Solid-state capacitor with high sealing performance and efficient heat dissipation and heat dissipation structure of solid-state capacitor

Abstract

The invention discloses a high-sealing-performance and efficient-heat-dissipation solid capacitor and a heat dissipation structure thereof. The high-sealing-performance and efficient-heat-dissipation solid capacitor comprises a shell, a core package and a sealing rubber cover. A mounting groove is formed in the shell, and an internal thread part is arranged on the inner side wall of the mounting groove; the core package is arranged in the mounting groove; according to the invention, the internal thread part and the external thread part of the connecting block at the bottom of the sealing rubber cover form a thread screwing structure, the invasion path of partial water vapor and dust is blocked through the precise matching of a thread gap, and a dynamic elastic sealing layer is formed through the synergistic effect of the silica gel sealing gasket on the surface of the pin terminal and the slot in the sealing rubber cover; by means of the flexible deformation capacity of the silica gel sealing gasket, the relative displacement between components can be compensated in a self-adaptive mode, and the sealing state is continuously kept; heat generated by the core package is conducted to the side heat dissipation silica gel cover and the bottom heat dissipation silica gel cover through the shell, and the heat dissipation area is increased through the strip-shaped heat dissipation grooves in the bottom heat dissipation silica gel cover.

Description

Technical Field

[0001] The present invention belongs to the technical field of solid-state capacitors, and in particular relates to a highly sealed and highly efficient heat dissipation solid-state capacitor and a heat dissipation structure thereof. Background Art

[0002] Solid-state capacitors refer to solid aluminum electrolytic capacitors that use different dielectric materials. The dielectric material of liquid aluminum capacitors is electrolyte, while the dielectric material of solid-state capacitors is conductive polymer material.

[0003] In the existing technology, the sealing structure of traditional capacitors usually adopts a single threaded connection or a simple glue sealing method. The threaded connection relies only on mechanical fit to achieve fixation, while the glue sealing relies on colloid to fill the gap. However, the sealing accuracy of the single threaded connection is insufficient, and the thread gap can easily become an intrusion channel for water vapor and dust. It also lacks elastic compensation ability, and the gap is prone to expand when vibration or temperature difference changes. Although the simple glue sealing process can fill the gap, the colloid lacks deformation ability after solidification and cannot adapt to the thermal expansion and contraction or slight displacement of components. Long-term use may cause the seal to fail due to cracking or aging of the colloid, making it difficult to simultaneously meet the dual needs of mechanical fastening and dynamic sealing.

[0004] To this end, we propose a highly sealed and highly efficient heat dissipation solid-state capacitor and its heat dissipation structure to solve the problems mentioned in the above background technology. Summary of the Invention

[0005] The object of the present invention is to provide a highly sealed and highly efficient heat dissipation solid capacitor and its heat dissipation structure to solve the problems raised in the above background technology.

[0006] To achieve the above object, the present invention provides the following technical solution: a highly sealed and highly efficient heat dissipation solid capacitor, comprising: a housing, a core package, and a sealing rubber cover;

[0007] A mounting groove is provided inside the housing, and an inner side wall of the mounting groove is provided with an internal thread portion;

[0008] The core pack is arranged inside the mounting groove, and the top two sides of the core pack are respectively connected with a positive electrode pin and a negative electrode pin;

[0009] The sealant cover is arranged on the top of the housing, and a connecting block is arranged on the bottom of the sealant cover;

[0010] A sealing structure is provided between the sealant cover and the housing, and the positive electrode pin and the negative electrode pin are sealed inside the sealant cover by the cooperation of the silicone sealing gasket of the sealing structure and the slot.

[0011] Preferably, the sealing structure includes a pin terminal connected to the top of the core package, the positive pin and the negative pin pass through the pin terminal, the silicone sealing gasket is connected to the surface of the pin terminal, the slot is opened inside the sealant cover, and the silicone sealing gasket extends to the inside of the slot.

[0012] The silicone sealing gasket will extend into the slot and use the good elasticity and fit of silicone to tightly fill the gaps between the components, forming a sealed barrier to prevent external impurities such as moisture, dust, etc. from entering the capacitor. The positive and negative pins are then sealed inside the sealant cover to ensure the stability of the capacitor's internal environment.

[0013] Preferably, a through groove for penetrating the positive electrode pin and the negative electrode pin is provided on the surface of the silicone sealing gasket, and the through groove and the silicone sealing gasket are integrally formed.

[0014] Preferably, a through hole for penetrating the positive electrode pin and the negative electrode pin is opened on the surface of the sealant cover, and the through hole and the sealant cover are integrally formed.

[0015] Preferably, the surface of the connecting block is connected with an external threaded portion, the external threaded portion and the connecting block are integrally formed, and the external threaded portion is matched and screwed with the internal threaded portion.

[0016] In addition, in order to achieve the above-mentioned purpose, the present invention also provides a heat dissipation structure, including the highly sealed and efficient heat dissipation solid capacitor.

[0017] Preferably, it further comprises a side heat dissipation silicone cover connected to the inner side of the shell, the bottom of the shell is connected to a bottom heat dissipation silicone cover, and strip heat dissipation grooves are opened at equal intervals inside the bottom heat dissipation silicone cover.

[0018] The side heat dissipation silicone cover and the bottom heat dissipation silicone cover connected to the bottom can quickly absorb and disperse the heat on the outer shell due to its good thermal conductivity. The strip heat dissipation grooves opened at equal intervals inside the bottom heat dissipation silicone cover increase the heat dissipation area and help speed up the diffusion of heat to the outside world.

[0019] Preferably, the surface of the shell is connected to a heat-conducting side seat, and the side edge of the surface of the heat-conducting side seat is connected to a clamping ring, the clamping ring and the heat-conducting side seat are integrally formed, the clamping ring is in contact with the surface of the shell, and the surface of the heat-conducting side seat is provided with a heat dissipation structure, the heat dissipation structure includes heat dissipation fins, the heat dissipation fins are connected to the surface of the heat-conducting side seat at equal intervals, the heat dissipation fins are used for heat dissipation, and the surface of the clamping ring is connected to bolts.

[0020] Preferably, the heat dissipation structure also includes heat sinks connected on both sides of the surface of the heat dissipation fins, which are fixedly arranged between the heat dissipation fins, and the heat dissipation area is further expanded by utilizing the heat dissipation fins connected on both sides of the surface of the heat dissipation fins, thereby enhancing the heat dissipation effect.

[0021] Preferably, a thread groove for the bolt to pass through is provided on the surface of the clamping ring. The thread groove is integrally formed between the clamping rings, and the bolt extends to the interior of the housing.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] (1) An internal threaded portion is provided on the inner side wall of the mounting groove of the housing to form a threaded engagement structure with the external threaded portion of the connecting block at the bottom of the sealant cover. This mechanical fastening method not only achieves the initial positioning of the sealant cover and the housing, but also blocks some of the intrusion paths of water vapor and dust through the precise fit of the thread gap. On this basis, the silicone sealing gasket on the surface of the pin terminal and the internal slot of the sealant cover work together to form a dynamic elastic sealing layer. When the sealant cover is tightened, the silicone sealing gasket is squeezed and deformed, and the edge of the through groove tightly wraps the positive and negative pins, while extending into the slot to fill the thread gap;

[0024] (2) The silicone gasket can adaptively compensate for the relative displacement between components by virtue of its flexible deformation ability, and continuously maintain the sealing state. When the shell is slightly deformed due to vibration, the elastic recovery force of the silicone gasket will automatically offset the gap caused by the deformation, preventing water vapor and dust from entering;

[0025] (3) The heat generated by the core package is conducted to the side heat dissipation silicone cover and the bottom heat dissipation silicone cover through the outer shell. The heat dissipation area is also increased through the strip heat dissipation groove inside the bottom heat dissipation silicone cover. Combined with the three-dimensional layout of the heat dissipation fins, a "point-line-surface" combined heat dissipation network is formed. The heat is quickly conducted to the top of the outer shell through the side heat dissipation silicone cover, and the top heat dissipation is achieved by air convection; the strip heat dissipation groove of the bottom heat dissipation silicone cover guides the heat to diffuse to the surroundings to avoid heat accumulation at the bottom. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a structural schematic diagram of the present invention;

[0027] Figure 2 This is a schematic diagram of the structure of the present invention when it is connected as a whole;

[0028] Figure 3 This is a schematic structural diagram of the heat-conducting edge seat, heat dissipation fins and heat sink when they are three-dimensionally connected;

[0029] Figure 4 This is a schematic structural diagram of the sealing rubber cover and the connecting block of the present invention;

[0030] Figure 5 It is a schematic structural diagram of the side section of the shell of the present invention.

[0031] In the figure: 1. Shell; 2. Retaining ring; 3. Thermal edge seat; 4. Heat sink fin; 5. Bolt; 6. Internal thread; 7. Mounting slot; 8. Core package; 9. Pin terminal; 10. Positive pin; 11. Negative pin; 12. Silicone sealing gasket; 13. Through slot; 14. Connecting block; 15. External thread; 16. Sealant cover; 17. Through hole; 18. Threaded groove; 19. Heat sink; 20. Slot; 21. Side heat dissipation silicone cover; 22. Bottom heat dissipation silicone cover; 23. Strip heat sink. DETAILED DESCRIPTION

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0033] Example 1

[0034] The present invention provides Figure 1-5 A highly sealed and efficient heat dissipation solid capacitor, comprising: a housing 1, a mounting groove 7 is formed inside the housing 1, an inner side wall of the mounting groove 7 is formed with an internal thread portion 6, and the internal thread portion 6 and the housing 1 are integrally formed;

[0035] The core package 8 is arranged inside the mounting groove 7, and the top two sides of the core package 8 are respectively connected to the positive electrode pin 10 and the negative electrode pin 11;

[0036] A sealing rubber cover 16 is provided on the top of the housing 1 , and a connecting block 14 is provided on the bottom of the sealing rubber cover 16 ;

[0037] A sealing structure is provided between the sealant cover 16 and the housing 1 , and the positive electrode pin 10 and the negative electrode pin 11 are sealed inside the sealant cover 16 by the cooperation of the silicone sealing gasket 12 and the slot 20 of the sealing structure.

[0038] The sealing structure includes a pin terminal 9 connected to the top of the core package 8, the positive pin 10 and the negative pin 11 pass through the pin terminal 9, the silicone sealing gasket 12 is connected to the surface of the pin terminal 9, the slot 20 is opened inside the sealing rubber cover 16, and the silicone sealing gasket 12 extends to the inside of the slot 20.

[0039] The silicone sealing gasket 12 will extend into the interior of the slot 20, and use the good elasticity and fit of silicone to tightly fill the gaps between the components to form a sealed barrier, preventing external impurities such as moisture, dust, etc. from entering the interior of the capacitor, thereby forming a seal between the positive pin 10 and the negative pin 11 inside the sealant cover 16, ensuring the stability of the internal environment of the capacitor.

[0040] A through groove 13 for penetrating the positive electrode pin 10 and the negative electrode pin 11 is formed on the surface of the silicone sealing gasket 12 , and the through groove 13 and the silicone sealing gasket 12 are integrally formed.

[0041] The surface of the sealant cover 16 is provided with a through hole 17 for penetrating the positive electrode pin 10 and the negative electrode pin 11 , and the through hole 17 and the sealant cover 16 are integrally formed.

[0042] An external thread portion 15 is connected to the surface of the connection block 14 . The external thread portion 15 and the connection block 14 are integrally formed. The external thread portion 15 is matched and screwed with the internal thread portion 6 .

[0043] In addition, in order to achieve the above-mentioned purpose, the present invention also provides a heat dissipation structure, including the highly sealed and efficient heat dissipation solid capacitor.

[0044] The housing 1 further comprises a side heat dissipation silicone cover 21 connected to the inner side of the housing 1 , a bottom heat dissipation silicone cover 22 connected to the bottom of the housing 1 , and strip heat dissipation grooves 23 are provided at equal intervals inside the bottom heat dissipation silicone cover 22 .

[0045] The side heat dissipation silicone cover 21 and the bottom heat dissipation silicone cover 22 connected to the bottom can quickly absorb and disperse the heat on the shell 1 due to its good thermal conductivity. The strip heat dissipation grooves 23 evenly spaced inside the bottom heat dissipation silicone cover 22 increase the heat dissipation area and help speed up the diffusion of heat to the outside.

[0046] The surface of the shell 1 is connected to a heat-conducting side seat 3, and the side edge of the surface of the heat-conducting side seat 3 is connected to a clamping ring 2. The clamping ring 2 and the heat-conducting side seat 3 are integrally formed. The clamping ring 2 is in contact with the surface of the shell 1. The surface of the heat-conducting side seat 3 is provided with a heat dissipation structure, and the heat dissipation structure includes heat dissipation fins 4. The heat dissipation fins 4 are connected to the surface of the heat-conducting side seat 3 at equal intervals. The heat dissipation fins 4 are used for heat dissipation, and the surface of the clamping ring 2 is connected to bolts 5.

[0047] The heat dissipation structure also includes heat sinks 19 connected on both sides of the surface of the heat dissipation fins 4. The heat sinks 19 are fixed to the heat dissipation fins 4, and the heat dissipation area is further expanded and the heat dissipation effect is enhanced by utilizing the heat sinks 19 connected on both sides of the surface of the heat dissipation fins 4.

[0048] The surface of the clamping ring 2 is provided with a thread groove 18 for the bolt 5 to pass through. The thread groove 18 is formed integrally with the clamping ring 2 , and the bolt 5 extends to the interior of the housing 1 .

[0049] In summary, compared with the prior art, the present invention provides a mounting groove 7 inside the housing 1, an internal threaded portion 6 on the inner wall, and a connecting block 14 at the bottom of the sealant cover 16 with an external threaded portion 15. The two are screwed together to achieve a preliminary connection, laying the foundation for sealing.

[0050] The core pack 8 is placed in the mounting groove 7, and the positive pin 10 and the negative pin 11 on the top thereof pass through the pin terminal 9. The surface of the pin terminal 9 is connected to the silicone sealing gasket 12. The through groove 13 on the silicone sealing gasket 12 is for the positive pin 10 and the negative pin 11 to pass through. The sealing rubber cover 16 has a slot 20 formed inside. When the sealing rubber cover 16 is screwed onto the housing 1, the silicone sealing gasket 12 will extend into the slot 20. The good elasticity and adhesion of silicone will tightly fill the gaps between the components to form a sealed barrier, preventing external impurities such as moisture, dust, etc. from entering the interior of the capacitor, so that the positive pin 10 and the negative pin 11 are sealed inside the sealing rubber cover 16, ensuring the stability of the internal environment of the capacitor;

[0051] The heat generated during the operation of the capacitor (i.e., the core package 8) is first conducted through the shell 1. The side heat dissipation silicone cover 21 connected to the inside of the shell 1 and the bottom heat dissipation silicone cover 22 connected to the bottom can quickly absorb and disperse the heat on the shell 1 due to their good thermal conductivity. The strip heat dissipation grooves 23 evenly spaced inside the bottom heat dissipation silicone cover 22 increase the heat dissipation area, which helps to accelerate the diffusion of heat to the outside world.

[0052] The heat-conducting edge seat 3 connected to the surface of the shell 1 will further conduct the heat conducted from the shell 1 to the heat dissipation structure on its surface. The heat dissipation fins 4 in the heat dissipation structure are evenly spaced and connected to the surface of the heat-conducting edge seat 3, which greatly increases the heat dissipation area and accelerates the heat exchange between the heat and the surrounding air. The clamping ring 2 is fixed to the surface of the shell 1 by bolts 5, and the heat-conducting edge seat 3 is firmly installed to ensure the stability and continuity of heat conduction, so that the heat generated by the capacitor during operation can be quickly and effectively dissipated to the external environment, avoiding the performance and service life of the capacitor affected by heat accumulation.

[0053] Example 2

[0054] See also Figure 3 The present invention provides a technical solution that is basically the same as Example 1, with the following slight differences:

[0055] The heat dissipation structure further includes heat dissipation fins 19 connected to both sides of the surface of the heat dissipation fins 4.

[0056] While the heat dissipation fins 4 on the surface of the embodiment 1 dissipate heat, the heat dissipation fins 19 connected to both sides of the surface of the heat dissipation fins 4 are utilized to further expand the heat dissipation area and enhance the heat dissipation effect.

[0057] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A highly sealed and highly efficient heat dissipation solid capacitor, characterized in that: include: A housing (1), wherein a mounting groove (7) is provided inside the housing (1), and an inner side wall of the mounting groove (7) is provided with an internal threaded portion (6); A core package (8), the core package (8) being arranged inside the mounting groove (7), and the top two sides of the core package (8) being respectively connected to a positive electrode pin (10) and a negative electrode pin (11); A sealing rubber cover (16), the sealing rubber cover (16) is arranged on the top of the housing (1), and a connecting block (14) is arranged at the bottom of the sealing rubber cover (16); A sealing structure is provided between the sealing rubber cover (16) and the housing (1), and the positive electrode pin (10) and the negative electrode pin (11) are sealed inside the sealing rubber cover (16) by the cooperation of the silicone sealing gasket (12) and the slot (20) of the sealing structure.

2. The highly sealed and highly efficient heat dissipation solid capacitor according to claim 1, characterized in that: The sealing structure includes a pin terminal (9) connected to the top of the core package (8), the positive electrode pin (10) and the negative electrode pin (11) pass through the pin terminal (9), the silicone sealing pad (12) is connected to the surface of the pin terminal (9), the slot (20) is opened inside the sealing rubber cover (16), and the silicone sealing pad (12) extends to the inside of the slot (20).

3. The highly sealed and highly efficient heat dissipation solid capacitor according to claim 2, characterized in that: A through groove (13) for penetrating the positive electrode pin (10) and the negative electrode pin (11) is provided on the surface of the silicone sealing pad (12).

4. The highly sealed and highly efficient heat dissipation solid capacitor according to claim 1, characterized in that: A through hole (17) for penetrating the positive electrode pin (10) and the negative electrode pin (11) is provided on the surface of the sealant cover (16).

5. The highly sealed and highly efficient heat dissipation solid capacitor according to claim 1, characterized in that: The surface of the connecting block (14) is connected with an external threaded portion (15), and the external threaded portion (15) is matched and screwed with the internal threaded portion (6).

6. A heat dissipation structure, characterized in that: The heat dissipation structure includes a highly sealed and highly efficient heat dissipation solid capacitor as described in any one of claims 1 to 5.

7. The heat dissipation structure according to claim 6, characterized in that: It also includes a side heat dissipation silicone cover (21) connected to the inner side of the shell (1), a bottom heat dissipation silicone cover (22) connected to the bottom of the shell (1), and strip-shaped heat dissipation grooves (23) are provided at equal intervals inside the bottom heat dissipation silicone cover (22).

8. The heat dissipation structure according to claim 7, characterized in that: The surface of the shell (1) is connected to a heat-conducting edge seat (3), and the side of the surface of the heat-conducting edge seat (3) is connected to a clamping ring (2), and the clamping ring (2) is in contact with the surface of the shell (1). The surface of the heat-conducting edge seat (3) is provided with a heat dissipation structure, and the heat dissipation structure includes heat dissipation fins (4), and the heat dissipation fins (4) are connected to the surface of the heat-conducting edge seat (3) at equal intervals. The surface of the clamping ring (2) is connected to a bolt (5).

9. The heat dissipation structure according to claim 8, characterized in that: The heat dissipation structure further comprises heat dissipation fins (19) connected to both sides of the surface of the heat dissipation fins (4).

10. The heat dissipation structure according to claim 8, characterized in that: A threaded groove (18) for a bolt (5) to pass through is provided on the surface of the clamping ring (2), and the bolt (5) extends to the interior of the housing (1).

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