Method for manufacturing intelligent card module with contact and non-contact functions

Abstract

The invention provides a method for manufacturing an intelligent card module with contact and non-contact functions, which comprises the following steps of: directly manufacturing a non-contact antenna on a packaging panel to realize a non-contact communication function of an intelligent card, and realizing the non-contact communication function without depending on a card-based antenna; a chip with a double-interface function is packaged on an onboard baseband, and the chip with the double-interface function is used for switching between a contact communication mode and a non-contact communication mode; the metal surface contacts are electrically connected with the contact contacts by adopting a via hole process so as to realize a contact type communication function of the intelligent card module; and packaging the packaged module into a card base without an antenna through gluing and sealing steps to form the intelligent card with contact and non-contact functions. The problems that a traditional double-interface intelligent card is complex in packaging process, high in cost, poor in attractiveness, limited in compatibility and the like can be solved.

Description

Technical Field

[0001] The present invention relates to the technical field of smart card production, and in particular to a method for producing a smart card module with both contact and contactless functions, which is applicable to various smart card products that need to support both contact and contactless communications. Background Art

[0002] Traditional dual-interface smart cards typically require an external card-based antenna to implement contactless communication. This packaging approach presents the following issues: Complex process: There are many packaging steps, including card-base packaging process connection, and the production cycle is long.

[0003] High cost: Conductive medium is required to connect the module contactless point and the card-based contactless antenna, which increases the material and manufacturing costs. Figure 1 and Figure 2 As shown, Figure 1 The contact point is an ISO 14443 contactless contact and needs to be connected to the card-based antenna through a conductive medium.

[0004] Poor aesthetics: The external antenna affects the overall appearance of the smart card and is not conducive to its application in different usage scenarios.

[0005] Limited compatibility: Without an external antenna, the contactless function cannot be enabled, which limits the usage environment of the smart card. Summary of the Invention

[0006] In view of the shortcomings of the existing technology, the present invention provides a method for manufacturing a smart card module with both contact and contactless functions to solve the problems of traditional dual-interface smart card packaging process, high cost, poor aesthetics and limited compatibility.

[0007] The present invention achieves the above-mentioned purpose through the following technical solutions: A method for manufacturing a smart card module with both contact and contactless functions, comprising: A contactless antenna is directly fabricated on the packaging panel, and the contactless antenna is used to implement the contactless communication function of the smart card, and the implementation of the contactless communication function does not rely on the card-based antenna; Encapsulating a chip with a dual-interface function on an onboard baseband, wherein the dual-interface function chip is used to switch between a contact communication mode and a contactless communication mode; The metal surface contacts and the contact contacts are electrically connected using a through-hole process to realize the contact communication function of the smart card module; The packaged module is packaged into a card base without an antenna through gluing and sealing steps to form a smart card with both contact and contactless functions.

[0008] According to a method for manufacturing a smart card module with both contact and contactless functions provided by the present invention, the method directly manufacturing a contactless antenna on a packaging panel includes: Based on the chip's technical parameters and the ISO1443 communication standard, and based on an operating frequency of 13.56MHz, a miniaturized design strategy was adopted for the contactless antenna. During the design process, a spiral winding method was selected as the fabrication method for the contactless antenna. Using photolithography technology to plan the structure of each part of the contactless antenna, setting the width, thickness and connection method of the conductive part to form a conductive layer pattern; The planned antenna structure is treated with an etching solution to form a stable conductive layer and ensure that the antenna feeder layout is optimally matched with the chip signal path, thus completing the fabrication of the contactless antenna. The processed contactless antenna is integrated with the packaging panel substrate through low-temperature hot pressing bonding, conductive adhesive bonding or vacuum lamination process.

[0009] According to a method for manufacturing a smart card module with both contact and contactless functions provided by the present invention, the method includes packaging a chip with dual-interface functions on an onboard baseband, comprising: Chip placement: Use high-precision equipment to extract the dual-interface chip from the 8-inch or 12-inch wafer and paste it on the epoxy-coated substrate. Then, perform a high-temperature curing process to achieve a firm connection between the chip and the substrate. Wire bonding step: Based on the specific contact information of the chip, use the wire bonding process to connect the contact points and non-contact points on the chip and the onboard baseband; Encapsulation step: Use UV encapsulation glue to cover the encapsulated module to protect the chip and connecting wires from external damage; Test steps: The contact function of the module is measured through testing; at the same time, the non-contact function of the module is tested using antenna sensing technology.

[0010] According to the present invention, a method for manufacturing a smart card module with both contact and contactless functions is provided, wherein the packaged module is packaged into a card base without an antenna through gluing and sealing steps, comprising: Gluing step: using an adhesive tape, sticking the tape to a designated position of the smart card module that has contact and contactless functions; Sealing step: Using specialized sealing equipment, apply pressure and heat to the module with the tape affixed to it, forming a strong and reliable connection between the module and the card base without the antenna, thus completing the overall packaging of the smart card.

[0011] According to a method for manufacturing a smart card module with both contact and contactless functions provided by the present invention, when designing a contactless antenna, the specific steps of planning the contact points and contactless contacts using a double-sided copper cladding process and an electroplating method are as follows: Double-sided copper cladding process: On the substrate of the package panel, a layer of copper foil is covered on both sides of the panel through the double-sided copper cladding process to form a conductive layer; Contact planning: Based on the chip's technical parameters and the ISO1443 communication standard, plan the location and shape of the contact points on the copper layer to ensure that the contact points can establish a stable and reliable electrical connection with the chip's contact points; Contactless contact planning: Plan contactless contacts in a specific area on the other side or the same side of the copper clad layer, i.e., the contactless antenna fabrication area. The contactless antenna is formed using a spiral winding method to ensure the realization of contactless communication functions. Electroplating to enhance conductivity: On planned contact points and non-contact points, the thickness of the copper layer is increased or the surface quality of the copper layer is improved by electroplating to improve the conductivity and corrosion resistance of the contacts; Etching and forming: Use photolithography technology and corrosive liquid to etch the copper layer, remove excess copper foil, and form the planned shape and size of contact points and non-contact points.

[0012] According to a method for manufacturing a smart card module with both contact and contactless functions provided by the present invention, the via hole process includes: During the design phase of the package panel, the location, size, and number of vias are planned and designed in advance; During the processing of the package panel, laser drilling, mechanical drilling or other suitable drilling technology is used to make via holes at predetermined locations. The via holes should penetrate all layers of the package panel to achieve electrical connection; Metallization is performed on the via holes to form a uniform and continuous metal layer on the inner wall of the via holes through electroplating, chemical plating or other metal deposition techniques; Align the metal surface contacts and the contact contacts with the two ends of the via holes respectively, and electrically connect the metal surface contacts and the contact contacts through the via holes by welding, crimping or other suitable connection methods to form a complete electrical path; After completing the electrical connection, verify and test the contact communication function of the smart card module.

[0013] According to the present invention, a method for manufacturing a smart card module with both contact and contactless functions is provided. When manufacturing a contactless antenna, a new conductive material is screened from candidate materials with higher conductivity than traditional copper materials and lower dielectric loss at an operating frequency of 13.56 MHz. The new conductive material includes but is not limited to a silver nanowire composite material, a graphene-enhanced conductive polymer, or a copper-silver alloy material with a specific ratio.

[0014] According to a method for manufacturing a smart card module with both contact and contactless functions provided by the present invention, a network analyzer is used to test the quality factor Q value, resonant frequency and radiation efficiency of the integrated antenna. The antenna pattern parameters or material thickness are adjusted according to the test results, and the impedance matching between the antenna and the chip is optimized through finite element simulation.

[0015] According to a method for manufacturing a smart card module with both contact and contactless functions provided by the present invention, when performing a quality factor (Q) value test, a port of a network analyzer is connected to a feed point of a smart card module integrated with a contactless antenna via a radio frequency coaxial cable; Start the network analyzer to measure the S parameters and obtain the reflection coefficient of the antenna. S 11 Frequency-dependent curves, based on quality factor Q The value is calculated by: Q = f 0 / Δ f in, f 0 is the resonant frequency of the antenna, Δ f for S 11 The amplitude of the curve drops to 1 / 2 of the maximum value near the resonance point. The corresponding frequency bandwidth can be directly read or calculated through the data processing function of the network analyzer. Q value; In completion S 11 After the parameters are measured, the S 11 The frequency corresponding to the point with the smallest amplitude in the curve is the resonant frequency of the antenna. f 0.

[0016] The radiation efficiency test method of the hub-and-spoke method is used to place the smart card module in a microwave darkroom and measure the radiation power of the antenna in free space using a network analyzer. P rad and input power P in , radiation efficiency η The calculation formula is: η = P rad / P in ×100% The input power data is collected by a network analyzer, and the radiation power data is obtained by combining it with the power measurement equipment in the darkroom to calculate the radiation efficiency of the antenna.

[0017] According to the method for manufacturing a smart card module with both contact and contactless functions provided by the present invention, if the measured resonant frequency f 0 deviates from 13.56MHz, and the number of turns of the antenna coil is adjusted according to the relationship between the antenna resonant frequency and the pattern parameters such as antenna size and shape. N , Line Width w , line spacing s etc. to change the resonant frequency; If the quality factor Q A lower value indicates that the antenna loss is large; If the radiation efficiency is low, the radiation structure of the antenna can be adjusted to improve the radiation efficiency.

[0018] It can be seen that compared with the prior art, the method for manufacturing a smart card module with both contact and contactless functions proposed in the present invention has the following beneficial effects: 1. The present invention's built-in contactless coil design completely eliminates reliance on a card-based antenna, enabling contactless communication functionality to be implemented directly within the module. This eliminates the need for additional card-based antenna packaging, simplifying the overall packaging process. This reduced contact with the card-based antenna reduces reliance on packaging processes, simplifies the production process, and reduces production costs and time.

[0019] 2. This invention adopts a modular design concept, which not only optimizes the internal structure of the smart card module but also enhances its overall appearance, making the smart card more attractive and aesthetically pleasing in different usage scenarios. This aesthetically pleasing design helps increase user acceptance and satisfaction with the smart card, thereby enhancing the product's market competitiveness.

[0020] 3. This invention integrates a dual-interface chip into the module, enabling smooth switching between contact and contactless communication modes, ensuring smart card compatibility in diverse environments. Whether using traditional card swipe or emerging contactless interactions, the module provides stable and efficient communication support, meeting the needs of a variety of application scenarios.

[0021] 4. This invention, through its built-in contactless coil and integrated dual-interface functional chip design, simplifies the production process, reduces production steps, and thus improves production efficiency. This increased production efficiency shortens product cycles, helping companies bring products to market faster and seize opportunities.

[0022] 5. The design of the present invention's built-in non-contact coil reduces external connection points, thereby reducing the risk of failure caused by external connections and improving product reliability. Improved product reliability means reduced maintenance costs, helping companies save long-term operating costs.

[0023] In summary, the present invention provides a method for manufacturing a smart card module with both contact and contactless functions. By simplifying the packaging process, improving the module's aesthetics, enhancing compatibility, improving production efficiency, and enhancing product reliability, it has brought significant technological progress and improved market competitiveness to the smart card industry.

[0024] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic diagram of the packaging surface of a smart card module in the prior art.

[0026] Figure 2 This is a schematic diagram of the metal surface of a smart card module in the prior art.

[0027] Figure 3 The present invention is a flowchart of a method for manufacturing a smart card module with both contact and contactless functions.

[0028] Figure 4 It is a schematic diagram of the packaging surface of a contactless antenna in an embodiment of a method for manufacturing a smart card module with both contact and contactless functions of the present invention.

[0029] Figure 5 It is a schematic diagram of a metal surface in an embodiment of a method for manufacturing a smart card module with both contact and contactless functions according to the present invention.

[0030] Figure 6 This is a structural diagram of packaging a chip on an onboard baseband in an embodiment of a method for manufacturing a smart card module with both contact and contactless functions of the present invention.

[0031] Figure 7 The present invention is a process flow diagram of packaging a chip on an onboard baseband in an embodiment of a method for manufacturing a smart card module with both contact and contactless functions.

[0032] Figure 8The figure is a schematic diagram of the card sealing production process in an embodiment of a method for producing a smart card module with both contact and contactless functions according to the present invention. DETAILED DESCRIPTION

[0033] To make the objectives, technical solutions, and advantages of the present invention more clear, the technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0034] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0035] See also Figures 3 to 8 This embodiment provides a method for manufacturing a smart card module with both contact and contactless functions, including: Step S1: directly fabricating a contactless antenna on the packaging panel. The contactless antenna is used to implement the contactless communication function of the smart card, and the implementation of the contactless communication function does not rely on the card-based antenna; Step S2: encapsulating a chip with a dual-interface function on an onboard baseband, wherein the dual-interface function chip is used to switch between a contact communication mode and a contactless communication mode; Step S3, using a via hole process to electrically connect the metal surface contacts with the contact contacts to realize the contact communication function of the smart card module; In step S4, the packaged module is packaged into a card base without an antenna through gluing and sealing steps to form a smart card with both contact and contactless functions.

[0036] It can be seen that the smart card module of this embodiment directly manufactures the contactless antenna on the packaging surface, and can realize the contactless function of the smart card without the need for a card-based antenna. Figure 4 As shown. The metal surface contacts use a through-hole process to achieve conduction and realize the module contact function. In addition, this embodiment optimizes the metal surface layout without affecting the module function, and designs a four-leaf clover with gem pattern for the metal surface, such as Figure 5 shown.

[0037] In the above step S1, directly manufacturing a contactless antenna on the packaging panel includes: Based on the chip's technical parameters and the ISO1443 communication standard, and based on an operating frequency of 13.56MHz, a miniaturized design strategy was adopted for the contactless antenna. During the design process, a spiral winding method was selected as the fabrication method for the contactless antenna. Using photolithography technology to plan the structure of each part of the contactless antenna, setting the width, thickness and connection method of the conductive part to form a conductive layer pattern; The planned antenna structure is treated with an etching solution to form a stable conductive layer and ensure that the antenna feeder layout is optimally matched with the chip signal path, thus completing the fabrication of the contactless antenna. The processed contactless antenna is integrated with the packaging panel substrate through low-temperature hot pressing bonding, conductive adhesive bonding or vacuum lamination process.

[0038] It can be seen that this embodiment adopts a miniaturized design strategy based on the chip's technical parameters and communication standards (ISO1443), based on an operating frequency of 13.56MHz, and selects a spiral winding method to design a contactless antenna. Double-sided copper cladding process and electroplating method are used to plan contact points and contactless contacts. According to the required conductive performance, the width, thickness and connection method of the conductive part are set, the structure of each part of the antenna is planned using photolithography technology, and an etching solution is used to form a precise conductive layer. By optimizing the photolithography pattern and etching process, the shape of the conductive part is ensured to be stable and meet the chip requirements, while ensuring that the antenna feed line layout is optimally matched with the chip signal path, such as Figure 6 shown.

[0039] In the above step S2, the chip with dual interface function is packaged on the onboard baseband, such as Figure 7 Shown, including: Attachment step (a): Using high-precision equipment, remove the dual-interface chip from the 8-inch or 12-inch wafer and attach it to the epoxy-coated substrate. High-temperature curing is then performed to achieve a secure connection between the chip and the substrate. Wire bonding step (b): Based on the specific contact information of the chip, the chip is connected to the contact points and non-contact points on the onboard baseband using the wire bonding process to ensure the stability and reliability of signal transmission; Encapsulation step (c): Cover the encapsulated module with UV encapsulation glue to protect the chip and connecting wires from external damage, while improving the durability and environmental adaptability of the module; Test step (d): The contact function of the module is measured to ensure the stability and accuracy of contact communication. At the same time, the contactless function of the module is tested using antenna sensing technology to verify the performance and reliability of contactless communication.

[0040] In the above step S4, the packaged module is packaged into a card base without an antenna through gluing and sealing steps, such as Figure 8 As shown (steps: gluing-sealing), including: Gluing step: using an adhesive tape, sticking the tape to a designated position of the smart card module that has contact and contactless functions; Sealing step: Using specialized sealing equipment, apply pressure and heat to the module with the tape affixed to it, forming a strong and reliable connection between the module and the card base without the antenna, thus completing the overall packaging of the smart card.

[0041] In the above step S1, when designing the contactless antenna, the specific steps of planning the contact points and the contactless contacts using the double-sided copper cladding process and electroplating method are as follows: Double-sided copper cladding process: On the substrate of the package panel, a layer of copper foil is covered on both sides of the panel through the double-sided copper cladding process to form a conductive layer, providing a basis for the subsequent planning of contact points and non-contact points; Contact planning: Based on the chip's technical parameters and the ISO1443 communication standard, plan the location and shape of the contact points on the copper layer to ensure that the contact points can establish a stable and reliable electrical connection with the chip's contact points; Contactless contact (i.e., contactless antenna) planning: The contactless contact, or the contactless antenna fabrication area, is planned in a specific area on the other side or the same side of the copper clad layer. The contactless antenna is formed using a spiral winding method to ensure contactless communication functionality. During the miniaturization design process, spiral winding was chosen as the contactless antenna fabrication method. This winding method allows for a longer antenna length within a limited space, thereby improving the antenna's communication efficiency and stability. Electroplating enhances conductivity: On planned contact and non-contact points, the copper layer thickness is increased or the surface quality is improved through electroplating to enhance the conductivity and corrosion resistance of the contacts, ensuring long-term stability and reliability. Etching and forming: Use photolithography technology and corrosive liquid to etch the copper layer, remove excess copper foil, and form the planned shape and size of contact points and non-contact points.

[0042] In the above step S3, the via hole process includes: During the design phase of the package panel, the location, size, and number of vias are pre-planned and designed to ensure that the vias can accurately connect the metal surface contacts and the contact contacts; During the processing of the package panel, laser drilling, mechanical drilling or other suitable drilling technology is used to make via holes at predetermined locations. The via holes should penetrate all layers of the package panel to achieve electrical connection; Metallization is performed on the via holes to form a uniform and continuous metal layer on the inner wall of the via holes through electroplating, chemical plating or other metal deposition techniques; Align the metal surface contacts and the contact contacts with the two ends of the via holes respectively, and electrically connect the metal surface contacts and the contact contacts through the via holes by welding, crimping or other suitable connection methods to form a complete electrical path; After completing the electrical connection, the contact communication function of the smart card module is verified and tested to ensure that the electrical connection between the metal surface contacts and the contact contacts is stable and reliable, meeting the contact communication requirements of the smart card module.

[0043] In this embodiment, when fabricating a contactless antenna, novel conductive materials are selected from candidate materials with higher conductivity than traditional copper and lower dielectric loss at an operating frequency of 13.56 MHz. These novel conductive materials include, but are not limited to, silver nanowire composites, graphene-enhanced conductive polymers, or copper-silver alloys with specific ratios. The selected novel materials are cleaned to remove oxide layers and impurities. Based on the antenna design requirements, a uniform conductive layer is formed on the surface of the material through physical vapor deposition (PVD), electroless plating, or electroplating. Composite materials are directly cut to size. Laser direct writing, photolithography, or nanoimprinting techniques are used to precisely form a spiral contactless antenna pattern compliant with the ISO 1443 standard on the pre-treated novel material surface, ensuring that the antenna line width, spacing, and number of turns meet the inductance matching requirements at a frequency of 13.56 MHz. The fabricated novel material antenna pattern is then integrated with the package panel substrate through low-temperature hot-press bonding, conductive adhesive bonding, or vacuum lamination, ensuring a stable mechanical connection and electrical continuity between the antenna and substrate.

[0044] In this embodiment, a network analyzer is used to test the quality factor Q value, resonant frequency, and radiation efficiency of the integrated antenna. The antenna pattern parameters or material thickness are adjusted according to the test results, and the impedance matching between the antenna and the chip is optimized through finite element simulation.

[0045] Specifically, when performing a quality factor Q value test, the port of the network analyzer is connected to the feeding point of the smart card module integrated with the non-contact antenna through a radio frequency coaxial cable; Set the network analyzer's sweep frequency range to cover the frequency band around 13.56 MHz to encompass the expected operating frequency range of the non-connected antenna. Start the network analyzer to measure the S parameters and obtain the reflection coefficient of the antenna. S 11 Frequency-dependent curves, based on quality factor Q The value is calculated by: Q = f 0 / Δf in, f 0 is the resonant frequency of the antenna, Δ f for S 11 The amplitude of the curve drops to 1 / 2 of the maximum value near the resonance point. The corresponding frequency bandwidth (i.e. 3dB bandwidth) can be directly read or calculated through the data processing function of the network analyzer. Q value; In completion S 11 After the parameters are measured, the S 11 The frequency corresponding to the point with the smallest amplitude in the curve is the resonant frequency of the antenna. f 0.

[0046] Use the hub-and-spoke method or two-port network analysis method to test radiation efficiency. Take the hub-and-spoke method as an example. Place the smart card module in a microwave darkroom and use a network analyzer to measure the radiation power of the antenna in free space. P rad and input power P in , radiation efficiency η The calculation formula is: η = P rad / P in ×100% The input power data is collected by a network analyzer, and the radiation power data is obtained by combining it with the power measurement equipment in the darkroom to calculate the radiation efficiency of the antenna.

[0047] If the measured resonant frequency f 0 deviates from 13.56MHz, and the number of turns of the antenna coil is adjusted according to the relationship between the antenna resonant frequency and the pattern parameters such as antenna size and shape. N , Line Width w , line spacing s etc. to change the resonant frequency; for example, for a helical antenna, the resonant frequency f 0 and antenna inductance L and capacitors C The relationship is f 0=1 / 2 π , and the antenna inductance L and number of turns N , Line Width w When the resonant frequency is high, the number of turns can be appropriately increased. N Or reduce the line width wTo increase inductance L , thereby reducing the resonant frequency; conversely, when the resonant frequency is low, reduce the number of turns N Or increase the line width w。

[0048] If the quality factor Q A low value indicates that the antenna loss is large. You can optimize the layout of the antenna pattern to reduce unnecessary bends and crosses to reduce the antenna's resistance loss. At the same time, check the connection between the antenna and the package panel substrate to ensure a good connection and reduce contact resistance. If the radiation efficiency is low, the antenna's radiation structure can be adjusted, such as increasing the antenna's effective radiation area, optimizing the antenna's radiation pattern, etc. For example, for a helical antenna, the outer diameter of the antenna can be appropriately increased to improve the radiation efficiency.

[0049] If the antenna performance is sensitive to material thickness and the test results show that the antenna performance does not meet expectations, the material thickness can be studied experimentally. t Relationship with antenna performance. Generally speaking, the material thickness affects the resistance and inductance of the antenna, which in turn affects the quality factor. Q Under the premise of ensuring the material processability and compatibility with the packaging panel substrate, the material thickness is adjusted according to the experimental results to optimize the antenna performance.

[0050] Using professional electromagnetic field finite element simulation software such as HFSS and CST, a finite element simulation model of the smart card module is created based on the actual antenna structure, material parameters, and the chip's equivalent circuit model. In the model, parameters such as the antenna's geometric dimensions, material properties (including conductivity and dielectric constant), and the chip's input impedance are accurately set.

[0051] In the finite element simulation software, the electromagnetic field simulation calculation is performed on the established model to obtain the input impedance of the antenna at a frequency of 13.56MHz. Z ant , whose expression is Z ant = R ant + JX ant ,in R ant is the input resistance of the antenna, X ant is the input reactance of the antenna. At the same time, the input impedance of the chip is known Z chip = R chip + JX chipIn order to achieve the best impedance matching between the antenna and the chip, the reflection coefficient Γ needs to be minimized. The calculation formula of the reflection coefficient is: Γ= Z ant - Z ∗ chip / Z ant + Z chip in, Z ∗ chip The conjugate complex number of the chip input impedance can be changed by adjusting the antenna pattern parameters (such as number of turns, line width, line spacing, etc.) or material thickness. Zant , making the reflection coefficient Γ approach to zero, thereby achieving impedance matching between the antenna and the chip.

[0052] Based on the optimized antenna pattern parameters or material thickness obtained through finite element simulation, the contactless antenna is remade and integrated into the smart card module. The network analyzer is then used to test again to verify the accuracy of the simulation results. If the test results still do not meet the expected performance, the finite element simulation model is modified based on the difference between the test and simulation results. The above simulation optimization process is repeated until the impedance matching between the antenna and the chip is optimized and the antenna's performance indicators such as quality factor (Q value), resonant frequency, and radiation efficiency meet the design requirements.

[0053] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0054] The above embodiments are only preferred embodiments of the present invention and cannot be used to limit the scope of protection of the present invention. Any non-substantial changes and replacements made by technicians in this field on the basis of the present invention fall within the scope of protection required by the present invention.

Claims

1. A method for manufacturing a smart card module with both contact and contactless functions, characterized in that: include: A contactless antenna is directly fabricated on the package panel to realize the contactless communication function of the smart card, and the realization of the contactless communication function does not rely on the card-based antenna; Encapsulating a chip with a dual-interface function on an onboard baseband, wherein the dual-interface function chip is used to switch between a contact communication mode and a contactless communication mode; The metal surface contacts and the contact contacts are electrically connected using a through-hole process to realize the contact communication function of the smart card module; The packaged module is packaged into a card base without an antenna through gluing and sealing steps to form a smart card with both contact and contactless functions.

2. The method according to claim 1, characterized in that The method of directly manufacturing a contactless antenna on a packaging panel includes: Based on the chip's technical parameters and the ISO1443 communication standard, and based on an operating frequency of 13.56MHz, a miniaturized design strategy was adopted for the contactless antenna. During the design process, a spiral winding method was selected as the fabrication method for the contactless antenna. Using photolithography technology to plan the structure of each part of the contactless antenna, setting the width, thickness and connection method of the conductive part to form a conductive layer pattern; The planned antenna structure is treated with an etching solution to form a stable conductive layer and ensure that the antenna feeder layout is optimally matched with the chip signal path, thus completing the fabrication of the contactless antenna. The processed contactless antenna is integrated with the packaging panel substrate through low-temperature hot pressing bonding, conductive adhesive bonding or vacuum lamination process.

3. The method according to claim 1, characterized in that The method of packaging a chip with dual interface functions on an onboard baseband includes: Chip placement: Use high-precision equipment to extract the dual-interface chip from the 8-inch or 12-inch wafer and paste it on the epoxy-coated substrate. Then, perform a high-temperature curing process to achieve a firm connection between the chip and the substrate. Wire bonding step: Based on the specific contact information of the chip, use the wire bonding process to connect the contact points and non-contact points on the chip and the onboard baseband; Encapsulation step: Use UV encapsulation glue to cover the encapsulated module to protect the chip and connecting wires from external damage; Test steps: The contact function of the module is measured through testing; at the same time, the non-contact function of the module is tested using antenna sensing technology.

4. The method according to claim 1, wherein The encapsulated module is encapsulated into a card base without an antenna through gluing and sealing steps, including: Gluing step: using an adhesive tape, sticking the tape to a designated position of the smart card module that has contact and contactless functions; Sealing step: Using specialized sealing equipment, apply pressure and heat to the module with the tape affixed to it, forming a strong and reliable connection between the module and the card base without the antenna, thus completing the overall packaging of the smart card.

5. The method according to claim 2, characterized in that When designing a contactless antenna, the specific steps for planning the contact points and contactless contacts using a double-sided copper cladding process and electroplating are as follows: Double-sided copper cladding process: On the substrate of the package panel, a layer of copper foil is covered on both sides of the panel through the double-sided copper cladding process to form a conductive layer; Contact planning: Based on the chip's technical parameters and the ISO1443 communication standard, plan the location and shape of the contact points on the copper layer to ensure that the contact points can establish a stable and reliable electrical connection with the chip's contact points; Contactless contact planning: Plan contactless contacts in a specific area on the other side or the same side of the copper clad layer, i.e., the contactless antenna fabrication area. The contactless antenna is formed using a spiral winding method to ensure the realization of contactless communication functions. Electroplating to enhance conductivity: On planned contact points and non-contact points, the thickness of the copper layer is increased or the surface quality of the copper layer is improved by electroplating to improve the conductivity and corrosion resistance of the contacts; Etching and forming: Use photolithography technology and corrosive liquid to etch the copper layer, remove excess copper foil, and form the planned shape and size of contact points and non-contact points.

6. The method according to claim 1, characterized in that The via hole process includes: During the design phase of the package panel, the location, size, and number of vias are planned and designed in advance; During the processing of the package panel, laser drilling, mechanical drilling or other suitable drilling technology is used to make via holes at predetermined locations. The via holes should penetrate all layers of the package panel to achieve electrical connection; Metallization is performed on the via holes to form a uniform and continuous metal layer on the inner wall of the via holes through electroplating, chemical plating or other metal deposition techniques; Align the metal surface contacts and the contact contacts with the two ends of the via holes respectively, and electrically connect the metal surface contacts and the contact contacts through the via holes by welding, crimping or other suitable connection methods to form a complete electrical path; After completing the electrical connection, verify and test the contact communication function of the smart card module.

7. The method according to claim 1, wherein: When making a non-contact antenna, new conductive materials are screened from candidate materials with higher conductivity than traditional copper materials and lower dielectric loss at an operating frequency of 13.56 MHz. The new conductive materials include but are not limited to silver nanowire composites, graphene-enhanced conductive polymers, or copper-silver alloy materials with a specific ratio.

8. The method according to claim 2, wherein: Use a network analyzer to test the quality factor Q value, resonant frequency and radiation efficiency of the integrated antenna. Adjust the antenna pattern parameters or material thickness based on the test results, and optimize the impedance matching between the antenna and the chip through finite element simulation.

9. The method according to claim 8, characterized in that: When performing a quality factor (Q) test, connect the port of the network analyzer to the feed point of the smart card module with an integrated non-contact antenna through an RF coaxial cable. Start the network analyzer to measure the S parameters and obtain the reflection coefficient of the antenna. S 11 Frequency-dependent curves, based on quality factor Q The value is calculated by: Q = f 0 / D f in, f 0 is the resonant frequency of the antenna, Δ f for S 11 The amplitude of the curve drops to 1 / 2 of the maximum value near the resonance point. The corresponding frequency bandwidth can be directly read or calculated through the data processing function of the network analyzer. Q value; In completion S 11 After the parameters are measured, the S 11 The frequency corresponding to the point with the smallest amplitude in the curve is the resonant frequency of the antenna. f 0. The radiation efficiency test method of the hub-and-spoke method is used to place the smart card module in a microwave darkroom and measure the radiation power of the antenna in free space using a network analyzer. P rad and input power P in , radiation efficiency η The calculation formula is: η = P rad / P in ×100% The input power data is collected by a network analyzer, and the radiation power data is obtained by combining it with the power measurement equipment in the darkroom to calculate the radiation efficiency of the antenna.

10. The method according to claim 9, characterized in that: If the measured resonant frequency f 0 deviates from 13.56MHz, and the number of turns of the antenna coil is adjusted according to the relationship between the antenna resonant frequency and the pattern parameters such as antenna size and shape. N , Line Width w , line spacing s etc. to change the resonant frequency; If the quality factor Q A lower value indicates that the antenna loss is large; If the radiation efficiency is low, the radiation structure of the antenna can be adjusted to improve the radiation efficiency.

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