Intelligent laser etching system for laser etching machine

Abstract

The invention discloses an intelligent laser etching system for a laser etching machine. The intelligent laser etching system for the laser etching machine comprises a processor, wherein the processor is used for executing the following steps: receiving an etching preset mode and configuring laser formula data based on the etching preset mode; adjusting the operation platform and the laser module to preparation positions respectively; controlling to open the corresponding laser module; and controlling the operation platform and the laser module to move, and performing laser etching on the to-be-etched object through the laser module. According to the intelligent laser etching system for the laser etching machine, automatic control and automatic monitoring of etching can be realized, the etching precision and the etching efficiency are improved, the time and errors of manual intervention are reduced, and the production efficiency is improved; and the safety of operators is ensured to a certain extent.

Description

Technical Field

[0001] The present application relates to the field of laser etching technology, and in particular to an intelligent laser etching system for a laser etcher. Background Art

[0002] The high precision and non-contact nature of laser etching technology has led to its widespread application in many fields. In microelectronics manufacturing, laser etching can be used to create tiny circuit structures and devices, as well as to repair and modify the surfaces of electronic components. In optical component processing, laser etching can be used to produce high-precision optical components such as optical fibers, gratings, and optical lenses. In the biomedical field, laser etching can be used to create micro biochips and biosensors, as well as for precise cutting and repair of cells and tissues. In nanomaterial research, laser etching can be used to prepare nanostructures and nanomaterials, as well as for nanoscale processing and surface modification.

[0003] By adjusting laser parameters and controlling the machining process, high-precision machining of various materials and the fabrication of microstructures can be achieved. For example, by adjusting parameters such as laser power, pulse width, and frequency, the machining depth and speed of laser etching can be controlled. Furthermore, by controlling the focusing and scanning pattern of the laser beam, precise positioning and shape control of the machining area can be achieved. Furthermore, by controlling the machining time and spatial distribution of the laser etching, the fabrication and assembly of microstructures can be achieved. These precise control capabilities make laser etching an efficient, accurate, and environmentally friendly machining technology.

[0004] Laser etching technology enables high-precision processing of various materials and the fabrication of microstructures by adjusting laser parameters and controlling the machining process. Its high energy density, high-precision processing, selectivity, non-contact processing, and pollution-free nature have led to its widespread application in industry, biomedicine, nanomaterials research, and other fields.

[0005] Traditionally, laser etching equipment has been controlled manually, starting and stopping the equipment. During etching, the motor must be manually controlled to a fixed etching position. Etching parameters, such as power, speed, and frequency, must be manually adjusted based on specific etching requirements. Operators also need to manually monitor etching progress and quality to ensure the desired results are achieved.

[0006] However, manual operation is susceptible to human factors, such as fatigue, lack of concentration, and operational errors, which can lead to equipment errors or accidents, posing a potential threat to the safety of the equipment and operators. During the etching process, manually controlling the motor to a fixed etching position may have low precision, making it impossible to achieve high-precision etching control, affecting etching quality and consistency. Traditional methods cannot achieve remote monitoring and management of the equipment. The inability to remotely control and monitor information such as the equipment's operating status and etching progress limits the convenience and efficiency of remote management and maintenance of the equipment.

[0007] Therefore, a new etching control scheme is needed to improve etching quality and etching efficiency and ensure the safety of operators. Summary of the Invention

[0008] One advantage of the present application is that it provides an intelligent laser etching system for a laser etcher, wherein the intelligent laser etching system for a laser etcher can realize automatic control and automatic monitoring of etching, improve etching accuracy and etching efficiency, reduce the time and errors of manual intervention, improve production efficiency; and ensure the safety of operators to a certain extent.

[0009] Another advantage of the present application is that it provides an intelligent laser etching system for a laser etcher, wherein the intelligent laser etching system for a laser etcher uses advanced AI algorithms and visual technology, and cooperates with a high-computing-power desktop computer as a host computer to directly process and analyze the data of the laser etcher at high speed. Through the comprehensive application of motion controllers and software, it can achieve precise control and monitoring of the laser etcher, significantly improving production efficiency and the stability of the production environment.

[0010] Another advantage of the present application is that it provides an intelligent laser etching system for a laser etcher, wherein the intelligent laser etching system for a laser etcher automatically judges the laser etching effect by introducing AI (Artificial Intelligence) technology, can clearly identify high-quality etching and poor etching, and then fully realize the intelligence of the laser etcher through the combined judgment of CCD (Charge coupled Device) + AI (Artificial Intelligence). Specifically, the intelligent laser etching system for a laser etcher can accurately control and monitor the equipment, and import a large number of data models into the AI, thereby improving the accuracy and stability of the equipment. By using advanced control algorithms and sensor technology, the system can monitor and adjust the parameters in the etching process in real time to ensure the accuracy and consistency of etching. In addition, the intelligent laser etching system for a laser etcher also supports more complex algorithm implementations, making the etching process more flexible and sophisticated.

[0011] Another advantage of the present application is that it provides an intelligent laser etching system for a laser etcher, wherein the intelligent laser etching system for a laser etcher can monitor the laser etcher in real time and adjust the equipment parameters of the laser etcher in a timely manner, thereby ensuring the stability and safety of the production environment and taking effective measures to deal with potential problems.

[0012] Another advantage of the present application is that it provides an intelligent laser etching system for a laser etcher. The software interface of the intelligent laser etching system for the laser etcher is intuitive and user-friendly, and can display etching data and the status of the laser etcher in real time, allowing users to intuitively and in real time understand the various parameters and indicators of the etching process, as well as the operating status of the laser etcher. This visual display enables operators to better understand the working conditions of the laser etcher and adjust and optimize the etching process in a timely manner.

[0013] Another advantage of the present application is that it provides an intelligent laser etching system for a laser etcher, wherein the intelligent laser etching system for a laser etcher can record etching data, which can facilitate the user's subsequent data analysis and statistical work, help the user better understand the operation of the laser etcher, promptly identify problems and take effective measures to adjust them, thereby ensuring the stability and safety of the production environment, and can also help users evaluate and optimize the production process. Users can also view the production data of the laser etcher within a specific time period and use the software to generate corresponding reports and charts. These reports and charts will help users better evaluate and optimize the production process, improve production efficiency and etching quality.

[0014] Another advantage of the present application is that it provides an intelligent laser etching system for a laser etcher, wherein the intelligent laser etching system for a laser etcher can run on computers with different operating systems and form a good interactive experience with the operator. This flexibility reduces the learning cost for personnel, because operators can use the operating system and interface they are familiar with without the need for additional training or learning a new operating system.

[0015] Another advantage of this application is that it provides an intelligent laser etching system for a laser etcher, wherein the intelligent laser etching system for a laser etcher can realize remote control and monitoring of the laser etcher, making it convenient to operate and manage the laser etcher anytime and anywhere. Operators can remotely monitor and control the operating status of the laser etcher through remote access system, perform fault diagnosis and maintenance. This remote control function greatly improves the operability and management efficiency of the laser etcher, bringing greater convenience and flexibility to enterprises.

[0016] According to one aspect of the present application, an intelligent laser etching system for a laser etcher is provided, comprising a processor configured to perform the following steps: receiving a preset etching mode and configuring laser recipe data based on the preset etching mode; Adjust the operating platform and laser module to their preparation positions respectively; Control to turn on the corresponding laser module; and, The operation platform and the laser module are controlled to move, and the object to be etched is laser-etched by the laser module.

[0017] In the intelligent laser etching system for a laser etcher according to the present application, the preset etching mode includes an etching mode of an upper laser module and an etching mode of a lower laser module, and the laser recipe data includes upper laser recipe data and lower laser recipe data.

[0018] In the intelligent laser etching system for a laser etcher according to the present application, the processor is used to control the upper laser module to emit green light and control the lower laser module to emit red light.

[0019] In the intelligent laser etching system for a laser etcher according to the present application, the processor is used to control the movement of the platform axis, the X-axis moving element, the Y-axis moving element, and the Z-axis moving element, and drives the operating platform to move through the platform axis, and drives the laser module to move through the X-axis moving element, the Y-axis moving element, and the Z-axis moving element.

[0020] In the intelligent laser etching system for a laser etcher according to the present application, the processor is used to control the mechanical pump to start, and drive the platform axis to move to its ready position through the mechanical pump, so that the operating platform moves to its ready position.

[0021] In the intelligent laser etching system for a laser etcher according to the present application, the processor is used to control the motor to start, and drive the X-axis moving element, the Y-axis moving element, and the Z-axis moving element to their preparation positions respectively through the motor.

[0022] In the intelligent laser etching system for a laser etcher according to the present application, the processor is used to determine an initial laser etching position and an initial etching plan through a visual sensor and an artificial intelligence algorithm.

[0023] In the intelligent laser etching system for a laser etcher according to the present application, the processor is used to monitor and adjust the equipment parameters of the laser etcher in real time through visual sensors and artificial intelligence algorithms.

[0024] In the intelligent laser etching system for a laser etcher according to the present application, the processor is used to control the dust collection device to collect dust from the laser etcher.

[0025] In the intelligent laser etching system for a laser etcher according to the present application, the processor is used to control the resetting of the X-axis moving element, the Y-axis moving element and the Z-axis moving element; control the shutdown of the laser module; control the shutdown of the dust collection device; and control the shutdown of the mechanical pump.

[0026] Further objectives and advantages of the present application will be fully reflected through understanding of the following description and drawings.

[0027] These and other objects, features and advantages of the present application are fully reflected in the following detailed description, drawings and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The above and other purposes, features, and advantages of the present application will become more apparent through a more detailed description of the embodiments of the present application in conjunction with the accompanying drawings. The accompanying drawings are intended to provide a further understanding of the embodiments of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation of the present application. In the drawings, the same reference numerals generally represent the same components or steps.

[0029] Figure 1 The figure shows a schematic diagram of the etching process flow of an intelligent laser etching system for a laser etcher according to an embodiment of the present application.

[0030] Figure 2 The figure shows a schematic diagram of the operation flow of an intelligent laser etching system for a laser etcher according to an embodiment of the present application. DETAILED DESCRIPTION

[0031] Below, the exemplary embodiments according to the present application will be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application, and it should be understood that the present application is not limited to the exemplary embodiments described herein.

[0032] It is understood that the term "a" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the element may be multiple, and the term "a" should not be understood as limiting the number. "Multiple" means greater than or equal to two.

[0033] Although ordinal numbers such as "first," "second," and the like will be used to describe various components, these are not intended to limit those components. The terms are used solely to distinguish one component from another. For example, a first component could be referred to as a second component, and similarly, a second component could be referred to as a first component without departing from the teachings of the present disclosure. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0034] The terms used herein are for the purpose of describing various embodiments only and are not intended to be limiting. As used herein, the singular also includes the plural, unless the context clearly indicates otherwise. It will also be understood that the terms "comprising" and / or "having" when used in this specification specify the presence of a stated feature, number, step, operation, component, element, or combination thereof, and do not preclude the presence or addition of one or more other features, numbers, steps, operations, components, elements, or combinations thereof.

[0035] Application Overview: As previously mentioned, manual operation is susceptible to human factors, such as fatigue, lack of concentration, and operational errors, which can lead to equipment misoperation or accidents, posing a potential threat to the safety of the equipment and operators. During the etching process, manually controlling the motor to a fixed etching position may have low precision, making it impossible to achieve high-precision etching control, affecting etching quality and consistency. Traditional methods cannot achieve remote monitoring and management of the equipment. The inability to remotely control and monitor information such as the equipment's operating status and etching progress limits the convenience and efficiency of remote management and maintenance of the equipment.

[0036] This application proposes combining AI and visual technologies, using a high-computing desktop computer as the host computer, to achieve rapid data processing and analysis. By precisely controlling and monitoring the operating status of equipment in real time, production efficiency and environmental stability will be significantly improved. Users can easily view production data and make corresponding adjustments to optimize production processes and improve etching quality.

[0037] Based on this, the present application proposes an intelligent laser etching system for a laser etcher, which includes: a processor, which is used to perform the following steps: receiving an etching preset mode and configuring laser recipe data based on the etching preset mode; adjusting the operating platform and the laser module to their preparation positions respectively; controlling the opening of the corresponding laser module; and controlling the movement of the operating platform and the laser module, and performing laser etching on the object to be etched through the laser module.

[0038] Schematic diagram of intelligent laser etching system for laser etcher: Figures 1 to 2 As shown, the intelligent laser etching system for a laser etcher according to an embodiment of the present application is illustrated. The intelligent laser etching system for a laser etcher can realize automated etching control and automated monitoring, improve etching accuracy and etching efficiency, reduce the time and errors of manual intervention, improve production efficiency; and to a certain extent, ensure the safety of operators. Specifically, in the etching process flow of the intelligent laser etching system for a laser etcher according to an embodiment of the present application, some preparatory work needs to be done before the formal etching.

[0039] Before performing laser etching, the user needs to select the etching method of each laser according to actual needs. In one embodiment of the present application, the laser etcher controlled by the intelligent laser etching system for the laser etcher includes but is not limited to two laser modules, namely a first laser module and a second laser module. The first laser module is an upper laser module, and the second laser module is a lower laser module. Accordingly, the user needs to select the etching method using the upper laser module and the lower laser module according to actual needs. The etching method of the upper laser module and the lower laser module depends on the etching requirements and the structure of the laser etcher itself. Accordingly, the intelligent laser etching system for the laser etcher includes a processor, which is used to receive an etching preset mode, and the etching preset mode includes but is not limited to one or more of the following options: the etching mode of the first laser module and the etching mode of the second laser. When the first laser module is implemented as an upper laser module and the second laser module is implemented as a lower laser module, the etching preset mode includes but is not limited to one or more of the following options: the etching mode of the upper laser module and the etching mode of the lower laser module.

[0040] The processor of the intelligent laser etching system for a laser etcher is further configured to configure laser recipe data based on the preset etching mode. This laser recipe data includes parameters and settings required for etching. Different laser recipe data can be configured for different laser modules. Accordingly, the processor is configured to configure first laser recipe data for the first laser module and second laser recipe data for the second laser module. When the first laser module is implemented as an upper laser module and the second laser module is implemented as a lower laser module, the processor is configured to configure upper laser recipe data for the upper laser module and lower laser recipe data for the lower laser module.

[0041] The intelligent laser etching system for the laser etcher uses advanced AI algorithms and visual technology, and cooperates with a high-computing-power desktop computer as a host computer to directly process and analyze the data of the laser etcher at high speed. Through the comprehensive application of motion controllers and software, it can achieve precise control and monitoring of the laser etcher, significantly improving production efficiency and the stability of the production environment.

[0042] For example, before laser etching, the position of the object to be etched (e.g., the substrate to be etched) can be determined by combining CCD (Charge coupled Device) and AI (Artificial Intelligence) to determine the initial laser etching position. The basic features of the object to be etched can also be obtained, and the etching scheme can be determined based on the basic features of the object to be etched. The etching scheme includes etching steps, parameters, etc.

[0043] Specifically, computer vision technology and artificial intelligence algorithms are used to comprehensively inspect and analyze the object being etched. By accurately identifying and classifying surface defects, shapes, sizes, and other features, the optimal etching strategy and parameters are determined. After determining the etching plan, extensive etching experiments, combined with AI's automatic adjustment capabilities, continuously optimize the parameters and control strategies during the etching process to achieve extremely high etching accuracy. This approach effectively improves the quality and efficiency of substrate etching.

[0044] Accordingly, the processor is used to determine an initial laser etching position and an initial etching plan through a visual sensor (eg, CCD) and an artificial intelligence algorithm.

[0045] Before laser etching, the corresponding laser modules may be controlled to be turned on, for example, the first laser module and the second laser module, or only the first laser module, or only the second laser module.

[0046] Before laser etching begins, the operating platform and each laser module need to be moved to a ready position to ensure the accuracy and stability of the etching. Accordingly, the processor is used to adjust the position of the operating platform and the position of the laser module, specifically, to adjust the operating platform and the laser module to their ready positions.

[0047] Specifically, in one embodiment of the present application, the laser etcher controlled by the intelligent laser etching system for the laser etcher includes an operating platform, a platform axis, an X-axis moving element, a Y-axis moving element, and a Z-axis moving element, as well as a platform axis drive assembly, a first drive assembly, a second drive assembly, and a third drive assembly connected to the operating platform, the X-axis moving element, the Y-axis moving element, and the Z-axis moving element, respectively. The X-axis moving element, the Y-axis moving element, and the Z-axis moving element are mounted on the operating platform; the first drive assembly is used to drive the X-axis moving element to move along the set X-axis; the second drive assembly is used to drive the Y-axis moving element to move along the set Y-axis; and the third drive assembly is used to drive the Z-axis moving element to move along the set Z-axis. The operating platform is connected to the platform axis; the laser module is connected to the X-axis moving element, or the Y-axis moving element, or the Z-axis moving element. This allows the X-axis moving element, the Y-axis moving element, and the Z-axis moving element to drive each laser module to move when they move.

[0048] In this embodiment, the laser etcher controlled by the intelligent laser etching system drives the platform shaft to move pneumatically. Accordingly, optionally, the platform shaft drive assembly includes at least one mechanical pump. The intelligent laser etching system for the laser etcher can control the movement of the platform shaft by controlling the mechanical pump connected to the platform shaft, thereby driving the movement of the operating platform. In other words, the processor is configured to control the mechanical pump to start, and drive the platform shaft to its ready position via the mechanical pump, thereby causing the operating platform to move to its ready position.

[0049] Alternatively, the laser etcher controlled by the intelligent laser etching system may also drive the platform shaft via other means, such as a motor. Accordingly, the platform shaft drive assembly may optionally include at least one motor. The intelligent laser etching system for the laser etcher may drive the operating platform by controlling the movement of the motor connected to the platform shaft.

[0050] It should be understood that, optionally, the laser etcher controlled by the intelligent laser etching system for the laser etcher can also pneumatically drive the flat X-axis moving element, the Y-axis moving element, and the Z-axis moving element. Accordingly, optionally, the first drive assembly includes at least one mechanical pump, the second drive assembly includes at least one mechanical pump, and the third drive assembly includes at least one mechanical pump. The intelligent laser etching system for the laser etcher can control the movement of the X-axis moving element, the Y-axis moving element, and the Z-axis moving element by controlling each mechanical pump, thereby driving the movement of each laser module.

[0051] Optionally, the laser etcher controlled by the intelligent laser etching system for the laser etcher may also drive the X-axis moving element, the Y-axis moving element, and the Z-axis moving element by other means, for example, a motor. Accordingly, optionally, the first drive assembly includes at least one motor, the second drive assembly includes at least one motor, and the third drive assembly includes at least one motor. The intelligent laser etching system for the laser etcher may control the movement of the X-axis moving element, the Y-axis moving element, and the Z-axis moving element by controlling each motor, thereby driving each laser module to move.

[0052] In one example, the upper laser module is mounted on the Y-axis moving element and is configured to emit green light, thus forming a green light module. The lower laser module is mounted on the Z-axis moving element and is configured to emit red light, thus forming a red light module. In this example, when etching is performed using the upper laser module (i.e., the green light module), the Y-axis moving element must be moved to its preparation position to ensure accurate and stable etching. When the Y-axis moving element is mounted on the X-axis moving element, the position of the X-axis moving element may also need to be adjusted to drive the Y-axis moving element to move in the set X-axis direction until it reaches its corresponding position in the set X-axis direction. In this example, when etching is performed using the lower laser module (i.e., the red light module), due to the high precision of the etching, the focal length needs to be adjusted. The Z-axis focal length can be controlled and adjusted to achieve precise etching. The Z-axis moving element must be moved to its preparation position. It may also be necessary to adjust the positions of the X-axis moving element and the Y-axis moving element to drive the Z-axis moving element to move in the set X-axis direction and Y-axis direction until the Z-axis moving element moves to its corresponding position in the set X-axis direction and Y-axis direction.

[0053] It is worth mentioning that the order of controlling the laser module to turn on and controlling the platform axis, the X-axis moving element, the Y-axis moving element, and the Z-axis moving element to move to the preparation position can be reversed, that is, the platform axis, the X-axis moving element, the Y-axis moving element, and the Z-axis moving element can be moved to the preparation position first, and then the laser module can be controlled to turn on.

[0054] During the laser etching process, the processor is used to control the movement of the platform axis, the X-axis moving element, the Y-axis moving element, and the Z-axis moving element based on the laser recipe data, and cooperate with each laser module to complete the laser etching.

[0055] During the laser etching process, the intelligent laser etching system for the laser etcher can monitor the laser etcher in real time and adjust the equipment parameters of the laser etcher in time, so as to ensure the stability and safety of the production environment and take effective measures to deal with potential problems. In the present application, the intelligent laser etching system for the laser etcher automatically judges the laser etching effect by introducing AI (Artificial Intelligence) technology, and can clearly identify high-quality etching and poor etching, and then through the combined judgment of CCD (Charge coupled Device) + AI (Artificial Intelligence), the laser etcher is fully intelligent, accurately controls and monitors the equipment, and continuously optimizes the parameters and control strategies in the etching process, thereby improving the accuracy and stability of the equipment. By using advanced control algorithms and sensor technology, the system can monitor and adjust the parameters in the etching process in real time to ensure the accuracy and consistency of etching. In addition, the intelligent laser etching system for the laser etcher also supports more complex algorithm implementations, making the etching process more flexible and refined. Accordingly, the processor is used to monitor and adjust the equipment parameters of the laser etching machine in real time through a visual sensor (eg, CCD) and an artificial intelligence algorithm.

[0056] Preferably, the laser etcher needs to be vacuumed before and during the etching process. A large amount of fine dust is generated during the etching process, which will accumulate inside the laser etcher and in the surrounding environment, adversely affecting the normal operation of the laser etcher and the etching effect. First, the dust will adhere to the etching head and etching lens, causing the optical performance of the etching head to deteriorate, affecting the etching quality and accuracy. Second, the dust will also enter the internal components of the laser etcher, clogging and wearing out key components, causing malfunction and damage to the laser etcher, and even shortening the life of the laser etcher. Intelligent laser etchers have introduced a vacuum function that automatically turns on during green light etching. Turning on the vacuum device can absorb and filter out the dust in time, keeping the etching environment clean. Second, cleaning the dust can prevent dust from entering the internal components of the laser etcher, reducing the risk of laser etcher malfunction and extending the service life of the laser etcher. Accordingly, the processor is used to control the vacuum device to vacuum the laser etcher.

[0057] After etching the object to be etched, the laser etcher needs to be restored to its initial state, for example, the platform axis, the X-axis moving element, the Y-axis moving element and the Z-axis moving element are controlled to reset, that is, the platform axis, the X-axis moving element, the Y-axis moving element and the Z-axis moving element are controlled to move to their respective initial positions; each laser module is controlled to be turned off; the dust collection device is controlled to be turned off; and the mechanical pump is controlled to be turned off.

[0058] After the etching of the object to be etched is completed, the etched object to be etched can be taken out.

[0059] The intelligent laser etching system for the laser etcher can record the etching data, which can facilitate the user's subsequent data analysis and statistical work, help the user better understand the operation of the laser etcher, find problems in time and take effective measures to adjust, thereby ensuring the stability and safety of the production environment, and can also help users evaluate and optimize the production process. Users can also view the production data of the laser etcher within a specific time period and use the software to generate corresponding reports and charts. These reports and charts will help users better evaluate and optimize the production process, improve production efficiency and etching quality. Accordingly, the processor of the intelligent laser etching system for the laser etcher is used to control and record etching data.

[0060] It is worth mentioning that the intelligent laser etching system for laser etching machines can run on computers with different operating systems and form a good interactive experience with operators. This flexibility reduces the learning cost for personnel, because operators can use the operating system and interface they are familiar with without additional training or learning a new operating system.

[0061] The intelligent laser etching system for laser etcher has an intuitive and user-friendly software interface, which can display the etching data and the status of the laser etcher in real time, so that users can intuitively and in real time understand the various parameters and indicators of the etching process, as well as the operating status of the laser etcher. This visual display enables operators to better understand the working conditions of the laser etcher and adjust and optimize the etching process in a timely manner. Specifically, the intelligent laser etching system for laser etcher can be communicatively connected to the display screen, and the etching data and the status of the laser etcher can be displayed on the display screen.

[0062] The intelligent laser etching system for laser etchers supports remote control, enabling remote control and monitoring of the laser etcher, making it easy to operate and manage the laser etcher anytime, anywhere. Operators can remotely access the system to monitor and control the laser etcher's operating status, perform fault diagnosis, and perform maintenance. This remote control feature significantly improves the operability and management efficiency of the laser etcher, bringing greater convenience and flexibility to enterprises.

[0063] According to the intelligent etching process, the present application proposes an intelligent laser etching system for a laser etcher, which includes a processor configured to perform the following steps: S110, receiving a preset etching mode and configuring laser recipe data based on the preset etching mode; S120, adjusting the operating platform and the laser module to their respective preparation positions; S130, controlling to turn on the corresponding laser module; and, S140, controlling the operation platform and the laser module to move, and performing laser etching on the object to be etched by the laser module.

[0064] In some embodiments of the present application, the preset etching mode includes an etching method of an upper laser module and an etching method of a lower laser module, and the laser recipe data includes upper laser recipe data and lower laser recipe data.

[0065] In some embodiments of the present application, the processor is used to control the upper laser module to emit green light, and control the lower laser module to emit red light.

[0066] In some embodiments of the present application, the processor is used to control the movement of the platform axis, the X-axis moving element, the Y-axis moving element, and the Z-axis moving element, and drives the operating platform to move through the platform axis, and drives the laser module to move through the X-axis moving element, the Y-axis moving element, and the Z-axis moving element.

[0067] In some embodiments of the present application, the processor is used to control the mechanical pump to start, and drive the platform shaft to move to its ready position through the mechanical pump, so that the operating platform moves to its ready position.

[0068] In some embodiments of the present application, the processor is used to control the motor to turn on, and drive the X-axis moving element, the Y-axis moving element, and the Z-axis moving element to their respective preparation positions through the motor.

[0069] In some embodiments of the present application, the processor is used to determine the initial laser etching position and the initial etching plan through a visual sensor and an artificial intelligence algorithm.

[0070] In some embodiments of the present application, the processor is used to monitor and adjust the equipment parameters of the laser etcher in real time through visual sensors and artificial intelligence algorithms.

[0071] In some embodiments of the present application, the processor is used to control a vacuuming device to vacuum the laser etching machine.

[0072] In some embodiments of the present application, the processor is used to control the resetting of the X-axis moving element, the Y-axis moving element, and the Z-axis moving element; control the shutdown of the laser module; control the shutdown of the dust collection device; and control the shutdown of the mechanical pump.

[0073] In some embodiments of the present application, the processor is used to control recording of etching data.

[0074] In summary, the intelligent laser etching system for a laser etcher based on the embodiments of the present application is described. The intelligent laser etching system for a laser etcher can achieve automated etching control and automated monitoring, improve etching accuracy and efficiency, reduce the time and errors of manual intervention, improve production efficiency, and, to a certain extent, ensure operator safety.

[0075] The above description of the present application and its embodiments is non-limiting. The drawings show only one embodiment of the present application, and the actual structure is not limited thereto. In short, if a person skilled in the art is inspired by this and, without departing from the inventive purpose of this application, designs a structure and embodiment similar to this technical solution without creatively designing, they shall fall within the scope of protection of this application.

Claims

1. An intelligent laser etching system for a laser etcher, characterized in that: The device comprises a processor configured to perform the following steps: receiving a preset etching mode and configuring laser recipe data based on the preset etching mode; Adjust the operating platform and laser module to their preparation positions respectively; Control to turn on the corresponding laser module; and, The operation platform and the laser module are controlled to move, and the object to be etched is laser-etched by the laser module.

2. The intelligent laser etching system for a laser etcher according to claim 1, characterized in that: The preset etching mode includes an etching mode of an upper laser module and an etching mode of a lower laser module, and the laser formula data includes upper laser formula data and lower laser formula data.

3. The intelligent laser etching system for a laser etcher according to claim 2, characterized in that: The processor is used to control the upper laser module to emit green light, and to control the lower laser module to emit red light.

4. The intelligent laser etching system for a laser etcher according to claim 1, characterized in that: The processor is used to control the movement of the platform axis, the X-axis moving element, the Y-axis moving element, and the Z-axis moving element, and drives the operating platform to move through the platform axis, and drives the laser module to move through the X-axis moving element, the Y-axis moving element, and the Z-axis moving element.

5. The intelligent laser etching system for a laser etching machine according to claim 4, characterized in that: The processor is used to control the mechanical pump to start, and drive the platform shaft to move to its ready position through the mechanical pump, so that the operating platform moves to its ready position.

6. The intelligent laser etching system for a laser etcher according to claim 4, characterized in that: The processor is used to control the motor to turn on, and drive the X-axis moving element, the Y-axis moving element, and the Z-axis moving element to their preparation positions respectively through the motor.

7. The intelligent laser etching system for a laser etcher according to claim 1, characterized in that: The processor is used to determine an initial laser etching position and an initial etching plan through a visual sensor and an artificial intelligence algorithm.

8. The intelligent laser etching system for a laser etcher according to claim 1, characterized in that: The processor is used to monitor and adjust the equipment parameters of the laser etching machine in real time through visual sensors and artificial intelligence algorithms.

9. The intelligent laser etching system for a laser etcher according to claim 5, characterized in that: The processor is used to control the dust collection device to collect dust from the laser etching machine.

10. The intelligent laser etching system for a laser etching machine according to claim 9, characterized in that: The processor is used to control the resetting of the X-axis moving element, the Y-axis moving element and the Z-axis moving element; control the shutdown of the laser module; control the shutdown of the dust collection device; and control the shutdown of the mechanical pump.

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