Die bonder

Abstract

The invention discloses a die bonder, and relates to the technical field of die bonding. Wherein the die bonder comprises a machine table, a magnetic current device, a deviation rectifying device and a camera device, the magnetic current device is movably installed on the machine table, a circuit board is placed on the magnetic current device, the magnetic current device is provided with a magnetic current cavity, the circuit board is limited in the magnetic current cavity, and the circuit board is provided with a plurality of die bonding positions where wafers are to be placed; and the deviation rectifying device is arranged below the magnetic current device, is provided with a magnetic needle plate, and rectifies the position of the magnetic needle plate to a position where the magnetic element corresponds to the plurality of crystal fixing positions on the circuit board. When the plurality of magnetic elements on the magnetic needle plate correspond to the plurality of wafer fixing positions and the magnetic needle plate is located below the circuit board, liquid containing wafers flows in the magnetic flow cavity, and the plurality of wafers flow to the corresponding wafer fixing positions and are positioned at the wafer fixing positions, so that the plurality of wafers can be accurately transferred to the wafer fixing positions of the circuit board at one time, and the production efficiency is improved. And the die bonding efficiency is greatly improved.

Description

Technical Field

[0001] The present invention relates to the technical field of crystal bonding, and in particular to a crystal bonding machine. Background Art

[0002] A die bonder is a mechanical device that attaches the die to the circuit board.

[0003] Existing die bonders typically use a suction nozzle or robotic arm to transfer individual wafers from the supply station to the die bonding station, thereby bonding the wafer to the circuit board. However, this single-wafer transfer method results in low die bonding efficiency, impacting subsequent curing operations. Summary of the Invention

[0004] The main purpose of the present invention is to provide a die bonding machine, aiming to solve the problem of low die bonding efficiency of existing die bonding machines.

[0005] To achieve the above-mentioned purpose, the die bonding machine proposed in the present invention comprises: Machine; A magnetic flow device, the magnetic flow device is movably mounted on the machine platform, a circuit board is placed on the magnetic flow device, the magnetic flow device is provided with a magnetic flow cavity, the circuit board is limited in the magnetic flow cavity, and the circuit board has a plurality of die-bonding positions for placing wafers; a deflection correction device, the deflection correction device being provided on the machine platform and moving below the magnetic flow device, the deflection correction device being provided with a magnetic needle plate provided with a plurality of magnetic elements; and A camera device, the camera device being movably mounted on the machine platform and configured to photograph the plurality of die-bonding positions and the magnetic needle plate; When the multiple magnetic elements of the magnetic needle plate correspond to the multiple crystal fixing positions and the magnetic needle plate is located under the circuit board, liquid containing chips flows in the magnetic fluid cavity, and the multiple chips flow to the corresponding crystal fixing positions and are positioned at the crystal fixing positions.

[0006] In some embodiments, the magnetic flow device has a flow trough body, a recovery trough body and the magnetic flow cavity body, the flow trough body and the recovery trough body are arranged on both sides of the magnetic flow cavity opposite to each other, and the flow trough body and the recovery trough body are both connected to the magnetic flow cavity; the magnetic flow cavity is provided with an opening corresponding to the position of the circuit board, and the circuit board is exposed in the opening.

[0007] In some embodiments, the magnetic flow cavity has a guide slope; a boss is protruding from the inner bottom wall of the magnetic flow cavity facing the side of the flow trough body, the flow trough body is arranged on the boss, and the guide slope is arranged between the boss and the magnetic flow cavity, and the guide slope is inclined from the boss toward the inner bottom wall of the magnetic flow cavity, and the circuit board is limited to the inner bottom wall of the magnetic flow cavity; or, the inner bottom wall of the magnetic flow cavity forms the guide slope, and the guide slope is set as a slope structure extending obliquely from the flow trough body to the recovery trough body, and the circuit board is limited to the guide slope.

[0008] In some embodiments, a drain port is provided on a side of the magnetic flow cavity away from the boss, and the drain port is connected to the recovery tank body; the recovery tank body is extended along the bottom of the magnetic flow cavity, and the recovery tank body avoids the correction device; and / or, a plurality of flow ports are provided on the side of the flow tank body facing the circuit board.

[0009] In some embodiments, the machine has a guide rail extending along the length direction of the machine, and the magnetic flow device is installed with a first moving mechanism, which is connected to the magnetic flow cavity and is movably installed on the guide rail to move on the guide rail.

[0010] In some embodiments, the flow trough body and the recovery trough body can be detachably mounted on the magnetic flow cavity; A first mounting protrusion is provided on the edge of the bottom of the flow trough body, and the first mounting protrusion is detachably connected to the inner bottom wall of the magnetic flow cavity; and / or a second mounting protrusion is provided on the edge of the top of the recovery trough body, and the second mounting protrusion is detachably connected to the inner bottom wall of the magnetic flow cavity.

[0011] In some embodiments, the deviation correction device includes a first driving device, the output end of which is connected to the magnetic needle plate to drive the magnetic needle plate to rotate; The correction device also includes a second drive device and a third drive device. The second drive device is used to drive the magnetic needle plate and the first drive device to lift toward the circuit board, and the third drive device is used to drive the magnetic needle plate, the first drive device and the second drive device to move along the length direction of the machine to the bottom of the magnetic flow device.

[0012] In some embodiments, the machine is provided with grating sensors corresponding to the deflection correction device. The grating sensors are located on both sides of the deflection correction device and are used to detect the value of the movement of the deflection correction device along the length direction of the machine.

[0013] In some embodiments, the correction device further includes a photoelectric sensor, which is located below the magnetic needle plate and is used to sense the rotation angle of the magnetic needle plate during reset rotation.

[0014] In some embodiments, the camera device includes a camera, a Z-axis assembly for driving the camera to rise and fall, a Y-axis assembly for driving the camera to move along the length direction of the machine, and an X-axis assembly for driving the camera to move along the width direction of the machine; the camera is installed on the movable body of the Z-axis assembly, the fixed body of the Z-axis assembly is installed on the movable body of the X-axis assembly, and the fixed body of the X-axis assembly is installed on the movable body of the Y-axis assembly; support frames are installed on opposite sides of the machine, and the fixed body of the Y-axis assembly is installed on the support frames, so that the camera is located above the magnetic flow device.

[0015] The technical solution of the present invention is to add a magnetic flow device, which is movably mounted on the machine table. A circuit board is placed on the magnetic flow device, and the magnetic flow device is provided with a magnetic flow cavity. The circuit board is limited in the magnetic flow cavity, and the circuit board has multiple crystal fixing positions for placing chips. Then, a correction device is arranged below the magnetic flow device, and the correction device is equipped with a magnetic needle plate so that the correction device corrects the position of the magnetic needle plate to correspond to the magnetic elements and the multiple crystal fixing positions on the circuit board. When the multiple magnetic elements on the magnetic needle plate correspond to the multiple crystal fixing positions, and the magnetic needle plate is located below the circuit board, liquid containing chips flows in the magnetic flow cavity, and the multiple chips flow to the corresponding crystal fixing positions and are positioned at the crystal fixing positions, thereby achieving a one-time and precise transfer of multiple chips to the crystal fixing positions of the circuit board, thereby greatly improving the crystal fixing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0017] Figure 1 A schematic structural diagram of an embodiment of a die bonding machine provided by the present invention; Figure 2 A schematic structural diagram of an embodiment of a die bonding machine provided by the present invention from another perspective; Figure 3 for Figure 2 A partial enlarged view of point A in the middle; Figure 4 A schematic structural diagram of an embodiment of a magnetic flow device in a die bonding machine provided by the present invention; Figure 5 A schematic diagram of the exploded structure of an embodiment of a magnetic flow device in a die bonder provided by the present invention; Figure 6 A schematic structural diagram of an embodiment of a deviation correction device in a die bonding machine provided by the present invention; Figure 7 A partially exploded structural diagram of an embodiment of a deviation correction device in a die bonder provided by the present invention; Figure 8 This is a structural schematic diagram of an embodiment of a crystal bonding machine provided by the present invention being installed on a frame.

[0018] Description of Figure Numbers: 100. Die bonder; 10. Frame; 11. Machine platform; 12. Guide rail; 20. Magnetic flow device; 21. Flow channel; 210. Flow port; 211. First mounting protrusion; 22. Magnetic flow chamber; 221. Boss; 222. Opening; 223. Drain port; 224. Receiving tank; 23. Recovery channel; 230. Second mounting protrusion; 231. Recovery port; 24. Guide ramp; 30. First moving mechanism; 40. Circuit board; 41. Die-bonding position; 50. Correction device; 51. First drive device; 52. Second drive device; 520. Lifting module; 53. Third drive device; 54. Magnetic needle plate; 540. Magnetic element; 55. Fixing fixture; 550. Fixing slot; 60. Photoelectric sensor; 61. Grating sensor; 70. Camera device; 71. X-axis assembly; 72. Y-axis assembly; 73. Z-axis assembly; 74. Camera; 75. Support frame.

[0019] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments. DETAILED DESCRIPTION

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0021] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0022] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of such features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0023] A die bonder is a mechanical device that secures wafers to circuit boards. Existing die bonders typically use a suction nozzle or robotic arm to transfer individual wafers from a supply station to a bonding station, thereby bonding the wafer to the circuit board. However, this single-wafer transfer method results in low die bonding efficiency, impacting subsequent curing operations.

[0024] The present invention provides a die bonder 100. Figure 1 and Figure 4 In one embodiment of the present invention, the die bonding machine 100 proposed in the present invention includes a machine platform 11, a magnetic flow device 20, a correction device 50 and a camera device 70. The magnetic flow device 20 is movably installed on the machine platform 11. A circuit board 40 is placed on the magnetic flow device 20. The magnetic flow device 20 is provided with a magnetic flow cavity 22. The circuit board 40 is limited to the magnetic flow cavity 22. The circuit board 40 has a plurality of die bonding positions 41 for placing chips.

[0025] See also Figure 1 and Figure 6 The correcting device 50 is provided on the machine platform 11 and moves below the magnetic flow device 20 . The correcting device 50 is provided with a magnetic needle plate 54 , and the magnetic needle plate 54 is provided with a plurality of magnetic elements 540 .

[0026] The camera device 70 is movably mounted on the machine platform 11 , and is used to photograph the plurality of die-bonding positions 41 and the magnetic needle plate 54 .

[0027] When the multiple magnetic elements 540 of the magnetic needle plate 54 correspond to the multiple crystal fixing positions 41, and the magnetic needle plate 54 is located under the circuit board 40, liquid containing chips flows in the magnetic fluid cavity 22, and the multiple chips flow to the corresponding crystal fixing positions 41 and are positioned at the crystal fixing positions 41.

[0028] The correction device 50 moves below the magnetic flow device 20 , and the camera device 70 moves above the magnetic flow device 20 , which effectively utilizes the longitudinal space of the die bonding machine 100 and reduces the volume of the die bonding machine 100 .

[0029] Optionally, the magnetic element 540 mounted on the magnetic needle plate 54 may be a magnetic needle structure or magnetic beads. The substrate of the circuit board 40 is a non-magnetic insulating material that does not shield or distort the magnetic field of the magnetic needle plate 54. The die-bonding portion 41 of the circuit board 40 is provided with a copper sheet. The copper sheet is a non-magnetic metal and serves only as a physical carrier for subsequent electrical connections and does not participate in the generation of the magnetic field.

[0030] The liquid containing the wafers can be a low-viscosity carrier liquid containing the wafers. Specifically, the low-viscosity carrier liquid can be deionized water or a fluorinated oil containing the wafers. The wafers within the magnetic fluid chamber 22 are suspended in the low-viscosity carrier liquid, which reduces frictional resistance on the wafers and prevents mechanical contact damage, such as scratches and stress cracks.

[0031] Furthermore, the wafer may be a magnetic wafer. Specifically, a magnetic film may be attached to the wafer surface or a magnetic alloy layer may be coated on the wafer surface to form a magnetic wafer.

[0032] The deflection correction device 50 is positioned below the magnetic flow device 20 and is equipped with a magnetic needle plate 54. Multiple magnetic elements 540 are mounted on the magnetic needle plate 54. These magnetic elements 540 correspond to the die-bonding positions 41. By utilizing the stable magnetic field surrounding the magnetic elements 540, the magnetic wafer is moved toward the area with the strongest or weakest magnetic field, and then to the die-bonding position 41 on the circuit board 40. This allows for precise pre-alignment and facilitates the subsequent curing process.

[0033] Specifically, a liquid containing magnetic chips is poured into the magnetic flow chamber 22 so that the liquid carries the chips and flows within the magnetic flow chamber 22. Then, the correction device 50 moves the multiple magnetic elements 540 of the magnetic needle plate 54 to below the circuit board 40 within the magnetic flow chamber 22. The magnetic fields of the multiple magnetic elements 540 exert a directional force on the magnetic chips within the magnetic flow chamber 22.

[0034] Since the magnetic field at the plurality of magnetic elements 540 forms a local maximum point above the copper sheet, the local maximum point corresponds to the die bonding position 41, and the magnetic wafer is attracted toward the local maximum point, causing the magnetic wafer to move toward the local maximum point.

[0035] When the magnetic chip approaches the local strongest point, the magnetic field force and the viscous resistance of the liquid reach a dynamic balance, the magnetic chip stops moving, and the magnetic chip is positioned at the local strongest point, thereby achieving precise alignment of the magnetic chip to the crystal fixing position 41.

[0036] After the magnetic wafer reaches the wafer fixing position 41 , the surface tension or capillary force of the liquid will further enhance the stability of the alignment.

[0037] If the liquid is a partially wetting liquid, such as a mixture of deionized water and a surfactant, the liquid film between the magnetic chip and the circuit board 40 will generate capillary attraction, pulling the magnetic chip toward the circuit board 40, thereby fixing the magnetic chip, and then subsequently welding the magnetic chip to the circuit board 40.

[0038] The technical solution of the present invention is achieved by adding a magnetic flow device 20, which is movably installed on the machine 11. A circuit board 40 is placed on the magnetic flow device 20, and the magnetic flow device 20 is provided with a magnetic flow cavity 22. The circuit board 40 is limited to the magnetic flow cavity 22, and the circuit board 40 has multiple crystal fixing positions 41 for placing chips; then the correction device 50 is arranged below the magnetic flow device 20, and the correction device 50 is installed with the magnetic needle plate 54, so that the correction device 50 corrects the position of the magnetic needle plate 54 to correspond to the magnetic element 540 and the multiple crystal fixing positions 41 on the circuit board 40. When the multiple magnetic elements 540 on the magnetic needle plate 54 correspond to the multiple crystal fixing positions 41, and the magnetic needle plate 54 is located below the circuit board 40, liquid containing chips flows in the magnetic fluid cavity 22, and multiple chips flow to the corresponding crystal fixing positions 41 and are positioned at the crystal fixing positions 41, thereby achieving the one-time and precise transfer of multiple chips to the crystal fixing positions 41 of the circuit board 40, thereby greatly improving the crystal fixing efficiency.

[0039] In one embodiment, see Figure 4 and Figure 5 The magnetic flow device 20 has a flow trough body 21, a recovery trough body 23 and the magnetic flow cavity 22. The flow trough body 21 and the recovery trough body 23 are arranged on both sides of the magnetic flow cavity 22 opposite to each other. The flow trough body 21 and the recovery trough body 23 are both connected to the magnetic flow cavity 22; the magnetic flow cavity 22 is provided with an opening 222 corresponding to the position of the circuit board 40, and the circuit board 40 is exposed in the opening 222, which facilitates the camera device 70 to capture the position of the crystal fixing position 41 on the circuit board 40.

[0040] The top of the magnetic fluid chamber 22 may be a plate-like structure with only an opening 222 to reduce liquid splashing. Alternatively, the top of the magnetic fluid chamber 22 may be designed as a fully open opening 222 to facilitate the camera device 70 to photograph the circuit board 40 within the magnetic fluid chamber 22.

[0041] After the camera device 70 captures and records the die-bonding position 41 on the circuit board 40, it moves above the deflection correction device 50 to capture and record the positions of the multiple magnetic elements 540 on the magnetic needle plate 54. The camera device 70 or a controller can then calculate the captured positions of the die-bonding position 41 and the positions of the multiple magnetic elements 540. This allows the deflection correction device 50 to subsequently move the magnetic needle plate 54 below the circuit board 40 and rotate the magnetic needle plate 54 so that the positions of the multiple magnetic elements 540 on the magnetic needle plate 54 correspond to the positions of the die-bonding position 41 on the circuit board 40. The deflection correction device 50 can then lift the magnetic needle plate 54 to bring the multiple magnetic elements 540 closer to the circuit board 40, generating a magnetic field. The method by which the camera device 70 or the controller calculates the captured positions of the die-bonding position 41 and the positions of the multiple magnetic elements 540 can employ conventional methods, such as image recognition, which will not be further described here.

[0042] Furthermore, the liquid containing the multiple wafers in the flow tank 21 begins to flow into the magnetic fluid chamber 22. As the wafers flow through the circuit board 40, they are positioned one by one on the multiple wafer bonding sites 41 on the circuit board 40, thereby achieving the purpose of batch transfer of multiple wafers and protecting the wafers from wear. The liquid, which does not contain the wafers, then flows into the recovery tank 23 and is recovered for recycling.

[0043] Among them, see Figure 4 and Figure 5 To allow liquid to flow from the flow trough 21 to the magnetic flow chamber 22 and the recovery trough 23, the magnetic flow chamber 22 has a guide slope 24. A boss 221 is protruding from the inner bottom wall of the magnetic flow chamber 22 on the side facing the flow trough 21. The flow trough 21 is located on the boss 221. The guide slope 24 is located between the boss 221 and the magnetic flow chamber 22. The guide slope 24 is inclined from the boss 221 toward the inner bottom wall of the magnetic flow chamber 22. The circuit board 40 is located on the inner bottom wall of the magnetic flow chamber 22. There is a height difference between the bottom of the flow trough 21 and the inner bottom wall of the magnetic flow chamber 22, so that the liquid flowing out of the flow trough 21 can flow smoothly into the magnetic flow chamber 22 through the guide slope 24.

[0044] In one embodiment, the inner bottom wall of the magnetic fluid cavity 22 is provided with a receiving groove 224 , and the circuit board 40 is confined in the receiving groove 224 to prevent the circuit board 40 from shifting when liquid is in the magnetic fluid cavity 22 .

[0045] The angle between the inclined surface of the guide slope 24 and the vertical line can be limited to between 0 and 80 degrees. Specifically, the angle between the inclined surface of the guide slope 24 and the vertical line can be 60 degrees, so that the liquid containing the wafer flowing out of the flow channel 21 can flow into the magnetic flow cavity 22 more quickly, and then flow to the circuit board 40. The wafer is positioned at the crystal fixing position 41, and the liquid continues to flow forward by inertia in the magnetic flow cavity 22 until it flows into the recovery channel 23.

[0046] In another embodiment, the inner bottom wall of the magnetic flow cavity 22 forms the guide slope 24, and the guide slope 24 is configured as a slope structure extending obliquely from the flow trough 21 to the recovery trough 23, so that the liquid flows from the high flow trough 21 through the guide slope 24 to the recovery trough 23.

[0047] The circuit board 40 is limited to the guide slope 24 , and the wafer suspended on the liquid can be positioned at the wafer bonding position 41 of the circuit board 40 when it flows to the circuit board 40 .

[0048] The angle between the inclined surface of the guide slope 24 and the horizontal line can be limited to between 0 degrees and 80 degrees. Specifically, the angle between the inclined surface of the guide slope 24 and the horizontal line can be 10 degrees, so that the liquid flowing out of the flow channel 21 can flow into the magnetic flow cavity 22 more quickly, and the liquid can flow smoothly into the recovery channel 23 in the magnetic flow cavity 22.

[0049] In some embodiments, see Figure 4 and Figure 5 , a drain port 223 is provided on the side of the magnetic flow cavity 22 away from the boss 221, and the drain port 223 is connected to the recovery tank body 23; the recovery tank body 23 is extended along the bottom of the magnetic flow cavity 22, and the recovery tank body 23 avoids the correction device 50; and / or, a plurality of flow ports 210 are provided on the side of the flow tank body 21 facing the circuit board 40.

[0050] In one embodiment, see Figure 4 and Figure 5 A drain port 223 is provided on the side of the inner bottom wall of the magnetic fluid cavity 22 away from the boss 221, and the recovery tank body 23 is connected to the drain port 223, and is extended below the magnetic fluid cavity 22, so that the liquid in the magnetic fluid cavity 22 can flow out from the drain port 223 and flow into the recovery tank body 23 under the influence of gravity.

[0051] The side of the flow channel 21 is provided with a plurality of flow openings 210. A blocking plate can be inserted into the inner side of the flow channel 21 to act as a gate. The blocking plate can be pulled out or inserted to open or close the plurality of flow openings 210 at the same time.

[0052] In one embodiment, see Figure 1 and Figure 2 After the chip is positioned at the crystal fixing position 41, the magnetic flow device 20 needs to be moved to the curing station for curing. To this end, the machine 11 has a guide rail 12 extending along the length direction of the machine 11. The magnetic flow device 20 is installed with a first moving mechanism 30. The first moving mechanism 30 is connected to the magnetic flow cavity 22. The first moving mechanism 30 is movably installed on the guide rail 12 to move on the guide rail 12, so that the magnetic flow device 20 can be moved to the curing station through the first moving mechanism 30.

[0053] The camera device 70 can be installed on the guide rail 12 and located on one side of the magnetic flow device 20 so as to photograph the circuit board 40 in the magnetic flow device 20 .

[0054] In one embodiment, the platform 11 has two guide rails 12, and the first movable mechanism 30 is a movable base or plate that spans the two guide rails 12. A movable space is defined between the two guide rails 12, and the deflection correction device 50 moves within the movable space. The deflection correction device 50 is located below the first movable mechanism 30, preventing interference with the camera device 70. Furthermore, the deflection correction device 50 can be removed from the first movable mechanism 30, facilitating the camera device 70 to capture the magnetic needle plate 54.

[0055] Correspondingly, sliders may be provided on both sides of the first moving mechanism 30 , so that the first moving mechanism 30 is slidably connected to the guide rail 12 via the two sliders, thereby allowing the magnetic flow device 20 to slide on the guide rail 12 .

[0056] In some embodiments, see Figure 4 and Figure 5 , the flow trough body 21 and the recovery trough body 23 can be detachably installed on the magnetic flow cavity 22; the edge of the bottom of the flow trough body 21 is provided with a first mounting protrusion 211, and the first mounting protrusion 211 is detachably connected to the inner bottom wall of the magnetic flow cavity 22; and / or, the edge of the top of the recovery trough body 23 is provided with a second mounting protrusion 230, and the second mounting protrusion 230 is detachably connected to the inner bottom wall of the magnetic flow cavity 22.

[0057] In one embodiment, the recovery tank 23 can be designed as a semi-enclosed box-like structure. A recovery port 231 is provided at the top of the recovery tank 23, communicating with the magnetic flow chamber 22. Liquid within the magnetic flow chamber 22 can enter the recovery tank 23 through the recovery port 231. To facilitate assembly and disassembly, a second mounting protrusion 230 is protruding from the outer periphery of the top of the recovery tank 23. The second mounting protrusion 230 is detachably connected to the outer bottom wall of the magnetic flow device 20. The second mounting protrusion 230 can be connected to the magnetic flow device 20 by gluing, snapping, or screwing.

[0058] The flow channel body 21 can be designed as a semi-enclosed box structure. The flow channel body 21 is provided with a plurality of flow ports 210 on the side facing the magnetic flow cavity 22. The top of the flow channel body 21 can be provided with a liquid inlet to facilitate pouring the liquid containing the wafer from the liquid inlet. In order to facilitate disassembly and assembly, a first mounting protrusion 211 is provided on the outer periphery of the bottom of the flow channel body 21. The first mounting protrusion 211 is detachably connected to the inner bottom wall of the magnetic flow device 20. The second mounting protrusion 230 can be connected to the magnetic flow device 20 by gluing, snapping or screwing.

[0059] See also Figure 6 and Figure 7 In order to adjust the magnetic needle plate 54 in multiple directions and angles so that the multiple magnetic elements 540 on the adjusted magnetic needle plate 54 are accurately aligned with the die-bonding position 41 on the circuit board 40, the correcting device 50 includes a first driving device 51, the output end of the first driving device 51 is connected to the magnetic needle plate 54 to drive the magnetic needle plate 54 to rotate; the correcting device 50 also includes a second driving device 52 and a third driving device 53, the second driving device 52 is used to drive the magnetic needle plate 54 and the first driving device 51 to lift in the direction close to the circuit board 40, and the third driving device 53 is used to drive the magnetic needle plate 54, the first driving device 51 and the second driving device 52 to move along the length direction of the machine 11 to the bottom of the magnetic flow device 20.

[0060] The longitudinal direction of the machine 11 is defined as the Y-axis direction, and the lifting direction toward the circuit board 40 is defined as the Z-axis direction. The correction device 50 can adjust the magnetic needle plate 54 in the Y-axis direction and the Z-axis direction, and can also rotate the angle of the magnetic needle plate 54.

[0061] Specifically, the correction device 50 further includes a lifting module 520, to which the output end of the second drive device 52 is connected. The lifting module 520 may include a lifting shell and a linkage mechanism, which is installed within the lifting shell. The output end of the second drive device 52 is connected to the linkage mechanism, which is used to convert the rotational force of the second drive device 52 into a lifting force. The first drive device 51 is installed at the top of the lifting shell.

[0062] The linkage mechanism can be a gear set and a rack structure. The gear set is connected to the output end of the second driving device 52 and meshed with the rack structure. The end of the rack structure away from the gear set is connected to the inner top wall of the jacking shell.

[0063] The correction device 50 may further include a Y-axis sliding module, to which the output end of the third drive device 53 is connected. The Y-axis sliding module may include a slide rail and a slide seat. The slide rail is mounted on the machine platform 11. The slide seat is connected to the output shaft of the third drive device 53 and is slidably mounted on the slide rail to slide along the length of the machine platform 11 relative to the slide rail. The lifting housing is mounted on the slide seat, so that the slide seat carries the second drive device 52, the first drive device 51, and the magnetic needle plate 54 and slides on the slide rail.

[0064] Furthermore, the correction device 50 also includes a fixing jig 55, and the fixing jig 55 is provided with a fixing groove 550, and the magnetic needle plate 54 can be installed in the fixing groove 550 of the mounting jig. The output end of the first driving device 51 is connected to the bottom of the fixing jig 55. A transmission mechanism can be installed between the first driving device 51 and the magnetic needle plate 54, and the transmission mechanism can include a driving wheel connected to the first driving device 51 and a driven wheel vertically meshed with the driving wheel, and the shaft of the driven wheel is connected to the magnetic needle plate 54. The first driving device 51 drives the driving wheel to rotate, so as to drive the driven wheel to rotate, and the driven wheel can drive the magnetic needle plate 54 to rotate synchronously.

[0065] The correction device 50 can drive the magnetic needle plate 54 to move along the length direction of the machine platform 11, lift the magnetic needle plate 54 up and down, and drive the magnetic needle plate 54 to rotate, so that the magnetic needle plate 54 can be adjusted in multiple directions and angles.

[0066] The outer bottom wall of the magnetic flow chamber 22 is provided with a recessed groove that is recessed toward the circuit board, with a partition between the recess and the circuit board. Because the magnetic flow chamber 22 has the recessed groove, the second drive device 52 can lift the magnetic needle plate 54 into the recess, thereby reducing the distance between the magnetic needle plate 54 and the circuit board 40.

[0067] See also Figure 2 and Figure 3 Since the grating sensor 61 has a high detection accuracy, the machine 11 is provided with a grating sensor 61 corresponding to the correcting device 50. The grating sensor 61 is located on both sides of the correcting device 50 and is used to detect the value of the correcting device 50 moving along the length direction of the machine 11, thereby facilitating the precise adjustment of the position of the magnetic needle plate 54 in the Y-axis direction.

[0068] After multiple wafers are positioned at the wafer-holding position 41, the magnetic needle plate 54 can be reset by the correction device 50. The correction device 50 also includes a photoelectric sensor 60, which is located below the magnetic needle plate 54. The photoelectric sensor 60 is used to sense the rotation angle of the magnetic needle plate 54 during reset rotation, thereby ensuring that the magnetic needle plate 54 is reset into place.

[0069] The light emitting surface of the photoelectric sensor 60 faces the magnetic needle plate 54. The sensing detection principle of the photoelectric sensor 60 is prior art and will not be described in detail here.

[0070] In some embodiments, see Figure 1 The camera device 70 includes a camera 74, a Z-axis assembly 73 for driving the camera 74 to rise and fall, a Y-axis assembly 72 for driving the camera 74 to move along the length direction of the platform 11, and an X-axis assembly 71 for driving the camera 74 to move along the width direction of the platform 11; the camera 74 is installed on the movable body of the Z-axis assembly 73, the fixed body of the Z-axis assembly 73 is installed on the movable body of the X-axis assembly 71, and the fixed body of the X-axis assembly 71 is installed on the movable body of the Y-axis assembly 72; support frames 75 are installed on opposite sides of the platform 11, and the fixed body of the Y-axis assembly 72 is installed on the support frames 75, so that the camera 74 is located above the magnetic flow device 20.

[0071] The width direction of the platform 11 is defined as the X-axis direction. The camera 74 of the camera device 70 can move in the X-axis direction, the Y-axis direction, and the Z-axis direction, thereby facilitating adjustment of the position of the camera 74 to align with the circuit board 40 of the magnetic flow device 20 or the magnetic needle plate 54 of the correction device 50. The camera 74 can move in multiple directions, making the position of the camera 74 more flexible.

[0072] See also Figure 8The crystal bonding machine 100 further includes a frame 10, and the machine platform 11, the deviation correction device 50, the magnetic flow device 20 and the camera device 70 are all installed inside the frame 10, which can reduce the odor overflow of the liquid flowing in the magnetic flow device 20.

[0073] A controller may be installed below the platform 11 , and the controller may be electrically connected to the camera device 70 and the deviation correction device 50 .

[0074] The above description is merely an exemplary embodiment of the present invention and does not limit the scope of protection of the present invention. Any equivalent structural transformation made by using the contents of the present invention description and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields, is included in the scope of protection of the present invention.

Claims

1. A die bonder, characterized in that: include: Machine; A magnetic flow device, the magnetic flow device is movably mounted on the machine platform, a circuit board is placed on the magnetic flow device, the magnetic flow device is provided with a magnetic flow cavity, the circuit board is limited in the magnetic flow cavity, and the circuit board has a plurality of die-bonding positions for placing wafers; a deflection correction device, the deflection correction device being provided on the machine platform and moving below the magnetic flow device, the deflection correction device being provided with a magnetic needle plate provided with a plurality of magnetic elements; and A camera device, the camera device being movably mounted on the machine platform and configured to photograph the plurality of die-bonding positions and the magnetic needle plate; When the multiple magnetic elements of the magnetic needle plate correspond to the multiple crystal fixing positions and the magnetic needle plate is located under the circuit board, liquid containing chips flows in the magnetic fluid cavity, and the multiple chips flow to the corresponding crystal fixing positions and are positioned at the crystal fixing positions.

2. The die bonder according to claim 1, wherein: The magnetic flow device comprises a flow trough, a recovery trough and the magnetic flow cavity, wherein the flow trough and the recovery trough are arranged on opposite sides of the magnetic flow cavity, and both the flow trough and the recovery trough are connected to the magnetic flow cavity; The magnetic fluid cavity is provided with an opening at a position corresponding to the circuit board, and the circuit board is exposed at the opening.

3. The die bonder according to claim 2, wherein: The magnetic flow cavity has a guide slope; A boss is protruded from the inner bottom wall of the magnetic flow cavity on one side facing the flow channel body, the flow channel body is arranged on the boss, the guide slope is arranged between the boss and the magnetic flow cavity, and the guide slope is inclined from the boss toward the inner bottom wall of the magnetic flow cavity, and the circuit board is limited to the inner bottom wall of the magnetic flow cavity; Alternatively, the inner bottom wall of the magnetic flow cavity forms the guide slope, and the guide slope is configured as a slope structure extending obliquely from the flow trough to the recovery trough, and the circuit board is confined to the guide slope.

4. The die bonder according to claim 3, wherein: A liquid discharge port is provided on a side of the magnetic flow cavity away from the boss, and the liquid discharge port is connected to the recovery tank body; the recovery tank body is extended along the bottom of the magnetic flow cavity, and the recovery tank body avoids the deviation correction device; And / or, a plurality of flow openings are provided on a side of the flow channel body facing the circuit board.

5. The die bonder according to claim 2, wherein: The machine platform has a guide rail extending along the length direction of the machine platform. The magnetic flow device is equipped with a first moving mechanism connected to the magnetic flow cavity. The first moving mechanism is movably installed on the guide rail to move on the guide rail.

6. The die bonder according to claim 2, wherein: The flow trough body and the recovery trough body can be detachably mounted on the magnetic flow cavity body; A first mounting protrusion is provided on the edge of the bottom of the flow trough body, and the first mounting protrusion is detachably connected to the inner bottom wall of the magnetic flow cavity; and / or a second mounting protrusion is provided on the edge of the top of the recovery trough body, and the second mounting protrusion is detachably connected to the inner bottom wall of the magnetic flow cavity.

7. The die bonder according to any one of claims 1 to 6, wherein: The deviation correction device includes a first driving device, the output end of which is connected to the magnetic needle plate to drive the magnetic needle plate to rotate; The correction device also includes a second drive device and a third drive device. The second drive device is used to drive the magnetic needle plate and the first drive device to lift toward the circuit board, and the third drive device is used to drive the magnetic needle plate, the first drive device and the second drive device to move along the length direction of the machine to the bottom of the magnetic flow device.

8. The die bonder according to claim 7, wherein: The machine platform is provided with grating sensors corresponding to the deflection-correcting device. The grating sensors are located on both sides of the deflection-correcting device and are used to detect the value of the movement of the deflection-correcting device along the length direction of the machine platform.

9. The die bonder according to claim 7, wherein: The deviation correction device further includes a photoelectric sensor, which is located below the magnetic needle plate and is used to sense the rotation angle of the magnetic needle plate when it is reset and rotated.

10. The die bonder according to any one of claims 1 to 6, wherein: The camera device includes a camera, a Z-axis assembly for driving the camera to move up and down, a Y-axis assembly for driving the camera to move along the length direction of the machine platform, and an X-axis assembly for driving the camera to move along the width direction of the machine platform; The camera is mounted on the movable body of the Z-axis assembly, the fixed body of the Z-axis assembly is mounted on the movable body of the X-axis assembly, and the fixed body of the X-axis assembly is mounted on the movable body of the Y-axis assembly; Support frames are installed on two opposite sides of the machine platform, and the fixed body of the Y-axis assembly is installed on the support frames so that the camera is located above the magnetic flow device.

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