the outer edge of the second substrate 3. While meeting performance requirements, the magnetoelectric dipole antenna can be made lightweight by reducing the size of the second substrate 3 and the ground layer 4.

[0114] In some embodiments, the size of the ground layer 4 can be increased so that the positive projection of the radiation plate 11 on the ground layer 4 is located within the range of the ground layer 4. During the operation of the magnetoelectric dipole antenna, the ground layer 4 can reflect electromagnetic waves, that is, the ground layer 4 plays a directional role.

[0115] Continuing with Figures 4 and 5 , the shorting post 60 can be made of a conductor such as metal and is used to electrically connect the radiating plate 11 and the ground layer 4. The shorting post 60 is disposed within the first substrate 2 and the second substrate 3, with one end of the shorting post 60 electrically connected to the radiating plate 11 and the other end of the shorting post 60 electrically connected to the ground layer 4.

[0116] For example, the shorting post 60 penetrates the first substrate 2 and the second substrate 3 along the thickness direction of the first substrate 2 and the second substrate 3, one end of the shorting post 60 is exposed from the outer side surface of the first substrate 2 and is electrically connected to the radiation plate 11, and the other end of the shorting post 60 is exposed from the outer side surface of the second substrate 3 and is electrically connected to the ground layer 4.

[0117] Exemplarily, the first substrate 2 and the second substrate 3 are provided with via holes penetrating along the thickness direction, and the shorting posts 60 are provided in the via holes.

[0118] The shorting post 60 can be a hollow cylindrical structure made of a conductive material, for example, a conductive layer formed on the inner wall of the via hole by electroplating or deposition. Of course, the shorting post 60 can also be a solid cylindrical structure made of a conductive material.

[0119] For example, with continued reference to FIG. 4 and FIG. 5 , the shorting post 60 includes a first post 61 and a second post 62 . The first post 61 is disposed in the first substrate 2 , and the second post 62 is disposed in the second substrate 3 . The first post 61 and the second post 62 are electrically connected.

[0120] There are various methods for preparing the shorting posts 60. For example, after the first substrate 2 and the second substrate 3 are connected, the via holes of the first substrate 2 are connected to the via holes of the second substrate 3. Then, the shorting posts 60 are formed in the two connected via holes through electroplating or deposition. For another example, a first post 61 is formed in the via hole of the first substrate 2 through electroplating or deposition, and a second post 62 is formed in the via hole of the second substrate 3 through electroplating or deposition. When the first substrate 2 and the second substrate 3 are connected, the first post 61 and the second post 62 are electrically connected.

[0121] When the short-circuit column 60 includes a first column 61 and a second column 62, the axes of the first column 61 and the second column 62 can coincide, or the axes of the first column 61 and the second column 62 can be staggered a certain distance along a direction parallel to the first substrate 2, as long as the first column 61 and the second column 62 are electrically connected.

[0122] 1 , 4 and 5 , the first side 112 and the second side 113 of each radiating plate 11 are electrically connected to the shorting posts 60 , so that the shorting posts 60 and the grounding layer 4 between the shorting posts 60 form multiple pairs of magnetic dipoles.

[0123] Two radiating plates 11 adjacent to each other in the circumferential direction of the circular array include a first side 112 and a second side 113 that are arranged opposite to each other. The first side 112 belongs to one of the radiating plates 11, and the second side 113 belongs to the other radiating plate 11. The short-circuit column 60 connected to the first side 112 and the second side 113 and the ground layer 4 located between the first side 112 and the second side 113 form a "U"-shaped conductive structure, that is, a magnetic dipole is formed.

[0124] Exemplarily, the magnetoelectric dipole antenna includes four radiating plates 11, a cross-shaped middle area is formed between the four radiating plates 11, and a plurality of short-circuit posts 60 are arranged along the outer contour of the cross-shaped middle area, thereby forming two pairs of magnetic dipoles.

[0125] The first side 112 may be connected to one shorting post 60 or multiple shorting posts 60. When multiple shorting posts 60 are connected to the first side 112, the multiple shorting posts 60 may be arranged at intervals along the extension direction of the first side 112. In this case, the spacing between two adjacent shorting posts 60 may be the same or different.

[0126] Similarly, the second side 113 can be connected to one shorting post 60 or multiple shorting posts 60. When multiple shorting posts 60 are connected to the second side 113, the multiple shorting posts 60 can be arranged at intervals along the extension direction of the second side 113. In this case, the spacing between two adjacent shorting posts 60 can be the same or different.

[0127] When the magneto-electric dipole antenna includes four radiating plates 11, the four radiating plates 11, the ground layer 4, and the shorting posts 60 connected between the radiating plates 11 and the ground layer 4 form two pairs of magneto-electric dipoles, with the polarization direction of one pair of magneto-electric dipoles intersecting with the polarization direction of the other pair of magneto-electric dipoles. For example, if the polarization direction of one pair of magneto-electric dipoles is 45 degrees and the polarization direction of the other pair of magneto-electric dipoles is -45 degrees, the magneto-electric dipole antenna is a dual-polarized magneto-electric dipole antenna.

[0128] Continuing with reference to Figures 6 to 10 , the magnetoelectric dipole antenna further includes a feed structure 70 for feeding the magnetoelectric dipole coupling. For example, when the magnetoelectric dipole antenna includes four radiating patches 11 , the orthographic projection of the feed structure 70 on the first substrate 2 is located in the middle of the cross-shaped region between the four radiating patches.

[0129] The feed structure 70 includes a first trace 12 and a second trace 51. The first trace 12 and the second trace 51 are located on a side of the second substrate 3 away from the ground layer 4. The first trace 12 and the second trace 51 intersect and are insulated. For example, the first trace 12 and the second trace 51 are arranged on different layers, and an insulating layer is provided between the first trace 12 and the second trace 51.

[0130] Exemplarily, the first trace 12 is provided on the same layer as the radiation plate 11. This can reduce the number of conductive layers in the magnetoelectric dipole antenna, thereby reducing the cross-sectional size of the magnetoelectric dipole antenna.

[0131] Exemplarily, the second trace 51 is located between the first substrate 2 and the second substrate 3. The second trace 51 can be arranged on the side of the first substrate 2 facing the second substrate 3; the second trace 51 can also be arranged on the side of the second substrate 3 facing the first substrate 2; the second trace 51 can also include a two-layer structure, with one layer arranged on the side of the first substrate 2 facing the second substrate 3, and the other layer arranged on the side of the second substrate 3 facing the first substrate 2, with the two layers stacked to form the second trace 51.

[0132] When the first trace 12 and the radiation plate 11 are arranged on the same layer, and the second trace 51 is located between the first substrate 2 and the second substrate 3, the thickness of the first substrate 2 can be smaller than the thickness of the second substrate 3, that is, the thickness of the first substrate 2 is thinner, so that the distance between the first trace 12 and the second trace 51 is smaller.

[0133] Exemplarily, the thickness of the first substrate 2 is 0.1 mm.

[0134] The lengths of the first trace 12 and the second trace 51 may be equal or unequal.

[0135] Exemplarily, the first trace 12 and the second trace 51 are arranged orthogonally, and the center of the first trace 12 overlaps the center of the second trace 51. When there is a cross-shaped middle area between the multiple radiation plates 11, the center of the first trace 12 and the second trace 51 is located at the center of the cross-shaped middle area.

[0136] When preparing a magnetoelectric dipole antenna, a first trace 12 can be formed on the side of the first substrate 2 away from the second substrate 3 by an electroplating or deposition process, and a second trace 51 can be formed on the side of the first substrate 2 facing the second substrate 3 or on the side of the second substrate 3 facing the first substrate 2 by an electroplating or deposition process.

[0137] Both ends of the first trace 12 are electrically connected to conductive posts, which extend from the first trace 12 toward the ground layer 4. The first trace 12 and the conductive posts connected to the first trace 12 form a Γ-shaped conductive structure. Both ends of the second trace 51 are electrically connected to conductive posts, which extend from the second trace 51 toward the ground layer 4. The second trace 51 and the conductive posts connected to the second trace 51 form a Γ-shaped conductive structure. In other words, the feed structure 70 is composed of two Γ-shaped conductive structures.

[0138] Continuing to refer to Figures 6 to 10, the multiple conductive columns may include a first conductive column 71, a second conductive column 72, a third conductive column 73 and a fourth conductive column 74. The first conductive column 71 and the third conductive column 73 are respectively connected to the two ends of the first trace 12, and the second conductive column 72 and the fourth conductive column 74 are respectively connected to the two ends of the second trace 51.

[0139] The feeding structure 70 can adopt a two-point feeding method. A first avoidance hole 41 can be provided in the ground layer 4 at a position opposite the third conductive post 73, and a second avoidance hole 42 can be provided in the ground layer 4 at a position opposite the fourth conductive post 74. The third conductive post 73 can be exposed through the first avoidance hole 41, and the fourth conductive post 74 can be exposed through the second avoidance hole 42, so that the third conductive post 73 and the fourth conductive post 74 can be electrically connected to an SMA (SubMiniature version A) connector or a coaxial cable to receive electrical signals.

[0140] For example, when the third conductive post 73 is electrically connected to the coaxial line, the core wire of the coaxial line passes through the first avoidance hole 41 and is electrically connected to the third conductive post 73, and the shielding wire of the coaxial line is electrically connected to the ground layer 4. The connection method of the fourth conductive post 74 is similar and will not be repeated here.

[0141] The shapes of the first avoidance hole 41 and the second avoidance hole 42 can be circular or polygonal, and can be determined according to the shapes of the conductive column, the SMA connector, and the coaxial line in actual application.

[0142] Part or all of the conductive pillars are disposed within the second substrate 3. For example, when the first trace 12 is disposed on a side of the first substrate 2 away from the second substrate 3, part of the first conductive pillar 71 and the third conductive pillar 73 electrically connected to the first trace 12 are disposed within the first substrate 2, while part of the first conductive pillar 71 and the third conductive pillar 73 are disposed within the second substrate 3. For another example, when the second trace 51 is disposed between the first substrate 2 and the second substrate 3, the entire second conductive pillar 72 and the fourth conductive pillar 74 electrically connected to the second trace 51 are disposed within the second substrate 3.

[0143] For example, as shown in FIG9 , the length L of the first trace 12 is 2 mm to 4 mm, for example, the length L of the first trace 12 is any value selected from 2 mm, 2.5 mm, 3 mm, 3.5 mm, and 4 mm, or a value within a range consisting of any two values. The length H1 of the first conductive pillar 71 is 0.1 mm to 1 mm, for example, the length H1 of the first conductive pillar 71 is any value selected from 0.1 mm, 0.2 mm, 0.5 mm, 0.8 mm, and 1 mm, or a value within a range consisting of any two values. The length H2 of the third conductive pillar 73 is 0.8 mm to 1 mm, for example, the length H2 of the third conductive pillar 73 is any value selected from 0.8 mm, 0.85 mm, 0.9 mm, 0.95 mm, and 1 mm, or a value within a range consisting of any two values.

[0144] For example, as shown in FIG10 , the length l of the second trace 51 is 2 mm to 4 mm, for example, the length l of the second trace 51 is any value selected from 2 mm, 2.5 mm, 3 mm, 3.5 mm, and 4 mm, or a value within a range consisting of any two values. The length h1 of the second conductive pillar 72 is 0.1 mm to 1 mm, for example, the length h1 of the second conductive pillar 72 is any value selected from 0.1 mm, 0.2 mm, 0.5 mm, 0.8 mm, and 1 mm, or a value within a range consisting of any two values. The length h2 of the fourth conductive pillar 74 is 0.8 mm to 1 mm, for example, the length h2 of the fourth conductive pillar 74 is any value selected from 0.8 mm, 0.85 mm, 0.9 mm, 0.95 mm, and 1 mm, or a value within a range consisting of any two values.

[0145] The length H2 of the third conductive pillar 73 is greater than the length h2 of the fourth conductive pillar 74. The length H1 of the first conductive pillar 71 and the length h1 of the second conductive pillar 72 can be the same or different. For example, the length H1 of the first conductive pillar 71 is different from the length h1 of the second conductive pillar 72, and the shortest distance between the ground layer 4 and the first conductive pillar 71 is equal to the shortest distance between the ground layer 4 and the second conductive pillar 72. In other words, the first conductive pillar 71 and the second conductive pillar 72 are flush with each other at one end facing the ground layer 4.

[0146] The conductive pillars can be hollow cylindrical structures made of conductive material. For example, via holes are provided in the first substrate 2 and the second substrate 3, and the conductive pillars are conductive layers formed on the inner walls of the via holes by electroplating or deposition. Of course, the conductive pillars can also be solid cylindrical structures made of conductive material.

[0147] There are various methods for preparing the first conductive pillar 71. For example, after the first substrate 2 and the second substrate 3 are connected, the via holes of the first substrate 2 are connected to the via holes of the second substrate 3. Then, the first conductive pillar 71 is formed in the two connected via holes through electroplating or deposition. Another example is to form sub-conductive pillars in the via holes of the first substrate 2 and the second substrate 3 through electroplating or deposition. When the first substrate 2 and the second substrate 3 are connected, the two sub-conductive pillars are electrically connected to form the first conductive pillar 71. The preparation method of the third conductive pillar 73 is similar and will not be further described here.

[0148] When the first conductive pillar 71 includes two sub-conductive pillars, the axes of the two sub-conductive pillars may coincide, or the axes of the two sub-conductive pillars may be staggered a certain distance along a direction parallel to the first substrate 2, as long as the two sub-conductive pillars are electrically connected.

[0149] Figure 16 is a front view of the second substrate 3 in a magnetoelectric dipole antenna according to an embodiment of the present disclosure. As shown in Figure 16, the second substrate 3 may be provided with a first blind hole 32a and a second blind hole 32b, with the openings of the first blind hole 32a and the second blind hole 32b facing the first substrate 2. A blind hole is a hole that does not penetrate the second substrate 3 along its thickness.

[0150] At least a portion of the first conductive pillar 71 is located within the first blind hole 32a. For example, when the first trace 12 and the radiation plate 11 are provided on the same layer, the portion of the first conductive pillar 71 is located within the first blind hole 32a. At least a portion of the second conductive pillar 72 is located within the second blind hole 32b. For example, when the second trace 51 is provided between the first substrate 2 and the second substrate 3, the entire portion of the second conductive pillar 72 is located within the second blind hole 32b.

[0151] The second substrate 3 can be an integrally molded structure. An integrally molded structure refers to a structure manufactured through an integral molding process, as distinguished from a structure in which multiple parts are connected into one piece by bonding, welding, or other methods. For example, when the second substrate 3 is a glass substrate, the second substrate 3 is manufactured by forming an integrally molded glass plate with blind holes and through holes.

[0152] For example, when the second substrate 3 is a glass substrate, a first blind hole 32a and a second blind hole 32b can be opened on the side of the second substrate 3 facing the first substrate 2 by etching, and then a first conductive column 71 is formed in the first blind hole 32a and a second conductive column 72 is formed in the second blind hole 32b by electroplating or deposition process.

[0153] The present disclosure also provides a method for preparing a magnetoelectric dipole antenna, which is used to prepare the magnetoelectric dipole antenna described in Example 1. The following describes the method for preparing the magnetoelectric dipole antenna provided in the present disclosure in detail, taking the example of glass substrates as an example, and combining the accompanying drawings.

[0154] Figure 14 is a front view of the first substrate 2 in a magnetoelectric dipole antenna provided in an embodiment of the present disclosure, Figure 15 is a partial structural diagram of a magnetoelectric dipole antenna provided in an embodiment of the present disclosure, Figure 16 is a front view of the second substrate 3 in a magnetoelectric dipole antenna provided in an embodiment of the present disclosure, Figure 17 is a partial structural diagram of a magnetoelectric dipole antenna provided in an embodiment of the present disclosure, Figure 18 is a partial structural diagram of a magnetoelectric dipole antenna provided in an embodiment of the present disclosure, and Figure 19 is a preparation process diagram of a magnetoelectric dipole antenna provided in an embodiment of the present disclosure.

[0155] The preparation method of the magnetoelectric dipole antenna includes the following steps:

[0156] a. Provide a first substrate 2.

[0157] As shown in Figure 14, the first substrate 2 has two first vias 21 spaced apart in the vertical direction shown in Figure 14. The first substrate 2 also has a plurality of second vias 22 spaced apart. The number of second vias 22 is at least twice the number of radiating plates 11. For example, if a magnetoelectric dipole antenna includes four radiating plates 11, the first substrate 2 has at least eight second vias 22, meaning at least two second vias 22 for each radiating plate 11.

[0158] The first via hole 21 and the second via hole 22 penetrate the first substrate 2 along the thickness direction of the first substrate 2 .

[0159] For example, the magnetoelectric dipole antenna includes four radiating plates 11, each of which has six second vias 22. The plurality of second vias 22 form a cross-shaped central region, with the two first vias 21 located within the cross-shaped central region. Furthermore, seven second vias 22 are provided for each radiating plate 11, as shown in FIG20 .

[0160] The first substrate 2 can be made of a glass plate by etching the first via hole 21 and the second via hole 22 .

[0161] b. Forming a conductive layer on the inner walls of the first via hole 21 and the second via hole 22 .

[0162] For example, a metal conductive layer such as copper may be formed on the inner walls of the first via hole 21 and the second via hole 22 by electroplating or deposition process, so that the first via hole 21 and the second via hole 22 are metallized via holes.

[0163] c. Forming the radiation plate 11 and the first trace 12 on the surface of the first substrate 2 .

[0164] For example, a conductive layer can be formed on the surface of the first substrate 2, and then etched on the conductive layer through a patterning process to form the radiation plate 11 and the first trace 12. The resulting structure is shown in Figure 15. In Figure 15, the second via 22 is covered by the radiation plate 11 and is therefore represented by a dotted line.

[0165] 15 , the two sides of the first trace 12 are tangent to the periphery of the first via 21. In practical applications, the end of the first trace 12 can also surround the first via 21, making the electrical connection between the first trace 12 and the conductive layer in the first via 21 more reliable.

[0166] d. Provide a second substrate 3.

[0167] As shown in FIG. 16 , the second substrate 3 is provided with a plurality of third via holes 33 . The third via holes 33 correspond to the second via holes 22 one by one. The third via holes 33 penetrate the second substrate 3 along the thickness direction of the second substrate 3 .

[0168] The second substrate 3 is further provided with a first blind hole 32a, a second blind hole 32b, a fourth via hole 31a, and a fifth via hole 31b. The first blind hole 32a and the second blind hole 32b do not penetrate the second substrate 3 along the thickness direction of the second substrate 3, while the fourth via hole 31a and the fifth via hole 31b penetrate the second substrate 3 along the thickness direction of the second substrate 3.

[0169] The first blind holes 32 a and the fourth via holes 31 a are arranged at intervals along the vertical direction shown in FIG. 16 , and the first blind hole 32 a is opposite to one of the first via holes 21 , and the fourth via hole 31 a is opposite to the other first via hole 21 .

[0170] The second blind holes 32 b and the fifth via holes 31 b are arranged at intervals along the horizontal direction as shown in FIG. 16 .

[0171] e. Forming a conductive layer on the inner walls of the first blind hole 32a, the second blind hole 32b, the fourth via hole 31a, and the fifth via hole 31b.

[0172] For example, a metal conductive layer such as copper can be formed on the inner walls of the first blind hole 32a, the second blind hole 32b, the fourth via hole 31a and the fifth via hole 31b through electroplating or deposition process, so that the first blind hole 32a, the second blind hole 32b, the fourth via hole 31a and the fifth via hole 31b are metallized vias.

[0173] f. Form a second trace 51 on one surface of the second substrate 3 .

[0174] For example, a conductive layer may be formed on the surface of the second substrate 3 , and then the second traces 51 may be formed by etching the conductive layer through a patterning process. The resulting structure is shown in FIG. 17 .

[0175] In Figure 17 , the two edges of the second trace 51 are tangent to the periphery of the second blind via 32b and the fifth via 31b, respectively. In practical applications, the end of the second trace 51 can also surround the second blind via 32b and the fifth via 31b, making the electrical connection between the second trace 51 and the conductive layer in the second blind via 32b and the fifth via 31b more reliable.

[0176] g. Form a ground layer 4 on the other surface of the second substrate 3.

[0177] For example, a conductive layer may be formed on the other surface of the second substrate 3 , and then the first avoidance hole 41 and the second avoidance hole 42 may be formed by etching on the conductive layer through a patterning process. The resulting structure is shown in FIG. 18 .

[0178] h. Connect the first substrate 2 and the second substrate 3.

[0179] As shown in Figure 19, the structure in the upper dashed box is the structure obtained in step c, and the structure in the lower dashed box is the structure obtained in step g. The first substrate 2 and the second substrate 3 are connected along the arrow direction to prepare a magnetoelectric dipole antenna.

[0180] The first substrate 2 and the second substrate 3 can be bonded together using adhesive or a glass bonding process.

[0181] The magnetoelectric dipole antenna provided by the embodiments of the present disclosure has a smaller cross-sectional size and a higher degree of integration. Furthermore, when the first substrate 2 and the second substrate 3 are glass substrates, the magnetoelectric dipole antenna can be manufactured using a glass-based semiconductor process, improving the antenna's manufacturing efficiency and dimensional accuracy.

[0182] Figure 37 is a simulation diagram of the S11 value of a magnetoelectric dipole antenna provided in accordance with an embodiment of the present disclosure, and Figure 38 is a simulation diagram of the gain value of a magnetoelectric dipole antenna provided in accordance with an embodiment of the present disclosure. As shown in Figures 37 and 38, the magnetoelectric dipole antenna provided in accordance with an embodiment of the present disclosure has an S11 value less than -10dB in the 23.8-36GHz range, demonstrating high gain and normal operation.

[0183] Example 2

[0184] Figure 21 is a front view of a magnetoelectric dipole antenna provided in an embodiment of the present disclosure, Figure 22 is a decomposition diagram of a magnetoelectric dipole antenna provided in an embodiment of the present disclosure, Figure 23 is a cross-sectional view of EE in Figure 21, Figure 24 is a cross-sectional view of FF in Figure 21, Figure 25 is a cross-sectional view of GG in Figure 21, and Figure 26 is a cross-sectional view of HH in Figure 21.

[0185] As shown in FIG. 21 to FIG. 26 , the main difference between the embodiment of the present disclosure and the first embodiment is that the second substrate 3 includes a first dielectric plate 3 a and a second dielectric plate 3 b stacked together, and the first dielectric plate 3 a is closer to the first substrate 2 .

[0186] Figure 27 is a front view of the first dielectric plate 3a in a magnetoelectric dipole antenna provided in an embodiment of the present disclosure. As shown in Figure 27, the first dielectric plate 3a is provided with a first through-hole 34a and a second through-hole 34b, which extend through the first dielectric plate 3a along its thickness. Figure 29 is a front view of the second dielectric plate 3b in a magnetoelectric dipole antenna provided in an embodiment of the present disclosure. As shown in Figure 29, the second dielectric plate 3b has no openings at positions opposite the first through-hole 34a and the second through-hole 34b. This allows the second dielectric plate 3b to block the sides of the first through-hole 34a and the second through-hole 34b facing the ground layer 4, forming the first blind hole 32a and the second blind hole 32b.

[0187] In the magnetoelectric dipole antenna provided in the embodiment of the present disclosure, the depth of the first blind hole 32a and the second blind hole 32b is equal to the thickness of the first dielectric plate 3a. Therefore, the lengths of the first conductive pillar 71 and the second conductive pillar 72 can be controlled by controlling the thickness of the first dielectric plate 3a. This is equivalent to directly forming the first blind hole 32a and the second blind hole 32b in the second substrate 3 in the first embodiment. By controlling the thickness of the first dielectric plate 3a, the lengths of the first conductive pillar 71 and the second conductive pillar 72 are controlled, resulting in higher dimensional accuracy of the first conductive pillar 71 and the second conductive pillar 72.

[0188] 27 and 29 , the first dielectric plate 3 a further defines two sixth via holes 35 , and the second dielectric plate 3 b further defines two seventh via holes 36 , with the sixth via holes 35 and the seventh via holes 36 corresponding to each other.

[0189] The present disclosure also provides a method for fabricating a magnetoelectric dipole antenna, which is used to fabricate the magnetoelectric dipole antenna described in Example 2. The materials of the first dielectric plate 3a and the second dielectric plate 3b can be the same or different. The following describes the method for fabricating the magnetoelectric dipole antenna provided in the present disclosure in detail, using the example of glass substrates for both the first dielectric plate 3a and the second dielectric plate 3b, in conjunction with the accompanying drawings.

[0190] Figure 27 is a front view of the first medium in a magnetoelectric dipole antenna provided in an embodiment of the present disclosure, Figure 28 is a partial structural diagram of a magnetoelectric dipole antenna provided in an embodiment of the present disclosure, Figure 29 is a front view of the second medium in a magnetoelectric dipole antenna provided in an embodiment of the present disclosure, and Figure 30 is a preparation process diagram of a magnetoelectric dipole antenna provided in an embodiment of the present disclosure.

[0191] The preparation method of the magnetoelectric dipole antenna includes the following steps:

[0192] a. Provide a first substrate 2.

[0193] As shown in Figure 14, the first substrate 2 has two first vias 21 spaced apart in the vertical direction shown in Figure 14. The first substrate 2 also has a plurality of second vias 22 spaced apart. The number of second vias 22 is at least twice the number of radiating plates 11. For example, if a magnetoelectric dipole antenna includes four radiating plates 11, the first substrate 2 has at least eight second vias 22, meaning at least two second vias 22 for each radiating plate 11.

[0194] The first via hole 21 and the second via hole 22 penetrate the first substrate 2 along the thickness direction of the first substrate 2 .

[0195] For example, the magnetoelectric dipole antenna includes four radiating plates 11, each of which has six second vias 22. The plurality of second vias 22 form a cross-shaped central region, with the two first vias 21 located within the cross-shaped central region. Furthermore, seven second vias 22 are provided for each radiating plate 11, as shown in FIG20 .

[0196] The first substrate 2 can be made of a glass plate by etching the first via hole 21 and the second via hole 22 .

[0197] b. Forming a conductive layer on the inner walls of the first via hole 21 and the second via hole 22 .

[0198] For example, a metal conductive layer such as copper may be formed on the inner walls of the first via hole 21 and the second via hole 22 by electroplating or deposition process, so that the first via hole 21 and the second via hole 22 are metallized via holes.

[0199] c. Forming the radiation plate 11 and the first trace 12 on the surface of the first substrate 2 .

[0200] For example, a conductive layer can be formed on the surface of the first substrate 2, and then etched on the conductive layer through a patterning process to form the radiation plate 11 and the first trace 12. The resulting structure is shown in Figure 15. In Figure 15, the second via 22 is covered by the radiation plate 11 and is therefore represented by a dotted line.

[0201] 15 , the two sides of the first trace 12 are tangent to the periphery of the first via 21. In practical applications, the end of the first trace 12 can also surround the first via 21, making the electrical connection between the first trace 12 and the conductive layer in the first via 21 more reliable.

[0202] d1. Provide a first dielectric plate 3a.

[0203] As shown in FIG27 , the first dielectric plate 3a is provided with a first through hole 34a and a second through hole 34b, which penetrate the first dielectric plate 3a along its thickness direction. The first dielectric plate 3a is also provided with two sixth through holes 35 .

[0204] d2. Form a second trace 51 on the surface of the first dielectric plate 3a.

[0205] For example, a conductive layer may be formed on the surface of the first dielectric plate 3 a , and then the second trace 51 may be formed by etching the conductive layer through a patterning process. The resulting structure is shown in FIG. 28 .

[0206] d3. Provide a second dielectric plate 3b.

[0207] As shown in Figure 29, the second dielectric plate 3b has no openings at positions opposite to the first through hole 34a and the second through hole 34b. The second dielectric plate 3b also has a sixth through hole, which corresponds one-to-one to the fifth through hole.

[0208] d4. Form a ground layer 4 on the surface of the second dielectric plate 3b.

[0209] For example, a conductive layer may be formed on one surface of the second dielectric plate 3 b , and then the first avoidance hole 41 and the second avoidance hole 42 may be formed by etching the conductive layer through a patterning process.

[0210] d5. Connect the first substrate 2, the first dielectric plate 3a and the second dielectric plate 3b.

[0211] As shown in Figure 30, the structure within the upper dashed box is the structure obtained in step c, the structure within the middle dotted box is the structure obtained in step d2, and the structure within the lower double-dotted box is the structure obtained in step d4. The first substrate 2, first dielectric plate 3a, and second dielectric plate 3b are connected along the arrows to produce a magnetoelectric dipole antenna.

[0212] The first substrate 2 , the first dielectric plate 3 a and the second dielectric plate 3 b may be bonded together using adhesive or by glass bonding technology.

[0213] Example 3

[0214] FIG31 is a front view of a magnetoelectric dipole antenna provided in an embodiment of the present disclosure, FIG32 is a cross-sectional view of JJ in FIG31 , and FIG33 is a cross-sectional view of KK in FIG31 .

[0215] As shown in FIG31 to FIG33 , the main difference between the embodiment of the present disclosure and the second embodiment is that the first dielectric plate 3a and the second dielectric plate 3b both include stacked multi-layer sub-dielectric plates 311 , and each sub-dielectric plate 311 has the same thickness.

[0216] Depending on the lengths of the first conductive pillars 71 and the second conductive pillars 72, the thicknesses of the first dielectric plate 3a and the second dielectric plate 3b in the second embodiment may be the same or different. When the thicknesses of the first dielectric plate 3a and the second dielectric plate 3b differ, the thickness specifications of the dielectric plates increase, which increases the complexity of the process. In the disclosed embodiment, both the first dielectric plate 3a and the second dielectric plate 3b are formed by stacking multiple sub-dielectric plates 311 of the same thickness, reducing the thickness specifications of the dielectric plates and reducing the complexity of the process.

[0217] For example, as shown in Figures 32 and 31 , the first dielectric plate 3a and the second dielectric plate 3b are each formed by stacking two sub-dielectric plates 311 of the same thickness. In actual use, the number of sub-dielectric plates 311 included in the first dielectric plate 3a and the number of sub-dielectric plates 311 included in the second dielectric plate 3b can be the same or different. For example, the first dielectric plate 3a includes four sub-dielectric plates 311, and the second dielectric plate 3b includes five sub-dielectric plates 311, for a total of five sub-dielectric plates 311 in the first and second dielectric plates 3a and 3b.

[0218] To further reduce the thickness of the dielectric plate, the thickness of the first substrate 2 can be equal to that of the sub-dielectric plate 311, that is, the first substrate 2 can also be regarded as a sub-dielectric plate 311. In this case, the magnetoelectric dipole antenna only includes a dielectric plate of one thickness specification, further reducing process complexity.

[0219] Exemplarily, the first dielectric plate 3a includes four sub-dielectric plates 311 , the second dielectric plate 3b includes five sub-dielectric plates 311 , and the first substrate 2 serves as another sub-dielectric plate 311 , that is, the magnetoelectric dipole antenna is formed by stacking ten sub-dielectric plates 311 .

[0220] The two adjacent dielectric sub-plates 311 may be bonded together by adhesive or by glass bonding process.

[0221] The preparation method of the magnetoelectric dipole antenna in Example 3 can refer to the preparation method of the magnetoelectric dipole antenna in Example 2. The main difference is that the first dielectric plate 3a and the second dielectric plate 3b are formed by stacking multiple dielectric sub-plates 311.

[0222] Example 4

[0223] Figure 34 is a front view of a magnetoelectric dipole antenna provided in an embodiment of the present disclosure, Figure 35 is a decomposition diagram of a magnetoelectric dipole antenna provided in an embodiment of the present disclosure, and Figure 36 is a partial structural schematic diagram of a magnetoelectric dipole antenna provided in an embodiment of the present disclosure.

[0224] As shown in Figures 34 to 36 , the main difference between the embodiment of the present disclosure and Examples 1, 2, and 3 is that the magnetoelectric dipole antenna further includes a parasitic patch 52. Parasitic patch 52 is located on the side of first substrate 2 facing second substrate 3, and the orthographic projections of radiating plate 11 and parasitic patch 52 on ground layer 4 at least partially overlap. The provision of parasitic patch 52 can improve the gain of the magnetoelectric dipole antenna.

[0225] The parasitic patch 52 may be made of a conductive material, such as a metal material with low resistance, such as copper or aluminum.

[0226] The shape of the parasitic patch 52 can be a polygon such as a square, a hexagon, an octagon, or a circle, an ellipse, or other irregular shapes. The embodiment of the present disclosure does not limit the shape of the parasitic patch 52.

[0227] The parasitic patch 52 may further include gaps, such as I-shaped, I-shaped, and X-shaped gaps.

[0228] The magnetoelectric dipole antenna includes a plurality of parasitic patches 52 , and the parasitic patches 52 correspond one-to-one to the radiation patches 11 .

[0229] The radiating patch is located below the radiating patch 11 and is blocked by the first substrate 2. Therefore, in Figure 34, dashed boxes are used to represent parasitic patches 52, and each dashed box represents one parasitic patch 52. For example, as shown in Figure 34, the magnetoelectric dipole antenna includes four radiating patches 11 and four parasitic patches 52, and the radiating patches 11 and the parasitic patches 52 are arranged opposite each other.

[0230] 35 , the parasitic patch 52 can be provided on the same layer as the second trace 51. This can reduce the number of conductive layers inside the antenna, thereby reducing the cross-sectional size of the antenna.

[0231] Example 5

[0232] FIG39 is a front view of an antenna array provided in an embodiment of the present disclosure, and FIG40 is a front view of another antenna array provided in an embodiment of the present disclosure.

[0233] As shown in FIG39 and FIG40 , the antenna array includes a plurality of the above-mentioned magnetoelectric dipole antennas, and the plurality of magnetoelectric dipole antennas are arranged in an array.

[0234] Exemplarily, as shown in FIG39 , the antenna array includes four magnetoelectric dipole antennas, and the four magnetoelectric dipole antennas are arranged in a 1*4 array.

[0235] Exemplarily, as shown in FIG40 , the antenna array includes four magnetoelectric dipole antennas, and the four magnetoelectric dipole antennas are arranged in a 2*2 array.

[0236] Example 6

[0237] An embodiment of the present disclosure provides a communication device, which includes any one of the magnetoelectric dipole antennas of Embodiments 1 to 4, or the antenna array described in Embodiment 5 of the communication device, or the communication device includes both any one of the magnetoelectric dipole antennas of Embodiments 1 to 4 and the antenna array described in Embodiment 5.

[0238] The communication device provided in the embodiment of the present disclosure may be a base station. The base station involved in the embodiment of the present disclosure may also be referred to as a radio access network (RAN) device. The base station may be a base station (base transceiver station, BTS) in global system of mobile communication (GSM) or code division multiple access (CDMA), or a base station (nodeB, NB) in wideband code division multiple access (WCDMA), or an evolutionary base station (eNB or eNodeB) in long term evolution (LTE), or a relay station or access point, or a base station in a 5G network, or a base station in a future communication system, etc., and is not limited here.

[0239] The communication device provided by the embodiments of the present disclosure may also be a terminal device. The terminal device involved in the embodiments of the present disclosure may be a device with wireless transceiver functions. The terminal device involved in the embodiments of the present disclosure may be deployed on land, including indoors or outdoors or on a vehicle; it may also be deployed on the water surface (such as a ship, etc.); it may also be deployed in the air (for example, on an airplane, a balloon, and a satellite, etc.). The terminal device involved in the embodiments of the present disclosure may be a user equipment (UE), wherein the UE includes a vehicle-mounted device with a wireless communication function, etc. The terminal device may also be a wireless terminal in industrial control, a wireless terminal in unmanned driving, a wireless terminal in telemedicine, a wireless terminal in a smart grid, a wireless terminal in a smart city, a wireless terminal in a smart home, and the like.

[0240] Of course, the communication device provided in the embodiment of the present disclosure may also be other devices with wireless communication functions, which are not listed here one by one.

[0241] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this disclosure should be included in the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. A magnetoelectric dipole antenna, characterized in that, Comprising: A first substrate and a second substrate, the first substrate and the second substrate being stacked; A plurality of radiation fins, the plurality of radiation fins being disposed on a side of the first substrate away from the second substrate, and the plurality of radiation fins being arranged in a circumferential array around an origin, the radiation fin including adjacent first and second sides, and among two adjacent radiation fins along the circumferential direction of the circumferential array, the first side of one of the radiation fins is opposite to the second side of the other radiation fin; A ground layer, the ground layer being disposed on a side of the second substrate away from the first substrate; A plurality of shorting posts, the shorting posts being inserted through the first substrate and the second substrate, and one end of the shorting post being electrically connected to the radiation fin, the other end of the shorting post being electrically connected to the ground layer, and the first side and the second side of each radiation fin are both electrically connected to the shorting post; A feeding structure, the feeding structure including a first trace and a second trace, the first trace and the second trace being located on a side of the second substrate away from the ground layer, the first trace and the second trace intersecting and being insulated from each other, and both ends of the first trace and both ends of the second trace are electrically connected to conductive posts, and part or all of the structure of the conductive posts is inserted through the second substrate.

2. The magnetoelectric dipole antenna according to claim 1, wherein, The conductive post includes a first conductive post and a second conductive post, the first conductive post being connected to one end of the first trace, and the second conductive post being connected to one end of the second trace, The second substrate is provided with a first blind hole and a second blind hole, openings of the first blind hole and the second blind hole face the first substrate, at least part of the structure of the first conductive post is located in the first blind hole, and at least part of the structure of the second conductive post is located in the second blind hole.

3. The magnetoelectric dipole antenna according to claim 2, wherein The second substrate is an integrally formed structure.

4. The magnetoelectric dipole antenna according to claim 2, wherein, The second substrate includes a first dielectric layer and a second dielectric layer which are stacked, the first dielectric layer is closer to the first substrate, the first dielectric layer is provided with a first through hole and a second through hole, and the second dielectric layer seals a side of the first through hole and the second through hole facing the ground layer to form the first blind hole and the second blind hole.

5. The magnetoelectric dipole antenna according to claim 4, wherein, Both the first dielectric layer and the second dielectric layer include a plurality of sub-dielectric layers which are stacked, and the thickness of each sub-dielectric layer is the same.

6. The magnetoelectric dipole antenna according to claim 5, wherein, The thickness of the sub-dielectric layer is the same as the thickness of the first substrate.

7. The magnetoelectric dipole antenna according to claim 2, wherein, The conductive post further includes a third conductive post and a fourth conductive post, one end of the third conductive post is electrically connected to the other end of the first trace, one end of the fourth conductive post is electrically connected to the other end of the second trace, and the other ends of the third conductive post and the fourth conductive post are exposed by the ground layer.

8. The magnetoelectric dipole antenna according to claim 7, wherein, The ground layer is provided with a first avoidance hole and a second avoidance hole, the first avoidance hole is opposite to the third conductive post, and the second avoidance hole is opposite to the fourth conductive post.

9. The magnetoelectric dipole antenna according to claim 1, wherein The first trace is disposed on the same layer as the radiation fin, and the second trace is located between the first substrate and the second substrate.

10. The magnetoelectric dipole antenna according to claim 1, wherein, The magnetoelectric dipole antenna further includes a parasitic patch, the parasitic patch is located on a side of the first substrate facing the second substrate, and at least a part of the orthographic projection of the radiation patch and the parasitic patch on the ground layer overlaps.

11. The magnetoelectric dipole antenna according to claim 10, wherein, The magnetoelectric dipole antenna includes a plurality of the parasitic patches, and the parasitic patches correspond to the radiation patches one by one.

12. The magnetoelectric dipole antenna according to claim 10, wherein, The parasitic patch is disposed on the same layer as the second trace.

13. The magnetoelectric dipole antenna according to claim 1, wherein, The radiation patch is in a polygonal ring shape or a patch shape.

14. The magnetoelectric dipole antenna according to claim 13, wherein, When the radiation patch is in a ring shape, a chamfer structure is provided at a corner of the radiation patch.

15. The magnetoelectric dipole antenna according to claim 1, wherein, A plurality of shorting posts are respectively connected to the first side and the second side, and the plurality of shorting posts are arranged at intervals along the extending direction of the first side or the second side.

16. The magnetoelectric dipole antenna according to claim 1, wherein, The sum of the thicknesses of the first substrate and the second substrate is less than or equal to 0.1λ, where λ is the wavelength at the resonance frequency point of the magnetoelectric dipole antenna.

17. The magnetoelectric dipole antenna according to claim 1, wherein, The first substrate and the second substrate are glass substrates or plastic substrates, and the shorting posts and / or the conductive posts are metallized vias provided in the first substrate and / or the second substrate.

18. The magnetoelectric dipole antenna according to claim 17, wherein, At least a part of an end of the first trace and / or the second trace surrounds the metallized via.

19. An antenna array, characterized in that, It includes a plurality of magnetoelectric dipole antennas as described in any one of claims 1 to 18, and the plurality of magnetoelectric dipole antennas are arranged in an array.

20. A communication device, characterized in that, It includes a magnetoelectric dipole antenna as described in any one of claims 1 to 18, or includes an antenna array as described in claim 19.

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