Energy-saving type semiconductor industrial oven system

Abstract

The invention provides an energy-saving semiconductor industrial oven system which comprises an AI intelligent master control center, a heat source assembly, a waste gas treatment tank, a heat energy exchanger, a feeding and discharging conveying assembly and a plurality of semiconductor industrial ovens in control connection. The semiconductor industrial drying oven is provided with a drying oven high-temperature gas inlet, a drying oven normal-temperature gas inlet and a drying oven high-temperature waste gas exhaust port, and the heat source assembly is communicated with the drying oven high-temperature gas inlet. The heat energy exchanger is provided with an exchanger high-temperature waste gas inlet, an exchanger normal-temperature air inlet, an exchanger normal-temperature waste gas outlet and an exchanger high-temperature air outlet, the oven high-temperature waste gas outlet is communicated with the exchanger high-temperature waste gas inlet, and the exchanger high-temperature air outlet is communicated with the oven high-temperature gas inlet; and the exchanger normal-temperature waste gas exhaust port is communicated with the waste gas treatment tank. The device has the beneficial effects that high-temperature waste gas can be purified and treated, heat energy in the high-temperature waste gas can be recycled, the production efficiency is improved, and the energy consumption is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of industrial ovens, and in particular to an energy-saving semiconductor industrial oven system. Background Art

[0002] Industrial ovens are a key thermal processing equipment widely used in modern industrial production, including electronics, chemicals, food, medicine, automotive manufacturing, metalworking, and other fields. In the semiconductor field, industrial ovens are primarily used for hot-melt fixing of electronic components. Their principle is to heat-melt solder at high temperatures to secure electronic components to circuit boards. Their advantage lies in precise temperature control. Using an advanced temperature control system, the oven's internal temperature can be precisely controlled, ensuring fluctuations within a set temperature range and meeting the temperature accuracy requirements of different processes. By optimizing air duct design and using high-efficiency heating elements, the oven achieves uniform temperature distribution, preventing quality issues caused by uneven heating of the material.

[0003] At present, in the production process of semiconductor circuit boards, semiconductor industrial ovens are an indispensable production equipment. However, the existing semiconductor industrial ovens have the following disadvantages because each hot melt fixation needs to be heated from room temperature:

[0004] 1. The heating speed is slow, resulting in low production efficiency;

[0005] 2. The heating time is long and the energy consumption is high, which leads to high production costs for heating;

[0006] 3. Direct discharge of high-temperature waste will pollute the atmosphere and is not friendly to environmental protection. Summary of the Invention

[0007] In order to solve the problems in the prior art, the present invention provides an energy-saving semiconductor industrial oven system. By arranging mutually coordinated heat source components, exhaust gas treatment tanks, heat exchangers, loading and unloading conveying components, AI intelligent main control center and multiple semiconductor industrial ovens in the semiconductor industrial oven system, the AI ​​intelligent main control center can control the heat exchanger to recover the heat energy of the high-temperature exhaust gas discharged by the semiconductor industrial oven and re-transmit it to the semiconductor industrial oven to preheat the electronic components that need to be heated. At the same time, the exhaust gas after the heat energy is recovered is harmlessly treated before being discharged. It can purify the high-temperature exhaust gas and recycle the heat energy in the high-temperature exhaust gas, circulate and preheat the electronic components that need to be heated, greatly reduce the time required for hot melting and fixing of electronic components, improve production efficiency, reduce energy consumption, achieve environmentally friendly emissions, will not pollute the atmosphere, and protect the environment. It solves the problems of slow heating speed, high energy consumption and lack of environmental friendliness of semiconductor industrial ovens in the prior art.

[0008] The present invention provides an energy-saving semiconductor industrial oven system, comprising a heat source component, an exhaust gas treatment tank, a heat exchanger, a loading and unloading conveying component, an AI intelligent main control center and a plurality of semiconductor industrial ovens that cooperate with each other. The AI ​​intelligent main control center is controlled and connected with the heat source component, the exhaust gas treatment tank, the heat exchanger, the loading and unloading conveying component, and a plurality of the semiconductor industrial ovens. The semiconductor industrial oven is provided with an oven high-temperature gas inlet, an oven normal-temperature gas inlet and an oven high-temperature exhaust gas exhaust port. The heat source component is connected to the oven high-temperature gas inlet through a gas pipeline, and the oven normal-temperature gas inlet is connected to the external normal-temperature atmospheric environment through a gas pipeline. The heat exchanger is provided with an exchanger high-temperature exhaust gas. Air inlet, exchanger normal temperature air inlet, exchanger normal temperature waste gas exhaust port and exchanger high temperature air outlet, the oven high temperature waste gas exhaust port is connected with the exchanger high temperature waste gas inlet through a gas pipeline, the exchanger high temperature air outlet is connected with the oven high temperature gas inlet, the exchanger normal temperature waste gas exhaust port is connected with the waste gas treatment tank, the oven normal temperature gas inlet is connected with the external normal temperature atmospheric environment through a gas pipeline, the AI ​​intelligent main control center can control the heat energy exchanger to recover the heat energy of the high temperature waste gas discharged from the semiconductor industrial oven and re-deliver it to the semiconductor industrial oven to preheat the electronic components that need to be heated, and at the same time, the waste gas after the heat energy is recovered is harmlessly treated before being discharged.

[0009] The present invention is further improved, and the semiconductor industrial oven also includes a baking inner box, a baking outer box and a baking drawer that cooperate with each other. The bottom of the baking inner box is provided with a drawer slide rail, and the baking drawer is slidably connected to the drawer slide rail. A material placement box is provided in the baking drawer, and the baking outer box is tightly surrounded by the baking inner box. A sealing and thermal insulation layer is provided between the inner wall of the baking outer box and the baking inner box, and the sealing and thermal insulation layer is an aerogel gasket.

[0010] The present invention is further improved in that the bottom of the baking inner box is further provided with a spoiler for accelerating uniform mixing of the high-temperature gas.

[0011] The present invention is further improved in that a heating gas mixing pipe is further provided on the surface of the baking outer box, and the heating gas mixing pipe is connected to the high-temperature gas inlet of the oven and the normal-temperature gas inlet of the oven. The AI ​​intelligent main control center controls the specific temperature in the baking inner box by controlling the ratio of high-temperature gas entering the high-temperature gas inlet of the oven and normal-temperature gas entering the normal-temperature gas inlet of the oven.

[0012] The present invention is further improved in that a high-temperature sealing strip is provided at the junction of the baking inner box and the baking drawer, and a drawer sealing and heat-insulating layer is provided on the inner wall of the baking drawer, and the drawer sealing and heat-insulating layer is an aerogel gasket.

[0013] The present invention is further improved in that a plurality of semiconductor industrial oven arrays are arranged on a baking rack and combined into an oven group, and the oven group cooperates with the loading and unloading conveying assembly.

[0014] The present invention is further improved in that high-temperature resistant solenoid valves are provided at the high-temperature gas inlet of the oven, the normal-temperature gas inlet of the oven, and the high-temperature exhaust gas exhaust port of the oven, and the AI ​​intelligent main control center is controlled and connected to the high-temperature resistant solenoid valves.

[0015] The present invention is further improved, and the loading and unloading conveying assembly includes a ground rail, a six-axis robot and a loading and unloading conveyor belt. The six-axis robot is slidably connected to the ground rail, and the loading and unloading conveyor belt cooperates with the ground rail. The six-axis robot can clamp the electronic components on the loading and unloading conveyor belt and move them into the semiconductor industrial oven for hot melt fixing operations.

[0016] The present invention is further improved in that a high-temperature exhaust gas combustion chamber is provided between the high-temperature exhaust gas exhaust port of the oven and the high-temperature exhaust gas inlet of the exchanger. The high-temperature exhaust gas combustion chamber is provided with a variety of catalytic catalysts for decomposing organic matter in the exhaust gas, including low-temperature catalysts, biological catalysts and photocatalysts.

[0017] The present invention is further improved in that the waste gas treatment tank is provided with activated carbon for filtering waste gas.

[0018] Compared with the prior art, the beneficial effects of the present invention are as follows: the present invention provides an energy-saving semiconductor industrial oven system, which provides a heat source component, an exhaust gas treatment tank, a heat exchanger, an loading and unloading conveying component, an AI intelligent main control center and multiple semiconductor industrial ovens that cooperate with each other in the semiconductor industrial oven system. The AI ​​intelligent main control center can control the heat exchanger to recover the heat energy of the high-temperature exhaust gas discharged from the semiconductor industrial oven and re-transmit it to the semiconductor industrial oven to preheat the electronic components that need to be heated. At the same time, the exhaust gas after the heat energy is recovered is harmlessly treated before being discharged, which can purify the high-temperature exhaust gas and recycle the heat energy in the high-temperature exhaust gas, circulate and preheat the electronic components that need to be heated, greatly reduce the time required for hot-melt fixing of electronic components, and improve production efficiency. Reduce energy consumption; use catalytic catalysts for exhaust gas treatment to achieve environmentally friendly emissions, will not pollute the atmosphere, and protect the environment. The oven is a small, sealed box with no heat leakage, high thermal energy utilization, high temperature control accuracy, and energy saving, so the heat temperature inside is uniform (±3°C). The oven group is arranged in a shelf-like manner, utilizing the upper space of the site and occupying a small area. The number of ovens can be configured according to production capacity, with high flexibility. It can be used for both experimental products and mass-produced products. The AI ​​intelligent main control center monitors and controls the robot operation and the temperature inside the box at all times. It has a high degree of intelligence. All machine actions, programmed temperature rise, and multi-stage temperature control will record data for quality traceability and analysis, solving the problems of slow heating speed, high energy consumption, and environmental friendliness of semiconductor industrial ovens in the existing technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the solutions in the present application or the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0020] Figure 1 This is a schematic diagram of an energy-saving semiconductor industrial oven system according to the present invention;

[0021] Figure 2 A cross-sectional view of a semiconductor industrial oven according to the present invention;

[0022] Figure 3 A perspective view of a semiconductor industrial oven according to the present invention;

[0023] Figure 4 It is a three-dimensional diagram of the oven assembly of the present invention.

[0024] In the figure, 1-heat source component, 2-waste gas treatment tank, 3-heat energy exchanger, 4-loading and unloading conveying component, 41-ground rail, 42-six-axis robot, 43-loading and unloading conveyor belt, 5-semiconductor industrial oven, 51-oven high-temperature gas inlet, 52-oven normal-temperature gas inlet, 53-oven high-temperature waste gas exhaust port, 54-baking inner box, 55-baking outer box, 56-baking drawer, 57-heating gas mixing pipe, 58-spoiler. DETAILED DESCRIPTION

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs; the terms used in the specification of the application herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned figure descriptions are intended to cover non-exclusive inclusions.

[0026] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0027] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings.

[0028] like Figure 1-4As shown, the present invention provides an energy-saving semiconductor industrial oven system, including a heat source component 1, an exhaust gas treatment tank 2, a heat exchanger 3, a loading and unloading conveying component 4, an AI intelligent main control center and multiple semiconductor industrial ovens 5 that cooperate with each other. The AI ​​intelligent main control center is controlled and connected with the heat source component 1, the exhaust gas treatment tank 2, the heat exchanger 3, the loading and unloading conveying component 4, and multiple semiconductor industrial ovens 5. The semiconductor industrial oven 5 is provided with an oven high-temperature gas inlet 51, an oven normal-temperature gas inlet 52 and an oven high-temperature exhaust gas exhaust port 53. The heat source component 1 is connected to the oven high-temperature gas inlet 51 through a gas pipeline. The high-temperature gas inlet 51 of the oven is connected, and the normal-temperature gas inlet 52 of the oven is connected to the external normal-temperature atmospheric environment through a gas pipeline. The heat exchanger 3 is provided with an exchanger high-temperature exhaust gas inlet, an exchanger normal-temperature air inlet, an exchanger normal-temperature exhaust gas exhaust port and an exchanger high-temperature air outlet. The high-temperature exhaust gas exhaust port 53 of the oven is connected to the high-temperature exhaust gas inlet of the exchanger through a gas pipeline, the high-temperature air outlet of the exchanger is connected to the high-temperature gas inlet 51 of the oven, the normal-temperature exhaust gas exhaust port of the exchanger is connected to the exhaust gas treatment tank, and the normal-temperature gas inlet of the oven is connected to the external normal-temperature atmospheric environment through a gas pipeline. In this embodiment, the AI ​​intelligent main control center can control the heat exchanger to recover the heat energy of the high-temperature exhaust gas discharged from the semiconductor industrial oven and re-transmit it to the semiconductor industrial oven to preheat the electronic components that need to be heated. At the same time, the exhaust gas after the heat energy is recovered is harmlessly treated before being discharged. It can purify the high-temperature exhaust gas and recycle the heat energy in the high-temperature exhaust gas, circulate and preheat the electronic components that need to be heated, greatly reduce the time required for hot melting and fixing of electronic components, improve production efficiency, and reduce energy consumption; use catalytic catalysts for exhaust gas treatment to achieve environmentally friendly emissions, will not pollute the atmosphere, and protect the environment.

[0029] like Figure 2-4As shown, the semiconductor industrial oven 5 also includes a baking inner box 54, a baking outer box 55 and a baking drawer 56 that cooperate with each other. A drawer slide is provided at the bottom of the baking inner box 54, and the baking drawer 56 is slidably connected to the drawer slide. A material placement box is provided in the baking drawer 56, and the baking outer box 55 is tightly surrounded by the baking inner box 54. A sealing insulation layer is provided between the inner wall of the baking outer box 55 and the baking inner box 54, and the sealing insulation layer is an aerogel gasket; a spoiler 58 for accelerating the uniform mixing of high-temperature gases is also provided at the bottom of the baking inner box 54; a high-temperature sealing strip is also provided at the junction of the baking inner box 54 and the baking drawer 56, and a drawer sealing insulation layer is provided on the inner wall of the baking drawer 56, and the drawer sealing insulation layer is an aerogel gasket; a high-temperature gas inlet 51 of the oven, a normal-temperature gas inlet 52 of the oven, and a high-temperature exhaust gas exhaust port 53 of the oven are all provided with high-temperature resistant solenoid valves, AI The intelligent main control center is connected to the high-temperature resistant solenoid valve control; a high-temperature exhaust gas full combustion chamber is also provided between the high-temperature exhaust gas exhaust port 53 of the oven and the high-temperature exhaust gas inlet of the exchanger. The high-temperature exhaust gas full combustion chamber is provided with a variety of catalytic catalysts for decomposing organic matter in the exhaust gas, including low-temperature catalysts, biological catalysts and photocatalysts; the exhaust gas treatment tank 2 is provided with activated carbon for filtering exhaust gas; the outer surface of the baking outer box 55 is also provided with a heating gas mixing pipe 57, and the heating gas mixing pipe 57 is connected to the high-temperature gas inlet 51 of the oven and the normal-temperature gas inlet 52 of the oven. The AI ​​intelligent main control center controls the specific temperature in the baking inner box by controlling the proportion of high-temperature gas entering the high-temperature gas inlet of the oven and the normal-temperature gas entering the normal-temperature gas inlet of the oven. Multiple semiconductor industrial oven arrays are arranged on a baking rack and combined into an oven group, and the oven group cooperates with the loading and unloading conveying components. In this embodiment, the entire oven group shares a heat source assembly, which is delivered to each semiconductor industrial oven through a pipeline. In the heating gas mixing pipeline, high-temperature gas and room-temperature gas are mixed in proportion to achieve the required gas temperature. The gas temperature change in each semiconductor industrial oven is independently controlled, so that the gas temperature in each semiconductor industrial oven will not be the same at the same time.

[0030] like Figure 1 As shown, the loading and unloading conveyor assembly 4 includes a ground rail 41, a six-axis robot 42, and a loading and unloading conveyor belt 43. The six-axis robot 42 is slidably connected to the ground rail 41, and the loading and unloading conveyor belt 43 cooperates with the ground rail 41. The six-axis robot 42 can grasp electronic components on the loading and unloading conveyor belt 43 and move them into the semiconductor industrial oven 5 for heat-seal fixing. In this embodiment, the loading and unloading conveyor assembly is used to transport electronic components to be heated to the semiconductor industrial oven and then transport the heat-seal fixed electronic products out of the production line.

[0031] From the above, it can be seen that the present invention provides an energy-saving semiconductor industrial oven system. By arranging mutually coordinated heat source components, exhaust gas treatment tanks, heat exchangers, loading and unloading conveying components, AI intelligent main control center and multiple semiconductor industrial ovens in the semiconductor industrial oven system, the AI ​​intelligent main control center can control the heat exchanger to recover the heat energy of the high-temperature exhaust gas discharged from the semiconductor industrial oven and re-transmit it to the semiconductor industrial oven to preheat the electronic components that need to be heated. At the same time, the exhaust gas after the heat energy is recovered is harmlessly treated before being discharged, which can purify the high-temperature exhaust gas and recycle the heat energy in the high-temperature exhaust gas, circulate and preheat the electronic components that need to be heated, greatly reduce the time required for hot-melt fixing of electronic components, improve production efficiency, and reduce energy consumption; use Catalytic catalysts are used to treat exhaust gases to achieve environmentally friendly emissions, which will not pollute the atmosphere and protect the environment. In addition, the oven is a small, sealed box with no heat leakage, high thermal energy utilization rate, high temperature control accuracy and energy saving, so the heat temperature inside is uniform (±3°C). The oven group is arranged in a shelf-like manner, utilizing the upper space of the site and occupying a small area. The number of ovens can be configured according to production capacity, with high flexibility. It can be used for both experimental products and mass-produced products. The AI ​​intelligent main control center monitors and controls the robot operation and the temperature inside the box at all times. It has a high degree of intelligence. All machine actions, programmed temperature rise, and multi-stage temperature control will record data for quality traceability and analysis, solving the problems of slow heating speed, high energy consumption, and environmental friendliness of semiconductor industrial ovens in the existing technology.

[0032] The specific implementation manner described above is a preferred implementation manner of the present invention, and is not intended to limit the specific implementation scope of the present invention. The scope of the present invention includes but is not limited to this specific implementation manner. All equivalent changes made in accordance with the present invention are within the protection scope of the present invention.

Claims

1. An energy-saving semiconductor industrial oven system, characterized in that: It includes a heat source component, an exhaust gas treatment tank, a heat exchanger, a loading and unloading conveying component, an AI intelligent main control center and multiple semiconductor industrial ovens that cooperate with each other. The AI ​​intelligent main control center is controlled and connected with the heat source component, the exhaust gas treatment tank, the heat exchanger, the loading and unloading conveying component, and multiple semiconductor industrial ovens. The semiconductor industrial oven is provided with an oven high-temperature gas inlet, an oven normal-temperature gas inlet and an oven high-temperature exhaust gas exhaust port. The heat source component is connected to the oven high-temperature gas inlet through a gas pipeline, and the oven normal-temperature gas inlet is connected to the external normal-temperature atmospheric environment through a gas pipeline. The heat exchanger is provided with an exchanger high-temperature exhaust gas inlet, an exchanger normal-temperature air inlet, and an oven high-temperature exhaust gas exhaust port. The air inlet, the normal temperature exhaust gas exhaust port of the exchanger and the high temperature air outlet of the exchanger, the high temperature exhaust gas exhaust port of the oven is connected to the high temperature exhaust gas inlet of the exchanger through a gas transmission pipeline, the high temperature air outlet of the exchanger is connected to the high temperature gas inlet of the oven, the normal temperature exhaust gas exhaust port of the exchanger is connected to the waste gas treatment tank, and the normal temperature gas inlet of the oven is connected to the external normal temperature atmospheric environment through a gas transmission pipeline. The AI ​​intelligent main control center can control the heat exchanger to recover the heat energy of the high temperature exhaust gas discharged from the semiconductor industrial oven and re-deliver it to the semiconductor industrial oven to preheat the electronic components that need to be heated, and at the same time, the exhaust gas after the heat energy is recovered is harmlessly treated before being discharged.

2. The energy-saving semiconductor industrial oven system according to claim 1, characterized in that: The semiconductor industrial oven also includes a baking inner box, a baking outer box and a baking drawer that cooperate with each other. A drawer slide is provided at the bottom of the baking inner box. The baking drawer is slidably connected to the drawer slide. A material placement box is provided in the baking drawer. The baking outer box is tightly surrounded by the baking inner box. A sealing and thermal insulation layer is provided between the inner wall of the baking outer box and the baking inner box. The sealing and thermal insulation layer is an aerogel gasket.

3. The energy-saving semiconductor industrial oven system according to claim 2, characterized in that: The bottom of the baking inner box is also provided with a spoiler for accelerating the uniform mixing of high-temperature gas.

4. The energy-saving semiconductor industrial oven system according to claim 3, characterized in that: The outer surface of the baking outer box is also provided with a heating gas mixing pipe, which is connected to the high-temperature gas inlet of the oven and the normal-temperature gas inlet of the oven. The AI ​​intelligent main control center controls the specific temperature in the baking inner box by controlling the ratio of high-temperature gas from the high-temperature gas inlet of the oven and normal-temperature gas from the normal-temperature gas inlet of the oven.

5. The energy-saving semiconductor industrial oven system according to claim 4, characterized in that: A high-temperature sealing strip is further provided at the junction of the baking inner box and the baking drawer. The inner wall of the baking drawer is provided with a drawer sealing and heat-insulating layer, and the drawer sealing and heat-insulating layer is an aerogel gasket.

6. The energy-saving semiconductor industrial oven system according to claim 5, characterized in that: A plurality of semiconductor industrial oven arrays are arranged on a baking rack and combined into an oven group, and the oven group cooperates with the loading and unloading conveying assembly.

7. The energy-saving semiconductor industrial oven system according to claim 6, characterized in that: High-temperature resistant solenoid valves are provided at the high-temperature gas inlet of the oven, the normal-temperature gas inlet of the oven, and the high-temperature exhaust gas exhaust port of the oven, and the AI ​​intelligent main control center is controlled and connected to the high-temperature resistant solenoid valves.

8. The energy-saving semiconductor industrial oven system according to claim 7, characterized in that: The loading and unloading conveying assembly includes a ground rail, a six-axis robot and a loading and unloading conveyor belt. The six-axis robot is slidably connected to the ground rail, and the loading and unloading conveyor belt cooperates with the ground rail. The six-axis robot can clamp the electronic components on the loading and unloading conveyor belt and move them into the semiconductor industrial oven for hot melt fixing operations.

9. The energy-saving semiconductor industrial oven system according to claim 8, characterized in that: A high-temperature exhaust gas combustion chamber is provided between the high-temperature exhaust gas exhaust port of the oven and the high-temperature exhaust gas inlet of the exchanger. The high-temperature exhaust gas combustion chamber is provided with a variety of catalytic catalysts for decomposing organic matter in the exhaust gas, including low-temperature catalysts, biological catalysts and photocatalysts.

10. The energy-saving semiconductor industrial oven system according to claim 9, characterized in that: Activated carbon for filtering waste gas is arranged in the waste gas treatment tank.

Images