Sensor module

Abstract

The invention relates to a sensor module. A sensor module according to one embodiment of the present disclosure is provided with a housing, a sensor substrate, an external connector, a flexible wiring substrate, and a metal shield case. The flexible wiring substrate is electrically connected between the sensor substrate and the external connector and has a signal line and a ground line. The shield housing has a bottom portion positioned between the flexible wiring substrate and the external connector. The external connector has a first connection pin connected to the signal line, a second connection pin connected to the ground line, and a third connection pin connected to the bottom of the shielding case. The bottom is provided with: a first hole through which the first connection pin passes; the second connecting pin passes through the second hole; a third connecting pin passes through the third hole; and a heat storage portion provided around the third hole, the heat storage portion being covered by a solder material joining the third connection pin to the bottom portion.

Description

[0001] This application is a divisional application of the invention patent application with an application date of February 10, 2021, application number 202180014210.4, a PCT international application national phase entry date of August 12, 2022, PCT international application application number PCT / JP2021 / 005010, and invention name “Sensor Module”. Technical Field

[0002] The present technology relates to a sensor module mounted on, for example, a vehicle. Background Art

[0003] Camera devices installed on vehicles and used to perform visual recognition using surveillance equipment placed near the driver's cabin have been offered in the past to improve vehicle convenience and safety. This type of camera device includes a substantially rectangular housing, incorporating, for example, an imaging lens, an imaging element, and an external connector. The housing is built into or attached to, for example, a rear door, a side mirror, or a front spoiler of the vehicle body, such that the imaging lens faces outward. Such camera devices enable the capture of images of the vehicle's surroundings that are blind spots from the driver's perspective, thereby improving safety and convenience.

[0004] In this type of camera device, it is necessary to determine the position of the imaging element in the housing and stably electrically connect the external connector and the substrate on which the imaging element is mounted in order to obtain high-quality image signals from the imaging element. For example, Patent Document 1 discloses a camera device that includes a shielding case for implementing electromagnetic compatibility (EMC) measures in the housing, the shielding case being connected to a ground pattern of a flexible wiring substrate that connects the external connector and the substrate on which the imaging element is mounted.

[0005] Citation List

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent No. 5413231 Summary of the Invention

[0008] Technical issues

[0009] Recently, there has been a need to further improve the EMC measures employed in sensor modules. This requires a stable connection between the shield housing and the ground wire of the external connector. However, since the shield housing is made of metal, heat escapes into the shield housing when soldering the shield housing to the ground wire. This can make it difficult to ensure good operability and reliable connection.

[0010] In view of the above circumstances, one of the objects of the present technology is to provide a sensor module that enables improvement in the workability of soldering a shield case to a ground wire and improves reliability in connecting the shield case and the ground wire.

[0011] Solution to the problem

[0012] A sensor module according to an embodiment of the present technology includes a housing, a sensor substrate, an external connector, a flexible wiring substrate, and a shield case made of metal.

[0013] The sensor substrate includes a sensor element and is arranged in the housing.

[0014] The external connector is disposed on the housing.

[0015] The flexible wiring substrate electrically connects the sensor substrate and the external connector, and includes a signal line and a ground line.

[0016] The shield case includes a bottom portion disposed between the flexible wiring substrate and the external connector and a peripheral portion covering the periphery of the sensor substrate.

[0017] The external connector includes a first connection pin connected to the signal line, a second connection pin connected to the ground line, and a third connection pin connected to the bottom of the shield case.

[0018] The bottom includes a first hole, a second hole, a third hole, and a heat storage portion, wherein the first hole is a hole through which the first connecting pin passes, the second hole is a hole through which the second connecting pin passes, the third hole is a hole through which the third connecting pin passes, and the heat storage portion is arranged around the third hole and is covered with a welding material used to join the third connecting pin to the bottom.

[0019] In the sensor module, since the heat storage unit is provided at the bottom of the shield case, the shield case and the ground portion of the external connector can be easily soldered, which improves operability and connection reliability.

[0020] The flexible wiring substrate may further include a substrate end portion supporting the signal line and the ground line and arranged in the bottom portion. In this case, the substrate end portion includes an opening through which the third connection pin passes, the opening having an opening area larger than that of the third hole, and the heat storage portion is provided in a region opposite the opening.

[0021] The heat storage portion may include a plurality of slits annularly formed around the third hole.

[0022] The heat storage portion may include a recessed portion annularly formed around the third hole.

[0023] The heat storage portion may include a heat transfer layer made of a metal material having a higher thermal conductivity than the bottom portion.

[0024] The third connecting pin may be arranged offset from the center of the opening.

[0025] The opening may be formed in a circular shape or an oval shape.

[0026] The opening may include a plurality of openings provided corresponding to the plurality of connection pins.

[0027] The sensor element may be a solid-state imaging element.

[0028] The sensor module can be mounted to a vehicle. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 is an exploded perspective view illustrating the configuration of a sensor module according to an embodiment of the present technology.

[0030] Figure 2 FIG. 1 is a schematic plan view of main parts of a housing included in the sensor module.

[0031] Figure 3 It is along Figure 2 Cross-sectional view along line AA.

[0032] Figure 4 is a schematic plan view of a main portion of a flexible wiring substrate included in the sensor module.

[0033] Figure 5 is a plan view of a shielding case included in the sensor module.

[0034] Figure 6 is a schematic plan view illustrating another embodiment of a shielding case.

[0035] Figure 7 is a schematic plan view illustrating yet another embodiment of a shielding case. DETAILED DESCRIPTION

[0036] Now, embodiments according to the present technology will be described below with reference to the drawings.

[0037] [Overall configuration of the sensor module]

[0038] Figure 1 1 is an exploded perspective view illustrating the configuration of a sensor module according to an embodiment of the present technology. The sensor module 100 of this embodiment is configured as a camera module used by being mounted on a vehicle. First, referring to Figure 1 The overall configuration of the sensor module 100 is described.

[0039] The sensor module 100 can be mounted on a vehicle. For example, the sensor module 100 is arranged outside a vehicle body (mounting object) (not shown) and captures images of an area in front of the vehicle, an area behind the vehicle, or an area to the side of the vehicle, depending on the mounting position.

[0040] For example, the sensor module 100 mounted on the front of the vehicle (e.g., the front grille) captures images of the environment in front of the vehicle. Furthermore, the sensor module 100 mounted on the rear of the vehicle (e.g., above the license plate) captures images of the environment behind the vehicle. Furthermore, the sensor module 100 mounted on the side of the vehicle (e.g., the upper portion of a pillar (A-pillar, B-pillar, or a pillar at the rear of the vehicle (C-pillar, D-pillar)) or a side mirror) captures images of the environment lateral to the vehicle.

[0041] like Figure 1 As shown in FIG, the sensor module 100 of the present embodiment includes a housing 10 , a sensor substrate 20 , an external connector 30 , a flexible wiring substrate 40 , and a shield case 50 .

[0042] (case)

[0043] The housing 10 is constructed by combining a front case 11 and a rear case 12 in the direction of the optical axis Z. Typically, the front case 11 and the rear case 12 are injection-molded bodies made of a synthetic resin material.

[0044] The front housing 11 includes a front portion 111 formed substantially perpendicular to the front-to-back direction (the direction of the optical axis Z), and a side portion 112 extending from the periphery of the front portion 111 toward the rear housing 12. In the present embodiment, the front portion 111 is substantially rectangular when viewed from the direction of the optical axis Z. The front housing 11 is hollow, and a space portion is formed in the area surrounded by the front portion 111 and the side portion 112, in which, for example, the sensor substrate 20 is accommodated.

[0045] A through hole 113 is formed in a central portion of a front surface portion 111 of the front housing 11, and a lens barrel member 61 is inserted into the through hole 113 via a sealing ring 62. The lens barrel member 61 supports an imaging lens having an optical axis Z, and is supported between the front housing 11 and the sensor substrate 20 via, for example, a shield plate 63 and a buffer member 64.

[0046] The front housing 11 includes an open end portion 114 welded to the rear housing 12 at the end portion of the side surface portion 112 located on the rear housing 12 side. The open end portion 114 is formed to be substantially rectangular in correspondence with the outer shape of the front portion 111. Note that the front portion 111 and the open end portion 114 are not limited to being rectangular and may be formed in other shapes such as a circular shape or a triangular shape.

[0047] The rear housing 12 is formed into a generally rectangular shallow dish shape, including a bottom portion 121 formed substantially perpendicular to the front-to-back direction, and side portions 122 extending from the periphery of the bottom portion 121 toward the front housing 11. A space portion is formed in the area surrounded by the bottom portion 121 and the side portions 122, which accommodates, for example, the shield shell 50. A substantially rectangular step portion 123 is formed between the bottom portion 121 and the outer peripheral surfaces of the side portions 122. The front housing 11 and the rear housing 12 are integrated with each other by welding the open end portion 114 of the front housing 11 to the step portion 123. The welding method is not particularly limited, and, for example, ultrasonic welding or laser welding methods can be applied.

[0048] (Sensor substrate)

[0049] The sensor substrate 20 includes a front substrate 21 that faces the front portion 111 of the front housing 11, a rear substrate 22 that faces the bottom portion 121 of the rear housing 12, and a spacer 23 disposed between the front substrate 21 and the rear substrate 22. The front substrate 21 and the rear substrate 22 are rigid double-sided wiring substrates such as glass epoxy substrates, and the distance between the substrates is defined by the spacer 23. The front substrate 21 and the rear substrate 22 are mechanically and electrically connected to each other via a substrate connector (B-to-B connector) (not shown). The sensor substrate 20 is not limited to being formed of two substrates, the front substrate 21 and the rear substrate 22, and may be formed of a single substrate.

[0050] A solid-state imaging element 24 is mounted on the front substrate 21 as a sensor element. The solid-state imaging element 24 is an image sensor such as a complementary metal oxide semiconductor (CMOS) image sensor or a charge coupled device (CCD) image sensor. The front substrate 21 is bonded to the lens barrel member 61, and the solid-state imaging element 24 is arranged at the focal point of the lens barrel member 61. In addition, the rear substrate 22 is electrically connected to the external connector 30 provided on the bottom surface portion 121 of the rear housing 12 through the flexible wiring substrate 40.

[0051] (External connector)

[0052] An external connector 30 is provided on the rear housing 12. The external connector 30 is used to electrically connect the sensor substrate 20 to the vehicle body. Power is supplied from the vehicle body to the sensor substrate 20 through the external connector 30, and image signals (output signals from the solid-state imaging element 24) are transmitted from the sensor substrate 20 to the vehicle body.

[0053] Figure 2 is a schematic plan view illustrating the internal structure of the main part of the rear housing 12 side, and Figure 3 It is along Figure 2 Cross-sectional view along line AA.

[0054] like Figure 3As shown in FIG, the external connector 30 includes a signal terminal 31 provided on the bottom surface portion 121 of the rear housing 12, a cylindrical shield terminal 32 formed concentrically with the signal terminal 31, and an insulating member 33 arranged between the signal terminal 31 and the shield terminal 32. Each of the signal terminal 31 and the shield terminal 32 is made of a metal material and can be connected to a coaxial cable (not shown).

[0055] A cylindrical portion 124 concentric with the external connector 30 is provided on the bottom portion 121 of the rear housing 12. The cylindrical portion 124 protects the signal terminals 31 and the shield terminals 32 from the outside and is formed outside the external connector 30 concentrically therewith.

[0056] The external connector 30 further includes a first connection pin 301, a second connection pin 302, and a third connection pin 303. The first connection pin 301 passes through the bottom portion 121 of the rear housing 12 and is integrally formed at the end of the signal terminal 31. The second connection pin 302 and the third connection pin 303 pass through the bottom portion 121 of the rear housing 12 and are integrally formed at the end of the shield terminal 32.

[0057] A plurality of second connecting pins 302 and a plurality of third connecting pins 303 are formed, and for example, two second connecting pins 302 and two third connecting pins 303 are formed, as shown in FIG. Figure 2 As shown in . In this embodiment, the second connecting pins 302 and the third connecting pins 303 are respectively arranged at the vertices of a virtual rectangle centered on the first connecting pin 301. Here, the corresponding second connecting pins 302 are arranged symmetrically with respect to the first connecting pin 301 (arranged diagonally with each other). Similarly, the corresponding third connecting pins 303 are arranged symmetrically with respect to the first connecting pin 301 (arranged diagonally with each other).

[0058] (Flexible Wiring Board)

[0059] The flexible wiring substrate 40 electrically connects the sensor substrate 20 and the external connector 30. The flexible wiring substrate 40 is a wiring substrate formed by laying signal lines and ground lines on a flexible base material such as polyimide. The signal lines carry image signals from the sensor substrate 20, and the ground lines connect to the ground line of the sensor substrate 20. When the flexible wiring substrate 40 is used to connect the sensor substrate 20 and the external connector 30, variations (tolerance) in the distance between the sensor substrate 20 and the external connector 30 can be accommodated, thereby ensuring the reliability of a stable electrical connection between them.

[0060] The flexible wiring substrate 40 includes a first substrate end portion 41 connected to the sensor substrate 20 (back substrate 22) and a second substrate end portion 42 connected to the external connector 30. The first substrate end portion 41 is connected to the back substrate 22, for example, via a connector member 43. The second substrate end portion 42 is connected to the external connector 30 using soldering.

[0061] Figure 4 4 is a schematic plan view of the second base material end portion 42 of the flexible wiring substrate 40. The second base material end portion 42 supports a signal line 401 and a ground line 402. The signal line 401 and the ground line 402 each include a pad electrically connected to the external connector 30.

[0062] For example, the signal line 401 includes a first pad 401a including a through hole and a ring conductor formed around the through hole, wherein the first connection pin 301 passes through the through hole. The first connection pin 301 is soldered to the first pad 401a to be electrically connected to the signal line 401.

[0063] Furthermore, the ground line 402 includes a second solder pad 402a, which includes a through-hole and a ring-shaped conductor formed around the through-hole, wherein the second connecting pin 302 passes through the through-hole. The solder pads 402a are arranged corresponding to the number and position of the second connecting pins 302. In this embodiment, the solder pads 402a are provided at two locations. The second connecting pin 302 is soldered to the second solder pad 402a to electrically connect to the ground line 402.

[0064] The second base material end portion 42 of the flexible wiring substrate 40 further includes an opening 403 through which the third connection pins 303 of the external connector 30 pass. The openings 403 are provided corresponding to the number and positions of the third connection pins 303. In this embodiment, the third connection pins 303 are provided at two positions. The opening area of ​​the opening 403 is larger than the opening area of ​​the through-holes included in the first and second pads 401a and 402a, respectively.

[0065] As will be described later, the opening 403 is a region forming a reservoir of solder material for bonding the third connecting pin 303 to the shield case 50. The shape of the opening 403 is not particularly limited, but in view of, for example, wettability of the solder material, it is preferred that the opening 403 have a shape that does not include corners, such as an elliptical shape as shown in the figure, or an elliptical shape or a circular shape.

[0066] (Shielded housing)

[0067] The shield case 50 is one of the components of EMC measures taken to protect the sensor substrate 20 from electromagnetic noise, and is a substantially rectangular box body whose end on the front housing 11 side is open. The shield case 50 is generally made of a metal material such as stainless steel or aluminum alloy.

[0068] The shielding shell 50 is arranged in the space formed by the bottom surface portion 121 and the side surface portions 122 of the rear housing 12. The shielding shell 50 includes a bottom portion 51 arranged on the bottom surface portion 121 of the rear housing 12 and a peripheral surface portion 52 that covers the periphery of the sensor substrate 20. The peripheral surface portion 52 extends from the peripheral edge of the bottom portion 51 toward the front housing 11 to form a space portion in which the sensor substrate 20 is accommodated. The end of the peripheral surface portion 52 elastically contacts the peripheral edge of the lens barrel member 61.

[0069] like Figure 3 As shown in FIG, the bottom portion 51 of the shield shell 50 is arranged between the second base material end portion 42 of the flexible wiring substrate 40 and the external connector 30. The bottom portion 51 is a substantially rectangular flat plate parallel to the bottom surface portion 121 of the rear housing 12.

[0070] Figure 5 is a plan view illustrating the bottom 51 of the shielding shell 50. The bottom 51 of the shielding shell 50 includes a plurality of holes through which the various connection pins of the external connector 30 pass. In other words, the bottom 51 includes a first hole 501 through which the first connection pin 301 passes, a second hole 502 through which the second connection pin 302 passes, and a third hole 503 through which the third connection pin 303 passes. The second holes 502 and the third holes 503 are respectively arranged to correspond to the number and position of the second connection pins 302 and to correspond to the number and position of the third connection pins 303. In this embodiment, the second holes 502 and the third holes 503 are each arranged at two locations.

[0071] The bottom 51 of the shield case 50 is soldered to the third connection pins 303 of the external connector 30 to be electrically connected to the shield terminals 32 of the external connector 30. For example, solder plating may be performed on the surface of the bottom 51 to increase wettability of the soldering material.

[0072] The bottom 51 of the shielding case 50 includes a heat storage portion 510 disposed around the third hole 503. The heat storage portion 510 is an area covered with solder material used to bond the third connecting pin 303 to the bottom 51. The heat storage portion 510 is disposed in an area facing the opening 403 formed in the second base end portion 42 of the flexible wiring substrate 40. The opening 403 has a larger opening area than the third hole 503, and the heat storage portion 510 is disposed in an area of ​​the bottom 51 that is exposed to the outside through at least the opening 403.

[0073] The heat storage portion 510 includes a function of storing heat required for soldering when the third connecting pin 303 and the shield shell 50 are joined together in the opening 403. This results in increased solderability of the third connecting pin 303. This facilitates the soldering operation of the shield shell 50 and the external connector 30 and improves the reliability of the connection between the shield shell 50 and the external connector 30.

[0074] In order to achieve this function of the heat storage unit 510, the heat storage unit 510 according to the present embodiment includes a plurality of slits 511 formed in an annular shape around the third hole 503. The plurality of slits 511 are arranged in an annular shape so as to surround the region of the shielding case 50 exposed from the opening 403 of the flexible wiring substrate 40. By partitioning the heat storage unit 510 using the plurality of slits 511, heat diffusion from the heat storage unit 510 to the outside is suppressed, as described above.

[0075] The shape of each slit 511 is not particularly limited, and may include a straight slit and a curved slit, such as Figure 5 . The plurality of slits 511 are generally formed along the opening edge of the opening 403 to have a shape corresponding to the opening shape of the opening 403. The plurality of slits 511 may be provided inside the opening edge of the opening 403, but by providing the plurality of slits 511 outside the opening edge, the area of ​​the heat storage portion 510 can be increased. The width of each slit 511 and the arrangement intervals between the slits 511 are not particularly limited and can be arbitrarily set according to, for example, the amount of heat stored in the heat storage portion 510 and the strength of the bottom 51 of the shielding case 50.

[0076] The position of the third hole 503 in the opening 403 is not particularly limited, and the third hole 503 can be located at the center of the opening 403, or can be offset from the center of the opening 403. Figure 5 As shown in FIG, the third hole 503 is provided offset from the center of the opening 403. Therefore, when soldering the third connecting pin 303, it is easy to ensure an area for the solder reservoir, and this makes it possible to further facilitate the soldering operation and further improve the reliability of the connection.

[0077] The bottom 51 of the shielding shell 50 further includes positioning holes 504 for positioning the bottom 51 relative to the bottom portion 121 of the rear housing 12. The positioning holes 504 are provided at multiple locations, and the protrusions 125 provided on the bottom portion 121 of the rear housing 12 are fitted into the positioning holes 504. The shape of the positioning holes 504 is not particularly limited. The positioning holes 504 are generally circular, but at least some of the positioning holes 504 may be elliptical or oval. This makes it possible to absorb assembly errors caused by, for example, tolerances, thereby facilitating assembly. In addition, the protrusions 125 do not necessarily have to be provided at positions corresponding to all of the positioning holes 504 and may also be provided at positions corresponding to at least two of the positioning holes 504.

[0078] [Method of manufacturing sensor module]

[0079] Next, a method of manufacturing the sensor module 100 having the above-described configuration is described.

[0080] The manufacturing method of the sensor module 100 according to the present embodiment includes: accommodating the sensor substrate 20 in the front housing 11; accommodating the shielding shell 50 in the rear housing 12; connecting the sensor substrate 20 and the external connector 30 using the flexible wiring substrate 40; electrically connecting the shielding shell 50 and the shielding terminal 32 of the external connector 30; and welding the front housing 11 and the rear housing 12 to each other to form the housing 10. The following describes the connection of the flexible wiring substrate 40 and the shielding shell 50 to the external connector 30.

[0081] like Figure 2 As shown in FIG, the second base material end portion 42 of the flexible wiring substrate 40 is arranged on the bottom 51 of the shield case 50 accommodated in the rear housing 12. The second base material end portion 42 can be temporarily fixed to the bottom 51 of the shield case 50 using, for example, a double-sided tape.

[0082] like Figure 3 As shown in FIG, the first connection pin 301 of the external connector 30 passes through the first hole 501 of the shielding shell 50 and the first pad 401a of the flexible wiring substrate 40. The second connection pin 302 of the external connector 30 passes through the second hole 502 of the shielding shell 50 and the second pad 402a of the flexible wiring substrate 40. In addition, the third connection pin 303 of the external connector 30 passes through the third hole 503 of the shielding shell 50 and the opening 403 of the flexible wiring substrate 40.

[0083] Next, the first connecting pin 301 and the first pad 401a are joined together by welding, the second connecting pin 302 and the second pad 402a are joined together by welding, and the third connecting pin 303 and the bottom 51 of the shielding case 50 are joined together by welding. In this embodiment, laser welding is used as the welding method. However, this is not limiting, and welding using a soldering iron may also be used.

[0084] During laser welding, the first to third connecting pins 301 to 303 are irradiated with laser light of a specified wavelength to heat them. A wire of soldering material then comes into contact with each of the first to third connecting pins 301 to 303 to melt, and the molten solder forms a fillet around each of the first to third connecting pins 301 to 303. The first to third connecting pins 301 to 303 are welded individually, but they can also be welded simultaneously.

[0085] For example, an infrared laser with a wavelength of 800 to 1000 nm can be used as the laser of the specified wavelength. The laser can be continuous light or pulsed light. The soldering material can include flux. When the solder melts, the flux removes oxides formed on the surfaces of the objects being joined. This ensures excellent solderability.

[0086] This embodiment prevents heat generated by laser light irradiating the third connecting pin 303 from spreading widely across the bottom 51 of the shielding case 50 when soldering the third connecting pin 303 to the shielding case 50, because the heat storage portion 510, which includes a plurality of slits 511, is disposed around the third hole 503 through which the third connecting pin 303 passes. This facilitates the soldering operation of the third connecting pin 303. Furthermore, since the opening included in the flexible wiring substrate 40 and exposing the heat storage portion 510 to the outside is formed in an elliptical or oblong shape, the molten solder material wets and spreads throughout the entire opening 403. This enables the stable formation of a solder joint with a desired joint strength.

[0087] Furthermore, this embodiment provides a plurality of third connection pins 303 that electrically connect the shielding terminals 32 of the external connector 30 to the shielding shell 50, thereby enabling the shielding shell 50 to be stably connected to the ground potential. This makes it possible to obtain a desired shielding effect.

[0088] Furthermore, since the third connection pins 303 are symmetrically arranged with respect to the first connection pins 301, heat distribution in the shield case 50 can be made uniform when soldering the third connection pins 303. This makes it possible to reduce the heat load acting on the first connection pins 301 (signal lines).

[0089] <Other embodiments>

[0090] In the above embodiment, the heat storage unit 510 including a specific heat storage function is formed by providing a plurality of slits 511 around the third hole 503 of the shielding shell 50, but the heat storage unit 510 is not limited thereto. Figure 6 As shown in FIG, the heat storage portion 510 may be formed by a recess 512 formed annularly around the third hole 503. Since the recess 512 forms a thin wall portion locally at the bottom of the shield case 50, heat can be prevented from diffusing from the inner circumference to the outer circumference of the recess 512.

[0091] In addition, if Figure 7 As shown in FIG, the heat storage portion 510 can be formed by a heat transfer layer 513 locally provided around the third hole 503. The heat transfer layer 513 is made of a material having a higher thermal conductivity than the metal material of the bottom 51 of the shielding case 50. This makes it possible to obtain an effect similar to that described above. The heat transfer layer 513 is not particularly limited and can be, for example, a metal sheet or a metal plating layer.

[0092] <Modification>

[0093] The technology according to the present disclosure can be applied to various products. For example, the technology according to the present disclosure can be provided as a sensor module mounted on one of various types of mobile objects, such as vehicles, electric vehicles, hybrid electric vehicles, motorcycles, bicycles, personal mobile devices, aircraft, drones, ships, robots, construction machinery, and agricultural machinery (tractors).

[0094] In addition, in the above embodiment, a camera module has been described as an example of the sensor module 100. However, the present technology is not limited thereto. For example, the present technology can also adopt a sensor module that includes a ranging sensor such as a light detection and ranging (LiDAR) or a time-of-flight (ToF) sensor as a sensor element.

[0095] Note that the present technology can also adopt the following configurations.

[0096] (1) A sensor module comprising:

[0097] case;

[0098] a sensor substrate including a sensor element and arranged in the housing;

[0099] an external connector, disposed on the housing;

[0100] a flexible wiring substrate electrically connecting the sensor substrate and the external connector, the flexible wiring substrate including a signal line and a ground line; and

[0101] A metal shielding shell includes a bottom portion and a peripheral portion, wherein the bottom portion is arranged between the flexible wiring substrate and the external connector, and the peripheral portion covers the periphery of the sensor substrate.

[0102] The external connector includes a first connection pin connected to the signal line, a second connection pin connected to the ground line, and a third connection pin connected to the bottom of the shielding shell,

[0103] The bottom includes a first hole, a second hole, a third hole, and a heat storage portion, the first hole being a hole through which the first connecting pin passes, the second hole being a hole through which the second connecting pin passes, and the third hole being a hole through which the third connecting pin passes, the heat storage portion being arranged around the third hole and covered by a welding material, the welding material being used to join the third connecting pin to the bottom.

[0104] (2) The sensor module according to (1), wherein

[0105] The flexible wiring substrate further includes a base material end portion that supports the signal line and the ground line and is arranged in the bottom portion,

[0106] The end portion of the substrate includes an opening, the third connecting pin passes through the opening, and the opening area of ​​the opening is larger than the opening area of ​​the third hole; and

[0107] The heat storage portion is provided in a region facing the opening.

[0108] (3) The sensor module according to (2), wherein

[0109] The heat storage portion includes a plurality of slits formed annularly around the third hole.

[0110] (4) The sensor module according to (2), wherein

[0111] The heat storage portion includes a recessed portion formed annularly around the third hole.

[0112] (5) The sensor module according to (2), wherein

[0113] The heat storage portion includes a heat transfer layer made of a metal material having a higher thermal conductivity than the bottom portion.

[0114] (6) The sensor module according to any one of (2) to (5), wherein

[0115] The third connecting pin is arranged to be offset from the center of the opening.

[0116] (7) The sensor module according to any one of (2) to (6), wherein

[0117] The opening is formed in a circular shape or an elliptical shape.

[0118] (8) The sensor module according to any one of (1) to (7), wherein

[0119] The third connecting pin includes a plurality of connecting pins, and

[0120] The opening includes a plurality of openings provided corresponding to the plurality of connection pins.

[0121] (9) The sensor module according to (8), wherein

[0122] The plurality of connecting pins are symmetrically arranged with respect to the first connecting pin.

[0123] (10) The sensor module according to any one of (1) to (9), wherein

[0124] The sensor element is a solid-state imaging element.

[0125] (11) The sensor module according to any one of (1) to (10), wherein

[0126] The sensor module is mountable to a vehicle.

[0127] Reference Signs List

[0128] 10 Housing

[0129] 11 front housing

[0130] 12 rear housing

[0131] 20 sensor substrate

[0132] 24 solid-state imaging elements (sensor elements)

[0133] 30 External connectors

[0134] 31 signal terminal

[0135] 32 ground terminal

[0136] 40 Flexible wiring substrate

[0137] 41, 42 substrate ends

[0138] 50 shielding shell

[0139] 51 bottom

[0140] 52 weeks facial

[0141] 100 sensor modules

[0142] 301 First connection pin

[0143] 302 Second connection pin

[0144] 303 Third connection pin

[0145] 310 heat storage unit

[0146] 311 Slit

[0147] 312 recess

[0148] 313 heat transfer layer

[0149] 401 signal line

[0150] 402 ground wire

[0151] 501 First Hole

[0152] 502 Second Hole

[0153] 503 Third Hole

Claims

1. An automotive sensor module, comprising: case; a sensor substrate including a sensor element and arranged in the housing; A first connector is provided on the housing; a second connector electrically connecting the sensor substrate and the first connector; and A metal shielding shell includes a bottom portion and a peripheral portion, wherein the bottom portion is arranged between the second connector and the first connector, and the peripheral portion covers the periphery of the sensor substrate. The first connector includes connection pins connected to the bottom of the shielding shell, The bottom portion includes a hole through which the connecting pin passes and a soldering portion surrounding the hole and at least a portion of which is covered with a soldering material for bonding the connecting pin to the bottom portion. The soldering portion has higher thermal conductivity than a low thermal conductivity portion located around the soldering portion.

2. The sensor module according to claim 1, wherein The first connector includes a first pin connected to a signal line of the second connector.

3. The sensor module according to claim 1, wherein The first connector further includes a second pin connected to a ground line of the second connector. The sensor module according to claim 1 , wherein The second connector is a signal line and a ground line. The sensor module according to claim 1 , wherein The second connector is a flexible wiring substrate. The sensor module according to claim 1 , wherein The second connector is a flexible wiring substrate.

7. The sensor module according to claim 1, wherein The first connector is an external connector provided on the rear housing.

8. The sensor module according to claim 4, wherein The flexible wiring substrate further includes a base material end portion that supports the signal line and the ground line and is arranged in the bottom portion, The end portion of the substrate includes an opening, the connecting pin passes through the opening, and the opening area of ​​the opening is larger than the opening area of ​​the hole, and The welding portion is provided in a region facing the opening.

9. The sensor module according to claim 1, wherein The low thermal conductivity portion includes a plurality of slits annularly formed around the hole.

10. The sensor module according to claim 1, wherein The low thermal conductivity portion includes a recess formed annularly around the hole.

11. The sensor module according to claim 8, wherein The welding portion includes a heat transfer layer made of a metal material having a higher thermal conductivity than that of the bottom portion.

12. The sensor module according to claim 8, wherein The connecting pins are arranged to be offset from the center of the opening.

13. The sensor module according to claim 8, wherein The opening is formed in a circular shape or an elliptical shape.

14. The sensor module according to claim 8, wherein The connecting pins include a plurality of third pins, and The opening includes a plurality of openings respectively provided to correspond to the third pins of the plurality of connecting pins.

15. The sensor module according to claim 14, wherein The first connector includes a first pin connected to a signal line of the second connector.

16. The sensor module according to claim 15, wherein A third pin among the plurality of connecting pins is symmetrically arranged with respect to the first pin.

17. The sensor module according to claim 1, wherein The sensor element is a solid-state imaging element.

18. The sensor module according to claim 1, wherein The sensor module is mountable to a vehicle.

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