Fluid flow control component for semiconductor process

Abstract

According to the fluid flow control component for the semiconductor technology, the valve seat, the heat dissipation connecting component and the actuator are arranged, the heat dissipation connecting component is arranged between the valve seat and the actuator to release heat of the high-temperature valve seat, an internal preset structure is arranged in the actuator in the working process to enable a lower piston to move upwards, and a connecting rod is driven to move upwards; the heat of the valve seat is conducted to the heat dissipation connecting part as soon as possible by combining the valve seat structure and adopting the converging flow channel with the larger section relative to the inlet and outlet flow channel, and meanwhile the valve seat is prevented from being damaged due to heat accumulation. Not only is the service life of the whole structure prolonged, but also the flow control component is relatively simple in structure and does not need to occupy more installation space, accurate control of flow is achieved through design of an actuator and the like, and the semiconductor process requirement is met.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a fluid flow control component used in semiconductor processes. Background Art

[0002] In the semiconductor manufacturing field, due to its special requirements such as high precision and high cleanliness, conventional components cannot meet the manufacturing requirements of the semiconductor industry. For example, the flow control components used in the semiconductor industry, such as valves, are used in chemical vapor deposition (CVD) and atomic layer deposition (ALD).

[0003] Conventionally used control valves such as diaphragm valves, pressure reducing valves, and metering valves cannot be used in semiconductor processes. For example, they cannot meet the high temperature requirements of semiconductor process fluids, and they cannot quickly and accurately control the amount of supplied fluid. In addition, different valves need to be switched according to different fluids, which reduces production efficiency.

[0004] Therefore, a new solution for fluid flow control in semiconductor processes is needed. Summary of the Invention

[0005] In view of this, an embodiment of the present disclosure provides a fluid flow control component for use in semiconductor processes.

[0006] The embodiments of this specification provide the following technical solutions:

[0007] The present invention provides a fluid flow control component for semiconductor processing, including:

[0008] Valve seats, heat dissipation connections and actuators;

[0009] The actuator is provided with a preset structure and a lower piston in the direction inward from the air inlet, and the preset structure is used to drive the lower piston to move; the heat dissipation connection component includes a connecting rod, and the heat dissipation connection component and the connecting rod are both connected between the actuator and the valve seat to transfer heat from the fluid in the valve seat;

[0010] The actuator is used to move the internal lower piston upward / downward through the inflow / outflow of gas, thereby driving the connecting rod in the heat dissipation connection component to move;

[0011] The valve seat includes a first flow channel, a diaphragm and a second flow channel;

[0012] One end of the connecting rod is connected to the lower piston of the actuator; the other end of the connecting rod is connected to the diaphragm in the valve seat;

[0013] A converging flow channel of the first flow channel and the second flow channel is provided in the valve seat; a first preset distance is provided between the top and bottom ends of the converging flow channel perpendicular to the flow direction, and the diaphragm is provided in the converging flow channel along the direction from the top to the bottom end;

[0014] The connecting rod is used to provide an upward pulling force for the diaphragm to rebound during the upward movement, and the diaphragm is used to move away from the bottom end of the converging flow channel, so that the fluid flows out after passing through the first flow channel, the converging flow channel, and the second flow channel in sequence.

[0015] The converging flow channel has a larger cross-section than the corresponding flow channels of the first flow channel and the second flow channel, so that the heat of the fluid is transferred to the heat dissipation connection component through the diaphragm and the connecting rod, thereby avoiding damage to the actuator due to heat conduction;

[0016] Alternatively, the connecting rod is used to drive the diaphragm downward during the downward movement, and the diaphragm is used to be in a compressed and sealed state with the bottom end of the converging flow channel, so that the flow in the internal flow channel of the valve seat is cut off, so that the residual heat is transferred to the heat dissipation connection component through the diaphragm and the connecting rod, thereby avoiding damage to the actuator due to heat conduction.

[0017] Compared with the prior art, the at least one technical solution adopted in the embodiments of this specification can achieve the following beneficial effects:

[0018] The embodiments of this specification provide a fluid flow control component for semiconductor processes. By rationally arranging structures such as the valve seat, heat dissipation connection component, and actuator, a heat dissipation connection component is cleverly added between the valve seat and the actuator. This design can effectively and quickly conduct and release the heat generated by the high-temperature valve seat, thereby significantly reducing the heat conducted from the valve seat to the actuator, and avoiding actuator failure due to high temperature. At the same time, the structural design of the valve seat adopts a converging flow channel with a relatively larger inlet and outlet flow channel cross-section, which not only helps the heat of the valve seat to be quickly conducted to the heat dissipation connection component, but also prevents the valve seat from being damaged by heat accumulation. This design not only improves the service life of the overall structure, but also compared with the prior art of designing the heat dissipation structure for each component separately, the flow control component structure of this application is simpler and does not require more installation space. In addition, through the precise control of the actuator, the component can meet the strict requirements of the semiconductor process for fluid flow. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0020] Figure 1is a cross-sectional view of a fluid flow control component for semiconductor processing according to an embodiment of the present invention;

[0021] Figure 2 1 is a schematic structural diagram of a fluid flow control component used in a semiconductor process according to an embodiment of the present invention;

[0022] Figure 3 Schematic diagram of the diaphragm in the valve seat in the embodiment of the present invention in an open state;

[0023] Figure 4 Schematic diagram of the diaphragm in the valve seat in the embodiment of the present invention in a closed state;

[0024] Figure 5 is a cross-sectional view of an actuator according to an embodiment of the present invention;

[0025] Figure 6 Schematic diagram of a flow regulating nut provided in an actuator according to an embodiment of the present invention;

[0026] Figure 7 Schematic diagram of a piston guide sleeve in an actuator according to an embodiment of the present invention.

[0027] Among them, 1. actuator, 11. air inlet, 12. spring, 13. lower piston, 14. guide sleeve, 15. upper piston, 16. fixed piston, 17. first chamber, 18. second chamber, 19. flow regulating nut, 10. compressed air flow channel 2. heat dissipation connecting component, 21. connecting rod, 22. metal shell, 3. valve seat, 31. top column block, 32. diaphragm, 33. first flow channel, 34. second flow channel, 35. converging flow channel, 4. position sensor, 5. solenoid valve. DETAILED DESCRIPTION

[0028] The embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0029] The following describes the embodiments of the present application through specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The present application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that, in the absence of conflict, the features in the following embodiments and embodiments can be combined with each other. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without making creative work are within the scope of protection of this application.

[0030] It should be noted that various aspects of the embodiments within the scope of the appended claims are described below. It should be apparent that the aspects described herein can be embodied in a wide variety of forms, and any specific structure and / or function described herein is merely illustrative. Based on this application, it should be understood by those skilled in the art that an aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspect described herein can be used to implement an apparatus and / or practice a method. In addition, other structures and / or functionalities other than one or more of the aspects described herein can be used to implement this apparatus and / or practice this method.

[0031] It should also be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present application. The illustrations only show components related to the present application and are not drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component can be changed at will, and the component layout type may also be more complicated.

[0032] Additionally, in the following description, specific details are provided to provide a thorough understanding of the examples, however, one skilled in the art will appreciate that the examples can be practiced without these specific details.

[0033] Conventionally used control valves such as diaphragm valves, pressure reducing valves, and metering valves cannot be applied to semiconductor processes. For example, they cannot meet the high temperature requirements of semiconductor process fluids, and they cannot quickly and accurately control the amount of supplied fluid. In addition, different valves need to be switched according to different fluids, which reduces production efficiency.

[0034] Based on this, the embodiment of this specification proposes a new solution for a fluid flow control component for semiconductor processes. By setting a valve seat, a heat dissipation connection component, and an actuator, a heat dissipation connection component is set between the valve seat and the actuator to release the heat of the high-temperature valve seat, reduce the heat conducted from the valve seat to the actuator, and avoid failure due to high temperature of the actuator. In combination with the valve seat structure, a converging flow channel with a larger cross-section than the inlet and outlet flow channels is adopted to allow the heat of the valve seat to be conducted to the heat dissipation connection component as quickly as possible, and at the same time avoid damage to the valve seat due to heat accumulation, etc., which not only improves the service life of the overall structure, but also designs its own heat dissipation structure for each component compared to the existing technology. The flow control component of this application has a relatively simple structure and does not need to occupy more installation space. The precise control of the flow rate is achieved through the design of the actuator and other devices to meet the needs of semiconductor processes.

[0035] The following describes the technical solutions provided by various embodiments of the present application in conjunction with the accompanying drawings.

[0036] like Figure 1-Figure 5As shown, the embodiment of this specification provides a fluid flow control component for semiconductor processing, which includes a valve seat 3, a heat dissipation connection component 2 and an actuator 1 from bottom to top.

[0037] The actuator 1 is provided with a preset structure (which may include an upper piston 15, a fixed piston 16, a first chamber 17, a second chamber 18) and a lower piston 13 along the inward direction of the air inlet 11. The preset structure is used to drive the lower piston 13 to move;

[0038] The heat dissipation connection component 2 includes a connecting rod 21. The heat dissipation connection component 2 and the connecting rod 21 are both connected between the actuator 1 and the valve seat 3 to conduct heat from the fluid in the valve seat 3.

[0039] The valve seat 3 includes a first flow channel 33, a diaphragm 32 and a second flow channel 34;

[0040] One end of the connecting rod 21 is connected to the lower piston 13 of the actuator 1; the other end of the connecting rod 21 is connected to the diaphragm 32 in the valve seat 3;

[0041] The valve seat 3 is provided with a converging flow channel 35 of the first flow channel 33 and the second flow channel 34; a first preset distance is provided between the top and bottom ends of the converging flow channel 35 perpendicular to the flow direction, and the diaphragm 32 is provided in the converging flow channel 35 along the direction from the top to the bottom end;

[0042] Among them, the gas enters the actuator 1 through the air inlet 11, and the preset structure inside the actuator 1 causes the lower piston 13 to move upward, driving the connecting rod 21 and the diaphragm 32 to move upward, so that the diaphragm 32 is away from the bottom end of the converging flow channel 35, so that the fluid flows out after passing through the first flow channel 33, the converging flow channel 35, and the second flow channel 34 in sequence. The converging flow channel 35 has a larger cross-section than the corresponding flow channels of the first flow channel 33 and the second flow channel 34, so that the heat of the fluid is transferred to the heat dissipation connection component 2 through the diaphragm 32 and the connecting rod 21, thereby preventing damage to the actuator 1 caused by heat conduction;

[0043] On the contrary, the gas inside the actuator 1 is discharged, and the preset structure inside the actuator 1 pushes the lower piston 13 to move downward, driving the connecting rod 21 and the diaphragm 32 to move downward, so that the diaphragm 32 and the bottom end of the converging flow channel 35 are in a compressed and sealed state, so that the flow in the internal flow channel of the valve seat 3 is cut off, so that the residual heat is conducted to the heat dissipation connection component through the diaphragm and the connecting rod, avoiding damage to the actuator due to heat conduction.

[0044] The preset structure inside the actuator may include a spring, or a structure with elastic material that can drive the piston to operate.

[0045] In some embodiments, the preset structure may include no piston, one piston, or even multiple pistons. Thus, the preset structure and the lower piston in the actuator can implement a single-stage piston or a multi-stage piston configuration. In a multi-stage piston design, an internal chamber is provided between each adjacent piston.

[0046] In some embodiments, when the actuator is open, compressed air enters the internal chambers of the two pistons through the compressed air flow passage corresponding to the air inlet. The pressure in the two chambers increases, and the air pressure acts on the lower surface area of ​​the pistons. Based on the equation F = P * S, the two pistons are subjected to an upward force. When the force acting on the pistons exceeds the spring force caused by the spring compression, the pistons move upward, and the actuator enters the open state. The connection is used to provide an upward pulling force to the diaphragm during this upward movement, and the diaphragm's own elasticity rebounds under the pulling force.

[0047] When the actuator is closed: the compressed air flow path is exhausted, the spring force is greater than the air pressure on the piston surface, and the piston moves downward, at which point the actuator is in the closed state. The connecting rod drives the diaphragm downward during this downward movement.

[0048] The embodiment of this specification provides a heat dissipation connection component between the valve seat and the upper component thereof to reduce the heat conducted from the valve seat to the actuator thereon, thereby avoiding failure of the actuator due to high temperature. In combination with the valve seat structure, a converging flow channel with a larger cross-section than the inlet and outlet flow channels is adopted to allow the heat of the valve seat to be conducted to the heat dissipation connection component as quickly as possible, while also avoiding damage to the valve seat due to heat accumulation. This not only improves the service life of the overall structure, but also the structure of the flow control component is relatively simple, without occupying more installation space. Precise control of the flow rate is achieved through designs such as actuators to meet the needs of semiconductor processes.

[0049] In some embodiments, a solenoid valve is further included, wherein the air outlet of the solenoid valve is connected to the air inlet of the actuator, and the air inlet of the solenoid valve is used for gas to enter.

[0050] It should be noted that the solenoid valve uses a high-frequency solenoid valve. The air inlet of the high-frequency solenoid valve is connected to compressed air at about 0.5 MPa, and the air outlet is connected to the air inlet of the actuator. The high-frequency solenoid valve controls the opening and closing of the compressed air circuit, thereby controlling the opening and closing of the diaphragm valve flow channel.

[0051] like Figure 2 The solenoid valve 5 shown is energized and in an open state. Compressed air enters the actuator through the solenoid valve. At this time, the piston inside the actuator moves upward, the actuator is in an open state, the diaphragm and the valve seat are in an open state, and the internal flow channel is flowing.

[0052] When the solenoid valve is powered off, it is in the closed state, and the gas inside the solenoid valve and the actuator is discharged. At this time, the piston inside the actuator moves downward, and the actuator is in the closed state. Through the conduction effect of the middle connecting rod, the diaphragm and the valve seat are in a compressed and sealed state, and the internal flow channel is cut off.

[0053] In some embodiments, the opening time and closing time of the diaphragm in the solenoid valve and the actuator control valve seat are less than or equal to 15 ms.

[0054] In the embodiments of this specification, a high-frequency solenoid valve and an actuator are used to achieve rapid valve response, and the valve can be opened and closed within 15ms. The rapid opening and closing of the valve can achieve precise control of the fluid usage.

[0055] In some embodiments, the valve seat also includes a top column block, and the connecting rod is connected to the diaphragm through the top column block. The top column block and the diaphragm are arranged in the converging flow channel along the direction of the top end and the bottom end; the cross-section of the diaphragm is larger than the cross-section of the top column block, and the cross-section of the top column block is larger than the cross-section of the connecting rod. The top column block is used to maintain circulation in the flow channel inside the valve seat, and the heat of the fluid is conducted to the heat dissipation connection component through the diaphragm, the top column block and the connecting rod to dissipate the heat.

[0056] Combine Figure 1 For example, a top column block 31 is also provided in the valve seat 3, and the upper end of the top column block 31 is connected to the lower end of the connecting rod 21, and the lower end of the top column block 31 is connected to the diaphragm 32. The top column block 31 and the diaphragm 32 are arranged in the converging flow channel 35 along the direction of the top end and the bottom end; the cross-section of the diaphragm 32 is larger than the cross-section of the top column block 31, and the cross-section of the top column block 31 is larger than the cross-section of the connecting rod 21. The top column block 31 is used to maintain circulation in the flow channel inside the valve seat, and the heat of the fluid is conducted to the heat dissipation connecting component 2 through the diaphragm 32, the top column block 31 and the connecting rod 21 to dissipate the heat.

[0057] The cross-sectional area of ​​the top column block is set between the cross-sectional area of ​​the lower end of the connecting rod and the cross-sectional area of ​​the diaphragm to achieve steady heat diffusion, avoid excessively high local temperatures of various components, reduce service life, and improve the durability of control components.

[0058] In some embodiments, the heat dissipation connection component is configured to be made of metal, and the heat dissipation connection component further includes a metal shell, such as Figure 2 The metal shell 22 is sleeved on the outside of the connecting rod, and the two ends of the metal shell are respectively connected to the actuator and the valve seat.

[0059] By installing a heat dissipation connection component between the valve seat and the actuator, the high temperature of the fluid flowing through the valve seat, such as a high-temperature fluid of 200°C flowing in the flow channel, is conducted upward through the heat dissipation connection component. The metal heat dissipation connection component is used to dissipate most of the heat, and a small amount of heat (or even almost no heat) is conducted to the upper actuator, etc., avoiding the actuator and electrical components such as the solenoid valve due to high temperature accelerated aging of the electrical components, or even damage and affecting normal production. If this heat dissipation connection component is not added, more heat will be conducted to the actuator. The solenoid valve connected to the actuator is an electrical component and cannot withstand high temperatures, which will accelerate the aging of the electrical components and shorten the service life.

[0060] In some embodiments, the top column block is made of metal.

[0061] In combination with the above embodiments, the connecting rod and the diaphragm are equipped with a converging flow channel, and the top column block is arranged between the connecting rod and the diaphragm, which is not only convenient for installation, but also the top column block is set to be a metal material. During the high-temperature conduction process at the bottom of the valve seat, the heat conducted by the diaphragm passes through the top column block with an intermediate cross-section size and then is conducted to the connecting rod and the entire heat dissipation connection component, which will not cause the local temperature of the diaphragm and the valve seat to be too high, and is conducive to rapid heat dissipation.

[0062] In some embodiments, the diaphragm is configured as a metal diaphragm, and the valve seat is made of PFA (Polyfluoroalkoxy, soluble polytetrafluoroethylene)

[0063] In conjunction with the above embodiment, the diaphragm in the valve seat is configured as a metal diaphragm, and the valve seat is configured as PFA. The metal diaphragm and PFA valve seat provide a strong seal, ensuring that the seal will not fail during tens of millions of uses. The use of a high-temperature resistant PFA valve seat allows high-temperature fluids up to 200°C to pass through the flow channel.

[0064] In some embodiments, a guide sleeve is provided on the piston of the actuator, and the guide sleeve is used to straighten the piston during the up and down movement of the piston. The guide sleeve is set to polytrifluorochloroethylene.

[0065] In combination with the above embodiments, in order to extend the service life of the actuator, a guide sleeve is added, which is provided on the piston and is used to straighten the piston during the upward and downward movement of the piston. In some embodiments, the piston includes an upper piston and a lower piston.

[0066] The actuator 1 has a preset structure with an upper piston 15 and a lower piston 13, as shown in FIG. Figure 7 As shown, the guide sleeve 14 is sleeved on the upper piston 15, and the guide sleeve 14 is used to straighten the piston during the up and down movement of the upper piston 15.

[0067] like Figure 7As shown, the piston in the actuator has a PCTFE (Polychlorotrifluoroethylene) guide sleeve 14. This sleeve stabilizes and straightens the upper piston 15 during its upward and downward movement, preventing the piston (e.g., upper piston 15) from shifting during extended operation. Without this guide sleeve, the piston may become warped or misaligned during movement. This misalignment can exacerbate the misalignment of the O-ring. Unilateral misalignment of the O-ring can cause unilateral wear, leading to seal failure and air leakage, which in turn can cause actuator failure. Therefore, installing a guide sleeve on the actuator piston extends the life of the actuator.

[0068] The present application provides a fluid flow control component for semiconductor processes, which achieves good heat dissipation and ensures that the entire structure can meet the high temperature requirements of the semiconductor fluid, thereby achieving precise flow adjustment.

[0069] In some embodiments, the preset structure in the actuator includes a spring, an upper piston and a fixed piston. The compressed air enters the first chamber between the upper piston and the fixed piston, and the second chamber formed by the lower piston and the cylinder body through the compressed air flow channel; one end of the spring is connected to the preset position corresponding to the air inlet, and the other end of the spring is connected to the upper surface of the upper piston; a flow regulating nut is also provided at the air inlet, and the flow regulating nut is provided on the nut screw connected to the upper piston, and is used to adjust the valve flow by moving the flow regulating nut up and down so that the upper piston moves up and down.

[0070] like Figure 3-Figure 5 As shown, the preset structure in the actuator 1 is provided with an upper piston 15, a fixed piston 16 and a spring 12. The compressed air enters the first chamber 17 between the upper piston 15 and the fixed piston 16, and the second chamber 18 formed by the lower piston 13 and the cylinder body through the compressed air flow channel 10. One end of the spring 12 is connected to the preset position corresponding to the air inlet 11, and the other end of the spring 12 is connected to the upper surface of the upper piston 15. A flow regulating nut 19 is also provided at the air inlet 11. The flow regulating nut 19 is provided on the nut screw connected to the upper piston 15, and is used to adjust the maximum range of the up and down movement of the upper piston 15 in the actuator 1 by adjusting the position of the up and down movement of the flow regulating nut 19, thereby adjusting the flow of the entire valve.

[0071] like Figure 6 Part B is relative to Figure 6 Part A of the actuator, move the flow regulating nut 19 downward. At this time, when the actuator is working normally, the highest position of the internal upper piston 15 will be restricted by the flow regulating nut 19 and cannot move upward, restricting the movement of the upper piston. At this time, when the valve is open, the opening of the metal diaphragm and the valve seat sealing position will be restricted, thereby limiting the flow of the fluid.

[0072] In some embodiments, a position sensor is also provided in the actuator, and the position sensor is installed on the actuator through threads. A second preset distance is set between the contact end of the position sensor and the upper piston, wherein the second preset distance ranges from 0.1mm to 0.3mm, and the upper piston and the lower piston are set correspondingly.

[0073] like Figure 3-Figure 4 As shown, position sensor 4 is installed in actuator 1, and a small distance is provided between the contact end of position sensor 4 and upper piston 15, achieving micro-contact between position sensor 4 and the upper surface of upper piston 15. So-called micro-contact means no contact, a certain distance, and a relatively small distance. For example, the second preset distance range is between 0.1mm and 0.3mm. Therefore, when the distance between the contact end of position sensor 4 and upper piston 15 is between 0 and 0.3mm, the position sensor is in contact and outputs a signal. When the distance is greater than 0.3mm, the position sensor is in non-contact and no signal is output.

[0074] First, the position sensor 4 is mounted on the actuator 1 via a thread. Compared to traditional contact sensors, the position sensor 4 provided in the embodiment of this specification does not require the complicated installation and debugging of contact sensors, that is, the contact sensor must be installed in place during installation, otherwise it will cause inconvenience in debugging and installation. In the embodiment of this specification, the installation and debugging distance of the micro distance between the contact end of the position sensor 4 and the upper piston 15 is set between 0-0.3mm, which is relatively easy to install. Secondly, the contact sensor will be in contact and impacted during long-term operation, causing relative displacement of various internal components. Once the position of the internal components changes from the initial installation position, the signal may not be received. In the embodiment of this specification, the position sensor 4 is threadedly installed. Even if it is impacted, it may cause the thread to loosen and the position to shift. However, as long as it is ensured to be within the macro range, it can still work without the harsh installation conditions of contact sensors. In addition, the contact sensor is subjected to impact wear during contact, which will shorten its lifespan, while the position sensor has a longer service life than the contact sensor.

[0075] The position sensor 4 can receive the signal of the valve opening or closing status in real time, and the current status of the valve can be viewed online.

[0076] Combine Figure 1 and Figure 2When the solenoid valve 5 is energized, it is in the open state. Compressed air enters the actuator through the solenoid valve 5. At this time, the piston inside the actuator moves upward, the actuator is in the open state, the metal diaphragm and the plastic valve seat are in the open state, the internal flow channel is flowing, the valve, such as the diaphragm valve, is open, and the position sensor 4 can receive the open state signal. Alternatively, when the solenoid valve 5 is de-energized, it is in the closed state. The air inside the solenoid valve 5 and the actuator 1 is exhausted. At this time, the piston inside the actuator 1 moves downward, and the actuator 1 is in the closed state. Through the conduction effect of the intermediate connecting rod 21, the metal diaphragm and the plastic valve seat are in a compressed and sealed state, the internal flow channel is cut off, the diaphragm valve is closed, and the position sensor 4 can receive the closed state signal.

[0077] The embodiment of this specification can achieve a fast valve response through the structure of a high-frequency solenoid valve and an actuator, and can complete valve opening and closing within 15ms, further achieving fast and accurate flow regulation.

[0078] In some embodiments, the first flow channel and the second flow channel are respectively configured to be L-shaped, and the first flow channel and the second flow channel are respectively connected by two straight flow channels to form an L-shape.

[0079] In combination with the above embodiments, Figure 3 As shown, the first flow channel and the second flow channel are respectively set to be L-shaped, so that the cross-sectional area of ​​the flow channel is minimized while meeting the requirements, but will not affect the converging flow channel related to the diaphragm.

[0080] In some embodiments, the first flow channel and the second flow channel are respectively connected by two straight flow channels to form an L shape.

[0081] In some embodiments, the roughness of the turning position and inner diameter surface of each of the first flow channel and the second flow channel is set to 0.1; and a fluid at 200° C. flows through the first flow channel and the second flow channel.

[0082] like Figure 3 As shown, the flow channel is set to an L-shape, consisting of two straight flow channels connected. To ensure smooth transition without flow resistance, the bends are set to arcs. While meeting the requirements, the flow channel design minimizes the cross-sectional area of ​​the flow channel, that is, sets a minimum flow channel.

[0083] The rougher the inner surface area of ​​the same flow channel, the greater the resistance when the fluid flows through it. To ensure smooth use of the flow channel, the roughness of the flow channel inner diameter surface and the arc transition connection (i.e., the turning position) are set to Ra0.1, which means that there is basically no resistance to the fluid.

[0084] When the roughness of both the channel bend and the inner diameter is 0.1, gas can flow more smoothly, facilitating purge operations. This design, not only due to the smoothness of the channel's inner surface, but also due to the effectiveness of the purge process, effectively prevents the generation of particles and other contaminants within the channel, ensuring the component's suitability for the ultra-clean semiconductor industry.

[0085] In summary, the fluid flow control components used in semiconductor processes in the embodiments of this specification include a valve seat, heat dissipation connectors, an actuator, a position sensor, and a high-frequency solenoid valve. The high-frequency solenoid valve and actuator structure enable rapid valve response, opening and closing within 15ms. This rapid opening and closing of the valve allows for precise control of fluid usage and real-time visibility of the valve's status, meeting the requirements of processes such as atomic layer deposition in the semiconductor industry.

[0086] In other words, the fluid flow control component for semiconductor processing in the embodiments of this specification achieves the following beneficial effects:

[0087] 1. Equipped with high-frequency solenoid valve, which can achieve rapid response of the valve;

[0088] 2. The position sensor can receive the signal of valve opening or closing status in real time, and the current status of the valve can be viewed online;

[0089] 3. According to different flow usage occasions, different flow states can be achieved through the flow adjustment nut;

[0090] 4. The flow channel with minimized throttling area not only maximizes the flow rate, but also facilitates purging and reduces particle generation;

[0091] 5. The metal diaphragm and PFA valve seat can achieve a good sealing effect, ensuring that the seal will not fail during tens of millions of uses;

[0092] 6. The use of high temperature resistant PFA valve seat can enable high temperature fluid of 200℃ to pass through the flow channel;

[0093] 7. There is a heat dissipation connecting rod between the valve seat and the actuator, which can dissipate the temperature of the high-temperature valve seat and transfer less heat to the actuator to avoid failure of the actuator due to high temperature;

[0094] 8. The up and down movement of the mechanism is achieved through the interaction between the spring and the piston in the actuator;

[0095] 9. Adding a plastic guide sleeve to the actuator can increase the life of the actuator.

[0096] The same or similar parts between the various embodiments in this specification can be referred to in conjunction with each other. Each embodiment focuses on the differences from other embodiments. In particular, for the product embodiments described later, since they correspond to the methods, the description is relatively simple. For relevant parts, please refer to the partial description of the system embodiment.

[0097] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present application should be included in the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.

Claims

1. A fluid flow control component for semiconductor processing, characterized in that: include: Valve seats, heat dissipation connections and actuators; A preset structure and a lower piston are provided in the actuator along the inward direction of the air inlet, and the preset structure is used to drive the lower piston to move; The heat dissipation connection component includes a connecting rod, and the heat dissipation connection component and the connecting rod are both connected between the actuator and the valve seat, and are used to conduct heat of the fluid in the valve seat; The actuator is used to move the internal lower piston upward / downward through the inflow / outflow of gas, thereby driving the connecting rod in the heat dissipation connection component to move; The valve seat includes a first flow channel, a diaphragm and a second flow channel; One end of the connecting rod is connected to the lower piston of the actuator; the other end of the connecting rod is connected to the diaphragm in the valve seat; A converging flow channel of the first flow channel and the second flow channel is provided in the valve seat; a first preset distance is provided between the top and bottom ends of the converging flow channel perpendicular to the flow direction, and the diaphragm is provided in the converging flow channel along the direction from the top to the bottom end; The connecting rod is used to provide an upward pulling force for the diaphragm to rebound during the upward movement. The diaphragm is used to move away from the bottom end of the converging flow channel, so that the fluid flows out after passing through the first flow channel, the converging flow channel, and the second flow channel in sequence. The cross-section of the converging flow channel is larger than that of the corresponding flow channels of the first flow channel and the second flow channel, so that the heat of the fluid is transferred to the heat dissipation connection component through the diaphragm and the connecting rod, thereby avoiding damage to the actuator due to heat conduction.

2. The fluid flow control component for semiconductor process according to claim 1, characterized in that: The valve seat also includes a top column block, The connecting rod is connected to the diaphragm through the top column block; The top column block and the diaphragm are arranged in the converging flow channel along the direction of the top end and the bottom end; The cross-section of the diaphragm is larger than that of the top column block, and the cross-section of the top column block is larger than that of the connecting rod. The top column block is used to maintain flow in the internal flow channel of the valve seat. The heat of the fluid is conducted to the heat dissipation connection component through the diaphragm, the top column block and the connecting rod to dissipate the heat.

3. The fluid flow control component for semiconductor process according to claim 2, characterized in that: The heat dissipation connection component is made of metal; The heat dissipation connection component further includes a metal shell, which is sleeved on the outside of the connecting rod, and the two ends of the metal shell are respectively connected to the actuator and the valve seat; The diaphragm is a metal diaphragm, The top column block is made of metal; the valve seat is made of soluble polytetrafluoroethylene.

4. The fluid flow control component for semiconductor process according to claim 1, characterized in that: The preset structure in the actuator includes a spring, an upper piston and a fixed piston. The compressed air enters the first chamber between the upper piston and the fixed piston, and the second chamber formed by the lower piston and the cylinder body through the compressed air flow channel; one end of the spring is connected to the preset position corresponding to the air inlet, and the other end of the spring is connected to the upper surface of the upper piston; a flow regulating nut is also provided at the air inlet, and the flow regulating nut is provided on the nut screw connected to the upper piston, and is used to adjust the valve flow by moving the flow regulating nut up and down to make the upper piston move up and down.

5. The fluid flow control component for semiconductor process according to claim 4, characterized in that: The actuator is further provided with a position sensor, which is mounted on the actuator via a thread, and a second preset distance is set between the contact end of the position sensor and the upper piston; wherein the second preset distance ranges from 0.1 mm to 0.3 mm; The upper piston and the lower piston are arranged correspondingly.

6. The fluid flow control component for semiconductor process according to claim 4, characterized in that: The guide sleeve is sleeved on the upper piston and is used for straightening the piston during the up and down movement of the upper piston; the guide sleeve is set to polytrifluorochloroethylene.

7. The fluid flow control component for semiconductor process according to claim 1, characterized in that: It also includes a solenoid valve, the air outlet end of the solenoid valve is connected to the air inlet of the actuator, and the air inlet end of the solenoid valve is used for gas to enter.

8. The fluid flow control component for semiconductor process according to claim 7, characterized in that: The opening time and closing time range of the diaphragm in the solenoid valve and the actuator control valve seat is less than or equal to 15ms.

9. The fluid flow control component for semiconductor process according to claim 1, characterized in that: The first flow channel and the second flow channel are respectively configured as L-shaped; The first flow channel and the second flow channel are respectively connected by two straight flow channels to form an L shape.

10. The fluid flow control component for semiconductor process according to claim 9, characterized in that: The turning positions and inner diameter surface roughness of each of the first flow channel and the second flow channel are set to 0.1; wherein the turning positions of the two straight flow channels of each flow channel are set to be smoothly connected by an arc.

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