Heat dissipation structure combining vapor chamber and heat pipe and manufacturing method of heat dissipation structure

Abstract

The invention relates to a heat dissipation structure combining a uniform temperature plate and a heat pipe and a manufacturing method thereof.The heat dissipation structure comprises the uniform temperature plate, the heat pipe and working fluid, the uniform temperature plate comprises an upper shell, a lower shell and a first capillary structure, the lower shell is hermetically connected and sealed corresponding to the upper shell, the first capillary structure is laid on the inner surface of the upper shell, and a containing cavity is formed between the upper shell and the lower shell; the upper shell is provided with a through hole communicated with the accommodating cavity, and the first capillary tissue is provided with a through hole corresponding to the through hole; the heat pipe comprises a pipe body penetrating through the through hole in a sealing mode and a second capillary structure laid on the inner surface of the pipe body, a through groove is formed in the position, corresponding to the through hole, of the pipe body, and the second capillary structure is provided with an exposed section exposed out of the through groove; the working fluid is filled in the accommodating cavity; wherein the diameter of the inner edge of the through hole is smaller than that of the inner edge of the through hole, and the first capillary structure is embedded into the through groove to be attached to the exposed section. The manufacturing method can improve the manufacturing easiness and is suitable for large-scale rapid production.

Description

Technical Field

[0001] The present invention relates to a heat dissipation structure and a manufacturing method thereof, and more particularly to a heat dissipation structure combining a vapor chamber and a heat pipe and a manufacturing method thereof. Background Art

[0002] As the computing speeds of electronic components continue to increase, the heat they generate is also increasing. To effectively address this high heat generation problem, the industry has widely adopted heat pipes and vapor chambers, which have excellent thermal conductivity properties. Although heat pipes can ensure consistent flow of the gaseous working fluid within them, their limited volume limits the amount of heat they can conduct. Vapor chambers, on the other hand, although they have a large heating surface area that provides direct contact with the heat source for conduction, the flow of the gaseous working fluid is quite turbulent, thus limiting their heat dissipation efficiency.

[0003] To address these issues, the industry has combined heat pipes and vapor chambers to form a thermally conductive structure. The process steps are as follows: First, one shell of the vapor chamber is welded to the heat pipe. Next, a core rod is inserted and filled with metal powder, then sintered in a heating device. Finally, the core rod is removed from the heat pipe and sealed to the other shell of the vapor chamber, completing the thermally conductive structure.

[0004] However, while existing heat-conducting structures are effective in dissipating heat, they suffer from the following issues: Their complex manufacturing process makes them unsuitable for mass production. Furthermore, because the core rod extends into the bottom (closed) end of the heat pipe, it is difficult to remove from the heat pipe after sintering. Furthermore, the core rod adheres extensively to the capillary structure, making it prone to damage or cracking during extraction. This, in turn, results in low product yields, a problem that urgently needs improvement. Summary of the Invention

[0005] The present invention aims to provide a heat dissipation structure combining a vapor chamber and a heat pipe and a manufacturing method thereof. The vapor chamber and the heat pipe are manufactured separately and then the heat pipe is directly plugged into the vapor chamber, thereby improving the ease of manufacturing and being suitable for large-scale rapid production.

[0006] In an embodiment of the present invention, a heat dissipation structure combining a vapor chamber and a heat pipe is provided, comprising: a vapor chamber comprising an upper shell, a lower shell tightly sealed to the upper shell, and a first capillary structure laid on the inner surface of the upper shell, wherein a cavity is formed between the upper shell and the lower shell, the upper shell is provided with a through hole communicating with the cavity, and the first capillary structure has a through hole formed at a position corresponding to the through hole; a heat pipe comprising a tube body penetrating and sealed to the through hole and a second capillary structure laid on the inner surface of the tube body, the tube body having a hollow groove formed at a position corresponding to the through hole, the second capillary structure having an exposed section exposed to the hollow groove; and a working fluid filled in the cavity; wherein the inner edge diameter of the through hole is smaller than the inner edge diameter of the through hole, and the first capillary structure is embedded in the hollow groove and in contact with the exposed section.

[0007] In an embodiment of the present invention, the hollow groove is formed by peeling or scraping the skin of the tube body.

[0008] In an embodiment of the present invention, the first capillary structure and the second capillary structure are respectively a metal woven mesh or a combination of a metal woven mesh and a powder sintered body.

[0009] In the embodiment of the present invention, the tube body has a bottom edge, and there is a distance between the lower edge of the opening of the hollow slot and the bottom edge.

[0010] In an embodiment of the present invention, the lower shell has a plurality of protrusions extending toward the cavity, and the tube body has a bottom edge that abuts against the tops of the plurality of protrusions.

[0011] In an embodiment of the present invention, the hollow groove is an annular hollow groove arranged along the entire circumference of the tube body.

[0012] In an embodiment of the present invention, the hollow groove is a C-shaped hollow groove arranged along a partial circumference of the tube body.

[0013] In an embodiment of the present invention, a method for manufacturing a heat dissipation structure combining a vapor chamber and a heat pipe is provided, comprising: A) preparing an upper housing, processing the upper housing to form a through-hole; B) preparing a first capillary structure, the first capillary structure having a through-hole corresponding to the through-hole, the inner diameter of the through-hole being smaller than the inner diameter of the through-hole; C) laying the first capillary structure on the surface of the upper housing, and aligning the through-hole with the through-hole; D) preparing a lower housing, sealing the upper housing with the through-hole, and A cavity is formed between the upper shell and the lower shell; E) a heat pipe is prepared, the heat pipe having a tube body and a second capillary structure arranged on the inner surface of the tube body, a hollow groove is formed in the tube body, and the second capillary structure has an exposed section exposed in the hollow groove; F) the heat pipe is penetrated and sealed corresponding to the through hole, and the exposed section is arranged corresponding to the through hole so that the first capillary structure is embedded in the hollow groove and in contact with the exposed section; and G) the semi-finished product after step F) is subjected to a liquid filling and a degassing sealing process.

[0014] Based on the above, the first capillary structure can be embedded in the hollow groove and attached to the exposed section, allowing the gaseous working fluid to enter the tube body for heat dissipation. The cooled liquid working fluid then flows through the second capillary structure and the exposed section to the first capillary structure for recycling, thereby achieving excellent heat dissipation efficiency of the heat dissipation structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 The figure is a flow chart of the method for manufacturing the heat dissipation structure of the present invention.

[0016] Figure 2 It is a three-dimensional exploded view of the heat dissipation structure of the present invention.

[0017] Figure 3 It is a cross-sectional exploded view of the heat dissipation structure of the present invention.

[0018] Figure 4 It is a three-dimensional combination diagram of the heat dissipation structure of the present invention.

[0019] Figure 5 It is a cross-sectional combined view of the heat dissipation structure of the present invention.

[0020] Figure 6 This is a perspective exploded view of another embodiment of the heat dissipation structure of the present invention.

[0021] In the picture: 10: Heat dissipation structure; 1: Vaporizing plate; 11: Upper shell; 111: Perforation; 12: Lower shell; 121: Boss; 13: First capillary structure; 131: Through hole; 2: Heat pipe; 21: Tube body; 211: Hollow groove; 212: Bottom edge; 213: Annular hollow groove; 214: C-shaped hollow groove; 22: Second capillary structure; 221: Exposed section; 3: Third capillary structure; H: Spacing; S: Cavity; Steps A to G. DETAILED DESCRIPTION

[0022] The present invention will be further described below with reference to the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it. However, the embodiments are not intended to limit the present invention.

[0023] Please refer to Figures 1 to 5 As shown, the present invention provides a heat dissipation structure combining a temperature vapor chamber and a heat pipe and a manufacturing method thereof. The heat dissipation structure 10 mainly includes a temperature vapor chamber 1, a heat pipe 2 and a working fluid.

[0024] like Figure 1 As shown, the steps of the manufacturing method of the heat dissipation structure 10 of the present invention are as follows: first, Figure 1 Step A and Figures 2 to 3 As shown, an upper shell 11 is prepared, and one or more through holes 111 are formed on the upper shell 11. The number of through holes 111 can be selected according to actual needs. For a micro radiator, a single through hole 111 can also be provided.

[0025] Second, if Figure 1 Step B and Figures 2 to 3 As shown, a first capillary structure 13 is prepared and punched using a forming die (not shown) to form one or more through holes 131 in the first capillary structure 13. Each through hole 131 corresponds to a position of a perforation 111, and the inner diameter of each through hole 131 is smaller than the inner diameter of each perforation 111. The first capillary structure 13 is a metal woven mesh or a combination of a metal woven mesh and a powder sintered body.

[0026] Third, if Figure 1 Step C and Figures 2 to 3 As shown, the first capillary structure 13 is laid on the surface of the upper shell 11, with the through-hole 131 aligned with the through-hole 111. As described in detail below, this step involves aligning the through-hole 131 of the first capillary structure 13 with the through-hole 111 of the upper shell 11 and firmly bonding the first capillary structure 13 to the inner surface of the upper shell 11 through welding or fixing.

[0027] Fourth, if Figure 1 Step D and Figures 2 to 5 As shown, a lower shell 12 is prepared, which is tightly sealed to the upper shell 11 and has a plurality of protrusions 121 punched out, that is, the lower shell 12 extends toward the cavity S with a plurality of protrusions 121, and a cavity S is formed between the upper shell 11 and the lower shell 12, and each through hole 111 is connected to the cavity S.

[0028] In addition, the upper shell 11 and the lower shell 12 are tightly sealed together, for example by welding, to form a vapor chamber 1. In addition to the upper shell 11 and the lower shell 12, the vapor chamber 1 further includes a first capillary structure 13 laid on the inner surface of the upper shell 11 and a third capillary structure 3 laid on the inner surface of the lower shell 12. The third capillary structure 3 can be a powder sintered body, a metal woven mesh, a groove, or any combination of the foregoing. The top edge of the third capillary structure 3 will be in contact with the first capillary structure 13.

[0029] Fifth, if Figure 1 Step E and Figures 2 to 5 As shown, one or more heat pipes 2 are provided. The heat pipe 2 comprises a tube body 21 and a second capillary structure 22 laid on the inner surface of the tube body 21. The tube body 21 is peeled or scraped to form a hollow groove 211. The second capillary structure 22 has an exposed section 221 exposed in the hollow groove 211. The second capillary structure 22 is a metal woven mesh or a combination of a metal woven mesh and a powder sintered body.

[0030] The tube body 21 has a bottom edge 212 , and there is a distance H between the lower edge of the opening of the hollow groove 211 and the bottom edge 212 . In this embodiment, the hollow groove 211 is an annular hollow groove 213 arranged along the entire circumference of the tube body 21 , but this is not limiting.

[0031] Sixth, as Figure 1 Step F and Figures 2 to 5 As shown, each heat pipe 2 is inserted and sealed corresponding to each through-hole 111. The intersection of each heat pipe 2 and the vapor chamber 1 is sealed, for example, by welding. The bottom edge 212 of each tube body 21 is placed against the top of the plurality of protrusions 121. Because each hollow groove 211 is provided at a corresponding position to each through-hole 131, each exposed section 221 is positioned corresponding to each through-hole 131. In addition, the inner diameter of each through-hole 131 is smaller than the inner diameter of each through-hole. When the exposed section 221 of each heat pipe 2 is inserted into each through-hole 131, the first capillary structure 13 comprises a metal mesh, which causes the edge of the through-hole 131 to bend and deform before restoring, allowing the first capillary structure 13 to fit into each hollow groove 211 and adhere to each exposed section 221.

[0032] In addition, in this embodiment, the step of punching out the plurality of protrusions 121 on the lower shell 12 is performed before the step of tightly sealing the upper shell 11 and the lower shell 12, but this is not limiting. The step of punching out the plurality of protrusions 121 on the lower shell 12 can be performed after the step of tightly sealing the upper shell 11 and the lower shell 12, or after the step of passing through and sealing the corresponding through holes 111 of the heat pipe 2.

[0033] Seventh, such as Figure 1As shown in step G, the semi-finished product obtained in step F is subjected to a liquid filling and a degassing and sealing process, that is, the working fluid is filled into the cavity S through a liquid infusion and degassing pipe (not shown in the figure), and degassing, sealing and other processing steps are performed to complete the finished product of the heat dissipation structure 10 of the present invention.

[0034] Thus, the vapor chamber 1 and the heat pipe 2 are manufactured separately, and the heat pipe 2 is directly connected to the vapor chamber 1, thereby avoiding the problems of complicated manufacturing process and poor yield rate in the existing process, thereby improving the ease and yield rate of manufacturing the heat dissipation structure 10 and making it suitable for large-scale rapid production.

[0035] In addition, the first capillary structure 13 can be embedded in the hollow groove 211 and abut against the exposed section 221, allowing the gaseous working fluid to enter the tube body 21 for heat dissipation. The cooled liquid working fluid then flows sequentially through the second capillary structure 22, the exposed section 221, and the first capillary structure 13 to the third capillary structure 3 for recycling, thereby achieving excellent heat dissipation efficiency of the heat dissipation structure 10.

[0036] Furthermore, the lower shell 12 extends with a plurality of protrusions 121 that abut against the bottom edge 212 of the tube 21 , thereby increasing the structural strength of the vapor chamber 1 and eliminating the problem of the vapor chamber 1 being easily deformed under pressure, thereby enhancing the structural strength of the heat dissipation structure 10 .

[0037] like Figure 6 As shown, another embodiment of the heat dissipation structure 10 of the present invention, Figure 6 Examples and Figures 1 to 5 The embodiments are roughly the same, Figure 6 Examples and Figures 1 to 5 The embodiment of the present invention is different in that the hollow groove 211 is a C-shaped hollow groove 214 arranged along the partial circumference of the tube body 21, so as to achieve the same Figures 1 to 5 The functions and effects of the embodiments.

[0038] The above embodiments are merely preferred embodiments for the purpose of fully illustrating the present invention, and the scope of protection of the present invention is not limited thereto. Equivalent substitutions or modifications made by those skilled in the art based on the present invention are within the scope of protection of the present invention. The scope of protection of the present invention shall be subject to the claims.

Claims

1. A heat dissipation structure combining a temperature vapor chamber and a heat pipe, characterized in that: include: A temperature homogenizing plate, comprising an upper shell, a lower shell tightly sealed to the upper shell, and a first capillary structure arranged on the inner surface of the upper shell, wherein a cavity is formed between the upper shell and the lower shell, the upper shell is provided with a through hole communicating with the cavity, and the first capillary structure is provided with a through hole at a position corresponding to the through hole; A heat pipe comprising a tube body passing through and sealed to the through hole and a second capillary structure arranged on the inner surface of the tube body, wherein the tube body has a hollow groove formed at a position corresponding to the through hole, and the second capillary structure has an exposed section exposed in the hollow groove; and A working fluid is filled in the cavity; The inner diameter of the through hole is smaller than the inner diameter of the through hole, and the first capillary structure is embedded in the hollow groove and adhered to the exposed section.

2. The heat dissipation structure combining a vapor chamber and a heat pipe according to claim 1, wherein: The hollow groove is formed by peeling or scraping the skin of the tube body.

3. The heat dissipation structure combining a temperature vapor chamber and a heat pipe according to claim 1, wherein: The first capillary structure and the second capillary structure are respectively a metal woven mesh or a combination of a metal woven mesh and a powder sintered body.

4. The heat dissipation structure combining a temperature vapor chamber and a heat pipe according to claim 1, wherein: The tube body has a bottom edge, and there is a distance between the lower edge of the opening of the hollow slot and the bottom edge.

5. The heat dissipation structure combining a temperature vapor chamber and a heat pipe according to claim 1, wherein: The lower shell body is provided with a plurality of protruding columns extending toward the cavity. The tube body is provided with a bottom edge which abuts against the tops of the plurality of protruding columns.

6. The heat dissipation structure combining a temperature vapor chamber and a heat pipe according to claim 1, wherein: The hollow groove is an annular hollow groove arranged along the entire circumference of the tube body.

7. The heat dissipation structure combining a temperature vapor chamber and a heat pipe according to claim 1, wherein: The hollow groove is a C-shaped hollow groove arranged along the local circumference of the tube body.

8. A method for manufacturing a heat dissipation structure combining a temperature vapor chamber and a heat pipe, characterized in that: include: Step A) preparing an upper shell and forming a through hole in the upper shell; Step B) preparing a first capillary structure, wherein the first capillary structure has a through hole corresponding to the through hole, and the inner diameter of the through hole is smaller than the inner diameter of the through hole; Step C) laying the first capillary structure on the surface of the upper housing, and aligning the through hole with the perforated structure; Step D) preparing a lower housing, tightly sealed to the upper housing, and forming a cavity between the upper and lower housings; Step E) preparing a heat pipe, the heat pipe comprising a tube body and a second capillary structure disposed on the inner surface of the tube body, a hollow groove being formed in the tube body, and the second capillary structure having an exposed section exposed in the hollow groove; Step F) sealing the heat pipe corresponding to the through hole, and arranging the exposed section corresponding to the through hole so that the first capillary structure is embedded in the hollow groove and in contact with the exposed section; as well as Step G) performs a liquid filling and a degassing and sealing process on the semi-finished product obtained in step F).

9. The method for manufacturing a heat dissipation structure combining a temperature vapor chamber and a heat pipe according to claim 8, wherein: In step D), a plurality of protrusions are punched out of the lower shell, and in step F), the bottom edge of the tube is pressed against the tops of the plurality of protrusions.

10. The method for manufacturing a heat dissipation structure combining a temperature vapor chamber and a heat pipe according to claim 8, wherein: In step E), the tube body is peeled or scraped to form the hollow groove.

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