Substrate thinning method

Abstract

The invention discloses a substrate thinning method, which comprises the following steps that a substrate to be thinned is placed on a transportation positioning disc, and the transportation positioning disc carries the substrate to move towards a thinning unit; in the moving process of the transportation positioning disc, the vision module detects the position of the substrate relative to the transportation positioning disc; according to the detection result of the visual module, the position of the substrate notch is adjusted, so that the connecting line of the substrate notch and the circle center of the substrate is perpendicular to the moving direction of the conveying positioning disc, and the substrate is adjusted to be concentric with the grabbing position of the carrying manipulator; the transportation positioning disc moves to a handover position, and the carrying manipulator clamps the substrate and adjusts the position of the notch of the substrate; the carrying mechanical arm clamping the substrate swings to a rotary table suction cup of the thinning unit from the connection position and then swings towards the edge of the rotary table suction cup, so that a notch of the substrate moves to the edge of a porous part of the rotary table suction cup; the carrying manipulator places the substrate on the rotary table suction cup, and the grinding wheel of the thinning unit grinds the surface of the substrate.

Description

[0001] This application is a divisional application of the invention patent application with application number 2022114075313 filed on November 10, 2022. Technical Field

[0002] The present invention belongs to the technical field of substrate thinning, and in particular relates to a substrate thinning method. Background Art

[0003] In the back-end process of integrated circuit (IC) manufacturing, in order to reduce the package mounting height, reduce the chip package volume, improve the chip's thermal diffusion efficiency, electrical performance, and mechanical properties, and reduce the chip processing workload, the substrate needs to be thinned before subsequent packaging. The chip thickness after thinning can even reach less than 5% of the initial thickness.

[0004] Substrate thinning technology is mainly used for thinning the back side of the substrate. The so-called back side refers to the side of the substrate where no devices are laid, generally a substrate of materials such as silicon, silicon oxide, silicon nitride, silicon carbide, etc.

[0005] When the substrate is thinned, the substrate to be thinned is vacuum-adsorbed on the surface of the suction cup made of porous material. Figure 1a and Figure 1b As shown, the porous portion of the chuck surface at this location is exposed to the processing environment, and grinding debris generated during thinning will accumulate in the area corresponding to the substrate notch. Furthermore, during the substrate thinning process, the vacuum system draws suction from the porous portion of the chuck to hold the substrate against the chuck surface. This can draw some grinding debris from the substrate notch into the porous portion and even into the connecting pipes within the chuck, affecting the chuck surface flatness and reducing the total thickness variation (TTV) of the substrate after grinding. Summary of the Invention

[0006] An embodiment of the present invention provides a substrate thinning method, which aims to solve at least one of the technical problems existing in the prior art.

[0007] A first aspect of an embodiment of the present invention provides a substrate thinning method, comprising:

[0008] S1, placing the substrate to be thinned on a transport positioning plate, and the transport positioning plate carries the substrate and moves toward the thinning unit;

[0009] S2, during the movement of the transport positioning plate, the vision module detects the position of the substrate relative to the transport positioning plate;

[0010] S3, according to the detection results of the visual module, adjust the position of the substrate notch so that the line connecting the substrate notch and the center of the substrate is perpendicular to the moving direction of the transport positioning plate, and adjust the substrate to be concentric with the gripping position of the transport robot;

[0011] S4, the transport positioning plate moves to the handover position, the transport robot clamps the substrate and adjusts the position of the substrate notch;

[0012] S5, the handling robot holding the substrate swings from the handover position to the turntable suction cup of the thinning unit, and then swings toward the edge of the turntable suction cup, so that the substrate notch moves to the edge of the porous portion of the turntable suction cup;

[0013] In step S6, the transport robot places the substrate on the turntable suction cup, and the grinding wheel of the thinning unit grinds the surface of the substrate.

[0014] In one embodiment, at least a portion of the substrate notch is located outside the porous portion of the turntable suction cup.

[0015] In one embodiment, the vision module is disposed on the moving path of the transport positioning plate, and calculates the position of the substrate relative to the transport positioning plate by scanning the substrate gap.

[0016] In step S3, the position of the substrate notch is pre-adjusted.

[0017] In step S4 , the transport robot has a rotating portion that can drive the fixed plate and the substrate thereon to rotate, so that the substrate notch is located on the swing path of the transport robot.

[0018] In one embodiment, the rotating portion drives the fixed disk to rotate counterclockwise or clockwise.

[0019] In one embodiment, the fixed plate is rotated to the following position: the substrate notch and the center of the fixed plate form a first connecting line, the rotation point of the transport robot and the center of the fixed plate form a second connecting line, and the angle between the first connecting line and the second connecting line is α;

[0020]

[0021] Where r is the radius of the substrate;

[0022] L is the distance between the rotation point of the handling robot and the center of the fixed plate.

[0023] In step S5, the transport robot swings toward the turntable suction cup so that the substrate on it is concentric with the turntable suction cup; then, the transport robot swings toward the edge of the turntable suction cup by an angle θ;

[0024]

[0025] Where s is the distance the substrate swings toward the edge of the turntable chuck;

[0026] L is the distance between the rotation point of the handling robot and the center of the fixed plate.

[0027] In some embodiments, when the fixed plate of the transport robot clamps the substrate and rotates to a swing path of the transport robot, the rotation directions of adjacent substrates are different.

[0028] In some embodiments, the substrate notch is located outside the porous portion of the turntable suction cup.

[0029] A second aspect of an embodiment of the present invention provides a substrate thinning control device, which includes a memory, a processor, and a computer program stored in the memory and runnable on the processor, and when the processor executes the computer program, the steps of the substrate thinning method described above are implemented.

[0030] A third aspect of an embodiment of the present invention provides a computer-readable storage medium storing a computer program. When the computer program is executed by a processor, the steps of the substrate thinning method described above are implemented.

[0031] The beneficial effects of the present invention include:

[0032] a. When thinning the substrate, the substrate notch is placed close to the edge of the turntable chuck to prevent grinding chips formed during the substrate thinning process from accumulating on the exposed porous portion and entering the interior of the turntable chuck through the porous portion, thereby controlling the total thickness deviation of the substrate after grinding;

[0033] b. When adjusting the position of the substrate notch to the swing path of the handling robot, the rotation directions of adjacent substrates are different to prevent the substrate notches corresponding to the thinning substrates from falling in the same area of ​​the turntable suction cup. This controls or reduces the accumulation of grinding chips, ensures the flatness of the turntable suction cup surface, and improves the processing quality of substrate thinning. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The advantages of the present invention will become clearer and easier to understand through the detailed description made in conjunction with the following drawings, which are only exemplary and do not limit the scope of protection of the present invention, wherein:

[0035] Figure 1a It is a schematic diagram of a substrate to be processed being placed on the surface of a suction cup in the prior art;

[0036] Figure 1b yes Figure 1a A partial enlarged view of point C in the middle;

[0037] Figure 2 is a schematic diagram of a substrate thinning apparatus provided by one embodiment of the present invention;

[0038] Figure 3 is a flow chart of a substrate thinning method provided by one embodiment of the present invention;

[0039] Figure 4 This is a schematic diagram of the substrate being placed in the initial position of the transport positioning plate;

[0040] Figure 5 This is a schematic diagram after the position of the substrate notch is adjusted;

[0041] Figure 6 This is a schematic diagram of the substrate and the handling robot's grasping position being concentric;

[0042] Figure 7 is a schematic diagram of a handling robot provided by an embodiment of the present invention;

[0043] Figure 8 This is a schematic diagram of the handling robot adjusting the circumferential position of the substrate notch;

[0044] Figure 9 This is a schematic diagram of the handling robot gripping the substrate and swinging it from the handover position to the turntable suction cup;

[0045] Figure 10 This is a schematic diagram of the handling robot driving the substrate to swing towards the edge of the turntable suction cup;

[0046] Figure 11 yes Figure 10 A partial enlarged view of point A in the middle;

[0047] Figure 12 This is a partial schematic diagram of the substrate on the surface of the turntable suction cup when the handling robot is not swinging;

[0048] Figure 13 This is a partial schematic diagram of the substrate on the surface of the turntable suction cup after the handling robot swings;

[0049] Figure 14 Schematic diagram of a control device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0050] The technical solutions of the present invention are described in detail below in conjunction with specific embodiments and the accompanying drawings. The embodiments described herein are specific embodiments of the present invention and are used to illustrate the concept of the present invention; these descriptions are explanatory and exemplary and should not be understood as limiting the embodiments of the present invention and the scope of protection of the present invention. In addition to the embodiments described herein, those skilled in the art can also adopt other obvious technical solutions based on the contents disclosed in the claims of this application and its specification, including technical solutions that adopt any obvious replacements and modifications to the embodiments described herein.

[0051] The drawings in this specification are schematic diagrams that assist in illustrating the concepts of the present invention and schematically illustrate the shapes of the various components and their interrelationships. It should be understood that in order to clearly illustrate the structures of the various components of the embodiments of the present invention, the drawings are not drawn to the same scale, and the same reference numerals are used to represent the same parts in the drawings.

[0052] In the present invention, substrate is also called wafer, which can be abbreviated as W, and its meaning and actual function are equivalent.

[0053] The present invention relates to a substrate thinning method, wherein the method comprises: Figure 2 The substrate thinning equipment shown implements substrate thinning processing. Figure 2 Briefly describe the composition and general working principle of substrate thinning equipment. Substrate thinning equipment includes:

[0054] The front-end unit 1 is used to move substrates in and out. The front-end unit 1 is located at the front end of the substrate thinning device. The front-end unit 1 is a transition module that moves substrates from the outside to the inside of the device, and is used to move substrates in and out.

[0055] The thinning unit 2 is used to thin (grind) the substrate, and the thinning unit 2 is arranged at the end of the substrate thinning equipment; the thinning unit 2 includes a turntable suction cup 2-1 to vacuum absorb the substrate to be processed; the thinning unit 2 also includes a transport robot 2-2 to transfer the substrate to be processed to the thinning unit 2.

[0056] a polishing unit 3 for performing chemical mechanical polishing on the substrate after the grinding is completed, using a carrier head capable of adjusting the loading pressure according to the thickness distribution of the substrate; the polishing unit 3 is arranged between the equipment front-end unit 1 and the thinning unit 2;

[0057] The cleaning unit 4 is arranged between the front end unit 1 and the polishing unit 3 of the equipment. The cleaning unit 4 includes a horizontal brushing device 4-1 and a single-chamber cleaning device 4-2. The horizontal brushing device 4-1 includes: a substrate fixing assembly for horizontally supporting and fixing the substrate; specifically, the substrate fixing assembly includes a fixing seat and a plurality of support rollers provided on the fixing seat, the plurality of support rollers working together to horizontally support the edge of the substrate and drive the substrate to rotate horizontally along the circumferential direction; a first horizontal cleaning brush that can rotate around its horizontal axis to horizontally brush the front of the substrate; a second horizontal cleaning brush that can rotate around its horizontal axis to horizontally brush the back of the substrate; a pressure detection assembly for detecting whether the pressure applied to the substrate by the first horizontal cleaning brush and the second horizontal cleaning brush is symmetrical; a cleaning brush movement assembly for adjusting the movement position and movement posture of the first horizontal cleaning brush and / or the second horizontal cleaning brush to make the pressure symmetrical when the pressure detection assembly detects that the pressure is asymmetric; and a cleaning tank for accommodating the substrate fixing assembly, the first horizontal cleaning brush, and the second horizontal cleaning brush, and immersing the substrate in the cleaning liquid.

[0058] The single-chamber cleaning device 4-2 includes a supporting portion for holding and rotating the substrate, a fluid supply portion for spraying fluid onto the substrate, a baffle portion for blocking splashing fluid, and a fluid collection chamber. The supporting portion, the fluid supply portion and the baffle portion are all arranged in a closed fluid collection chamber to prevent fluid leakage. The supporting portion keeps the substrate horizontal, and the supporting portion drives the substrate to rotate around its vertical center axis. The baffle portion is arranged around the supporting portion, and the baffle portion can be composed of an annular baffle assembly. The fluid supply portion is used to spray cleaning liquid or drying gas onto the surface of the substrate. Under different actual needs, water, acidic solution and / or alkaline solution, drying gas, etc. can be sprayed onto the substrate in sequence according to different operating sequences, and different baffles can be used to guide different liquids into different chambers.

[0059] A mobile transport unit 5 is provided for transporting substrates and is positioned parallel to the polishing unit 3 and between the front-end module 1 and the thinning unit 2. The mobile transport unit 5 includes a transport positioning plate 5-1 that can move along the length of the substrate thinning apparatus toward the thinning unit 2. A vision module 5-2 is provided along the moving path of the transport positioning plate 5-1 to detect the position of the substrate placed on the transport positioning plate 5-1.

[0060] The present invention discloses a substrate thinning method, wherein Figure 2 The substrate thinning device shown is used to perform a substrate thinning process to remove a material layer of the substrate. Figure 3 1 is a flow chart of a substrate thinning method provided by one embodiment of the present invention, which includes:

[0061] S1, placing the substrate to be thinned on the transport positioning plate 5-1, and the transport positioning plate 5-1 carries the substrate and moves toward the thinning unit 2;

[0062] Specifically, a linear module is configured at the lower portion of the transport positioning plate 5 - 1 to drive the transport positioning plate 5 - 1 to move along the length direction of the substrate thinning equipment.

[0063] S2, during the movement of the transport positioning plate 5-1, the vision module 5-2 detects the position of the substrate relative to the transport positioning plate 5-1;

[0064] Figure 2 In the figure, vision module 5-2 is positioned in the path of the transport positioning plate 5-1, facing the edge of the substrate. This means that vision module 5-2 can scan the substrate's notch Wn. The transport positioning plate 5-1 is equipped with a rotation module that rotates the substrate on it. By scanning the substrate notch Wn, vision module 5-2 calculates the substrate's position relative to the transport positioning plate 5-1.

[0065] S3, based on the detection results of the visual module 5-2, adjust the position of the substrate notch Wn so that the line connecting the substrate notch Wn and the center of the substrate is perpendicular to the moving direction of the transport positioning plate 5-1, and adjust the substrate and the gripping position of the transport robot 2-2 to be concentric;

[0066] In step S3 , first, the position of the substrate notch Wn is adjusted. Figure 4 Schematic diagram of the substrate W placed on the initial position of the transport positioning plate 5-1. Figure 4 In the embodiment, the center of the substrate does not overlap with the center of the transport positioning plate 5-1, and the substrate notch Wn is located in the fourth quadrant of the XY coordinate system. The position of the substrate notch Wn is adjusted by a rotating module (not shown) configured with the transport positioning plate 5-1. Figure 4 In the illustrated embodiment, the substrate W is rotated clockwise such that a line connecting the center of the substrate notch Wn and the center of the substrate is parallel to the Y coordinate axis. Figure 5 Schematic diagram of the substrate notch Wn after position adjustment, where the line connecting the center of the substrate notch Wn and the center of the substrate circle is parallel to the Y coordinate axis.

[0067] Next, the position of the substrate W is adjusted. Based on the center of the substrate W and the gripping position of the transport robot 2-2, the position of the substrate W is adjusted using an adjustment module (not shown) configured on the transport positioning plate 5-1. That is, the adjustment module can drive the substrate W to move along the X-axis and / or Y-axis to adjust the substrate W to Figure 6 Position shown. Figure 6 In the embodiment shown, the gripping position of the handling robot 2-2 is concentric with the transport positioning plate 5-1. It is understandable that the gripping position of the handling robot 2-2 may not be concentric with the transport positioning plate 5-1.

[0068] S4, the transport positioning plate 5-1 moves to the handover position, the transport robot 2-2 clamps the substrate and adjusts the position of the substrate notch Wn;

[0069] Figure 2 In the figure, the position of the transport positioning plate 5-1 indicated by the dotted line is the handover position. It should be noted that the handover position needs to be within the moving range of the transport robot 2-2. That is, the transport robot 2-2 can clamp the substrate at the handover position and transfer it to the next process.

[0070] Figure 7 Figure 2 is a schematic diagram of a transport robot 2-2 provided in one embodiment of the present invention. The transport robot 2-2 includes a pivoting portion 2-2a, a swing arm 2-2b, a rotating portion 2-2c, and a fixed plate 2-2d. The swing arm 2-2b is disposed below the pivoting portion 2-2a. The fixed plate 2-2d is disposed at its other end. The rotating portion 2-2c is disposed above the fixed plate 2-2d to rotate the fixed plate 2-2d and adjust the circumferential position of the substrate held by the fixed plate 2-2d.

[0071] In step S4, the rotating portion 2-2c of the transport robot 2-2 can drive the fixed plate 2-2d to rotate around its central axis, and the substrate W adsorbed on the fixed plate 2-2d also rotates with it to adjust the position of the substrate notch Wn.

[0072] Figure 8 This is a schematic diagram of the handling robot 2-2 provided in one embodiment of the present invention for adjusting the circumferential position of the substrate notch Wn. Driven by the rotating part 2-2c, the fixed plate 2-2d and the substrate W thereon rotate around the axis, so that the substrate notch Wn is located on the swing path of the handling robot 2-2, so as to further adjust the position of the substrate notch Wn based on the swing arm 2-2b.

[0073] Figure 8 In the embodiment, the pivoting portion 2-2a ( Figure 7 The pivot center of the robot 2-2 is O1, and the connection point between the swing arm 2-2b and the rotating part 2-2c is O2. The swing path of the transport robot 2-2 is a trajectory line passing through point O2 with O1 as the center and the length between O1 and O2 as the radius. Figure 8 The dotted circle in FIG. 1 is the swing path of the transport robot 2 - 2 .

[0074] The steps for adjusting the circumferential position of the substrate notch Wn are as follows: under the drive of the rotating part 2-2c, the fixed plate 2-2d rotates counterclockwise around the point O2 as the center; Figure 8 , the substrate notch Wn rotates counterclockwise to the straight line L1. At this time, the rotation angle of the fixed plate 2-2d is β.

[0075] It is understandable that the fixed disk 2-2d can also rotate clockwise, that is, the substrate gap Wn rotates clockwise to Figure 8 The straight line L2 is shown. At this time, the rotation angle of the fixed plate 2-2d is γ.

[0076] Figure 2 The control portion of the illustrated substrate thinning apparatus can set the rotation direction of the fixed plate 2 - 2 d so that the substrate notch Wn can be quickly rotated to the swing path of the transport robot 2 - 2 .

[0077] S5, the handling robot 2-2 holding the substrate swings from the handover position to the turntable suction cup 2-1 of the thinning unit 2, and then swings toward the edge of the turntable suction cup 2-1, so that the substrate notch Wn moves to the edge of the porous portion of the turntable suction cup 2-1;

[0078] Figure 9 This is a schematic diagram of the transfer robot 2-2 swinging the substrate W from the handover position to the turntable suction cup 2-1. The fixed plate 2-2d needs to swing above the turntable suction cup 2-1. At this time, the position of the substrate W is represented by the angle α. The substrate notch Wn and the center O2 of the fixed plate 2-2d form a first line, and the rotation point O1 of the transfer robot 2-2 and the center O2 of the fixed plate 2-2d form a second line. The angle between the first and second lines is α.

[0079]

[0080] Where r is the radius of the substrate W;

[0081] L is the distance between the rotation point O1 of the transport robot 2-2 and the center O2 of the fixed plate 2-2d.

[0082] When the substrate W swings to a position determined by the angle α, the substrate W adsorbed on the fixed plate 2 - 2 d is concentric with the turntable suction cup 2 - 1 in the thinning unit 2 .

[0083] In order to reduce exposure of the porous portion at the position corresponding to the substrate notch Wn, the swing arm 2 - 2 b of the transport robot 2 - 2 also needs to swing toward the edge of the turntable suction cup 2 - 1 by an angle θ.

[0084]

[0085] Wherein, s is the distance that the substrate swings toward the edge of the turntable suction cup 2-1;

[0086] L is the distance between the rotation point O1 of the transport robot 2-2 and the center of the fixed plate 2-2d.

[0087] Figure 10 This is a schematic diagram of the substrate W after being driven by the transport robot 2-2 to swing toward the edge of the turntable suction cup 2-1. Figure 11yes Figure 10 A partial enlarged view of point A in the middle.

[0088] Point O2 swings from the center of the turntable suction cup 2-1 toward the edge of the turntable suction cup 2-1 to point O2', as shown in FIG. Figure 11 As shown, the distance between points O2 and O2' is s. Points O2, O2', and O1 form an isosceles triangle. The angle θ of the isosceles triangle is L, and the base is s. The law of sine can be used to calculate the swing angle θ of the handling robot 2-2.

[0089] Figure 12 FIG2 is a partial schematic diagram of a substrate W on the surface of the turntable chuck 2-1 when the transport robot 2-2 is not swinging. At this time, the substrate W is concentrically arranged on the surface of the turntable chuck 2-1, and some porous portions are exposed at the substrate notch Wn. Figure 13 This is a partial schematic diagram of the substrate W on the surface of the turntable suction cup 2-1 after the transport robot 2-2 swings. At this time, the substrate notch Wn is close to the edge of the turntable suction cup 2-1. Figure 12 The exposed porous portion is covered by the substrate W to prevent grinding chips formed during the substrate thinning process from accumulating on the exposed porous portion and to prevent the grinding chips from entering the interior of the turntable suction cup 2 - 1 through the porous portion.

[0090] Figure 13 In the illustrated embodiment, the substrate notch Wn is located outside the porous portion of the turntable chuck 2 - 1 to prevent grinding chips from accumulating in the porous portion of the turntable chuck 2 - 1 .

[0091] S6, the transport robot 2-2 places the substrate on the turntable suction cup 2-1, and the grinding wheel of the thinning unit 2 grinds the surface of the substrate.

[0092] In the present invention, at least a portion of the substrate notch Wn is located outside the porous portion of the turntable chuck 2-1. If the handling robot 2-2 swings the clamped substrate toward the turntable chuck 2-1, causing the substrate notch Wn to completely lie outside the porous portion of the turntable chuck 2-1, a sacrificial area will form at the edge of the substrate. This sacrificial area refers to an area where thinning uniformity is poor.

[0093] Because the substrate notch Wn is approximately triangular in shape, the exposed porous area inside the notch Wn is relatively small. Therefore, a balance must be struck between the size of the sacrificial area at the substrate edge and the degree of grinding debris accumulation within the notch Wn. Preferably, the distance s that the substrate swings toward the edge of the turntable chuck 2-1 should be greater than or equal to two-thirds of the radial length of the substrate notch Wn.

[0094] In the present invention, since the orientation of the substrate notches Wn is uniform in step S4 and the radial lengths of Wn for substrates from the same batch are substantially the same, the substrate notches Wn corresponding to the thinned substrates fall within the same region of the turntable chuck 2-1. This can cause grinding debris to accumulate to a certain extent, especially when the substrate notches Wn have not fully swung to the outside of the porous portion of the turntable chuck 2-1, resulting in varying degrees of accumulation of grinding debris.

[0095] In order to solve the above problem, when the fixed plate 2 - 2 d of the transport robot 2 - 2 holds the substrate and rotates to the swing path of the transport robot 2 - 2 , the rotation directions of adjacent substrates are different.

[0096] Specifically, when the substrate held by the transport robot 2-2 rotates to the swing path of the transport robot 2-2, if the rotation direction of the fixed plate 2-2d is counterclockwise, such as Figure 8 It is shown that the rotation angle of the fixing plate 2 - 2 d is a first rotation angle β.

[0097] When the transport robot 2-2 processes the next substrate, the fixed plate 2-2d drives the substrate thereon to rotate clockwise, so that the substrate rotates to the swing path of the transport robot 2-2; the rotation angle of the fixed plate 2-2d is the second rotation angle γ, as shown Figure 8 That is, by changing the rotation direction of the adjacent substrates when adjusting the position of the substrate notches Wn, the substrate notches Wn corresponding to the thinned substrates are prevented from falling in the same area of ​​the turntable chuck 2-1, thereby controlling or reducing the accumulation of grinding chips and ensuring the flatness of the surface of the turntable chuck 2-1.

[0098] Figure 14 is a schematic diagram of a control device provided in one embodiment of the present invention. In this embodiment, the control device includes: a processor, a memory, and a computer program stored in the memory and executable by the processor. When the processor executes the computer program, the steps of the substrate thinning method described above are implemented. Alternatively, when the processor executes the computer program, the functions of the modules / units described in the various embodiments of the system described above are implemented.

[0099] Control devices refer to terminals with data processing capabilities, including but not limited to computers, workstations, servers, and even some high-performance smartphones, PDAs, tablets, personal digital assistants (PDAs), smart TVs, etc.

[0100] The control device may include, but is not limited to, a processor and a memory. It will be understood by those skilled in the art that Figure 14These are merely examples of control devices and do not constitute limitations on the control device. The control device may include more or fewer components than shown in the figure, or a combination of certain components, or different components. For example, the control device may also include input and output devices, network access devices, buses, etc.

[0101] The processor may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc.

[0102] Memory can be an internal storage unit of a control device, such as a hard drive or memory. It can also be an external storage device, such as a plug-in hard drive, a SmartMedia Card (SMC), a Secure Digital (SD) card, or a flash memory card. Furthermore, memory can include both internal and external storage devices. Memory is used to store computer programs and other programs and data required by the control device. Memory can also be used to temporarily store data that has been output or is about to be output.

[0103] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative uses of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0104] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the claims and their equivalents.

Claims

1. A substrate thinning device, characterized in that: include: Equipment front-end unit; A thinning unit, which includes a turntable suction cup for vacuum adsorbing the substrate to be processed; The polishing unit is arranged between the front end unit and the thinning unit of the equipment; A cleaning unit is provided between the front end unit and the polishing unit of the equipment; A mobile transmission unit is arranged parallel to the polishing unit and located between the front end unit and the thinning unit of the equipment; The thinning unit further includes a handling robot, which includes a swing arm, one end of which is disposed at the lower portion of the pivot portion, and the other end of which is disposed at a fixed plate; a rotating portion is disposed at the upper portion of the fixed plate, and the rotating portion drives the fixed plate to rotate about its central axis so that the substrate notch is located on a swing path of the handling robot; the swing path is a trajectory line along which the center of the fixed plate passes through, with the rotation point of the handling robot as the center and the radius L as the rotation radius; The transport robot swings toward the turntable suction cup so that the substrate on it is concentric with the turntable suction cup; then, the transport robot swings toward the edge of the turntable suction cup by an angle θ so that the substrate notch moves to the outside of the porous portion of the turntable suction cup; s is the distance the substrate swings toward the edge of the turntable suction cup; L is the distance between the rotation point of the handling robot and the center of the fixed plate; The rotating part drives the fixed disk to rotate counterclockwise or clockwise. When the fixed disk clamps the substrate and rotates to the swing path of the transport robot, the rotation directions of adjacent substrates are different.

2. The substrate thinning device according to claim 1, wherein: The transport positioning plate moves along the length direction of the substrate thinning device toward the thinning unit, and a visual module is provided on its moving path for detecting the position of the substrate carried by the transport positioning plate.

3. The substrate thinning device according to claim 2, wherein: The vision module is arranged toward the edge of the substrate and calculates the position of the substrate relative to the transport positioning plate by scanning the substrate gap.

4. The substrate thinning device according to claim 2, wherein: A linear module is disposed at the lower portion of the transport positioning plate to drive the transport positioning plate to move along the length direction of the substrate thinning device.

5. The substrate thinning device according to claim 2, wherein: The transport positioning plate is equipped with a rotating module to drive the substrate thereon to rotate.

6. The substrate thinning device according to claim 2, wherein: According to the detection results of the visual module, the position of the substrate gap is adjusted so that the line connecting the substrate gap and the center of the substrate is perpendicular to the moving direction of the transport positioning plate, and the substrate is adjusted to be concentric with the grasping position of the transport robot.

7. The substrate thinning device according to claim 1, wherein: When the substrate and the turntable suction cup are concentric, the fixed plate rotates to the following position: the substrate notch and the center of the fixed plate form a first connecting line, the rotation point of the transport robot and the center of the fixed plate form a second connecting line, and the angle between the first connecting line and the second connecting line is α; Where r is the radius of the substrate.

8. The substrate thinning device according to claim 1, wherein: The invention also includes a control unit to set the rotation direction of the fixed plate so that the substrate gap rotates to the swing path of the transport robot.

9. The substrate thinning device according to claim 1, wherein: The substrate clamped by the transport robot swings from the handover position to the turntable suction cup of the thinning unit, and then swings toward the edge of the turntable suction cup, so that the substrate notch moves to the outside of the porous part of the turntable suction cup; the handover position is within the moving range of the transport robot to clamp the substrate and transfer it to the next process.

10. The substrate thinning device according to claim 1, wherein: The distance s that the substrate swings toward the edge of the turntable suction cup is greater than or equal to 2 / 3 of the radial length of the substrate notch.

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