Electronic device

Abstract

The invention provides an electronic device. The electronic device comprises a flexible encapsulation body, a first electronic component and a first conductive connecting piece. The flexible encapsulation body has a first predetermined pattern. The first electronic component includes terminals exposed by the first predetermined pattern. The first conductive connector is disposed within the first predetermined pattern and electrically connected to the terminal of the first electronic component.

Description

Technical Field

[0001] The present disclosure relates generally to an electronic device, and more particularly, to an electronic device including a predetermined pattern configured to accommodate conductive traces. Background Art

[0002] Flexible packaging materials are becoming increasingly popular and are applicable to wearable electronic devices. Stretchable system-in-package (SiP) has recently been used in electronic devices. However, these electronic devices encounter the following challenges. First, polyimide (PI) is currently used as a substrate, which is flexible but not stretchable. Furthermore, these products involve combining a flexible substrate with a flexible film, which involves joining dissimilar materials and carries the risk of delamination due to differences in coefficient of thermal expansion (CTE). Therefore, new electronic devices are needed. Summary of the Invention

[0003] In some arrangements, an electronic device includes a flexible encapsulated body, a first electronic component, and a first conductive connector. The flexible encapsulated body has a first predetermined pattern. The first electronic component includes terminals exposed by the first predetermined pattern. The first conductive connector is disposed within the first predetermined pattern and electrically connected to the terminals of the first electronic component.

[0004] In some arrangements, an electronic device includes a flexible encapsulated body, a first conductive connector, and a second conductive connector. The flexible encapsulated body has an upper surface and a lower surface. The first conductive connector is recessed from the lower surface. The second conductive connector is recessed from the upper surface and electrically connected to the first conductive connector.

[0005] In some arrangements, a method of manufacturing an electronic device includes providing a first electronic component and an encapsulation body encapsulating the first electronic component; forming a first predetermined pattern defined by the encapsulation body; and forming a first conductive connection within the first predetermined pattern of the encapsulation body to electrically connect to the first electronic component. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Aspects of some arrangements of the present disclosure are best understood from the following detailed description when read in conjunction with the accompanying drawings.It should be noted that the various structures may not be drawn to scale and that the dimensions of the various structures may be arbitrarily increased or reduced for clarity of discussion.

[0007] Figure 1 is a cross-sectional view of an electronic device arranged according to the present disclosure.

[0008] Figure 2 is a cross-sectional view of an electronic assembly arranged according to the present disclosure.

[0009] Figure 3A is a cross-sectional view of an electronic device arranged according to the present disclosure.

[0010] Figure 3B is a cross-sectional view of an electronic device arranged according to the present disclosure.

[0011] Figure 4A For the arrangement according to the present disclosure Figure 3A A partially enlarged view of the electronic device shown in FIG.

[0012] Figure 4B For the arrangement according to the present disclosure Figure 3A A partially enlarged view of the electronic device shown in FIG.

[0013] Figure 4C For the arrangement according to the present disclosure Figure 3A A partially enlarged view of the electronic device shown in FIG.

[0014] Figure 5A For the arrangement according to the present disclosure Figure 3A A partially enlarged view of the electronic device shown in FIG.

[0015] Figure 5B For the arrangement according to the present disclosure Figure 3A A partially enlarged view of the electronic device shown in FIG.

[0016] Figure 6A is a bottom view of a layout of an electronic device arranged according to the present disclosure.

[0017] Figure 6B For the arrangement according to the present disclosure Figure 6A A partially enlarged view of the electronic device shown in FIG.

[0018] Figure 7A is a cross-sectional view of an electronic assembly arranged according to the present disclosure.

[0019] Figure 7B For the arrangement according to the present disclosure Figure 7A A partially enlarged view of the electronic device shown in FIG.

[0020] Figure 8 is a cross-sectional view of an electronic device arranged according to the present disclosure.

[0021] Figure 9 is a cross-sectional view of an electronic device arranged according to the present disclosure.

[0022] Figure 10 is a cross-sectional view of an electronic device arranged according to the present disclosure.

[0023] Figure 11 is a cross-sectional view of an electronic device arranged according to the present disclosure.

[0024] Figure 12A 、 Figure 12B 、 Figure 12C and Figure 12D One or more stages of an example of a method for manufacturing an electronic device according to some arrangements of the present disclosure are shown.

[0025] Figure 13A 、 Figure 13B and Figure 13C One or more stages of an example of a method for manufacturing an electronic device according to some arrangements of the present disclosure are shown.

[0026] Figure 14A For the arrangement according to the present disclosure Figure 13A A partial magnified view of the stage shown in .

[0027] Figure 14B For the arrangement according to the present disclosure Figure 13A A partial magnified view of the stage shown in .

[0028] Figure 14C For the arrangement according to the present disclosure Figure 13A A partial magnified view of the stage shown in .

[0029] Figure 15A 、 Figure 15B 、 Figure 15C 、 Figure 15D and Figure 15E One or more stages of an example of a method for manufacturing an electronic device according to some arrangements of the present disclosure are shown.

[0030] Figure 16A 、 Figure 16B and Figure 16C One or more stages of an example of a method for manufacturing an electronic device according to some arrangements of the present disclosure are shown.

[0031] Figure 17A 、 Figure 17B 、 Figure 17C 、 Figure 17D 、 Figure 17E 、 Figure 17F and Figure 17G One or more stages of an example of a method for manufacturing an electronic device according to some arrangements of the present disclosure are shown.

[0032] Figure 18A 、 Figure 18B and Figure 18C One or more stages of an example of a method for manufacturing an electronic device according to some arrangements of the present disclosure are shown.

[0033] Figure 19 is a cross-sectional view of an electronic device arranged according to the present disclosure.

[0034] Figure 20is a cross-sectional view of an electronic device arranged according to the present disclosure.

[0035] Figure 21 is a cross-sectional view of an electronic device arranged according to the present disclosure.

[0036] Figure 22 is a cross-sectional view of an electronic device arranged according to the present disclosure.

[0037] Figure 23 is a cross-sectional view of an electronic device arranged according to the present disclosure.

[0038] Figure 24 is a cross-sectional view of an electronic device arranged according to the present disclosure. DETAILED DESCRIPTION

[0039] Common reference numerals are used throughout the drawings and detailed description to refer to the same or similar components.The arrangement of the present disclosure will be readily understood from the following detailed description taken in conjunction with the accompanying drawings.

[0040] The following disclosure provides many different arrangements or examples for implementing the different features of the provided themes. Specific examples of components and arrangements are described below to explain certain aspects of the present disclosure. Of course, these components and arrangements are merely examples and are not intended to be restrictive. For example, in the following description, the formation of a first feature above or on a second feature may include an arrangement in which the first feature and the second feature are directly contacted and formed or arranged, and may also include an arrangement in which an additional feature may be formed or arranged between the first feature and the second feature so that the first feature and the second feature may not be directly contacted. In addition, the present disclosure may repeat reference numerals and / or letters in various examples. This repetition is for the purpose of simplicity and clarity, and does not itself specify the relationship between the various arrangements and / or configurations discussed.

[0041] Figure 1is a cross-sectional view of an electronic device 1a arranged according to the present disclosure. In some arrangements, the electronic device 1a may be applicable to, for example, wireless devices, such as user equipment (UE), mobile stations, mobile devices, devices communicating with the Internet of Things (IoT), etc. In some arrangements, the electronic device 1a may be or include a portable device. In some arrangements, the electronic device 1a may support fifth-generation (5G) communications, such as sub-6 GHz frequency bands and / or millimeter (mm) wave frequency bands. For example, the electronic device 1a may include both sub-6 GHz devices and mm wave devices. In some arrangements, the electronic device 1a may support super-5G or 6G communications, such as terahertz (THz) frequencies. The electronic device 1a may be configured to radiate and / or receive electromagnetic signals, such as radio frequency (RF) signals. For example, the electronic device 1a can be configured to operate at a frequency between about 10 GHz and about 10 THz, such as 10 GHz, 20 GHz, 30 GHz, 40 GHz, 50 GHz, 100 GHz, 300 GHz, 1 THz, 5 THz, or 10 THz. In some arrangements, the electronic device 1a can include a flexible encapsulant 10, an electronic package 20a, an electronic component 30a, an energy storage component 40, and a conductive connector 50.

[0042] The flexible encapsulation 10 (or a bendable, pliable, adjustable, and / or stretchable encapsulation) may include an insulating or dielectric material. In some arrangements, the flexible encapsulation 10 may be bendable, pliable, adjustable, and / or stretchable. The flexible encapsulation 10 may include silicone rubber, a thermoplastic material (e.g., thermoplastic polyurethane), or a combination thereof. polyurethane, TPU)), polyether, polyester, copolymer of polyether polyurethane, polyester polyurethane, polysulfone, polybutadiene-styrene, elastomer, hydrogel formed by copolymer of polyethylene glycol and polylactic acid, copolymer of polyglycolide or polylactide-co-glycolide polyacrylate rubber, ethylene-acrylate rubber, polyester polyurethane, bromoisobutylene isoprene, polybutadiene, chloroisobutylene isoprene, polychloroprene, chlorosulfonated polyethylene, epichlorohydrin, ethylene propylene, ethylene propylene diene monomer, polyether polyurethane, perfluorocarbon rubber, fluorinated hydrocarbons, fluorosilicone, fluorocarbon rubber, hydrogenated nitrile, polyisoprene, isobutylene isoprene butyl, acrylonitrile butadiene, polyurethane, styrene butadiene, styrene ethylene styrene-butylene styrene copolymers, polysiloxanes, vinyl methyl silicone, acrylonitrile-butadiene carboxyl monomer, styrene-butadiene carboxyl monomer, thermoplastic polyether esters, styrene-butadiene block copolymers, styrene-butadiene carboxyl block copolymers, synthetic polyisoprene, polybutadiene, chloroprene rubber, polychloroprene, chloroprene rubber, Baypren, butyl rubber, halogenated butyl rubber, styrene-butadiene rubber, nitrile rubber, hydrogenated nitrile rubber, ethylene propylene rubber, EPDM rubber, epichlorohydrin rubber, polyacrylic rubber, silicone rubber, fluorosilicone rubber, fluoroelastomers Viton, Tecnoflon, Fluorel, Aflas and Dai-el, perfluoroelastomer Tecnoflon PFR, Kalrez, Chemraz, Perlast, polyether block amides, chlorosulfonated polyethylene, Hypalon, ethylene vinyl acetate, and combinations thereof. In some arrangements, the flexible encapsulation body 10 can be formed by a molding technique such as compression molding, injection molding, or transfer molding. In some arrangements, the flexible encapsulation body 10 can be formed by a lamination technique, and the flexible encapsulation body 10 can include multiple laminated films. The flexible encapsulation body 10 can have a surface 10s1 (or bottom surface) and a surface 10s2 (or top surface) opposite the surface 10s1.

[0043] The electronic package 20a may be embedded in the flexible encapsulation body 10. The electronic package 20a may be adjacent to the surface 10s1 of the flexible encapsulation body 10. Figure 2, which shows electronic package 20a in detail. In some arrangements, electronic package 20a may include a system-in-package (SiP) device that integrates multiple dies and can perform and / or process multiple functions. Electronic package 20a may include a carrier 21, electronic components 22a, 22b, 22c, and 22d, a package body 23, and terminals 24.

[0044] The carrier 21 may comprise, for example, a printed circuit board (PCB), such as a paper-based copper foil laminate, a composite copper foil laminate, or a polymer-impregnated fiberglass-based copper foil laminate.

[0045] Electronic components 22a-22d may be disposed over carrier 21. Each of electronic components 22a-22d may include a semiconductor substrate, one or more integrated circuit (IC) devices, and one or more overlying interconnect structures therein. The IC devices may include active devices and / or passive devices. For example, active devices may include logic dies (e.g., application processors (APs), system-on-chips (SoCs), central processing units (CPUs), graphics processing units (GPUs), microcontroller units (MCUs), etc.), memory dies (e.g., dynamic random access memory (DRAM) dies, static random access memory (SRAM) dies, etc.), power management dies (e.g., power management integrated circuit (PMIC) dies), radio frequency (RF) dies, sensor dies, microelectromechanical systems (MEMS) dies, signal processing dies (e.g., digital signal processing (DSP) dies), front-end dies (e.g., analog front-end (AFE) dies), or other active devices (e.g., charger IC devices, Bluetooth devices, etc.). Passive devices may include resistors, capacitors, inductors, or combinations thereof. In some arrangements, the electronic components 22a-22d may have different dimensions (eg, height, surface area, etc.) and may be electrically connected to the carrier 21 via flip-chip technology, wire bonding technology, or other suitable technology.

[0046] A package 23 may be disposed above the carrier 21. The package 23 may encapsulate the electronic components 22a to 22d. In some arrangements, the package 23 may be made of a molding material, such as a novolac-type resin, an epoxy-type resin, a silicone-type resin, or another suitable encapsulant. The molding material may also include a suitable filler, such as powdered SiO2.

[0047] Terminals 24 may be disposed below carrier 21. Terminals 24 may include solder balls, such as controlled collapse chip connection (C4) bumps, ball grid arrays (BGAs), land grid arrays (LGAs), etc. In some arrangements, terminals 24 may include one or more solder materials, which may include an alloy of gold and solder, an alloy of silver and solder, or other suitable materials. Figure 1 In some arrangements, the terminals 24 may be exposed from the surface 10s1 of the flexible encapsulation body 10. The terminals 24 may be encapsulated by the flexible encapsulation body 10.

[0048] The electronic component 30a may be embedded within the flexible encapsulation 10. The electronic component 30a may abut a surface 10s1 of the flexible encapsulation 10. In some arrangements, the electronic component 30a may include active devices and / or passive devices. In some arrangements, the electronic component 30a may include an antenna. For example, the electronic component 30a may include, but is not limited to, a directional antenna, an omnidirectional antenna, an antenna array, a dipole antenna, and / or a patch antenna. The electronic component 30a may be configured to radiate and / or receive electromagnetic signals, such as radio frequency (RF) signals. For example, the electronic component 30a may include an antenna-in-package (AiP), an antenna-on-package (AoP), etc.

[0049] An energy storage component (or power storage component) 40 may be embedded within the flexible encapsulation 10. The energy storage component 40 may be configured to provide power to the electronic package 20a or other device. The energy storage component 40 may include a battery pack 42 and electrodes 44. The battery pack 42 may include battery cells (e.g., a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell), an external component (e.g., a laminate film in which a fusion layer, a metal layer, and a surface protection layer are stacked in this order), a switching unit (e.g., a charge control switch and a discharge control switch), a current detection resistor, a temperature detection element (e.g., a thermistor), and a control unit configured to control the switching unit. The energy storage component 40 may include flexible battery cells or other components.

[0050] The electrodes 44 may include a positive electrode and a negative electrode that are electrically connected to other devices. In some arrangements, the electrodes 44 may be exposed from the surface 10s1 of the flexible encapsulation body 10.

[0051] In some arrangements, a conductive connector 50 (or conductive trace) may be disposed on or below a surface 10s1 of the flexible encapsulation 10. The conductive connector 50 may be configured to electrically connect the electronic package 20a, the electronic component 30a, the energy storage component 40, and / or other devices. In some arrangements, the conductive connector 50 may include a conductive paste (e.g., silver paste, copper paste, gold paste, or other suitable paste), a conductive ink that may include gold, silver, copper, or other suitable material mixed with a resin or other polymer material, or other suitable conductive material. The conductive connector 50 may include a surface 50s1 (or bottom surface) and a surface 50s2 (or top surface) opposite the surface 50s1. In some arrangements, the surface 50s1 may be spaced apart from the flexible encapsulation 10.

[0052] In a comparative example, a flexible device includes a flexible carrier (e.g., polyimide having a coefficient of thermal expansion (CTE) of 20-60 ppm / °C) and an encapsulation body (e.g., silicone rubber having a CTE of 150-200 ppm / °C) formed over the flexible carrier. Conductive connectors are formed over the flexible carrier and encapsulated by the encapsulation body. Due to the CTE mismatch between the flexible carrier and the encapsulation body, delamination may occur. To address this issue, in the current arrangement, the flexible carrier is eliminated (or not used), and the conductive connectors are formed directly on a surface (bottom or top) of the encapsulation body. As a result, delamination issues can be prevented in the arrangement described in the present disclosure.

[0053] Figure 3A is a cross-sectional view of an electronic device 1b arranged according to the present disclosure. The electronic device 1b is similar to Figure 1 The electronic device 1a shown in FIG. 1 has the following differences.

[0054] In some arrangements, the flexible encapsulant 10 may define an encapsulant-defined pattern 10r1 (or a predetermined pattern configured to accommodate traces or circuitry) adjacent to the surface 10s1. The encapsulant-defined pattern 10r1 may be an opening of the flexible encapsulant 10 recessed from the surface 10s1, configured to accommodate the conductive connector 50. In some arrangements, the electrode 44 of the energy storage component 40 may be exposed by the encapsulant-defined pattern 10r1. In some arrangements, the terminal 24 of the electronic package 20a may be exposed by the encapsulant-defined pattern 10r1. In some arrangements, the terminal 24 of the electronic component 30a (not shown) may be exposed by the encapsulant-defined pattern 10r1. In some arrangements, the conductive connector 50 may be disposed within the encapsulant-defined pattern 10r1 to electrically connect the electronic package 20a, the electronic component 30a, the energy storage component 40, and / or other suitable devices. In some arrangements, an encapsulation body defining pattern 10r1 may be formed or defined first, followed by forming a conductive material therein to define the conductive connector 50. The pattern of the encapsulation body defining pattern 10r1 may be predetermined, and then filled with conductive material, allowing the conductive connector 50 to inherit the pattern of the encapsulation body defining pattern 10r1. In some arrangements, the surface 50s1 of the conductive connector 50 may be substantially aligned with or coplanar with the surface 10s1 of the flexible encapsulation body 10. In some arrangements, due to process tolerances, a slight height difference may occur between the surface 10s1 of the flexible encapsulation body 10 and the surface 50s1 of the conductive connector 50. Unlike the comparative example, the pattern of the conductive connector is defined first, and then the encapsulation body is formed to cover the conductive connector.

[0055] Figure 3B is a cross-sectional view of an electronic device 1b' according to an arrangement of the present disclosure. In some arrangements, the flexible encapsulation 10 can be stretched and / or bent to conformally rest on an object 92 defining a curved surface adjacent to the electronic device 1b'.

[0056] Figure 4A: is a partially enlarged view of an electronic device 1b according to an arrangement of the present disclosure. In some arrangements, the encapsulation body defining pattern 10r1 may have a demoulding pattern DP1. In some arrangements, a temporary carrier having a predetermined pattern is provided, and the flexible encapsulation body 10 is formed over the temporary carrier to inherit the pattern of the temporary carrier, the temporary carrier being described in detail later. Once the flexible encapsulation body 10 is formed, the temporary carrier is removed. To make the removal process easier, the predetermined pattern of the temporary carrier may be designed to have a demoulding structure, the contour of which will also be inherited by the encapsulation body defining pattern 10r1 of the flexible encapsulation body 10. In addition, the conductive connector 50 will be filled in the encapsulation body defining pattern 10r1 and may conform to the demoulding pattern DP1. In some arrangements, the demoulding pattern DP1 may include a draft angle or contour that facilitates separation of the flexible encapsulation body 10 from the temporary carrier.

[0057] In some arrangements, the demolding pattern DP1 may include a tapered profile. For example, the demolding pattern DP1 may be tapered toward the surface 10s2 of the flexible encapsulation body 10 (shown in FIG. Figure 3A The flexible encapsulation body 10 may have a surface 10s3 and a surface 10s4. Surface 10s3 may serve as the bottom (or top) of the encapsulation body-defining pattern 10r1. Surface 10s3 may be substantially parallel to surface 10s1 and located at a different level (or height) than surface 10s1. Surface 10s4 may extend between surfaces 10s1 and 10s3. In some arrangements, surfaces 10s3 and 10s4 may form an obtuse angle. In some arrangements, surface 10s4 may be inclined relative to surface 10s1. In some arrangements, surface 10s4 may be inclined relative to surface 10s3. In some arrangements, the conductive connector 50 may taper toward surface 10s2 (shown in FIG. 3 ) of the flexible encapsulation body 10. In some arrangements, the conductive connector 50 may include an inclined side surface (not labeled) extending between surfaces 50s1 and 50s2.

[0058] Figure 4B1 is a partially enlarged view of an electronic device 1b according to an arrangement of the present disclosure. In some arrangements, the release pattern DP1 may have a uniform portion (or a substantially uniform portion) having a uniform dimension (e.g., width or length) in a cross-sectional view, and a tapered portion above the uniform portion. The uniform portion may abut surface 10s1, and the tapered portion may be separated from surface 10s1 by the uniform portion. In some arrangements, the flexible encapsulation body 10 may have a surface 10s5. Surface 10s5 may extend between surface 10s1 and surface 10s4. In some arrangements, surface 10s5 may be substantially perpendicular to surface 10s1. In some arrangements, surface 10s4 may be inclined relative to surface 10s5. In some arrangements, surfaces 10s4 and 10s5 may form an obtuse angle. In some arrangements, the conductive connector 50 may have a uniform portion (or substantially uniform portion) 50 p 1 having a uniform size (eg, width or length) in a cross-sectional view and a tapered portion 50 p 2 above the uniform portion 50 p 1 .

[0059] Figure 4C is a partially enlarged view of an electronic device 1b according to an arrangement of the present disclosure. In some arrangements, the demolding pattern DP1 may include step profiles 10t1 and 10t2, each of which may be composed of a vertical surface extending between two horizontal surfaces. The step profile 10t1 may be adjacent to the surface 10s1. The step profile 10t2 may be separated from the surface 10s1 by the step profile 10t1. In some arrangements, the step profile 10t1 may define a lower portion having a larger dimension (e.g., width, length, or surface), and the step profile 10t2 may define an upper portion having a smaller dimension (e.g., width, length, or surface). In some arrangements, the conductive connector 50 may include a step profile. In some arrangements, the conductive connector 50 may include a lower portion 50p3 having a larger dimension (e.g., width, length, or surface) and an upper portion 50p4 having a smaller dimension (e.g., width, length, or surface).

[0060] Figure 5A FIG. 1 is a partially enlarged view of an electronic device 1 b according to another arrangement of the present disclosure.

[0061] In some arrangements, the electronic device 1b may further include an adhesive layer 32. The adhesive layer 32 may be configured to attach the conductive connector 50 to the flexible encapsulation body 10. The adhesive layer 32 may prevent delamination between the conductive connector 50 and the flexible encapsulation body 10. In some arrangements, the adhesive layer 32 may include octamethyltrisilazane, tetra(2-butoxyethyl)orthosilicate, tetra-n-butyl titanate, or other suitable materials.

[0062] Figure 5B For the arrangement according to the present disclosure Figure 3AIn some arrangements, the adhesive layer 32 may be further disposed on the surface 10s4 of the flexible encapsulation body 10.

[0063] Figure 6A is a bottom view of the layout of an electronic device 1 c arranged according to the present disclosure.

[0064] In some arrangements, the conductive connector 50 may include conductive elements 51a, 51b, 52, 53, 54, 55, 56, and 57 (or conductive connectors). Each of the conductive elements 51a-57 may be an electrode, a pad, or a trace. Each of the conductive elements 51a-57 may be within the encapsulation-defined pattern 10r1 of the flexible encapsulation 10. The conductive elements 51a and 51b may be connected to an external object (e.g., a biological or electronic device). For example, the conductive elements 51a and 51b may be configured to attach to the skin of an object to obtain biosignals. The biosignals may be processed by, for example, the electronic package 20a and transmitted to a user's mobile phone or a medical institution for monitoring and recording of physical conditions via the electronic component 30a. In this arrangement, the electronic device 1c may function as an electronic patch. When attached to an object, the electronic device 1c may be stretchable and bendable to accommodate the object's movement. As a result, the flexible encapsulation 10 is relatively bendable, pliable, adjustable, and / or stretchable.

[0065] The conductive elements 52 may be electrically connected to terminals of the electronic package 20a (eg, Figure 3A 24 shown in FIG. ). Conductive element 53 can be electrically connected to a terminal of electronic component 30a or electronic component 30b. Conductive element 54 can be configured to electrically connect conductive connector 50a (or conductive connector 50b) to electronic package 20a. Conductive element 55 can be configured to electrically connect electronic package 20a to electronic component 30a (or electronic component 30b). Conductive element 56 can be configured to electrically connect electronic component 30a to electronic component 30b. Conductive element 57 can be configured to electrically connect electronic package 20a to electrode 44 of energy storage component 40.

[0066] In some arrangements, the encapsulation body defining pattern 10r1 may include a circuit area 10p1 and a circuit area 10p2. The density of the circuit area 10p1 (e.g., the (average) area of ​​the conductive pattern recessed from the surface 10s1 of the flexible encapsulation body 10 per unit area) may be greater than the density of the circuit area 10p2. The conductive connectors 50 may be distributed in the circuit area 10p1 and the circuit area 10p2. For example, the conductive element 51b, the conductive element 52, and the conductive element 53 may be disposed in the circuit area 10p2. The conductive element 51a may be disposed in the circuit area 10p1. In some arrangements, the circuit density of the conductive connectors 50 within the circuit area 10p1 may be greater than the circuit density of the circuit area 10p2. In some arrangements, the depth of the encapsulation body defining pattern 10r1 (e.g., Figure 4A The distance between the surface 10s1 and the surface 10s3 shown in FIG. 10 may be non-uniform. For example, the depth of the circuit area 10p1 may be different from the depth of the circuit area 10p2. In some arrangements, the thickness of the conductive connector 50 (e.g., Figure 4A The distance between the surface 10s1 and the surface 10s3 shown in FIG. 5 may be non-uniform. For example, in some arrangements, the conductive elements 51a to 57 may have different thicknesses.

[0067] Figure 6B A bottom view of conductive element 56 is shown. Conductive element 56 may have surface 56s1 (or bottom surface) exposed by surface 10s1 and surface 56s2 (or top surface) opposite surface 56s1. Conductive element 56 may have surfaces 56s3, 56s4, 56s5, and 56s6 (or side surfaces), each of which extends between surfaces 56s1 and 56s2. In some arrangements, each of surfaces 56s3, 56s4, 56s5, and 56s6 is inclined relative to surface 56s1. Conductive element 56 may taper in a direction from surface 56s1 toward surface 56s2. Thus, conductive element 56 may have a larger dimension (e.g., length or width) adjacent to surface 56s1 and a smaller dimension (e.g., length or width) adjacent to surface 56s2 along a first direction (e.g., a direction extending between surfaces 56s3 and 56s5) and a second direction (e.g., a direction extending between surfaces 56s2 and 56s6).

[0068] Figure 7A is a cross-sectional view of an electronic device 1d according to the arrangement of the present disclosure. The electronic device 1d is similar to Figure 1 , with the following differences: In some arrangements, the electronic device 1d may further include a conductive connection 61 and a conductive pillar 71.

[0069] In some arrangements, the conductive connector 61 may abut the surface 10s2 of the flexible encapsulation body 10. In some arrangements, the conductive connector 61 may be embedded within the flexible encapsulation body 10. In some arrangements, the conductive connector 61 may include a conductive paste (e.g., silver paste, copper paste, gold paste, or other suitable paste), a conductive ink that may include gold, silver, copper, or other suitable material mixed with a resin or other polymer material, or other suitable conductive material. The conductive connector 61 may include a surface 61s1 (or bottom surface) and a surface 61s2 (or top surface) opposite the surface 61s1. In some arrangements, the surface 61s2 of the conductive connector 61 may be substantially aligned or coplanar with the surface 10s2 of the flexible encapsulation body 10. In some arrangements, a slight height difference may occur between the surface 10s2 of the flexible encapsulation body 10 and the surface 61s1 of the conductive connector 61 due to errors during processing.

[0070] In some arrangements, a conductive post 71 may extend between the conductive connector 50 and the conductive connector 61. In some arrangements, the conductive post 71 may be embedded within the flexible encapsulation 10. The conductive post 71 may be electrically connected to the conductive connector 50. The conductive post 71 may be electrically connected to the conductive connector 61. The conductive post 71 may include or be replaced by a conductive via, a conductive element, or a conductive pin. The conductive post 71 may include or be made of copper (Cu), tin (Sn), silver (Ag), titanium (Ti), nickel (Ni), or a combination of two or more thereof.

[0071] In some arrangements, the flexible encapsulation body 10 may include an encapsulation body-defining pattern 10r2. In some arrangements, the encapsulation body-defining pattern 10r2 may abut the surface 10s2. The encapsulation body-defining pattern 10r2 may be an opening of the flexible encapsulation body 10 recessed from the surface 10s2, the opening being configured to accommodate the conductive connector 61. In some arrangements, the encapsulation body-defining pattern 10r2 may be formed first, and then a conductive material may be formed therein to define the conductive connector 61. The pattern of the encapsulation body-defining pattern 10r2 may be predetermined, and then the conductive material may be filled therein, allowing the conductive connector 61 to inherit the pattern of the encapsulation body-defining pattern 10r2. Unlike the comparative example, the pattern of the conductive connector is initially defined, and then the encapsulation body is formed to cover the conductive connector.

[0072] Figure 7B For the arrangement according to the present disclosure Figure 7A FIG. 1 is a partially enlarged view of the electronic device 1 d shown in FIG.

[0073] In some arrangements, the encapsulation body-defining pattern 10r2 may have a release pattern DP2. In some arrangements, a mold cavity having a predetermined pattern is provided, and the flexible encapsulation body 10 may inherit the pattern of the mold cavity. Once the flexible encapsulation body 10 is formed, the mold cavity is removed. To facilitate the removal process, the predetermined pattern of the mold cavity may be designed with a release structure, which will also be inherited by the encapsulation body-defining pattern 10r2 of the flexible encapsulation body 10. In addition, the conductive connector 61 will be filled within the encapsulation body-defining pattern 10r2 and may conform to the release pattern DP2. In some arrangements, the release pattern may include a draft angle or contour to facilitate separation of the flexible encapsulation body 10 from the temporary carrier.

[0074] In some arrangements, the demolding pattern DP2 may include a tapered profile. For example, the demolding pattern DP2 may be tapered toward the surface 10s1 of the flexible encapsulation body 10 (shown in FIG. Figure 7A The flexible encapsulation body 10 may have a surface 10s6 and a surface 10s7. The surface 10s6 may serve as the bottom (or top) of the encapsulation body defining pattern 10r2. The surface 10s6 may be substantially parallel to the surface 10s2 and at a different level (or height) than the level of the surface 10s2. The surface 10s7 may extend between the surface 10s2 and the surface 10s6. In some arrangements, the surface 10s6 and the surface 10s7 may be at an obtuse angle. In some arrangements, the surface 10s7 may be inclined relative to the surface 10s2. In some arrangements, the surface 10s7 may be inclined relative to the surface 10s6. In some arrangements, the conductive connector 61 may be directed toward the surface 10s1 (shown in FIG. 10 ) of the flexible encapsulation body 10. Figure 7A gradually tapers.

[0075] Although not shown, the demolding pattern DP2 may have other profiles, such as Figure 4B or Figure 4C . In some arrangements, the release pattern DP2 may have a non-uniform portion adjacent to the surface 10s2 and a uniform portion spaced apart from the surface 10s2. In some arrangements, the release pattern DP2 may have a stepped profile having different sizes. The conductive connector 50 may conform to the release pattern DP2 of the encapsulation body-defining pattern 10r2. In addition, an adhesive layer having a material similar to or the same as the adhesive layer 32 may be disposed between the conductive connector 61 and the flexible encapsulation body 10.

[0076] Figure 8 is a cross-sectional view of an electronic device 1e according to the arrangement of the present disclosure. The electronic device 1e is similar to Figure 1 The electronic device 1a shown in FIG. 1 has the following differences.

[0077] In some arrangements, the flexible encapsulation 10 may include an insulating layer 11 and an insulating layer 12. Each of the insulating layer 11 and the insulating layer 12 may be bendable and / or stretchable. In some arrangements, the material of the insulating layer 11 and the insulating layer 12 may be the same or similar to the material of the flexible encapsulation 10. The bottom surface of the insulating layer 11 may serve as the surface 10s1 of the flexible encapsulation 10. The top surface of the insulating layer 12 may serve as the surface 10s2 of the flexible encapsulation 10. In some arrangements, there may be an unclear boundary between the insulating layer 11 and the insulating layer 12. In some arrangements, there is no boundary between the insulating layer 11 and the insulating layer 12. The electronic package 20a, the electronic component 30a, and the energy storage component 40 may be disposed within the insulating layer 11. The conductive connector 61 may be disposed within the insulating layer 11 and adjacent to the insulating layer 12. The conductive pillar 71 may be disposed within the insulating layer 11. The insulating layer 12 may be disposed above the top surface of the insulating layer 11.

[0078] The electronic device 1e may further include an electronic package 20b, a conductive connector 62, and a conductive post 72. The electronic package 20b may be embedded within the insulating layer 12. The electronic package 20b may abut the surface 10s2 of the flexible encapsulation 10. In some arrangements, the electronic package 20b may include a system-in-package (SiP) device that integrates multiple dies and can perform and / or process multiple functions. The electronic package 20b may include a carrier 25, an electronic component 26, a package body 27, and terminals 28.

[0079] The carrier 25 may comprise, for example, a printed circuit board, such as a paper-based copper foil laminate, a composite copper foil laminate, or a polymer-impregnated fiberglass-based copper foil laminate.

[0080] Electronic component 26 may be disposed above carrier 25. Electronic component 26 may include a semiconductor substrate, one or more IC devices, and one or more overlying interconnect structures therein. The IC devices may include active devices and / or passive devices. Electronic component 26 may include a logic die (e.g., an AP die, a SoC die, a CPU die, a GPU die, an MCU die, etc.), a memory die (e.g., a DRAM die, an SRAM die, etc.), a power management die (e.g., a PMIC die), an RF die, a sensor die, a MEMS die, a signal processing die (e.g., a DSP die), a front-end die (e.g., an AFE die), or other active devices (e.g., a charger IC device, a Bluetooth device, etc.). Passive devices may include resistors, capacitors, inductors, or combinations thereof. In some arrangements, electronic component 26 may be electrically connected to carrier 25 using flip-chip technology, wire bonding technology, or other suitable technology.

[0081] Encapsulation 27 may be disposed over carrier 25. Encapsulation 27 may encapsulate electronic component 26. Encapsulation 27 may be embedded within insulating layer 12. In some arrangements, encapsulation 27 may be made of a molding material, such as a novolac-type resin, an epoxy-type resin, a silicone-type resin, or another suitable encapsulant. Suitable fillers, such as powdered SiO2, may also be included.

[0082] Terminals 28 may be disposed under carrier 25. Terminals 28 may include solder balls, such as controlled collapse chip connection bumps, ball grid arrays, land grid arrays, etc. In some arrangements, terminals 28 may include one or more solder materials, which may include an alloy of gold and solder or an alloy of silver and solder, or other suitable materials.

[0083] The conductive connector 62 may be disposed on or over the surface 10s2 of the flexible encapsulation 10. The conductive connector 62 may be disposed over the insulating layer 12. In some arrangements, the conductive connector 62 may include a conductive paste (e.g., a silver paste, a copper paste, a gold paste, or other suitable paste), a conductive ink that may include gold, silver, copper, or other suitable materials mixed with a resin or other polymer material, or other suitable conductive materials.

[0084] In some arrangements, a conductive post 72 may be disposed within the insulating layer 12. In some arrangements, the conductive post 72 may extend between the conductive connector 61 and the conductive connector 62. The conductive post 72 may be electrically connected to the conductive connector 61. The conductive post 72 may be electrically connected to the conductive connector 62. The conductive post 72 may include or be replaced by a conductive via, a conductive element, or a conductive pin. The conductive post 72 may include or be made of copper, tin, silver, titanium, nickel, or a combination of two or more thereof.

[0085] In some arrangements, the projection of electronic package 20b on surface 10s1 can be closer to the projection of electronic package 20a on surface 10s1 than the projection of energy storage component 40 on surface 10s1. In some arrangements, electronic package 20b can vertically overlap electronic package 20a. In some arrangements, electronic packages 20a and 20b can be closer to one side of flexible encapsulation 10 than to the opposite side. Electronic packages 20a and 20b can be concentrated on one side or in a specific area, while the opposite side or other areas remain free of electronic packages. Because electronic packages 20a and 20b can be located on the same side relative to energy storage component 40, delamination and / or cracking can be prevented when electronic device 1e is bent or stretched.

[0086] Figure 9 is a cross-sectional view of an electronic device 1f according to the arrangement of the present disclosure. The electronic device 1f is similar to Figure 3A The electronic device 1b shown in FIG. 1 has the following differences.

[0087] In some arrangements, the electronic device 1f may further include an insulating layer 13, conductive connectors 63, conductive connectors 64, and conductive posts 73. In some arrangements, the material of the insulating layer 13 may be the same as or similar to that of the insulating layer 11. The bottom surface of the insulating layer 13 may serve as the surface 10s1 of the flexible encapsulation 10. In this arrangement, the top surface of the insulating layer 11 may serve as the surface 10s2 of the flexible encapsulation 10. In some arrangements, there may be an unclear boundary between the insulating layer 11 and the insulating layer 13. In some arrangements, there is no boundary between the insulating layer 11 and the insulating layer 13.

[0088] In some arrangements, the flexible encapsulation body 10 may define an encapsulation body defining pattern 10r3 adjacent to the surface 10s1 or the bottom surface of the insulating layer 13. The encapsulation body defining pattern 10r3 may be an opening of the flexible encapsulation body 10 recessed from the surface 10s1 or from the bottom surface of the insulating layer 13, the opening being configured to accommodate the conductive connector 63. In some arrangements, the encapsulation body defining pattern 10r3 may be formed first, and then a conductive material may be formed therein to define the conductive connector 63. The pattern of the encapsulation body defining pattern 10r3 may be predetermined, and then the conductive material may be filled therein, thereby allowing the conductive connector 63 to inherit the pattern of the encapsulation body defining pattern 10r3. In some arrangements, the bottom surface (not labeled) of the conductive connector 63 may be substantially aligned with or coplanar with the surface 10s1 of the flexible encapsulation body 10. The encapsulation body defining pattern 10r3 may include a pattern similar to Figures 4A to 4C The demoulding pattern DP1 shown in FIG.

[0089] In some arrangements, the flexible encapsulation body 10 may define an encapsulation body defining pattern 10r4 adjacent to the top surface of the insulating layer 13. The encapsulation body defining pattern 10r4 may be an opening of the flexible encapsulation body 10 recessed from the top surface of the insulating layer 13, the opening being configured to accommodate the conductive connector 64. In some arrangements, the encapsulation body defining pattern 10r4 may be formed first, and then a conductive material may be formed therein to define the conductive connector 64. The pattern of the encapsulation body defining pattern 10r4 may be predetermined, and then the conductive material may be filled therein, thereby allowing the conductive connector 64 to inherit the pattern of the encapsulation body defining pattern 10r4. The encapsulation body defining pattern 10r4 may include a pattern similar to Figures 4A to 4C The demoulding pattern DP1 shown in FIG.

[0090] In some arrangements, the conductive connector 63 can abut the surface 10s1 of the flexible encapsulation body 10. In some arrangements, the conductive connector 63 can include a conductive paste (e.g., silver paste, copper paste, gold paste, or other suitable paste), a conductive ink that can include gold, silver, copper, or other suitable materials mixed with a resin or other polymer material, or other suitable conductive material. The conductive connector 63 can inherit the mold release profile of the encapsulation body-defining pattern 10r3 of the flexible encapsulation body 10. The function of the conductive connector 63 can be the same as or similar to that of the conductive element 51a.

[0091] In some arrangements, the conductive connector 64 can be positioned below the conductive connector 50. The conductive connector 64 can be electrically connected to the conductive connector 50. In some arrangements, the conductive connector 64 can include a conductive paste (e.g., silver paste, copper paste, gold paste, or other suitable paste), a conductive ink that can include gold, silver, copper, or other suitable materials mixed with a resin or other polymer material, or other suitable conductive materials. The conductive connector 64 can inherit the mold release profile of the encapsulation body-defining pattern 10r4 of the flexible encapsulation body 10.

[0092] In some arrangements, a conductive post 73 may be disposed within the insulating layer 13. In some arrangements, the conductive post 73 may extend between the conductive connector 63 and the conductive connector 64. The conductive post 73 may be electrically connected to the conductive connector 63. The conductive post 73 may be electrically connected to the conductive connector 64. The conductive post 73 may include or be made of copper, tin, silver, titanium, nickel, or a combination of two or more thereof.

[0093] In this arrangement, the flexible encapsulation 10 can be composed of multiple laminated layers, which allows for the creation of electronic devices that require multiple conductive traces while still being flexible and stretchable.

[0094] Figure 10 is a cross-sectional view of an electronic device 1g arranged according to the present disclosure. The electronic device 1g is similar to Figure 8 The electronic device 1e shown in FIG. 1 has the following differences.

[0095] In some arrangements, the electronic device 1g may further include a conductive wire 76. In some arrangements, the conductive wire 76 may be disposed within the insulating layer 12. In some arrangements, the conductive wire 76 may be electrically connected to the conductive connector 61. The conductive wire 76 may be configured to electrically connect the electronic package 20b to the conductive connector 62. In some arrangements, a portion of the conductive connector 61 may be replaced by the conductive wire 76, which may reduce the size (e.g., length) of the conductive connector 61. As a result, when the electronic device 1g is bent or stretched, delamination between the conductive connector 61 and the insulating layer 12 may be reduced. The stretchability of the conductive wire 76 may be greater than the stretchability of the conductive connector, which may reduce the risk of electrical disconnection. In addition, the conductive wire 76 may be electrically connected to the ground to shield the electronic package 20b from electromagnetic interference (EMI). In some arrangements, multiple conductive wires 76 may surround the electronic package 20b to enhance EMI shielding.

[0096] Figure 11 is a cross-sectional view of an electronic device 1h arranged according to the present disclosure. The electronic device 1h is similar to Figure 9 The electronic device 1f shown in has the following differences.

[0097] In some arrangements, the electronic device 1h may include conductive wires 77 and 78. The conductive wire 77 may be disposed within the flexible encapsulation 10. The conductive wire 77 may be electrically connected to the conductive connector 50. The conductive wire 77 may be electrically connected to the electronic components 30a and 30b. In some arrangements, a portion of the conductive connector 50 may be replaced by the conductive wire 77, which may reduce the size (e.g., length) of the conductive connector 50. As a result, delamination between the conductive connector 50 and the flexible encapsulation 10 may be reduced when the electronic device 1h is bent or stretched.

[0098] Conductive wire 78 may be disposed within the flexible encapsulation body 10. Conductive wire 77 may be located at a different level (or height) relative to the surface 10s1 of the flexible encapsulation body 10 than conductive wire 78. Conductive wire 78 may be electrically connected to conductive connector 61. In some arrangements, a portion of conductive connector 61 may be replaced by conductive wire 78, which may reduce the size (e.g., length) of conductive connector 61. As a result, delamination between conductive connector 61 and flexible encapsulation body 10 may be reduced when the electronic device 1h is bent or stretched. In some arrangements, conductive wire 78 may function as a passive component (e.g., an inductor) configured to control or adjust impedance between electronic components. In some arrangements, conductive wire 78 may be configured to function as a regulator and / or filter.

[0099] Figure 12A 、 Figure 12B 、 Figure 12C and Figure 12D One or more stages of an example of a method for manufacturing an electronic device according to some arrangements of the present disclosure are shown.

[0100] refer to Figure 12A A carrier 80 may be provided. The carrier 80 may include a glass carrier, a ceramic carrier, a plastic carrier, an organic carrier, a silicon carrier, or other suitable carriers. The electronic package 20a, the electronic component 30a, and the energy storage component 40 may be attached to the top surface (not labeled) of the carrier 80.

[0101] refer to Figure 12B , a flexible encapsulation body 10 may be formed over the carrier 80. The flexible encapsulation body 10 may encapsulate the electronic package 20a, the electronic component 30a, and the energy storage component 40. The flexible encapsulation body 10 may be formed by a molding technique such as injection molding, compression molding, or transfer molding.

[0102] refer to Figure 12C , the carrier 80 can be removed. The surface 10s1 of the flexible encapsulation body 10 can be exposed.

[0103] refer to Figure 12D , the conductive connection 50 may be formed below the surface 10s1 of the flexible encapsulation body 10. As a result, an electronic device (eg, Figure 1 The electronic device 1a shown in FIG.

[0104] Figure 13A 、 Figure 13B and Figure 13C One or more stages of an example of a method for manufacturing an electronic device according to some arrangements of the present disclosure are shown.

[0105] refer to Figure 13A A carrier 82 may be provided. The carrier 82 may include a glass carrier, a ceramic carrier, a plastic carrier, or other suitable carrier. The carrier 82 may have a protruding portion 82p. The protruding portion 82p may protrude from the top surface of the carrier 82. In some arrangements, the protruding portion 82p may be configured to define an encapsulation-defining region of the flexible encapsulation. The electronic package 20a, the electronic component 30a, and the energy storage component 40 may be attached to the protruding portion 82p of the carrier 80. The flexible encapsulation 10 may be formed on the carrier 82.

[0106] Figure 14A For the arrangement according to the present disclosure Figure 13A . In some arrangements, the carrier 82 may include a release feature 82d that facilitates removal of the carrier 82. In some arrangements, the release feature 82d may include a draft angle or profile that facilitates separation of the flexible encapsulation body 10 from the carrier 82. In some arrangements, the release feature 82d may include a tapered profile. In some arrangements, the release feature 82d may define an obtuse angle, resulting in the surface 10s4 having an inclined surface. In some arrangements, the release feature 82d may taper toward the flexible encapsulation body 10. In some arrangements, the flexible encapsulation body 10 may inherit Figure 14A The demoulding structure 82d of the carrier 80 is shown in FIG. 8 , and thereby presents a demoulding pattern DP1.

[0107] Figure 14B For the arrangement according to the present disclosure Figure 13A In some arrangements, the demolding structure 82d may have a uniform portion 82u having a uniform dimension (eg, width or length) in the cross-sectional view and a tapered portion 82t above the uniform portion. In some arrangements, the flexible encapsulation body 10 may inherit Figure 14B The demoulding structure 82d of the carrier 80 is shown in FIG. 8 , and thereby presents a demoulding pattern DP1.

[0108] Figure 14C For the arrangement according to the present disclosure Figure 13A In some arrangements, the demolding structure 82d may include stepped profiles 82e and 82f, each of which may be composed of a vertical surface extending between two horizontal surfaces. In some arrangements, the flexible encapsulation body 10 may inherit Figure 14C The demoulding structure 82d of the carrier 80 is shown in FIG. 8 , and thereby presents a demoulding pattern DP1.

[0109] refer to Figure 13B , the carrier 82 may be removed. An encapsulation body defining pattern 10r1 may be defined. The electrodes 44 may be exposed by the encapsulation body defining pattern 10r1 of the flexible encapsulation body 10. The terminals 24 may be exposed by the encapsulation body defining pattern 10r1 of the flexible encapsulation body 10.

[0110] refer to Figure 13C , the conductive connector 50 may be formed within the encapsulation body defining pattern 10r1 of the flexible encapsulation body 10. In some arrangements, a printing technique may be performed to form the conductive connector 50. In some arrangements, a conductive material may be filled within the encapsulation body defining pattern 10r1, and a curing technique (or heat treatment) may be performed on the conductive material to produce the conductive connector 50. In some arrangements, the contour of the conductive connector 50 may inherit the release structure 82d of the carrier 82. As a result, an electronic device (e.g., Figure 3A The electronic device 1b shown in FIG.

[0111] Figure 15A 、 Figure 15B 、 Figure 15C 、 Figure 15D and Figure 15E One or more stages of an example of a method for manufacturing an electronic device according to some arrangements of the present disclosure are shown.

[0112] refer to Figure 15AA carrier 82 may be provided. The carrier 82 may include a protruding portion 82p. The electronic package 20a, the electronic component 30a, and the energy storage component 40 may be attached to the protruding portion 82p of the carrier 80. The conductive pillar 71 may be formed above the carrier 82. The electronic package 20a, the electronic component 30a, and the energy storage component 40 may be attached to the protruding portion 82p of the carrier 80.

[0113] refer to Figure 15B , the flexible encapsulation body 10 may be formed over the carrier 82. The flexible encapsulation body 10 may encapsulate the electronic package 20, the electronic component 30a, the energy storage component 40, and the conductive pillar 71. In some arrangements, the flexible encapsulation body 10 may define an encapsulation body defining pattern 10r2 that is recessed from the surface 10s2 of the flexible encapsulation body 10. In some arrangements, a mold cavity may be utilized. The mold cavity may include a mold release contour and a predetermined pattern. The flexible encapsulation body 10 may inherit the contour of the mold cavity. As a result, the flexible encapsulation body 10 may exhibit the encapsulation body defining pattern 10r2 and Figure 7B The demoulding profile shown in .

[0114] refer to Figure 15C , the conductive connector 61 may be formed within the encapsulation body defining pattern 10r2 of the flexible encapsulation body 10. In some arrangements, a printing technique may be performed to form the conductive connector 61. In some arrangements, a conductive material may be filled within the encapsulation body defining pattern 10r2, and a curing technique (or heat treatment) may be performed on the conductive material to produce the conductive connector 62.

[0115] refer to Figure 15D , the carrier 82 may be removed. An encapsulation body defining pattern 10r1 may be defined and recessed from a surface 10s1 of the flexible encapsulation body 10. The encapsulation body defining pattern 10r1 may inherit the pattern of the protruding portion 82p.

[0116] refer to Figure 15E , the conductive connection member 50 may be formed within the encapsulation body defining pattern 10r1 of the flexible encapsulation body 10. As a result, an electronic device (eg, Figure 7A The electronic device 1d shown in FIG.

[0117] Figure 16A 、 Figure 16B and Figure 16C One or more stages of an example of a method for manufacturing an electronic device according to some arrangements of the present disclosure are shown. The initial stage of the process is shown with Figures 15A to 15E The stages shown in FIG. Figure 16A Depicted in Figure 15E The stage following the stage depicted in .

[0118] refer to Figure 16A, the electronic package 20b can be attached to the conductive connector 61. The conductive pillar 72 can be attached to the conductive connector 61. The insulating layer 11 can be formed to encapsulate the electronic package 20b and the conductive pillar 72.

[0119] refer to Figure 16B Insulating layer 12 may be formed over insulating layer 11. Insulating layer 12 may encapsulate conductive pillars 72 and electronic package 20b. Insulating layers 11 and 12 may define or represent flexible encapsulation body 10. Insulating layer 12 may be formed by molding techniques such as injection molding, compression molding, or transfer molding.

[0120] refer to Figure 16C , conductive connectors 62 may be formed over insulating layer 12. In some arrangements, a printing technique or other suitable technique may be performed to form conductive connectors 62. As a result, an electronic device (eg, Figure 8 The electronic device 1e shown in FIG.

[0121] Figure 17A 、 Figure 17B 、 Figure 17C 、 Figure 17D 、 Figure 17E 、 Figure 17F and Figure 17G One or more stages of an example of a method for manufacturing an electronic device according to some arrangements of the present disclosure are shown.

[0122] refer to Figure 17A , a carrier 82 may be provided. A conductive pillar 73 may be formed over a protruding portion 82 p of the carrier 82 .

[0123] refer to Figure 17B An insulating layer 13 may be formed over the carrier 82. The insulating layer 13 may encapsulate the conductive pillars 73. The insulating layer 13 may be formed using a molding technique such as injection molding, compression molding, or transfer molding. In some arrangements, a mold cavity may be utilized. The mold cavity may include a mold release profile and a predetermined pattern. The insulating layer 13 may inherit the contour of the mold cavity. As a result, the insulating layer 13 may define an encapsulation-defining pattern 10r4 that exposes the conductive pillars 73.

[0124] refer to Figure 17C , the conductive connector 64 can be formed within the encapsulation body defining pattern 10r4. In some arrangements, a printing technique or other suitable technique can be performed to form the conductive connector 64. The conductive connector 64 can inherit and conform to the contour of the encapsulation body defining pattern 10r4 of the flexible encapsulation body 10. In some arrangements, a conductive material can be filled within the encapsulation body defining pattern 10r4, and a curing technique (or heat treatment) can be performed on the conductive material to produce the conductive connector 64.

[0125] refer to Figure 17D, the carrier 82 may be removed. An encapsulation body defining pattern 10r3 may be defined and recessed from the bottom surface of the insulating layer 13. The encapsulation body defining pattern 10r3 may inherit the pattern of the protruding portion 82p.

[0126] refer to Figure 17E , the conductive connector 63 may be formed within the encapsulation body defining pattern 10r3. In some arrangements, a printing technique or other suitable technique may be performed to form the conductive connector 63. In some arrangements, a conductive material may be filled within the encapsulation body defining pattern 10r3, and a curing technique (or heat treatment) may be performed on the conductive material to produce the conductive connector 63. The conductive connector 63 may inherit and conform to the contour of the encapsulation body defining pattern 10r3.

[0127] refer to Figure 17F , which can be provided Figure 15E The structure shown in (e.g., electronic device 1d).

[0128] refer to Figure 17G , the insulating layer 11 can be attached to the insulating layer 13. The conductive connector 50 can be attached to the conductive connector 64. The insulating layer 11 and the insulating layer 13 can define or present a flexible encapsulation 10. As a result, an electronic device (e.g., Figure 9 The electronic device 1f shown in FIG.

[0129] In other arrangements, Figure 17E After the 10-step process, the electronic package 20a, the electronic component 30a, and the energy storage component 40 can be attached to the conductive connector 64. The conductive pillar 71 can be formed above the conductive connector 64. Next, the insulating layer 11 can be formed above the insulating layer 13. The insulating layer 11 defines or presents an encapsulation-defining pattern 10r2 adjacent to the top surface of the insulating layer 11. Finally, the conductive connector 61 can be formed within the encapsulation-defining pattern 10r2, thereby producing the electronic device 1f.

[0130] Figure 18A 、 Figure 18B and Figure 18C One or more stages of an example of a method for manufacturing an electronic device according to some arrangements of the present disclosure are shown. The initial stage of the process is shown with Figures 15A to 15E The stages shown in FIG. Figure 18A Depicted in Figure 15E The stage following the stage depicted in .

[0131] refer to Figure 18A , electronic package 20b may be attached to conductive connector 61. Conductive pillar 72 may be attached to conductive connector 61. Conductive line 76 may be formed over conductive connector 61.

[0132] refer to Figure 18B, an insulating layer 12 may be formed over the insulating layer 11. The insulating layer 12 may encapsulate the conductive pillars 72, the electronic package 20b, and the conductive lines 76. The insulating layers 11 and 12 may define or present a flexible encapsulated body 10.

[0133] refer to Figure 18C , conductive connectors 62 may be formed over insulating layer 12. In some arrangements, a printing technique or other suitable technique may be performed to form conductive connectors 62. As a result, an electronic device (eg, Figure 10 The electronic device 1g shown in FIG.

[0134] Figure 19 1 is a cross-sectional view of an electronic device 1i according to the arrangement of the present disclosure. The electronic device 1i may include a conductive connector 50'. The material and position of the conductive connector 50' may be the same or similar to the material and position of the conductive connector 50. In addition, the conductive connector 50' may include Figures 4A to 4C . The conductive connector 50' may include a surface 50s3 extending between surfaces 50s1 and 50s2 and a surface 50s4 opposite surface 50s3. In some arrangements, the conductive connector 50' may include conductive particles (e.g., silver particles or other conductive materials). The particles may be exposed from the surface 50s1 of the conductive connector 50'. Therefore, the surface 50s1 may be relatively rough. In some arrangements, the roughness of the surface 50s1 may be greater than the roughness of the surface 10s1.

[0135] Figure 20 is a cross-sectional view of an electronic device 1j according to an arrangement of the present disclosure. In some arrangements, the conductive connector 50' may be recessed from the surface 10s1 of the flexible encapsulation body 10. In some arrangements, the surface 10s1 may be coated or formed with a conductive paste or other suitable material. A scraper or other suitable component may be used to apply pressure to the surface 10s1 so that the conductive paste fills the encapsulation body-defining pattern (e.g., the encapsulation body-defining pattern 10r1) to form the conductive connector 50'. Under some conditions, the scraper may apply pressure to the conductive paste, causing the conductive connector 50' to be recessed from the surface 10s1. In some arrangements, the conductive connector 50' may have different levels adjacent to the surfaces 50s3 and 50s4. The distance T1 may be defined by the surface 50s1 of the conductive connector 50' and the surface 10s1 of the flexible encapsulation body 10 at the surface 50s4 (or side). Distance T2 may be defined at surface 50s3 (or side) by surface 50s1 of conductive connector 50' and surface 10s1 of flexible encapsulation 10. In some arrangements, distance T1 may be different from distance T2.

[0136] Figure 21FIG. 1 is a cross-sectional view of an electronic device 1 k according to an arrangement of the present disclosure. In some arrangements, a surface 50s1 of the conductive connector 50 ′ may protrude from a surface 10s1 of the flexible encapsulation body 10 .

[0137] Figure 22 FIG1 is a cross-sectional view of an electronic device 11 according to an arrangement of the present disclosure. In some arrangements, a portion of the surface 50s1 of the conductive connector 50' may be higher than the surface 10s1 of the flexible encapsulation 10, and another portion of the surface 50s1 of the conductive connector 50' may be lower than the surface 10s1 of the flexible encapsulation 10.

[0138] Figure 23 is a cross-sectional view of an electronic device 1m arranged according to the present disclosure. In some arrangements, the conductive connector 50' may include a filler 50r and conductive particles 50c within the filler 50r. The filler 50r may include a resin or other suitable material. The conductive particles 50c may include silver, gold, titanium, copper, aluminum or other suitable materials. When the scraper 90 moves in the direction from the surface 50s3 toward the surface 50s4, the conductive particles 50c of the adjacent surface 50s1 may be unevenly distributed. For example, the density of the conductive particles 50c of the adjacent surface 50s4 may be greater than the density of the adjacent surface 50s3. In some arrangements, the conductive particles 50c of the adjacent surface 50s2 may be more evenly distributed than the conductive particles 50c of the adjacent surface 50s1.

[0139] Figure 24 FIG. 1 is a cross-sectional view of an electronic device 1 n according to an arrangement of the present disclosure. In some arrangements, a portion of the conductive connector 50 ′ may be disposed on the surface 10 s 1 of the flexible encapsulation body 10 .

[0140] In some arrangements, an electronic device includes a flexible encapsulation body, a first electronic component, and a first conductive connector. The flexible encapsulation body has a first encapsulation body-defining pattern. The first electronic component is disposed within the flexible encapsulation body. The first electronic component includes a terminal exposed by the first encapsulation body-defining pattern. The first conductive connector is disposed within the first encapsulation body-defining pattern and electrically connected to the terminal of the first electronic component.

[0141] In some arrangements, the flexible encapsulation body has a bottom surface that is substantially aligned with the bottom surface of the first conductive connector. In some arrangements, the first encapsulation body-defining pattern is recessed from the bottom surface of the flexible encapsulation body. In some arrangements, the first encapsulation body-defining pattern has a release pattern. In some arrangements, the first conductive connector conforms to the release pattern of the first encapsulation body-defining pattern. In some arrangements, the flexible encapsulation body has a bottom surface and a top surface opposite the bottom surface, and the first conductive connector is adjacent to the bottom surface and tapers toward the top surface of the flexible encapsulation body. In some arrangements, the first conductive connector includes a stepped profile within the first encapsulation body-defining pattern. In some arrangements, the flexible encapsulation body has a second encapsulation body-defining pattern at a different level than the first encapsulation body-defining pattern, and the electronic device further includes a second conductive connector disposed within the second encapsulation body-defining pattern. In some arrangements, the second encapsulation body-defining pattern has a release pattern. In some arrangements, the flexible encapsulation body has a bottom surface adjacent to the first encapsulation body-defined pattern and a top surface adjacent to the second encapsulation body-defined pattern. In some arrangements, the top surface of the second conductive connector is substantially aligned with the top surface of the flexible encapsulation body. In some arrangements, the second conductive connector is embedded within the flexible encapsulation body. In some arrangements, the second conductive connector tapers toward the first conductive connector, and the first conductive connector tapers toward the second conductive connector. In some arrangements, the power storage component is electrically connected to the first electronic component via the first conductive connector. In some arrangements, the second electronic component is electrically connected to the second conductive connector, wherein a projection of the second electronic component onto the bottom surface of the flexible encapsulation body is closer to a projection of the first electronic component onto the bottom surface of the flexible encapsulation body than a projection of the power storage component onto the bottom surface of the flexible encapsulation body. In some arrangements, the second electronic component vertically overlaps the first electronic component.

[0142] In some arrangements, an electronic device includes a flexible encapsulated body, a first conductive connector, and an electronic component. The flexible encapsulated body has a bottom surface. The flexible encapsulated body has a first release pattern adjacent to the bottom surface. The first conductive connector is adjacent to the bottom surface. The first conductive connector is at least partially embedded within the flexible encapsulated body and conforms to the first release pattern. The electronic component is within the flexible encapsulated body and electrically connected to the first conductive connector.

[0143] In some arrangements, the first conductive connector has a bottom surface that is substantially aligned with the bottom surface of the flexible encapsulation. In some arrangements, the first conductive connector has a top surface opposite the bottom surface, and in a cross-sectional view, the top surface is shorter than the bottom surface. In some arrangements, the electronic component is attached to the first conductive connector using flip-chip technology. In some arrangements, a power storage component is positioned adjacent to the bottom surface of the flexible encapsulation and electrically connected to the first conductive connector, wherein the first conductive connector has a first circuit density adjacent to the electronic component and a second circuit density adjacent to the power storage component, the second circuit density being greater than the first circuit density. In some arrangements, the flexible encapsulation has a second release pattern spaced apart from the bottom surface, and the electronic device includes a second conductive connector conforming to the second release pattern. In some arrangements, the second conductive connector has a top surface and a bottom surface opposite the top surface, and in a cross-sectional view, the top surface of the second conductive connector is longer than the bottom surface of the second conductive connector. In some arrangements, the second release pattern of the flexible encapsulation is spaced apart from the top surface of the flexible encapsulation. In some arrangements, the first conductive connection comprises a conductive paste or a conductive ink.

[0144] In some arrangements, a method of manufacturing an electronic device includes providing a carrier having a pattern; forming an encapsulation body onto the carrier; removing the carrier, wherein at a first surface of the encapsulation body, the encapsulation body has a first predetermined pattern corresponding to the pattern of the carrier; and forming a conductive connection within the first predetermined pattern of the encapsulation body.

[0145] In some arrangements, the pattern comprises a protruding portion protruding from the carrier. In some arrangements, the method includes attaching a terminal of the electronic component to the protruding portion of the carrier. In some arrangements, the encapsulated body is formed by injection molding. In some arrangements, the encapsulated body has a second predetermined pattern on a second surface opposite the first surface. In some arrangements, the protruding portion comprises a mold release pattern.

[0146] Unless otherwise specified, spatial descriptions such as "above," "below," "up," "left," "right," "lower," "top," "bottom," "vertical," "horizontal," "side," "above," "below," "upper," "above," "below," etc., are indicated relative to the orientation shown in the figures. It should be understood that the spatial descriptions used herein are for illustrative purposes only, and that embodiments of the structures described herein may be spatially arranged in any orientation or manner, provided that the advantages of the embodiments of the present disclosure are not deviated by such arrangements.

[0147] As used herein, the terms "approximately," "substantially," "approximately," and "about" are used to describe and explain minor variations. When used in conjunction with an event or circumstance, these terms can refer to instances where the event or circumstance occurred exactly as well as instances where the event or circumstance occurred very approximately. For example, when used in conjunction with a numerical value, these terms can refer to a range of variation of less than or equal to ±10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, if the difference between two numerical values ​​is less than or equal to ±10% of the average of the values, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%, then the values ​​may be considered "substantially" the same or equal.

[0148] Two surfaces may be considered coplanar or substantially coplanar if the amount of displacement between them is no greater than 5 μm, no greater than 2 μm, no greater than 1 μm, or no greater than 0.5 μm.

[0149] As used herein, the singular forms "a," "an," and "the" may include plural or plural referents unless the context clearly dictates otherwise.

[0150] As used herein, the terms "conductive," "electrically conductive," and "conductivity" refer to the ability to carry an electric current. Conductive materials are materials that present little or no resistance to the flow of electric current. One unit of measurement for conductivity is Siemens per meter (S / m). Typically, a conductive material has a conductivity greater than about 10 4 S / m, for example at least 10 5 S / m or at least 10 6 S / m of a material. The electrical conductivity of a material sometimes varies with temperature. Unless otherwise specified, the electrical conductivity of a material is measured at room temperature.

[0151] In addition, amounts, ratios, and other numerical values ​​are sometimes presented herein in a range format. It should be understood that such range format is used for convenience and brevity and should be construed flexibly to include not only the values ​​explicitly specified as the limits of the range, but also all individual values ​​or sub-ranges encompassed within the range, as if each value and sub-range were explicitly specified.

[0152] Although the present disclosure has been described and illustrated with reference to specific embodiments of the present disclosure, these descriptions and illustrations are not restrictive. Those skilled in the art will understand that various changes may be made and equivalents may be substituted without departing from the true spirit and scope of the present disclosure as defined by the appended claims. The illustrations may not necessarily be drawn to scale. Due to manufacturing processes and tolerances, there may be differences between the process reproduction in the present disclosure and the actual equipment. There may be other embodiments that are not specifically described in the present disclosure. The description and drawings should be regarded as illustrative and not restrictive. Modifications may be made to make specific circumstances, materials, compositions of matter, methods or processes suitable for the objectives, spirit and scope of the present disclosure. All such modifications are deemed to be included within the scope of the appended claims. Although the disclosed methods have been described herein with reference to specific operations performed in a specific order, it should be understood that these operations may be combined, subdivided or reordered to form equivalent methods without departing from the teachings of the present disclosure. Therefore, unless specifically indicated herein, the order and grouping of operations are not limitations of the present disclosure.

Claims

1. An electronic device comprising: a flexible encapsulating body having a first predetermined pattern; a first electronic component disposed within the flexible encapsulation, wherein the first electronic component includes terminals exposed by the first predetermined pattern; and A conductive connector is disposed within the first predetermined pattern and electrically connected to the terminal of the first electronic component. 2 . The electronic device of claim 1 , wherein the first predetermined pattern tapers from a bottom surface of the flexible encapsulation body. 3 . The electronic device according to claim 1 , wherein a roughness of a bottom surface of the conductive connecting member is greater than a roughness of a bottom surface of the flexible encapsulation body.

4. The electronic device of claim 1 , wherein a first distance between the bottom surface of the conductive connector and the bottom surface of the flexible encapsulation body on a first side of the conductive connector is different from a second distance between the bottom surface of the conductive connector and the bottom surface of the flexible encapsulation body on a second side of the conductive connector opposite the first side. 5 . The electronic device of claim 1 , wherein the first predetermined pattern has a first width adjacent to the bottom surface of the flexible encapsulation body along a first direction and a second width away from the bottom surface of the flexible encapsulation body along the first direction, and the first width is greater than the second width.

6. The electronic device of claim 5, wherein the first predetermined pattern has a third width adjacent to the bottom surface of the flexible encapsulation body along a second direction substantially perpendicular to the first direction and a fourth width away from the bottom surface of the flexible encapsulation body along the second direction, and the third width is greater than the fourth width. 7 . The electronic device of claim 5 , wherein the first predetermined pattern has a profile that is inclined relative to the bottom surface of the flexible encapsulation body. The electronic device according to claim 5 , wherein the first predetermined pattern has a stepped profile. 9 . The electronic device of claim 1 , wherein the conductive connector has a profile that tapers toward a top surface of the flexible encapsulation body.

10. The electronic device according to claim 1, further comprising: A second electronic component is encapsulated by the flexible encapsulation body, wherein the conductive connecting member electrically connects the first electronic component and the second electronic component.

11. An electronic device comprising: a flexible encapsulation body having a first surface and a second surface opposite the first surface; a first conductive connection member recessed from the second surface; and A second conductive connection is recessed from the first surface and electrically connected to the first conductive connection.

12. The electronic device according to claim 11, further comprising: A first electronic component is encapsulated by the flexible encapsulation body and electrically connected to the first conductive connection.

13. The electronic device according to claim 12, further comprising: A second electronic component is disposed on the flexible encapsulation body and is electrically connected to the second conductive connection. 14 . The electronic device of claim 13 , wherein the first electronic component at least partially overlaps the second electronic component in a generally vertical direction.

15. The electronic device according to claim 11, further comprising: A conductive element is encapsulated by the flexible encapsulation body and connected to the first conductive connector and the second conductive connector. 16 . The electronic device of claim 11 , wherein the first conductive connection tapers in a direction different from a direction of the second conductive connection.

17. A method of manufacturing an electronic device, comprising: Providing a first electronic component and an encapsulation body encapsulating the first electronic component; forming a first predetermined pattern defined by the encapsulated body; and A first conductive connection is formed in the first predetermined pattern of the encapsulation body to electrically connect to the first electronic component.

18. The method of claim 17, further comprising: A second electronic component is provided, wherein the encapsulation body encapsulates the second electronic component, and the first conductive connection electrically connects the first electronic component to the second electronic component.

19. The method of claim 18, further comprising: forming a second predetermined pattern defined by the encapsulated body, the second predetermined pattern being opposite to the first predetermined pattern; and A second conductive connection is formed within the second predetermined pattern of the encapsulation.

20. The method of claim 19, further comprising: A conductive element is provided that is electrically connected to the first conductive connection and the second conductive connection.

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