MEMS micro galvanometer device, packaging structure and laser radar device

Abstract

The invention provides an MEMS micro galvanometer device, a packaging structure and a laser radar device. The MEMS micro galvanometer device comprises an MEMS micro galvanometer; and the MEMS micro galvanometer is electrically connected with the PCB substrate through a gold wire, and the contact surfaces of the MEMS micro galvanometer and the PCB substrate are flexibly connected through a soft adhesive. When external impact signal energy is applied to the MEMS micro galvanometer device, the energy is firstly absorbed and dispersed through the PCB substrate, so that the impact kinetic energy is obviously reduced; subsequently, the MEMS device itself resists the impact kinetic energy, which has been greatly weakened, by means of its inherent structural strength, thereby ensuring the final integrity of the MEMS device.

Description

Technical Field

[0001] The present invention relates to the field of MEMS device packaging, and in particular to a MEMS micro-vibration mirror device, a packaging structure and a laser radar device. Background Art

[0002] As a key dynamic motion component, MEMS micro-vibration mirrors face many severe challenges in terms of mechanical reliability. In order to effectively improve the reliability level of products, optimization from the perspective of packaging technology has proven to be a practical solution. Currently, many manufacturers generally tend to use the traditional packaging method of wrapping MEMS devices with metal shells in order to enhance the reliability and durability of the devices. Figure 1 As shown. However, this traditional packaging structure is mainly designed for static or low-dynamic performance sensors such as accelerometers. Since these sensors do not contain active moving parts, they themselves have good shock resistance. In contrast, MEMS micro-vibration mirrors are typical dynamic motion devices, which contain precise vibration and reflection mechanisms inside, and place higher demands on the dynamic response and shock protection capabilities of the packaging structure. Specifically, the traditional metal shell packaging structure often seems to be unable to cope with the vibration and impact requirements of MEMS micro-vibration mirrors. This packaging method may not be able to fully absorb and disperse the vibration and impact energy from the external environment, resulting in damage to the precise structure inside the MEMS micro-vibration mirror, which in turn affects its performance and reliability. Summary of the Invention

[0003] In order to solve all or part of the problems of the above-mentioned prior art, the present invention provides a MEMS micro-vibration mirror device, a packaging structure and a lidar device. By introducing a new packaging structure, the reliability of the product is enhanced, especially the ability to resist high-intensity impact is significantly improved.

[0004] To achieve the above object, the present invention provides the following technical solutions:

[0005] A MEMS micro-vibration mirror device is provided, comprising: a MEMS micro-vibration mirror; and a PCB substrate. The MEMS micro-vibration mirror and the PCB substrate are electrically connected via gold wire, and their contact surfaces are flexibly connected via a soft adhesive. When external impact signal energy is applied to the MEMS micro-vibration mirror device, the energy is first absorbed and dispersed by the PCB substrate, significantly reducing the impact kinetic energy. Subsequently, the MEMS device itself, relying on its inherent structural strength, resists the significantly reduced impact kinetic energy, thereby ensuring the ultimate integrity of the MEMS device.

[0006] The present invention also provides a MEMS micro-mirror packaging structure, comprising a shell, the inner cavity of the shell is used to accommodate the MEMS micro-mirror device described above, the MEMS micro-mirror device includes a MEMS micro-mirror and a PCB substrate, and the contact surface between the MEMS micro-mirror and / or the PCB substrate and the shell is flexibly connected by a soft adhesive. The packaging structure tightly connects the PCB substrate and the MEMS micro-mirror through a soft adhesive, and encapsulates them together within the shell. When subjected to external impact, the shell will transmit the impact kinetic energy inward as a medium, and the PCB substrate will first serve as the first line of defense, effectively absorbing and dispersing part of the impact force. Subsequently, thanks to the flexible connection provided by the soft adhesive, the remaining impact kinetic energy is further buffered and weakened. Finally, the MEMS device itself, with its inherent structural strength, resists the greatly reduced impact kinetic energy, thereby effectively ensuring the integrity of the entire packaging structure and the safe and stable operation of the internal components.

[0007] The MEMS micro-vibration mirror includes a vibrating mirror portion, an outer frame, and a rotating shaft portion connected between the vibrating mirror portion and the outer frame. The vibrating mirror portion is provided with a reflecting mirror surface for reflecting and modulating a laser beam.

[0008] A laser opening is provided on the top of the housing to allow the laser beam to pass through; the PCB substrate is fixed to the bottom of the housing cavity by a soft adhesive, and the MEMS micro-vibration mirror is arranged above the PCB substrate. An electrical connection is established between the two by a gold wire, and a soft adhesive is applied between the contact surfaces; the PCB substrate, the MEMS micro-vibration mirror and the laser opening are coaxially arranged, and the laser beam passes through the laser opening from the top of the housing and is received by the reflective mirror surface of the MEMS micro-vibration mirror.

[0009] The laser opening is located in the central area of ​​the top of the shell, the upper opening is circular, and the diameter is designed to be 5-20 mm; the lower end is a gradually narrowing structure, and the diameter of the lower opening is designed to be 3-18 mm; the straight-line distance between the lower opening of the laser opening and the reflective mirror surface of the MEMS micro-vibration mirror is 1-3 mm.

[0010] A laser opening is provided at the bottom of the shell to allow the laser beam to pass through; the PCB substrate is designed with a corresponding opening corresponding to the position of the laser opening, and the PCB substrate is fixed to the bottom of the inner cavity of the shell by a soft adhesive and is located outside the laser opening. The MEMS micro-vibration mirror is arranged above the PCB substrate, and an electrical connection is established between the two by a gold wire, and a soft adhesive is applied between the contact surfaces; the PCB substrate, the MEMS micro-vibration mirror and the laser opening are coaxially arranged, and the laser beam passes through the laser opening and the opening of the PCB substrate from the bottom of the shell and is received by the reflective mirror surface of the MEMS micro-vibration mirror.

[0011] The laser opening is located in the central area of ​​the bottom of the shell, the upper opening is circular, and the diameter is designed to be 3-18 mm; the lower end is a gradually expanding structure, and the diameter of the lower opening is designed to be 5-20 mm; the straight-line distance between the upper opening of the laser opening and the reflective mirror surface of the MEMS micro-vibration mirror is 1-3 mm.

[0012] The housing includes an upper shell and a lower shell, which are sealed together by a connecting component. The inner cavity of the lower shell accommodates the MEMS micro-vibration mirror, the PCB substrate, and the gold wire. The housing is configured as a split structure, which makes it easier to install the various components of the MEMS micro-vibration mirror device into the housing and also facilitates subsequent maintenance and replacement.

[0013] The present invention also provides an assembly process for a MEMS micro-mirror packaging structure, which is implemented using the above-mentioned MEMS micro-mirror packaging structure and specifically includes the following steps:

[0014] S1. Cleaning and pretreatment: Clean the housing and PCB substrate to remove dust, stains and other impurities attached to their surfaces;

[0015] S2. MEMS mirror assembly: A layer of soft adhesive, no less than 0.1 mm thick, is evenly applied to the cleaned and dried surface of the PCB. The MEMS mirror is aligned and attached to the PCB using the pre-defined alignment points on the PCB. The entire assembly is then heated to 120°C to cure the soft adhesive.

[0016] S3. Assembly of the MEMS micro-mirror packaging structure: evenly apply a layer of soft adhesive on the bottom of the inner cavity of the lower shell of the shell, and use the preset alignment points on the shell or with the help of special auxiliary tools to align and stick the assembled MEMS micro-mirror device to the bottom of the inner cavity of the lower shell; then, heat the entire assembly to 120°C to cure the soft adhesive; finally, use fasteners to connect the upper shell and the lower shell together.

[0017] The present invention also provides a laser radar device that utilizes the aforementioned MEMS micro-vibration mirror device or MEMS micro-vibration mirror packaging structure. Incident laser light is reflected by the reflective mirror surface of the MEMS micro-vibration mirror and then irradiates the surface of an object to be detected, thereby enabling detection of the object. A laser radar device utilizing the MEMS micro-vibration mirror device or packaging structure of the present invention can achieve more stable and accurate laser beam reflection and modulation, thereby improving the detection accuracy and reliability of the laser radar device.

[0018] The present invention has at least the following beneficial effects:

[0019] By introducing a new packaging structure, an electrical connection is established between the PCB substrate of the MEMS micro-vibration mirror device and the MEMS micro-vibration mirror through gold wire, and a flexible connection is achieved using a soft adhesive. This design effectively enhances the overall stability of the product. When external impact signal energy is applied to the MEMS micro-vibration mirror device, the PCB substrate first absorbs and disperses the impact force as the first line of defense. Then the flexible connection provided by the soft adhesive further buffers and weakens the remaining impact kinetic energy. Ultimately, the structural strength of the MEMS device itself resists the greatly reduced impact kinetic energy. This series of mechanisms together ensures that the MEMS device remains intact even when subjected to high-intensity impact, significantly improving the reliability of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the specific embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0021] Figure 1 Schematic diagram of a MEMS device packaging structure in the prior art.

[0022] Figure 2 This is a schematic structural diagram of the MEMS micro-vibration mirror device provided in Example 1 of the present invention.

[0023] Figure 3 This is a schematic structural diagram of the top opening of the MEMS micro-vibration mirror packaging structure provided in Example 2 of the present invention.

[0024] Figure 4 This is a structural schematic diagram of the bottom opening of the MEMS micro-vibration mirror packaging structure provided in Example 2 of the present invention.

[0025] Reference numerals: 1-MEMS micro-vibration mirror; 2-PCB substrate; 3-gold wire; 4-housing; 5-1, 5-2-laser opening. DETAILED DESCRIPTION

[0026] The following is a clear and complete description of the technical solutions in the specific embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present invention.

[0027] Example 1

[0028] In the embodiment of the present invention, in combination with reference Figure 2As shown, a MEMS micro-mirror device is provided, which includes a MEMS micro-mirror 1 and a PCB (printed circuit board) substrate electrically connected thereto. A stable electrical connection is achieved between the MEMS micro-mirror 1 and the PCB substrate 2 through gold wires 3. These gold wires 3 not only ensure the accurate transmission of electrical signals, but also provide the necessary mechanical stability. In order to further enhance the connection performance between the MEMS micro-mirror 1 and the PCB substrate 2, a soft adhesive is used between the contact surfaces of the two. This adhesive has excellent flexibility and adhesion, and can fit tightly to surfaces of different materials. Moreover, its unique stress absorption and dispersion capabilities can effectively alleviate the mechanical stress generated by external environmental factors such as vibration or temperature changes, thereby significantly reducing the potential risk of damage to the MEMS micro-mirror 1.

[0029] Example 2

[0030] Combined with reference Figure 3 As shown, this embodiment provides a MEMS micro-vibration mirror packaging structure, which adopts the MEMS micro-vibration mirror device described in Example 1. This packaging structure includes a shell 4, whose inner cavity is specifically used to accommodate and protect the MEMS micro-vibration mirror device. The MEMS micro-vibration mirror device is composed of a MEMS micro-vibration mirror 1 and a PCB substrate 2, and the two are flexibly connected to the contact surface of the shell 4 through a soft adhesive during the packaging process. This connection method not only enhances the overall mechanical stability, but also ensures good adaptability and long-term reliability under different environmental conditions. Specifically, the MEMS micro-vibration mirror 1 is composed of a vibrating mirror part, an outer frame and a rotating shaft part. A reflecting mirror surface is provided on the vibrating mirror part, which is specifically used to reflect and modulate the laser beam to achieve high-precision optical control and positioning. The rotating shaft part is a key component connecting the vibrating mirror part and the outer frame. Its design takes into account the flexibility of rotation and the stability of the structure, ensuring the stability and reliability of the MEMS micro-vibration mirror 1 in high-speed, high-precision movement.

[0031] In this embodiment, a laser aperture 5-1 is defined in the top of the housing 4 of the structure. This aperture is specifically designed to allow the laser beam to pass through, ensuring unimpeded access to the reflective surface of the MEMS micro-mirror 1. The PCB substrate 2 is secured to the bottom of the housing 4's interior cavity with a soft adhesive. The MEMS micro-mirror 1 is positioned directly above the PCB substrate 2, and the two are connected via gold wire 3 to achieve stable electrical transmission. Furthermore, to ensure stability and mechanical compliance of the connection, an additional layer of soft adhesive is applied between the contact surfaces. The PCB substrate 2, MEMS micro-mirror 1, and laser aperture 5-1 all utilize a coaxial design. This design not only enhances the overall structural symmetry but also ensures that the laser beam accurately passes through the laser aperture 5-1 from above the housing 4 and is precisely received by the reflective surface of the MEMS micro-mirror 1. Laser aperture 5-1 is located in the center of the top of the housing 4. Its upper opening is a standard circular design with a diameter ranging from 5 to 20 mm to ensure smooth passage of the laser beam. The lower end adopts a gradually narrowing structural design, and the diameter of the lower end opening is designed to be 3-18mm. This design not only helps to reduce the scattering of the laser beam during propagation, but also improves the focusing effect of the laser beam on the reflective mirror. In addition, the straight-line distance between the lower end opening of the laser opening 5-1 and the reflective mirror surface of the MEMS micro-vibration mirror 1 is controlled within the range of 1-3mm. The selection of this design parameter is intended to achieve the best focusing effect of the laser beam and ensure that the reflective mirror surface can receive the strongest laser signal. The opening diameter of the laser opening 5-1 is usually calculated based on the diameter of the reflective mirror surface. Since the laser beam is usually irradiated at an incident angle of no more than 45°, the diameter of the lower end opening of the laser opening 5-1 is set to the diameter of the reflective mirror surface plus the vertical distance from the reflective mirror surface to the lower end opening (this distance takes into account the path growth caused by the oblique incidence of the laser beam). The diameter of the reflective mirror surface is usually designed to be 1-15mm to ensure effective reception and reflection of the laser beam.

[0032] In other embodiments, Figure 4As shown, this structure also features a laser aperture 5-2 at the bottom of the housing 4. This design allows the laser beam to penetrate from below the package structure and precisely impact the reflective surface of the MEMS micro-mirror 1. To ensure smooth laser beam penetration, the PCB substrate 2 is designed with an opening corresponding to the laser aperture 5-2. The PCB substrate 2 is secured to the bottom of the housing 4 cavity with a soft adhesive and strategically positioned around the laser aperture 5-2 to avoid any obstruction to laser beam propagation. The MEMS micro-mirror 1 is positioned above the PCB substrate 2, connected by gold wire 3 for stable electrical transmission. To ensure stability and mechanical compliance of the connection, an additional layer of soft adhesive is applied between the contact surfaces. Similarly, the PCB substrate 2, MEMS micro-mirror 1, and laser aperture 5-2 all utilize a coaxial design. This design not only enhances the overall structural symmetry but also ensures that the laser beam accurately passes from below the housing 4 through the laser aperture 5-2 and the opening in the PCB substrate 2, ultimately being precisely received by the reflective surface of the MEMS micro-mirror 1. The laser opening 5-2 is located in the center of the bottom of the housing 4. Its upper opening is a standard circular design with a diameter range of 3-18 mm to ensure smooth penetration of the laser beam. The lower end of the laser opening adopts a gradually expanding structural design with a diameter of 5-20 mm. This design helps the laser beam gradually focus during propagation. Furthermore, the straight-line distance between the upper opening of the laser opening 5-2 and the reflective mirror surface of the MEMS micro-vibration mirror 1 is controlled within a range of 1-3 mm. This design parameter is selected to achieve optimal focusing of the laser beam and ensure that the reflective mirror surface can receive the strongest laser signal.

[0033] In other specific embodiments, the housing 4 can also be configured as a split structure, specifically comprising an upper shell and a lower shell, which are sealed together by connecting components to form a complete housing 4 structure. In this split structure, the inner cavity of the lower shell is specifically designed to accommodate core components such as the MEMS micro-vibration mirror 1, the PCB substrate 2, and the gold wire 3 connecting the two.

[0034] The present invention also provides an assembly process for a MEMS micro-mirror packaging structure, which is implemented using the above-mentioned MEMS micro-mirror packaging structure and specifically includes the following steps:

[0035] S1. Cleaning and Pretreatment: Scrutinize the housing 4 and PCB 2 to thoroughly remove dust, dirt, grease, and other impurities that could affect bonding and electrical performance. This cleaning process ensures a clean, residue-free surface, laying a solid foundation for subsequent steps.

[0036] S2. MEMS micro-mirror device assembly: After confirming that the housing 4 and the PCB substrate 2 have been thoroughly cleaned and dried, evenly apply a layer of precision soft adhesive with a thickness of not less than 0.1 mm to the designated area of ​​the PCB substrate 2. This adhesive must not only have good bonding strength, but also maintain a certain degree of flexibility to adapt to the slight deformation that may occur in subsequent applications. Using the pre-designed and precisely machined alignment points on the PCB substrate 2, the high-precision MEMS micro-mirror 1 is precisely aligned and affixed to the PCB substrate 2. During this process, the edge of the MEMS micro-mirror 1 is gently squeezed so that the glue can be evenly applied to the contact surface between the MEMS micro-mirror 1 and the PCB substrate 2. To ensure the reliability and stability of the bonding, the entire assembly is placed in a heating device, heated to 120°C and maintained for a certain period of time to complete the complete curing of the soft adhesive.

[0037] S3. Assembly of MEMS micro-vibration mirror packaging structure: evenly apply a layer of soft adhesive identical to that in step S2 to the bottom of the inner cavity of the lower shell of the shell 4. Using the preset alignment points on the shell 4 or with the help of special high-precision auxiliary tools (such as positioning pins), the assembled MEMS micro-vibration mirror device is precisely aligned and pasted to the bottom of the inner cavity of the lower shell. During this process, it is also necessary to gently squeeze the PCB substrate 2 to ensure that the glue can be evenly applied to the contact surface between the PCB substrate 2 and the lower shell. Heat the entire assembly to 120°C again to ensure that the adhesive is fully cured to form a stable packaging structure. Finally, use fasteners (such as screws) to tightly connect the upper shell and the lower shell to complete the assembly of the entire MEMS micro-vibration mirror packaging structure.

[0038] Example 3

[0039] This embodiment provides a laser radar device, which uses the MEMS micro-vibration mirror device provided in Example 1, or the MEMS micro-vibration mirror packaging structure provided in Example 2. The incident laser is reflected by the reflective mirror surface in the MEMS micro-vibration mirror 1 and then irradiates the surface of the object to be measured, thereby realizing detection of the object to be measured.

[0040] The present invention significantly improves the reliability and impact resistance of the product by providing a MEMS micro-vibration mirror device comprising a stable electrical connection between a MEMS micro-vibration mirror 1 and a PCB substrate 2 and a flexible adhesive reinforcement, as well as a packaging structure using the device. At the same time, the design of the shell 4 in the packaging structure, whether it is the laser opening 5 at the top or bottom and its optimized parameters, ensures the precise focusing and reception of the laser beam, broadening the application scenarios. In addition, the split structural design of the shell 4 simplifies the assembly and maintenance process and reduces costs. Ultimately, the present invention is applied to a laser radar device to achieve high-precision, high-stability optical control and positioning, improve detection accuracy and reliability, and provide strong support for the development of autonomous driving, robot navigation and other fields.

[0041] It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made to the present invention without departing from the principles of the present invention. These improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. A MEMS micro-vibration mirror device, characterized in that: include: MEMS micro-vibration mirror (1); A PCB substrate (2) is provided, wherein the MEMS micro-vibration mirror (1) and the PCB substrate (2) are electrically connected via a gold wire (3), and a flexible connection is achieved between the contact surfaces of the two via a soft adhesive.

2. A MEMS micro-mirror packaging structure, characterized in that: The invention comprises a shell (4), wherein the inner cavity of the shell (4) is used to accommodate the MEMS micro-mirror device according to claim 1, wherein the MEMS micro-mirror device comprises a MEMS micro-mirror (1) and a PCB substrate (2), and a flexible connection is achieved between the contact surface of the MEMS micro-mirror (1) and / or the PCB substrate (2) and the shell (4) via a soft adhesive.

3. The packaging structure according to claim 2, wherein: The MEMS micro-vibration mirror (1) comprises a vibrating mirror portion, an outer frame, and a rotating shaft portion connected between the vibrating mirror portion and the outer frame; the vibrating mirror portion is provided with a reflecting mirror surface for reflecting and modulating a laser beam.

4. The packaging structure according to claim 2, wherein: The top of the housing (4) is provided with a laser opening (5-1) that allows a laser beam to pass through; the PCB substrate (2) is fixed to the bottom of the inner cavity of the housing (4) by means of a soft adhesive, the MEMS micro-vibration mirror (1) is arranged above the PCB substrate (2), an electrical connection is established between the two by means of a gold wire (3), and a soft adhesive is applied between the contact surfaces; the PCB substrate (2), the MEMS micro-vibration mirror (1) and the laser opening (5-1) are coaxially arranged, and the laser beam passes through the laser opening (5-1) from above the housing (4) and is received by the reflective mirror surface of the MEMS micro-vibration mirror (1).

5. The packaging structure according to claim 4, wherein: The laser opening (5-1) is located in the central area of ​​the top of the housing (4), with the upper opening being circular and the diameter being designed to be 5-20 mm; the lower opening being a gradually narrowing structure and the diameter being designed to be 3-18 mm; and the straight-line distance between the lower opening of the laser opening (5-1) and the reflective mirror surface of the MEMS micro-vibration mirror (1) is 1-3 mm.

6. The packaging structure according to claim 2, wherein: The bottom of the housing (4) is provided with a laser opening (5-2) that allows the laser beam to pass through; the PCB substrate (2) is designed with a corresponding opening corresponding to the position of the laser opening (5-2); the PCB substrate (2) is fixed to the bottom of the inner cavity of the housing (4) by a soft adhesive and is located outside the laser opening (5-2); the MEMS micro-vibration mirror (1) is arranged above the PCB substrate (2); an electrical connection is established between the two by a gold wire (3), and a soft adhesive is applied between the contact surfaces; the PCB substrate (2), the MEMS micro-vibration mirror (1) and the laser opening (5-2) are coaxially arranged; the laser beam passes through the laser opening (5-2) and the opening of the PCB substrate (2) from the bottom of the housing (4) and is received by the reflective mirror surface of the MEMS micro-vibration mirror (1).

7. The packaging structure according to claim 6, wherein: The laser opening (5-2) is located in the central area of ​​the bottom of the housing (4), and its upper opening is circular with a diameter designed to be 5-20 mm; the lower end is a gradually expanding structure, and the diameter of the lower opening is designed to be 3-18 mm; the straight-line distance between the upper opening of the laser opening (5-2) and the reflective mirror surface of the MEMS micro-vibration mirror (1) is 1-3 mm.

8. The packaging structure according to claim 2, wherein: The housing (4) comprises an upper shell and a lower shell, the upper shell and the lower shell are packaged together via a connecting component, and the inner cavity of the lower shell accommodates the MEMS micro-vibration mirror (1), the PCB substrate (2) and the gold wire (3).

9. An assembly process for a MEMS micro-mirror packaging structure, characterized in that: The process is implemented using the MEMS micro-mirror packaging structure according to any one of claims 2 to 8, and specifically includes the following steps: S1. Cleaning and pretreatment: Clean the housing (4) and the PCB substrate (2) to remove dust, stains and other impurities attached to their surfaces; S2. MEMS micro-vibration mirror device assembly: a layer of soft adhesive having a thickness of not less than 0.1 mm is evenly coated on the surface of the cleaned and dried PCB substrate (2), and the MEMS micro-vibration mirror (1) is aligned and attached to the PCB substrate (2) using the alignment points preset on the PCB substrate (2); then, the entire assembly is heated to 120° C. to cure the soft adhesive; S3. Assembly of the MEMS micro-mirror packaging structure: a layer of soft adhesive is evenly applied on the bottom of the inner cavity of the lower shell of the shell (4), and the assembled MEMS micro-mirror device is aligned and adhered to the bottom of the inner cavity of the lower shell using the preset alignment points on the shell (4) or with the help of special auxiliary tools; then, the entire assembly is heated to 120°C to solidify the soft adhesive; finally, the upper shell and the lower shell are connected together using fasteners.

10. A laser radar device, characterized in that: By using the MEMS micro-vibration mirror device according to claim 1 or the MEMS micro-vibration mirror packaging structure according to any one of claims 2 to 8, the incident laser is reflected by the mirror surface of the MEMS micro-vibration mirror (1) and then irradiated onto the surface of the object to be measured.

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