Lens assembly and electronic device including same

Abstract

A lens assembly and / or an electronic device including the lens assembly according to one embodiment of the present disclosure includes: an image sensor; an aperture; a first lens including a convex image-side surface while having a positive refractive power, and disposed between the aperture and the image sensor; a second lens having negative refractive power and disposed between the first lens and the image sensor; a third lens disposed between the second lens and the image sensor; a fourth lens disposed between the third lens and the image sensor; and a fifth lens including a concave image sensor side surface while having positive refractive power, and disposed between the fourth lens and the image sensor. In one embodiment, the lens assembly can be easily miniaturized by satisfying at least some of the conditions disclosed with respect to total lens length, image height, half field of view, and / or thickness of the first lens. Other various embodiments are possible.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to a lens assembly, for example, a lens assembly including a plurality of lenses and an electronic device including the lens assembly. Background Art

[0002] Optical devices (e.g., cameras capable of capturing images or videos) have become widely used, and digital cameras or video cameras having solid-state image sensors such as charge-coupled devices (CCDs) or complementary metal oxide semiconductors (CMOSs) have become common in recent years. Optical devices having solid-state image sensors (CCDs or CMOSs) have gradually replaced film-based optical devices because they allow for easier storage, copying, and movement of images than film-based optical devices.

[0003] Multiple optical devices (e.g., two or more selected from a macro camera, a telephoto camera, and / or a wide-angle camera) have recently been installed in a single electronic device to enhance the quality of captured images and impart various visual effects to the captured images. For example, images of an object can be obtained by multiple cameras having different optical characteristics and synthesized into a high-quality captured image. As electronic devices such as mobile communication terminals and smartphones are equipped with multiple optical devices (e.g., cameras) for obtaining high-quality captured images, these electronic devices are gradually replacing electronic devices dedicated to photographic functions (such as digital compact cameras) and are expected to replace high-performance cameras such as digital single-lens reflex cameras (DSLRs) in the future.

[0004] The above information is presented only as related art to assist in understanding the present disclosure. No determination has been made, and no assertion has been made, as to whether any of the above content may be used as prior art with respect to the present disclosure. Summary of the Invention

[0005] Technical Solution

[0006] According to an embodiment of the present disclosure, a lens assembly includes: an image sensor; an aperture stop; a first lens having positive refractive power, including a convex object-side surface, and disposed between the aperture stop and the image sensor; a second lens having negative refractive power and disposed between the first lens and the image sensor; a third lens disposed between the second lens and the image sensor; a fourth lens disposed between the third lens and the image sensor; and a fifth lens having positive refractive power, including a concave image sensor-side surface, and disposed between the fourth lens and the image sensor. In this embodiment, the lens assembly satisfies the following [Conditional Expression 1].

[0007] [Conditional expression 1]

[0008] 0.8 <TTL / (IH*tan(HFOV))<2

[0009] Among them, "TTL" can be the distance from the object surface of the first lens to the imaging plane of the image sensor measured along the optical axis, "IH" can be the maximum image height of the lens assembly, and "HFOV" can be the half field of view of the lens assembly.

[0010] According to an embodiment of the present disclosure, an electronic device includes: a lens assembly; and a processor configured to acquire an image of an object using the lens assembly. In an embodiment, the lens assembly includes: an image sensor; an aperture stop; a first lens having positive refractive power, including a convex object-side surface, and disposed between the aperture stop and the image sensor; a second lens having negative refractive power and disposed between the first lens and the image sensor; a third lens disposed between the second lens and the image sensor; a fourth lens disposed between the third lens and the image sensor; and a fifth lens having positive refractive power, including a concave image sensor-side surface, and disposed between the fourth lens and the image sensor. In an embodiment, the lens assembly satisfies the following [Conditional Expression 1].

[0011] [Conditional expression 1]

[0012] 0.8 <TTL / (IH*tan(HFOV))<2

[0013] Among them, "TTL" can be the distance from the object surface of the first lens to the imaging plane of the image sensor measured along the optical axis, "IH" can be the maximum image height of the lens assembly, and "HFOV" can be the half field of view of the lens assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The above and other aspects, features and / or advantages of the embodiments of the present disclosure may be apparent from the following detailed description in conjunction with the accompanying drawings.

[0015] Figure 1 is a block diagram illustrating electronic devices in a network environment according to an embodiment of the present disclosure.

[0016] Figure 2 is a block diagram illustrating a camera module according to an embodiment of the present disclosure.

[0017] Figure 3 is a front perspective view illustrating an electronic device according to an embodiment of the present disclosure.

[0018] Figure 4 is a rear perspective view illustrating an electronic device according to an embodiment of the present disclosure.

[0019] Figure 5 is a diagram illustrating a lens assembly according to an embodiment of the present disclosure.

[0020] Figure 6 The present invention is shown in FIG. Figure 5 A graph of the spherical aberration of a lens assembly.

[0021] Figure 7 The present invention is shown in FIG. Figure 5 A graph showing the astigmatism of a lens assembly.

[0022] Figure 8 The present invention is shown in FIG. Figure 5 A graph of the distortion of a lens assembly.

[0023] Figure 9 is a diagram illustrating a lens assembly according to an embodiment of the present disclosure.

[0024] Figure 10 The present invention is shown in FIG. Figure 9 A graph of the spherical aberration of a lens assembly.

[0025] Figure 11 The present invention is shown in FIG. Figure 9 A graph showing the astigmatism of a lens assembly.

[0026] Figure 12 The present invention is shown in FIG. Figure 9 A graph of the distortion of a lens assembly.

[0027] Figure 13 is a diagram illustrating a lens assembly according to an embodiment of the present disclosure.

[0028] Figure 14 The present invention is shown in FIG. Figure 13 A graph of the spherical aberration of a lens assembly.

[0029] Figure 15 The present invention is shown in FIG. Figure 13 A graph showing the astigmatism of a lens assembly.

[0030] Figure 16 The present invention is shown in FIG. Figure 13 A graph of the distortion of a lens assembly.

[0031] Figure 17 is a diagram illustrating a lens assembly according to an embodiment of the present disclosure.

[0032] Figure 18 The present invention is shown in FIG. Figure 17 A graph of the spherical aberration of a lens assembly.

[0033] Figure 19 The present invention is shown in FIG. Figure 17 A graph showing the astigmatism of a lens assembly.

[0034] Figure 20 The present invention is shown in the embodiment of the present invention. Figure 17 A graph of the distortion of a lens assembly.

[0035] Figure 21 is a diagram illustrating a lens assembly according to an embodiment of the present disclosure.

[0036] Figure 22 The present invention is shown in the embodiment of the present invention. Figure 21 A graph of the spherical aberration of a lens assembly.

[0037] Figure 23 The present invention is shown in FIG. Figure 21 A graph showing the astigmatism of a lens assembly.

[0038] Figure 24 The present invention is shown in FIG. Figure 21 A graph of the distortion of a lens assembly.

[0039] Figure 25 is a diagram illustrating a lens assembly according to an embodiment of the present disclosure.

[0040] Figure 26 The present invention is shown in the embodiment of the present invention. Figure 25 A graph of the spherical aberration of a lens assembly.

[0041] Figure 27 The present invention is shown in the embodiment of the present invention. Figure 25 A graph showing the astigmatism of a lens assembly.

[0042] Figure 28 The present invention is shown in FIG. Figure 25 A graph of the distortion of a lens assembly.

[0043] Figure 29 is a diagram illustrating a lens assembly according to an embodiment of the present disclosure.

[0044] Figure 30 The present invention is shown in FIG. Figure 29 A graph of the spherical aberration of a lens assembly.

[0045] Figure 31 The present invention is shown in the embodiment of the present invention. Figure 29 A graph showing the astigmatism of a lens assembly.

[0046] Figure 32The present invention is shown in FIG. Figure 29 A graph of the distortion of a lens assembly.

[0047] Throughout the drawings, like reference numbers may be assigned to like parts, components and / or structures. DETAILED DESCRIPTION

[0048] As described above, miniaturized electronic devices such as smart phones can obtain high-quality images by including multiple cameras or multiple lens assemblies. When multiple cameras are installed, it may be difficult to achieve consistency with the appearance of the electronic device. For example, since an optical path corresponding to each camera should be provided, the arrangement or size of the multiple optical holes may not conform to the external design specifications of the electronic device. By including a camera that is arranged to overlap with the display (or below the display) and / or a camera that is arranged parallel to one side of the display according to the electronic device, the user can make a video call or take a selfie. The camera arranged below the display can receive external light that passes through the display or the optical hole formed in a partial area of ​​the display. However, when receiving external light that passes through the display, it may be difficult for the camera to obtain an image of sufficiently good quality, and when an optical hole that penetrates a partial area of ​​the display is provided, the screen display area (e.g., the effective area) of the display may be reduced.

[0049] In order to at least solve the above problems and / or disadvantages and at least provide the advantages described below, embodiments of the present disclosure may provide a lens assembly and / or an electronic device including the lens assembly, which is one of a plurality of cameras arranged adjacent to each other and can be easily coordinated with the appearance of the electronic device.

[0050] Embodiments of the present disclosure may provide a lens assembly configured to overlap with a display while suppressing reduction in an active area of ​​the display, and / or an electronic device including the same.

[0051] The technical objectives to be achieved by the present disclosure are not limited to those described above, and other technical objectives not mentioned will be clearly understood by those skilled in the art from the following description.

[0052] The following description of the accompanying drawings can provide an understanding of various exemplary embodiments of the present disclosure, including the claims, and their equivalents. The exemplary embodiments disclosed in the following description include various specific details to aid understanding, but they are considered to be only one of the various exemplary embodiments. Therefore, it will be understood by those skilled in the art that various changes and modifications can be made to the various embodiments of the present disclosure without departing from the scope and spirit of the present disclosure. In addition, for the sake of clarity and conciseness, descriptions of well-known functions and configurations will be avoided.

[0053] The terms and words used in the following description and claims are not limited to their dictionary meanings, but are used to enable a clear and consistent understanding of the embodiments of the present disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various embodiments of the present disclosure is provided for illustrative purposes only and not for the purpose of limiting the present disclosure as defined by the appended claims and their equivalents.

[0054] It will be understood that the singular forms "a," "an," and "the" are intended to include plural referents unless the context clearly indicates otherwise. Thus, for example, reference to "a component surface" may include reference to one or more surfaces of the component.

[0055] Figure 1 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to an embodiment. Figure 1 , the electronic device 101 in the network environment 100 can communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or can communicate with at least one of the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 can communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a subscriber identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the above components (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the above-described components (eg, sensor module 176, camera module 180, or antenna module 197) may be implemented as a single component (eg, display module 160).

[0056] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component of the electronic device 101 connected to the processor 120 (e.g., a hardware component or a software component), and may perform various data processing or calculations. According to an embodiment, as at least part of the data processing or calculation, the processor 120 may store a command or data received from another component (e.g., the sensor module 176 or the communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resultant data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operationally independent of or combined with the main processor 121. For example, when the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121 or be adapted to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of the main processor 121.

[0057] When the main processor 121 is inactive (e.g., sleeping), the auxiliary processor 123 (rather than the main processor 121) may control at least some of the functions or states associated with at least one of the components of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190). Alternatively, when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 may work together with the main processor 121 to control at least some of the functions or states associated with at least one of the components of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190). Depending on the embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component functionally related to the auxiliary processor 123 (e.g., camera module 180 or communication module 190). Depending on the embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model may be generated through machine learning. For example, such learning may be performed by the electronic device 101 where the artificial intelligence is executed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q network or a combination of two or more thereof, but is not limited thereto. Additionally or alternatively, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0058] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134.

[0059] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0060] The input module 150 may receive commands or data from outside the electronic device 101 (e.g., a user) to be used by other components of the electronic device 101 (e.g., the processor 120). The input module 150 may include, for example, a microphone, a mouse, a keyboard, keys (e.g., buttons), or a digital pen (e.g., a stylus).

[0061] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. Depending on the embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0062] The display module 160 can visually provide information to the outside of the electronic device 101 (e.g., a user). The display module 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. Depending on the embodiment, the display module 160 may include a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the strength of the force caused by the touch.

[0063] The audio module 170 can convert sound into an electrical signal, and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0064] The sensor module 176 can detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a user's state) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. Depending on the embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0065] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 102). Depending on the embodiment, the interface 177 may include, for example, a High-Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital (SD) card interface, or an audio interface.

[0066] The connection end 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. Depending on the embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0067] The haptic module 179 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0068] The camera module 180 may capture still images or moving images. Depending on the embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

[0069] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0070] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0071] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., application processor (AP)) and support direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules may communicate via a first network 198 (e.g., a short-range communication network such as Bluetooth TM , Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (for example, a long-distance communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (for example, a LAN or a wide area network (WAN)))). These various types of communication modules may be implemented as a single component (for example, a single chip), or may be implemented as multiple components separated from each other (for example, multiple chips). The wireless communication module 192 may identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (for example, an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0072] The wireless communication module 192 can support 5G networks after 4G networks and next-generation communication technologies (e.g., new radio (NR) access technology). NR access technology can support enhanced mobile broadband (eMBB), massive machine type communication (mMTC), or ultra-reliable low-latency communication (URLLC). The wireless communication module 192 can support high-frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 192 can support various technologies for ensuring performance on high-frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 can support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., a second network 199). According to an embodiment, the wireless communication module 192 may support peak data rates for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane latency for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip).

[0073] Antenna module 197 can transmit or receive signals or power to or from the outside of electronic device 101 (e.g., an external electronic device). Depending on the embodiment, antenna module 197 may include an antenna comprising a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). Depending on the embodiment, antenna module 197 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for the communication scheme used in a communication network (such as first network 198 or second network 199) may be selected from the multiple antennas by, for example, communication module 190 (e.g., wireless communication module 192). Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. Depending on the embodiment, additional components other than the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may also be formed as part of antenna module 197.

[0074] According to various embodiments, antenna module 197 may form a millimeter wave antenna module. According to embodiments, the millimeter wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and multiple antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a specified high frequency band (e.g., millimeter wave band), and the multiple antennas are disposed on a second surface (e.g., top surface or side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals in the specified high frequency band.

[0075] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, general-purpose input output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0076] According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 or the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type than the electronic device 101. According to an embodiment, all or some operations to be executed on the electronic device 101 may be executed on one or more of the external electronic devices 102, 104, or 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices that receive the request may execute at least part of the function or service requested, or execute another function or service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request, with or without further processing the result. To this end, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology, or client-server computing technology, for example, may be used. The electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology or IoT-related technologies.

[0077] Figure 2 FIG is a block diagram 200 illustrating a camera module 280 according to various embodiments. Figure 2The camera module 280 may include a lens assembly 210, a flash 220, an image sensor 230, an image stabilizer 240, a memory 250 (e.g., a buffer memory), or an image signal processor 260. The lens assembly 210 may collect light emitted or reflected from an object whose image is to be captured. The lens assembly 210 may include one or more lenses. Depending on the embodiment, the camera module 280 may include multiple lens assemblies 210. In this case, the camera module 280 may form, for example, a dual camera, a 360-degree camera, or a spherical camera. Some of the multiple lens assemblies 210 may have the same lens properties (e.g., angle of view, focal length, autofocus, f-number, or optical zoom), or at least one lens assembly may have one or more lens properties that differ from those of another lens assembly. The lens assembly 210 may include, for example, a wide-angle lens or a telephoto lens.

[0078] The flash 220 can emit light, wherein the emitted light is used to enhance light reflected from an object. Depending on the embodiment, the flash 220 may include one or more light-emitting diodes (LEDs) (e.g., red, green, and blue (RGB) LEDs, white LEDs, infrared (IR) LEDs, or ultraviolet (UV) LEDs) or a xenon lamp. The image sensor 230 can capture an image corresponding to the object by converting light emitted from or reflected from the object and transmitted through the lens assembly 210 into an electrical signal. Depending on the embodiment, the image sensor 230 may include one image sensor selected from a plurality of image sensors having different properties (e.g., an RGB sensor, a black and white (BW) sensor, an IR sensor, or a UV sensor), a plurality of image sensors having the same properties, or a plurality of image sensors having different properties. Each image sensor included in the image sensor 230 may be implemented using, for example, a charge-coupled device (CCD) sensor or a complementary metal oxide semiconductor (CMOS) sensor.

[0079] The image stabilizer 240 can move the image sensor 230 or at least one lens included in the lens assembly 210 in a specific direction, or control an operational property of the image sensor 230 (e.g., adjust readout timing) in response to movement of the camera module 280 or the electronic device 101 including the camera module 280. This allows for compensating for at least a portion of negative effects (e.g., image blur) resulting from movement of the image being captured. Depending on the embodiment, the image stabilizer 240 can sense such movement of the camera module 280 or the electronic device 101 using a gyroscope sensor (not shown) or an accelerometer (not shown) disposed within or outside the camera module 280. Depending on the embodiment, the image stabilizer 240 can be implemented as, for example, an optical image stabilizer. The memory 250 can at least temporarily store at least a portion of an image acquired via the image sensor 230 for subsequent image processing tasks. For example, if multiple images are captured quickly or image capture is delayed due to shutter lag, the acquired original image (e.g., Bayer pattern image, high-resolution image) may be stored in memory 250, and its corresponding duplicate image (e.g., low-resolution image) may be previewed via display device 160. Then, if a specified condition is met (e.g., by user input or system command), at least a portion of the original image stored in memory 250 may be acquired and processed by, for example, image signal processor 260. Depending on the embodiment, memory 250 may be configured as at least a portion of memory 130, or may be configured as a separate memory that operates independently of memory 130.

[0080] The image signal processor 260 may perform one or more image processing operations on images acquired via the image sensor 230 or stored in the memory 250. The one or more image processing operations may include, for example, depth map generation, three-dimensional (3D) modeling, panoramic image generation, feature point extraction, image synthesis, or image compensation (e.g., noise reduction, resolution adjustment, brightness adjustment, blurring, sharpening, or softening). Additionally or alternatively, the image signal processor 260 may control at least one of the components included in the camera module 280 (e.g., image sensor 230) (e.g., exposure time control or readout timing control). Images processed by the image signal processor 260 may be stored back in the memory 250 for further processing, or may be provided to an external component outside the camera module 280 (e.g., memory 130, display device 160, electronic device 102, electronic device 104, or server 108). Depending on the embodiment, the image signal processor 260 may be configured as at least a portion of the processor 120, or may be configured as a separate processor that operates independently of the processor 120. If the image signal processor 260 is configured as a separate processor from the processor 120 , the at least one image processed by the image signal processor 260 may be displayed as it is by the processor 120 via the display device 160 , or may be displayed after being further processed.

[0081] Depending on the embodiment, the electronic device 101 may include multiple camera modules 280 having different properties or functions. In this case, at least one of the multiple camera modules 280 may form, for example, a wide-angle camera, and at least another of the multiple camera modules 280 may form a telephoto camera. Similarly, at least one of the multiple camera modules 280 may form, for example, a front-facing camera, and at least another of the multiple camera modules 280 may form a rear-facing camera.

[0082] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to those described above.

[0083] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but rather include various changes, equivalents or alternative forms for corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the nouns in the singular form corresponding to the term may include one or more things, unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include any one or all possible combinations of the items listed together with the corresponding phrase in the multiple phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish corresponding components from another component, and do not limit the components in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “combined with another element (e.g., a second element)”, “combined to another element (e.g., a second element)”, “connected with another element (e.g., a second element)”, or “connected to another element (e.g., a second element)”, when the term “operably” or “communicatively” is used or when the term “operably” or “communicatively” is not used, it means that the element can be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0084] As used in connection with various embodiments of the present disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions, or the smallest unit or portion of the single integrated component. For example, depending on the embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0085] The various embodiments described herein can be implemented as software (e.g., program 140) comprising one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). For example, under the control of a processor, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) can call at least one of the one or more instructions stored in the storage medium and execute the at least one instruction with or without the use of one or more other components. This enables the machine to be operable to perform at least one function according to the called at least one instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The machine-readable storage medium can be provided in the form of a non-transitory storage medium. The term "non-transitory" only means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but the term does not distinguish between data being semi-permanently stored in the storage medium and data being temporarily stored in the storage medium.

[0086] According to an embodiment, the method according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be released in the form of a machine-readable storage medium (e.g., a compact disc read-only memory (CD-ROM)), or may be downloaded via an application store (e.g., PlayStore). TM ) The computer program product may be published online (e.g., downloaded or uploaded) or may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smartphones). If published online, at least part of the computer program product may be temporarily generated or at least part of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a memory of a manufacturer's server, an application store's server, or a forwarding server).

[0087] According to various embodiments, each component (for example, module or program) in the above-mentioned components may include a single entity or multiple entities, and some entities in the multiple entities may be separably arranged in different components. According to various embodiments, one or more components in the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (for example, module or program) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each component in the multiple components in the same or similar manner as a corresponding component in the multiple components before integration. According to various embodiments, the operations performed by a module, program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more operations in the operations may be run or omitted in different orders, or one or more other operations may be added.

[0088] Figure 3 FIG. 1 is a diagram showing an electronic device 300 (eg, Figure 1 101). Figure 4 The present invention is shown in FIG. Figure 3 1 is a rear perspective view of the electronic device 300 shown in FIG.

[0089] Reference Figure 3 and Figure 4 , according to the electronic device 300 of the embodiment (eg, Figure 1 The electronic device 101 may include a housing 310 including a first surface (front surface) 310A, a second surface (rear surface) 310B, and a side surface 310C surrounding a space between the first surface 310A and the second surface 310B. In an embodiment (not shown), the housing 310 may refer to a housing formed Figure 3 a first surface 310A, Figure 4 According to an embodiment, at least a portion of the first surface 310A may be formed by a front plate 302 (e.g., a glass plate or a polymer plate including various coatings) that is at least partially substantially transparent. In an embodiment, the front plate 302 may be coupled to the housing 310 to form an internal space together with the housing 310. In an embodiment, the term "internal space" may refer to a portion of the housing 310 for accommodating a display 301 or a display 302 to be described later. Figure 1 The inner space of at least a portion of the display module 160 is formed.

[0090] In accordance with an embodiment, the second surface 310B may be formed by a back plate 311. The back plate 311 may be formed of, for example, coated or tinted glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS) or magnesium), or a combination of at least two of these materials. The side surface 310C may be coupled to the front plate 302 and the back plate 311 and formed by a side frame structure (or "side member") 318 comprising a metal and / or polymer. In an embodiment, the back plate 311 and the side frame structure 318 may be integrally formed and comprise the same material (e.g., a metal material such as aluminum).

[0091] In the illustrated embodiment, the front plate 302 may include two first regions 310D at both long edge ends of the front plate 302 that are bent from the first surface 310A toward the rear plate 311 and extend seamlessly. Figure 4 ), the back panel 311 may include two second areas 310E at the two long edge ends of the back panel 311 that are bent from the second surface 310B toward the front panel 302 and extend seamlessly. In an embodiment, the front panel 302 (or the back panel 311) may include only one of the first areas 310D (or the second areas 310E). In an embodiment, some of the first areas 310D or the second areas 310E may not be included. In an embodiment, when viewed from the side of the electronic device 101, the side frame structure 318 may have a first thickness (or width) on a side surface that does not include any of the above-mentioned first areas 310D or second areas 310E (for example, a side surface on which the connector hole 308 is formed), and a second thickness that is less than the first thickness on a side surface that includes the above-mentioned first area 310D or second area 310E (for example, a side surface on which the key input device 317 is provided).

[0092] According to an embodiment, the electronic device 300 may include a display 301, audio modules 303, 307, sensor modules 304, 316 and 319, camera modules 305, 312 and 313 (eg, Figure 1 or Figure 2 ), a camera module 180 or 280 in the electronic device 300, a key input device 317, or at least one of the connector holes 308 and 309. In an embodiment, the electronic device 300 may not be provided with at least one of the above components (for example, the key input device 317 or the light emitting element 306), or may additionally include other components.

[0093] Display 301 (eg, Figure 1The display module 160 of the front panel 302 may be visually exposed, for example, through a majority of the front panel 302. In an embodiment, at least a portion of the display 301 may be exposed through the first surface 310A and the front panel 302 forming the first region 310D of the side surface 310C. In an embodiment, the corners of the display 301 may be formed to have a shape substantially the same as the shape of the adjacent perimeter of the front panel 302. In an embodiment (not shown), the gaps between the perimeter of the display 301 and the perimeter of the front panel 302 may be substantially equal to increase the visually exposed area of ​​the display 301.

[0094] In an embodiment (not shown), a groove or an opening may be formed in a portion of the screen display area (e.g., an active area) or an area outside the screen display area (e.g., an inactive area), and an audio module 314 (e.g., an inactive area) aligned with the groove or the opening may be included. Figure 1 Audio module 170), sensor module 304 ( Figure 1 At least one of the sensor module 176 of the display 301, the camera module 305, or the light-emitting element 306. In an embodiment (not shown), at least one of the audio module 314, the sensor module 304, the camera module 305 (e.g., an under-screen camera (UDC)), the fingerprint sensor 316, or the light-emitting element 306 may be included on the rear surface of the screen display area of ​​the display 301. In an embodiment (not shown), the display 301 may be combined with or provided adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer for detecting a stylus based on a magnetic field. In an embodiment, at least some of the sensor modules 304 and 319 and / or at least some of the keys of the key input device 317 may be provided in the first area 310D and / or the second area 310E.

[0095] The audio modules 303, 307, and 314 may include a microphone hole 303 and speaker holes 307 and 314. A microphone for obtaining external sound may be provided in the microphone hole 303, and in an embodiment, a plurality of microphones may be provided to detect the direction of the sound. The speaker holes 307 and 314 may include an external speaker hole 307 and a receiver hole 314 for calling. In an embodiment, the speaker holes 307 and 314 and the microphone hole 303 may be implemented as a single hole, or a speaker (e.g., a piezoelectric speaker) may be included without the speaker holes 307 and 314.

[0096] The sensor modules 304, 316, and 319 can generate electrical signals or data values ​​corresponding to the internal operating state or external environmental state of the electronic device 300. The sensor modules 304, 316, and 319 can include, for example, a first sensor module 304 (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on the first surface 310A of the housing 310, and / or a third sensor module 319 (e.g., an HRM sensor) and / or a fourth sensor module 316 (e.g., a fingerprint sensor) disposed on the second surface 310B of the housing 310. The fingerprint sensor can be disposed on both the second surface 310B and the first surface 310A (e.g., the display 301) of the housing 310. The electronic device 300 may further include a sensor module (not shown), such as at least one of a gesture sensor, a gyroscope sensor, an air pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0097] The camera modules 305, 312, and 313 may include a front camera module 305 disposed on a first surface 310A of the electronic device 300, and a rear camera module 312 and / or a flash 313 disposed on a second surface 310B. The camera modules 305 and 312 may include one or more lenses, image sensors, and / or image signal processors. The flash 313 may include, for example, a light emitting diode (LED) or a xenon lamp. In an embodiment, two or more lenses (an IR camera, a wide-angle lens, and a telephoto lens) and an image sensor may be arranged on one surface of the electronic device 300.

[0098] The key input device 317 may be provided on the side surface 310C of the housing 310. In an embodiment, the electronic device 300 may not include some or any of the key input devices 317, and the key input devices 317 not included may be implemented in other forms such as soft keys on the display 301. In an embodiment, the key input device may include a sensor module 316 provided on the second surface 310B of the housing 310.

[0099] The light emitting element 306 may be provided, for example, on the first surface 310A of the housing 310. The light emitting element 306 may provide, for example, status information about the electronic device 300 in the form of light. In an embodiment, the light emitting element 306 may provide, for example, a light source that cooperates with the operation of the front camera module 305. The light emitting element 306 may include, for example, an LED, an IR LED, and a xenon lamp.

[0100] The connector holes 308 and 309 may include a first connector hole 308 capable of accommodating a connector for sending power and / or data to and receiving power and / or data from an external electronic device (e.g., a USB connector) and / or a second connector hole 309 capable of accommodating a connector for sending audio signals to and receiving audio signals from an external electronic device (e.g., a headphone jack).

[0101] When describing the following embodiments, reference may be made to the electronic devices 101, 102, 104, and 300 and / or the camera modules 180, 280, 305, 312, and 313 of the aforementioned embodiments. The lens assemblies 400, 500, 600, 700, 800, 900, and 1000 of the embodiments described below may implement a portion or all of at least one of the aforementioned camera modules 180, 280, 305, 312, and 313.

[0102] Figure 5 is a diagram illustrating a lens assembly 400 according to an embodiment of the present disclosure. Figure 6 The present invention is shown in the embodiment of the present invention. Figure 5 A graph of spherical aberration of the lens assembly 400 is shown. Figure 7 The present invention is shown in the embodiment of the present invention. Figure 5 A graph of astigmatism of the lens assembly 400 is shown. Figure 8 The present invention is shown in the embodiment of the present invention. Figure 5 A graph showing the distortion of the lens assembly 400 is shown.

[0103] Figure 6 4 is a graph showing spherical aberration of the lens assembly 400 according to an embodiment of the present disclosure, wherein the horizontal axis represents the coefficient of longitudinal spherical aberration, the vertical axis represents the normalized distance from the optical axis, and shows the change of longitudinal spherical aberration with the wavelength of light. For example, the longitudinal spherical aberration is shown for each of light having a wavelength of 656.2725 nanometers (nm) (e.g., red light), light having a wavelength of 587.5618 nm (e.g., yellow light), light having a wavelength of 546.0740 nm, light having a wavelength of 486.1372 nm (e.g., blue light), and light having a wavelength of 435.8343 nm. Figure 7 is a graph illustrating astigmatism of the lens assembly 400 for light having a wavelength of 546.0740 nm according to an embodiment of the present disclosure, where “S” represents the sagittal plane with a solid line and “T” represents the tangential plane (or meridional plane) with a dashed line. Figure 8 is a graph illustrating distortion of the lens assembly 400 with respect to light having a wavelength of 546.0740 nm according to an embodiment of the present disclosure.

[0104] Reference Figures 5 to 8, according to an embodiment of the present disclosure, the lens assembly 400 (eg, Figure 2 The lens assembly 210 may include an image sensor 1 or 230 and at least five lenses L1, L2, L3, L4, and L5. In embodiments, the at least five lenses L1, L2, L3, L4, and L5 may be disposed between an aperture stop ST0 and the image sensor 1 and may include a first lens L1, a second lens L2, a third lens L3, a fourth lens L4, and / or a fifth lens L5 aligned sequentially along an optical axis O from an object side S toward the image sensor 1 or 230. For example, it will be appreciated that the second lens L2, the third lens L3, the fourth lens L4, and / or the fifth lens L5 are disposed between the first lens L1 and the image sensor 1, and the fourth lens L4 and / or the fifth lens L5 are disposed between the third lens L3 and the image sensor 1. In embodiments, an optical component, such as an IR-cut filter F, may be disposed between any of the at least five lenses L1, L2, L3, L4, and L5 and the image sensor 1 or 230. The IR cut filter F can, for example, suppress or block light of a wavelength that is invisible to the naked eye of the user but is detected by the photosensitive material of the film or the image sensor 1 or 230 (e.g., IR light) from entering the image sensor 1 or 230. The IR cut filter F can be disposed between the fifth lens L5 and the image sensor 1 or 230. Depending on the purpose of the lens assembly 400, the IR cut filter F can be replaced with a bandpass filter that transmits IR light and suppresses or blocks visible light.

[0105] In the detailed description below, the first lens L1 may be referred to as a "first object-side lens," and the fifth lens L5 may be referred to as a "first sensor-side lens." In embodiments, "aligning along the direction of the optical axis O" may refer to aligning the optical axes of the lenses L1, L2, L3, L4, and L5 so as to coincide with the optical axis of the image sensor 1 or 230 (e.g., imaging plane IS). The imaging plane IS may, for example, receive or detect light aligned or focused by the lenses L1, L2, L3, L4, and L5. In embodiments, a processor (e.g., Figure 1 The processor 120) can perform a focus adjustment operation and / or a focal length adjustment operation by linearly moving at least one of the lenses L1, L2, L3, L4 and L5 relative to the image sensor I or 230 along the direction of the optical axis O.

[0106] According to an embodiment, the first lens L1 disposed between the aperture stop STO and the image sensor I may have positive refractive power and include an object-side surface S2 convex toward the object S. The second lens L2 disposed between the first lens L1 and the image sensor I may have negative refractive power. According to an embodiment, the second lens L2 may be disposed at a distance equal to or greater than approximately 0.55 mm and equal to or less than approximately 1.4 mm from the aperture stop STO. For example, the distance from the aperture stop STO to the object-side surface S4 of the second lens L2 may be equal to or greater than approximately 0.55 mm and equal to or less than approximately 1.4 mm. When the arrangement of the second lens L2 and / or the conditions presented by the [equation] described below are satisfied, the outer diameter of the first lens L1 or the barrel structure of the lens of the fixed lens assembly 400 may be reduced. The "outer diameter of the first lens L1 or the barrel structure" may refer to the portion of the lens assembly 400 that is visually perceived by the user from the outside of the electronic device 300. For example, when in an electronic device (e.g., Figures 1 to 4 When one of the plurality of cameras is implemented on the exterior of the electronic device 101, 102, 104, 200, and 300 of the embodiment, the lens assembly 400 may have a size that is easily coordinated with the exterior of the electronic device 300. In an embodiment, when the lens assembly 400 is provided to be aligned with a display (e.g., Figure 3 When the display 301 is overlapped, a good optical path can be provided while suppressing the reduction of the effective area of ​​the display.

[0107] According to embodiments, the third lens L3 may be disposed between the second lens L2 and the image sensor I and have positive refractive power, and the fourth lens L4 may have negative refractive power and be disposed between the third lens L3 and the image sensor I. In embodiments, the third lens L3 may have a shape with the image sensor-side surface S7 being convex. In embodiments, the fifth lens L5 may have positive refractive power and be disposed between the fourth lens L4 and the image sensor I. According to embodiments, the fifth lens L5 may include at least one inflection point IP disposed on at least one of the object-side surface S10 or the image sensor-side surface S11. In embodiments, the fifth lens L5 may have a shape that is convex toward the object S by including a convex object-side surface S10 and a concave image sensor-side surface S11.

[0108] According to embodiments, lens assembly 400 may include first lens L1 or a lens barrel structure having a reduced outer diameter by satisfying the condition expressed by the following [Equation 1]. In embodiments, when the distance from aperture stop STO to object surface S4 of second lens L2 is equal to or greater than approximately 0.55 mm and equal to or less than approximately 1.4 mm while satisfying the condition expressed by [Equation 1], lens assembly 400 may include first lens L1 or a lens barrel structure having a further reduced outer diameter. In reducing the outer diameter of first lens L1 or the lens barrel structure, the distance from aperture stop STO to object surface S4 of second lens L2 may be approximately 0.85 mm or less.

[0109] [Equation 1]

[0110]

[0111] Here, “TTL” may refer to a total lens length, which is the distance from the object-side surface S2 of the first lens L1 to the imaging plane IS of the image sensor I, measured along the optical axis O. In an embodiment, “IH” may be a maximum image height of the lens assembly 400, and “HFOV” may refer to a half field of view of the lens assembly 400.

[0112] According to an embodiment, when the distance from the lens assembly 400 and / or the aperture stop STO to the object-side surface S4 of the second lens L2 satisfies the condition expressed by the following [Equation 2], the outer diameter of the first lens L1 or the barrel structure can be easily reduced.

[0113] [Equation 2]

[0114]

[0115] Here, "D4" may refer to a distance from aperture stop STO to object-side surface S4 of second lens L2. In an embodiment, the calculated value according to [Equation 2] may be within a range of approximately 0.14 or greater and approximately 0.30 or less.

[0116] According to embodiments, first lens L1 may have a greater center thickness than other lenses L2, L3, L4, and L5. When first lens L1 has a greater center thickness than other lenses L2, L3, L4, and L5, lens assembly 400 can achieve a good field of view even in a configuration where the outer diameter of first lens L1 or the lens barrel structure is reduced. For example, by satisfying at least one of the following [Equation 3] and / or [Equation 4] regarding the center thickness T1 of first lens L1, lens assembly 400 can achieve a good field of view while being compact.

[0117] [Equation 3]

[0118]

[0119] [Equation 4]

[0120]

[0121] Here, “T2,” “T3,” “T4,” and / or “T5” may respectively denote the center thickness of second lens L2, third lens L3, fourth lens L4, and / or fifth lens L5.

[0122] In embodiments, lens assembly 400 can achieve a good field of view while reducing its size exposed on the exterior of electronic device 300 by satisfying at least some of the above conditions. For example, lens assembly 400 can enhance the aesthetic appearance of electronic device 300 while implementing any of a plurality of cameras. In embodiments, lens assembly 400 can achieve a good quality image while suppressing a reduction in the active area of ​​display 301 by implementing a camera that is arranged to overlap display 301 by satisfying at least some of the above conditions.

[0123] In the above embodiment, although there is no direct mention of the allocation Figure 5 Some of the reference numbers for the lens surfaces of the lenses L1, L2, L3, L4, and L5 are omitted, but those skilled in the art will readily understand the configuration of each of lenses L1, L2, L3, L4, and L5 based on the lens data presented in the [Table] described below. When describing the various embodiments below, for the sake of brevity, reference numbers for some of the object-side and image sensor-side surfaces and / or inflection points IP of lenses L1, L2, L3, L4, and L5 may be omitted in the drawings. Reference numbers for lens surfaces omitted in the drawings may be used in accordance with the configurations of the above-described embodiments and can be readily understood through the [Table] regarding lens data for each embodiment described below. In the detailed descriptions of the embodiments of the present disclosure, the terms "concave" or "convex" used to describe the object-side or sensor-side surfaces of lenses L1, L2, L3, L4, and L5 may refer to the shape of the lens surface at the point where it intersects with the optical axis O or in the paraxial region intersecting with the optical axis O.

[0124] According to embodiments, the lens assembly 400 may have a focal length of approximately 3.25 mm and an F-number of approximately 2.27. In embodiments, the lens assembly 400 may satisfy at least some of the conditions presented regarding the shapes and refractive powers (e.g., lens surfaces) of the above-described lenses L1, L2, L3, L4, and L5, the total lens length, the maximum image height, the half field of view, the thickness of the first lens L1, and / or the distance between the aperture stop STO and the second lens L2, and may be manufactured to the specifications shown in [Table 1] below.

[0125] [Table 1]

[0126]

[0127]

[0128] The following [Table 2] and [Table 3] describe aspherical coefficients of lenses L1, L2, L3, L4, and L5, and the aspherical surface can be defined by the following [Equation 5].

[0129] [Equation 5]

[0130]

[0131] In [Equation 5], "z" may represent a distance from a point on the lens surface through which the optical axis O passes in the direction of the optical axis O, "y" may represent a distance from the optical axis O in a direction perpendicular to the optical axis O, "c" may represent a reciprocal of the radius of curvature at the vertex of the lens, "k" may represent a conic constant, and each of "A," "B," "C," "D," "E," "F," "G," "H," "J," "K," "L," "M," "N," and "O" may represent an aspheric coefficient. The "reciprocal of the radius of curvature" may represent a value (e.g., curvature) indicating the degree of curvature at each point of a curved surface or curve.

[0132] [Table 2]

[0133]

[0134]

[0135] [Table 3]

[0136]

[0137]

[0138] Figure 9 is a diagram illustrating a lens assembly 500 according to an embodiment of the present disclosure. Figure 10 The present invention is shown in FIG. Figure 9 A graph of spherical aberration of the lens assembly 500 is shown. Figure 11 The present invention is shown in FIG. Figure 9 A graph of astigmatism of the lens assembly 500 is shown. Figure 12 The present invention is shown in FIG. Figure 9 A graph showing the distortion of the lens assembly 500.

[0139] Figure 9Lens assembly 500 may have a focal length of approximately 3.28 mm and an F-number of approximately 2.21. In embodiments, lens assembly 500 may satisfy at least some of the conditions presented regarding the shapes and refractive powers (e.g., lens surfaces) of lenses L1, L2, L3, L4, and L5, the total lens length, the maximum image height, the half field of view, the thickness of first lens L1, and / or the distance between aperture stop STO and second lens L2. In embodiments, lens assembly 500 may be manufactured to the specifications shown in [Table 4] below, and have the aspheric coefficients of [Table 5] and [Table 6].

[0140] [Table 4]

[0141]

[0142]

[0143] [Table 5]

[0144]

[0145] [Table 6]

[0146]

[0147]

[0148] Figure 13 is a diagram illustrating a lens assembly 600 according to an embodiment of the present disclosure. Figure 14 The present invention is shown in the embodiment of the present invention. Figure 13 A graph of spherical aberration of the lens assembly 600 is shown. Figure 15 The present invention is shown in the embodiment of the present invention. Figure 13 A graph of astigmatism of the lens assembly 600 is shown. Figure 16 The present invention is shown in the embodiment of the present invention. Figure 13 A graph showing the distortion of the lens assembly 600.

[0149] Figure 13 Lens assembly 600 may have a focal length of approximately 2.97 mm and an F-number of approximately 2.24. In embodiments, lens assembly 600 may satisfy at least some of the conditions presented regarding the shapes and refractive powers (e.g., lens surfaces) of lenses L1, L2, L3, L4, and L5, the total lens length, the maximum image height, the half field of view, the thickness of first lens L1, and / or the distance between aperture stop STO and second lens L2. In embodiments, lens assembly 600 may be manufactured to the specifications shown in [Table 7] below, and have the aspheric coefficients of [Table 8] and [Table 9].

[0150] [Table 7]

[0151]

[0152]

[0153] [Table 8]

[0154]

[0155]

[0156] [Table 9]

[0157]

[0158] Figure 17 is a diagram illustrating a lens assembly 700 according to an embodiment of the present disclosure. Figure 18 The present invention is shown in the embodiment of the present invention. Figure 17 A graph of spherical aberration of the lens assembly 700 is shown. Figure 19 The present invention is shown in the embodiment of the present invention. Figure 17 A graph of astigmatism of the lens assembly 700 is shown. Figure 20 The present invention is shown in the embodiment of the present invention. Figure 17 A graph showing the distortion of the lens assembly 700 is shown.

[0159] Figure 17 Lens assembly 700 may have a focal length of approximately 2.99 mm and an F-number of approximately 2.27. In embodiments, lens assembly 700 may satisfy at least some of the conditions presented regarding the shapes and refractive powers (e.g., lens surfaces) of lenses L1, L2, L3, L4, and L5, the total lens length, the maximum image height, the half field of view, the thickness of first lens L1, and / or the distance between aperture stop STO and second lens L2. In embodiments, lens assembly 700 may be manufactured to the specifications shown in [Table 10] below, and have the aspheric coefficients of [Table 11] and [Table 12].

[0160] [Table 10]

[0161]

[0162] [Table 11]

[0163]

[0164]

[0165] [Table 12]

[0166]

[0167]

[0168] Figure 21 is a diagram illustrating a lens assembly 800 according to an embodiment of the present disclosure. Figure 22 The present invention is shown in the embodiment of the present invention. Figure 21 A graph of spherical aberration of the lens assembly 800 is shown. Figure 23 The present invention is shown in the embodiment of the present invention. Figure 21 A graph of astigmatism of the lens assembly 800 is shown. Figure 24 The present invention is shown in the embodiment of the present invention. Figure 21 A graph showing the distortion of the lens assembly 800.

[0169] Figure 21 Lens assembly 800 may have a focal length of approximately 2.95 mm and an F-number of approximately 2.46. In embodiments, lens assembly 800 may satisfy at least some of the conditions presented above regarding the shapes and refractive powers (e.g., lens surfaces) of lenses L1, L2, L3, L4, and L5, the total lens length, the maximum image height, the half field of view, the thickness of first lens L1, and / or the distance between aperture stop STO and second lens L2. In embodiments, lens assembly 800 may be manufactured to the specifications shown in [Table 13] below, and have the aspheric coefficients of [Table 14] and [Table 15].

[0170] [Table 13]

[0171]

[0172]

[0173] [Table 14]

[0174]

[0175] [Table 15]

[0176]

[0177]

[0178] Figure 25 is a diagram illustrating a lens assembly 900 according to an embodiment of the present disclosure. Figure 26 The present invention is shown in the embodiment of the present invention. Figure 25 A graph of spherical aberration of lens assembly 900 is shown. Figure 27 The present invention is shown in the embodiment of the present invention. Figure 25 A graph of astigmatism of lens assembly 900 is shown. Figure 28 The present invention is shown in the embodiment of the present invention. Figure 25 A graph showing the distortion of the lens assembly 900.

[0179] Figure 25 Lens assembly 900 may have a focal length of approximately 3.30 mm and an F-number of approximately 2.23. In embodiments, lens assembly 900 may satisfy at least some of the conditions presented above regarding the shapes and refractive powers (e.g., lens surfaces) of lenses L1, L2, L3, L4, and L5, the total lens length, the maximum image height, the half field of view, the thickness of first lens L1, and / or the distance between aperture stop STO and second lens L2. In embodiments, lens assembly 900 may be manufactured to the specifications shown in [Table 16] below, and have the aspheric coefficients of [Table 17] and [Table 18].

[0180] [Table 16]

[0181]

[0182]

[0183] [Table 17]

[0184]

[0185]

[0186] [Table 18]

[0187]

[0188] Figure 29 is a diagram illustrating a lens assembly 1000 according to an embodiment of the present disclosure. Figure 30 The present invention is shown in the embodiment of the present invention. Figure 29 A graph of spherical aberration of the lens assembly 1000 is shown. Figure 31 The present invention is shown in the embodiment of the present invention. Figure 29 A graph of astigmatism of the lens assembly 1000 is shown. Figure 32 The present invention is shown in the embodiment of the present invention. Figure 29 A graph showing the distortion of the lens assembly 1000.

[0189] Figure 29 Lens assembly 1000 may have a focal length of approximately 3.00 mm and an F-number of approximately 2.273. In embodiments, lens assembly 1000 may satisfy at least some of the conditions presented regarding the shapes and refractive powers (e.g., lens surfaces) of lenses L1, L2, L3, L4, and L5, the total lens length, the maximum image height, the half field of view, the thickness of first lens L1, and / or the distance between aperture stop STO and second lens L2. In embodiments, lens assembly 1000 may be manufactured to the specifications shown in [Table 19] below, and have the aspheric coefficients of [Table 20] and [Table 21].

[0190] [Table 19]

[0191]

[0192] [Table 20]

[0193]

[0194]

[0195] [Table 21]

[0196]

[0197]

[0198] According to an embodiment, for the conditions presented by [Equation 1] to [Equation 4], from Figure 5 、 Figure 9 、 Figure 13 、 Figure 17 、 Figure 21 、 Figure 25 and / or Figure 29 The values ​​calculated from the lens data of the lens assemblies 400, 500, 600, 700, 800, 900 and 1000 shown in are shown in [Table 22] below.

[0199] [Table 22]

[0200]

[0201] As described above, the lens assembly according to the embodiment of the present disclosure (eg, Figure 2 、 Figure 5 、 Figure 9 、 Figure 13 、 Figure 17 、 Figure 21 、 Figure 25 and / or Figure 29 The lens assembly 210, 400, 500, 600, 700, 800, 900 and 1000) can be provided by satisfying the conditions presented on the total lens length, maximum image height and / or half field of view, in the first lens (e.g., Figure 5 、 Figure 9 、 Figure 13 、 Figure 17 、 Figure 21 、 Figure 25 and / or Figure 29 When the requirements for the thickness of the first lens or the aperture stop (e.g., Figure 5 、 Figure 9 、 Figure 13 、 Figure 17 、 Figure 21 、 Figure 25 and / or Figure 29 The aperture stop STO) and the second lens (for example, Figure 5 、 Figure 9 、 Figure 13 、 Figure 17 、 Figure 21 、 Figure 25 and / or Figure 29 When the distance between the second lens L2 is set to the maximum value, the miniaturization of the lens assembly can be further promoted. For example, when a plurality of cameras (for example, Figure 1 and / or Figure 4 While using any of the cameras 180, 280, 312, and 313 (e.g., the camera 180, 280, 312, and 313) of the electronic device, the lens assembly can be arranged or configured to coordinate with the appearance of the electronic device. In embodiments, the miniaturized lens assembly can be configured to overlap with the display and / or be configured parallel to one side of the display while suppressing a reduction in the active area of ​​the display.

[0202] Effects obtainable from the present disclosure are not limited to the above-mentioned effects, and other unmentioned effects will be clearly understood by those skilled in the art from the description of the above-mentioned embodiments.

[0203] As mentioned above, the lens assembly (e.g. Figure 2 、 Figure 5 、 Figure 9 、 Figure 13 、 Figure 17 、 Figure 21 、 Figure 25 and / or Figure 29 The lens assembly 210, 400, 500, 600, 700, 800, 900 or 1000) includes: an image sensor (e.g., Figure 2 、 Figure 5 、 Figure 9 、 Figure 13 、 Figure 17 、 Figure 21 、 Figure 25 and / or Figure 29 Image sensor 230 or I in); Aperture stop (e.g., Figure 2 、 Figure 5 、 Figure 9 、 Figure 13 、 Figure 17 、 Figure 21 、 Figure 25 and / or Figure 29 Aperture stop STO in the optical axis (e.g. Figure 2 、 Figure 5 、 Figure 9 、 Figure 13 、 Figure 17 、 Figure 21 、 Figure 25 and / or Figure 29 ) is aligned with the image sensor on the optical axis in; the first lens (eg, Figure 2 、 Figure 5 、 Figure 9 、 Figure 13 、 Figure 17 、 Figure 21 、 Figure 25 and / or Figure 29 The first lens L1 in the embodiment has positive refractive power, includes a convex object-side surface, and is disposed between the aperture stop and the image sensor; the second lens (e.g., Figure 2 、 Figure 5 、 Figure 9 、 Figure 13 、 Figure 17 、 Figure 21 、 Figure 25 and / or Figure 29 The second lens L2 in FIG. 1 has negative refractive power and is disposed between the first lens and the image sensor; the third lens (eg, Figure 2 、 Figure 5 、 Figure 9 、 Figure 13 、 Figure 17 、 Figure 21 、 Figure 25 and / or Figure 29 The third lens L3 in FIG is disposed between the second lens and the image sensor; the fourth lens (eg, Figure 2 、 Figure 5 、 Figure 9 、 Figure 13 、 Figure 17 、 Figure 21 、 Figure 25 and / or Figure 29 The fourth lens L4 in FIG is provided between the third lens and the image sensor, and the fifth lens (eg, Figure 2 、 Figure 5 、 Figure 9 、 Figure 13 、 Figure 17 、 Figure 21 、 Figure 25 and / or Figure 29 The fifth lens L5 in FIG has positive refractive power, includes a concave image sensor side surface, and is disposed between the fourth lens and the image sensor. In the embodiment, the lens assembly satisfies the following [Conditional Expression 1].

[0204] [Conditional expression 1]

[0205] 0.8 <TTL / (IH*tan(HFOV))<2

[0206] Wherein, “TTL” may be the distance from the object surface of the first lens to the imaging plane of the image sensor measured along the optical axis (e.g., Figure 2 、 Figure 5 、 Figure 9 、 Figure 13 、 Figure 17 、 Figure 21 、 Figure 25 and / or Figure 29 where “IH” may be the maximum image height of the lens assembly and “HFOV” may be the half field of view of the lens assembly.

[0207] According to an embodiment, a center thickness of the first lens may be greater than a center thickness of each of the second lens, the third lens, the fourth lens, and the fifth lens.

[0208] According to the embodiment, the lens assembly may satisfy the following [Conditional Expression 2].

[0209] [Conditional expression 2]

[0210] 0.15 <T1 / TTL<0.25

[0211] Here, “T1” may be the center thickness of the first lens.

[0212] According to the embodiment, the lens assembly may satisfy the following [Conditional Expression 3].

[0213] [Conditional expression 3]

[0214] 0.40 <T1 / (T2+T3+T4+T5)<0.65

[0215] Here, “T1” may be the center thickness of the first lens, “T2” may be the center thickness of the second lens, “T3” may be the center thickness of the third lens, “T4” may be the center thickness of the fourth lens, and “T5” may be the center thickness of the fifth lens.

[0216] According to an embodiment, a distance from the aperture stop to the object-side surface of the second lens may be equal to or greater than 0.55 mm and equal to or less than 1.4 mm.

[0217] According to the embodiment, the lens assembly may satisfy the following [Conditional Expression 4].

[0218] [Conditional expression 4]

[0219] 0.13 <D4 / TTL<0.37

[0220] Here, “D4” may be the distance from the aperture stop to the object-side surface of the second lens measured along the optical axis.

[0221] According to an embodiment, the third lens may have positive refractive power, and the fourth lens may have negative refractive power.

[0222] According to an embodiment, the third lens may include a convex image sensor-side surface.

[0223] According to an embodiment, the fifth lens may include a convex object-side surface.

[0224] According to an embodiment, the fifth lens may include at least one inflection point (eg, Figure 5 inflection point IP in).

[0225] According to an embodiment of the present disclosure, an electronic device (eg, Figure 1 、 Figure 3 and / or Figure 4 The electronic device 101, 102, 104 or 300 in the embodiment includes: a lens assembly (eg, Figure 2 、 Figure 5 、 Figure 9 、 Figure 13 、 Figure 17 、 Figure 21 、 Figure 25 and / or Figure 29 210, 400, 500, 600, 700, 800, 900, or 1000); and a processor (e.g., Figure 1 The processor 120 and / or Figure 2 The image signal processor 260 in the image sensor is configured to obtain an image of an object using a lens assembly. In an embodiment, the lens assembly includes: an image sensor (e.g., Figure 2 、 Figure 5 、 Figure 9 、 Figure 13 、 Figure 17 、 Figure 21 、 Figure 25 and / or Figure 29 Image sensor 230 or I in); Aperture stop (e.g., Figure 2 、 Figure 5 、 Figure 9 、 Figure 13 、 Figure 17 、 Figure 21 、 Figure 25 and / or Figure 29 Aperture stop STO in the optical axis (e.g. Figure 2 、 Figure 5 、 Figure 9 、 Figure 13 、 Figure 17 、 Figure 21 、 Figure 25 and / or Figure 29The first lens (eg, Figure 2 、 Figure 5 、 Figure 9 、 Figure 13 、 Figure 17 、 Figure 21 、 Figure 25 and / or Figure 29 The first lens L1 in the embodiment has positive refractive power, includes a convex object-side surface, and is disposed between the aperture stop and the image sensor; the second lens (e.g., Figure 2 、 Figure 5 、 Figure 9 、 Figure 13 、 Figure 17 、 Figure 21 、 Figure 25 and / or Figure 29 The second lens L2 in FIG. 1 has negative refractive power and is disposed between the first lens and the image sensor; the third lens (eg, Figure 2 、 Figure 5 、 Figure 9 、 Figure 13 、 Figure 17 、 Figure 21 、 Figure 25 and / or Figure 29 The third lens L3 in FIG is disposed between the second lens and the image sensor; the fourth lens (eg, Figure 2 、 Figure 5 、 Figure 9 、 Figure 13 、 Figure 17 、 Figure 21 、 Figure 25 and / or Figure 29 , and a fifth lens (e.g., a fourth lens L4 in FIG. 1 ), disposed between the third lens and the image sensor; and Figure 2 、 Figure 5 、 Figure 9 、 Figure 13 、 Figure 17 、 Figure 21 、 Figure 25 and / or Figure 29 The fifth lens L5 in FIG has positive refractive power, includes a concave image sensor side surface, and is disposed between the fourth lens and the image sensor. In the embodiment, the lens assembly satisfies the following [Conditional Expression 1].

[0226] [Conditional expression 1]

[0227] 0.8 <TTL / (IH*tan(HFOV))<2

[0228] Wherein, “TTL” may be the distance from the object surface of the first lens to the imaging plane of the image sensor measured along the optical axis (e.g., Figure 2 、 Figure 5 、 Figure 9 、 Figure 13 、 Figure 17 、 Figure 21 、 Figure 25 and / or Figure 29 where “IH” may be the maximum image height of the lens assembly and “HFOV” may be the half field of view of the lens assembly.

[0229] According to an embodiment, a center thickness of the first lens may be greater than a center thickness of each of the second lens, the third lens, the fourth lens, and the fifth lens.

[0230] According to the embodiment, the lens assembly may satisfy the following [Conditional Expression 2].

[0231] [Conditional expression 2]

[0232] 0.15 <T1 / TTL<0.25

[0233] Here, “T1” may be the center thickness of the first lens.

[0234] According to the embodiment, the lens assembly may satisfy the following [Conditional Expression 3].

[0235] [Conditional expression 3]

[0236] 0.40 <T1 / (T2+T3+T4+T5)<0.65

[0237] Here, “T1” may be the center thickness of the first lens, “T2” may be the center thickness of the second lens, “T3” may be the center thickness of the third lens, “T4” may be the center thickness of the fourth lens, and “T5” may be the center thickness of the fifth lens.

[0238] According to an embodiment, a distance from the aperture stop to the object-side surface of the second lens may be equal to or greater than 0.55 mm and equal to or less than 1.4 mm.

[0239] According to the embodiment, the lens assembly may satisfy the following [Conditional Expression 4].

[0240] [Conditional expression 4]

[0241] 0.13 <D4 / TTL<0.37

[0242] Here, “D4” may be the distance from the aperture stop to the object-side surface of the second lens measured along the optical axis.

[0243] According to an embodiment, the third lens may have positive refractive power, and the fourth lens may have negative refractive power.

[0244] According to an embodiment, the third lens may include a convex image sensor-side surface.

[0245] According to an embodiment, the fifth lens may include a convex object-side surface.

[0246] According to an embodiment, the fifth lens may include at least one inflection point (eg, Figure 5 inflection point IP in).

[0247] Although the present disclosure has been shown and described with respect to the embodiments, it should be understood that the embodiments are for illustrative purposes only and are not intended to limit the present disclosure. It will be apparent to those skilled in the art that various changes in form and detailed configuration may be made without departing from the scope of the present disclosure, including the appended claims and their equivalents.

Claims

1. A lens assembly (210; 400; 500; 600; 700; 800; 900; 1000), comprising: Image sensor (230, I); an aperture stop (STO) aligned with the image sensor on an optical axis (O); a first lens (L1) having positive refractive power, including a convex object-side surface, and disposed between the aperture stop and the image sensor; a second lens (L2) having negative refractive power and disposed between the first lens and the image sensor; a third lens (L3) disposed between the second lens and the image sensor; a fourth lens (L4) disposed between the third lens and the image sensor; as well as a fifth lens (L5) having positive refractive power, including a concave image sensor-side surface, and disposed between the fourth lens and the image sensor, Wherein, the lens assembly satisfies the following [Conditional Expression 1], [Conditional expression 1] 0.8 <TTL / (IH*tan(HFOV))<2 (Wherein, "TTL" is the distance from the object-side surface of the first lens to the imaging plane (IS) of the image sensor measured along the optical axis, "IH" is the maximum image height of the lens assembly, and "HFOV" is the half field of view of the lens assembly).

2. The lens assembly according to claim 1, wherein: The center thickness of the first lens is greater than the center thickness of each of the second lens, the third lens, the fourth lens, and the fifth lens.

3. The lens assembly according to claim 1 or 2, wherein: The lens assembly satisfies the following [Conditional Expression 2], [Conditional expression 2] 0.15 <T1 / TTL<0.25 (Where "T1" is the center thickness of the first lens).

4. The lens assembly according to any one of claims 1 to 3, wherein: The lens assembly satisfies the following [Conditional Expression 3], [Conditional expression 3] 0.40 <T1 / (T2+T3+T4+T5)<0.65 (where "T1" is the center thickness of the first lens, "T2" is the center thickness of the second lens, "T3" is the center thickness of the third lens, "T4" is the center thickness of the fourth lens, and "T5" is the center thickness of the fifth lens).

5. The lens assembly according to any one of claims 1 to 4, wherein: A distance from the aperture stop to an object-side surface of the second lens is equal to or greater than 0.55 mm and equal to or less than 1.4 mm.

6. The lens assembly according to any one of claims 1 to 5, wherein: The lens assembly satisfies the following [Conditional Expression 4], [Conditional expression 4] 0.13 <D4 / TTL<0.37 (Where "D4" is the distance from the aperture stop to the object-side surface of the second lens measured along the optical axis).

7. The lens assembly according to any one of claims 1 to 6, wherein: The third lens has positive refractive power, and the fourth lens has negative refractive power.

8. The lens assembly according to any one of claims 1 to 7, wherein: The third lens includes a convex image sensor-side surface.

9. The lens assembly according to any one of claims 1 to 8, wherein: The fifth lens includes a convex object-side surface.

10. The lens assembly according to any one of claims 1 to 9, wherein: The fifth lens includes at least one inflection point (IP) provided on at least one of an object-side surface and an image sensor-side surface of the fifth lens.

11. An electronic device (101; 102; 104; 300), comprising: The lens assembly (210; 400; 500; 600; 700; 800; 900; 1000) according to any one of claims 1 to 10; and The processor (120, 260) is configured to obtain an image of an object using the lens assembly.

Images