Optical engine module and optical engine system

Abstract

The invention provides an optical engine module and an optical engine system, and relates to the technical field of optical engines. The optical engine module comprises at least two PIC chips, the at least two PIC chips comprise at least one signal sending chip and at least one signal receiving chip, and an optical port of each PIC chip is provided with a groove; the at least two EIC chips are located above the PIC chips, each EIC chip is electrically connected with one PIC chip, and each EIC chip is further connected with the pin at the bottom; and the lens module is installed in the groove, the lens module is coupled with the optical port of the PIC chip, and an optical signal of the PIC chip is overturned by 90 degrees so as to realize surface signal transmission. The optical engine module and the optical engine system have the advantages that the width can be smaller, and miniaturization is facilitated.

Description

Technical Field

[0001] The present application relates to the field of light engine technology, and more specifically, to a light engine module and a light engine system. Background Art

[0002] With the development of the AI ​​(Artificial Intelligence) industry, computing companies such as NVIDIA have significantly increased the switching bandwidth of individual GPUs (Graphics Processing Units). This has led to a growing demand for interconnect components with high bandwidth, low latency, and low power consumption, both within servers and networking switches.

[0003] CPO (Co-packaged optics) uses advanced micro-bump interconnect technology to co-package the optical engine with the switch or GPU chip on the same substrate, achieving low insertion loss and high-bandwidth I / O interconnection. This effectively reduces the signal compensation and high power consumption caused by the long, complex and uncontrollable transmission links in the past when pluggable optical modules were manufactured using COB.

[0004] While CPO's advanced packaging approach effectively improves the integration of optical engines, the increase in I / O density presents new challenges. To meet the demands of integration, both GPU and switch chips typically utilize multiple rows of TX and RX pins for their internal I / O (Input / Output) pins. However, the PIC (Photonic Integrated Circuit) ports of most current optical engines are end-to-end couplers, limiting them to single-row optical signal transmission and reception. This results in the optical engine's width often being over three times that of the chip's I / O.

[0005] In summary, the light engine module in the prior art has the problem of being relatively wide, which is not conducive to miniaturization. Summary of the Invention

[0006] The purpose of the present application is to provide a light engine module and a light engine system to solve the problem in the prior art that the light engine module has a large width and is not conducive to miniaturization.

[0007] In order to achieve the above objectives, the technical solutions adopted in the embodiments of the present application are as follows:

[0008] In one aspect, an embodiment of the present application provides a light engine module, comprising:

[0009] At least two PIC chips, wherein the at least two PIC chips include at least one signal transmitting chip and at least one signal receiving chip, and the optical ports of the PIC chips are provided with grooves;

[0010] at least two EIC chips located above the PIC chip, each of the EIC chips being electrically connected to one of the PIC chips and each of the EIC chips being further connected to the bottom pins;

[0011] A lens module is installed in the groove, and the lens module is coupled with the optical port of the PIC chip, and flips the optical signal of the PIC chip by 90 degrees to achieve surface signal transmission.

[0012] Optionally, the PIC chip is mounted in a face-down manner, and the EIC chip is mounted in a flip-down manner.

[0013] Optionally, the optical engine module is packaged using RDL and / or TSV.

[0014] Optionally, when the optical engine module is packaged in an RDL manner, the optical engine module further includes:

[0015] A first RDL layer; a first metal wiring is provided in the first RDL layer, and the first metal wiring is connected to the bottom pin;

[0016] a filling layer and at least two PIC chips located on a surface of the first RDL layer, wherein the filling layer is disposed around the PIC chips, and metal pillars are disposed in the filling layer, the metal pillars are spaced apart from the PIC chips and are electrically connected to the first metal wiring;

[0017] a second RDL layer located between the filling layer and the surface of the PIC chip; wherein the second RDL layer is provided with a second metal wiring, the second metal wiring being electrically connected to the metal pillar and the PIC chip respectively, and the second RDL layer exposing the optical port of the PIC chip;

[0018] The EIC chips are located on the surface of the second RDL layer. Each of the EIC chips is electrically connected to one of the PIC chips through the second metal wiring, and each of the EIC chips is also electrically connected to the metal pillar through the second metal wiring.

[0019] Optionally, when the light engine module is packaged in a TSV manner, a TSV through-hole is provided on the PIC chip, and the TSV through-hole is filled with a metal layer;

[0020] The EIC chip is located on the PIC chip, and the EIC chip is connected to the pins at the bottom through the metal layer.

[0021] Optionally, when the optical engine module is packaged in an RDL and TSV manner, a TSV through-hole is provided on the PIC chip, and the TSV through-hole is filled with a metal layer; the optical engine module further includes:

[0022] A first RDL layer; a first metal wiring is provided in the first RDL layer, and the first metal wiring is connected to the bottom pin;

[0023] The at least two PIC chips are located on the first RDL layer;

[0024] The EIC chip is located on the PIC chip, and the EIC chip is connected to the first metal wiring in the first RDL layer through the metal layer.

[0025] Optionally, the lens module includes a reflective portion and a lens portion, the width of the lens portion is greater than the width of the reflective portion, and the width of the lens portion is greater than the width of the groove, and the reflective portion is connected to the bottom of the lens portion;

[0026] The reflecting portion is configured as a right-angled triangular prism, and the inclined surface of the right-angled triangular prism is configured on a side away from the light port;

[0027] The focus of the lens portion matches the mode field of the optical port.

[0028] Optionally, the lens portion includes a transparent body and a convex lens, a receiving groove is provided in the middle area of ​​the transparent body, the convex lens is provided in the receiving groove, the height of the convex lens is equal to the height of the receiving groove, and the width of the convex lens is smaller than the width of the receiving groove.

[0029] Optionally, when there are multiple signal transmitting chips and multiple signal receiving chips, the multiple signal transmitting chips are arranged side by side, and the multiple signal receiving chips are also arranged side by side. The lens module includes a first lens array and a second lens array. The first lens array is coupled with the optical ports of the multiple signal transmitting chips, and the second lens array is coupled with the optical ports of the multiple signal receiving chips.

[0030] Optionally, the lens module includes a plurality of lens arrays, each of the PIC chips includes a plurality of rows of grooves, and each of the lens arrays is coupled to one of the grooves.

[0031] On the other hand, the present application also provides an optical engine system, which includes a substrate, an optical fiber array, a processing chip and the above-mentioned optical engine module. The optical engine module and the processing chip are both installed on the substrate and interconnected through wiring on the substrate; the optical fiber array and the optical engine module are pluggable.

[0032] Optionally, the optical fiber array includes a clamping portion, and the optical fiber array is connected to the lens module of the light engine module through the clamping portion.

[0033] Compared with the prior art, this application has the following beneficial effects:

[0034] Embodiments of the present application provide a light engine module and a light engine system. The light engine module includes at least two PIC chips, each of which includes at least one signal transmitting chip and at least one signal receiving chip. A groove is provided at the optical port of the PIC chip; at least two EIC chips are located above the PIC chips, each of which is electrically connected to a PIC chip and each EIC chip is also connected to a pin at the bottom; a lens module is installed in the groove, the lens module is coupled to the optical port of the PIC chip, and the optical signal of the PIC chip is flipped 90° to achieve surface signal transmission.

[0035] Since the light engine module provided in the present application separates the signal sending chip from the signal receiving chip in the PIC chip, and changes the end face signal transmission mode to the surface signal transmission mode through the lens module, the width of the light engine module can be smaller, which is conducive to miniaturization.

[0036] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0038] Figure 1 Schematic diagram of the application of light engine modules in the prior art.

[0039] Figure 2 This is a first cross-sectional schematic diagram of the light engine module in the embodiment of the present application.

[0040] Figure 3 Schematic cross-section of the lens module in the embodiment of the present application.

[0041] Figure 4 This is a top view of the light engine module in an embodiment of the present application.

[0042] Figure 5 This is another top view of the light engine module in an embodiment of the present application.

[0043] Figure 6 This is a second cross-sectional schematic diagram of the light engine module in the embodiment of the present application.

[0044] Figure 7 This is a third cross-sectional schematic diagram of the light engine module in the embodiment of the present application. Figure 8 Schematic cross-section of the light engine system in the embodiment of the present application.

[0045] In the picture:

[0046] 100-light engine module; 110-first RDL layer; 111-first metal wiring; 120-PIC chip; 121-signal transmitting chip; 122-signal receiving chip; 123-groove; 130-filling layer; 140-second RDL layer; 150-EIC chip; 160-lens module; 161-reflecting part; 162-lens part; 1621-transparent body; 1622-convex lens; 200-light engine system; 210-substrate; 220-fiber array; 230-processing chip. DETAILED DESCRIPTION

[0047] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0048] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without creative work are within the scope of protection of the present application.

[0049] It should be noted that similar reference numerals and letters represent similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings. At the same time, in the description of this application, the terms "first", "second", etc. are only used to distinguish the description and should not be understood as indicating or implying relative importance.

[0050] It should be noted that, in this document, relational terms such as first and second, etc. are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations.

[0051] For the convenience of explanation, the following explanations are given for the relevant professional terms involved in this application:

[0052] Light Engine: A light engine is a modular optical system that integrates optical components, electronic drive, and control systems to generate, modulate, and transmit optical signals. The core optoelectronic integration of a light engine consists of two key chips: photonic integrated circuits (PICs) and electronic integrated circuits (EICs). The collaborative operation of these two chips forms the foundation of modern light engines.

[0053] CPO (Co-Packaged Optics) optical engine: an advanced optoelectronic integration technology that integrates optical devices and electronic chips (such as ASICs, switch chips, etc.) in the same package with high density. It is mainly used in high-speed data centers, AI computing and optical communications.

[0054] PIC chip: A chip used to process the generation, modulation, routing and detection of optical signals, which mainly includes components such as light source, modulator, waveguide structure, and detector.

[0055] EIC chip: A chip used to provide electrical signal driving, control and signal processing, which mainly includes driving circuit, receiving circuit, control circuit and digital processing circuit. Among them, the driving circuit includes laser driver, modulator driver, etc., the receiving circuit includes transimpedance amplifier (TIA), limiting amplifier (LA), etc., the control circuit includes automatic power control (APC), temperature control circuit, etc., and the digital processing circuit includes CDR (clock data recovery), DSP (digital signal processing), etc.

[0056] RDL (Redistribution Layer): A key component in advanced packaging technology, the RDL layer is primarily used for redistributing interconnects within a chip or between the chip and the package. A metal wiring layer fabricated on the chip surface or package substrate, RDL is primarily used to redistribute the positions of chip pads, enable interconnects with varying pitches, and provide more flexible routing solutions. The fabrication process typically includes dielectric deposition, patterning, metallization, or planarization.

[0057] Through-Silicon Via (TSV) is an interconnect structure that passes vertically through the silicon substrate, enabling high-density electrical connections in chip stacking (3D IC) or 2.5D packaging. Compared to traditional wire bonding or flip-chip bonding, TSV significantly shortens interconnect distances, increases bandwidth, and reduces power consumption. It is a core technology for advanced packaging (such as HBM and chiplets).

[0058] Through Mold Via (TMV): A vertical interconnect structure formed within an Epoxy Molding Compound (EMC). It's primarily used to achieve electrical interconnection between different layers within the package, provide vertical connection channels in 3D packaging, and partially replace TSV (Through Silicon Via) functionality. The TMV structure primarily consists of conductive pillars, an insulating layer, and a pad.

[0059] UBM Pad (Under Bump Metallization Pad): A key structure in advanced packaging technology, UBM Pad is primarily used for reliable connections between chips and external interconnects (such as solder balls and copper pillars). It plays a vital role in advanced packaging processes such as flip-chip, wafer-level packaging (WLP), and 2.5D / 3D integration. The UBM Pad is a metallization layer located between the chip pad (Al / Ni / Cu Pad) and the bump (such as a solder ball, copper pillar, or microbump). Its main functions include providing a reliable metal interface, blocking diffusion, improving adhesion, and optimizing current distribution.

[0060] FA (Fiber Array): A high-precision optical fiber arrangement component used to achieve parallel transmission and coupling of multi-channel optical signals. It is widely used in optical communications, photonic integration, and optical sensing.

[0061] COB (Chip on Board) packaging: A packaging technology that directly binds the bare die to a PCB or substrate, omitting the plastic or ceramic shell of traditional packaging (such as QFN, BGA). It is mainly used for low-cost, highly integrated, and small-volume electronic products.

[0062] As mentioned in the background technology, the light engine modules all adopt the end-face light emission method, which results in a larger width of the light engine. Figure 1 , a schematic diagram of a conventional light engine module. As can be seen from the figure, the light engine module includes a PIC chip and an EIC chip, both soldered to a substrate and interconnected via bonding wires. The PIC chip's optical port is located on the side (to the left of the PIC chip in the figure), so light can only be emitted from the end face (i.e., the direction of the arrow in the figure indicates the light emission direction).

[0063] In actual applications, the applicant's research found that optical engines using traditional COB packaging solutions face low integration and high electrical link loss. CPO optical engines use advanced packaging processes to effectively improve transmission loss and bandwidth limitations. However, to achieve low insertion loss on the PIC chip side, the coupler often uses an EC coupler (Edge Coupler, end-face coupler), resulting in the optical signal being connected to the FA only through a single side of the PIC. The fiber pitch of the FA is 127μm, and the high-frequency channel pitch of the GPU / Switch is 450μm, and multiple rows of TX (output) and RX (input) channels are used. Assuming the number of TX and RX rows is n, it can be calculated that the maximum width dimension of a single FA optical engine will not exceed 0.28n times the GPU channel size. In order to further improve the bandwidth density of the OE (Optical Engine), the number of optical ports of the entire OE and PIC must be expanded. Since the size of the FA is large, far exceeding the thickness of the PIC, it is not feasible to simply expand the number of PICs in two dimensions for a PIC with single-side light output. Therefore, configuring FAs in front and behind will cause interference between the two adjacent FA fibers and the FA cover. If a PIC GC (grating coupler) is used, surface coupling between the FA and the PIC can be achieved. However, the insertion loss of the GC is large, more than twice that of the current EC, and the cost of power compensation is too high.

[0064] Therefore, the existing light engine module has a large width, which is not conducive to miniaturization. In view of this, in order to solve the above problem, the present application provides a light engine module, and the light engine module provided by the present application is exemplarily described below:

[0065] As an optional implementation, see Figure 2 , the light engine module 100 includes:

[0066] At least two PIC chips, each of which includes at least one signal transmitting chip and at least one signal receiving chip, and a groove is provided at the optical port of the PIC chip; at least two EIC chips are located above the PIC chips, each EIC chip is electrically connected to a PIC chip, and each EIC chip is also connected to a pin at the bottom; a lens module is installed in the groove, the lens module is coupled to the optical port of the PIC chip, and the optical signal of the PIC chip is flipped 90 degrees to achieve surface signal transmission.

[0067] By using a lens module to flip the end-face light signal 90° to achieve surface signal transmission, the width of the light engine module can be made smaller, thereby facilitating miniaturization.

[0068] In order to realize the surface signal transmission of the PIC chip, the PIC chip is installed in a positive manner and the EIC chip is installed in a flip-chip manner during packaging.

[0069] Furthermore, in order to realize the packaging of the optical engine module, RDL and / or TSV can be adopted. When the RDL packaging is adopted, the optical engine module further includes:

[0070] The first RDL layer 110, the filling layer 130, and the second RDL layer 140 are provided. The first RDL layer 110 is provided with a first metal wiring 111, and the first metal wiring 111 is connected to the bottom pin. The filling layer 130 and at least two PIC chips 120 are located on the surface of the first RDL layer 110, and the filling layer 130 is arranged around the PIC chips 120. The filling layer 130 is provided with metal pillars, which are spaced apart from the PIC chips 120 and electrically connected to the first metal wiring 111. The second RDL layer 140 is located on the surface of the filling layer 130 and the PIC chips 120. The second RDL layer 140 is provided with a second metal wiring, which is electrically connected to the metal pillars and the PIC chips 120. The second RDL layer 140 also exposes the optical ports of the PIC chips 120. The EIC chips 150 are located on the surface of the second RDL layer 140 . Each EIC chip 150 is electrically connected to one PIC chip 120 through a second metal wiring, and each EIC chip 150 is also electrically connected to a metal pillar through a second metal wiring.

[0071] The optical engine module 100 packaged in an RDL manner has at least the following beneficial effects:

[0072] 1. The optical engine module 100 provided herein incorporates a TMV structure and metal pillars, enabling advanced packaging by embedding two or more PICs. Furthermore, by integrating the lens module 160 into the optical port, the optical engine density of the OE is expanded. Compared to the traditional PIC chip 120, which can only achieve optical coupling on a single side of the chip, the present invention enables coupling access to multiple rows of FAs.

[0073] 2. The lens module 160 is coupled to the optical port of the PIC chip 120, and the surface coupling of the end face coupler is realized. Compared with the traditional surface coupling, the method provided by the present application can obtain smaller coupling loss.

[0074] 3. The lens module 160 is mounted in the groove 123 , so its size is small and it adopts vertical surface mounting, which reduces the reliability problem caused by packaging stress.

[0075] 4. Multiple groups of PIC chips 120 and EIC chips 150 are placed side by side within the light engine, which facilitates miniaturization across the width of the light engine and facilitates I / O signal routing. Furthermore, compared to existing technologies, this application separates the PIC chips 120 and EIC chips 150 into separate groups, resulting in a smaller footprint.

[0076] As an implementation, see Figure 3 The lens module 160 includes a reflective portion 161 and a lens portion 162 . The width of the lens portion 162 is greater than that of the reflective portion 161 , and the width of the lens portion 162 is greater than that of the groove 123 . The bottom of the reflective portion 161 and the lens portion 162 are connected.

[0077] By providing the reflective portion 161, the light reflection effect can be achieved, thereby converting the horizontal light transmission and reception into the surface light transmission and reception effect, so that the lens array can be mounted on the groove 123 position of the light port of the light engine module 100. Optionally, the reflective portion 161 is configured as a right-angled triangular prism, and the inclined surface of the right-angled triangular prism is configured on the side away from the light port. Figure 3 As shown by the middle arrow, by providing a right-angled triangular prism-shaped reflective portion 161, the horizontal light can be flipped 90 degrees and turned into vertical light, thereby achieving the effect of surface light transmission and reception.

[0078] Furthermore, the focal point of lens portion 162 matches the mode field of the optical port to achieve lower coupling loss. In one implementation, lens portion 162 includes a transparent body 1621 and a convex lens 1622. A receiving groove is provided in the middle region of transparent body 1621, and convex lens 1622 is disposed within the receiving groove. The height of convex lens 1622 is equal to the height of the receiving groove, and the width of convex lens 1622 is less than the width of the receiving groove.

[0079] The above-mentioned lens portion 162 structure has at least the following advantages:

[0080] 1. The entire lens module 160 achieves a beam expansion effect, so that the FA connected to the PIC chip 120 has a larger coupling assembly tolerance.

[0081] 2. Since the width of the main body of the lens portion 162 is greater than the width of the reflective portion 161, when the lens assembly is installed, the reflective portion 161 can be conveniently installed in the groove 123 and bonded with glue. In addition, since the height of the convex lens 1622 is equal to the height of the receiving groove, the overall volume is relatively small.

[0082] 3. For the PIC chip 120, since the focus of the lens portion 162 matches the mode field of the optical port, the FA can achieve a light spot that matches the EC through the lens module 160, which can achieve smaller coupling loss than directly coupling the FA to the end face of the PIC chip 120.

[0083] 4. The FA adopts a pluggable solution, solving the thermal reliability issue of UV glue in advanced packaging processes. Furthermore, by placing the convex lens 1622 within the receiving groove, and by making the width of the convex lens 1622 smaller than the width of the receiving groove, the transparent body 1621 and the convex lens 1622 form a pluggable structure, achieving a stable pluggable connection with the FA.

[0084] In summary, by setting the structure of the reflector part 161 and the lens part 162, the reflection and convergence functions of the optical signal can be realized, while achieving two-dimensional expansion of the optical port signal, achieving smaller coupling loss and ensuring a stable connection with the FA.

[0085] Furthermore, the bottom of the receiving groove is flush with the surface of the second RDL layer 140. Overall, the height of the lens module 160 at the optical port is not too high. The height difference between the EIC chip 150 and the PIC chip 120 is substantially equal to the height of the convex lens 1622. Furthermore, the height difference between the FA and the EIC chip 150 is relatively small. Consequently, after the FA and the lens module 160 are plugged in, the height difference between the FA and the EIC chip 150 is relatively small, and the thickness of the entire light engine module 100 is relatively small, facilitating miniaturization.

[0086] Furthermore, the optical engine module provided in the present application may include multiple PIC chips, or a single PIC chip may include multiple rows of coupling slots.

[0087] When there are multiple signal transmitting chips 121 and signal receiving chips 122, multiple signal transmitting chips are arranged side by side, and multiple signal receiving chips 122 are also arranged side by side. The lens module 160 includes a first lens array and a second lens array. The first lens array is coupled with the optical ports of multiple signal transmitting chips, and the second lens array is coupled with the optical ports of multiple signal receiving chips 122. That is, in this application, by mounting the first lens array and the second lens array at the groove 123 of the optical port, the transmission and reception of multiple rows of optical I / O ports of a single optical engine module 100 can be realized. In actual production, it is first necessary to etch a groove 123 at the optical port of the PIC chip 120, such as Figure 4As shown, in the entire optical engine module 100, the signal transmitting chip 121 is located on the right, and the signal receiving chip 122 is located on the left. The signal transmitting chip 121 and the signal receiving chip 122 each include 6 optical I / O ports, and a groove 123 is provided corresponding to the position of the I / O port. Optionally, the groove 123 is a square groove with a depth greater than 30μm and a width greater than 50μm. During the preparation process, the groove 123 can be filled by electroplating copper, and the copper metal at the optical port can be completely removed by selective corrosion after the packaging process. The entire optical engine module 100 includes two grooves 123, and when the lens module 160 is subsequently mounted, please refer to Figure 5 A first lens array is mounted in the optical port groove 123 of the signal transmitting chip, enabling optical signal transmission and reception for six optical I / O ports. Similarly, a second lens array is mounted in the optical port groove 123 of the signal receiving module, enabling optical signal transmission and reception for six optical I / O ports. By providing lens module 160, the width of the entire optical engine module 100 can be reduced, improving the device's bandwidth density.

[0088] When each PIC chip includes multiple rows of grooves, the lens module includes multiple lens arrays, and each lens array is coupled with a groove, multiple rows of optical I / O ports of a single PIC chip can be realized.

[0089] Furthermore, the entire optical engine module 100 adopts a 3D packaging method. Metal pillars are used to achieve interconnection inside the optical engine module 100, thereby enabling multiple rows of signals of the EIC chip 150 to be led out in parallel through TMVs.

[0090] To meet the overall miniaturization requirements of the light engine module 100, the EIC chip 150 and the signal receiving chip 122 do not overlap in horizontal projection, while the EIC chip 150 and the signal transmitting chip 121 partially overlap in horizontal projection. This arrangement ensures sufficient space in the optical port groove 123 to accommodate the mounting of the lens module 160 and the FA connected to the lens module 160 via a plug-and-play connection. Furthermore, the spacing between the EIC chip 150 and the PIC chip 120 is relatively small, reducing the length of the light engine module 100 and facilitating miniaturization.

[0091] Furthermore, for the entire optical engine module 100, the PIC chip 120 is packaged face-up, while the EIC is flip-chip packaged. A UBM pad is provided on the surface of the second RDL layer 140, and the EIC chip 150 is electrically connected to the second RDL layer 140 via the UBM pad. It can be understood that the EIC chip 150 is interconnected via the UBM pad, the second RDL layer 140, and the pins on the surface of the PIC chip 120. The high-frequency, digital, and power supply signals of the entire optical engine module 100 are connected to the substrate 210 where the computing or switching chip is located via bumps on the bottom surface of the OE.

[0092] When the optical engine module is packaged in TSV mode, Figure 6 As shown, a TSV through hole is provided on the PIC chip, and the TSV through hole is filled with a metal layer; the EIC chip is located on the PIC chip, and the EIC chip is connected to the pins at the bottom through the metal layer.

[0093] The length of the PIC chip can be longer than that of the EIC chip, and the EIC chip is arranged on a side of the PIC chip away from the optical port. Figure 6 In the embodiment, the optical port of the PIC chip is arranged on the right side, and the EIC chip is arranged on the left side of the PIC chip.

[0094] It can be understood that by providing TSV packaging, the thickness of the entire light engine module can be greatly reduced, which is more conducive to miniaturization.

[0095] When the optical engine module is packaged using RDL and TSV, Figure 7 As shown, the PIC chip is provided with a TSV through hole, and the TSV through hole is filled with a metal layer; the optical engine module also includes:

[0096] A first RDL layer is provided with first metal traces, which are connected to the bottom pins. At least two PIC chips are located on the first RDL layer, and an EIC chip is located on the PIC chip, which is connected to the first metal traces in the first RDL layer via a metal layer. It can be understood that by utilizing RDL and TSV packaging, the thickness of the optical engine module can be reduced while making the internal electrical connections more flexible.

[0097] Based on the above implementation, please refer to Figure 8 The embodiment of the present application also provides an optical engine system 200, which includes a substrate 210, an optical fiber array 220, a processing chip 230 and the above-mentioned optical engine module 100. The optical engine module 100 and the processing chip 230 are both installed on the substrate 210 and interconnected through the wiring on the substrate 210; the optical fiber array 220 and the optical engine module 100 are pluggable.

[0098] The optical fiber array 220 includes a clamping portion, and when the optical fiber array 220 is connected to the lens module 160 of the light engine module 100 through the clamping portion, the lens portion 162 in the lens module 160 realizes the convergence of optical signals while also achieving clamping with the clamping portion.

[0099] In summary, embodiments of the present application provide a light engine module and light engine system. The light engine module includes at least two PIC chips, each of which includes at least one signal transmitting chip and at least one signal receiving chip. A groove is provided at the optical port of the PIC chip. At least two EIC chips are located above the PIC chips, each of which is electrically connected to a PIC chip and each EIC chip is also connected to a pin at the bottom. A lens module is mounted in the groove, coupled to the optical port of the PIC chip and flipping the optical signal of the PIC chip 90° to achieve surface signal transmission. Because the light engine module provided by the present application separates the signal transmitting chip from the signal receiving chip in the PIC chip, and uses the lens module to change the end-face signal transmission mode to surface signal transmission, the width of the light engine module can be reduced, facilitating miniaturization.

[0100] The above description is merely a preferred embodiment of the present application and is not intended to limit the present application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

[0101] It will be apparent to those skilled in the art that the present application is not limited to the details of the exemplary embodiments described above and that the present application can be implemented in other specific forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present application is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. A light engine module, characterized in that: The light engine module includes: At least two PIC chips, wherein the at least two PIC chips include at least one signal transmitting chip and at least one signal receiving chip, and the optical ports of the PIC chips are provided with grooves; at least two EIC chips located above the PIC chip, each of the EIC chips being electrically connected to one of the PIC chips and each of the EIC chips being further connected to the bottom pins; A lens module is installed in the groove, and the lens module is coupled with the optical port of the PIC chip, and flips the optical signal of the PIC chip by 90 degrees to achieve surface signal transmission.

2. The light engine module according to claim 1, wherein: The PIC chip is installed in a positive mounting manner, and the EIC chip is installed in a flip-chip manner.

3. The light engine module according to claim 1, wherein: The optical engine module is packaged in RDL and / or TSV manner.

4. The light engine module according to claim 3, wherein: When the optical engine module is packaged in an RDL manner, the optical engine module further includes: A first RDL layer; a first metal wiring is provided in the first RDL layer, and the first metal wiring is connected to the bottom pin; a filling layer and at least two PIC chips located on a surface of the first RDL layer, wherein the filling layer is disposed around the PIC chips, and metal pillars are disposed in the filling layer, the metal pillars are spaced apart from the PIC chips and are electrically connected to the first metal wiring; a second RDL layer located between the filling layer and the surface of the PIC chip; wherein the second RDL layer is provided with a second metal wiring, the second metal wiring being electrically connected to the metal pillar and the PIC chip respectively, and the second RDL layer exposing the optical port of the PIC chip; The EIC chips are located on the surface of the second RDL layer. Each of the EIC chips is electrically connected to one of the PIC chips through the second metal wiring, and each of the EIC chips is also electrically connected to the metal pillar through the second metal wiring.

5. The light engine module according to claim 3, wherein: When the optical engine module is packaged in a TSV manner, a TSV through-hole is provided on the PIC chip, and the TSV through-hole is filled with a metal layer; The EIC chip is located on the PIC chip, and the EIC chip is connected to the pins at the bottom through the metal layer.

6. The light engine module according to claim 3, wherein: When the optical engine module is packaged in RDL and TSV, the PIC chip is provided with a TSV through-hole, and the TSV through-hole is filled with a metal layer; the optical engine module further includes: A first RDL layer; a first metal wiring is provided in the first RDL layer, and the first metal wiring is connected to the bottom pin; The at least two PIC chips are located on the first RDL layer; The EIC chip is located on the PIC chip, and the EIC chip is connected to the first metal wiring in the first RDL layer through the metal layer.

7. The light engine module according to claim 1, wherein: The lens module includes a reflective portion and a lens portion, wherein the width of the lens portion is greater than the width of the reflective portion, and the width of the lens portion is greater than the width of the groove, and the reflective portion is connected to the bottom of the lens portion; The reflecting portion is configured as a right-angled triangular prism, and the inclined surface of the right-angled triangular prism is configured on a side away from the light port; The focus of the lens portion matches the mode field of the optical port.

8. The light engine module according to claim 7, wherein: The lens portion includes a transparent body and a convex lens. A receiving groove is provided in the middle area of ​​the transparent body. The convex lens is provided in the receiving groove. The height of the convex lens is equal to the height of the receiving groove, and the width of the convex lens is smaller than the width of the receiving groove.

9. The light engine module according to claim 1, wherein: When there are multiple signal transmitting chips and multiple signal receiving chips, the multiple signal transmitting chips are arranged side by side, and the multiple signal receiving chips are also arranged side by side. The lens module includes a first lens array and a second lens array. The first lens array is coupled with the optical ports of the multiple signal transmitting chips, and the second lens array is coupled with the optical ports of the multiple signal receiving chips.

10. The light engine module according to claim 1, wherein: The lens module includes a plurality of lens arrays, each of the PIC chips includes a plurality of rows of grooves, and each of the lens arrays is coupled to one of the grooves.

11. A light engine system, characterized in that: The optical engine system includes a substrate, an optical fiber array, a processing chip, and an optical engine module according to any one of claims 1 to 10. The optical engine module and the processing chip are both installed on the substrate and interconnected through wiring on the substrate; the optical fiber array and the optical engine module are pluggable.

12. The light engine system according to claim 11, wherein: The optical fiber array includes a clamping portion, and the optical fiber array is connected to the lens module of the light engine module through the clamping portion.

Images