Substrate cleaning device and method

Abstract

The invention discloses a substrate cleaning device and method, and relates to the technical field of semiconductor equipment, the substrate cleaning device comprises a cleaning unit, the cleaning unit comprises a rotary carrier and a cleaning nozzle, the rotary carrier is used for bearing a substrate and driving the substrate to rotate, the cleaning nozzle is used for spraying a cleaning solution to the substrate, and the cleaning solution is used for cleaning the substrate; cleaning the substrate; the liquid taking unit is configured to obtain the cleaning liquid on the substrate in real time in the cleaning process of the substrate; the detection unit is used for receiving the cleaning liquid obtained by the liquid taking unit and detecting the cleanliness of the cleaning liquid; and the control unit is in communication connection with the detection unit, and the control unit is used for controlling cleaning parameters according to the cleanliness of the cleaning liquid. According to the invention, the pollution degree of the current substrate can be more accurately detected, the substrates with different pollution degrees can be intelligently cleaned, and the waste of cleaning liquid can be reduced while the cleaning quality of the substrates is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment, and in particular to a substrate cleaning device and method. Background Art

[0002] Semiconductor cleaning is an important process throughout the entire wafer manufacturing process. Current semiconductor cleaning equipment is divided into two types: tank cleaning equipment and single-wafer cleaning equipment. Tank cleaning equipment is used for batch wafer wet cleaning with high production efficiency, while single-wafer cleaning equipment is used for single wafer wet cleaning with high cleaning quality.

[0003] The cleaning control of the existing single-wafer cleaning device is a single control. The same cleaning parameters are used for cleaning substrates with different degrees of contamination. The cleaning liquid consumed by substrates with relatively more contaminants and substrates with relatively less contaminants is the same. Cleaning parameters are usually set based on substrates with relatively more contaminants. Therefore, there will be problems of over-cleaning and waste of cleaning liquid for substrates with relatively less contaminants. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to overcome the above-mentioned defects and provide a substrate cleaning device and method.

[0005] The present invention solves the above technical problems through the following technical solutions:

[0006] A substrate cleaning device, comprising:

[0007] a cleaning unit, the cleaning unit comprising a rotating carrier and a cleaning nozzle, the rotating carrier being used to carry the substrate and drive the substrate to rotate, the cleaning nozzle being used to spray a cleaning liquid onto the substrate to clean the substrate;

[0008] The liquid collecting unit is configured to: collect the cleaning liquid on the substrate in real time during the substrate cleaning process;

[0009] a detection unit, configured to receive the cleaning liquid obtained by the liquid collection unit and detect the cleanliness of the cleaning liquid;

[0010] A control unit is communicatively connected to the detection unit, and the control unit is used to control cleaning parameters according to the cleanliness of the cleaning fluid.

[0011] In this solution, by adding a liquid collection unit to obtain the cleaning liquid on the substrate in real time, the cleanliness of the cleaning liquid obtained by the liquid collection unit can accurately reflect the current contamination level of the substrate. The detection unit can detect the cleanliness of the cleaning liquid obtained by the liquid collection unit, and the control unit controls the cleaning parameters according to the cleanliness detected by the detection unit. The substrate cleaning device provided by this embodiment can more accurately detect the current contamination level of the substrate, so that intelligent cleaning can be performed based on the current contamination level of the substrate. For example, if the contamination level of the substrate is high, the cleaning parameters can be increased; if the contamination level of the substrate is low, the cleaning parameters can be reduced. This ensures the quality of substrate cleaning while reducing the waste of cleaning liquid.

[0012] A substrate cleaning method comprising:

[0013] controlling the substrate to rotate and spraying a cleaning liquid onto the substrate for cleaning;

[0014] Obtain the cleaning liquid on the current substrate in real time;

[0015] detecting the cleanliness of the cleaning fluid;

[0016] The cleaning parameters of the current substrate are controlled according to the cleanliness of the cleaning liquid.

[0017] In this solution, by obtaining the cleaning liquid on the current substrate in real time, the cleanliness of the cleaning liquid can reflect the contamination level of the substrate, and then the contamination level of the current substrate can be detected in real time, so that intelligent cleaning can be performed according to the contamination level of the current substrate, while ensuring the cleaning quality of the substrate, it can also reduce the waste of cleaning liquid. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 Schematic diagram of a substrate cleaning device according to embodiment 1 of the present invention;

[0019] Figure 2 Schematic diagram of a substrate cleaning device according to embodiment 2 of the present invention;

[0020] Figure 3 Schematic diagram of a substrate cleaning device according to embodiment 3 of the present invention;

[0021] Figure 4 is a schematic diagram of a substrate cleaning device according to embodiment 4 of the present invention; and

[0022] Figure 5 This is a flow chart of the substrate cleaning method according to Example 5 of the present invention. DETAILED DESCRIPTION

[0023] The present invention is further described below by way of examples, but the present invention is not limited to the scope of the examples.

[0024] Example 1

[0025] like Figure 1 As shown, this embodiment provides a substrate cleaning device, including a cleaning chamber 100, a cleaning unit, a liquid collection unit 140, a detection unit 200 and a control unit 300. The cleaning unit and the liquid collection unit 140 are both arranged in the cleaning chamber 100. The cleaning unit includes a rotating carrier 110 and a cleaning nozzle 130, wherein the rotating carrier 110 is used to carry the substrate W and drive the substrate W to rotate, and the cleaning nozzle 130 is used to spray cleaning liquid onto the substrate W to clean the substrate W. The liquid collection unit 140 is configured to: obtain the cleaning liquid on the substrate W in real time during the cleaning process of the substrate W. The detection unit 200 is used to receive the cleaning liquid obtained by the liquid collection unit 140 and detect the cleanliness of the cleaning liquid. The control unit 300 is communicatively connected to the detection unit 200, and the control unit 300 is used to control the cleaning parameters according to the cleanliness of the cleaning liquid. Among them, the cleaning parameters include any one or more of the cleaning time, cleaning pressure, cleaning flow rate and the rotation speed of the rotating carrier 110.

[0026] The substrate cleaning device provided in this embodiment is a single-wafer cleaning device. A drain pipe 150 is provided at the bottom of the cleaning chamber 100, and the cleaning liquid after cleaning the substrate W is discharged through the drain pipe 150. The cleaning liquid discharged by the drain pipe 150 has a hysteresis, and may contain residual cleaning liquid from the previous substrate W. If the liquid is directly taken from the drain pipe 150 for cleanliness analysis, it cannot accurately reflect the contamination level of the current substrate W. In this embodiment, by adding a liquid collection unit 140, the cleaning liquid on the substrate W is obtained in real time. The cleanliness of the cleaning liquid obtained by the liquid collection unit 140 can more accurately reflect the contamination level of the current substrate W. The cleanliness of the cleaning liquid obtained by the liquid collection unit 140 can be detected by the detection unit 200, and the control unit 300 controls the cleaning parameters according to the cleanliness detected by the detection unit 200. The substrate cleaning device provided in this embodiment can more accurately detect the contamination level of the current substrate, so that it can perform intelligent cleaning according to the contamination level of the current substrate W. For example, if the contamination level of the substrate W is high, the cleaning parameters can be increased (for example, the cleaning flow, cleaning pressure, and cleaning time can be increased); if the contamination level of the substrate W is low, the cleaning parameters can be reduced (for example, the cleaning flow, cleaning pressure, and cleaning time can be reduced), thereby ensuring the cleaning quality of the substrate W while reducing the waste of cleaning liquid.

[0027] Specifically, in this embodiment, the liquid collection unit 140 is a liquid collection device, such as a vacuum nozzle device, which draws liquid by generating negative pressure and is disposed above the edge region of the substrate W. This device can draw the cleaning liquid from the surface of the substrate W in a non-contact manner, thereby minimizing damage to the substrate W. In some embodiments, the liquid collection device can also use a suction head connected to a pump via a pipeline to collect liquid.

[0028] The detection unit 200 is a particle counter. This is an existing device. The particle counter's liquid inlet is connected to the liquid collection unit 140 , its liquid outlet is connected to the liquid discharge line 150 , and its signal output is connected to the control unit 300 . The particle counter converts particle counts into electrical signals and transmits them to the control unit 300 . The particle counter can be used to determine the particle count in the cleaning fluid, which in turn reflects the cleanliness of the cleaning fluid.

[0029] In some embodiments, the detection unit 200 may also adopt other devices capable of detecting the cleanliness of the cleaning fluid, such as a reflective sensor, an electrical property monitoring device, etc.

[0030] In this embodiment, the control unit 300 is controlled by a processor, such as a PLC controller, a single chip microcomputer controller, etc.

[0031] In this embodiment, the substrate cleaning device also includes a liquid supply pipeline 400, a regulating valve 410 and a pump 500. One end of the liquid supply pipeline 400 is connected to the cleaning nozzle 130, and the other end of the liquid supply pipeline 400 is connected to the pump 500. A regulating valve 410 is provided on the liquid supply pipeline 400. The control unit 300 is communicated with the pump 500 and the regulating valve 410. The control unit 300 controls the cleaning parameters by controlling the output power of the pump 500 and the opening of the regulating valve 410.

[0032] In this embodiment, the substrate cleaning apparatus further includes a pressure sensor 420 and a flow sensor 430, each disposed on the liquid supply line 400. The pressure sensor 420 is communicatively connected to the control unit 300 and is used to detect the cleaning pressure of the cleaning liquid in the liquid supply line 400. The flow sensor 430 is communicatively connected to the control unit 300 and is used to detect the cleaning flow rate of the cleaning liquid in the liquid supply line 400.

[0033] In some embodiments, only the pressure sensor 420 or the flow sensor 430 may be provided as needed.

[0034] In this embodiment, the substrate cleaning apparatus further includes a cleaning brush (not shown) for scrubbing the surface of the substrate. The control unit 300 is also in communication with the rotating carrier 110 to control the rotation speed of the rotating carrier 110. When a high degree of contamination of the substrate W is detected, the cleaning capability of the substrate W can be improved by increasing the rotation speed of the rotating carrier 110.

[0035] The communication connection in this embodiment can be in a wired or wireless manner.

[0036] Example 2

[0037] The substrate cleaning device in this embodiment is basically the same as that in embodiment 1, except that the structure of the liquid taking unit is different. Figure 2 As shown, the cleaning unit in this embodiment also includes a protective cover 120. The liquid collection unit includes a liquid collection chamber 160. The protective cover 120 is arranged on the periphery of the rotating carrier 110, and the liquid collection chamber 160 is arranged on the periphery of the protective cover 120. A liquid collection hole 161 is provided at the bottom of the liquid collection chamber 160, and an opening 121 connected to the liquid collection chamber 160 is provided on the protective cover 120. The opening 121 is configured as follows: when cleaning the substrate W, the opening 121 is used to allow the cleaning liquid thrown off the substrate W to enter the liquid collection chamber 160 through the opening 121. The detection unit 200 is connected to the liquid collection hole 161, and is used to receive the cleaning liquid in the liquid collection chamber 160 and detect the cleanliness of the cleaning liquid.

[0038] The rotating carrier 110 rotates the substrate W, and the cleaning nozzle 130 sprays cleaning liquid onto the substrate W, cleaning the substrate W. The cleaning liquid is then ejected in all directions by centrifugal force. A protective cover 120 is disposed on the periphery of the rotating carrier 110 to prevent corrosion of the cleaning liquid on components outside the protective cover 120. The protective cover 120 is provided with an opening 121 that communicates with the liquid extraction chamber 160. A large amount of cleaning liquid is discharged from the drain line 150 at the bottom of the cleaning chamber 100, and a small amount of cleaning liquid enters the liquid extraction chamber 160 through the opening 121. The amount of cleaning liquid entering the liquid collection chamber 160 is small, and the discharge speed is fast, so it is not easy to have residue. During the cleaning process of the substrate W, it can be quickly discharged from the liquid collection hole 161 into the detection unit 200. After the substrate is cleaned, the processing liquid in the liquid collection chamber 160 can be quickly emptied. When the next substrate W is cleaned, it is not easy for the cleaning liquid of the previous substrate W to remain in the liquid collection chamber 160, thereby improving the accuracy of the cleanliness detection of the next substrate W.

[0039] In some embodiments, a cleaning device (not shown), such as a cleaning nozzle, is further provided in the liquid extraction chamber 160 to clean the residual cleaning liquid in the liquid extraction chamber 160. Specifically, the liquid extraction chamber 160 can be cleaned during the replacement of the substrate W to remove the residual cleaning liquid in the cleaning chamber 160 to ensure the accuracy of the cleanliness test of the next substrate W.

[0040] In this embodiment, the liquid extraction cavity 160 completely surrounds the protection cover 120 .

[0041] In some embodiments, the liquid extraction chamber 160 may also partially surround the protective cover 120 , so that the volume of the liquid extraction chamber 160 is smaller and the amount of cleaning liquid entering the liquid extraction chamber 160 is correspondingly reduced, so that the cleaning liquid can be discharged from the liquid extraction chamber 160 faster.

[0042] Example 3

[0043] The solution of this embodiment is basically the same as that of embodiment 2, except that Figure 3 As shown, the bottom of the liquid collection chamber 160 has a drainage slope, so that the bottom of the liquid collection chamber 160 has a lowest part. The liquid collection hole 161 is set at the lowest part of the liquid collection chamber 160, which is conducive to accelerating the discharge of the cleaning liquid.

[0044] Specifically, the bottom of the liquid extraction chamber 160 includes a groove 162 , the opening diameter of the groove 162 decreases from top to bottom to form a drainage slope, the bottom of the groove 162 is the lowest part of the liquid extraction chamber 160 , and the liquid extraction hole 161 is arranged at the lowest point of the groove 162 .

[0045] Example 4

[0046] The solution of this embodiment is basically the same as that of embodiment 2, except that Figure 4 As shown, in this embodiment, no protective cover is provided, and the liquid collection chamber 160 is provided on the periphery of the rotating carrier 110 . The liquid collection chamber 160 is configured as follows: during the cleaning process of the substrate W, the liquid collection chamber 160 is used to allow the cleaning liquid thrown out from the substrate W to enter the liquid collection chamber 160 .

[0047] In this embodiment, the liquid extraction chamber 160 is provided with a liquid inlet hole 163 , and the cleaning liquid ejected from the substrate W enters the liquid extraction chamber 160 through the liquid inlet hole 163 .

[0048] In some embodiments, the top of the liquid collection chamber 160 is open and is lower than the substrate W on the rotating carrier 110 , and the cleaning liquid thrown off the substrate W enters the liquid collection chamber 160 through the top of the liquid collection chamber 160 .

[0049] Example 5

[0050] like Figure 5 As shown, this embodiment provides a substrate cleaning method, which includes:

[0051] S10, controlling the substrate to rotate and spraying a cleaning liquid on the substrate for cleaning.

[0052] S20, obtaining the cleaning liquid on the current substrate in real time.

[0053] S30, detecting the cleanliness of the cleaning fluid.

[0054] S40: Control the cleaning parameters of the current substrate according to the cleanliness of the cleaning liquid.

[0055] By obtaining the cleaning liquid on the current substrate in real time, the cleanliness of the cleaning liquid can reflect the contamination level of the substrate, and then the contamination level of the current substrate can be detected in real time, so that intelligent cleaning can be performed according to the contamination level of the current substrate, while ensuring the cleaning quality of the substrate and reducing the waste of cleaning liquid.

[0056] Although specific embodiments of the present invention have been described above, those skilled in the art will appreciate that these are merely illustrative and that the scope of the present invention is defined by the appended claims. Those skilled in the art may make various changes or modifications to these embodiments without departing from the principles and essence of the present invention, and such changes and modifications are intended to fall within the scope of the present invention.

Claims

1. A substrate cleaning device, characterized in that: include: a cleaning unit, the cleaning unit comprising a rotating carrier and a cleaning nozzle, the rotating carrier being used to carry the substrate and drive the substrate to rotate, the cleaning nozzle being used to spray a cleaning liquid onto the substrate to clean the substrate; The liquid collecting unit is configured to: collect the cleaning liquid on the substrate in real time during the substrate cleaning process; a detection unit, configured to receive the cleaning liquid obtained by the liquid collection unit and detect the cleanliness of the cleaning liquid; A control unit is communicatively connected to the detection unit, and the control unit is used to control cleaning parameters according to the cleanliness of the cleaning fluid.

2. The substrate cleaning device according to claim 1, wherein: The cleaning parameters include any one or more of cleaning time, cleaning pressure, cleaning flow rate, and the rotation speed of the rotating carrier.

3. The substrate cleaning device according to claim 2, wherein: It also includes a liquid supply pipeline, a regulating valve and a pump, one end of the liquid supply pipeline is connected to the cleaning nozzle, the other end of the liquid supply pipeline is connected to the pump, and the regulating valve is arranged on the liquid supply pipeline; The control unit is in communication with the pump and / or the regulating valve, and controls the cleaning parameters by controlling the output power of the pump and / or the opening of the regulating valve.

4. The substrate cleaning device according to claim 3, wherein: Also includes: a pressure sensor disposed on the liquid supply pipeline, the pressure sensor being in communication with the control unit, the pressure sensor being used to detect the cleaning pressure of the cleaning fluid in the liquid supply pipeline, and / or, A flow sensor is provided on the liquid supply pipeline. The flow sensor is communicatively connected to the control unit and is used to detect the cleaning flow of the cleaning liquid in the liquid supply pipeline.

5. The substrate cleaning device according to claim 2, wherein: The substrate cleaning device further comprises a cleaning brush, and the cleaning brush is used to scrub the surface of the substrate.

6. The substrate cleaning device according to claim 1, wherein: The detection unit is a particle counter.

7. The substrate cleaning device according to claim 1, wherein: The liquid collecting unit is a liquid collecting device, and the liquid collecting device is arranged close to the upper surface of the substrate.

8. The substrate cleaning device according to claim 1, wherein: The liquid collection unit includes a liquid collection chamber, which is arranged on the outer periphery of the rotating carrier. The bottom of the liquid collection chamber is provided with a liquid collection hole. The liquid collection chamber is configured to: during the substrate cleaning process, the liquid collection chamber is used to allow the cleaning liquid thrown off the substrate to enter the liquid collection chamber; The detection unit is connected to the liquid collection hole.

9. The substrate cleaning device according to claim 8, wherein: It also includes a cleaner, which is arranged in the liquid collection cavity and is used to clean the cleaning liquid remaining in the liquid collection cavity.

10. The substrate cleaning device according to claim 8, wherein: The bottom of the liquid collection cavity is provided with a drainage slope so that the bottom of the liquid collection cavity has a lowest part, and the liquid collection hole is provided at the lowest part.

11. The substrate cleaning device according to claim 10, wherein: The bottom of the liquid extraction cavity comprises a groove, the opening diameter of the groove decreases from top to bottom to form the drainage slope, and the bottom of the groove is the lowest part.

12. The substrate cleaning device according to claim 8, wherein: The cleaning unit also includes a protective cover, which is arranged on the outer periphery of the rotating carrier. The liquid collection chamber is arranged on the outer periphery of the protective cover. The protective cover is provided with an opening connected to the liquid collection chamber. The opening is configured as follows: during the substrate cleaning process, the opening is used to allow the cleaning liquid thrown off the substrate to enter the liquid collection chamber through the opening.

13. A substrate cleaning method, characterized in that: It includes: controlling the substrate to rotate and spraying a cleaning liquid onto the substrate for cleaning; Obtain the cleaning liquid on the current substrate in real time; detecting the cleanliness of the cleaning fluid; The cleaning parameters of the current substrate are controlled according to the cleanliness of the cleaning liquid.

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