High-heat-power surrounding type four-air-duct 6MCU case

Abstract

The invention relates to the related field of case structure design of high-power-consumption equipment, in particular to a high-heat-power surrounding type four-air-duct 6MCU case which comprises a case structure assembly, a fan assembly and a signal interface board assembly. The case structure assembly comprises a left cover plate, a right cover plate, an upper cover plate, a main body piece, a lower cover plate, a front cover plate, a rear panel and a fan cover. As the performance of airborne equipment is gradually improved and the power consumption of a single module and a single chip is continuously increased, the heat dissipation face of a case has the problems that the total power consumption is high and the heat density per unit area is increased, and higher requirements are put forward for the internal heat dissipation structure of the case. The internal space of the case is fully utilized, an annular four-air-duct heat dissipation structure is constructed, the heat dissipation thermal resistance of the case is reduced to the maximum extent, the heat dissipation requirements of 150W of a single module and 100W of a single chip are met, meanwhile, the requirements of weight reduction, strength and the like are considered, and the 6MCU case is a brand-new 6MCU case structural form and has great application prospects in structural design of new-generation airborne equipment.

Description

Technical Field

[0001] The present invention relates to the field related to chassis structure design of high-power consumption equipment, and in particular to a high-heat-power surround-type four-air-duct 6MCU chassis. Background Art

[0002] With the continuous development of avionics equipment, the requirements for chassis performance are gradually increasing, and the number of chassis with small size and high thermal power is increasing. Therefore, how to make a chassis heat dissipation structure that can cope with hardware devices with high thermal power consumption in a limited space has become the key to chassis structure design. Only by controlling the operating temperature of the chassis within an appropriate temperature range can the reliability and service life of electronic equipment be guaranteed. The chassis equipment of the present invention has high software and hardware requirements, and the heat dissipation requirements are particularly harsh. It is equipped with a 6MCU standard module equipped with a 100-watt single chip and a total power consumption of 150 watts, which puts higher demands on the chassis heat dissipation structure design of 6MCU.

[0003] In the prior art, there are two forms of heat dissipation for chassis modules. One is module-through air cooling, in which the air duct is set in the middle of each module, blowing air from one end of the module to the other end for air cooling and heat dissipation; the other is side wall air cooling, in which the air duct and the interior of the chassis are independent spaces and do not communicate with each other. The module first adheres to the wall through the side of the structural member to import heat into the side wall, and then takes away the heat from the side wall through air cooling. The first mode is applicable to ASAAC standard modules and is not applicable to 6MCU standard chassis. The heat dissipation capacity of the second mode has certain limitations, and the heat dissipation capacity is limited, which is not suitable for heat dissipation in the case of high power consumption (150W) of a single module. Due to the continuous development of chip technology, the power consumption of a single module is constantly increasing, and the density of heat dissipation components and the total power consumption of a single module are constantly increasing. Therefore, it is necessary to develop an internal structure of a 6MCU chassis so that it can adapt to the situation of high power consumption of a single module. Summary of the Invention

[0004] The purpose of the present invention is to provide a high thermal power surround four-duct 6MCU chassis to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a high-heat-power surround-type four-air-duct 6MCU chassis, comprising a chassis structure assembly, a fan assembly, and a signal interface board assembly, wherein right fan assemblies are installed on the left and right sides of the back of the chassis structure assembly, and a right signal interface board assembly is provided on the side wall of the inner cavity of the chassis structure assembly. The chassis structure assembly comprises a left panel, a right panel, an upper cover, a lower cover, a main body, a rear panel, a front panel, and two fan covers, wherein the right lower cover is installed at the bottom of the main body, the upper cover is installed at the top of the main body, the left and right panels are installed on the left and right sides of the main body respectively, the rear panel is installed at the back of the main body, fan covers are installed on the left and right sides of the rear panel surface, and the front panel is installed at the front of the main body;

[0006] The signal interface board assembly includes a SIM1 board, a SIM2 board, a middle frame structure, and a connector assembly. The SIM1 board, the SIM2 board, and the middle frame structure are fixed to the rear panel by long screws. The connector assembly is connected to the SIM2 board. The SIM1 board and the SIM2 board are in contact with the middle frame structure, and the middle frame structure is located between the SIM1 board and the SIM2 board. Mounting holes are provided on the upper and lower sides of the surface of the SIM1 board. A 3U standard module is installed in the mounting hole above the SIM1 board through a guide pin, and a 6U standard module is installed in the mounting hole below the SIM1 board through a guide pin. The 6U standard module and the 3U standard module are respectively docked with the VPX connector on the SIM1 board;

[0007] The fan assembly includes two cooling fans and two corresponding fan connector plugs. The two cooling fans are respectively installed inside two corresponding fan covers by screws. The two cooling fan terminals are connected to the fan connector plugs through guides. The fan connector plugs are connected to the fan connector socket on the SIM2 board.

[0008] Preferably, four through-type air ducts are formed between the left side panel and the left side wall of the main body, the right side panel and the right side wall of the main body, and the lower cover and the bottom of the main body, and heat dissipation fins are provided inside the air ducts, and the heat dissipation fins are connected to the outer wall surface of the main body. The fan cover is located corresponding to the position of the heat dissipation fins, wherein the hole on the fan cover is the air inlet, and the heat dissipation fan introduces air into the interior of the chassis structure assembly by exhausting air, passes through the four air ducts in the chassis structure assembly, and finally discharges the chassis structure assembly through the groove outlet composed of the main body, the lower cover, the left side panel, and the right side panel.

[0009] Preferably, the 6U standard module and the 3U standard module are attached to the inner wall surface of the main body through a thermal pad. The 6U standard module and the 3U standard module dissipate heat by adhering to the wall. Through a large area of ​​adhering to the wall, the heat of the heating device is transferred to the thermal pad by solid thermal contact conduction, and then transferred to the main body, and then the heat is taken away by ventilation.

[0010] Compared with the prior art, the beneficial effects of the present invention are as follows: in a traditional 6MCU chassis, the heat of the module is often transferred to the side wall of the chassis through the side of the heat-conducting plate and the locking strip against the wall by solid heat conduction, and then ventilated by air cooling to take away the heat on the side wall of the chassis. This heat dissipation method is very limited and not suitable for high-power products. Therefore, the present invention proposes a chassis structure with four air ducts and surround heat dissipation, which takes into account the heat dissipation performance and disassembly and maintenance of high-performance and high-power products, and realizes an air-cooling heat dissipation design that traditional MCU chassis do not have. It not only ensures the easy maintenance of the plug-in installation of the module, but also minimizes the thermal resistance on the heat transfer path of the signal interface board assembly, and meets the heat dissipation requirements of high-heat density and high-power products such as single-chip 100W and single-module 150W. It is a new 6MCU chassis structure and has good application prospects in the next generation of high-power airborne equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a structural schematic diagram of the present invention;

[0012] Figure 2 It is a structural schematic diagram of the present invention;

[0013] Figure 3 It is a structural schematic diagram of the present invention;

[0014] In the figure: 1. Fan cover; 2. Rear panel; 3. Lower cover; 4. Main body; 5. Left side panel; 6. Right side panel; 7. Upper cover; 8. Front panel; 9. Debug cover assembly; 10. 6U standard module; 11. 3U standard module; 12. SIM1 board; 13. SIM2 board; 14. Structural middle frame; 15. Connector assembly. DETAILED DESCRIPTION

[0015] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0016] In the description of the present invention, it should be noted that the terms "vertical", "up", "down", "horizontal", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limiting the present invention.

[0017] In the description of the present invention, it should also be noted that, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to mechanical connections or electrical connections; they may refer to direct connections or indirect connections through an intermediate medium; and they may refer to internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0018] Example 1

[0019] See also Figure 1-3 The present invention provides a technical solution: a high-heat-power surround-type four-air-duct 6MCU chassis, comprising a chassis structure component, a fan component, and a signal interface board component. The right fan component is installed on the left and right sides of the back of the chassis structure component, and the right signal interface board component is set on the side wall of the inner cavity of the chassis structure component. The chassis structure component includes a left panel 5, a right panel 6, an upper cover 7, a lower cover 3, a main body 4, a rear panel 2, a front panel 8 and two fan covers 1. The lower cover 3 is installed at the bottom of the main body 4, the upper cover 7 is installed on the top of the main body 4, the left panel 5 and the right panel 6 are installed on the left and right sides of the main body 4 respectively, the rear panel 2 is installed on the back of the main body 4, the fan covers 1 are installed on the left and right sides of the rear panel 2, and the front panel 8 is installed on the front of the main body 4.

[0020] The signal interface board assembly includes a SIM1 board 12, a SIM2 board 13, a middle frame structure 14, and a connector assembly 15. The SIM1 board 12, the SIM2 board 13, and the middle frame structure 14 are fixed to the rear panel 2 by long screws. The connector assembly 15 is connected to the SIM2 board 13. The SIM1 board 12 and the SIM2 board 13 are in contact with the middle frame structure 14, and the middle frame structure 14 is located between the SIM1 board 12 and the SIM2 board 13. Mounting holes are provided on the upper and lower sides of the surface of the SIM1 board 12. A 3U standard module 11 is installed in the mounting holes above the IM1 board 12 using guide pins. A 6U standard module 10 is installed in the mounting holes below the SIM1 board 12 using guide pins. The 6U standard module 10 and 3U standard module 11 are each docked with the VPX connector on the SIM1 board 12. During installation, remove 8 before installing the 6U standard module 10. Then, insert the 6U standard module 10 into the slot on the bottom side of the main unit 4 and dock it with the VPX connector on the SIM1 board 12. Installation is complete. Next, follow the same installation method as for the 6U standard module 10. Install the 3U standard module 11 in the slot on the top side of the main unit 4 and dock it with the VPX connector on the SIM1 board assembly. After all modules are installed, install the front panel 8 and secure it securely with screws.

[0021] The main body 4 has installation space for one standard 6U standard module 10 and one 3U standard module 11 , and can be expanded into a chassis that accommodates two 6U standard modules 10 according to actual needs.

[0022] The fan assembly includes two cooling fans and two corresponding fan connector plugs. The two cooling fans are installed in the corresponding fan covers 1 with screws. The two cooling fan terminals are connected to the fan connector plugs through guides. The fan connector plugs are connected to the fan connector sockets on the SIM2 board 13. The cooling fans are 60×60×32 axial fans.

[0023] Example 2

[0024] See also Figure 1-2Based on Example 1, four through-type air ducts are formed between the left side panel 5 and the left side wall of the main body 4, the right side panel 6 and the right side wall of the main body 4, and the lower cover 3 and the bottom of the main body 4. Heat dissipation fins are provided inside the air ducts and connected to the outer wall surface of the main body 4. The fan cover 1 is located corresponding to the position of the heat dissipation fins, and the 6U standard module 10 and the 3U standard module 11 are attached to the inner wall surface of the main body 4 via thermal pads. The four through-type air ducts are formed to form independent spaces within the internal space of the main body 4, thereby ensuring the electromagnetic sealing performance of the main body 4 as a whole. Specifically, air is blown into the four through-type air ducts with heat dissipation fins by two 60×60 cooling fans using an exhaust mode from the fan cover 1. The air passes through the four through-type cooling channels, removes heat from the heat dissipation fins, and is finally blown out through the four air outlets on the front panel 8. The heat dissipation path of the signal interface board assembly is as follows: First, the heat on the 6U standard module 10 and the 3U standard module 11 is transferred to the thermal pad through thermal contact conduction, and then transferred to the heat dissipation fins through contact heat dissipation. The heat is then transferred to the outside of the chassis through air cooling.

[0025] In order to meet the heat dissipation requirements of chips and modules with high heat consumption, the present invention improves the heat dissipation channel based on the standard 6MCU chassis structure, greatly enhancing the heat dissipation capacity of the chassis. In traditional 6MCU chassis, a heat dissipation method in which the module has its own heat conduction plate and heats away from the wall through a tightening strip is often used. Its heat dissipation capacity is limited and it is not suitable for high-power products. The present invention creatively proposes a surround four-air duct heat dissipation mode, which dissipates heat from three sides of the 6U standard module 10 and the 3U standard module 11 with a power consumption of 150W. The 6U standard module 10 and the 3U standard module 11 dissipate heat through a thermal pad, conduct the heat to the chassis structural member attached to the wall on the lower side, and then conduct it to the heat dissipation fins of the chassis air duct, and take away the heat from the heat dissipation fins by air cooling. This chassis structure is not only beneficial to the heat dissipation of the module, but also beneficial to the disassembly, assembly, replacement and maintenance of the module. Its structure takes into account the weight reduction and strength performance of the chassis. This chassis type can meet the heat dissipation requirements under high heat density conditions of 150W for a single module and 100W for a single chip. It is a new 6MCU chassis structure and can be widely used in other 6MCU chassis with high heat power consumption.

[0026] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A high-heat-power surround-type four-duct 6MCU chassis, comprising a chassis structure assembly, a fan assembly, and a signal interface board assembly, characterized in that: Fan assemblies are installed on the left and right sides of the back of the chassis structure assembly, and a signal interface board assembly is provided on the side wall of the inner cavity of the chassis structure assembly. The chassis structure assembly comprises a left side panel (5), a right side panel (6), an upper cover panel (7), a lower cover panel (3), a main body (4), a rear panel (2), a front panel (8) and two fan covers (1). The lower cover panel (3) is installed at the bottom of the main body (4), the upper cover panel (7) is installed at the top of the main body (4), the left side panel (5) and the right side panel (6) are installed on the left and right sides of the main body (4), the rear panel (2) is installed on the back of the main body (4), and the fan covers (1) are installed on the left and right sides of the surface of the rear panel (2), and the front panel (8) is installed on the front of the main body (4); The signal interface board assembly comprises a SIM1 board (12), a SIM2 board (13), a middle frame structure (14), and a connector assembly (15); the SIM1 board (12), the SIM2 board (13), and the middle frame structure (14) are fixed to the rear panel (2) by long screws; the connector assembly (15) is connected to the SIM2 board (13); the SIM1 board (12), the SIM2 board (13) are in contact with the middle frame structure (14), and the middle frame structure (14) is located between the SIM1 board (12) and the SIM2 board (13); mounting holes are provided on the upper and lower sides of the surface of the SIM1 board (12); a 3U standard module (11) is mounted on the mounting hole above the SIM1 board (12) through a guide pin; a 6U standard module (10) is mounted on the mounting hole below the SIM1 board (12) through a guide pin; the 6U standard module (10) and the 3U standard module (11) are docked with the VPX connector on the SIM1 board (12) respectively; The fan assembly comprises two cooling fans and two corresponding fan connector plugs. The two cooling fans are respectively mounted inside two corresponding fan covers (1) by screws. The two cooling fan connection terminals are connected to the fan connector plugs through guides. The fan connector plugs are connected to the fan connector socket on the SIM2 board (13).

2. The high thermal power surround type four-duct 6MCU chassis according to claim 1, characterized in that: Four through-type air ducts are formed between the left side plate (5) and the left side wall of the main body (4), the right side plate (6) and the right side wall of the main body (4), and the lower cover plate (3) and the bottom of the main body (4), and heat dissipation fins are provided inside the air ducts, and the heat dissipation fins are connected to the outer wall surface of the main body (4). The fan cover (1) is located corresponding to the position of the heat dissipation fins.

3. The high thermal power surround type four-duct 6MCU chassis according to claim 1, characterized in that: The 6U standard module (10) and the 3U standard module (11) are bonded to the inner cavity wall surface of the main body (4) via a thermal pad.

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