Metal dot matrix 3D printing system and method based on electromagnetic-thermocompression coupling adsorption

Through the multi-physics field coupling print head and intelligent closed-loop system, the problems of microstructure accuracy and single application of existing metal 3D printing technology have been solved, and the printing of high-precision microstructures and the manufacture of high-strength satellite brackets have been achieved.

CN120644679AInactive Publication Date: 2025-09-16高原
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Patent Information

Application Number
CN202510872685.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-06-27
Publication Date
2025-09-16
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

Existing metal 3D printing technology has shortcomings in microstructure accuracy, welding-printing composite and energy field control, especially the lack of synchronous control of electromagnetic adsorption and hot pressing deposition, which leads to limited microstructure accuracy and single application.

Method used

It adopts a multi-physics field coupling print head, combined with electromagnetic adsorption of radially distributed coils with pulsed current and a hot pressing composite module with instantaneous current passing through resistive electrodes, to achieve precise adsorption and synchronous application of mechanical pressure. It combines an intelligent closed-loop system and a longitudinal cubic Z-axis zeroing algorithm, and integrates Weijing's intelligent 3D visual tracking technology for real-time calibration.

Benefits of technology

The microstructure accuracy has been improved to 50μm, the conductivity has been increased by 22%, and it has been successfully applied to microelectronic devices and in-orbit manufacturing in space to print high-strength satellite brackets.

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Abstract

The invention relates to a metal dot matrix 3D printing system and method based on electromagnetic-thermocompression coupling adsorption. The invention relates to the technical field of metal additive manufacturing, in particular to a 3D printing system integrating imprinting welding adsorption characteristics and hot-pressing deposition, and is suitable for high-precision scenes such as microelectronic devices and space on-orbit manufacturing. The technical problems that due to the fact that traditional metal 3D printing depends on gravity powder laying, the microstructure precision is low (gt; 100 microns), and the welding process and the printing process are separated are solved.
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Description

Technical Field

[0001] The present invention belongs to the field of metal additive manufacturing technology, and specifically relates to a 3D printing system that integrates the adsorption characteristics of imprint welding and hot pressing deposition, which is suitable for high-precision scenarios such as microelectronic devices, in-orbit manufacturing in space, and biomedical implants. Background Art

[0002] 1. Deficiencies in existing technology - Limitations of gravity-based powder spreading: Traditional metal printing (such as SLM) relies on gravity-based powder spreading, which limits microstructure accuracy (>100μm); - Welding technology fragmentation: Existing welding-printing composite technology (such as Aero Engine CN202111535227.2) is only used for post-repair and does not achieve in-situ adsorption deposition; - Single adsorption application: Lianzan's laser negative pressure adsorption patent (CN202410489146.0) is only used for workpiece fixation and does not integrate energy field control.

[0003] 2. Technological gaps There are currently no patents involving the simultaneous control of electromagnetic adsorption and hot pressing deposition (search end June 2025). The Gangyan high-nano high-temperature alloy patent (CN202410780731.6) optimizes the material but does not solve the adsorption mechanism. Summary of the Invention

[0004] (1) Core innovations 1. Multi-physics coupling print head - Electromagnetic adsorption module: Radially distributed coils pass pulse current (0.1-5T), accurately adsorbing magnetic powder (such as Fe-Co-Ni alloy) with a positioning accuracy of ±5μm; - Hot pressing composite module: a transient current (100-500A) is passed through the resistance electrode to soften the material, and mechanical pressure (5-20MPa) is applied simultaneously to achieve atomic diffusion bonding.

[0005] 2. Intelligent closed-loop system - Integrated vertical cubic Z-axis zeroing algorithm (CN119610678A) to compensate for thermal deformation; - Integrates Weijing's intelligent 3D visual tracking technology to calibrate the printing path in real time.

[0006] (2) Material innovation - Matrix material: Kingfa PBT composite material (CN202410530186.5) to enhance interlayer toughness; - Magnetic powder: Gradient Fe-Co-Ni alloy (cited from Gangyan Gaona patent), with 40% increase in resistance to oxygen-rich ablation. DETAILED DESCRIPTION Example 1: 50 μm microcircuit printing 1. Parameters: - Electromagnetic field strength: 1.2T (pulse frequency 200Hz); - Hot pressing temperature: 380℃ (copper alloy), pressure: 15MPa.

[0007] 2. Effect: - The wire width is reduced to 50μm (the traditional SLM limit is 100μm), and the conductivity is increased by 22%.

[0008] Example 2: Space titanium alloy repair 1. Inert gas protection: using Chuangxiang three-dimensional sealing module (CN222610457U); 2. Zero-gravity adaptation: Adsorption force replaces gravity to successfully print satellite brackets (strength ≥ 850MPa).

Claims

1. A point adsorption 3D printing system, characterized in that Include: - Electromagnetic adsorption print head, hot pressing composite deposition module, and multi-physics closed-loop controller.

2. A system as described in claim 1, wherein the electromagnetic coils are radially distributed and the magnetic field gradient is adjustable.

3. As in the system described in right 1, a strong new material light-curing composition (CN202211608271.6) is used to coat the powder to improve leveling.

Citation Information

Patent Citations

  • A composite connection method for a large-size round-to-square 3D printer housing

    CN114043109B

  • Negative pressure adsorption clamp and welding equipment

    CN118143555A

  • PBT (polybutylene terephthalate) composite material as well as preparation method and application thereof

    CN118271807A

  • High-temperature alloy for 3D printing, 3D printing method of high-temperature alloy and 3D printing structural part

    CN118345275A

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    CN119610678A