Planar phased array ultrasonic transducer

Abstract

The invention discloses a planar phased array ultrasonic transducer, which relates to the technical field of transducers and comprises a polymer plate, a common electrode thin-layer panel, a retaining plate, a first signal line, a plurality of piezoelectric ceramic columns, a plurality of conductive elastic components and a plurality of second signal lines, a plurality of first mounting holes are formed in the polymer plate, and the inner side faces of the first mounting holes are attached to and fixed to the outer side faces of the piezoelectric ceramic columns; one end surface of the piezoelectric ceramic column is a radiating surface, and the other end surface of the piezoelectric ceramic column is a back surface; the common electrode thin-layer panel is fixedly and electrically connected with each radiating surface; the conductive elastic assemblies are arranged on the retaining plate, the conductive elastic assemblies have elasticity and can conduct electricity, and the end faces of the first ends of the conductive elastic assemblies can be tightly pressed on the back face and are electrically connected with the back face; one end of the second signal line is fixedly and electrically connected with the second end of the conductive elastic assembly; according to the invention, stable conduction of signals is ensured, and meanwhile, no load effect is formed on the array elements.

Description

Technical Field

[0001] The present invention relates to the technical field of transducers, and in particular to a planar phased array ultrasonic transducer. Background Art

[0002] Underwater acoustic transducers are core sensing components in underwater communication, detection, and imaging technologies. They transmit and receive acoustic signals underwater, earning them the nickname "the eyes and ears of underwater acoustic equipment." The advent of the underwater acoustic transducer marked the beginning of the development of underwater equipment technology, and its continuous technological advancements provide a crucial foundation and guarantee for the long-term development of underwater equipment.

[0003] Compared with traditional single or multiple underwater ultrasonic probe devices, phased array ultrasonic transducers in underwater equipment technology can realize functions such as beam scanning, deflection and focusing, providing more powerful detection capabilities for determining the discontinuous shape, size and direction of underwater targets.

[0004] The electrodes of each element in a phased array need to be led out through a signal line. The conventional connection methods between the element electrodes and the signal line mainly include welding and bonding. However, when welding is used, the load effect of the solder joints on the array element will cause the frequency of the array element to shift. When conductive adhesive bonding is used, the bonding is prone to failure and falling off after long-term use. Summary of the Invention

[0005] The purpose of the present invention is to provide a planar phased array ultrasonic transducer to solve the problems existing in the above-mentioned prior art, thereby ensuring stable conduction of the signal and at the same time not forming a load effect on the array elements.

[0006] To achieve the above object, the present invention provides the following solutions:

[0007] The present invention provides a planar phased array ultrasonic transducer, comprising a polymer plate, a common electrode thin layer panel, a retaining plate, a first signal line, a plurality of piezoelectric ceramic columns, a plurality of conductive elastic components, and a plurality of second signal lines; the polymer plate is provided with a plurality of first mounting holes, the first mounting holes corresponding to the piezoelectric ceramic columns one by one, the first mounting holes being able to accommodate the piezoelectric ceramic columns, the inner side surfaces of the first mounting holes being adhered to and fixed to the outer side surfaces of the piezoelectric ceramic columns; one end surface of the piezoelectric ceramic columns being a radiating surface, and the other end surface of the piezoelectric ceramic columns being a back surface; the common electrode thin layer panel and each of the The radiating surface is fixedly connected and electrically connected; the retaining plate can be fixed relative to the polymer plate, and each of the conductive elastic components is arranged on the retaining plate, the conductive elastic component is elastic and conductive, and the conductive elastic component corresponds one-to-one to the piezoelectric ceramic column, and the first end face of the conductive elastic component can be pressed against the back surface and electrically connected to the back surface; one end of the first signal line is fixedly connected and electrically connected to the common electrode thin layer panel; the second signal line corresponds one-to-one to the conductive elastic component, and one end of the second signal line is fixedly connected and electrically connected to the second end of the conductive elastic component.

[0008] Preferably, it also includes a hard support backing plate, which is placed between the retaining plate and the polymer plate, and the hard support backing plate is fixedly connected to the retaining plate and the polymer plate. The hard support backing plate is provided with a plurality of through holes, which correspond one-to-one to the conductive elastic components, and the first end of the conductive elastic component can pass through the through holes.

[0009] Preferably, a plurality of second mounting holes are provided on the retaining plate, and the second mounting holes correspond one-to-one to the conductive elastic components. The middle part of the conductive elastic component is fixedly mounted in the second mounting hole, and the first end of the conductive elastic component protrudes out of the second mounting hole in a direction close to the polymer plate, and the second end of the conductive elastic component protrudes out of the second mounting hole in a direction away from the polymer plate.

[0010] Preferably, the hard support backing plate is a foam board; and the retaining plate is a PCB board.

[0011] Preferably, it also includes a potting glue layer, which is fixed on the side of the retaining plate away from the polymer plate, and the potting glue layer wraps the part of each conductive elastic component that protrudes away from the polymer plate to the outside of the second mounting hole.

[0012] Preferably, a metal cover plate is further included, which is fixed on the side of the potting layer away from the polymer plate, and a wire hole is opened in the center of the metal cover plate, and the first signal line and all the second signal lines pass through the wire hole.

[0013] Preferably, it also includes a potting sleeve and a potting layer, the potting sleeve is fixedly mounted on the outside of the common electrode thin layer panel, the polymer plate, the hard support backing plate, the retaining plate, the potting glue layer and the metal cover plate, the top end of the metal cover plate protrudes out of the potting sleeve, and the potting layer is filled in the potting sleeve.

[0014] Preferably, the potting layer has a specific portion, which is placed between each of the radiation surfaces and an end surface of the potting sleeve away from the metal cover plate, and the thickness of the specific portion is an integer multiple of one quarter of the wavelength of the sound wave.

[0015] Preferably, the potting layer is a polyurethane layer.

[0016] Preferably, the common electrode thin layer panel is a silver paste thin layer panel, and the radiation surface and the back surface are both plated with a thin layer of silver paste; and the conductive elastic component is a copper spring pin.

[0017] Compared with the prior art, the present invention has achieved the following technical effects:

[0018] The planar phased array ultrasonic transducer provided by the present invention is fixed to the outer side of the piezoelectric ceramic column by attaching the inner side of the first mounting hole on the polymer plate to suppress the lateral vibration mode of the piezoelectric ceramic column and strengthen the vibration in the thickness direction of the polymer plate. It has high electromechanical coupling coefficient and low lateral crosstalk characteristics, which significantly improves the sensitivity and resolution of the transducer. Each piezoelectric ceramic column and the part of the polymer plate wrapped on its outside form a transducer array element, that is, the transducer array element corresponds to the piezoelectric ceramic column one by one, and the radiation surfaces of all piezoelectric ceramic columns are connected together through a common electrode thin layer panel, and the common electrode thin layer panel is connected to the planar phased array ultrasonic transducer provided by the present invention through a first signal line. The array ultrasonic transducer establishes electrical signal communication with the outside world by pressing the first end face of the elastic and conductive elastic component against the back of the piezoelectric ceramic column and electrically connecting to the back of the piezoelectric ceramic column. One end of the second signal line is fixedly connected and electrically connected to the second end of the conductive elastic component, thereby achieving electrical signal communication between the second signal line and the piezoelectric ceramic column. Due to the elastic support of the conductive elastic component, the first end face of the conductive elastic component is always in contact with the back of the piezoelectric ceramic column, which not only ensures stable signal conduction, but also does not form a load on the array element (or piezoelectric ceramic column), thereby ensuring the consistency of the resonant frequency of the array element in the thickness direction. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 A schematic diagram of a planar phased array ultrasonic transducer provided by the present invention;

[0021] Figure 2 for Figure 1 The structural exploded diagram of the planar phased array ultrasonic transducer;

[0022] Figure 3 for Figure 1 Schematic diagram of the fabrication process of a planar phased array ultrasonic transducer;

[0023] In the figure: 1-polymer plate, 2-common electrode thin layer panel, 3-holding plate, 4-piezoelectric ceramic column, 5-conductive elastic component, 6-hard supporting backing plate, 7-potting glue layer, 8-metal cover plate, 9-wire hole, 10-potting sleeve. DETAILED DESCRIPTION

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0025] The purpose of the present invention is to provide a planar phased array ultrasonic transducer to solve the problems existing in the above-mentioned prior art, thereby ensuring stable conduction of the signal and at the same time not forming a load effect on the array elements.

[0026] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0027] like Figures 1 to 3As shown, the present invention provides a planar phased array ultrasonic transducer, comprising a polymer plate 1, a common electrode thin layer panel 2, a retaining plate 3, a first signal line, a plurality of piezoelectric ceramic columns 4, a plurality of conductive elastic components 5 and a plurality of second signal lines; a plurality of first mounting holes are opened on the polymer plate 1, the first mounting holes correspond to the piezoelectric ceramic columns 4 one by one, the first mounting holes can accommodate the piezoelectric ceramic columns 4, the inner side of the first mounting holes is attached to and fixed to the outer side of the piezoelectric ceramic columns 4; one end surface of the piezoelectric ceramic columns 4 is a radiating surface, and the other end surface of the piezoelectric ceramic columns 4 is a back surface; the common electrode The thin layer panel 2 is fixedly connected and electrically connected to each radiating surface; the retaining plate 3 can be fixed relative to the polymer plate 1, and each conductive elastic component 5 is arranged on the retaining plate 3. The conductive elastic component 5 is elastic and conductive. The conductive elastic component 5 corresponds one-to-one with the piezoelectric ceramic column 4. The first end surface of the conductive elastic component 5 can be pressed against the back surface and electrically connected to the back surface; one end of the first signal line is fixedly connected and electrically connected to the common electrode thin layer panel 2; the second signal line corresponds one-to-one with the conductive elastic component 5, and one end of the second signal line is fixedly connected and electrically connected to the second end of the conductive elastic component 5.

[0028] The planar phased array ultrasonic transducer provided by the present invention is fixed by attaching and fixing the inner side of the first mounting hole on the polymer plate 1 to the outer side of the piezoelectric ceramic column 4, thereby suppressing the lateral vibration mode of the piezoelectric ceramic column 4 and strengthening the vibration in the thickness direction of the polymer plate 1. It has a high electromechanical coupling coefficient and low lateral crosstalk characteristics, which significantly improves the sensitivity and resolution of the transducer. Each piezoelectric ceramic column 4 and the part of the polymer plate 1 wrapped on its outside form a transducer array element, that is, the transducer array element corresponds to the piezoelectric ceramic column 4 one-to-one, and the radiation surfaces of all the piezoelectric ceramic columns 4 are connected together through the common electrode thin layer panel 2, and the common electrode thin layer panel 2 is connected to the planar phased array ultrasonic transducer provided by the present invention through the first signal line. The array ultrasonic transducer is controlled to establish electrical signal communication with the outside world. The first end face of the elastic and conductive elastic component 5 is pressed against the back of the piezoelectric ceramic column 4 and electrically connected to the back of the piezoelectric ceramic column 4. One end of the second signal line is fixedly connected and electrically connected to the second end of the conductive elastic component 5, thereby realizing electrical signal communication between the second signal line and the piezoelectric ceramic column 4. Due to the elastic support of the conductive elastic component 5, the first end face of the conductive elastic component 5 is always in contact with the back of the piezoelectric ceramic column 4, which not only ensures stable signal conduction, but also does not form a load on the array element (or piezoelectric ceramic column 4), thereby ensuring the consistency of the resonant frequency of the array element in the thickness direction.

[0029] As an optional implementation of this embodiment, the piezoelectric ceramic column 4 can be made of, but is not limited to, lead zirconate titanate, barium titanate, or potassium sodium niobate.

[0030] As a more preferred implementation of this embodiment, the planar phased array ultrasonic transducer provided in this embodiment also includes a hard support backing plate 6, which is placed between the retaining plate 3 and the polymer plate 1. The hard support backing plate 6 is fixedly connected to the retaining plate 3 and the polymer plate 1. A number of through holes are opened on the hard support backing plate 6, and the through holes correspond one-to-one to the conductive elastic components 5. The first end of the conductive elastic component 5 can pass through the through hole, and the hard support backing plate 6 is used to effectively support the polymer plate 1 and the conductive elastic component 5, thereby improving the stability of the overall structure.

[0031] As a more preferred implementation of this embodiment, a plurality of second mounting holes are opened on the retaining plate 3, and the second mounting holes correspond one-to-one to the conductive elastic components 5. The middle part of the conductive elastic component 5 is fixedly mounted in the second mounting hole, and the first end of the conductive elastic component 5 protrudes out of the second mounting hole in a direction close to the polymer plate 1, so that the first end face of the conductive elastic component 5 is pressed against the back surface and electrically connected to the back surface, and the second end of the conductive elastic component 5 protrudes out of the second mounting hole in a direction away from the polymer plate 1, so that one end of the second signal line is fixedly connected and electrically connected to the second end of the conductive elastic component 5.

[0032] As a more preferred implementation method of this embodiment, the hard support backing plate 6 is a foam board, which is light in weight and has an effective sound absorption effect. When the piezoelectric ceramic column 4 is excited by the excitation signal, it vibrates in the thickness direction (axial direction), and sound waves are generated on the surface of the piezoelectric ceramic column 4 and radiated to the hard support backing plate 6. The dense porous structure of the foam board can effectively absorb the sound waves radiated by the vibration, and the density of the foam plastic is very small, which can reduce the weight of the transducer; the retaining plate 3 is a PCB board, which has good mechanical strength and heat resistance, can provide stable support for a long time, and is not easy to be damaged or fail.

[0033] As a more preferred implementation of this embodiment, the planar phased array ultrasonic transducer provided in this embodiment also includes a potting glue layer 7, which is fixed on the side of the retaining plate 3 away from the polymer plate 1. The potting glue layer 7 wraps the part of each conductive elastic component 5 that protrudes out of the second mounting hole in the direction away from the polymer plate 1, so as to effectively protect the part of each conductive elastic component 5 that protrudes out of the second mounting hole in the direction away from the polymer plate 1 and reduce interference from external factors.

[0034] As a more preferred implementation of this embodiment, the planar phased array ultrasonic transducer provided in this embodiment also includes a metal cover plate 8. The structural strength of the metal cover plate 8 is high, which is convenient for long-term use. The metal cover plate 8 is fixed on the side of the potting layer 7 away from the polymer plate 1. A wire hole 9 is provided in the center of the metal cover plate 8. The first signal line and all second signal lines pass through the wire hole 9 to facilitate the guidance and convergence of each second signal line.

[0035] As a more preferred implementation scheme of this embodiment, the planar phased array ultrasonic transducer provided in this embodiment also includes a potting sleeve 10 and a potting layer. The potting sleeve 10 is fixedly mounted on the outside of the common electrode thin layer panel 2, the polymer plate 1, the hard support backing plate 6, the retaining plate 3, the potting glue layer 7 and the metal cover plate 8. The top end of the metal cover plate 8 protrudes outside the potting sleeve 10, and the potting layer is filled in the potting sleeve 10. The common electrode thin layer panel 2, the polymer plate 1, the hard support backing plate 6, the retaining plate 3 and the potting glue layer 7 are fixed as a whole through the potting sleeve 10, the metal cover plate 8 and the potting layer, and the common electrode thin layer panel 2, the polymer plate 1, the hard support backing plate 6, the retaining plate 3, the potting layer and the potting glue layer 7 are effectively protected by the potting sleeve 10 and the metal cover plate 8.

[0036] As a more preferred implementation method of this embodiment, the encapsulation layer has a specific portion, which is placed between each radiation surface and the end face of the encapsulation sleeve 10 away from the metal cover plate 8. The thickness of the specific portion is an integer multiple of one quarter of the wavelength of the sound wave, which conforms to the matching full transmission theory of integer multiples of one quarter wavelength, thereby facilitating waterproofing and sound transmission.

[0037] As a more preferred implementation of this embodiment, the encapsulation layer is a polyurethane layer. The density, sound velocity and characteristic impedance of the polyurethane material are relatively close to those of the water medium and can better match water.

[0038] As a more preferred implementation of this embodiment, the common electrode thin layer panel 2 is a silver paste thin layer panel, and a thin layer of silver paste is plated on the radiation surface and the back surface to improve the smoothness of signal conduction; the conductive elastic component 5 is a copper spring pin, which has good conductivity, is durable, and is easy to manufacture.

[0039] like Figure 3 As shown in FIG. 1 , a specific manufacturing process flow of the planar phased array ultrasonic transducer provided by the present invention is as follows:

[0040] 1. Select a piezoelectric ceramic disc polarized in the thickness direction, with the electrode direction in the thickness direction, and a thin layer of silver paste on both the upper and lower surfaces of the piezoelectric ceramic disc;

[0041] 2. Use a cutting machine to cut the piezoelectric ceramic disc into small columns, retaining the original electrodes to obtain several piezoelectric ceramic columns 4;

[0042] 3. Use a light-curing printer to print a resin plate with a first mounting hole (i.e., the polymer plate 1 is preferably a resin plate), and install the piezoelectric ceramic column 4 into the first mounting hole;

[0043] 4. Evenly apply silver paste on the side of the polymer plate 1 to form a common electrode thin layer panel 2, connecting the radiating surfaces of all piezoelectric ceramic pillars 4 together;

[0044] 5. Bond the hard support backing plate 6 with the through-holes to the back side of the piezoelectric ceramic pillar 4 on the polymer plate 1;

[0045] 6. Install all the copper spring pins onto the PCB with the second mounting holes drilled in it.

[0046] 7. Pass the first end of the copper spring pin through the through hole in the rigid support backing plate 6 and press it against the back of the piezoelectric ceramic pillar 4. Ensure electrical signal communication between the first end of the copper spring pin and the piezoelectric ceramic pillar 4 and maintain a certain spring support force. Bond the PCB board and the rigid support backing plate 6 with epoxy resin.

[0047] 8. After the epoxy resin is cured, test the electrical signal connectivity between the copper spring pin and the common electrode thin layer panel 2;

[0048] 9. Solder one end of the second signal line to the second end of the copper spring pin. Simultaneously, solder one end of the first signal line to the common electrode thin panel 2. Then, use electronic potting compound to pot the portion of the second end of the copper spring pin that protrudes out of the second mounting hole away from the polymer board 1 until all the copper spring pins are covered, forming a potting compound layer 7.

[0049] 10. Pass the first signal line and all second signal lines through the wire holes 9 on the metal cover 8, and mark the position of the corresponding copper spring ejector pins for each second signal line when soldering. Use epoxy resin to bond the metal cover 8 to the potting layer 7;

[0050] 11. The potting sleeve 10 is mounted on the common electrode thin layer panel 2, the polymer plate 1, the hard support backing plate 6, the retaining plate 3, the potting adhesive layer 7 and the metal cover plate 8, and is potted with polyurethane having a density close to that of water to form a potting layer. The potting layer plays a role of being waterproof and sound-permeable. The thickness of the specific portion of the potting layer between each radiation surface and the end face of the potting sleeve 10 away from the metal cover plate 8 is an integer multiple of one quarter of the wavelength of the sound wave.

[0051] The present invention uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only intended to help understand the method and core concept of the present invention. At the same time, those skilled in the art will find that the specific implementation methods and application scopes may vary based on the concept of the present invention. In summary, the contents of this specification should not be construed as limiting the present invention.

Claims

1. A planar phased array ultrasonic transducer, characterized in that: The device comprises a polymer plate, a common electrode thin layer panel, a holding plate, a first signal line, a plurality of piezoelectric ceramic columns, a plurality of conductive elastic components and a plurality of second signal lines; The polymer plate is provided with a plurality of first mounting holes, each of the first mounting holes corresponding to the piezoelectric ceramic column one by one, the first mounting holes being capable of accommodating the piezoelectric ceramic column, and the inner side surfaces of the first mounting holes being in contact with and fixed to the outer side surfaces of the piezoelectric ceramic column; One end surface of the piezoelectric ceramic column is a radiation surface, and the other end surface of the piezoelectric ceramic column is a back surface; The common electrode thin layer panel is fixedly connected and electrically connected to each of the radiation surfaces; The retaining plate can be fixed relative to the polymer plate, and each of the conductive elastic components is arranged on the retaining plate. The conductive elastic components are elastic and conductive, and correspond one-to-one with the piezoelectric ceramic pillars. The first end surface of the conductive elastic component can be pressed against the back surface and electrically connected to the back surface. One end of the first signal line is fixedly and electrically connected to the common electrode thin layer panel; The second signal line corresponds to the conductive elastic component one by one, and one end of the second signal line is fixedly and electrically connected to the second end of the conductive elastic component.

2. The planar phased array ultrasonic transducer according to claim 1, wherein: It also includes a hard support backing plate, which is placed between the retaining plate and the polymer plate. The hard support backing plate is fixedly connected to the retaining plate and the polymer plate. A plurality of through holes are opened on the hard support backing plate. The through holes correspond one-to-one to the conductive elastic components, and the first end of the conductive elastic component can pass through the through holes.

3. The planar phased array ultrasonic transducer according to claim 2, wherein: A plurality of second mounting holes are provided on the retaining plate, and the second mounting holes correspond one-to-one to the conductive elastic components. The middle portion of the conductive elastic component is fixedly mounted in the second mounting hole, and the first end of the conductive elastic component protrudes out of the second mounting hole in a direction approaching the polymer plate, and the second end of the conductive elastic component protrudes out of the second mounting hole in a direction away from the polymer plate.

4. The planar phased array ultrasonic transducer according to claim 3, wherein: The hard supporting backing plate is a foam board; the retaining plate is a PCB board.

5. The planar phased array ultrasonic transducer according to claim 3, wherein: It also includes a potting glue layer, which is fixed on the side of the retaining plate away from the polymer plate, and the potting glue layer wraps the part of each conductive elastic component that protrudes away from the polymer plate and out of the second mounting hole.

6. The planar phased array ultrasonic transducer according to claim 5, characterized in that: It also includes a metal cover plate, which is fixed on the side of the potting layer away from the polymer plate. A wire hole is opened in the center of the metal cover plate, and the first signal line and all the second signal lines pass through the wire hole.

7. The planar phased array ultrasonic transducer according to claim 6, characterized in that: It also includes a potting sleeve and a potting layer. The potting sleeve is fixedly mounted on the common electrode thin layer panel, the polymer plate, the hard support backing plate, the retaining plate, the potting glue layer and the metal cover plate. The top end of the metal cover plate protrudes out of the potting sleeve, and the potting layer is filled in the potting sleeve.

8. The planar phased array ultrasonic transducer according to claim 7, characterized in that: The potting layer has a specific portion, which is placed between each of the radiation surfaces and an end surface of the potting sleeve away from the metal cover plate. The thickness of the specific portion is an integral multiple of one quarter of the wavelength of the sound wave.

9. The planar phased array ultrasonic transducer according to claim 8, characterized in that: The potting layer is a polyurethane layer.

10. The planar phased array ultrasonic transducer according to claim 1, characterized in that: The common electrode thin layer panel is a silver paste thin layer panel, and the radiation surface and the back surface are both plated with a thin layer of silver paste; the conductive elastic component is a copper spring thimble.

Images