Ceramic insulator microcrack detection method and system

Abstract

The invention provides a ceramic insulator microcrack detection method and system, and the method comprises the steps: obtaining scanning data of a to-be-detected ceramic insulator based on a constructed terahertz detection system, comparing the scanning data with reference data in a preset comparison database, and determining a crack state based on a comparison result. Under the condition of determining that the to-be-detected ceramic insulator has a crack based on the crack state, comparing the scanning image of each dimension in the scanning data with the scanning image of each dimension in the reference data, determining multi-dimensional characteristic information of the crack, and generating a crack distribution image based on the multi-dimensional characteristic information of the crack; and the surface and internal cracks of the ceramic insulator can be accurately detected in a non-contact manner.

Description

Technical Field

[0001] The present invention relates to the field of crack detection, and in particular to a method and system for detecting micro-cracks in ceramic insulators. Background Art

[0002] Over long-term operation, ceramic components such as post insulators and lightning arresters can develop defects such as aging or microcracks on the surface and interior of the porcelain sleeves due to localized stresses and high voltage environments. These defects can then develop into visible cracks, eventually exceeding their maximum strength and causing fracture. Anti-pollution flashover coatings, primarily silicone rubber with special fillers, offer a certain degree of elasticity, effectively preventing flashover hazards and maintaining the insulator's required anti-pollution and hydrophobic properties. Applied to the outer layer of the material, the coating adheres tightly to the insulator under normal conditions and maintains a defined thickness. During long-term operation and maintenance, stress changes caused by various factors can lead to early ceramic chipping and microcracks due to localized deformation and stretching. However, after applying anti-pollution flashover coatings, these early chipping and microcracks hidden beneath the coating cannot be detected through visual inspection alone. Even if a crack has formed a fracture, it is difficult to detect as long as there is no significant dislocation. Furthermore, early cracks are not accompanied by heat or discharge, and cannot be identified using infrared or ultraviolet imaging. Ultrasonic testing, because it uses contact testing and requires a coupling agent, is primarily used for quality inspection during the production and pre-installation stages of ceramic bushings. This testing can detect defects such as abnormal grains, grain boundary segregation layers, lamellar precipitates, granular precipitates, pores, and cracks within the ceramic. After installation and operation, contact testing must be performed with power off, making in-situ testing with power on impossible.

[0003] Therefore, it is of great significance to accurately detect crack defects in ceramic insulators under anti-pollution flashover coatings under non-contact conditions. Summary of the Invention

[0004] In order to solve the problem that the prior art cannot perform non-contact crack detection, the present invention proposes a method and system for detecting micro-cracks in ceramic insulators.

[0005] In a first aspect, a method for detecting microcracks in a ceramic insulator is provided, comprising:

[0006] Acquire scanning data of a ceramic insulator to be inspected based on the constructed terahertz detection system, wherein the ceramic insulator to be inspected is an insulator under an anti-pollution flashover coating;

[0007] Comparing the scan data with reference data in a preset comparison database, and determining the crack state based on the comparison result, wherein the reference data is pre-collected defect-free scan data;

[0008] When it is determined based on the crack state that there is a crack in the ceramic insulator to be inspected, the scanned images of each dimension in the scanned data are compared with the scanned images of each dimension in the reference data to determine multi-dimensional characteristic information of the crack, and a crack distribution image is generated based on the multi-dimensional characteristic information of the crack.

[0009] Preferably, comparing the scan data with reference data in a preset comparison database and determining the crack state based on the comparison result includes:

[0010] Aligning the peak position of the a scan signal in the scan data with the peak position corresponding to the a reference scan signal of the reference data in a preset comparison database;

[0011] Determining whether there is a new echo peak in the a-scan signal of the scan data;

[0012] If so, the crack state is determined to be a crack, and the crack position information is determined based on the newly added echo peak;

[0013] If not, the crack state is determined to be no crack.

[0014] Preferably, determining the crack location information based on the newly added echo peak includes:

[0015] When the newly added echo peak is a delamination echo and the newly added echo peak shows an echo change, it is determined that the crack is located on the surface of the ceramic insulator to be tested, wherein the delamination echo is an echo of the interface between the anti-pollution flashover coating and the ceramic; or,

[0016] When the newly added echo peak is located in the echo following the delamination echo, it is determined that the crack is located inside the ceramic insulator to be tested;

[0017] The depth of the crack in the ceramic insulator to be inspected is proportional to the distance between the newly added echo peak and the delamination echo.

[0018] Preferably, the comparing the scanned images of each dimension in the scanned data with the scanned images of each dimension in the reference data to determine the multi-dimensional characteristic information of the crack includes:

[0019] generating a b-scan image based on a plurality of a-scan images located in the same one-dimensional direction in the scan data, and determining crack defect information based on comparing the b-scan image with b-scan reference data in the reference data, wherein the crack defect information reflects the distribution and depth of cracks in the ceramic insulator to be inspected;

[0020] Determining crack plane distribution information inside the ceramic insulator to be inspected based on a comparison between the C-scan image in the scan data and the C-scan reference data in the reference data;

[0021] Multi-dimensional characteristic information of the crack is determined based on the crack defect information, the crack plane distribution information and the crack position information.

[0022] In a second aspect, the present invention provides a ceramic insulator microcrack detection system, characterized by comprising:

[0023] An acquisition module is used to acquire scanning data of a ceramic insulator to be detected based on the constructed terahertz detection system, wherein the ceramic insulator to be detected is an insulator under an anti-pollution flashover coating;

[0024] a comparison module, configured to compare the scan data with reference data in a preset comparison database, and determine the crack state based on the comparison result, wherein the reference data is pre-collected defect-free scan data;

[0025] A determination module is used to determine, based on the crack state, that there is a crack in the ceramic insulator to be inspected, compare the scanned images of each dimension in the scanned data with the scanned images of each dimension in the reference data, determine multi-dimensional characteristic information of the crack, and generate a crack distribution image based on the multi-dimensional characteristic information of the crack.

[0026] Preferably, the comparison module includes:

[0027] Aligning the peak position of the a scan signal in the scan data with the peak position corresponding to the a reference scan signal of the reference data in a preset comparison database;

[0028] Determining whether there is a new echo peak in the a-scan signal of the scan data;

[0029] If so, the crack state is determined to be a crack, and the crack position information is determined based on the newly added echo peak;

[0030] If not, the crack state is determined to be no crack.

[0031] Preferably, the comparison module determines the crack location information based on the newly added echo peak, including:

[0032] When the newly added echo peak is a delamination echo and the newly added echo peak shows an echo change, it is determined that the crack is located on the surface of the ceramic insulator to be tested, wherein the delamination echo is an echo of the interface between the anti-pollution flashover coating and the ceramic; or,

[0033] When the newly added echo peak is located in the echo following the delamination echo, it is determined that the crack is located inside the ceramic insulator to be tested;

[0034] The depth of the crack in the ceramic insulator to be inspected is proportional to the distance between the newly added echo peak and the delamination echo.

[0035] Preferably, the determining module compares the scanned images of each dimension in the scanned data with the scanned images of each dimension in the reference data to determine the multi-dimensional characteristic information of the crack, including:

[0036] generating a b-scan image based on a plurality of a-scan images located in the same one-dimensional direction in the scan data, and determining crack defect information based on comparing the b-scan image with b-scan reference data in the reference data, wherein the crack defect information reflects the distribution and depth of cracks in the ceramic insulator to be inspected;

[0037] Determining crack plane distribution information inside the ceramic insulator to be inspected based on a comparison between the C-scan image in the scan data and the C-scan reference data in the reference data;

[0038] Multi-dimensional characteristic information of the crack is determined based on the crack defect information, the crack plane distribution information and the crack position information.

[0039] In another aspect, the present application further provides an electronic device, comprising: at least one processor and a memory; the memory and the processor are connected via a bus;

[0040] The memory is used to store one or more programs;

[0041] When the one or more programs are executed by the at least one processor, the above-mentioned method for detecting micro-cracks in ceramic insulators is implemented.

[0042] On the other hand, the present application also provides a computer-readable storage medium having a computer program stored thereon, and when the computer program is executed, the method for detecting microcracks in ceramic insulators as described above is implemented.

[0043] Compared with the prior art, the present invention has the following beneficial effects:

[0044] The present invention provides a method and system for detecting microcracks in ceramic insulators. The method obtains scanning data of a ceramic insulator to be detected based on a constructed terahertz detection system, compares the scanning data with reference data in a preset comparison database, and determines the crack status based on the comparison result. When it is determined that the ceramic insulator to be detected has a crack based on the crack status, the scanning image of each dimension in the scanning data is compared with the scanning image of each dimension in the reference data to determine multi-dimensional characteristic information of the crack, and generates a crack distribution image based on the multi-dimensional characteristic information of the crack, thereby realizing non-contact and accurate detection of cracks on the surface and inside of the ceramic insulator. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 Flowchart of the method for detecting microcracks in ceramic insulators of the present invention;

[0046] Figure 2 This is a specific flow chart of the method for detecting microcracks in ceramic insulators of the present invention;

[0047] Figure 3 FIG1 is a structural diagram of a detection system for a method for detecting microcracks in ceramic insulators according to the present invention;

[0048] Figure 4 Schematic diagram of the characteristics of the test piece of the ceramic insulator micro-crack detection method of the present invention;

[0049] Figure 5 This is an A-scan image of a specimen detected by the method for detecting microcracks in a ceramic insulator according to the present invention;

[0050] Figure 6 Schematic diagram of scanning signals of the method for detecting micro-cracks in ceramic insulators of the present invention;

[0051] Figure 7 This is a B-scan diagram of a specimen detected by the method for detecting microcracks in a ceramic insulator according to the present invention;

[0052] Figure 8 This is a C-scan image of the specimen coating of the ceramic insulator microcrack detection method of the present invention;

[0053] Figure 9 C-scan images of gaps at different depths for the method for detecting microcracks in ceramic insulators of the present invention;

[0054] Figure 10 3D images of coatings and gaps in the ceramic insulator microcrack detection method of the present invention;

[0055] Figure 11 Schematic diagram of the structure of the ceramic insulator micro-crack detection system of the present invention;

[0056] Figure 12 The figure is a schematic structural diagram of an electronic device of the present invention. DETAILED DESCRIPTION

[0057] The present invention aims to detect cracks inside ceramic pillars covered by anti-pollution flashover coatings. A vertical detection device that transmits and receives terahertz signals on one side is used to penetrate the anti-pollution flashover coating and the interior of the ceramic in a non-contact manner to detect crack defects on the surface and inside of the ceramic. This not only includes the interface between the anti-pollution flashover coating and the ceramic pillar, but also includes the determination of whether there is an interface inside the ceramic pillar. Specifically, the detection target is the cracks inside the ceramic pillar covered by the anti-pollution flashover coating; by comparing the defect-free signal to see whether a new crack echo appears, the existence of the crack is determined, and further imaging is performed.

[0058] The implementation of the present invention can detect crack defects inside the ceramic pillar covered by the anti-pollution flashover coating under non-contact conditions. It can detect the ceramic pillar insulator before and after installation, and is also feasible for detection under energized conditions, providing a new method and system for the quality assessment of ceramic pillar insulators.

[0059] In order to better understand the present invention, the present invention will be further described below with reference to the accompanying drawings and embodiments.

[0060] Example 1:

[0061] A method and system for detecting micro cracks in ceramic insulators, such as Figure 1 Shown, including:

[0062] Step S1: acquiring scanning data of a ceramic insulator to be inspected based on the constructed terahertz detection system, wherein the ceramic insulator to be inspected is an insulator under an anti-pollution flashover coating;

[0063] Step S2: comparing the scan data with reference data in a preset comparison database, and determining the crack state based on the comparison result, wherein the reference data is pre-collected defect-free scan data;

[0064] Step S3: When it is determined based on the crack state that there is a crack in the ceramic insulator to be inspected, the scanned images of each dimension in the scanned data are compared with the scanned images of each dimension in the reference data to determine the multi-dimensional characteristic information of the crack, and a crack distribution image is generated based on the multi-dimensional characteristic information of the crack.

[0065] In this embodiment, the process of comparing the scan data with the reference data in the preset comparison database and determining the crack state based on the comparison result in step S2 includes:

[0066] Aligning the peak position of the a scan signal in the scan data with the peak position corresponding to the a reference scan signal of the reference data in a preset comparison database;

[0067] Determining whether there is a new echo peak in the a-scan signal of the scan data;

[0068] If so, the crack state is determined to be a crack, and the crack position information is determined based on the newly added echo peak;

[0069] If not, the crack state is determined to be no crack.

[0070] In this embodiment, the process of determining the presence of a crack and determining the crack location information based on the newly added echo peak includes:

[0071] When the newly added echo peak is a delamination echo and the newly added echo peak shows an echo change, it is determined that the crack is located on the surface of the ceramic insulator to be tested, wherein the delamination echo is an echo of the interface between the anti-pollution flashover coating and the ceramic; or,

[0072] When the newly added echo peak is located in the echo following the delamination echo, it is determined that the crack is located inside the ceramic insulator to be tested;

[0073] The depth of the crack in the ceramic insulator to be inspected is proportional to the distance between the newly added echo peak and the delamination echo.

[0074] In this embodiment, the process of comparing the scanned images of each dimension in the scanned data with the scanned images of each dimension in the reference data in step S3 to determine the multi-dimensional characteristic information of the crack includes:

[0075] generating a b-scan image based on a plurality of a-scan images located in the same one-dimensional direction in the scan data, and determining crack defect information based on comparing the b-scan image with b-scan reference data in the reference data, wherein the crack defect information reflects the distribution and depth of cracks in the ceramic insulator to be inspected;

[0076] Determining crack plane distribution information inside the ceramic insulator to be inspected based on a comparison between the C-scan image in the scan data and the C-scan reference data in the reference data;

[0077] Multi-dimensional characteristic information of the crack is determined based on the crack defect information, the crack plane distribution information and the crack position information.

[0078] The terahertz detection method proposed in the present invention is non-contact detection, and can simultaneously detect surface and internal cracks in ceramic insulators hidden underneath the anti-pollution flashover coating. Therefore, it is possible to detect microcracks in ceramic insulators without interrupting power supply. In addition, the terahertz technology is used to quantitatively reconstruct the thickness distribution of the anti-pollution flashover coating and accurately locate areas with abnormal coating thickness, thus realizing quantitative evaluation of the coating quality.

[0079] Example 2:

[0080] The present invention proposes a method and system for detecting micro cracks in ceramic insulators, which is specifically applied to the anti-pollution flashover coating. The specific implementation steps of the present invention are as follows: Figure 2 shown.

[0081] Step 1: Establish a non-contact terahertz detection system. Figure 3 As shown, the detection system utilizes a single-sided terahertz pulse imaging system, comprising a terahertz signal transceiver module, a beam transmission module, a host module, and a scanning imaging module. The terahertz signal transceiver module includes a terahertz transmitter, an off-axis parabolic mirror, a beam splitter, a terahertz lens, and a terahertz detector. The terahertz signal is output from the transmitter, collimated by the off-axis parabolic mirror, and reflected 45 degrees before being incident on the beam splitter and transmitted through it. The transmitted terahertz wave is focused by the terahertz lens onto the sample being measured, interacting with the sample and being reflected. The reflected signal then travels back through the terahertz lens to the beam splitter, where it is reflected by another parabolic mirror, focusing the terahertz signal onto the terahertz detector. These components are packaged into the terahertz signal transceiver module. The terahertz host includes the detection system's laser light source, laser beam splitter, data acquisition system, host computer, control interface, power supply and communication cables, and housing. It primarily splits the laser beam into two separate beams for output. The terahertz transceiver module also connects the laser excitation signal and electrical signal to the terahertz transceiver module. The beam transmission module is the connecting cable between the host module and the terahertz transceiver module, capable of transmitting both the beam and the electrical signal. Its two ends are connected to the host module and the terahertz transceiver module, respectively. The scanning control module is a positioning control system that places the terahertz transceiver head in conjunction with the scanning module to scan signals at different locations on the sample. Alternatively, the sample can be linked to the scanning module, but the terahertz transceiver module is different, and by scanning the moving sample, signals at different locations on the sample can also be obtained.

[0082] Step 2: Establish a comparison database.

[0083] First, a standard defect-free anti-pollution flashover coating is applied to a ceramic insulator specimen, or a defect-free area of ​​an already installed insulator is used as a standard specimen. Standard defect-free data is collected as a comparison reference database. The standard defect-free specimen should be as consistent as possible with the installed specimen. The anti-pollution flashover coating uses the same materials and spraying process, adheres tightly to the ceramic interface, and has a smooth, contaminant-free surface. The A-scan data of the standard defect-free terahertz data only includes scattered echoes from the surface of the anti-pollution flashover coating and from the interface between the anti-pollution flashover coating and the ceramic.

[0084] Step 3: Data acquisition. Detect the target specimen or the inspection area outside the defect-free area of ​​the specimen, and collect terahertz data of a certain target area of ​​the anti-pollution flashover coating-coated ceramic insulator by scanning. The number of collection points is X*Y group A scan data, X is the number of scanned rows, and Y is the number of scanned columns. First, align the X*Y group data with the standard defect-free data one by one, that is, align the peak position of the scattered echo on the surface of the anti-pollution flashover coating with the reference signal. During the comparison process, if a new signal peak appears relative to the standard defect-free data, then the position corresponds to the presence of a defect. When it is a defect on the ceramic surface, it will cause the echo at the interface between the anti-pollution flashover coating and the ceramic to split, extend, deform, and even cause the standard echo peak to disappear. When a crack defect appears inside the ceramic, a new echo will appear after the echo at the interface between the anti-pollution flashover coating and the ceramic. The deeper the crack is in the ceramic, the farther the new echo will be from the echo at the interface between the anti-pollution flashover coating and the ceramic. Moreover, the larger the crack gap, the new echo will gradually extend and split into two peaks or multiple peaks.

[0085] Step 4: Data Processing. During data processing, the aligned signals are reconstructed layer by layer from the surface echo peak of the anti-flashover coating. Differences between adjacent points in the image reflect the distribution of defects and can also serve as a basis for determining whether a defect exists. For abnormal areas in the C-scan pattern, the corresponding B-scan image is detected by mapping the X and Y coordinates. This is then compared with the cross-sectional A-scan data to further confirm the characteristics of the defect.

[0086] Step 5: Imaging. Finally, the spatial distribution of defects is revealed through 3D visualization.

[0087] Example 3:

[0088] The detection method includes a detection system, a comparison test piece, data processing and a judgment criterion. Figure 3 As shown in the figure, the detection system adopts a single-side terahertz pulse imaging system, which includes a terahertz pulse signal transceiver module, a beam propagation control module, a host module, and a scanning imaging module. The detection is carried out in a non-contact manner, irradiating the ceramic insulator coated with the anti-fouling flashover coating in a reflective manner. Figure 4 As shown, the test piece is compared with the known defect-free area, and the data of the defect-free area is recorded as the comparison standard defect-free data. The test piece is used as the standard defect-free test piece. By receiving the reflected terahertz signal and comparing it with the standard data, it is determined whether the defect exists. The existence and severity of the defect are further determined through A-scan, B-scan, C-scan imaging and 3D imaging. Figure 5 As shown in the figure, the A-scan image is used to judge the internal cracks of the ceramic. By comparing it with the defect-free data, crack echoes appear when the ceramic contains cracks, and the echo position reflects the crack depth. Figure 6As shown, the signal corresponding to point s1 is defect-free data, and the remaining s2-s5 correspond to different defect locations. By aligning the time positions of the first peak of the defect-free data with the defective data, it can be found that the defect-free position only has the first and second peaks, while the defective s2-s5 signals have more echo peaks. The appearance of echoes can determine the presence of defects, and the time position of the peak represents the depth of the defect. Knowing the refractive index of the ceramic material, the depth of the gap defect below the coating and ceramic interface can be calculated based on the time difference between the time position of the defect peak and the time position of the second peak using the formula d=ct / 2n, where d represents the distance to the target, c represents the speed of light or electromagnetic wave propagation in the medium, t represents the round-trip time from emission to reception of light or electromagnetic waves, and n represents the refractive index of the medium.

[0089] Among them, E0 represents the incident electric field intensity, E1, E2, and E3 represent the electric field intensity in different dielectric layers, and d p d g d c Indicates the thickness of each dielectric layer, n a 、n p 、n c 、n g Represents the refractive index of different media.

[0090] It can be observed that at point s1, only the first and second interface echoes are generated. After the signal enters the ceramic, no new echo is formed, indicating that there are no defects such as cracks inside the ceramic at this location. Correspondingly, at points s2, s3, and s5, new echoes are formed after the second interface on the characteristic image. The new echo peaks at points s2 and s3 are downward, indicating that a crack has appeared inside the ceramic at this location. When the terahertz signal enters the gap from the ceramic medium, the peak phase reverses and the peak is downward. The value of the gap is very small. When the signal passes through the gap and reaches the ceramic interface again, an echo with an upward peak is generated. The terahertz signal transmission at point s5 produces the same characteristics. Compared with points s2 and s3, the position of the gap is closer to the second interface. For point s2, the downward echo position is about 3.1ps away from the second interface. The refractive index of the ceramic is about 2.3, and the calculated position of the gap is 0.2mm below the second interface. The echo at point s4 is significantly delayed, also showing an echo that first moves downward and then upward, indicating that the crack is located deeper within the ceramic. The delay relative to the second interface is approximately 5.68 ps, and the crack depth at this point is approximately 0.37 mm. The crack at point s5 is shallower than that at point s2.

[0091] like Figure 7 As shown in the figure, the B-scan image is used to judge the internal cracks of ceramics. By comparing with the defect-free data, the crack layer B-scan distribution image appears when the ceramic contains cracks. The crack layer image reflects the distribution and depth of the cracks. Figure 8As shown in the figure, the internal cracks of ceramics are judged by C-scan images. By comparing with the defect-free data, when the ceramic contains cracks, the C-scan distribution image of the crack layer appears. The crack layer image reflects the distribution of cracks. Figure 9 The following is a C-scan distribution image of the crack layer at different depths inside the ceramic. The crack layer image reflects the distribution of cracks at different depths in the ceramic. Figure 10 As shown in the figure, the internal cracks of the ceramic are judged by 3D reconstructed images. By comparing with the defect-free data, a 3D scanning distribution image of the crack layer appears when the ceramic contains cracks, reflecting the overall morphology, distribution and depth of the cracks.

[0092] The present invention adopts terahertz multi-dimensional imaging, which can intuitively depict the position, depth and specific trend of ceramic cracks under the anti-fouling flash paint, and clearly present the spatial distribution of cracks under the coating interface. The signal characteristics are obvious. During the comparison process, if a new signal peak appears relative to the standard defect-free data, then the position corresponds to the existence of a defect. When it is a defect on the surface of the ceramic, it will cause the echo at the interface between the anti-fouling flash coating and the ceramic to split, extend, deform, and even cause the standard echo peak to disappear. When a crack defect appears inside the ceramic, a new echo will appear after the echo at the interface between the anti-fouling flash coating and the ceramic. The deeper the crack is in the ceramic, the farther the new echo is from the echo at the interface between the anti-fouling flash coating and the ceramic. Moreover, the larger the crack gap is, the new echo will gradually extend and split into two peaks or multiple peaks.

[0093] Example 4:

[0094] The present invention based on the same inventive concept also provides a ceramic insulator microcrack detection system, such as Figure 11 As shown, including:

[0095] An acquisition module is used to acquire scanning data of a ceramic insulator to be detected based on the constructed terahertz detection system, wherein the ceramic insulator to be detected is an insulator under an anti-pollution flashover coating;

[0096] a comparison module, configured to compare the scan data with reference data in a preset comparison database, and determine the crack state based on the comparison result, wherein the reference data is pre-collected defect-free scan data;

[0097] A determination module is used to determine, based on the crack state, that there is a crack in the ceramic insulator to be inspected, compare the scanned images of each dimension in the scanned data with the scanned images of each dimension in the reference data, determine multi-dimensional characteristic information of the crack, and generate a crack distribution image based on the multi-dimensional characteristic information of the crack.

[0098] Preferably, the comparison module includes:

[0099] Aligning the peak position of the a scan signal in the scan data with the peak position corresponding to the a reference scan signal of the reference data in a preset comparison database;

[0100] Determining whether there is a new echo peak in the a-scan signal of the scan data;

[0101] If so, the crack state is determined to be a crack, and the crack position information is determined based on the newly added echo peak;

[0102] If not, the crack state is determined to be no crack.

[0103] Preferably, the comparison module determines the crack location information based on the newly added echo peak, including:

[0104] When the newly added echo peak is a delamination echo and the newly added echo peak shows an echo change, it is determined that the crack is located on the surface of the ceramic insulator to be tested, wherein the delamination echo is an echo of the interface between the anti-pollution flashover coating and the ceramic; or,

[0105] When the newly added echo peak is located in the echo following the delamination echo, it is determined that the crack is located inside the ceramic insulator to be tested;

[0106] The depth of the crack in the ceramic insulator to be inspected is proportional to the distance between the newly added echo peak and the delamination echo.

[0107] Preferably, the determining module compares the scanned images of each dimension in the scanned data with the scanned images of each dimension in the reference data to determine the multi-dimensional characteristic information of the crack, including:

[0108] generating a b-scan image based on a plurality of a-scan images located in the same one-dimensional direction in the scan data, and determining crack defect information based on comparing the b-scan image with b-scan reference data in the reference data, wherein the crack defect information reflects the distribution and depth of cracks in the ceramic insulator to be inspected;

[0109] Determining crack plane distribution information inside the ceramic insulator to be inspected based on a comparison between the C-scan image in the scan data and the C-scan reference data in the reference data;

[0110] Multi-dimensional characteristic information of the crack is determined based on the crack defect information, the crack plane distribution information and the crack position information.

[0111] Example 5

[0112] like Figure 12As shown, the present invention also provides an electronic device, which may be a computer, a single-chip microcomputer, a smart mobile device, or the like. The electronic device in this embodiment may include a processor, a memory, a transceiver component, and the like. The memory, processor, and transceiver component are connected via a bus; the memory may be used to store an execution program, which may include instructions; and the processor may be used to execute the instructions stored in the memory. The memory may also be used to store data, which may be accessed and / or modified during the execution of the instructions.

[0113] The processor may be a central processing unit (CPU), or it may be other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. It is the computing core and control core of the terminal, which is suitable for implementing one or more instructions, specifically suitable for loading and executing one or more instructions in the storage medium to implement the corresponding method flow or corresponding function, so as to implement the steps of a ceramic insulator microcrack detection method in the above embodiment.

[0114] Example 6

[0115] Based on the same inventive concept, the present invention also provides a readable storage medium, specifically an electronic device readable storage medium (Memory), which is a memory device in the electronic device for storing programs and data. It can be understood that the storage medium here can include both the built-in storage medium in the electronic device and the extended storage medium supported by the electronic device. The storage medium provides a storage space, which stores the operating system of the terminal. In addition, one or more instructions suitable for being loaded and executed by the processor are also stored in the storage space. These instructions can be one or more execution programs (including program codes). It should be noted that the storage medium here can be a high-speed RAM memory or a non-volatile memory, such as at least one disk memory. The processor loads and executes one or more instructions stored in the storage medium to implement the steps of a ceramic insulator microcrack detection method in the above embodiment.

[0116] It will be understood by those skilled in the art that embodiments of the present invention may be provided as methods, systems, or computer program products. Thus, the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment, or an embodiment combining software and hardware. Furthermore, the present invention may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to magnetic disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0117] The present invention is described with reference to flowcharts and / or block diagrams of methods, devices (systems), and computer program products according to embodiments of the present invention. It should be understood that each process and / or block in the flowcharts and / or block diagrams, as well as combinations of processes and / or blocks in the flowcharts and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowcharts and / or block diagrams. Figure 1 a process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0118] These computer program instructions may also be stored in a computer readable memory that can direct a computer or other programmable data processing device to work in a specific manner, so that the instructions stored in the computer readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 a process or multiple processes and / or boxes Figure 1 The function specified in one or more boxes.

[0119] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operational steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing the instructions executed on the computer or other programmable device for implementing the process. Figure 1 a process or multiple processes and / or boxes Figure 1 A step that specifies a function in one or more boxes.

[0120] The above are merely embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention are included in the scope of the claims of the present invention to be approved.

Claims

1. A method for detecting microcracks in ceramic insulators, characterized in that: include: Acquire scanning data of a ceramic insulator to be inspected based on the constructed terahertz detection system, wherein the ceramic insulator to be inspected is an insulator under an anti-pollution flashover coating; Comparing the scan data with reference data in a preset comparison database, and determining the crack state based on the comparison result, wherein the reference data is pre-collected defect-free scan data; When it is determined based on the crack state that there is a crack in the ceramic insulator to be inspected, the scanned images of each dimension in the scanned data are compared with the scanned images of each dimension in the reference data to determine multi-dimensional characteristic information of the crack, and a crack distribution image is generated based on the multi-dimensional characteristic information of the crack.

2. The method according to claim 1, characterized in that The step of comparing the scanned data with reference data in a preset comparison database and determining the crack state based on the comparison result includes: Aligning the peak position of the a scan signal in the scan data with the peak position corresponding to the a reference scan signal of the reference data in a preset comparison database; Determining whether there is a new echo peak in the a-scan signal of the scan data; If so, the crack state is determined to be a crack, and the crack position information is determined based on the newly added echo peak; If not, the crack state is determined to be no crack.

3. The method according to claim 2, characterized in that The determining crack location information based on the newly added echo peak includes: When the newly added echo peak is a delamination echo and the newly added echo peak shows an echo change, it is determined that the crack is located on the surface of the ceramic insulator to be tested, wherein the delamination echo is an echo of the interface between the anti-pollution flashover coating and the ceramic; or, When the newly added echo peak is located in the echo following the delamination echo, it is determined that the crack is located inside the ceramic insulator to be tested; The depth of the crack in the ceramic insulator to be inspected is proportional to the distance between the newly added echo peak and the delamination echo.

4. The method according to claim 3, characterized in that The comparing the scanned images of each dimension in the scanned data with the scanned images of each dimension in the reference data to determine multi-dimensional characteristic information of the crack includes: generating a b-scan image based on a plurality of a-scan images located in the same one-dimensional direction in the scan data, and determining crack defect information based on comparing the b-scan image with b-scan reference data in the reference data, wherein the crack defect information reflects the distribution and depth of cracks in the ceramic insulator to be inspected; Determining crack plane distribution information inside the ceramic insulator to be inspected based on a comparison between the C-scan image in the scan data and the C-scan reference data in the reference data; Multi-dimensional characteristic information of the crack is determined based on the crack defect information, the crack plane distribution information and the crack position information.

5. A ceramic insulator microcrack detection system, characterized in that: include: An acquisition module is used to acquire scanning data of a ceramic insulator to be detected based on the constructed terahertz detection system, wherein the ceramic insulator to be detected is an insulator under an anti-pollution flashover coating; a comparison module, configured to compare the scan data with reference data in a preset comparison database, and determine the crack state based on the comparison result, wherein the reference data is pre-collected defect-free scan data; A determination module is used to determine, based on the crack state, that there is a crack in the ceramic insulator to be inspected, compare the scanned images of each dimension in the scanned data with the scanned images of each dimension in the reference data, determine multi-dimensional characteristic information of the crack, and generate a crack distribution image based on the multi-dimensional characteristic information of the crack.

6. The system according to claim 5, characterized in that The comparison module includes: Aligning the peak position of the a scan signal in the scan data with the peak position corresponding to the a reference scan signal of the reference data in a preset comparison database; Determining whether there is a new echo peak in the a-scan signal of the scan data; If so, the crack state is determined to be a crack, and the crack position information is determined based on the newly added echo peak; If not, the crack state is determined to be no crack.

7. The method according to claim 6, characterized in that The comparison module determines the crack location information based on the newly added echo peak, including: When the newly added echo peak is a delamination echo and the newly added echo peak shows an echo change, it is determined that the crack is located on the surface of the ceramic insulator to be tested, wherein the delamination echo is an echo of the interface between the anti-pollution flashover coating and the ceramic; or, When the newly added echo peak is located in the echo following the delamination echo, it is determined that the crack is located inside the ceramic insulator to be tested; The depth of the crack in the ceramic insulator to be inspected is proportional to the distance between the newly added echo peak and the delamination echo.

8. The method according to claim 7, characterized in that The determination module compares the scanned images of each dimension in the scanned data with the scanned images of each dimension in the reference data to determine multi-dimensional characteristic information of the crack, including: generating a b-scan image based on a plurality of a-scan images located in the same one-dimensional direction in the scan data, and determining crack defect information based on comparing the b-scan image with b-scan reference data in the reference data, wherein the crack defect information reflects the distribution and depth of cracks in the ceramic insulator to be inspected; Determining crack plane distribution information inside the ceramic insulator to be inspected based on a comparison between the C-scan image in the scan data and the C-scan reference data in the reference data; Multi-dimensional characteristic information of the crack is determined based on the crack defect information, the crack plane distribution information and the crack position information.

9. An electronic device, characterized in that: include: at least one processor and memory; The memory and the processor are connected via a bus; The memory is used to store one or more programs; When the one or more programs are executed by the at least one processor, the ceramic insulator microcrack detection method according to any one of claims 1 to 4 is implemented.

10. A readable storage medium, characterized in that: An execution program is stored thereon, and when the execution program is executed, the ceramic insulator microcrack detection method according to any one of claims 1 to 4 is implemented.

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