Composition and application thereof, mixture and preparation method thereof, and semiconductor device

Abstract

The invention provides a composition and application thereof, a mixture and a preparation method thereof, and a semiconductor device. The composition comprises a component A and a component B. The component A comprises an isothiazolinone solution; the component B comprises soluble metal salt. The composition provided by the invention contains the soluble metal salt and the isothiazolinone solution at the same time and has a good antibacterial effect, and the soluble metal salt can effectively stabilize 5-chloro-2-methylisothiazolin-3-ketone in the isothiazolinone solution. The composition has a wide application scene, and when the composition is added into a product with antibacterial requirements, the stability of the composition can be remarkably improved while the product has relatively strong antibacterial ability, so that a functional product containing the composition is ensured to exert own functions, the bacteria are effectively inhibited, and the service life of the functional product is prolonged.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of semiconductor preparation technology, and specifically to a composition and its application, a mixture and its preparation method, and a semiconductor device. Background Art

[0002] With the development of semiconductor technology, the industry's requirements for the precision of semiconductor devices are getting higher and higher. The flattening of semiconductor devices is one of the important processes that determine their ultimate precision and performance. The flattening process can make the surface of the chip smoother, which can effectively avoid circuit short circuits caused by different resistance values ​​due to uneven thickness of the same layer of metal film to a certain extent. The flatter chip surface will also make it easier to focus during etching, broaden the range of wiring layers, and thus improve the overall performance of semiconductor devices. Common flattening compositions on the market usually include components such as abrasives, organic acids, chelating agents, surfactants, pH regulators, and a small amount of antibacterial agents, but these antibacterial agents exhibit poor antibacterial effects and poor stability in complex working environments, which in turn leads to a decrease in the performance of the flattening solution, affecting its polishing effect, and thus affecting the quality of the chip, making it difficult to meet the production needs of high-precision semiconductor devices. Summary of the Invention

[0003] In view of this, the embodiments of the present application provide a composition and its application, a mixture and its preparation method, and a semiconductor device. The composition provided in the present application has good antibacterial effects and a wide range of application scenarios. When added to products with antibacterial requirements, it can significantly improve the stability of the composition while ensuring that the product has strong antibacterial ability, and can ensure that the product remains stable for a long time under various environmental conditions. Furthermore, while ensuring that the functional products containing the composition can perform their own functions, it can effectively inhibit bacteria and extend their service life.

[0004] The first aspect of the present application provides a composition comprising component A and component B;

[0005] The A component includes an isothiazolinone solution; the isothiazolinone solution includes 5-chloro-2-methylisothiazolin-3-one, 2-methylisothiazolin-3-one and a solvent;

[0006] The B component includes a soluble metal salt; the soluble metal salt includes a soluble copper salt and / or a soluble magnesium salt.

[0007] The composition provided in the present application contains both a soluble metal salt and an isothiazolinone solution. The soluble metal salt can effectively stabilize 5-chloro-2-methylisothiazolin-3-one in the isothiazolinone solution and inhibit the decomposition of 5-chloro-2-methylisothiazolin-3-one, thereby improving the stability of the composition. When added to products with antibacterial requirements, it can ensure that the product remains stable for a long time under various environmental conditions, thereby ensuring that the functional product containing the composition can exert its own function while effectively inhibiting bacteria and extending its service life.

[0008] In an embodiment of the present application, at least a portion of the soluble metal salt is used to stabilize the 5-chloro-2-methylisothiazolin-3-one in the isothiazolinone solution. The soluble metal salt of the composition of the present application can effectively improve the stability of the 5-chloro-2-methylisothiazolin-3-one in the isothiazolinone solution, thereby effectively inhibiting the decomposition of the 5-chloro-2-methylisothiazolin-3-one, thereby significantly improving the stability of the composition during use, and further extending the service life of the functional product containing the composition.

[0009] In an embodiment of the present application, the soluble metal salt includes a divalent metal ion; in the composition, the mass ratio of the 5-chloro-2-methylisothiazolin-3-one to the divalent metal ion is 1:1-1000:1. By controlling the mass ratio of the divalent metal ion to the 5-chloro-2-methylisothiazolin-3-one within an appropriate range, the antibacterial effect and stability of the composition can be further enhanced.

[0010] In the embodiment of the present application, in the isothiazolinone solution, the mass percentage of the 5-chloro-2-methylisothiazolin-3-one is 10%-12%, the mass percentage of the 2-methylisothiazolin-3-one is 0.5%-1.5%, and the mass percentage of the solvent is 86.5%-89.5%. The present application can further exert the synergistic bactericidal effect of 5-chloro-2-methylisothiazolin-3-one and 2-methylisothiazolin-3-one by controlling the content of each component in the isothiazolinone solution within an appropriate range.

[0011] In the embodiment of the present application, the soluble copper salt includes one or more of CuSO4, Cu(NO3)2 and CuCl2; the soluble magnesium salt includes one or more of MgSO4, Mg(NO3)2 and MgCl2. 2+ and / or Mg 2+ The use of soluble metal salts in combination with isothiazolinone solution containing 5-chloro-2-methylisothiazolin-3-one is beneficial to the 2+ or Mg 2+It cooperates with 5-chloro-2-methylisothiazoline-3-one to further improve the stability of 5-chloro-2-methylisothiazoline-3-one in the product without affecting the excellent bactericidal effect of the isothiazolinone solution itself, thereby improving the stability and antibacterial effect of the product.

[0012] The second aspect of the present application provides a mixture, comprising a composition as provided in the first aspect. The mixture containing the composition provided herein can ensure its inherent capabilities (such as cleaning, polishing, etc.) while effectively inhibiting the growth of fungi and bacteria in the mixture, achieving an antibacterial and bactericidal effect, and extending the service life of the mixture. The composition has good solubility, dispersibility, and stability in the mixture, thereby improving the uniformity and use effect of the entire product.

[0013] In some embodiments of the present application, the main functional component is a planarization composition or a cleaning solution.

[0014] In some embodiments of the present application, the main functional component is a leveling solution, and the mass ratio of the 5-chloro-2-methylisothiazoline-3-one to the divalent metal ion in the mixture is 1:1-200:1.

[0015] In some embodiments of the present application, the main functional component is a cleaning solution, and the mass ratio of the 5-chloro-2-methylisothiazoline-3-one to the divalent metal ion in the mixture is 1:1-1000:1.

[0016] In the embodiment of the present application, in the mixture, the mass percentage of the 5-chloro-2-methylisothiazoline-3-one is 0.0005%-0.05%; the mass percentage of the divalent metal ion is 0.000001%-0.002%.

[0017] In an embodiment of the present application, the turbidity of the mixture after being placed at 60° C. for 24 hours is less than or equal to 10 NTU.

[0018] In an embodiment of the present application, the absolute value of the difference in pH value of the mixture before and after being placed at 60° C. for 24 hours is less than or equal to 0.5.

[0019] The third aspect of the present application provides a method for preparing the mixture provided in the second aspect, comprising:

[0020] The component A and the component B are added to the main functional component and mixed to obtain a mixture.

[0021] The third aspect of the present application provides an application of the composition provided in the first aspect, wherein the composition provided in the first aspect or the mixture provided in the third aspect is applied in a planarization process for semiconductor preparation.

[0022] A fourth aspect of the present application provides a semiconductor device, comprising a planarization component, wherein the planarization component is produced by a planarization process using the composition provided in the first aspect or the mixture provided in the second aspect. DETAILED DESCRIPTION

[0023] The present application is further described in detail below in conjunction with preferred embodiments, but the protection scope of the present application is not limited to the following specific embodiments.

[0024] In this application, all professional terms have the same meanings as those generally understood by those skilled in the art. The professional terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the scope of protection of this application.

[0025] With the development of semiconductor technology, the industry's requirements for the precision of semiconductor devices are getting higher and higher. The flattening of semiconductor devices is one of the important processes that determine their ultimate precision and performance. The flattening process can make the surface of the chip smoother, which can effectively avoid circuit short circuits caused by different resistance values ​​due to uneven thickness of the same layer of metal film to a certain extent. The flatter chip surface will also make it easier to focus during etching, broaden the range of wiring layers, and thus improve the overall performance of semiconductor devices. Common flattening compositions on the market usually include components such as abrasives, organic acids, chelating agents, surfactants, pH regulators, and a small amount of antibacterial agents, but these antibacterial agents exhibit poor antibacterial effects and poor stability in complex working environments, which in turn leads to a decrease in the performance of the flattening solution, affecting its polishing effect, and thus affecting the quality of the chip, making it difficult to meet the production needs of high-precision semiconductor devices.

[0026] In order to solve the above problems, the present application provides a composition comprising an isothiazolinone solution and a soluble metal salt. The composition has a wide range of application scenarios. When it is added to products with antibacterial requirements, it can significantly improve the stability of the composition while ensuring that the product has strong antibacterial ability, and can ensure that the product remains stable for a long time under various environmental conditions. Furthermore, while ensuring that the functional products containing the composition perform their own functions, they can effectively inhibit bacteria and extend their service life.

[0027] The present application embodiment provides a composition, which includes component A and component B; wherein component A includes an isothiazolinone solution, the isothiazolinone solution includes 5-chloro-2-methylisothiazoline-3-one, 2-methylisothiazoline-3-one and a solvent; component B includes a soluble metal salt, and the soluble metal salt includes a soluble copper salt and / or a soluble magnesium salt. The composition provided by the present application is used in combination with component B and component A. The isothiazolinone compounds 5-chloro-2-methylisothiazoline-3-one and 2-methylisothiazoline-3-one in component A are matched to cooperate with each other to exert a strong bactericidal effect. The isothiazolinone compound mixed system containing 5-chloro-2-methylisothiazoline-3-one and 2-methylisothiazoline-3-one can react with the phospholipids that constitute the basic skeleton of the cell membrane, thereby destroying the cell membrane of bacteria and fungi, penetrating the cell membrane to destroy the normal function of bacteria and fungi, effectively inhibiting their growth and causing their death, and then playing an effective bactericidal role. In addition, at least part of the soluble metal salt in component B of the composition can stabilize the isothiazolinone solution in component A, specifically the divalent metal ions (Cu 2+ and / or Mg 2+ ) is conducive to the coordination of 5-chloro-2-methylisothiazoline-3-one in the isothiazolinone solution, so that the instability of 5-chloro-2-methylisothiazoline-3-one in the system can be improved without affecting the antibacterial and bactericidal effect of the isothiazolinone compounds, and the precipitation or stratification caused by its decomposition can be effectively suppressed, thereby improving the stability of the composition as a whole under various environmental conditions. Adding it to a functional product can effectively achieve a broad-spectrum antibacterial effect and significantly improve its service life while ensuring its own good performance (such as polishing, cleaning, etc.), and can also improve its overall uniformity. In some embodiments of the present application, the A component and the B component in the composition can be placed separately. When in use, when the composition is added to a product with antibacterial needs, the A component, the B component and the product are mixed to play an antibacterial effect.

[0028] In an embodiment of the present application, at least a portion of the soluble metal salt is used to stabilize the 5-chloro-2-methylisothiazolin-3-one in the isothiazolinone solution. The stability of 5-chloro-2-methylisothiazoline-3-one in the isothiazolinone solution of component A of the composition of the present application is poor. When the composition containing 5-chloro-2-methylisothiazoline-3-one is added as an antibacterial additive to complex systems such as other functional products, 5-chloro-2-methylisothiazoline-3-one is extremely easy to decompose, resulting in precipitation or stratification. The soluble metal salt in component B of the composition of the present application can effectively improve the stability of 5-chloro-2-methylisothiazoline-3-one in the isothiazolinone solution in component A. The divalent metal ions in the soluble metal salt are conducive to coordination with 5-chloro-2-methylisothiazoline-3-one, thereby effectively inhibiting the decomposition of 5-chloro-2-methylisothiazoline-3-one, thereby significantly improving the stability of the composition during use, so that the mixture containing the composition can be stably stored for a long time under various environmental conditions, thereby further extending its service life.

[0029] In the embodiment of the present application, the soluble metal salt includes a soluble copper salt and / or a soluble magnesium salt. That is, the divalent metal ions in the soluble metal salt in the composition include Cu 2+ Mg 2+ In some embodiments, the soluble metal salt in the composition is a soluble copper salt. In this case, the divalent metal ion is Cu 2+ In some embodiments, the soluble metal salt in the composition is a soluble magnesium salt. In this case, the divalent metal ion is Mg 2+ In some embodiments, the soluble metal salt in the composition is a soluble copper salt and a soluble magnesium salt. In this case, the divalent metal ion is Cu 2+ and Mg 2+ .

[0030] In an embodiment of the present application, in the composition, the mass ratio of 5-chloro-2-methylisothiazolin-3-one in component A to the divalent metal ions in component B is 1:1-1000:1. In some specific embodiments, the mass ratio of 5-chloro-2-methylisothiazolin-3-one in component A to the divalent metal ions in component B can be, for example, 1:1, 5:1, 10:1, 20:1, 40:1, 50:1, 60:1, 80:1, 100:1, 200:1, 500:1, 800:1, 1000:1. The present application can further enhance the antibacterial effect and stability of the composition by controlling the mass ratio of divalent metal ions to 5-chloro-2-methylisothiazolin-3-one within an appropriate range.

[0031] In the embodiment of the present application, the isothiazolinone solution includes 5-chloro-2-methylisothiazoline-3-one, 2-methylisothiazoline-3-one and a solvent. The present application uses 5-chloro-2-methylisothiazoline-3-one and 2-methylisothiazoline-3-one to match, and the obtained isothiazolinone compound mixed system has a wider sterilization range and better sterilization effect. The present application uses a special isothiazolinone compound 5-chloro-2-methylisothiazoline-3-one and 2-methylisothiazoline-3-one to match and selects an isothiazolinone solution obtained by a suitable solvent. Compared with a single 5-chloro-2-methylisothiazoline-3-one or a single 2-methylisothiazoline-3-one, when the final antibacterial effect is equivalent, the amount of isothiazolinone compounds in the isothiazolinone solution of the present application is less, which can further reduce the production cost of the composition while ensuring the sterilization effect of the composition. In the embodiment of the present application, the solvent is a solvent that can dissolve 5-chloro-2-methylisothiazolin-3-one and 2-methylisothiazolin-3-one and does not react with other components in the subsequent application system. In some specific embodiments, the solvent can be, for example, propylene glycol.

[0032] In an embodiment of the present application, in the isothiazolinone solution, the mass percentage of 5-chloro-2-methylisothiazolin-3-one is 10%-12%; the mass percentage of 2-methylisothiazolin-3-one is 0.5%-1.5%; and the mass percentage of the solvent is 86.5%-89.5%. In some specific embodiments, in the isothiazolinone solution, the mass percentage of 5-chloro-2-methylisothiazolin-3-one can be, for example, 10%, 10.5%, 11%, 11.5%, or 12%; the mass percentage of 2-methylisothiazolin-3-one can be, for example, 0.5%, 1%, or 1.5%; and the mass percentage of the solvent can be, for example, 86.5%, 87%, 87.5%, 88%, 88.5%, 89%, or 89.5%. The present application can further exert the synergistic bactericidal effect of 5-chloro-2-methylisothiazoline-3-one and 2-methylisothiazoline-3-one by controlling the content of each component in the isothiazolinone solution within an appropriate range.

[0033] In the embodiments of the present application, the isothiazolinone solution can be purchased directly from the market or prepared. In some embodiments of the present application, the isothiazolinone solution can be prepared by adding 5-chloro-2-methylisothiazoline-3-one and 2-methylisothiazoline-3-one of appropriate mass to a solvent, and mixing them thoroughly to obtain an isothiazolinone solution. In the present application, the type and content of each component in the composition can be measured by, but is not limited to, HPLC (High Performance Liquid Chromatography), nuclear magnetic resonance, and the like.

[0034] In an embodiment of the present application, the soluble metal salt includes a soluble copper salt and / or a soluble magnesium salt. In some embodiments of the present application, the soluble metal salt includes a soluble copper salt. In some embodiments of the present application, the soluble metal salt includes a soluble magnesium salt. In some embodiments of the present application, the soluble metal salt includes a soluble copper salt and a soluble magnesium salt. In an embodiment of the present application, the soluble copper salt includes one or more of CuSO4, Cu(NO3)2 and CuCl2, and the soluble magnesium salt includes one or more of MgSO4, Mg(NO3)2 and MgCl2. The present application selects a suitable Cu-containing 2+ and / or Mg 2+ The use of soluble metal salts in combination with isothiazolinone solution containing 5-chloro-2-methylisothiazolin-3-one is beneficial to the 2+ or Mg 2+ It cooperates with 5-chloro-2-methylisothiazoline-3-one to further improve the stability of 5-chloro-2-methylisothiazoline-3-one in the product without affecting the excellent bactericidal effect of the isothiazolinone solution itself, thereby improving the stability and antibacterial effect of the product.

[0035] The composition provided in this application has both excellent bactericidal effect and good stability. Adding it to other functional products can provide them with a broad-spectrum antibacterial effect while ensuring the good performance of the functional products themselves, significantly prolong their service life, and improve their overall uniformity.

[0036] The present application provides a mixture, which includes a main functional component and the composition provided above. In the embodiment of the present application, the main functional components include but are not limited to products with antibacterial requirements such as flattening solutions, cleaning fluids, coatings, and emulsions. In some specific embodiments of the present application, the mixture can be, for example, a flattening solution or a cleaning fluid containing a composition, specifically a flattening solution or a cleaning fluid used in a flattening process of a workpiece to be flattened. In some specific embodiments, the mixture can be used for chemical mechanical polishing of semiconductor devices to achieve surface flattening of semiconductor materials, for example, it can be a flattening solution or a cleaning fluid. Chemical mechanical polishing combines chemical and physical methods to achieve flattening of the substrate surface, thereby obtaining a semiconductor device with higher flatness, fewer surface defects, and higher precision. In the embodiment of the present application, the flattening solution can be acidic or alkaline; the cleaning fluid can be acidic or alkaline.

[0037] In an embodiment of the present application, in the mixture, the mass ratio of 5-chloro-2-methylisothiazoline-3-one to divalent metal ions is 1:1-1000:1. In some embodiments of the present application, the main functional component is a leveling solution, and the mass ratio of 5-chloro-2-methylisothiazoline-3-one to divalent metal ions is 1:1-200:1. In other embodiments of the present application, the main functional component is a cleaning solution, and the mass ratio of 5-chloro-2-methylisothiazoline-3-one to divalent metal ions is 1:1-1000:1.

[0038] In an embodiment of the present application, in the mixture, the mass percentage of 5-chloro-2-methylisothiazolin-3-one is 0.0005%-0.05%, and the mass of the thiazolinone solution is 0.0005%-0.05% of the total mass of the mixture. In some specific embodiments, the mass percentage of 5-chloro-2-methylisothiazolin-3-one in the mixture can be, for example, 0.0005%, 0.0006%, 0.0008%, 0.001%, 0.002%, 0.003%, 0.005%, 0.006%, 0.008%, 0.01%, 0.02%, 0.03%, 0.04%, or 0.05%. In some embodiments of the present application, the mass percentage of divalent metal ions in the mixture can be 0.000001%-0.002%. In some specific embodiments, the mass percentage of divalent metal ions in the mixture can be, for example, 0.000001%, 0.000002%, 0.000003%, 0.000005%, 0.00001%, 0.00005%, 0.0001%, 0.0005%, 0.001%, or 0.002%.

[0039] In an embodiment of the present application, the turbidity of the mixture after being placed at 60°C for 24 hours is less than or equal to 10NTU (Nephelometric Turbidity Unit). In some embodiments, the turbidity of the mixture after being placed at 60°C for 24 hours is less than or equal to 5NTU. In some specific embodiments, the turbidity of the mixture after being placed at 60°C for 24 hours can be, for example, 0NTU, 1NTU, 2NTU, 3NTU, 4NTU, 5NTU, 6NTU, 7NTU, 8NTU, 9NTU, 10NTU. In the present application, turbidity refers to the degree of obstruction caused by the solution to the passage of light. The unit of turbidity is NTU, which is a turbidity unit measured by a scattering method (90-degree angle scattered light measurement) and represents the degree of scattering of light by suspended particles in water. In an embodiment of the present application, turbidity can be measured, but is not limited to, by a turbidimeter, a scattering photometer, etc. The mixture provided in the present application can significantly improve the stability and storage life of the functional product by adding the composition described above, so that it will not precipitate or separate out after being stored at a higher temperature for a period of time.

[0040] In an embodiment of the present application, the absolute value of the difference in pH value of the mixture before and after being placed at 60°C for 24 hours is less than or equal to 0.5. In some embodiments, the absolute value of the difference in pH value of the mixture before and after being placed at 60°C for 24 hours is less than or equal to 0.1. In some specific embodiments, the absolute value of the difference in pH value of the mixture before and after being placed at 60°C for 24 hours is 0.01, 0.02, 0.03, 0.04, 0.05, 0.06, 0.08, 0.1, 0.12, 0.15, 0.16, 0.18, 0.2, 0.3, 0.4, 0.5. In the present application, the absolute value of the difference in pH value of the mixture before and after being placed at 60°C for 24 hours refers to: the pH value of the mixture measured when it is just prepared is A1, the pH value measured after being placed at 60°C for 24 hours is A2, and the absolute value of the difference between A1 and A2 is recorded as the absolute value of the difference in pH value of the mixture before and after being placed at 60°C for 24 hours. In the embodiments of the present application, the pH value can be measured, but is not limited to, by a pH meter. The mixture provided herein can significantly improve the stability and storage life of the mixture by adding the composition described above, so that the overall pH value does not change significantly after being stored at a higher temperature for a period of time.

[0041] The present application also provides a method for preparing the above-mentioned mixture, comprising:

[0042] Component A and component B are added to the main functional component and mixed to obtain a mixture.

[0043] In the embodiment of the present application, component A includes an isothiazolinone solution. In the embodiment of the present application, the isothiazolinone solution can be purchased directly from the market or prepared. In some embodiments of the present application, the isothiazolinone solution can be prepared, specifically by adding 5-chloro-2-methylisothiazoline-3-one and 2-methylisothiazoline-3-one of appropriate mass to a solvent, and mixing them thoroughly to obtain an isothiazolinone solution. The feed ratio of 5-chloro-2-methylisothiazoline-3-one, 2-methylisothiazoline-3-one and the solvent is (10-12): (0.5-1.5): (86.5-89.5). In some specific embodiments, the feed ratio of 5-chloro-2-methylisothiazoline-3-one, 2-methylisothiazoline-3-one and the solvent can be, for example, 10:1:89.

[0044] In an embodiment of the present application, component B includes a soluble metal salt. In an embodiment of the present application, the soluble metal salt includes one or more of a soluble copper salt and a soluble magnesium salt. In some embodiments, the soluble metal salt includes only a soluble copper salt. In some embodiments, the soluble metal salt includes only a soluble magnesium salt. In some embodiments, the soluble metal salt includes a soluble copper salt and a soluble magnesium salt. In an embodiment of the present application, the soluble copper salt includes one or more of CuSO4, Cu(NO3)2 and CuCl2; the soluble magnesium salt includes one or more of MgSO4, Mg(NO3)2 and MgCl2.

[0045] In some embodiments of the present application, when adding component A and component B to the main functional component, component A may be added to the main functional component first, mixed, and then component B is added; or components A and B may be added to the main functional component simultaneously and mixed. In some embodiments of the present application, the soluble metal salt in component B may be added directly to the main functional component, or may be first prepared into a metal salt solution of a certain concentration and then slowly added to the main functional solution.

[0046] In the embodiment of the present application, the feeding mass ratio of 5-chloro-2-methylisothiazolin-3-one in component B to the divalent metal ion in component A is 1:1-1000:1. In some specific embodiments, the feeding mass ratio of 5-chloro-2-methylisothiazolin-3-one in component A to the divalent metal ion in component B can be, for example, 1:1, 5:1, 10:1, 20:1, 40:1, 50:1, 60:1, 80:1, 100:1, 200:1, 500:1, 800:1, or 1000:1.

[0047] In the embodiments of the present application, the main functional components include but are not limited to products with antibacterial requirements such as leveling solutions, cleaning solutions, coatings, and emulsions. In some embodiments of the present application, the main functional components may be, for example, leveling solutions, which may include abrasives, additives, surfactants, organic acids, and pH regulators. In some specific embodiments, the abrasive may be, for example, one or more of silicon oxide and aluminum oxide; the additive may be, for example, a chelating agent, which may be, for example, one or more of ammonium or phosphoric acid chelating agents such as ammonium citrate, ammonium phosphate, ethylenediaminetetrakis(methylenephosphonic acid), and 1-hydroxyethylidene-1,1'-diphosphonic acid; the surfactant may be, for example, one or more of polyacrylic acid or sulfonic acid anionic surfactants or polyethylene glycol (PEG) and polypropylene glycol (PPG) non-ionic surfactants; the organic acid may be, for example, one or more of citric acid, maleic acid, lactic acid, and gluconic acid; the pH regulator may be, for example, one or more of ammonia water and acetic acid.

[0048] The preparation method of the mixture provided in the present application has readily available raw materials and a simple process. The prepared mixture has good stability and can be applied to the planarization process of semiconductor devices to achieve a good planarization effect, thereby obtaining semiconductor devices with high precision and good performance.

[0049] The present application provides an application of the composition provided above, specifically: using the composition or mixture provided above in the flattening process of semiconductor preparation. In the embodiment of the present application, the flattening process can occur in the front-end processing process, such as component production: etching, thin film deposition, and before and after ion implantation; the flattening process can occur in the back-end processing process, such as packaging and before and after testing. In some embodiments of the present application, the mixture can be, for example, a flattening solution, that is, a mixture of abrasive materials and chemical additives, which can produce a layer of oxide film on the surface of the wafer, which is then removed by the abrasive particles in the flattening solution to achieve the purpose of polishing. In some embodiments of the present application, the mixture can be, for example, a cleaning solution, which is mainly used to remove dust particles, organic impurities and inorganic impurities remaining on the surface of the wafer, thereby meeting the cleanliness requirements of integrated circuit manufacturing and improving the performance and yield of semiconductor devices.

[0050] The present application also provides a method for preparing a semiconductor device, comprising:

[0051] The component to be flattened is subjected to a flattening process using the composition or mixture provided above to obtain a flattened component.

[0052] In the embodiment of the present application, the part to be flattened can be, for example, a substrate or base material of a semiconductor device to be flattened. Here, the substrate or base material not only includes a silicon wafer, but can also be other metal layers, dielectric layers, and the above-mentioned base materials that have been surface-modified or have supporting layers added.

[0053] In the embodiments of the present application, the composition or mixture can be applied to the planarization process of the component to be planarized. The planarization process can be located at any stage of semiconductor device manufacturing, and can be during the front-end processing process, such as component production: etching, thin film deposition, and before and after ion implantation; or it can be during the back-end processing process, such as before and after packaging and testing.

[0054] The composition or mixture provided in the present application has excellent antibacterial and bactericidal effects and stability. Applying it in the planarization process can further improve the polishing or cleaning effect, thereby significantly improving the performance and yield of the semiconductor devices produced.

[0055] The technical solution of this application is described in detail below with multiple embodiments.

[0056] Example 1

[0057] The composition comprises component A and component B;

[0058] Prepare component A: add 10 g of 5-chloro-2-methylisothiazolin-3-one and 1 g of 2-methylisothiazolin-3-one to 89 g of propylene glycol and mix to obtain an isothiazolinone solution;

[0059] Prepare component B: Take 1g of CuSO4 to prepare a 0.04% CuSO4 solution;

[0060] To 995 g of the cleaning solution, 4 g of the isothiazolinone solution of component A was added, and then 1 g of the CuSO4 solution of component B was added, and the mixture was obtained after mixing;

[0061] The cleaning solution comprises the following components: a chelating agent comprising 0.1% by weight of ethylenediaminetetrakis(methylenephosphonic acid); an organic acid comprising 0.05% by weight of citric acid; a surfactant comprising 0.005% by weight of an acrylic acid-sulfonate copolymer; and a pH regulator comprising 0.02% by weight of aqueous ammonia.

[0062] Taking the total mass of the cleaning solution with antibacterial properties as 100wt%, the mass percentage of the isothiazolinone solution is 0.04wt%; the mass percentage of CuSO4 is 0.00004wt%; and the mass percentage of the cleaning solution is 99.95996wt%.

[0063] Example 2

[0064] The only difference from Example 1 is that the mass percentage of CuSO4 is 0.00006wt%; the mass percentage of the cleaning liquid is 99.95994wt%.

[0065] Example 3

[0066] The only difference from Example 1 is that the mass percentage of CuSO4 is 0.00008wt%; the mass percentage of the cleaning liquid is 99.95992wt%.

[0067] Example 4

[0068] The only difference from Example 1 is that the mass percentage of CuSO4 is 0.0001wt%; the mass of the cleaning liquid is 99.9599wt%.

[0069] Example 5

[0070] The only difference from Example 2 is that the CuSO4 with a mass percentage of 0.00006 wt% is replaced by Cu(NO3)2 with a mass percentage of 0.000045 wt%.

[0071] Example 6

[0072] The only difference from Example 2 is that the CuSO 4 with a mass percentage of 0.00006 wt % is replaced by MgSO 4 with a mass percentage of 0.000075 wt %.

[0073] Example 7

[0074] The only difference from Example 2 is that it further includes MgSO4 with a mass percentage of 0.00075wt%.

[0075] Example 8

[0076] The only difference from Example 2 is that the components of the cleaning solution are: the chelating agent is 0.5% by weight of ethylenediaminetetrakis (methylenephosphonic acid); the organic acid is 0.04% by weight of citric acid; the surfactant is 0.0025% by weight of polyethylene glycol (PEG); and the pH regulator is 0.49% by weight of ammonia water.

[0077] Example 9

[0078] The only difference from Example 2 is that the cleaning liquid is replaced with an acidic planarizing composition, and the components of the acidic planarizing composition are as follows: the abrasive is 4% by weight of silicon oxide; the organic acid is 0.1% by weight of citric acid; the surfactant is 0.03% by weight of polyethylene glycol (PEG); and the pH adjuster is 0.018% by weight of acetic acid.

[0079] The mass percentage of CuSO4 is 0.006wt%.

[0080] Example 10

[0081] The only difference from Example 9 is that the cleaning liquid is replaced by an alkaline planarizing composition, and the components of the alkaline planarizing composition are: the abrasive is 3% by mass of silicon oxide; the chelating agent is 0.05% by mass of ammonium phosphate; the organic acid is 0.05% by mass of maleic acid; the surfactant is 0.03% by mass of polypropylene glycol (PEG); and the pH adjuster is 0.16% by mass of ammonia water.

[0082] In order to highlight the beneficial effects of the embodiments of the present application, the following comparative examples are provided.

[0083] Comparative Example 1

[0084] The only difference from Example 2 is that CuSO4 is replaced by CaCl2.

[0085] Comparative Example 2

[0086] The only difference from Example 2 is that the composition in Example 2 is not added to the cleaning liquid.

[0087] Comparative Example 3

[0088] The only difference from Example 2 is that component B is not added to the cleaning liquid, and the mass of the cleaning liquid is 99.96 wt %.

[0089] Comparative Example 4

[0090] The only difference from Example 8 is that the composition in Example 2 is not added to the cleaning liquid.

[0091] Comparative Example 5

[0092] The only difference from Example 8 is that component B is not added to the cleaning liquid, and the mass of the cleaning liquid is 99.96 wt%.

[0093] Comparative Example 6

[0094] The only difference from Example 9 is that the composition in Example 2 is not added to the planarizing solution.

[0095] Comparative Example 7

[0096] The only difference from Example 9 is that no component B is added to the acidic leveling composition, and the mass of the acidic leveling composition is 99.96 wt %.

[0097] Comparative Example 8

[0098] The only difference from Example 10 is that the composition in Example 2 is not added to the planarizing solution.

[0099] Comparative Example 9

[0100] The only difference from Example 10 is that no component B is added to the alkaline planarizing composition, and the mass of the alkaline planarizing composition is 99.96 wt %.

[0101] Antibacterial effect test

[0102] The products of Examples 1 to 10 and Comparative Examples 1 to 9 were tested using the Easicult Combi bacterial count composite dipstick. The dipstick was immersed in the test liquid and allowed to contact with the test liquid for 5-10 seconds. After absorbing the excess liquid, the dipstick was returned to the culture tube and tightened. After incubation at room temperature for 14 days, the growth of bacteria was observed. The results are shown in Table 1.

[0103] Stability testing

[0104] (1) pH test

[0105] After the electrode of the pH meter was calibrated, the pH test electrode was placed in the products of Examples 1 to 10 and Comparative Examples 1 to 9. After stabilization, the pH value of the product was tested. The pH value of the product before and after being placed at 60°C for 24 hours was measured (the initial pH value was A1, and the pH value after being placed at 60°C for 24 hours was A2). The absolute value of the difference between A1 and A2 |A1-A2| was calculated. The results are shown in Table 1.

[0106] (2) Turbidity test

[0107] After the turbidimeter was calibrated, a certain volume of the products of Examples 1 to 10 and Comparative Examples 1 to 9 was placed in a test bottle and the turbidity of the products was tested using the turbidimeter. The turbidity values ​​of the products after being placed at 60° C. for 24 hours are shown in Table 1.

[0108] Cleaning effect test

[0109] After mounting a Si wafer deposited with a multilayer film including a silicon oxide film onto a chemical mechanical polishing apparatus, a chemical mechanical polishing process was performed using a chemical mechanical polishing slurry composition (silicon oxide 4%) at 60 rpm and 1 psi for 60 s. Then, a chemical mechanical polishing process was performed using the products of Examples 1 to 8 and Comparative Examples 1 to 5 at 60 rpm and 0.8 psi for 20 s. The Si wafer was placed into a cleaning box apparatus, and a cleaning process was performed for 15 s using a reference example of a commercially available cleaning solution (SC-1, ammonia: hydrogen peroxide: water = 1:1:5 weight ratio) in Brush 1. The number of defects on the surface of the Si wafer (specifically, defects greater than or equal to 0.12 μm on the surface of the silicon oxide wafer) was measured using a measuring device. The measured results are shown in Table 1.

[0110] After the Si wafer deposited with a multilayer film including a silicon oxide film was installed in a chemical mechanical polishing device, the chemical mechanical polishing process was performed for 60 seconds at 60 rpm and 1 psi using the products of Examples 9-10 and Comparative Examples 6-9. The Si wafer was placed in a cleaning box device, and a reference example of a commercially available cleaning liquid (SC-1, ammonia: hydrogen peroxide: water = 1:1:5 weight ratio) was used in Brush 1 to perform a cleaning process for 15 seconds. The number of defects on the surface of the Si wafer (specifically, defects greater than or equal to 0.12 μm on the surface of the silicon oxide wafer) was measured using a measuring device. The measured results are shown in Table 1.

[0111] Table 1

[0112]

[0113]

[0114] As can be seen from Table 1, compared to Comparative Examples 1-3, the antibacterial cleaning solutions of Examples 1-7 of the present application are added with a composition comprising both component A and component B, and therefore have both good antibacterial effect and stability. When applied to the actual cleaning process, fewer defects will be generated on the wafer surface, and the cleaning solution has an excellent cleaning effect. Compared to Comparative Examples 4-5, the antibacterial cleaning solution of Example 8 of the present application is added with a composition comprising both component A and component B, and therefore has both good antibacterial effect and stability and has a good cleaning effect. Compared to Comparative Examples 6-7, the antibacterial leveling composition of Example 9 of the present application is added with a composition comprising both component A and component B, and therefore has both good antibacterial effect and stability and has a good cleaning effect. Compared to Comparative Examples 8-9, the antibacterial leveling composition of Example 10 of the present application is added with a composition comprising both component A and component B, and therefore has both good antibacterial effect and stability and has a good cleaning effect. It can be seen from the data of Examples 1 to 10 that the composition provided in the present application can be widely used in cleaning solutions and leveling compositions of multiple systems and has a wide range of application scenarios.

[0115] It should be understood that the first, second and various numerical numbers involved in this document are only distinguished for the convenience of description and are not intended to limit the scope of this application.

[0116] In this application, "and / or" describes the relationship between related objects, indicating that three possible relationships exist. For example, "A and / or B" can mean: A exists alone, A and B exist simultaneously, and B exists alone. A and B can be singular or plural. The character " / " generally indicates that the related objects are in an "or" relationship.

[0117] In this application, "at least one" means one or more, and "plurality" means two or more. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single items or plural items. For example, "at least one of a, b or c", or "at least one of a, b and c" can all mean: a, b, c, ab (i.e., a and b), ac, bc or abc, where a, b, c can be single or multiple.

[0118] In this application, “-” represents a range value, including the endpoint values ​​at both ends. For example, the value of a can be 0.5-15, which means that the value of a can be between 0.5 and 15, and includes the endpoint values ​​0.5 and 15.

[0119] It should be understood that in the various embodiments of the present application, the size of the serial numbers of the above-mentioned processes does not mean the order of execution. Some or all of the steps can be executed in parallel or sequentially. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0120] The above is a preferred embodiment of the present application, but it should not be construed as limiting the scope of the present application. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of the present application, and such improvements and modifications are also considered to be within the scope of protection of the present application.

Claims

1. A composition, characterized in that The composition comprises component A and component B; The component A includes an isothiazolinone solution; the isothiazolinone solution includes 5-chloro-2-methylisothiazolin-3-one, 2-methylisothiazolin-3-one and a solvent; The B component includes a soluble metal salt; the soluble metal salt includes a soluble copper salt and / or a soluble magnesium salt.

2. The composition according to claim 1, wherein At least a portion of the soluble metal salt serves to stabilize 5-chloro-2-methylisothiazolin-3-one in the isothiazolinone solution.

3. The composition according to claim 1, wherein The soluble metal salt includes a divalent metal ion; in the composition, the mass ratio of the 5-chloro-2-methylisothiazoline-3-one to the divalent metal ion is 1:1-1000:

1.

4. The composition according to claim 1, wherein The soluble copper salt includes one or more of CuSO4, Cu(NO3)2 and CuCl2; the soluble magnesium salt includes one or more of MgSO4, Mg(NO3)2 and MgCl2.

5. A mixture, characterized in that The mixture comprises a main functional component and a composition according to any one of claims 1 to 4; The main functional component is a leveling solution, and in the mixture, the mass ratio of the 5-chloro-2-methylisothiazolin-3-one to the divalent metal ion is 1:1-200:1; The main functional component is a cleaning solution, and the mass ratio of the 5-chloro-2-methylisothiazoline-3-one to the divalent metal ion in the mixture is 1:1-1000:

1.

6. The mixture according to claim 5, characterized in that In the mixture, the mass percentage of the 5-chloro-2-methylisothiazoline-3-one is 0.0005%-0.05%; the mass percentage of the divalent metal ion is 0.000001%-0.002%.

7. The mixture according to claim 5, characterized in that The turbidity of the mixture after being placed at 60° C. for 24 hours is less than or equal to 10 NTU; the absolute value of the difference in pH value of the mixture before and after being placed at 60° C. for 24 hours is less than or equal to 0.

5.

8. A method for preparing the mixture according to any one of claims 5 to 7, characterized in that: include: The component A and the component B are added to the main functional component and mixed to obtain a mixture.

9. Use of the composition according to any one of claims 1 to 5, characterized in that: The composition according to any one of claims 1 to 4 or the mixture according to claim 5 is used in a planarization process for semiconductor preparation.

10. A semiconductor device, characterized in that: The semiconductor device includes a planarization component, and the planarization component is made by a planarization process using the composition according to any one of claims 1 to 5 or the mixture according to claim 6.

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