Modularized high-heat-dissipation large-current semiconductor testing device
Through modular design and needle holders made of conductive materials, the versatility and accuracy of semiconductor test equipment are achieved, the problems of flexible adaptability and heat accumulation of different test ports are solved, and the efficiency and reliability of testing are improved.
Patent Information
- Application Number
- CN202510927575.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-07
- Publication Date
- 2025-09-19
AI Technical Summary
Existing semiconductor test fixtures need to be manufactured with different specifications according to different test ports, resulting in additional design and mold opening costs. At the same time, heat accumulation during high current testing causes test data deviation.
A modular high-heat dissipation and high-current semiconductor testing device is designed. By inserting different numbers of upper and lower needle bodies into the circular groove of the needle holder, the needle holder is combined with conductive materials to achieve rapid heat conduction. The number of measuring needle bodies can be flexibly added or upgraded, and stable contact is ensured by the fixed structure of the cover and the needle holder.
It improves the versatility and test accuracy of the equipment, reduces maintenance and upgrade costs, and ensures test accuracy and pass rate.
Smart Images
Figure CN120669089A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of semiconductor testing, and in particular to a modular high-heat dissipation and high-current semiconductor testing device. Background Art
[0002] The semiconductor high-current heat dissipation test fixture is specifically designed to evaluate the heat dissipation performance and reliability of high-power semiconductor devices under high-temperature, high-current conditions. Its primary applications include R&D verification, production line testing, burn-in testing, and failure analysis, ensuring device stability and longevity in real-world applications.
[0003] Existing test fixtures typically utilize internal test probes for testing. However, different test ports require different numbers of test probes, resulting in the need to manufacture test fixtures of varying specifications for numerous product lines. This places additional design and mold costs on companies. Furthermore, when high-current testing is required, the test probes generate significant heat, which accumulates in the test fixture and cannot be dissipated promptly, leading to deviations in test data. Summary of the Invention
[0004] In order to solve the above problems, the present invention provides a modular high-heat dissipation and high-current semiconductor testing device, including a needle seat, the needle seat is made of a conductor, and several first circular grooves and second circular grooves are respectively arranged on the top and bottom of the needle seat, and the positions of the first circular groove and the second circular groove correspond to each other. A groove bottom is arranged between the first circular groove and the second circular groove, and an upper needle body is arranged in the first circular groove, and the upper needle body is used to contact the object to be measured. A lower needle body is arranged in the second circular groove, and the lower needle body is used to contact the circuit board. A spring is arranged between the upper needle body and the groove bottom and between the lower needle body and the groove bottom, one end of the spring abuts against the groove bottom, and the other end abuts against the upper needle body and the lower needle body, and the upper needle body and the lower needle body respectively form contact with the inner walls of the first circular groove and the second circular groove. Furthermore, the upper needle body and the lower needle body include a contact portion and a wrapping portion. When the upper needle body and the lower needle body are arranged in the first circular groove and the second circular groove, the wrapping portion contacts the inner walls of the first circular groove and the second circular groove.
[0005] Furthermore, a limiting post is protruded toward the bottom of the groove at one end of the wrapping portion away from the contact portion, and one end of the spring is sleeved on the limiting post.
[0006] Furthermore, a positioning hole matching the shape of the limiting post is provided in the bottom of the groove, and when the wrapping portion contacts the bottom of the groove, the limiting post is inserted into the positioning hole.
[0007] Furthermore, the top and bottom surfaces of the needle seat are covered with a first cover plate and a second cover plate, respectively; a plurality of first through holes are respectively provided in the middle of the first cover plate and the second cover plate; the positions of the first through holes correspond to the positions of the first circular groove and the second circular groove; second through holes are respectively provided on both sides of the first cover plate and the second cover plate; and third through holes corresponding to the positions of the second through holes are respectively provided on the top and bottom surfaces of the needle seat.
[0008] Furthermore, the wrapping portion is a portion protruding outward along the outer walls of the upper needle body and the lower needle body, and a limiting ring is provided in the first through hole. When the first cover plate and the second cover plate cover the top and bottom surfaces of the needle seat, the limiting ring forms an abutment against the wrapping portion.
[0009] Furthermore, outward-protruding supporting steps are respectively provided in the middle of the top surface and bottom of the needle seat, the first circular groove and the second circular groove are provided in the supporting steps, and card slots are respectively provided on both sides of the first cover plate and the second cover plate. When the first cover plate and the second cover plate cover the top surface and the bottom of the needle seat, the supporting steps are embedded between the card slots.
[0010] Furthermore, grooves are provided on both sides of the third through hole, and a protrusion is provided on the bottom of the first cover plate. When the first cover plate covers the top surface of the needle seat, the protrusion is embedded in the groove.
[0011] Compared with the prior art, the present invention has the following beneficial effects: This application allows for flexible addition or upgrade of the number of measuring needles by inserting different numbers of upper and lower needles into the first and second circular grooves, depending on the requirements of different test ports. This not only improves the versatility of the device but also facilitates maintenance and upgrades. Furthermore, because the needle holder of this application is made of a conductor, the upper and lower needles can quickly conduct heat through the needle holder during testing, ensuring test accuracy and pass rate.
[0012] Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0014] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 Schematic diagram of the structure of the upper needle body and the lower needle body of the present invention; Figure 3 It is a schematic diagram of the assembly between the needle seat and the first cover plate and the second cover plate of the present invention; Figure 4 is a structural schematic diagram of the first cover plate of the present invention; Figure 5 It is a cross-sectional view of the overall structure of the present invention.
[0015] The reference numerals and names in the figures are as follows: Needle seat 100, first circular groove 110, second circular groove 120, groove bottom 111, upper needle body 200, lower needle body 300, spring 400, contact part 210, wrapping part 220, limiting column 221, positioning hole 111a, first cover plate 500, second cover plate 600, first through hole 510, second through hole 520, third through hole 130, screw 140, limiting ring 511, supporting step 150, slot 530, groove 131, protrusion 540. DETAILED DESCRIPTION
[0016] The following is a clear and complete description of the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present invention.
[0017] The present invention will be described in more detail. It should be understood that the specific embodiments described herein are intended only to explain the present invention and are not intended to limit the present invention. It should be noted that when an element is described as being "fixed to" another element, it may be directly on the other element, or one or more intervening elements may be present therebetween. When an element is described as being "connected to" another element, it may be directly connected to the other element, or one or more intervening elements may be present therebetween.
[0018] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by directional words such as "front, back, up, down, left, right", "horizontal, vertical, vertical, horizontal" and "top, bottom" are usually based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description. Unless otherwise stated, these directional words do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the scope of protection of the present invention; the directional words "inside and outside" refer to the inside and outside relative to the outline of each component itself. In the description of the present invention, it should be noted that the use of words such as "first" and "second" to define components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above words have no special meaning and therefore cannot be understood as limiting the scope of protection of the present invention. In the description of the embodiments of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.
[0019] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as those commonly understood by those skilled in the art to which the present invention pertains. The terms used in this specification are for the purpose of describing specific embodiments only and are not intended to limit the present invention.
[0020] In addition, the technical features involved in different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.
[0021] The preferred embodiments of the present invention will now be further described with reference to the accompanying drawings. Figure 1 and Figure 5 As shown, a high heat dissipation and high current test fixture includes a needle holder 100, which is made of a conductor. A plurality of first circular grooves 110 and second circular grooves 120 are respectively provided on the top and bottom of the needle holder 100. The positions of the first circular grooves 110 and the second circular grooves 120 correspond to each other. A groove bottom 111 is provided between the first circular grooves 110 and the second circular grooves 120. An upper needle body 200 is provided in the first circular groove 110. The upper needle body 200 is used to contact the object to be tested. A lower needle body 300 is provided in the second circular groove 120, and the lower needle body 300 is used to contact the circuit board. A spring 400 is provided between the upper needle body 200 and the groove bottom 111 and between the lower needle body 300 and the groove bottom 111. One end of the spring 400 abuts against the groove bottom 111, and the other end abuts against the upper needle body 200 and the lower needle body 300. The upper needle body 200 and the lower needle body 300 respectively form contact with the inner walls of the first circular groove 110 and the second circular groove 120.
[0022] When testing is required, the upper needle body 200 contacts the product to be tested, and the lower needle body 300 is connected to the circuit board. When the upper needle body 200 contacts the product to be tested, since the upper needle body 200 is accommodated in the first circular groove 110, the upper needle body 200 will move downward in the first circular groove 110, and the spring 400 in the first circular groove 110 will be compressed. Similarly, since the lower needle body 300 is accommodated in the second circular groove 120, the lower needle body 300 will move upward in the second circular groove 120, and the spring 400 in the second circular groove 120 will be compressed. Since the material of the needle seat 100 is a conductor and the upper needle body 200 and the lower needle body 300 respectively contact the inner walls of the first circular groove 110 and the second circular groove 120, the electrical signal is transmitted in sequence through the upper needle body 200, the needle seat 100 and the lower needle body 300.
[0023] Compared to the existing technology, the present invention allows for flexible addition or upgrade of the number of measuring needles by inserting different numbers of upper and lower needles 200, 300 into the first and second circular grooves 110, 120, depending on the requirements of different test ports. This not only improves the versatility of the device but also facilitates maintenance and upgrades. Furthermore, since the needle holder 100 of the present invention is made of a conductor, the upper and lower needles 200, 300 can quickly conduct heat through the needle holder 100 during testing, ensuring test accuracy and pass rate.
[0024] On the basis of the above embodiment, Figure 1 and Figure 2 As shown, the upper needle body 200 and the lower needle body 300 include a contact portion 210 and a wrapping portion 220, and the contact portion 210 is used to form contact with the product under test or the circuit board. When the upper needle body 200 and the lower needle body 300 are arranged in the first circular groove 110 and the second circular groove 120, the wrapping portion 220 is in contact with the inner walls of the first circular groove 110 and the second circular groove 120, thereby ensuring that the upper needle body 200 and the lower needle body 300 are in contact with the inner walls of the first circular groove 110 and the second circular groove 120 respectively. In this way, when a large current test is performed, the upper needle body 200 and the lower needle body 300 can quickly conduct heat through the needle seat 100.
[0025] On the basis of the above embodiment, Figure 1 and Figure 2 As shown, a limiting column 221 protrudes toward the groove bottom 111 at one end of the wrapping portion 220 away from the contact portion 210, and one end of the spring 400 is sleeved on the limiting column 221. In this way, when the spring 400 is compressed, the contact between the spring 400 and the upper needle body 200 or the lower needle body 300 can be guaranteed, and the spring 400 is prevented from being twisted and deformed in the first circular groove 110 and the second circular groove 120.
[0026] On the basis of the above embodiment, Figure 1 、 Figure 2 and Figure 5 As shown, a positioning hole 111a matching the shape of the limiting column 221 is provided in the bottom 111 of the groove. When the wrapping portion 220 contacts the bottom 111 of the groove, the limiting column 221 is inserted into the positioning hole 111a. This design mainly solves the problem of the slender upper needle body 200 and the lower needle body 300, because in this case, it is difficult for the wrapping portion 220 to form mutual contact with the side surfaces in the inner walls of the first circular groove 110 and the second circular groove 120, and it is highly likely to contact with the bottom 111 of the first circular groove 110 and the second circular groove 120. In this case, by positioning the hole 111a in the bottom 111 of the groove, the limiting column 221 can be inserted into the positioning hole 111a when it is wrapped and in contact with the bottom 111 of the groove, thereby further ensuring the stability of the contact between the upper needle body 200 and the lower needle body 300 and the inner walls of the first circular groove 110 and the second circular groove 120, respectively, so as to form rapid heat conduction.
[0027] On the basis of the above embodiment, Figure 3 and Figure 4 As shown, the top and bottom surfaces of the needle seat 100 are respectively covered with a first cover plate 500 and a second cover plate 600, and a plurality of first through holes 510 are respectively provided in the middle of the first cover plate 500 and the second cover plate 600, and the positions of the first through holes 510 correspond to the positions of the first circular groove 110 and the second circular groove 120. Second through holes 520 are respectively provided on both sides of the first cover plate 500 and the second cover plate 600, and third through holes 130 corresponding to the positions of the second through holes 520 are respectively provided on the top and bottom surfaces of the needle seat 100. When the first cover plate 500 and the second cover plate 600 cover the top and bottom surfaces of the needle seat 100, a screw 140 can be passed through the second through hole 520 and the third through hole 130 to fix the first cover plate 500 and the second cover plate 600 to the needle seat 100.
[0028] On the basis of the above embodiment, Figure 3 and Figure 4As shown, the wrapping portion 220 is a portion protruding outward along the outer wall of the upper needle body 200 and the lower needle body 300, and a limiting ring 511 is provided in the first through hole 510. When the first cover plate 500 and the second cover plate 600 cover the top and bottom surfaces of the needle seat 100, the limiting ring 511 forms an abutting contact with the wrapping portion 220, which can prevent the upper needle body 200 and the lower needle body 300 from being pushed out of the first circular groove 110 and the second circular groove 120 under the reaction of the spring 400 when the test is completed. It is also convenient for replacing the number of measuring needle bodies. When the number of needle bodies needs to be replaced, the first cover plate 500 and the second cover plate 600 will be separated from the needle seat 100 by the screw 140. After adjusting the number of upper and lower needle bodies 300 accordingly, the first cover plate 500 and the second cover plate 600 can be assembled with the needle seat 100.
[0029] On the basis of the above embodiment, Figure 3 and Figure 4 As shown, outward-protruding supporting steps 150 are respectively provided in the middle of the top surface and the bottom of the needle seat 100, the first circular groove 110 and the second circular groove 120 are provided in the supporting steps 150, and card slots 530 are respectively provided on both sides of the first cover plate 500 and the second cover plate 600. When the first cover plate 500 and the second cover plate 600 cover the top surface and the bottom of the needle seat 100, the supporting steps 150 are embedded between the card slots 530, so that the positioning between the first cover plate 500 and the second cover plate 600 and the needle seat 100 is facilitated during installation.
[0030] On the basis of the above embodiment, Figure 3 and Figure 4 As shown, grooves 131 are provided on both sides of the third through hole 130, and a protrusion 540 is provided at the bottom of the first cover plate 500. When the first cover plate 500 covers the top surface of the needle seat 100, the protrusion 540 is embedded in the groove 131, thereby further improving the positioning between the first cover plate 500 and the needle seat 100 during installation.
[0031] The foregoing exemplary embodiments are detailed, and the invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims rather than the foregoing description, and all variations that come within the meaning and range of equivalents of the claims are intended to be embraced therein.
Claims
1. A modular high heat dissipation and high current semiconductor testing device, characterized in that: The invention comprises a needle seat (100), wherein the needle seat (100) is made of a conductor, and a plurality of first circular grooves (110) and second circular grooves (120) are respectively provided on the top surface and the bottom surface of the needle seat (100), wherein the positions of the first circular grooves (110) and the second circular grooves (120) correspond to each other, and a groove bottom (111) is provided between the first circular grooves (110) and the second circular grooves (120), and an upper needle body (200) is provided in the first circular groove (110), wherein the upper needle body (200) is used to contact with the object to be measured, and a second circular groove (120) is provided between the first circular grooves (110) and the second circular grooves (120). A lower needle body (300) is provided in the upper needle body (200) and the groove bottom (111), and a spring (400) is provided between the upper needle body (200) and the groove bottom (111), and between the lower needle body (300) and the groove bottom (111). One end of the spring (400) abuts against the groove bottom (111), and the other end abuts against the upper needle body (200) and the lower needle body (300). The upper needle body (200) and the lower needle body (300) respectively form contact with the inner walls of the first circular groove (110) and the second circular groove (120).
2. The modular high heat dissipation and high current semiconductor testing device according to claim 1, characterized in that: The upper needle body (200) and the lower needle body (300) include a contact portion (210) and a wrapping portion (220). When the upper needle body (200) and the lower needle body (300) are arranged in the first circular groove (110) and the second circular groove (120), the wrapping portion (220) contacts the inner walls of the first circular groove (110) and the second circular groove (120).
3. The modular high heat dissipation and high current semiconductor testing device according to claim 2, characterized in that: A limiting column (221) protrudes from one end of the wrapping portion (220) away from the contact portion (210) toward the groove bottom (111), and one end of the spring (400) is sleeved on the limiting column (221).
4. The modular high heat dissipation and high current semiconductor testing device according to claim 3, characterized in that: A positioning hole (111a) matching the shape of the limiting column (221) is provided in the groove bottom (111); when the wrapping portion (220) contacts the groove bottom (111), the limiting column (221) is inserted into the positioning hole (111a).
5. The modular high heat dissipation and high current semiconductor testing device according to claim 2, characterized in that: The top surface and the bottom of the needle seat (100) are covered with a first cover plate (500) and a second cover plate (600), respectively. A plurality of first through holes (510) are respectively provided in the middle of the first cover plate (500) and the second cover plate (600), and the positions of the first through holes (510) correspond to the positions of the first circular groove (110) and the second circular groove (120). Second through holes (520) are respectively provided on both sides of the first cover plate (500) and the second cover plate (600), and third through holes (130) corresponding to the positions of the second through holes (520) are respectively provided on the top surface and the bottom of the needle seat (100).
6. The modular high heat dissipation and high current semiconductor testing device according to claim 5, characterized in that: The wrapping portion (220) is a portion protruding outward along the outer wall of the upper needle body (200) and the lower needle body (300), and a limiting ring (511) is provided in the first through hole (510). When the first cover plate (500) and the second cover plate (600) cover the top surface and the bottom of the needle seat (100), the limiting ring (511) forms an abutment against the wrapping portion (220).
7. The modular high heat dissipation and high current semiconductor testing device according to claim 6, characterized in that: Outwardly protruding supporting steps (150) are respectively provided at the middle of the top surface and the bottom of the needle seat (100), the first circular groove (110) and the second circular groove (120) are provided in the supporting steps (150), and card slots (530) are respectively provided on both sides of the first cover plate (500) and the second cover plate (600). When the first cover plate (500) and the second cover plate (600) cover the top surface and the bottom of the needle seat (100), the supporting steps (150) are embedded between the card slots (530).
8. The modular high heat dissipation and high current semiconductor testing device according to claim 7, characterized in that: Grooves (131) are provided on both sides of the third through hole (130), and a protrusion (540) is provided at the bottom of the first cover plate (500). When the first cover plate (500) covers the top surface of the needle seat (100), the protrusion (540) is embedded in the groove (131).