Microphone and electronic equipment

Abstract

The invention provides a microphone and an electronic device. The microphone comprises a substrate, a sound hole arranged on the substrate, and an MEMS chip covering the sound hole. A conduction cavity is arranged in the substrate, the sound holes comprise a first sound hole and a second sound hole, one side of the conduction cavity is conducted with the outside through the first sound hole, and the other side of the conduction cavity is conducted with the MEMS chip through the second sound hole; the MEMS chip is conducted with the outside through the second sound hole, the conduction cavity and the first sound hole in sequence; a partition assembly is arranged in the communicating cavity and used for shunting and buffering air flow entering the communicating cavity. According to the invention, the airflow impact resistance of the microphone can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic products, and more particularly, to a microphone and electronic equipment. Background Art

[0002] As electronic products like mobile phones and laptops continue to shrink in size, people's performance requirements for these portable electronic products are also increasing. Consequently, they are demanding smaller electronic components while improving performance and consistency. Microphones integrated using MEMS (Micro Electro Mechanical System) technology are beginning to be widely adopted in various electronic products. Their smaller package size compared to traditional microphones has made them popular.

[0003] In electronic products, MEMS microphones have become the first choice for mid-to-high-end portable smart electronic devices. In order to meet the increasingly high performance requirements of electronic products, microphones are usually required to have functions such as waterproof, dustproof and airflow impact resistance, and have high performance, lightweight and high reliability in harsh environments.

[0004] Currently, conventional microphones usually have a sound hole set on the PCB, and the MEMS chip is directly set on the sound hole. This structure will cause the airflow to enter the microphone through the sound hole and directly impact the MEMS diaphragm. It may even cause the diaphragm to rupture under the impact of strong airflow, causing the microphone to fail. Summary of the Invention

[0005] In view of the above problems, the purpose of the present invention is to provide a microphone and an electronic device to solve the problems that the existing microphone chip is easily damaged by airflow impact, thereby affecting the performance of the microphone.

[0006] The microphone provided by the present invention comprises a substrate, a sound hole provided on the substrate, and a MEMS chip covering the sound hole;

[0007] A conductive cavity is provided in the substrate, the acoustic holes include a first acoustic hole and a second acoustic hole, one side of the conductive cavity is connected to the outside through the first acoustic hole, and the other side is connected to the MEMS chip through the second acoustic hole;

[0008] The MEMS chip is connected to the outside world through the second sound hole, the conductive cavity and the first sound hole in sequence;

[0009] A partition component is provided in the conducting cavity, and the partition component is used to divert and buffer the airflow entering the conducting cavity.

[0010] In addition, an optional technical solution is that the first sound hole and the second sound hole each include at least one microhole; and in a direction perpendicular to the substrate, the first sound hole and the second sound hole are staggered with each other.

[0011] In addition, an optional technical solution is that, in a direction parallel to the substrate, the width of the conductive cavity is greater than the horizontal distance between the first sound hole and the second sound hole, so as to form a shunt buffer zone at both ends of the conductive cavity.

[0012] In addition, an optional technical solution is that the partition component is provided on the upper side wall of the conducting cavity where the first sound hole is provided;

[0013] Alternatively, the partition assembly is provided on the lower side wall of the conducting cavity where the second sound hole is provided;

[0014] Alternatively, the partition assembly is provided on both the upper side wall and the lower side wall.

[0015] In addition, an optional technical solution is that when the partition assembly is arranged on the upper side wall or the lower side wall, the partition assembly includes at least one stopper, and when the partition assembly includes multiple stoppers, the multiple stoppers are spaced apart from each other.

[0016] In addition, an optional technical solution is that when the partition assembly is arranged on the upper side wall and the lower side wall, the partition assembly includes at least one upper stop block arranged on the upper side wall and at least one lower stop block arranged on the lower side wall, and the upper stop blocks and the lower stop blocks are staggered with each other.

[0017] In addition, an optional technical solution is that when the partition assembly is arranged on the upper side wall and the lower side wall, the partition assembly includes an upper retaining wall arranged on the upper side wall and a lower retaining wall arranged on the lower side wall;

[0018] In a direction parallel to the base plate, the upper retaining wall and the lower retaining wall are spaced apart from each other and overlap with each other, and an "N"-shaped channel is formed between the upper retaining wall and the lower retaining wall.

[0019] In addition, an optional technical solution is that the upper retaining wall and the lower retaining wall are arranged across the width of the conductive cavity.

[0020] In addition, an optional technical solution is that the partition component is distributed between the first sound hole and the second sound hole.

[0021] Corresponding to the above-mentioned microphone, the present invention further provides an electronic device, comprising the above-mentioned microphone.

[0022] Using the above-mentioned microphone and electronic equipment, a conductive cavity is set in the substrate, and the MEMS chip is connected to the outside world through the sound holes on both sides of the conductive cavity, which can prevent the external airflow from directly impacting the MEMS chip; at the same time, a partition component is set in the conductive cavity, and the airflow entering the conductive cavity is further diverted and buffered by the partition component, thereby improving the microphone's ability to resist strong airflow impact and ensuring the stability and reliability of the microphone performance.

[0023] In order to achieve the above and related purposes, one or more aspects of the present invention include the features that will be described in detail later. The following description and the accompanying drawings describe some exemplary aspects of the present invention in detail. However, these aspects indicate only some of the various ways in which the principles of the present invention can be used. In addition, the present invention is intended to include all of these aspects and their equivalents. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] By referring to the following description in conjunction with the accompanying drawings, and with a more complete understanding of the present invention, other objects and results of the present invention will become more clear and easy to understand. In the accompanying drawings:

[0025] Figure 1 Schematic diagram of the structure of a microphone according to embodiment 1 of the present invention;

[0026] Figure 2 A schematic diagram of the structure of a microphone according to the second embodiment of the present invention;

[0027] Figure 3 FIG. 4 is a schematic diagram of the structure of a microphone according to Embodiment 3 of the present invention.

[0028] The reference numerals include: substrate 1, housing 2, ASIC chip 3, electrical connection line 4, MEMS chip 5, partition assembly 6, block 61, upper block 62, lower block 63, lower block wall 64, upper block wall 65, second sound hole 71, first sound hole 72, and conductive cavity 8.

[0029] The same reference numerals throughout the drawings indicate similar or corresponding features or functions. DETAILED DESCRIPTION

[0030] In the following description, for illustrative purposes, numerous specific details are set forth to provide a comprehensive understanding of one or more embodiments. However, it will be apparent that the embodiments may be practiced without these specific details. In other instances, well-known structures and devices are shown in block diagram form to facilitate description of one or more embodiments.

[0031] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0032] It should be noted that the terms "first", "second", etc. in the description and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way are interchangeable where appropriate so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or server that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0033] In order to solve the problem that existing microphones have poor ability to resist airflow impact, which easily leads to product failure, the present invention provides a microphone and electronic equipment, in which a conducting cavity is arranged in a substrate, and sound hole structures are respectively arranged on both sides of the conducting cavity, so that the MEMS chip is connected to the outside world through the sound holes on both sides of the conducting cavity, which can avoid direct impact of external airflow on the MEMS chip; at the same time, a partition component is arranged in the conducting cavity, and the airflow entering the conducting cavity is further diverted and buffered by the partition component, thereby improving the microphone's ability to resist strong airflow impact and meeting application needs with higher requirements for products.

[0034] To describe the microphone and electronic device of the present invention in detail, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0035] Figures 1 to 3 Schematic structures of microphones according to three embodiments of the present invention are shown respectively.

[0036] like Figures 1 to 3As shown together, the microphone implemented in the present invention includes a substrate 1, a sound hole arranged on the substrate 1, and a MEMS chip 5 covering the sound hole. In order to prevent the external airflow from directly passing through the sound hole and causing impact on the MEMS chip 5, the sound hole further includes a first sound hole 72 and a second sound hole 71. At the same time, a conductive cavity 8 is provided in the substrate 1. One side of the conductive cavity 8 is connected to the outside world through the first sound hole 72, and the other side is connected to the MEMS chip 5 through the second sound hole 71, so that the MEMS chip 5 is connected to the outside world through the second sound hole 71, the conductive cavity 8 and the first sound hole 72 in turn; in addition, a partition component 6 is also provided in the conductive cavity 8, and the airflow entering the conductive cavity 8 is diverted and buffered by the partition component 6, thereby further improving the microphone's ability to resist airflow impact.

[0037] Among them, the first sound hole 72 and the second sound hole 71 can be set as a single-hole structure respectively, but in order to achieve better anti-airflow impact effect, the first sound hole 72 and the second sound hole 71 can also adopt a multi-micropore structure, that is, the first sound hole 72 and the second sound hole 71 respectively include at least one micropore; and in the direction perpendicular to the substrate 1, the first sound hole 72 and the second sound hole 71 are staggered with each other, so as to prevent the airflow in the conductive cavity 8 from directly impacting the MEMS chip 5.

[0038] In addition, the size of the conductive cavity 8 arranged in the substrate 1 can be flexibly set according to the size of the microphone and the chip to be protected, but in the direction parallel to the substrate 1, the width of the conductive cavity 8 can be made larger than the horizontal distance between the first sound hole 72 and the second sound hole 71, thereby forming a diversion buffer zone at both ends of the conductive cavity 8, that is, a diversion buffer zone A is formed on the left side of the conductive cavity 8, and a diversion buffer zone B is formed on the right side of the conductive cavity 8. After the external airflow enters the conductive cavity 8 through the first sound hole 72, a part of the airflow will be diverted to the diversion buffer zone B, and a part of the airflow after passing through the partition component 6 will enter the diversion buffer zone A, thereby achieving a multi-directional airflow buffering effect.

[0039] In the microphone structure of the embodiment of the present invention, the function of the partition component 6 is mainly to isolate and buffer the airflow in and out of the conductive cavity 8 to a certain extent. Therefore, the partition component 6 can be set at multiple positions in the conductive cavity 8. For example, the partition component 6 can be set on the upper side wall of the conductive cavity 8 where the first sound hole 72 is provided; or, the partition component 6 is set on the lower side wall of the conductive cavity 8 where the second sound hole 71 is provided; or, the partition component 6 is set on both the upper side wall and the lower side wall, etc., and the partition component 6 can adopt a block, a baffle or other structural parts that can play the role of blocking and diverting the airflow.

[0040] Specifically, in Figure 1In the first embodiment shown, the partition assembly 6 is arranged on the upper side wall or the lower side wall of the conducting cavity 8, and the partition assembly 6 includes at least one block 61. When the partition assembly 6 includes multiple blocks 61, the multiple blocks 61 are spaced apart from each other. In addition, the height of each block 61 can be set to be the same, or it can be set to a stepped height distribution according to the distance between the block 61 and the second sound hole 71, thereby buffering the airflow entering the first sound hole 72 step by step.

[0041] exist Figure 2 In the second embodiment shown, the partition assembly 6 is arranged on the upper side wall and the lower side wall of the conductive cavity 8, and the partition assembly 6 may include at least one upper block 62 arranged on the upper side wall and at least one lower block 63 arranged on the lower side wall. The upper blocks 62 and the lower blocks 63 are staggered with each other. The distribution area of ​​the upper blocks 62 and the lower blocks 63 can be set on the path of the airflow from the first sound hole 72 to the second sound hole 71, and can be set to a distribution method of multiple rows and columns.

[0042] exist Figure 3 In the third embodiment shown, the partition assembly 6 is disposed on the upper and lower sidewalls of the conductive cavity 8, and the partition assembly 6 includes an upper retaining wall 65 disposed on the upper sidewall and a lower retaining wall 64 disposed on the lower sidewall. The retaining wall structure can be provided in one or more groups, wherein the upper retaining walls 65 and the lower retaining walls 64 are spaced apart from each other and overlap in a direction parallel to the substrate 1, forming an "N"-shaped channel between the upper retaining walls 65 and the lower retaining walls 64. In this embodiment, the upper retaining walls 65 and the lower retaining walls 64 are disposed across the width of the conductive cavity 8, that is, in a direction perpendicular to the direction shown in the accompanying drawings, the width of the upper retaining walls 65 and the lower retaining walls 64 is the same as the width of the conductive cavity 8, so that airflow can only be conducted through the "N"-shaped channel between them.

[0043] It can be seen that in the above-mentioned embodiments of the present invention, no matter whether the partition component 6 is set on the upper side wall, the lower side wall, or on both the upper side wall and the lower side wall, it is necessary to ensure that the partition component 6 is distributed on the air flow path between the first sound hole 72 and the second sound hole 71; in addition, the partition component 6 can be set in a manner of being integrally formed with the substrate 1.

[0044] In another specific embodiment of the present invention, the microphone further includes a housing 2 disposed on a substrate 1 , and an ASIC chip 3 electrically connected to the MEMS chip 5 via an electrical connection line 4 , wherein the ASIC chip 3 is electrically connected to the substrate 1 .

[0045] Corresponding to the aforementioned microphone, the present invention further provides an electronic device including the aforementioned microphone, wherein the conductive cavity can be positioned at various locations in the microphone where airflow buffering is required, and is not limited to the location of the MEMS chip shown in the accompanying drawings. It should be noted that the embodiments of the aforementioned electronic device can be referenced with the description of the aforementioned microphone embodiment, and will not be detailed here.

[0046] According to the microphone and electronic device of the present invention, a conductive cavity structure is provided in the substrate, and the MEMS chip is connected to the outside world through the sound holes on both sides of the conductive cavity, which can prevent the external airflow from directly impacting the MEMS chip; at the same time, a partition component is provided in the conductive cavity, and the airflow entering the conductive cavity is further diverted and buffered in multiple directions through the partition component, thereby preventing the airflow from directly impacting the diaphragm of the MEMS chip, thereby improving the microphone's ability to resist strong airflow impact.

[0047] The microphone and electronic device according to the present invention are described above by way of example with reference to the accompanying drawings. However, those skilled in the art will appreciate that various modifications may be made to the microphone and electronic device described above without departing from the scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A microphone comprising a substrate, an acoustic hole provided on the substrate, and a MEMS chip covering the acoustic hole; characterized in that: A conductive cavity is provided in the substrate, the acoustic holes include a first acoustic hole and a second acoustic hole, one side of the conductive cavity is connected to the outside through the first acoustic hole, and the other side is connected to the MEMS chip through the second acoustic hole; The MEMS chip is connected to the outside world through the second sound hole, the conductive cavity and the first sound hole in sequence; A partition component is provided in the conducting cavity, and the partition component is used to divert and buffer the airflow entering the conducting cavity.

2. The microphone according to claim 1, wherein The first sound hole and the second sound hole each include at least one microhole; and in a direction perpendicular to the substrate, the first sound hole and the second sound hole are staggered with each other.

3. The microphone according to claim 1, wherein In a direction parallel to the substrate, the width of the conductive cavity is greater than a horizontal distance between the first sound hole and the second sound hole, so as to form a shunt buffer zone at both ends of the conductive cavity.

4. The microphone according to claim 1, wherein The partition assembly is arranged on the upper side wall of the conducting cavity where the first sound hole is arranged; Alternatively, the partition assembly is provided on the lower side wall of the conducting cavity where the second sound hole is provided; Alternatively, the partition assembly is provided on both the upper side wall and the lower side wall.

5. The microphone according to claim 4, characterized in that When the partition assembly is arranged on the upper side wall or the lower side wall, the partition assembly includes at least one stopper, and when the partition assembly includes a plurality of stoppers, the plurality of stoppers are spaced apart from each other.

6. The microphone according to claim 4, characterized in that When the partition assembly is arranged on the upper side wall and the lower side wall, the partition assembly includes at least one upper stopper arranged on the upper side wall and at least one lower stopper arranged on the lower side wall, and the upper stoppers and the lower stoppers are staggered with each other.

7. The microphone according to claim 4, characterized in that When the partition assembly is arranged on the upper side wall and the lower side wall, the partition assembly includes an upper retaining wall arranged on the upper side wall and a lower retaining wall arranged on the lower side wall; In a direction parallel to the base plate, the upper retaining wall and the lower retaining wall are spaced apart from each other and overlapped, and an "N"-shaped channel is formed between the upper retaining wall and the lower retaining wall.

8. The microphone according to claim 7, wherein The upper retaining wall and the lower retaining wall are arranged across the width of the conducting cavity.

9. The microphone according to claim 1, wherein The partition assembly is distributed between the first sound hole and the second sound hole.

10. An electronic device, characterized in that: Comprising the microphone according to any one of claims 1 to 9.

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