Microelectrode array implanting device

Abstract

The invention discloses a microelectrode array implanting device, and relates to the technical field of medical treatment, and the microelectrode array implanting device comprises an adsorption pen which is connected with the array end of a microelectrode array to be implanted in a negative pressure or gluing manner; the mounting seat is connected with the adsorption pen, and the mounting surface of the mounting seat is used for being connected with a connector end of a microelectrode array to be implanted; the buckle is connected with the mounting seat, a bolt hole is formed in one surface, opposite to the mounting surface, of the buckle, a fastener is connected in the bolt hole, and a connector suitable for clamping a microelectrode array to be implanted is arranged between the fastener and the mounting surface; according to the technical scheme, the adsorption pen can adapt to microelectrode arrays of different specifications and types, and the adsorption mode of the adsorption pen can select negative pressure or gluing according to the microelectrode arrays so as to ensure a good connection effect. And the design of the mounting surface of the mounting seat and the buckle has certain universality, and connectors with different sizes can be adapted by adjusting the clamping force of the fastener, so that the application range of the device is expanded, and the cost performance of the device is improved.

Description

Technical Field

[0001] The present invention relates to the field of medical technology, and in particular to a microelectrode array implantation device. Background Art

[0002] With the continuous deepening of neuroscience research and the rapid development of brain-computer interface technology, the application of implantable neural microelectrodes in animal experiments and clinical trials has become more and more extensive. However, traditional mechanical clamping implantation tools have encountered several key difficulties in practical application:

[0003] First, the risk of mechanical damage is high. The clamping force exerted by the rigid clamping device during operation can easily cause plastic deformation, structural fracture, or damage to the surface coating of the electrode.

[0004] Second, they suffer from poor universal adaptability. Traditional clamping methods struggle to effectively accommodate a wide variety of microelectrode arrays of varying sizes and shapes. This is particularly true for high-performance, fragile microelectrodes like Utah-type electrode arrays, floating microneedle electrode arrays, and thin-film electrodes, which lack longitudinal clamping space. This significantly limits the flexibility and diversity of experimental design.

[0005] Third, the problem of stress concentration: Traditional clamping methods easily generate stress in local areas of the electrode, thereby increasing the risk of damage to the electrode structure.

[0006] Therefore, there is an urgent need to develop a microelectrode array implant device that can achieve non-destructive clamping, high-precision manipulation, and wide adaptability. Summary of the Invention

[0007] In view of this, the present invention provides a microelectrode array implantation device to solve the problem of clamping damage during microelectrode array implantation.

[0008] The present invention provides a microelectrode array implant device, comprising:

[0009] An adsorption pen having an adsorption end, wherein the adsorption end is connected to the array end of the microelectrode array to be implanted by negative pressure or adhesion;

[0010] A mounting base connected to the adsorption pen, wherein the mounting base has a mounting surface, and the mounting surface is used to connect to the connector end of the microelectrode array to be implanted;

[0011] A buckle is connected to the mounting seat, and a bolt hole is provided on the side of the buckle opposite to the mounting surface. A fastener is connected to the bolt hole through a threaded structure, and the fastener and the mounting surface are suitable for clamping the connector of the microelectrode array to be implanted.

[0012] The technical solution of the present invention can accommodate microelectrode arrays of varying sizes and types. The adsorption pen can utilize either negative pressure or adhesive bonding, depending on the material and surface characteristics of the microelectrode array, to ensure a good connection. The mounting surface and buckle design of the mounting base offer a degree of versatility, allowing for adaptability to connectors of varying sizes by adjusting the clamping force of the fasteners, thereby expanding the device's applicability and improving its cost-effectiveness.

[0013] Specifically, the mount securely clamps the microelectrode array connector through a combination of clips and fasteners. This design ensures the connector is stably fixed between the mounting surface of the mount and the fasteners, preventing displacement of the connector during implantation. This ensures a stable electrical connection between the microelectrode array and external devices, providing a reliable foundation for subsequent neural signal acquisition or stimulation operations.

[0014] Optionally, the adsorption pen has an air flow channel, the adsorption end has an air flow channel opening, the air flow channel opening of the adsorption end is connected to a suction cup, the suction cup has an adsorption port and an installation port, and the installation port is connected to the air flow channel opening.

[0015] Optionally, the adsorption pen has at least two adsorption ends, and each adsorption end has at least one airflow channel opening.

[0016] Optionally, there are at least two adsorption pens arranged in parallel, each of the adsorption pens has an adsorption channel, and each of the adsorption pens has at least one adsorption end.

[0017] Optionally, each of the adsorption pens has at least two adsorption ends.

[0018] Optionally, the adsorption end of the adsorption pen has a vertical bend.

[0019] Optionally, the diameter of the suction port of the suction cup is 1 to 10 mm.

[0020] Optionally, the adsorption end of the adsorption pen has an adhesive rod, and the end of the adhesive rod has adhesive.

[0021] Optionally, an air pipe is connected to the air flow channel of the adsorption pen, and the other end of the air pipe is connected to an air pressure control component.

[0022] Optionally, the air pressure control component includes: a positive pressure output component and a negative pressure output component, and the output ends of the positive pressure output component and the negative pressure output component are connected to the air pipe through a three-way valve.

[0023] Optionally, the positive pressure output element includes: an air bag, an air pump, a syringe, a balloon or a positive pressure pump.

[0024] Optionally, the negative pressure output component includes: a vacuum pump.

[0025] Optionally, the mounting seat has a bending portion, the end of the bending portion has a limiting ring, and the limiting ring is connected to the pen body of the adsorption pen.

[0026] Optionally, the mounting base and the adsorption pen are connected via a Z-axis sliding assembly, and the Z-axis sliding assembly includes: a Z-axis connecting rod, a Z-axis slide rail and a first connecting member;

[0027] One end of the Z-axis connecting rod is connected to the limiting ring, and the Z-axis slide rail has a Z-axis slide groove parallel to the axis of the Z-axis connecting rod. The Z-axis connecting rod is slidably connected in the Z-axis slide groove, and the Z-axis slide rail is connected to the first connecting member, and the first connecting member is connected to the pen body of the adsorption pen.

[0028] This approach enhances the device's adaptability to different implantation scenarios. In clinical applications, the position of the microelectrode array can be adjusted by adjusting the position of the adsorption pen, thereby optimizing the implant position and meeting various implantation requirements.

[0029] Optionally, the first connecting member is connected to the pen body of the adsorption pen via a ball head adapter.

[0030] In this solution, the first connector connects to the pen body via a ball-end adapter, giving the mount greater angular adjustment capabilities in three dimensions. The ball-end adapter's spherical structure allows the mount to rotate omnidirectionally around its center. During microelectrode array implantation, the operator can flexibly adjust the mount's angle based on the specific angle and spatial position of the target implant site, ensuring accurate placement of the microelectrode array at the optimal angle, significantly improving implant accuracy and adaptability.

[0031] Optionally, the first connecting member is connected to the adsorption pen via an XY-axis sliding assembly, wherein the XY-axis sliding assembly includes: an X-axis slide rail, an X-axis slider, a Y-axis slide rail, a Y-axis slider, and a second connecting member;

[0032] The first connecting member is connected to the X-axis slide rail, the X-axis slider is slidably connected to the X-axis slide rail, the X-axis slider is connected to the Y-axis slide rail, the Y-axis slider is slidably connected to the Y-axis slide rail, the Y-axis slider is connected to the second connecting member, and the second connecting member is connected to the pen body of the adsorption pen.

[0033] In this solution, the XY-axis slide assembly enables precise movement of the mount in both the X and Y dimensions. Combined with the previously mentioned Z-axis slide assembly, this allows the mount to be flexibly adjusted in three dimensions. When implanting a microelectrode array into a tissue area with complex shapes or locations, precise alignment of the X and Y axes can be achieved, significantly improving implant accuracy.

[0034] Optionally, it further includes: an XYZ mobile platform having a mobile end, and the mobile end is connected to the adsorption pen.

[0035] In this solution, the introduction of an XYZ mobile platform enables high-precision positioning of the adsorption pen and its attached microelectrode array in three-dimensional space. By controlling the movement of the mobile terminal in the X, Y, and Z directions, the operator can precisely place the microelectrode array at the target location. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0037] Figure 1 A three-dimensional diagram of a microelectrode array implant device provided by an embodiment of the present invention;

[0038] Figure 2 for Figure 1 The enlarged view of the part shown;

[0039] Figure 3 is a perspective view of the mounting base;

[0040] Figure 4 A three-dimensional diagram of the buckle;

[0041] Figure 5 This is a schematic diagram of the installation of the mounting base and the buckle;

[0042] Figure 6 is a schematic diagram of one embodiment of a microelectrode array;

[0043] Figure 7 A front perspective view of an embodiment of the suction pen;

[0044] Figure 8 This is a front view of a second embodiment of the adsorption pen;

[0045] Figure 9 This is a front view of a third embodiment of the adsorption pen;

[0046] Figure 10 This is a front view of a fourth embodiment of the adsorption pen;

[0047] Figure 11 A front view of a fifth embodiment of the adsorption pen;

[0048] Figure 12 for Figure 11 The schematic diagram of the use of the adsorption pen shown;

[0049] Figure 13 Main view of installing the suction cup for the suction pen;

[0050] Figure 14 for Figure 13 A front view of the suction cup shown in ;

[0051] Figure 15 A perspective view of a sixth embodiment of the adsorption pen;

[0052] Figure 16 for Figure 15 A partial enlarged view of

[0053] Figure 17 for Figure 15 The schematic diagram of the use of the adsorption pen shown;

[0054] Figure 18 An exploded view of another microelectrode array implant device provided by an embodiment of the present invention;

[0055] Figure 19 for Figure 18 Front view of the mesotrachea;

[0056] Figure 20 for Figure 18 The combined stereogram of

[0057] Figure 21 A three-dimensional diagram of another microelectrode array implant device provided by an embodiment of the present invention;

[0058] Figure 22 for Figure 22 A three-dimensional image from another angle;

[0059] Figure 23 for Figure 23 Exploded view of some structures in the figure;

[0060] Figure 24 A three-dimensional diagram of a fourth microelectrode array implant device provided by an embodiment of the present invention;

[0061] Figure 25 A perspective view of a fifth microelectrode array implant device provided by an embodiment of the present invention;

[0062] Figure 26 for Figure 25 A partial enlarged view of the adsorption pen area;

[0063] Figure 27 for Figure 26 A perspective view of the adapter ring.

[0064] Description of reference numerals:

[0065] 1. Adsorption pen; 101. Adsorption end; 102. Airflow channel;

[0066] 2. Mounting seat; 201. Mounting surface; 202. Bending portion; 203. Limiting ring;

[0067] 3. Buckle; 301. Bolt hole; 302. Abutment column; 303. Inner arc groove;

[0068] 4. Microelectrode array; 401. Connector; 402. Array member;

[0069] 5. Suction cup;

[0070] 6. Trachea; 601. Three-way valve;

[0071] 7. Positive pressure output component;

[0072] 8. Negative pressure output component;

[0073] 9. Z-axis connecting rod; 10. Z-axis slide rail; 11. First connecting member;

[0074] 12. Ball head adapter;

[0075] 13. X-axis slide rail; 14. X-axis slider; 15. Y-axis slide rail; 16. Y-axis slider; 17. Second connecting piece;

[0076] 18. XYZ moving platform; 19. Positioning connecting rod; 20. Adapter ring. DETAILED DESCRIPTION

[0077] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts shall fall within the scope of protection of the present invention.

[0078] In the description of the present invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate and simplify the description of the present invention. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limitations on the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0079] In the description of the present invention, it should be noted that, unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they may refer to fixed connections, detachable connections, or integral connections; and they may refer to direct connections or indirect connections through an intermediary. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0080] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0081] like Figure 1 、 Figure 2 As shown, a specific embodiment of the microelectrode array 4 implantation device provided in this embodiment includes: an adsorption pen 1, a mounting base 2, and a buckle 3. The adsorption pen 1 has an adsorption end 101, which can be connected to the array end of the microelectrode array 4 to be implanted by negative pressure or adhesion.

[0082] like Figure 2 、 Figure 3 As shown, the mounting base 2 is connected to the adsorption pen 1 .

[0083] Specifically, in some embodiments, the mounting base 2 has a bent portion 202, and the end of the bent portion 202 has a limiting ring 203, and the limiting ring 203 is connected to the pen body of the adsorption pen 1. Furthermore, the limiting ring 203 can be provided with a screw hole for passing a fastener. After the limiting ring 203 is sleeved on the pen body of the adsorption pen 1, the fastener can be passed through the screw hole and abutted against the pen body, thereby achieving the connection between the mounting base 2 and the adsorption pen 1. Of course, the above description is not restrictive. In some alternative embodiments, the adsorption pen 1 can also be connected to the limiting ring 203 in other ways, such as: snap connection or direct threaded connection.

[0084] like Figure 3As shown, the mounting base 2 has a mounting surface 201, which is used to connect to the connector 401 end of the microelectrode array 4 to be implanted. In some embodiments, the connector 401 end of the microelectrode array 4 has a positioning hole for positioning. The mounting base 2 has a positioning post on the mounting surface 201 for insertion into the positioning hole. This arrangement allows the mounting base 2 to cooperate with the buckle 3 to ensure a more secure connection of the microelectrode array 4.

[0085] like Figure 4 As shown, the buckle 3 has an insertion slot with an opening at one end, and the mounting base 2 is inserted into the buckle 3 through the opening of the insertion slot, thereby mating with the buckle 3. The upper side of the insertion slot has an abutment column 302, and the lower surface of the abutment column 302 has an inner arc-shaped groove 303. The inner arc-shaped groove 303 is used to mate with the side of the mounting base 2, so that the side of the mounting base 2 is embedded in the inner arc-shaped groove 303, making the connection between the mounting base 2 and the buckle 3 more stable.

[0086] like Figure 4 As shown, the buckle 3 has a bolt hole 301 on the side opposite to the mounting surface 201 , and the bolt hole 301 is suitable for threaded connection of a fastener.

[0087] like Figure 5 As shown, after the buckle 3 is connected to the mounting base 2, the fastener is inserted into the threaded hole of the buckle 3 from the bottom upward, and the fastener cooperates with the mounting surface 201 of the mounting base 2 to clamp the connector 401 of the microelectrode array 4 to be implanted.

[0088] It should be noted that if Figure 6 As shown, the microelectrode array 4 to be implanted comprises an array element 402 and a connector 401. The array element 402 is used to directly contact the tissue, and the connector 401 is used to connect to the electrical signal line. The array element 402 and the connector 401 can be electrically connected via ribbons.

[0089] This embodiment provides a technical solution that can accommodate microelectrode arrays 4 of varying sizes and types. The adsorption method of the adsorption pen 1 can be selected based on the material and surface characteristics of the microelectrode array 4, using either negative pressure or adhesive bonding to ensure a good connection. The design of the mounting surface 201 and the buckle 3 of the mounting base 2 offers a degree of versatility, allowing for adaptability to connectors 401 of varying sizes by adjusting the clamping force of the fasteners. This expands the device's applicability and improves its cost-effectiveness.

[0090] The mounting base 2, through the combination of the buckle 3 and the fastener, can firmly clamp the connector 401 of the microelectrode array 4. This design ensures that the connector 401 is stably fixed between the mounting surface 201 of the mounting base 2 and the fastener, preventing the connector 401 from shifting during the implantation process. This ensures a stable electrical connection between the microelectrode array 4 and the external device, providing a reliable foundation for subsequent neural signal acquisition or stimulation operations.

[0091] like Figure 7 As shown, in some embodiments, the adsorption pen 1 has an air flow channel 102, the adsorption end 101 has an air flow channel opening, the air flow channel opening is connected to a suction cup 5, the suction cup 5 has an adsorption port and an installation port, and the installation port is connected to the air flow channel opening. Such a setting provides a hardware foundation for the negative pressure adsorption method, so that the negative pressure can effectively act on the microelectrode array 4 to be implanted. When the air flow channel 102 is connected to an external negative pressure source, air enters through the air flow channel opening and is discharged through the air flow channel 102, forming a negative pressure area at the adsorption port of the suction cup. Adsorption is carried out through the adsorption port of the suction cup 5, which can increase the contact area with the microelectrode array 4, thereby enhancing the stability of adsorption, and thus firmly adsorbing the microelectrode array 4. This design can quickly establish and maintain a stable negative pressure, ensure the stable connection of the microelectrode array 4 on the adsorption pen 1, and will not fall off easily during the implantation process, thereby ensuring the smooth progress of the implantation operation. Specifically, the suction cup 5 is typically made of flexible silicone. Its outer surface has been hardened to provide a certain degree of support, minimizing deformation during negative pressure suction. Meanwhile, its inner surface remains soft to increase contact friction. This design ensures both safety during suction of the microelectrode array 4 and a stable grip.

[0092] like Figure 8 As shown, in some embodiments, the adsorption pen 1 has two adsorption ends 101, each of which has at least one airflow channel opening. This arrangement allows the microelectrode array 4 to be adsorbed from two different positions, ensuring a more uniform force applied to the microelectrode array 4 during the adsorption process. Furthermore, in some embodiments, two microelectrode arrays 4 can be adsorbed simultaneously, allowing for simultaneous implantation of two electrodes.

[0093] Of course, the above description is not restrictive. In some alternative embodiments, the adsorption pen 1 can have three or more adsorption channels, and the number of the airflow channel openings is also not limited and can be multiple.

[0094] like Figure 9As shown, in some embodiments, the adsorption pens 1 are arranged in parallel, each of which has an adsorption channel and at least one adsorption end 101. Multiple adsorption pens 1 arranged in parallel can simultaneously adsorb different parts of the microelectrode array 4, increasing the number of adsorption points and thus improving the stability and reliability of adsorption.

[0095] Of course, the above description is not restrictive. In some alternative embodiments, the number of the adsorption pens 1 can also be three or more.

[0096] like Figure 10 As shown, in some embodiments, each of the adsorption pens 1 has at least two adsorption tips 101. Each adsorption pen 1 is equipped with at least two adsorption tips 101, which can ensure that the force applied to the microelectrode array 4 during the adsorption process is more uniform. For irregularly shaped or large microelectrode arrays 4, a single adsorption tip 101 cannot ensure sufficient adsorption force support for all parts. Multiple adsorption tips 101 can apply adsorption force from different positions, effectively preventing the microelectrode array 4 from tilting, twisting, or falling off during adsorption and movement.

[0097] like Figure 11 As shown, in some embodiments, the adsorption end 101 of the adsorption pen 1 has a vertical bend. The vertical bend of the adsorption end 101 can meet the specific implantation requirements of certain electrodes such as microneedle electrodes.

[0098] like Figure 12 As shown, in actual operation, the microelectrode array 4 may be in a vertical state, and the ordinary straight adsorption end 101 may not be able to effectively contact and adsorb. The vertical bend can ensure that the adsorption end 101 can fully contact the microelectrode array 4, thereby improving the stability and reliability of adsorption.

[0099] like Figure 13 、 Figure 14 As shown, in some embodiments, the adsorption port at the airflow channel opening has a diameter of 1 to 10 mm. The adsorption port is designed to have a diameter of 1-10 mm, covering a variety of size ranges, and can adapt to microelectrode arrays 4 of different sizes. For small microelectrode arrays 4, a smaller-diameter adsorption port can accurately adsorb the target area and avoid unnecessary adsorption interference to the surrounding area; for larger-sized microelectrode arrays 4, a larger-diameter adsorption port can be selected to provide sufficient adsorption area and adsorption force to ensure the firmness of adsorption.

[0100] like Figure 15 、 Figure 16 and Figure 17As shown, in some embodiments, the adsorption end 101 of the adsorption pen 1 has an adhesive rod, and the end of the adhesive rod has an adhesive. Connecting with the microelectrode array 4 through the adhesive at the end can provide a very reliable adsorption force. Compared with the negative pressure adsorption method, the adhesive can form a tight bond between the microelectrode array 4 and the adsorption pen 1, which is particularly suitable for some scenarios with extremely high requirements for adsorption stability, such as when it is necessary to move a long distance or operate in a complex environment during the implantation process, ensuring that the microelectrode array 4 will not fall off during the entire operation, greatly improving the reliability of adsorption and ensuring the smooth progress of the implantation operation.

[0101] like Figure 18 As shown, in some embodiments, the air flow channel 102 of the suction pen 1 is connected to an air tube 6, and the other end of the air tube 6 is connected to an air pressure control unit. When the microelectrode array 4 needs to be adsorbed, the air pressure control unit generates negative pressure, causing the suction pen 1 to adsorb the microelectrode array 4; when the microelectrode array 4 needs to be released, the air pressure control unit releases the negative pressure, allowing the suction cup and microelectrode array 4 to separate.

[0102] like Figure 18 、 Figure 19 and Figure 20 As shown, in some embodiments, the air pressure control component includes: a positive pressure output component 7 and a negative pressure output component 8, and the output ends of the positive pressure output component 7 and the negative pressure output component 8 are connected to the air pipe 6 through a three-way valve 601.

[0103] In the above scheme, the air pressure control component consists of a positive pressure output component 7 and a negative pressure output component 8, which operate independently and can accurately control the output of positive and negative pressure respectively. The positive pressure output component 7, the negative pressure output component 8 and the trachea 6 are connected via a three-way valve 601 to achieve rapid switching between positive and negative pressure. After the actual implant is completed to the specified position and depth, if the suction cup fails to separate from the microelectrode array 4 when the suction pen 1 is withdrawn, the three-way valve 601 needs to be operated to switch from negative pressure output to positive pressure output. The positive pressure acts on the suction cup through the trachea 6 and the airflow channel 102, which can easily separate the microelectrode array 4 from the suction cup.

[0104] It should be noted that, in this embodiment, the positive pressure output element 7 may include an air bag, an air pump, a syringe, a balloon, or a positive pressure pump. The negative pressure output element 8 may be a vacuum pump.

[0105] like Figure 21 、 Figure 22 As shown, in some embodiments, the mounting base 2 and the adsorption pen 1 are connected via a Z-axis sliding assembly, and the Z-axis sliding assembly includes: a Z-axis connecting rod 9, a Z-axis slide rail 10 and a first connecting member 11;

[0106] One end of the Z-axis connecting rod 9 is connected to the limiting ring 203, and the Z-axis slide rail 10 has a Z-axis slide groove parallel to the axis of the Z-axis connecting rod 9. The Z-axis connecting rod 9 is slidably connected in the Z-axis slide groove, and the Z-axis slide rail 10 is connected to the first connecting member 11, and the first connecting member 11 is connected to the pen body of the adsorption pen 1.

[0107] The above solution enhances the adaptability of the device to different implantation scenarios. In clinical applications, the adsorption pen 1 can be adjusted according to specific circumstances to achieve the optimal implantation position of the microelectrode array 4 in the Z-axis direction to meet diverse needs.

[0108] like Figure 23 As shown, in some embodiments, the first connecting member 11 is connected to the pen body of the adsorption pen 1 via a ball head adapter 12.

[0109] In the above solution, the first connector 11 is connected to the body of the adsorption pen 1 via the ball adapter 12, giving the mounting base 2 a wider range of angle adjustment capabilities in three-dimensional space. The spherical structure of the ball adapter 12 allows the mounting base 2 to rotate omnidirectionally around the center of the sphere. During the microelectrode array 4 implantation process, the operator can flexibly adjust the angle of the mounting base 2 based on the specific angle and spatial position of the target implantation site, ensuring that the microelectrode array 4 is accurately implanted at the optimal angle, greatly improving the implantation accuracy and adaptability.

[0110] like Figure 24 As shown, in some embodiments, the first connecting member 11 is connected to the adsorption pen 1 through an XY-axis sliding assembly, and the XY-axis sliding assembly includes: an X-axis slide rail 13, an X-axis slider 14, a Y-axis slide rail 15, a Y-axis slider 23 and a second connecting member 24;

[0111] The first connecting member 11 is connected to the X-axis slide rail 13, the X-axis slider 14 is slidably connected to the X-axis slide rail 13, the X-axis slider 14 is connected to the Y-axis slide rail 15, the Y-axis slider 23 is slidably connected to the Y-axis slide rail 15, the Y-axis slider 23 is connected to the second connecting member 24, and the second connecting member 24 is connected to the pen body of the adsorption pen 1.

[0112] In this solution, the XY-axis sliding assembly enables precise movement of the adsorption pen 1 in both the X and Y dimensions. Combined with the previously mentioned Z-axis sliding assembly, this allows the adsorption pen 1 to be flexibly adjusted in three dimensions. When implanting the microelectrode array 4 into tissue areas of complex shapes or locations, precise alignment with the target point can be achieved by adjusting the X and Y-axis positions, significantly improving implant accuracy.

[0113] like Figure 25 、 Figure 26As shown, in some embodiments, it also includes: an XYZ moving platform 25, having a mobile end, and the mobile end is connected to the adsorption pen 1.

[0114] In the above scheme, the introduction of an XYZ mobile platform enables the adsorption pen 1 and its connected microelectrode array 4 to achieve high-precision positioning in three-dimensional space. By controlling the movement of the mobile terminal in the X, Y, and Z directions, the operator can accurately place the microelectrode array 4 at the target location.

[0115] like Figure 26 、 Figure 27 As shown, in some embodiments, the movable end of the XYZ movable platform has a positioning link 26, and the positioning link 26 is connected to the pen body of the adsorption pen 1 through an adapter ring 27. The adapter ring 27 has two mounting holes arranged in parallel, one of which is connected to the positioning link 26, and the other is connected to the pen body of the adsorption pen 1.

[0116] In the above solution, the positioning link 26 is connected to the pen body of the suction pen 1 via the adapter ring 27, which can accurately transmit the precise positioning of the XYZ mobile platform to the suction pen 1. The XYZ mobile platform controls the position of the positioning link 26 through the adapter ring 27, allowing the suction pen 1 to be accurately moved to the target position.

[0117] Directions:

[0118] The first step is to select the adsorption method and components: Depending on the material, surface characteristics, and implantation scenario of the microelectrode array 4, choose between negative pressure or adhesive adsorption. If using negative pressure adsorption, determine the number of adsorption tips 101 on the adsorption pen 1; if using adhesive adsorption, prepare an adhesive stick with adhesive.

[0119] In the second step, align the positioning hole at the end of the connector 401 of the microelectrode array 4 with the positioning post on the mounting surface 201 of the mounting seat 2 and insert it, then match the buckle 3 with the mounting seat 2, insert the fastener from the bottom upward and tighten it to clamp the connector 401 of the microelectrode array 4.

[0120] When using negative pressure adsorption, connect an external negative pressure source to allow air to enter the air flow channel 102 through the air flow channel opening, forming a negative pressure adsorption microelectrode array 4 at the adsorption opening of the suction cup. If there are multiple adsorption ends 101, multiple adsorption pens 1, etc., adjust the position to ensure stable adsorption.

[0121] When adhesive adsorption is used, the adhesive at the end of the adhesive stick is brought into contact with the microelectrode array 4 , and the adhesive is allowed to take effect, ensuring that the microelectrode array 4 is firmly connected to the adsorption end 101 of the adsorption pen 1 .

[0122] In the third step, according to the requirements of the implantation site, the Z-axis position of the adsorption pen 1 is adjusted through the Z-axis sliding component, the angle of the adsorption pen 1 is adjusted through the ball head adapter 12, the X and Y axis positions of the adsorption pen 1 are adjusted through the XY axis sliding component, or the position of the adsorption pen 1 and the microelectrode array 4 in three-dimensional space is precisely controlled through the XYZ moving platform 25, so that the microelectrode array 4 reaches the optimal implantation position and angle.

[0123] Step 4: After confirming the position, angle, and connection of the microelectrode array 4, implant it into the target tissue area. Observe carefully during the implantation process to ensure that the microelectrode array 4 does not move.

[0124] Step 5: After implantation is complete, the air pressure control unit is operated to release the suction of the microelectrode array 4. If the microelectrode array 4 cannot be released in time due to deformation of the suction cup, the pressure is switched to positive pressure output. The positive pressure acts on the suction end 101 through the air tube 6 and air flow channel 102, separating the suction cup from the microelectrode array 4, completing the implantation operation.

[0125] Although the embodiments of the present invention have been described with reference to the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations shall all fall within the scope defined by the present invention.

Claims

1. A microelectrode array implant device, characterized in that: include: An adsorption pen (1) has an adsorption end (101), wherein the adsorption end (101) is connected to the array end of the microelectrode array (4) to be implanted by negative pressure or adhesion; A mounting base (2) connected to the adsorption pen (1), the mounting base (2) having a mounting surface (201), the mounting surface (201) being used to connect to a connector (401) end of a microelectrode array (4) to be implanted; A buckle (3) is connected to the mounting seat (2), and a bolt hole (301) is provided on a surface of the buckle (3) opposite to the mounting surface (201). A fastener is connected in the bolt hole (301) via a threaded structure, and the fastener and the mounting surface (201) are suitable for clamping a connector (401) of the microelectrode array (4) to be implanted.

2. The microelectrode array implant device according to claim 1, characterized in that: The adsorption pen (1) has an air flow channel (102) therein, the adsorption end (101) has an air flow channel opening, the air flow channel opening is connected to a suction cup (5), the suction cup (5) has an adsorption opening and an installation opening, and the installation opening is connected to the air flow channel opening.

3. The microelectrode array implant device according to claim 2, characterized in that: The adsorption pen (1) has at least two adsorption ends (101), and each adsorption end (101) has at least one airflow channel opening.

4. The microelectrode array implant device according to claim 2, characterized in that: The adsorption pens (1) have at least two adsorption pens arranged in parallel, each of the adsorption pens (1) has an adsorption channel therein, and each of the adsorption pens (1) has at least one adsorption end (101).

5. The microelectrode array implant device according to claim 4, characterized in that: Each of the adsorption pens (1) has at least two adsorption ends (101).

6. The microelectrode array implant device according to claim 1, characterized in that: The adsorption end (101) of the adsorption pen (1) has a vertical bend.

7. The microelectrode array implant device according to claim 2, characterized in that: The diameter of the suction port of the suction cup (5) is 1 to 10 mm.

8. The microelectrode array implant device according to claim 1, characterized in that: The adsorption end (101) of the adsorption pen (1) has an adhesive rod, and the end of the adhesive rod has adhesive.

9. The microelectrode array implant device according to claim 2, characterized in that: The air flow channel (102) of the adsorption pen (1) is connected to an air pipe (6), and the other end of the air pipe (6) is connected to an air pressure control component.

10. The microelectrode array implant device according to claim 9, characterized in that: The air pressure control component comprises a positive pressure output component (7) and a negative pressure output component (8), and the output ends of the positive pressure output component (7) and the negative pressure output component (8) are connected to the air pipe (6) through a three-way valve (601).

11. The microelectrode array implant device according to claim 1, characterized in that: The mounting seat (2) has a bending portion (202), the end of the bending portion (202) has a limiting ring (203), and the limiting ring (203) is connected to the pen body of the adsorption pen (1).

12. The microelectrode array implant device according to claim 11, characterized in that: The mounting seat (2) is connected to the adsorption pen (1) via a Z-axis sliding assembly, and the Z-axis sliding assembly comprises: a Z-axis connecting rod (9), a Z-axis slide rail (10) and a first connecting member (11); One end of the Z-axis connecting rod (9) is connected to the limiting ring (203), and the Z-axis slide rail (10) has a Z-axis slide groove parallel to the axis of the Z-axis connecting rod (9), and the Z-axis connecting rod (9) is slidably connected in the Z-axis slide groove. The Z-axis slide rail (10) is connected to the first connecting member (11), and the first connecting member (11) is connected to the pen body of the adsorption pen (1).

13. The microelectrode array implant device according to claim 12, characterized in that: The first connecting member (11) is connected to the pen body of the adsorption pen (1) via a ball head adapter (12).

14. The microelectrode array implant device according to claim 12, characterized in that: The first connecting member (11) is connected to the adsorption pen (1) via an XY-axis sliding assembly, wherein the XY-axis sliding assembly comprises: an X-axis slide rail (13), an X-axis slider (14), a Y-axis slide rail (15), a Y-axis slider (23) and a second connecting member (24); The first connecting member (11) is connected to the X-axis slide rail (13), the X-axis slider (14) is slidably connected to the X-axis slide rail (13), the X-axis slider (14) is connected to the Y-axis slide rail (15), the Y-axis slider (23) is slidably connected to the Y-axis slide rail (15), the Y-axis slider (23) is connected to the second connecting member (24), and the second connecting member (24) is connected to the pen body of the adsorption pen (1).

15. The microelectrode array implant device according to any one of claims 1 to 14, characterized in that: Also includes: The XYZ mobile platform (25) has a mobile end, and the mobile end is connected to the adsorption pen (1).

Images