Storage circuit board, capacity expansion circuit board and storage device

Abstract

The invention discloses a storage circuit board, a capacity expansion circuit board and a storage device. The storage circuit board comprises a first circuit board body; the main controller is arranged on the first circuit board, the first storage module is arranged on the first circuit board, and the first storage module is connected with the main controller; the external communication interface is arranged on the first circuit board, and the master controller is connected with the external communication interface and is configured to be in communication connection with an external host through the external communication interface; and the at least one first capacity expansion interface is arranged on the first circuit board, and when the storage circuit board is expanded, the at least one first capacity expansion interface is configured to be connected with the at least one capacity expansion circuit board so as to supplement the storage space of the storage circuit board with the capacity expansion circuit board. According to the storage circuit board, the storage space expansion of the storage circuit board is realized through the expansion interface.

Description

Technical Field

[0001] The present application relates to the field of storage, and in particular to a storage circuit board, an expansion circuit board, and a storage device. Background Art

[0002] In the storage sector, with the continuous advancement of technology, user demands for computing and storage are also increasing. In servers with large memory pools, memory is fragmented between the server CPU and mounted devices, and between mounted devices themselves. This results in wasted storage space and reduced server performance. To address this memory gap, CXL (Compute Express Link) technology was developed. As a high-speed interconnect technology, CXL aims to provide higher data throughput and lower latency to meet user demands for computing and storage. CXL connects storage devices to the PCIe bus, achieving the separation of storage and computing. It also allows the CPU to access the storage space on the storage device with low latency and high bandwidth, thereby expanding memory. The storage devices used for mounting must meet certain manufacturing standards. The SFF TA Working Group of the Solid State Drive Industry Association has developed and published standards such as E1.S (SFF-TA-1006), E1.L (SFF-TA-1007), and E3 (SFF-TA-1008), which define technical requirements for storage device size, interfaces, power supply, heat dissipation, and other aspects. When the space on the circuit board of a storage device is fully utilized, in order to further improve server performance, people often consider expanding the capacity of the storage device itself. However, this expansion solution requires a high level of process technology, and the research cycle for expanding the storage device itself can be long. Summary of the Invention

[0003] The main purpose of this application is to provide a storage circuit board, an expansion circuit board and a storage device that can increase the storage capacity of a storage device.

[0004] To solve the above technical problems, the first technical solution adopted in this application is to provide a storage circuit board. The storage circuit board includes a first circuit board; a main control disposed on the first circuit board; a first storage module disposed on the first circuit board and connected to the main control; an external communication interface disposed on the first circuit board, the main control being connected to the external communication interface and configured to communicate with an external host via the external communication interface; and at least one first expansion interface disposed on the first circuit board. When the storage circuit board is expanded, the at least one first expansion interface is configured to connect to at least one expansion circuit board to supplement the storage circuit board's storage space.

[0005] To solve the above technical problems, the second technical solution adopted in this application is to provide an expansion circuit board. The expansion circuit board includes: a second circuit board; a second storage module disposed on the second circuit board; and a second expansion interface disposed on the second circuit board and connected to the second storage module. When the expansion circuit board is configured on the storage circuit board to expand the storage circuit board, the second expansion interface is configured to connect to the storage circuit board to supplement the storage circuit board's storage space with the expansion circuit board.

[0006] To solve the above technical problems, the third technical solution adopted in this application is to provide a storage device. The storage device includes: a storage circuit board, which is the storage circuit board described in the first technical solution; an expansion circuit board, which is the expansion circuit board described in the second technical solution; and a connector disposed between the storage circuit board and the expansion circuit board, which connects at least one first expansion interface of the storage circuit board with at least one second expansion interface of the expansion circuit board via the connector, thereby supplementing the storage space of the storage circuit board with a second storage module provided in the expansion circuit board.

[0007] The beneficial effect of the present application is that, by setting a first expansion interface between the main control and the first storage module on the first circuit board plate of the storage circuit board, the storage circuit board and the expansion circuit board can be connected through the first expansion interface, thereby expanding the storage space of the storage circuit board without the need for process improvements to the storage particles on the storage circuit board, which is simple and convenient. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0009] Figure 1 This is a schematic structural diagram of the first embodiment of the storage circuit board of the present application;

[0010] Figure 2 This is a schematic structural diagram of the second embodiment of the storage circuit board of the present application;

[0011] Figure 3 This is a schematic structural diagram of the third embodiment of the storage circuit board of the present application;

[0012] Figure 4 This is a structural diagram of a storage module being arranged on a first circuit board;

[0013] Figure 5 This is a schematic structural diagram of the first embodiment of the capacity expansion circuit board of the present application;

[0014] Figure 6 This is a structural diagram of the second embodiment of the capacity expansion circuit board of the present application;

[0015] Figure 7 This is a structural diagram of a storage module being arranged on a second circuit board;

[0016] Figure 8 is a structural diagram of the first embodiment of the storage device of the present application;

[0017] Figure 9 This is a structural diagram of an embodiment of a connector of the present application;

[0018] Figure 10 It is a structural diagram of the second embodiment of the storage device of the present application. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0020] The terms "first," "second," and the like in this application are used to distinguish between different objects, not to describe a particular order. Furthermore, the terms "including," "having," and any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus comprising a series of steps or elements is not limited to the listed steps or elements, but may optionally include steps or elements not listed, or may optionally include other steps or elements inherent to the process, method, product, or apparatus.

[0021] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0022] As mentioned above, to expand the capacity of a storage device within limited space, especially when the space on a circuit board is already almost fully utilized, people often choose to expand the capacity of the storage chips. Within the same circuit board space, when the storage capacity of a single storage chip increases, the overall storage capacity of the storage device also increases.

[0023] However, expanding the capacity of memory chips is a highly challenging technical challenge, involving multiple levels of complexity and technical requirements. First, the structure and properties of the memory chips themselves are extremely sophisticated, and their internal circuit design and material selection are rigorously scientifically calculated and experimentally verified. Therefore, when expanding their capacity, it is imperative to ensure that the new memory cells seamlessly integrate with the existing structure, without any conflicts or interference. Second, the expansion process requires precise control of various physical and chemical parameters, such as temperature, pressure, and electric fields, to ensure the stable operation of the newly added memory cells. Even slight changes in these parameters can significantly affect the performance of the memory chips, requiring technicians to possess extremely high operational precision and extensive experience. Moreover, capacity expansion research is not a one-time effort; it requires long-term dedication.

[0024] In summary, research on storage capacity expansion requires not only deep technical expertise and a deep understanding of storage technology, but also the ability to skillfully apply this expertise, extensive practical experience, and a relentless spirit of innovation, capable of continuous innovation and experimentation throughout the long research process. Only by overcoming these challenges can the appropriate expansion solution be found during the experimental process, ultimately increasing storage capacity.

[0025] Considering the difficulty and time required to implement the aforementioned expansion solutions, in order to more quickly and easily expand the storage device, this application opts for increasing the space available for circuit boards. Adding circuit boards offers greater flexibility and scalability. As a core component of storage devices, circuit boards can be customized and expanded as needed. When increasing storage capacity, adding additional circuit boards or expanding them is simpler, more convenient, and easier to implement than performing complex expansion operations on the storage granules themselves. Furthermore, compared to expanding storage granules, adding circuit boards offers better performance and stability. Because expanding storage granules may involve controlling more physical and chemical parameters, changes in these parameters can have unexpected effects. As part of the overall system, circuit boards can better collaborate with other components, providing a more reliable data storage and access experience. Furthermore, adding circuit boards also means better compatibility and standardization. Circuit boards typically utilize standardized interfaces and protocols, making integration and connection of additional circuit boards easier during expansion, reducing the potential for compatibility issues.

[0026] However, the circuit board in the storage device is almost the same size as the bottom plate of the storage device housing, and there is no extra space for expansion. Therefore, this application chooses to use the longitudinal space to add an expansion circuit board in a direction perpendicular to the circuit board to expand the storage device.

[0027] Reference Figure 1 , Figure 1 This is a structural diagram of the first embodiment of the storage circuit board of this application.

[0028] In this embodiment, the storage circuit board 20 includes a first circuit board plate 210 , a main control 220 , a first storage module 230 , an external communication interface 240 and at least one first expansion interface 250 .

[0029] The main control 220 , the first storage module 230 , the external communication interface 240 and the first expansion interface 250 are all disposed on the first circuit board 210 .

[0030] The first storage module 230 is connected to the main control 220. The external communication interface 240 is provided on the first circuit board 210. Specifically, it can be provided on the edge of the first circuit board 210 to facilitate connection with the communication interface provided on the server. The main control 220 is connected to the external communication interface 240 and is configured to communicate with an external host through the external communication interface 240.

[0031] When expanding the storage circuit board, at least one first expansion interface 250 is configured to connect to at least one expansion circuit board to supplement the storage space of the storage circuit board. Specifically, the first expansion interface 250 is configured to connect to a matching second expansion interface on at least one expansion circuit board to supplement the storage space of the storage circuit board 20 with a second storage module provided in the expansion circuit board.

[0032] The expansion interfaces described in this application are all standardized connection interfaces with expansion capabilities. Users can connect the expansion circuit board through the expansion interface to use the second storage module in the expansion circuit board as the storage space of the storage circuit board. It will be understood by those skilled in the art that the expansion interface described in this application is a standardized connection interface that is specifically used to achieve the connection between the storage circuit board and the matching expansion capacitor board, thereby expanding the storage module in the expansion circuit board into the storage space in the storage circuit board. The storage circuit board will not be connected to other types of circuit boards through the first expansion interface, for example, other types of circuit boards without storage modules or other types of circuit boards with other functional electronic devices attached.

[0033] In this embodiment, a first expansion interface is provided between the main control unit and the first storage module on the first circuit board of the storage circuit board, enabling connection via the first expansion interface to the second expansion interface on the expansion circuit board, thereby connecting the storage circuit board to the expansion circuit board and expanding the storage space of the storage circuit board. This method eliminates the need for process improvements to the storage components on the storage circuit board, resulting in a simple and convenient implementation. Furthermore, the manufacturing process requirements for the circuit board are not high, and the circuit board can still be manufactured using currently used manufacturing processes. The various components installed thereon can also utilize currently used manufacturing processes or communication standards, eliminating the need for major process improvements. Therefore, by adding circuit boards, the storage space of the storage circuit board can be expanded quickly and conveniently.

[0034] Reference Figure 2-3 , Figure 2 This is a schematic structural diagram of the second embodiment of the storage circuit board of this application. Figure 3 This is a structural diagram of the third embodiment of the storage circuit board of this application.

[0035] like Figure 2-3 As shown, a first connection line array is provided in the first circuit board 210. The first connection line array includes a plurality of first connection lines 260, each of which is connected between a corresponding functional pin of the main control 220 and the first storage module 230, thereby achieving a connection between the main control 220 and the first storage module 230. Figure 2 For simplicity, the external communication interface 240 is not shown.

[0036] The first expansion interface 250 includes a first contact array, and the first contact array includes a plurality of first contacts, for example Figure 3 As shown in the first contacts 270 , the number of the first contacts matches the number of the first connection lines 260 , and each first contact is connected to a corresponding first connection line 260 .

[0037] exist Figure 2 In the illustrated embodiment, the first expansion interface 250 can be provided between the main control 220 and the first storage module 230. The first expansion interface 250 can be provided at a suitable position on the first circuit board 210, and each first contact in the first contact array of the first expansion interface 250 is connected to a corresponding first connection line 260 in the first connection line array via a corresponding connection line.

[0038] Or, in Figure 3 In the embodiment shown, the first contact array is arranged on the path where the first connection line array is located, such as Figure 3As shown, each first contact 270 is respectively arranged on the path where a corresponding first connection line 260 is located. Of course, the first expansion interface 250 in the present application can also adopt other methods, as long as it can achieve that each first contact in the first expansion interface 250 is respectively connected to a corresponding first connection line 260. It can be understood by those skilled in the art that, preferably, the first contact array of the first expansion interface 250 of the present application is arranged on the path where the first connection line array is located, that is, each first contact 270 of the first contact array is respectively arranged on the path where a corresponding first connection line 260 is located.

[0039] When each first contact 270 is set on the path of a corresponding first connecting line 260, it can save the setting space for setting the first expansion interface 250 on the first circuit board plate 210, and the extra setting space can be used to place more storage grains; in addition, it does not require additional wiring arrangement, saving costs and process difficulty, and during the signal transmission process, the signal transmission path is shorter, thereby effectively avoiding signal transmission distortion and energy loss.

[0040] The storage circuit board 20 of the present application is based on the design of the existing storage circuit board. Furthermore, a dedicated, standardized first expansion interface 250 is further provided in the area where the first connection line array between the main control 220 and the first storage module 230 is located. The first expansion interface 250 is not a traditional external interface (used to connect the storage circuit board 20 to other external devices). The first expansion interface 250 is used to expand the existing internal signal between the main control 220 and the first storage module 230 of the storage circuit board 20 itself, allowing the second storage module of the matching expansion circuit board to directly serve as an extension of the storage space of the storage circuit board 20 itself, thereby increasing the storage space of the storage circuit board 20.

[0041] Therefore, the technical solution of the present application can simply and conveniently implement the setting of the first expansion interface without making major improvements to the existing storage circuit board design, such as the original connecting lines, thereby helping the storage circuit board 20 to increase the storage space.

[0042] Please continue reading Figure 4 , Figure 4 This is a schematic diagram of a storage module mounted on a first circuit board. In this embodiment, the first storage module 230 includes a first storage unit 2301 and a second storage unit 2302. The first storage unit 2301 is mounted on the first side of the first circuit board 210, and the second storage unit 2302 is mounted on the second side of the first circuit board 210. The first and second sides face each other, and each of the first and second storage units 2301 and 2302 includes multiple storage cells.

[0043] In the present application, since the storage circuit board 20 is provided with a dedicated standard first expansion interface 250 and the matching expansion circuit board is provided with a corresponding standard second expansion interface, the two are connected by a hard board. Therefore, the connection between the first expansion interface 250 and the second expansion interface of the expansion circuit board and the first connection line 260 of the first connection line array provided between the main control 220 and the first storage module 230 in the storage circuit board 20 can be considered to be roughly the same connection method. Therefore, the data transmission rate between the first expansion interface 250 and the second expansion interface of the expansion circuit board can be designed to substantially match the transmission rate of the first connection line 260. In other words, when the first expansion interface 250 is connected to the second expansion interface of the expansion circuit board to perform data transmission, the maximum data transmission rate between the first expansion interface 250 and the second expansion interface can be of the same order of magnitude as the maximum data transmission rate of the first connection line 260 of the first connection line array. For example, if the maximum data transmission rate of the first connection line is 2 Gbps, the maximum data transmission rate between the first expansion interface 250 and the second expansion interface can also reach 2 Gbps.

[0044] In the present application, preferably, when the first expansion interface 250 is connected to the second expansion interface of the expansion circuit board to perform data transmission, the maximum data transmission rate between the first expansion interface 250 and the second expansion interface can be designed to be greater than or equal to 2Gbps.

[0045] When the storage circuit board 20 is expanded and at least one first expansion interface 250 on the storage circuit board 20 is configured to connect to a matching second expansion interface on at least one expansion circuit board, the storage circuit board 20 and the expansion circuit board can be stacked in parallel.

[0046] Since the space in the storage device in the direction perpendicular to the storage circuit board is limited, the expansion circuit board is stacked in parallel with the storage circuit board 20 to reduce the space required in the vertical direction.

[0047] The external communication interface 240 includes a PCIe interface that complies with the open interconnection standard CXL (Compute Express Link).

[0048] Reference Figure 5-6 , Figure 5 This is a structural diagram of the first embodiment of the expansion circuit board of this application. Figure 6 This is a structural diagram of the second embodiment of the capacity expansion circuit board of this application.

[0049] In this embodiment, the expansion circuit board 40 includes a second circuit board plate 410 , a second expansion interface 420 , and a second storage module 430 .

[0050] The second expansion interface 420 and the second storage module 430 are both disposed on the second circuit board 410 .

[0051] The second expansion interface 420 is connected to the second storage module 430. When the expansion circuit board 40 is configured on the storage circuit board 20 to expand the storage circuit board 20, the second expansion interface 420 is configured to connect to the storage circuit board 20 to supplement the storage space of the storage circuit board 20 with the expansion circuit board. Specifically, one second expansion interface 420 is configured to connect to a corresponding expansion interface of at least one first expansion interface 250 on the storage circuit board 20 to supplement the storage space of the storage circuit board 20 with the second storage module 430 provided on the expansion circuit board 40.

[0052] The second expansion interface described in this embodiment is identical to the first expansion interface, both being standardized expansion-capable connection interfaces. This expansion interface allows users to connect the storage circuit board to the expansion circuit board, allowing the storage modules on the expansion circuit board to function as storage space on the storage circuit board. The second expansion interface is designed to the same standards as the first expansion interface, enabling connection between the second expansion interface and the expansion circuit board.

[0053] exist Figure 6 In the embodiment shown, the second expansion interface 420 includes a second contact array, and the second contact array includes a plurality of second contacts, for example Figure 6 The number of the second contacts 450 shown in the figure matches the number of the multiple first contacts of the first contact array of the first expansion interface of the storage circuit board, and each second contact 450 is used to connect to a corresponding first contact.

[0054] exist Figure 6 In the illustrated embodiment, the second expansion interface 420 can be disposed at a suitable location on the second circuit board 410. The second circuit board 410 is provided with a second connection line array, including a plurality of second connection lines 440. Each second connection line 440 is connected between a corresponding second contact 450 in the second contact array and the second storage module 430, thereby connecting the second expansion interface 420 to the second storage module 430. In the present application, the second expansion interface 420 may also be provided in other manners, as long as each second contact in the second expansion interface 420 can be connected to a corresponding second connection line 440.

[0055] When the expansion circuit board 40 is configured on the storage circuit board 20 to expand the storage circuit board 20, the second expansion interface is configured to connect to at least one first expansion interface 250 on the storage circuit board 20, and the second expansion interface 420 performs data transmission with the first expansion interface 250 of the storage circuit board 20. The maximum data transmission rate between the second expansion interface 420 and the first expansion interface 250 can reach the same order of magnitude as the maximum data transmission rate with the first connection line 260 of the first connection line array of the storage circuit board 20. For example, if the maximum data transmission rate of the first connection line is 2 Gbps, the maximum data transmission rate between the first expansion interface and the second expansion interface can also reach 2 Gbps.

[0056] In the present application, preferably, when the first expansion interface is connected to the second expansion interface 420 of the expansion circuit board to perform data transmission, the data transmission rate between the first expansion interface and the second expansion interface 420 can be designed to be greater than or equal to 2 Gbps.

[0057] The same or similar configurations on the expansion circuit board 40 may refer to the description in the storage circuit board embodiment and will not be repeated here.

[0058] like Figure 7 As shown, Figure 7 This is a schematic diagram of a storage module mounted on a second circuit board. In this embodiment, the second storage module 430 includes a third storage unit 4301 and a fourth storage unit 4302. The third storage unit 4301 is mounted on the first side of the second circuit board 410, and the fourth storage unit 4302 is mounted on the second side of the second circuit board 410. The first and second sides face each other, and each of the third storage unit 4301 and the fourth storage unit 4302 includes multiple storage cells.

[0059] The specifications of the memory chips in the third storage unit 4301 and the fourth storage unit 4302 are the same as those in the first storage unit 2301 and the second storage unit 2302 of the storage circuit board. The number of memory chips in the third storage unit 4301 and the fourth storage unit 4302 is the same as that in the first storage unit 2301 and the second storage unit 2302 of the storage circuit board. For example, the first storage unit 2301 may include 8*5 memory chips, i.e., 40 memory chips in total, arranged in five rows, with 8 memory chips in each row. Similarly, the second storage unit 2302 may also include 8*5 memory chips, thus providing 80 memory chips on the storage circuit board 20. Correspondingly, the third storage unit 4301 and the fourth storage unit 4302 of the expansion circuit board 40 may also each include 8*5 memory chips, for a total of 80 memory chips. Therefore, after the storage circuit board 20 is expanded using the expansion circuit board 40, its storage space is doubled.

[0060] It will be understood by those skilled in the art that by setting the specifications and quantity of the storage units on the expansion circuit board 40 to be consistent with the specifications and quantity of the storage units on the storage circuit board, the main control of the storage circuit board does not need to change the communication protocol with the storage units, and does not need to make major improvements to the sending of control signals. The storage units on the expansion circuit board can be controlled directly in accordance with the control method of the storage units on the storage circuit board or with reference to the control method of the storage units on the storage circuit board.

[0061] like Figure 8 As shown, Figure 8 This is a structural diagram of the first embodiment of the storage device of this application.

[0062] The storage device 60 includes a storage circuit board 20 , at least one expansion circuit board 40 , and a connector 610 .

[0063] The storage circuit board 20 is a storage circuit board described in any one of the above embodiments of the present application and any possible combination thereof. The storage circuit board 20 includes a first circuit board 210, a main control 220, a first storage module 230, an external communication interface 240, and at least one first expansion interface 250. The main control 220, the first storage module 230, the external communication interface 240, and the first expansion interface 250 are all disposed on the first circuit board 210. The first storage module 230 is connected to the main control 220. The external communication interface 240 is disposed on the first circuit board 210, specifically, it can be disposed at an edge of the first circuit board 210 to facilitate docking with a communication interface provided on a server. The main control 220 is connected to the external communication interface 240 and is configured to communicate with an external host via the external communication interface 240. The first expansion interface 250 can be located between the main control 220 and the first storage module 230. When the storage circuit board is expanded, the first expansion interface 250 is configured to connect to a matching second expansion interface of at least one expansion circuit board to supplement the second storage module set in the expansion circuit board as the storage space of the storage circuit board 20.

[0064] The expansion circuit board 40 is the expansion circuit board described in any one of the above embodiments and possible combinations of the present application. The expansion circuit board 40 includes a second circuit board plate 410, a second expansion interface 420, and a second storage module 430. The second expansion interface 420 and the second storage module 430 are both arranged on the second circuit board plate 410. The second expansion interface 420 is connected to the second storage module 430. When the expansion circuit board 40 is configured on the storage circuit board 20 to expand the storage circuit board 20, the second expansion interface 420 is configured to connect to a corresponding expansion interface of at least one first expansion interface 250 in the storage circuit board 20, so as to supplement the storage space of the storage circuit board 20 with the second storage module 430 arranged in the expansion circuit board 40.

[0065] The connector 610 is arranged between the storage circuit board 20 and the expansion circuit board 40. The connector 610 is used to connect at least one first expansion interface 250 of the storage circuit board 20 with at least one second expansion interface 420 of the expansion circuit board 40, so as to supplement the storage space of the storage circuit board 20 with the second storage module 430 set in the expansion circuit board 40.

[0066] The height of the connector 610 needs to be slightly larger than the sum of the maximum heights of the components provided on the storage circuit board 20 and the expansion circuit board 40 to which the connector 610 is connected. This is to avoid compression or contact between the components on the expansion circuit board and the storage circuit board when the circuit boards are connected through the connector.

[0067] For ease of illustration, the external communication interface 240 , the first expansion interface 250 , and the second expansion interface 420 are not shown.

[0068] In one embodiment, the connector 610 includes a connector body, a first connection point array, and a second connection point array, wherein the first connection point array is disposed on a first surface of the connector body and includes a plurality of first connection points, each of which is configured to connect to a corresponding first contact of a first expansion interface of a storage circuit board;

[0069] A second connection point array is provided on a second side of the connector body, comprising a plurality of second connection points, the first side and the second side facing away from each other, each second connection point being configured to connect to a corresponding second contact of a second expansion interface of the expansion circuit board;

[0070] A plurality of third connection lines are also provided in the connector body, and each first connection point in the first connection point array is connected to a corresponding second connection point in the second connection point array via a corresponding third connection line.

[0071] In one embodiment, the first connection point and the second connection point protrude from the first surface and the second surface of the connector body, and the first connection point and the second connection point are elastically compressible connection points. Figure 9 As shown, Figure 9 This is a schematic diagram of the structure of an embodiment of a connector of the present application. A first connection point 6101 is provided on the first side of connector 610 for contacting and connecting with a first contact. A second connection point 6102 is provided on the second side of connector 610 for contacting and connecting with a second contact. First connection point 6101 and second connection point 6102 are interconnected via a third connection line 6103.

[0072] Elastic compressibility is a special design that allows for excellent elasticity and compression performance. These connectors are typically used in applications requiring a stable and reliable electrical connection, particularly those that must withstand compression, vibration, or shock. Their design and material selection ensure that the connector maintains stable contact with the contacts even when subjected to external forces, ensuring stable data transmission between the first and second expansion ports.

[0073] In one embodiment, the first connection point may be a connection point that does not protrude from the first surface of the connector body, and the second connection point may be a connection point that does not protrude from the second surface of the connector body. The contact connection between the first connection point and the first contact, and the contact connection between the second connection point and the second contact, are achieved by a structure such as a locking or pressing fit between the circuit boards to achieve stable connection contact.

[0074] like Figure 10 As shown, Figure 10The storage device of the present application further comprises a housing 620 having a receiving cavity therein, wherein the storage circuit board 20 , the expansion circuit board 40 and the connector 610 are all received in the receiving cavity of the housing 620 .

[0075] The housing 620 is also provided with a connection opening, through which the external communication interface 240 of the storage circuit board 20 extends out of the housing 620 to be connected to an external host.

[0076] In one embodiment, the storage device includes a network storage, and specifications of the housing comply with one of E3.S specifications, E3.S2T specifications, E3.L specifications, and E3.L 2T specifications of the network storage.

[0077] The specifications of E3.S are Height 76mm, Length 112.75mm, and Thickness 7.5mm.

[0078] The specifications of E3.S2T are 76mm in height, 112.75mm in length and 16.8mm in thickness.

[0079] The specifications of E3.L are height 76mm, length 142.2mm and thickness 7.5mm.

[0080] The specifications of E3.L 2T are height 76mm, length 142.2mm and thickness 16.8mm.

[0081] In this application Figure 8 In the example shown, only one expansion circuit board 40 is connected to the storage circuit board 20. This is limited by the current E3 specification, as well as the circuit board manufacturing process and the device manufacturing process on the circuit board. It is conceivable that in this application, the storage circuit board 20 can be provided with multiple first expansion interfaces 250. The first expansion interfaces 250 can be provided at multiple locations on the first side of the first circuit board material 210, and can also be provided on the second side of the circuit board material 210. The first expansion interfaces 250 can be provided on both the first and second sides of the first circuit board material 210 to establish connections with the second expansion interfaces 420 of multiple expansion circuit boards 40.

[0082] In one embodiment, the expansion circuit board 40 further includes a third expansion interface, which is provided on the second circuit board plate 410. The third expansion interface is used to establish a connection with a third expansion interface of another expansion circuit board to further expand the space of the storage circuit board 20.

[0083] The second expansion interface 420 on the expansion circuit board 40 may also establish a connection with the third expansion interface of another expansion circuit board to achieve space expansion of the storage circuit board 20 .

[0084] Therefore, it can be imagined that the storage circuit board 20 can be connected to multiple expansion circuit boards 40 through the connector 610, and the expansion circuit board 40 can be further connected to other expansion circuit boards 40 through the connector 610, thereby achieving further expansion of the storage circuit board 20.

[0085] All expansion circuit boards and storage circuit boards can be stacked in parallel.

[0086] In summary, the present application provides a first expansion interface between the main control and the first storage module on the first circuit board of the storage circuit board, enabling connection to the second expansion interface on the expansion circuit board through the first expansion interface, thereby achieving connection between the storage circuit board and the expansion circuit board, and expanding the storage space of the storage circuit board. This method does not require process improvements to the storage particles on the storage circuit board, and is simple and convenient. Furthermore, the manufacturing process requirements for the circuit board are not high, and the circuit board to be manufactured can still use the current manufacturing process. The various devices provided thereon can also use the current manufacturing process or communication standard, without the need for major process improvements. Therefore, by adding circuit boards, the storage space of the storage circuit board can be expanded quickly and conveniently in a short period of time.

[0087] In the several embodiments provided in this application, it should be understood that the disclosed methods and devices can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the division of the modules or units is merely a logical functional division. In actual implementation, other division methods may be used, such as combining or integrating multiple units or components into another system, or ignoring or not implementing certain features.

[0088] The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of this embodiment.

[0089] In addition, each functional unit in each embodiment of the present application may be integrated into a processing unit, each unit may exist physically separately, or two or more units may be integrated into a single unit. The above-mentioned integrated units may be implemented in the form of hardware or software functional units.

[0090] If the integrated units in the above other embodiments are implemented in the form of software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions for enabling a computer device (which can be a personal computer, server, or network device, etc.) or a processor to execute all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes: various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

[0091] The above description is merely an embodiment of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A storage circuit board, characterized in that: include: a first circuit board material; A main control unit is provided on the first circuit board; A first storage module is provided on the first circuit board, and the first storage module is connected to the main controller; An external communication interface is provided on the first circuit board, the main control is connected to the external communication interface, and is configured to communicate with an external host through the external communication interface; At least one first expansion interface is arranged on the first circuit board plate, wherein, when the storage circuit board is expanded, at least one first expansion interface is configured to connect at least one expansion circuit board to supplement the expansion circuit board as the storage space of the storage circuit board.

2. The storage circuit board according to claim 1, wherein: The first circuit board is provided with a first connection line array, including a plurality of first connection lines, each of which is connected between a corresponding functional pin of the main controller and the first storage module to achieve connection between the main controller and the first storage module; The first expansion interface includes a first contact array including a plurality of first contacts. The number of the first contacts matches the number of the first connection lines, and each of the first contacts is connected to a corresponding first connection line.

3. The storage circuit board according to claim 2, wherein: The first contact array is arranged on the path where the first connection line array is located, and each of the first contacts is respectively arranged on the path where a corresponding first connection line is located.

4. The storage circuit board according to claim 2, wherein: The first expansion interface is configured to connect to a matching second expansion interface on at least one of the expansion circuit boards. When the first expansion interface is connected to the second expansion interface of the expansion circuit board to perform data transmission, the maximum data transmission rate between the first expansion interface and the second expansion interface is of the same order of magnitude as the maximum data transmission rate of the first connection line of the first connection line array.

5. The storage circuit board according to claim 2, wherein: The first expansion interface is configured to connect to a matching second expansion interface on at least one expansion circuit board. When the first expansion interface is connected to the second expansion interface of the expansion circuit board to perform data transmission, the maximum data transmission rate between the first expansion interface and the second expansion interface is greater than or equal to 2 Gbps.

6. The memory circuit board according to claim 1, wherein: When the storage circuit board is expanded and at least one of the first expansion interfaces is configured to connect to at least one matching second expansion interface on the expansion circuit board, the storage circuit board and the expansion circuit board are stacked in parallel.

7. The memory circuit board according to claim 1, wherein: The first storage module includes a first storage unit and a second storage unit, wherein the first storage unit is arranged on the first surface of the first circuit board material, and the second storage unit is arranged on the second surface of the first circuit board material, the first surface and the second surface are opposite to each other, and the first storage unit and the second storage unit respectively include multiple storage particles.

8. The memory circuit board according to claim 1, wherein: The external communication interface includes a PCIe interface that meets the open interconnection standard CXL (Compute Express Link).

9. A capacity expansion circuit board, characterized in that: include: a second circuit board sheet; A second storage module is provided on the second circuit board; A second expansion interface is provided on the second circuit board and is connected to the second storage module, wherein, when the expansion circuit board is configured on the storage circuit board to expand the storage circuit board, the second expansion interface is configured to connect to the storage circuit board to supplement the expansion circuit board with the storage space of the storage circuit board.

10. The capacity expansion circuit board according to claim 9, characterized in that: The second expansion interface includes a second contact array, including multiple second contacts, the number of the second contacts matches the number of multiple first contacts of the first contact array of the first expansion interface of the storage circuit board, and each second contact is used to connect to a corresponding first contact.

11. The capacity expansion circuit board according to claim 10, characterized in that: A second connecting line array is provided in the second circuit board plate, including multiple second connecting lines, each of which is connected between a corresponding second contact in the second contact array and the second storage module to realize the connection between the second expansion interface and the second storage module.

12. The capacity expansion circuit board according to claim 9, characterized in that: When the expansion circuit board is configured on a storage circuit board to expand the storage circuit board, the second expansion interface is configured to connect to at least one first expansion interface on the storage circuit board, and the second expansion interface and the first expansion interface of the storage circuit board perform data transmission, and the maximum rate of data transmission between the second expansion interface and the first expansion interface is of the same order of magnitude as the maximum rate of data transmission with the first connection line of the first connection line array of the storage circuit board.

13. The capacity expansion circuit board according to claim 9, characterized in that: The second storage module includes a third storage unit and a fourth storage unit, wherein the third storage unit is arranged on the first surface of the second circuit board material, and the fourth storage unit is arranged on the second surface of the second circuit board material, the first surface and the second surface are opposite to each other, and the third storage unit and the fourth storage unit respectively include a plurality of storage particles; The specifications of the storage particles of the third storage unit and the fourth storage unit are the same as those of the storage particles in the first storage unit and the second storage unit of the storage circuit board, and the number of the storage particles of the third storage unit and the fourth storage unit is the same as the number of the storage particles in the first storage unit and the second storage unit of the storage circuit board.

14. A storage device, characterized in that: include: A storage circuit board, wherein the storage circuit board comprises the storage circuit board according to any one of claims 1 to 8; at least one expansion circuit board, wherein the expansion circuit board comprises the storage circuit board according to any one of claims 9 to 13; A connector is provided between the storage circuit board and the expansion circuit board, and is used to connect at least one first expansion interface of the storage circuit board with at least one second expansion interface of the expansion circuit board, so as to supplement the storage space of the storage circuit board with the second storage module provided in the expansion circuit board.

15. The storage device according to claim 14, wherein: The connector includes a connector body, a first connection point array, and a second connection point array, wherein the first connection point array is disposed on a first surface of the connector body and includes a plurality of first connection points, each of the first connection points being configured to connect to a corresponding first contact of a first expansion interface of the storage circuit board; The second connection point array is provided on the second side of the connector body and includes a plurality of second connection points, the first side and the second side are opposite to each other, and each second connection point is configured to connect to a corresponding second contact of the second expansion interface of the expansion circuit board; A plurality of third connection lines are further provided in the connector body, and each of the first connection points in the first connection point array is connected to a corresponding second connection point in the second connection point array via a corresponding third connection line.

16. The storage device according to claim 15, wherein: The first connection point and the second connection point protrude from the first surface and the second surface of the connector body, and the first connection point and the second connection point are elastically compressible connection points respectively.

17. The storage device according to claim 14, wherein: Further including: a housing, wherein a housing is provided in the housing, and the storage circuit board, the expansion circuit board, and the connector are accommodated in the housing cavity of the housing; The shell is also provided with a connection opening, and the external communication interface of the storage circuit board extends out of the shell through the connection opening to be connected to an external host.

18. The storage device according to claim 17, wherein: The storage device includes a network storage, and specifications of the housing comply with one of E3.S specifications, E3.S2T specifications, E3.L specifications, and E3.L 2T specifications of the network storage.

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