Display module and display device

Abstract

The invention provides a display module and a display device, and the display module comprises an array substrate which comprises a display area and a non-display area; the driving chip is located on one side of the array substrate, and the driving chip is located in the non-display area; the heat dissipation film comprises a wrapping part and an extension part which are connected with each other, the driving chip and part of the array substrate are located in the closed annular wrapping part, and the extension part extends to the back face, away from the light emitting direction, of the display module. According to the invention, the heat dissipation effect of the driving chip can be improved.

Description

Technical Field

[0001] The present disclosure relates to the field of display, and in particular, to a display module and a display device. Background Art

[0002] In display modules, the core function of the driver chip (IC) is to convert input digital signals into precise voltage / current control signals, driving each pixel to emit light on demand and displaying images. However, with the development of high-resolution and large-screen displays and the increasing integration of driver chips, along with improved performance, the thermal power consumption of driver chips has also increased, resulting in excessively high temperatures in the area around the driver chips.

[0003] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute prior art known to ordinary technicians in the field. Summary of the Invention

[0004] In view of this, the present disclosure provides a display module and a display device to at least solve the problem of excessively high temperature in the area surrounding the driver chip of the conventional display module.

[0005] In one aspect, an embodiment of the present disclosure provides a display module, comprising: an array substrate, the array substrate including a display area and a non-display area; a driver chip, the driver chip is located on one side of the array substrate, and the driver chip is located in the non-display area; a heat dissipation film, the heat dissipation film includes a wrapping portion and an extension portion that are interconnected, the driver chip and part of the array substrate are located inside the closed ring-shaped wrapping portion, and the extension portion extends to the back side of the display module away from the light emitting direction.

[0006] On the other hand, an embodiment of the present disclosure further provides a display device including the above-mentioned display module.

[0007] Compared with the prior art, the present disclosure has at least the following technical effects:

[0008] The display module and display device disclosed herein are configured such that a driver chip is arranged in a non-display area of ​​an array substrate, so that the driver chip is located at a position where the display module only has the array substrate in the thickness direction, i.e., a step area of ​​the display module, and the driver chip and a portion of the array substrate are wrapped in a closed ring inside the wrapping portion by a heat dissipation film, and an extension portion of the heat dissipation film interconnected with the wrapping portion extends to the back side of the display module away from the light emitting direction, so that the heat emitted from the driver chip is absorbed by the wrapping portion of the heat dissipation film and guided to the back side of the display module away from the light emitting direction through the extension portion, thereby improving the heat dissipation effect of the driver chip and preventing the heat from being transferred to the surface of the display module in the light emitting direction. At the same time, the provision of the wrapping portion can improve the fixing strength of the heat dissipation film and the driver chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The accompanying drawings are incorporated into and constitute a part of the specification, illustrate embodiments consistent with the present disclosure, and together with the specification, are used to explain the principles of the present disclosure. Obviously, the drawings described below are only some embodiments of the present disclosure, and those skilled in the art can derive other drawings based on these drawings without inventive effort.

[0010] Figure 1 This is a schematic diagram of a top view structure of a display module in the related art;

[0011] Figure 2 yes Figure 1 The schematic diagram of the structure of the module AA' section is shown in FIG.

[0012] Figure 3 This is a schematic top view of the structure of a display module with a heat dissipation film in an unfolded state provided by an embodiment of the present disclosure;

[0013] Figure 4 yes Figure 3 A structural schematic diagram showing the cross section of module BB' is shown in FIG.

[0014] Figure 5 1 is a schematic structural diagram of an array substrate and a wrapping portion provided by an embodiment of the present disclosure;

[0015] Figure 6 is a structural schematic diagram of an extension portion provided by an embodiment of the present disclosure;

[0016] Figure 7 1 is a schematic diagram of the structure of a display module in the thickness direction provided by an embodiment of the present disclosure;

[0017] Figure 8 is a schematic structural diagram of another display module in the thickness direction provided by an embodiment of the present disclosure;

[0018] Figure 91 is a schematic diagram of the structure of another display module in the thickness direction provided by an embodiment of the present disclosure;

[0019] Figure 10 This is a structural diagram of an extension portion and a heat dissipation module provided by an embodiment of the present disclosure;

[0020] Figure 11 is a structural schematic diagram of another extension portion and heat dissipation module provided by an embodiment of the present disclosure;

[0021] Figure 12 1 is a schematic structural diagram of a heat dissipation film provided by an embodiment of the present disclosure;

[0022] Figure 13 1 is a schematic top view of the structure of another display module in an unfolded state of a heat dissipation film provided by an embodiment of the present disclosure;

[0023] Figure 14 It is a structural schematic diagram of a display device provided by an embodiment of the present disclosure.

[0024] Reference numerals:

[0025] 100 Display Module

[0026] 110 array substrate

[0027] 111 display area

[0028] 112 non-display area

[0029] 120 driver chip

[0030] 130 heat dissipation film

[0031] 131 Package Department

[0032] 132 Extension

[0033] 133 graphene layers

[0034] 134 electromagnetic shielding layer

[0035] 135 copper foil layer

[0036] 136 Conductive pressure sensitive adhesive layer

[0037] 141 Point Light

[0038] 142 light guide plate

[0039] 143 Optical Film

[0040] 150 Flexible Printed Circuit Board

[0041] 160 filter

[0042] 170 back cover

[0043] 181 First Thermal Conductive Adhesive

[0044] 182 Second thermal conductive adhesive

[0045] 183 Third thermal conductive adhesive

[0046] 190 heat dissipation module

[0047] 191 First heat sink

[0048] 192 Second heat sink

[0049] 200 display device DETAILED DESCRIPTION

[0050] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concepts of the example embodiments to those skilled in the art. Identical reference numerals in the figures represent identical or similar structures, and thus a repeated description thereof will be omitted.

[0051] The terms "first," "second," and similar terms used in the specific description do not denote any order, quantity, or importance, but are simply used to distinguish different components. Furthermore, in the description of this disclosure, the terms "upper," "lower," and the like indicate positions or locations based on those shown in the accompanying drawings. These terms are intended solely for ease of description and do not indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this disclosure.

[0052] It should be noted that, in the absence of conflict, the embodiments of the present disclosure and features in different embodiments may be combined with each other.

[0053] In a display module, the core function of the driver chip (Integrated Circuit, IC) is to convert the input digital signal into a precise voltage / current control signal, driving each pixel to emit light on demand and realize image display. However, with the development of high-resolution and large-screen display devices, and the increasing integration of driver chips, as the performance of driver chips improves, their thermal power consumption also increases, and the temperature of the display module in the area around the driver chip is too high. Especially with the development of intelligent vehicles, the temperature of the in-vehicle display modules used in automobiles (such as front operating screens and rear-seat ceiling entertainment screens) is too high, which is more likely to lead to a decrease in user experience in the small and confined space of the car.

[0054] In the related art, in order to solve the problem that the local temperature around the IC in the display module is too high, which leads to the overall temperature of the display module being too high, Figure 1 and Figure 2 The illustrated display module 100' provides a solution. Specifically, the display module 100' includes multiple driver chips 120' disposed on the side of the array substrate 110' near the touch cover plate 150'. A first heat dissipation film 131', made of heat-dissipating material, is affixed directly above the driver chips 120'. This first heat dissipation film 131' and the driver chips 120' are located on the same side of the array substrate 110'. This film is used to disperse heat concentrated in the multiple driver chips 120' throughout the first heat dissipation film 131', thereby resolving the problem of heat concentration in the driver chips 120' and preventing this heat from being transferred to the touch cover plate 150'. A second heat dissipation film 132' is affixed below the side of the touch cover plate 150' near the array substrate 110'. This film is used to isolate the driver chips 120' from heat transfer to the touch cover plate 150' and to disperse the temperature of the touch cover plate 150' near the driver chips 120', thereby reducing the surface temperature of the display module 100'. However, the related technology can only provide a limited reduction in the temperature of the driver chip 120 ′.

[0055] In addition, the display module 100' also includes multiple light sources 140' located on the side of the array substrate 110' away from the driver chip 120'. The light sources 140' also generate heat. When the light sources 140' are in operation, the heat generated is transferred toward the touch cover plate 150' through the array substrate 110' and the area near the rear housing 160' and the touch cover plate 150'. In the thickness direction of the display module 100', the heat from the driver chip 120' and the light sources 140' overlaps in the area, further increasing the surface temperature of the display module 100'.

[0056] In view of this, one aspect, such as Figure 3 、 Figure 4 、 Figure 5 and Figure 6 As shown, an embodiment of the present disclosure provides a display module 100 . The display module 100 includes an array substrate 110 , a driving chip 120 , and a heat dissipation film 130 .

[0057] The array substrate 110 includes a display area 111 and a non-display area 112. Specifically, the display area 111 of the array substrate 110 includes a plurality of thin-film transistors (not shown) for driving the light-emitting state of the display module 100. When the display module 100 is a liquid crystal display (LCD) module, the array substrate 110 is used to drive the rotation of the liquid crystal to control the display content of the display module 100. When the display module 100 is an organic light-emitting diode (OLED), an active-matrix organic light-emitting diode (AMOLED) display, or a micro-light-emitting diode (Micro-LED) display, the array substrate 110 is used to directly drive the light-emitting elements to emit light to control the display content of the display module 100. The non-display area 112 of the array substrate 110 includes a plurality of driving traces for connecting to the driving chip 120 and at least receiving driving signals from the driving chip 120 to control the display content of the display module 100 .

[0058] The driver chip 120 is located on one side of the array substrate 110 and is located in the non-display area 112. Specifically, the driver chip 120 is used to connect to at least a plurality of drive traces in the non-display area 112 of the array substrate 110 and send drive signals to the drive traces to control the display content of the display module 100.

[0059] The heat dissipation film 130 includes a wrapping portion 131 and an extension portion 132 that are interconnected. The driver chip 120 and part of the array substrate 110 are located within the closed annular wrapping portion 131, and the extension portion 132 extends to the back side of the display module 100 away from the light emitting direction. Specifically, the wrapping portion 131 of the heat dissipation film 130 is annular, and the driver chip 120 and the portion of the non-display area 112 of the array substrate 110 where the driver chip 120 is located are wrapped within the annular wrapping portion 131. This facilitates the transfer of heat emitted from the driver chip 120 to the wrapping portion 131, and the heat emitted from the driver chip 120 is transferred to the back side of the display module 100 away from the light emitting direction through the extension portion 132 connected to the wrapping portion 131, thereby preventing the heat from being transferred to the surface of the display module 100 in the light emitting direction.

[0060] In this embodiment, the driver chip 120 is arranged in the non-display area 112 of the array substrate 110, so that the driver chip 120 is located at a position where the display module 100 only has the array substrate 110 in the thickness direction, that is, the step area of ​​the display module 100, and the driver chip 120 and part of the array substrate 110 are wrapped in the closed ring inside of the wrapping portion 131 by the wrapping portion 131 of the heat dissipation film 130, and the extension portion 132 of the heat dissipation film 130 connected to the wrapping portion 131 extends to the back side of the display module 100 away from the light emitting direction, so that the heat emitted from the driver chip 120 is absorbed by the wrapping portion 131 of the heat dissipation film 130 and guided to the back side of the display module 100 away from the light emitting direction through the extension portion 132, which can improve the heat dissipation effect of the driver chip 120 and prevent the heat from being transferred to the surface of the display module 100 in the light emitting direction. At the same time, the provision of the wrapping portion 131 can improve the fixing strength of the heat dissipation film 130 and the driver chip 120.

[0061] In some embodiments, as Figure 3 and Figure 7As shown, the display module 100 also includes: a plurality of point light sources 141. The point light sources 141 are located in the non-display area 112, and the plurality of point light sources 141 are arranged in sequence along the edge of the display module 100. The display module 100 includes a plurality of driver chips 120, and at least some of the driver chips 120 are located on the side of the display module 100 including at least some of the point light sources 141. Specifically, the display module 100 can be a liquid crystal display, and the light emitted by the point light source 141 changes its propagation direction and is dispersed to form a planar light source through a light guide plate 142 (Light Guide Plate, LGP), and is emitted to the optical film 143 located on the side of the light guide plate 142 close to the array substrate 110, and after passing through the optical film 143, is emitted to the light emitting surface of the display module 100. Furthermore, the optical film 143 along the light emitting direction of the display module 100 may include: a diffuser plate, a diffuser film, a prism film, and a brightness enhancement film. The diffuser plate and the diffuser film can disperse the light emitted from the point light source 141 to form a planar light source, wherein the diffuser plate also has the function of supporting the diffuser film, the prism film and the brightness enhancement film. The main function of the prism film is to change the direction of the light and help guide the light to propagate in a specific direction. The brightness enhancement film is mainly used to enhance the polarization effect and reflectivity of light and improve the energy efficiency of the point light source 141. The point light source 141 can be located on any side of the display module 100. Optionally, all the point light sources 141 are located on the same side of the display module 100 to reduce the border width of the display module 100 and increase the screen-to-body ratio of the display module 100. Multiple driver chips 120 can also be located on any side of the display module 100. Optionally, all the driver chips 120 are located on the same side of the display module 100 to reduce the border width of the display module 100 and increase the screen-to-body ratio of the display module 100. Furthermore, the point light sources 141 also generate heat. When operating, the heat generated by the point light sources 141 is transferred through the array substrate 110 to the surface of the display module 100 in the light-emitting direction. In the thickness direction of the display module 100, the heat from the driver chip 120 and the point light sources 141 overlaps, further increasing the surface temperature of the display module 100. This embodiment, combined with the provision of the heat dissipation film 130 of the previous embodiment, can further reduce the surface temperature of the display module 100 in the thickness direction where the driver chip 120 and the point light sources 141 overlap, while achieving the technical effects of the previous embodiment.

[0062] In some embodiments, the point light source 141 includes an LED (Light Emitting Diode). Specifically, the LED, as the backlight source of the display module 100, can provide a high luminous intensity and be dispersed by the light guide plate to form a planar light source, which is emitted toward the light-emitting surface of the display module 100. In this embodiment, the display module 100 can be a liquid crystal display.

[0063] In some embodiments, as Figure 3 As shown, the number of driver chips 120 is the same as the number of extensions 132 of the heat dissipation film 130, and the position of each extension 132 matches one driver chip 120. Specifically, the heat dissipation film 130 may include a wrapping portion 131 and multiple extensions 132. One wrapping portion 131 can be used to wrap multiple driver chips 120, and each extension 132 matches one driver chip 120. The above arrangement of this embodiment can quickly transfer heat from the driver chip 120 to the wrapping portion 131, and then transfer it to the back side of the display module 100 away from the light emitting direction through the extension 132, further improving the heat dissipation effect of the driver chip 120.

[0064] In some embodiments, as Figure 7 As shown, the display module 100 also includes: a plurality of flexible printed circuit boards 150. Each flexible printed circuit board 150 is electrically connected to a driver chip 120, and the flexible printed circuit board 150 extends to the back side of the display module 100 away from the light emitting direction; a portion of the flexible printed circuit board 150 is located inside the wrapping portion 131, and each extension portion 132 is attached to the surface of a flexible printed circuit board 150 away from the display module 100. Specifically, the core function of the flexible printed circuit board 150 (FPC) is to realize signal transmission and power supply between the display module 100 and other components, and to adapt to complex spatial layouts through its bendable characteristics, thereby improving the device's lightweight and mechanical reliability. At the same time, due to its high-density signal transmission and power supply, the flexible printed circuit board 150 also generates heat. In this embodiment, the flexible circuit board 150 is wrapped by the annular wrapping portion 131, and each extension portion 132 is attached to a flexible circuit board 150. This can transfer heat emitted from the flexible circuit board 150 to the back side of the display module 100 away from the light emitting direction through the heat dissipation film 130, thereby improving the heat dissipation effect of the flexible circuit board 150.

[0065] In some embodiments, as Figure 7As shown, the display module 100 also includes: a filter 160. The filter 160 and the driver chip 120 are located on the same side of the array substrate 110. The filter 160 covers the display area 111 and partially extends to the non-display area 112. In the direction perpendicular to the array substrate 110, the driver chip 120 and the filter 160 do not overlap, and the wrapping portion 131 and the filter 160 do not overlap. Specifically, the filter 160 (Color Filter, CF) can be applied to different display modules 100 such as liquid crystal, Micro-LED, OLED and AMOLED. Depending on the display module 100, the function of the filter 160 is slightly different. Please refer to the existing technology and will not be described here. The above-mentioned setting of the filter 160 in this embodiment enables the wrapping portion 131 of the heat dissipation film 130 to only wrap the array substrate 110 and the driver chip 120, but not the filter 160, which can further improve the heat dissipation efficiency of the driver chip 120.

[0066] In some embodiments, as Figure 7 、 Figure 8 and Figure 9 As shown, the display module 100 further includes a rear housing 170. The rear housing 170 is located on the side of the array substrate 110 facing away from the light emitting direction of the display module 100. The extension 132 is bonded to the back surface of the rear housing 170 facing away from the light emitting direction of the display module 100. Specifically, the rear housing 170 houses the internal structure of the display module 100 and may be made of sheet metal to enhance heat dissipation from the display module 100. In this embodiment, the bonding of the extension 132 to the rear housing 170 further enhances heat dissipation from the driver chip 120 and the flexible circuit board 150.

[0067] In some embodiments, as Figure 8 As shown, the display module 100 further includes a first thermally conductive adhesive 181. The extension portion 132 is bonded to the back surface of the rear housing 170, away from the light-emitting direction of the display module 100, via the first thermally conductive adhesive 181. In a direction perpendicular to the array substrate 110, the projection of the first thermally conductive adhesive 181 based on the array substrate 110 is contained within the projection of the extension portion 132 based on the array substrate 110. This arrangement of this embodiment allows the extension portion 132 to be tightly bonded to the rear housing 170, improving the heat exchange efficiency between the rear housing 170 and the extension portion 132, and enhancing the heat dissipation effect of the extension portion 132.

[0068] In some embodiments, the material of the first thermally conductive adhesive 181 includes one or a combination of at least two of epoxy resin, acrylic acid, or polyurethane. The above configuration of this embodiment can further improve the heat exchange efficiency between the rear housing 170 and the extension 132 and improve the heat dissipation effect of the extension 132.

[0069] In some embodiments, as Figure 7 、 Figure 9 、 Figure 10 and Figure 11 As shown, the display module 100 also includes: a heat dissipation module 190 and a second thermally conductive adhesive 182. The heat dissipation module 190 has two first heat dissipation fins 191 arranged opposite to each other and a plurality of second heat dissipation fins 192 connecting the two first heat dissipation fins 191. The heat dissipation module 190 is connected to the back surface of the rear shell 170 away from the light emitting direction of the display module 100 through the first heat dissipation fins 191. The extension 132 is bonded to the surface of the first heat dissipation fin 191 away from the light emitting direction of the display module 100 through the second thermally conductive adhesive 182. Specifically, the first heat dissipation fin 191 of the heat dissipation module 190 close to the rear shell 170 is used to realize heat transfer between the rear shell 170 and the heat dissipation module 190, and dissipate the heat from the rear shell 170 into the air through the heat dissipation module 190. The plurality of second heat dissipation fins 192 are arranged at intervals to improve the heat dissipation efficiency of the heat dissipation module 190. The second thermally conductive adhesive 182 of the extension portion 132 is bonded to the first heat sink 191 of the heat dissipation module 190 close to the rear housing 170, and at least transfers the heat emitted from the driver chip 120, the point light source 141 or the flexible circuit board 150 to the heat dissipation module 190, so as to further improve the heat dissipation effect of the driver chip 120, the point light source 141 or the flexible circuit board 150.

[0070] In some embodiments, as Figure 7 and Figure 9 As shown, the display module 100 further includes a third thermally conductive adhesive 183. The heat dissipation module 190 is bonded to the back surface of the rear housing 170, away from the light emitting direction of the display module 100, via the third thermally conductive adhesive 183. A first heat sink 191 covers the third thermally conductive adhesive 183. Specifically, the third thermally conductive adhesive 183 is bonded to the first heat sink 191 of the heat dissipation module 190, which is closer to the rear housing 170. The third thermally conductive adhesive 183 of this embodiment improves the heat exchange efficiency between the rear housing 170 and the heat dissipation module 190, further enhancing the heat dissipation of the driver chip 120, the point light source 141, or the flexible circuit board 150.

[0071] In some embodiments, the materials of the second thermally conductive adhesive 182 and the third thermally conductive adhesive 183 each include one or a combination of at least two of epoxy resin, acrylic resin, or polyurethane. That is, the materials of the second thermally conductive adhesive 182 and the third thermally conductive adhesive 183 can be the same as those of the first heat dissipation adhesive, and this disclosure does not impose any restrictions on this. The above-described configuration of this embodiment can further improve the heat exchange efficiency between the rear housing 170 and the extension 132, as well as the heat exchange efficiency between the rear housing 170 and the heat dissipation module 190, thereby improving the heat dissipation effect of the extension 132.

[0072] In some embodiments, the heat dissipation film 130 includes a thermally conductive material and an electromagnetic shielding material. This configuration of the present embodiment can improve the heat dissipation effect of the heat dissipation film 130 on the driver chip 120, the point light source 141, or the flexible circuit board 150 while avoiding the need for additional shielding film material. This achieves electromagnetic shielding while saving internal space within the display module 100 and reducing the thickness of the display module 100.

[0073] In some embodiments, as Figure 12 As shown, along the direction away from the driver chip 120, the heat dissipation film 130 includes, in order: a graphene layer 133, an electromagnetic shielding layer 134, a copper foil layer 135, and a conductive pressure-sensitive adhesive layer 136. Specifically, the electromagnetic shielding layer 134 can be made of metal, and the conductive pressure-sensitive adhesive layer 136 can be used for both electrical and thermal conductivity. This arrangement of the present embodiment achieves both thermal conductivity and electromagnetic shielding effects for the heat dissipation film 130.

[0074] In some embodiments, as Figure 3 and Figure 13 As shown, when the wrapping portion 131 and the extension portion 132 are unfolded in a plane, the heat dissipation film 130 is in a "T" or "I" shape. The above arrangement of this embodiment can increase the heat transfer path and contact area between the extension portion 132 of the heat dissipation film 130 and the air or other components, thereby further improving the heat dissipation efficiency of the extension portion 132.

[0075] In some embodiments, the display module 100 further includes a surface light source. This surface light source is located on a side of the array substrate 110 away from the driver chip 120 and covers the non-display area 112. The surface light source includes an array of Micro-LED light-emitting units. Specifically, the display module 100 can be a liquid crystal module using a Micro-LED backlight.

[0076] In some embodiments, the display module 100 further includes a light-emitting unit layer. The light-emitting unit layer and the driver chip 120 are located on the same side of the array substrate 110. The light-emitting unit layer includes an array of OLED light-emitting units, AMOLED light-emitting units, or Micro-LED light-emitting units. Specifically, the display module 100 can be an OLED module, an AMOLED module, or a Micro-LED module.

[0077] In some embodiments, the driver chip 120 includes a source driver chip or a gate driver chip. Specifically, the source driver chip (Source Driver IC) is responsible for converting image data into an analog voltage or current signal, and accurately controlling the brightness of each pixel (such as grayscale adjustment of LCD or current drive of OLED). The gate driver chip (Gate Driver IC) controls the pixel switching timing by scanning row by row, and determines the timing of writing data to each row of pixels. The two work together to achieve screen refresh and stable display of the display module 100. In this embodiment, the heat dissipation film 130 can be set on any side of the display module 100 by different types and positions of the driver chip 120, thereby improving the versatility of the heat dissipation film 130.

[0078] On the other hand, Figure 14 As shown, the embodiment of the present disclosure further provides a display device 200. The display device 200 includes the display module 100 provided by any embodiment of the present disclosure. The display device 200 provided by the embodiment of the present disclosure can be Figure 14 The vehicle-mounted display shown can also be any electronic product with display function, including but not limited to the following categories: televisions, laptops, desktop monitors, tablets, digital cameras, smart bracelets, smart glasses, medical equipment, industrial control equipment, touch interactive terminals, etc. The embodiments of the present disclosure do not specifically limit this.

[0079] The specific implementation and technical effects of the display device 200 disclosed in the present invention can refer to the specific embodiment of the display module 100 described above, and the repeated parts will not be repeated.

[0080] In summary, it can be seen from the above embodiments that the present disclosure achieves at least the following beneficial effects:

[0081] The display module and display device disclosed herein are configured such that a driver chip is arranged in a non-display area of ​​an array substrate, so that the driver chip is located at a position where the display module only has the array substrate in the thickness direction, i.e., a step area of ​​the display module, and the driver chip and a portion of the array substrate are wrapped in a closed ring inside the wrapping portion by a heat dissipation film, and an extension portion of the heat dissipation film interconnected with the wrapping portion extends to the back side of the display module away from the light emitting direction, so that the heat emitted from the driver chip is absorbed by the wrapping portion of the heat dissipation film and guided to the back side of the display module away from the light emitting direction through the extension portion, thereby improving the heat dissipation effect of the driver chip and preventing the heat from being transferred to the surface of the display module in the light emitting direction. At the same time, the provision of the wrapping portion can improve the fixing strength of the heat dissipation film and the driver chip.

[0082] The above content is a further detailed description of the present disclosure in conjunction with specific optional implementation methods, and the specific implementation of the present disclosure should not be considered to be limited to these descriptions. For those skilled in the art of the present disclosure, without departing from the concept of the present disclosure, they can also make several simple deductions or substitutions, which should be considered to fall within the scope of protection of the present disclosure.

Claims

1. A display module, characterized in that: include: An array substrate, the array substrate comprising a display area and a non-display area; A driving chip, wherein the driving chip is located on one side of the array substrate and is located in the non-display area; The heat dissipation film includes a wrapping portion and an extension portion connected to each other, the driving chip and part of the array substrate are located inside the closed ring-shaped wrapping portion, and the extension portion extends to the back of the display module away from the light emitting direction.

2. The display module according to claim 1, wherein: The display module further includes: a plurality of point light sources, the point light sources being located in the non-display area and arranged in sequence along an edge of the display module; The display module includes a plurality of the driving chips, and at least some of the driving chips are located on a side of the display module that includes at least some of the point light sources.

3. The display module according to claim 2, wherein: The point light source includes an LED lamp.

4. The display module according to claim 1, wherein: The number of the driving chips is the same as the number of the extension parts of the heat dissipation film, and the position of each extension part matches one driving chip.

5. The display module according to claim 4, wherein: The display module further includes: A plurality of flexible circuit boards, each of which is electrically connected to one of the driver chips, and each of which extends to the back side of the display module away from the light emitting direction; Part of the flexible circuit board is located inside the wrapping portion, and each of the extension portions is attached to a surface of the flexible circuit board away from the display module.

6. The display module according to claim 1, wherein: The display module further includes: A filter, wherein the filter and the driver chip are located on the same side of the array substrate, the filter covers the display area and partially extends to the non-display area; along a direction perpendicular to the array substrate, the driver chip and the filter do not overlap, and the wrapping portion and the filter do not overlap.

7. The display module according to claim 1, wherein: The display module further includes: The rear shell is located on a side of the array substrate away from the light emitting direction of the display module; the extension portion is bonded to the back side of the rear shell away from the light emitting direction of the display module.

8. The display module according to claim 7, wherein: The display module further includes: A first thermally conductive adhesive, wherein the extension portion is bonded to the back side of the rear shell away from the light emitting direction of the display module through the first thermally conductive adhesive; along a direction perpendicular to the array substrate, the projection of the first thermally conductive adhesive based on the array substrate is included in the projection of the extension portion based on the array substrate.

9. The display module according to claim 8, wherein: The material of the first thermally conductive adhesive includes one or a combination of at least two of epoxy resin, acrylic resin or polyurethane.

10. The display module according to claim 7, wherein: The display module further includes: a heat dissipation module, the heat dissipation module comprising two first heat dissipation fins arranged opposite to each other and a plurality of second heat dissipation fins connected to the two first heat dissipation fins, the heat dissipation module being connected to the back side of the rear housing away from the light emitting direction of the display module via the first heat dissipation fins; The second thermally conductive adhesive is used to bond the extension portion to a surface of the first heat sink away from the light emitting direction of the display module.

11. The display module according to claim 10, wherein: The display module further includes: A third thermally conductive adhesive is used to bond the heat dissipation module to the back side of the rear housing away from the light emitting direction of the display module; and the first heat sink covers the third thermally conductive adhesive.

12. The display module according to claim 11, wherein: The materials of the second thermal conductive adhesive and the third thermal conductive adhesive respectively include one or a combination of at least two of epoxy resin, acrylic acid or polyurethane.

13. The display module according to claim 1, wherein: The heat dissipation film includes a heat conductive material and an electromagnetic shielding material.

14. The display module according to claim 13, wherein: Along the direction away from the driving chip, the heat dissipation film includes: a graphene layer, an electromagnetic shielding layer, a copper foil layer and a conductive pressure-sensitive adhesive layer.

15. The display module according to claim 1, wherein: When the wrapping portion and the extension portion are unfolded in a plane, the heat dissipation film is in a "T" or "I" shape.

16. The display module according to claim 1, wherein: The display module further includes: A surface light source is located on a side of the array substrate away from the driver chip and covers the non-display area; the surface light source includes Micro-LED light-emitting units arranged in an array.

17. The display module according to claim 1, wherein: The display module further includes: A light-emitting unit layer, wherein the light-emitting unit layer and the driving chip are located on the same side of the array substrate; the light-emitting unit layer includes OLED light-emitting units, AMOLED light-emitting units or Micro-LED light-emitting units arranged in an array.

18. The display module according to claim 1, wherein: The driver chip includes a source driver chip or a gate driver chip.

19. A display device, characterized in that: Comprising the display module according to any one of claims 1 to 18.

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