Die bonder

Abstract

The application discloses a die bonder, and relates to the technical field of die bonding. The die bonder comprises a machine table, a magnetic flow device, a deviation rectifying device and a camera device. The magnetic flow device is movably arranged on the machine table, the magnetic flow device is provided with a circuit board, the magnetic flow device is provided with a magnetic flow cavity, the circuit board is limited in the magnetic flow cavity, and the circuit board is provided with a plurality of die bonding positions for placing wafers. The deviation rectifying device is arranged below the magnetic flow device, the deviation rectifying device is provided with a magnetic needle plate, and the deviation rectifying device rectifies the position of the magnetic needle plate to a position corresponding to the plurality of die bonding positions on the circuit board. When the plurality of magnetic elements on the magnetic needle plate correspond to the plurality of die bonding positions and the magnetic needle plate is located below the circuit board, a liquid containing wafers flows in the magnetic flow cavity, the plurality of wafers flow to the corresponding die bonding positions and are positioned on the die bonding positions, the plurality of wafers are accurately transferred to the die bonding positions of the circuit board at one time, and the die bonding efficiency is greatly improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of die bonding, in particular to a die bonder. BACKGROUND

[0002] The die bonder is a mechanical device capable of fixing the wafer to the circuit board.

[0003] The existing die bonder usually uses a suction nozzle or a mechanical hand to move a single wafer from a wafer supply position to a die bonding position, thereby realizing the die bonding operation of the wafer and the circuit board. However, the single wafer moving mode at a time will result in low die bonding efficiency, which affects the subsequent curing work. SUMMARY

[0004] The main purpose of the present application is to provide a die bonder, which aims to solve the problem of low die bonding efficiency of the existing die bonder.

[0005] To achieve the above purpose, the die bonder provided by the present application comprises:

[0006] a machine table;

[0007] a magnetic flow device movably installed on the machine table, the magnetic flow device being provided with a magnetic flow cavity, the circuit board being limited in the magnetic flow cavity, the circuit board having a plurality of die bonding positions for placing wafers;

[0008] a deviation rectifying device provided on the machine table and moving below the magnetic flow device, the deviation rectifying device being provided with a magnetic needle plate, the magnetic needle plate being provided with a plurality of magnetic elements; and

[0009] a camera device movably installed on the machine table, the camera device being used for photographing a plurality of the die bonding positions and the magnetic needle plate;

[0010] When the plurality of magnetic elements of the magnetic needle plate correspond to the plurality of die bonding positions and the magnetic needle plate is located below the circuit board, the magnetic flow cavity has a liquid containing wafers flowing therein, the plurality of wafers flow to the corresponding die bonding positions and are positioned in the die bonding positions.

[0011] In some embodiments, the magnetic flow device has an overflow groove, a recovery groove and the magnetic flow cavity, the overflow groove and the recovery groove being oppositely arranged on both sides of the magnetic flow cavity, the overflow groove and the recovery groove both being in communication with the magnetic flow cavity; the magnetic flow cavity is provided with an opening corresponding to the position of the circuit board, and the circuit board is exposed to the opening.

[0012] In some embodiments, the magnetic flow cavity has a guide slope; a side of the inner bottom wall of the magnetic flow cavity protrudes outwardly and is provided with a boss, the overflow groove is arranged on the boss, the guide slope is arranged between the boss and the magnetic flow cavity, the guide slope is arranged to be inclined from the boss to the inner bottom wall of the magnetic flow cavity, and the circuit board is limited to the inner bottom wall of the magnetic flow cavity; or the inner bottom wall of the magnetic flow cavity forms the guide slope, the guide slope is arranged to be a slope structure extending from the overflow groove to the recovery groove, and the circuit board is limited to the guide slope.

[0013] In some embodiments, a liquid discharge port is arranged on a side of the magnetic flow cavity away from the boss, the liquid discharge port communicates with the recovery groove; the recovery groove extends along the lower side of the magnetic flow cavity, and the recovery groove avoids the deviation correcting device; and / or a plurality of overflow ports are arranged on a side of the overflow groove facing the circuit board.

[0014] In some embodiments, the machine has a guide rail extending along the length direction of the machine, the magnetic flow device is provided with a first moving mechanism, the first moving mechanism is connected with the magnetic flow cavity, the first moving mechanism is movably arranged on the guide rail to move on the guide rail.

[0015] In some embodiments, the overflow groove and the recovery groove are detachably arranged on the magnetic flow cavity.

[0016] An edge of the bottom of the overflow groove is provided with a first mounting protrusion, the first mounting protrusion is detachably connected with the inner bottom wall of the magnetic flow cavity; and / or an edge of the top of the recovery groove is provided with a second mounting protrusion, the second mounting protrusion is detachably connected with the inner bottom wall of the magnetic flow cavity.

[0017] In some embodiments, the deviation correcting device comprises a first driving device, an output end of the first driving device is connected with the magnetic needle plate to drive the magnetic needle plate to rotate.

[0018] The deviation correcting device further comprises a second driving device and a third driving device, the second driving device is used to drive the magnetic needle plate and the first driving device to lift in a direction close to the circuit board, and the third driving device is used to drive the magnetic needle plate, the first driving device and the second driving device to move to the lower side of the magnetic flow device along the length direction of the machine.

[0019] In some embodiments, the machine is provided with a grating sensor corresponding to the deviation correcting device, the grating sensor is arranged on both sides of the deviation correcting device to detect the value of the movement of the deviation correcting device along the length direction of the machine.

[0020] In some embodiments, the deviation rectifying device further comprises a photoelectric sensor, which is located below the magnetic needle plate and is used to sense the rotation angle of the magnetic needle plate when it is reset.

[0021] In some embodiments, the camera device comprises a camera, a Z-axis assembly for driving the camera to move up and down, a Y-axis assembly for driving the camera to move along the length direction of the machine table, and an X-axis assembly for driving the camera to move along the width direction of the machine table; the camera is mounted on the moving body of the Z-axis assembly, the fixed body of the Z-axis assembly is mounted on the moving body of the X-axis assembly, the fixed body of the X-axis assembly is mounted on the moving body of the Y-axis assembly; the machine table is provided with support frames on opposite sides, and the fixed body of the Y-axis assembly is mounted on the support frames so that the camera is located above the magnetic flow device.

[0022] The technical scheme of the present application adds a magnetic flow device, which is movably mounted on a machine table, and is provided with a circuit board, a magnetic flow cavity, and a plurality of die bonding sites for placing wafers; a deviation rectifying device is arranged below the magnetic flow device, and is provided with a magnetic needle plate so as to rectify the position of the magnetic needle plate to correspond to the plurality of die bonding sites on the circuit board. When the plurality of magnetic elements on the magnetic needle plate correspond to the plurality of die bonding sites, and the magnetic needle plate is located below the circuit board, the magnetic flow cavity contains a liquid containing wafers, and the plurality of wafers flow to the corresponding die bonding sites and are positioned thereon, so that the plurality of wafers are accurately transferred to the die bonding sites on the circuit board at one time, thereby greatly improving the die bonding efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor based on the drawings shown.

[0024] Figure 1 The structural schematic diagram of an embodiment of the die bonder provided by the present application;

[0025] Figure 2 The structural schematic diagram of an embodiment of the die bonder provided by the present application from another perspective;

[0026] Figure 3 The structural schematic diagram of an embodiment of the die bonder provided by the present application from another perspective; Figure 2 The enlarged view of part A in FIG. 1;

[0027] Figure 4Structure schematic diagram of an embodiment of the magnetic flow device in the die bonder provided by the present application;

[0028] Figure 5 Structure schematic diagram of an embodiment of the magnetic flow device in the die bonder provided by the present application;

[0029] Figure 6 Structure schematic diagram of an embodiment of the deviation rectifying device in the die bonder provided by the present application;

[0030] Figure 7 Structure schematic diagram of an embodiment of the deviation rectifying device in the die bonder provided by the present application;

[0031] Figure 8 Structure schematic diagram of an embodiment of the rack installed in the die bonder provided by the present application.

[0032] Explanation of reference numerals:

[0033] 100, die bonder; 10, rack; 11, machine table; 12, guide rail;

[0034] 20, magnetic flow device; 21, flow passage body; 210, flow port; 211, first mounting protrusion; 22, magnetic flow cavity; 221, boss; 222, opening; 223, liquid discharge port; 224, accommodating groove; 23, recovery groove body; 230, second mounting protrusion; 231, recovery port; 24, guide slope; 30, first moving mechanism; 40, circuit board; 41, die bonding site;

[0035] 50, deviation rectifying device; 51, first driving device; 52, second driving device; 520, jacking module; 53, third driving device; 54, magnetic needle plate; 540, magnetic element; 55, fixing jig; 550, fixing groove; 60, photoelectric sensor; 61, grating sensor;

[0036] 70, camera device; 71, X-axis assembly; 72, Y-axis assembly; 73, Z-axis assembly; 74, camera; 75, support frame.

[0037] The implementation, functional features and advantages of the present application will be further described with reference to the embodiments and the accompanying drawings. DETAILED DESCRIPTION

[0038] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.

[0039] It should be noted that if the embodiments of the present application involve directionality indication (such as up, down, left, right, front, back, etc.), the directionality indication is only used to explain the relative position relationship, motion condition, etc. between components in a certain posture, and if the certain posture changes, the directionality indication also changes accordingly.

[0040] In addition, if the embodiments of the present application involve descriptions such as "first", "second", etc., the descriptions of "first", "second", etc. are only for description purposes and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one of the features. In addition, "and / or" or "and / or" appearing throughout the text means that the three parallel schemes are included, for example, "A and / or B" includes A scheme, or B scheme, or A and B are satisfied at the same time. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of ordinary skilled in the art, when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, nor within the scope of protection required by the present application.

[0041] The die bonder is a mechanical device capable of fixing the wafer to the circuit board. The existing die bonder usually moves a single wafer from the wafer supply position to the die bonding position by a suction nozzle or a mechanical hand, so as to realize the die bonding operation of the wafer and the circuit board. However, the single wafer transfer mode at a time will make the die bonding efficiency low, affecting the subsequent curing work.

[0042] The present application provides a die bonder 100. Please refer to Figure 1 and Figure 4 In an embodiment of the present application, the die bonder 100 provided by the present application comprises a machine table 11, a magnetic flow device 20, a deviation correction device 50 and a camera device 70, the magnetic flow device 20 is movably installed on the machine table 11, the magnetic flow device 20 is placed with a circuit board 40, the magnetic flow device 20 is provided with a magnetic flow cavity 22, the circuit board 40 is limited in the magnetic flow cavity 22, and the circuit board 40 has a plurality of die bonding positions 41 for placing wafers.

[0043] Please refer to Figure 1 and Figure 6 The deviation correction device 50 is arranged on the machine table 11 and moves below the magnetic flow device 20, the deviation correction device 50 is installed with a magnetic needle plate 54, and the magnetic needle plate 54 is installed with a plurality of magnetic elements 540.

[0044] The camera device 70 is movably installed on the machine table 11, and the camera device 70 is used for shooting a plurality of the die bonding positions 41 and the magnetic needle plate 54.

[0045] When the plurality of magnetic elements 540 of the magnetic needle plate 54 correspond to the plurality of die bonding sites 41, and the magnetic needle plate 54 is located below the circuit board 40, the liquid containing the wafer flows in the magnetic flow cavity 22, and the plurality of wafers flow to the corresponding die bonding sites 41 and are positioned in the die bonding sites 41.

[0046] The deviation correcting device 50 moves below the magnetic flow device 20, and the camera device 70 moves above the magnetic flow device 20, which effectively utilizes the longitudinal space of the die bonder 100 and reduces the volume of the die bonder 100.

[0047] Optionally, the magnetic elements 540 installed on the magnetic needle plate 54 can be magnetic needle structures or magnetic beads, etc. The base material of the circuit board 40 is a non-magnetic insulating material, which does not shield or distort the magnetic field of the magnetic needle plate 54. The die bonding sites 41 of the circuit board 40 are provided with copper sheets, which are non-magnetic metals and only serve as physical carriers for subsequent electrical connections, and do not participate in the generation of the magnetic field.

[0048] The liquid containing the wafer can be a low-viscosity carrier liquid containing the wafer. Specifically, the low-viscosity carrier liquid can be deionized water or fluorinated oil containing the wafer. The wafers in the magnetic flow cavity 22 flow suspended in the low-viscosity carrier liquid, and the wafers receive small frictional resistance, avoiding mechanical contact damage, such as avoiding scratches, stress cracks, etc.

[0049] Further, the wafer can be a magnetic wafer. Specifically, the wafer surface can be attached with a magnetic film or coated with a magnetic alloy layer, etc. to form a magnetic wafer.

[0050] The deviation correcting device 50 is arranged below the magnetic flow device 20, the deviation correcting device 50 is installed with a magnetic needle plate 54, the magnetic needle plate 54 is installed with a plurality of magnetic elements 540, and the plurality of magnetic elements 540 correspond to the die bonding sites 41. By utilizing the stable magnetic field existing around the magnetic elements 540, the magnetic wafer moves to the area with the strongest or weakest magnetic field, and then moves to the die bonding site 41 on the circuit board 40, realizing precise pre-alignment work and facilitating subsequent curing process.

[0051] Specifically, the liquid containing the magnetic wafer is poured into the magnetic flow cavity 22 so that the liquid carries the wafer to flow in the magnetic flow cavity 22. Then, the plurality of magnetic elements 540 of the magnetic needle plate 54 are moved below the circuit board 40 in the magnetic flow cavity 22 by the deviation correcting device 50, and the magnetic field at the plurality of magnetic elements 540 exerts a directional force on the magnetic wafer in the magnetic flow cavity 22.

[0052] The magnetic field at the plurality of magnetic elements 540 forms a local strongest point above the copper sheet. At this time, the local strongest point corresponds to the die bonding site 41, and the magnetic wafer is attracted to the local strongest point, so that the magnetic wafer moves to the local strongest point.

[0053] When the magnetic wafer approaches the local strongest point, the magnetic field force and the viscous resistance of the liquid reach a dynamic balance, the magnetic wafer stops moving, the magnetic wafer is positioned at the local strongest point, and then the magnetic wafer is accurately aligned to the die bonding site 41.

[0054] Wherein, after the magnetic wafer reaches the die bonding site 41, the surface tension or capillary force of the liquid can further enhance the stability of the alignment.

[0055] If the liquid is a partially wetting liquid, such as a mixture of deionized water and surfactant, the liquid film between the magnetic wafer and the circuit board 40 will generate a capillary attraction force, pulling the magnetic wafer towards the circuit board 40, achieving the fixation of the magnetic wafer, and then subsequently welding the magnetic wafer to the circuit board 40 by welding.

[0056] The technical scheme of the present application adopts the magnetic flow device 20, which is movably installed on the machine table 11, and the circuit board 40 is placed on the magnetic flow device 20. The magnetic flow device 20 is provided with a magnetic flow cavity 22, and the circuit board 40 is limited in the magnetic flow cavity 22. The circuit board 40 has a plurality of die bonding sites 41 for placing wafers. The correction device 50 is arranged below the magnetic flow device 20, and the magnetic needle plate 54 is installed on the correction device 50. The correction device 50 corrects the position of the magnetic needle plate 54 to correspond to the magnetic elements 540 on the magnetic needle plate 54 and the plurality of die bonding sites 41 on the circuit board 40. When the plurality of magnetic elements 540 on the magnetic needle plate 54 correspond to the plurality of die bonding sites 41, and the magnetic needle plate 54 is located below the circuit board 40, the magnetic flow cavity 22 flows with liquid containing wafers. A plurality of wafers flow to the corresponding die bonding sites 41 and are positioned in the die bonding sites 41, achieving the one-time accurate transfer of a plurality of wafers to the die bonding sites 41 of the circuit board 40, and greatly improving the die bonding efficiency.

[0057] In an embodiment, please refer to Figure 4 and Figure 5The magnetic flow device 20 has overflow grooves 21, recovery grooves 23 and the magnetic flow cavity 22. The overflow grooves 21 are arranged on both sides of the magnetic flow cavity 22 opposite to the recovery grooves 23. The overflow grooves 21 and the recovery grooves 23 are in communication with the magnetic flow cavity 22. The magnetic flow cavity 22 is provided with an opening 222 corresponding to the position of the circuit board 40. The circuit board 40 is exposed to the opening 222, so that the camera device 70 can shoot the position of the die bonding site 41 on the circuit board 40.

[0058] The top of the magnetic flow cavity 22 can be a plate-shaped structure with only the opening 222, so as to reduce the liquid spatter. Alternatively, the top of the magnetic flow cavity 22 can be designed as a whole open opening 222, so as to facilitate the camera device 70 to shoot the circuit board 40 in the magnetic flow cavity 22.

[0059] After the camera device 70 shoots and records the position of the die bonding site 41 on the circuit board 40, the camera device 70 moves above the deviation rectifying device 50 to shoot and record the positions of the plurality of magnetic elements 540 on the magnetic needle plate 54. Then, the positions of the die bonding site 41 and the plurality of magnetic elements 540 can be calculated by the camera device 70 or the controller, so that the deviation rectifying device 50 moves the magnetic needle plate 54 below the circuit board 40, and rotates the magnetic needle plate 54, so that the positions of the plurality of magnetic elements 540 on the magnetic needle plate 54 correspond to the positions of the die bonding site 41 on the circuit board 40. Subsequently, the deviation rectifying device 50 can lift the magnetic needle plate 54, so that the plurality of magnetic elements 540 are close to the circuit board 40 to generate a magnetic field. The method of calculating the positions of the die bonding site 41 and the plurality of magnetic elements 540 by the camera device 70 or the controller can adopt the existing technology, such as image recognition method, which will not be described here.

[0060] Further, the liquid containing a plurality of wafers in the overflow grooves 21 starts to flow to the magnetic flow cavity 22. When the plurality of wafers flow through the circuit board 40, the plurality of wafers are positioned on the plurality of die bonding sites 41 on the circuit board 40, thereby achieving the purpose of batch transfer of the plurality of wafers and protecting the wafers from being damaged. Then, the liquid without wafers flows into the recovery grooves 23 to be recovered for recycling.

[0061] Please refer to Figure 4 and Figure 5To make the liquid flow from the overflow groove 21 to the magnetic flow cavity 22 and the recovery groove 23, the magnetic flow cavity 22 has a guide slope 24; the inner bottom wall of the magnetic flow cavity 22 is provided with a boss 221 on the side facing the overflow groove 21, the overflow groove 21 is arranged on the boss 221, the guide slope 24 is arranged between the boss 221 and the magnetic flow cavity 22, the guide slope 24 is arranged obliquely from the boss 221 to the inner bottom wall of the magnetic flow cavity 22, and the circuit board 40 is limited to the inner bottom wall of the magnetic flow cavity 22. The bottom of the overflow groove 21 and the inner bottom wall of the magnetic flow cavity 22 have a height difference, so that the liquid flowing out of the overflow groove 21 can smoothly flow into the magnetic flow cavity 22 through the guide slope 24.

[0062] In an embodiment, the inner bottom wall of the magnetic flow cavity 22 is provided with a containing groove 224, and the circuit board 40 is limited to the containing groove 224, so as to avoid the displacement of the circuit board 40 when the liquid is in the magnetic flow cavity 22.

[0063] The angle between the slope of the guide slope 24 and the vertical line can be limited to between 0 degrees and 80 degrees. Specifically, the angle between the slope of the guide slope 24 and the vertical line can be 60 degrees, so that the liquid containing the wafer flowing out of the overflow groove 21 can flow into the magnetic flow cavity 22 more quickly, and then flow to the circuit board 40, the wafer is positioned to the die bonding site 41, the liquid continues to flow forward in the magnetic flow cavity 22 until it flows into the recovery groove 23.

[0064] In another embodiment, the inner bottom wall of the magnetic flow cavity 22 forms the guide slope 24, the guide slope 24 is arranged as a slope structure extending obliquely from the overflow groove 21 to the recovery groove 23, so that the liquid flows from the high overflow groove 21 to the recovery groove 23 through the guide slope 24.

[0065] The circuit board 40 is limited to the guide slope 24, and the wafer suspended in the liquid can be positioned to the die bonding site 41 of the circuit board 40 when flowing to the circuit board 40.

[0066] The angle between the slope of the guide slope 24 and the horizontal line can be limited to between 0 degrees and 80 degrees. Specifically, the angle between the slope of the guide slope 24 and the horizontal line can be 10 degrees, so that the liquid flowing out of the overflow groove 21 can flow into the magnetic flow cavity 22 more quickly, and the liquid can flow smoothly into the recovery groove 23 in the magnetic flow cavity 22.

[0067] In some embodiments, please refer to Figure 4 andFigure 5 The magnetic flow cavity 22 is provided with a liquid outlet 223 on the side away from the boss 221, the liquid outlet 223 is communicated with the recovery groove 23; the recovery groove 23 is arranged along the lower side of the magnetic flow cavity 22, and the recovery groove 23 avoids the deviation device 50; and / or the overflow groove 21 is provided with a plurality of overflow ports 210 on the side facing the circuit board 40.

[0068] In an embodiment, referring to Figure 4 and Figure 5 The inner bottom wall of the magnetic flow cavity 22 is provided with a liquid outlet 223 on the side away from the boss 221, the recovery groove 23 is communicated with the liquid outlet 223, and the magnetic flow cavity 22 is arranged along the lower side, so that the liquid in the magnetic flow cavity 22 can flow out of the liquid outlet 223 and flow into the recovery groove 23 under the influence of gravity.

[0069] The side of the overflow groove 21 is provided with a plurality of overflow ports 210, and the blocking plate can be inserted into the inner side of the overflow groove 21 to play the role of a gate. The blocking plate is extracted or inserted to simultaneously open or close a plurality of overflow ports 210.

[0070] In an embodiment, referring to Figure 1 and Figure 2 After the wafer is positioned on the die bonding site 41, the magnetic flow device 20 needs to be moved to the curing station for curing. To this end, the machine table 11 is provided with guide rails 12 extending along the length direction of the machine table 11, the magnetic flow device 20 is provided with a first moving mechanism 30, the first moving mechanism 30 is connected with the magnetic flow cavity 22, and the first moving mechanism 30 is movably installed on the guide rails 12 to move along the guide rails 12, so that the magnetic flow device 20 can be moved to the curing station through the first moving mechanism 30.

[0071] Among them, the camera device 70 can be installed on the guide rail 12 and located on one side of the magnetic flow device 20 to take pictures of the circuit board 40 in the magnetic flow device 20.

[0072] In an embodiment, the number of guide rails 12 of the machine table 11 is two, the first moving mechanism 30 is a moving seat or a moving plate, and the moving seat or the moving plate spans the two guide rails 12. The two guide rails 12 have a movable space, and the deviation device 50 moves in the movable space. The deviation device 50 is located below the first moving mechanism 30, avoiding the interference of the deviation device 50 to the camera device 70. And the deviation device 50 can be moved out of the first moving mechanism 30, which is convenient for the camera device 70 to take pictures of the magnetic needle plate 54.

[0073] Correspondingly, the two sides of the first moving mechanism 30 can be respectively provided with sliding blocks, so that the first moving mechanism 30 is connected with the guide rail 12 through the two sliding blocks, and then the magnetic flow device 20 can slide on the guide rail 12.

[0074] In some embodiments, referring to Figure 4 and Figure 5 , the overflow groove body 21 and the recovery groove body 23 can be detachably installed on the magnetic flow cavity 22; the edge of the bottom of the overflow groove body 21 is provided with a first mounting protrusion 211, which is detachably connected with the inner bottom wall of the magnetic flow cavity 22; and / or the edge of the top of the recovery groove body 23 is provided with a second mounting protrusion 230, which is detachably connected with the inner bottom wall of the magnetic flow cavity 22.

[0075] In an embodiment, the recovery groove body 23 can be designed as a semi-closed box structure, and the top of the recovery groove body 23 is provided with a recovery opening 231 which is in communication with the magnetic flow cavity 22, so that the liquid in the magnetic flow cavity 22 enters the recovery groove body 23 from the recovery opening 231. In order to facilitate disassembly and assembly, the outer periphery of the top of the recovery groove body 23 is provided with a second mounting protrusion 230 which is detachably connected with the outer bottom wall of the magnetic flow device 20. The second mounting protrusion 230 can be connected with the magnetic flow device 20 by means of pasting, clamping or screwing.

[0076] The overflow groove body 21 can be designed as a semi-closed box structure. The side of the overflow groove body 21 facing the magnetic flow cavity 22 is provided with a plurality of overflow openings 210, and the top of the overflow groove body 21 can be provided with a liquid inlet for facilitating pouring of the liquid containing wafers from the liquid inlet. In order to facilitate disassembly and assembly, the outer periphery of the bottom of the overflow groove body 21 is provided with a first mounting protrusion 211 which is detachably connected with the inner bottom wall of the magnetic flow device 20. The second mounting protrusion 230 can be connected with the magnetic flow device 20 by means of pasting, clamping or screwing.

[0077] Referring to Figure 6 and Figure 7In order to adjust the magnetic needle plate 54 in multiple directions and angles so that the magnetic elements 540 on the adjusted magnetic needle plate 54 are accurately aligned with the die bonding sites 41 on the circuit board 40, the deviation rectifying device 50 comprises a first driving device 51, the output end of the first driving device 51 is connected with the magnetic needle plate 54 to drive the magnetic needle plate 54 to rotate; the deviation rectifying device 50 further comprises a second driving device 52 and a third driving device 53, the second driving device 52 is used to drive the magnetic needle plate 54 and the first driving device 51 to lift towards the direction of the circuit board 40, and the third driving device 53 is used to drive the magnetic needle plate 54, the first driving device 51 and the second driving device 52 to move along the length direction of the machine table 11 to the lower side of the magnetic flow device 20.

[0078] The length direction of the machine table 11 is defined as the Y-axis direction, and the direction of lifting towards the circuit board 40 is the Z-axis direction. The deviation rectifying device 50 can adjust the magnetic needle plate 54 in the Y-axis direction and the Z-axis direction, and can also rotate the angle of the magnetic needle plate 54.

[0079] Specifically, the deviation rectifying device 50 further comprises a lifting module 520, the output end of the second driving device 52 is connected with the lifting module 520, wherein the lifting module 520 can comprise a lifting shell and a linkage mechanism, the linkage mechanism is installed in the lifting shell, the output end of the second driving device 52 is connected with the linkage mechanism, and the linkage mechanism is used to convert the rotating force of the second driving device 52 into the up-down lifting force. Wherein, the first driving device 51 is installed on the top of the lifting shell.

[0080] The linkage mechanism can be a gear set and a rack structure, the gear set is connected with the output end of the second driving device 52, and is meshed and connected with the rack structure, and the end of the rack structure away from the gear set is connected with the inner top wall of the lifting shell.

[0081] The deviation rectifying device 50 can further comprise a Y-axis sliding module, the output end of the third driving device 53 is connected with the Y-axis sliding module. Wherein, the Y-axis sliding module can comprise a sliding rail and a sliding seat, the sliding rail is installed on the machine table 11, the sliding seat is connected with the output shaft of the third driving device 53, and is slidingly installed on the sliding rail to slide along the length direction of the machine table 11. The lifting shell is installed on the sliding seat to make the sliding seat carry the second driving device 52, the first driving device 51 and the magnetic needle plate 54 to slide on the sliding rail.

[0082] Further, the deviation rectifying device 50 further comprises a fixing jig 55, the fixing jig 55 is provided with a fixing groove 550, the magnetic needle plate 54 can be installed into the fixing groove 550 of the fixing jig. The output end of the first driving device 51 is connected with the bottom of the fixing jig 55. A transmission mechanism can be installed between the first driving device 51 and the magnetic needle plate 54, the transmission mechanism can comprise a driving wheel connected with the first driving device 51 and a driven wheel vertically meshed and connected with the driving wheel, the shaft body of the driven wheel is connected with the magnetic needle plate 54. The first driving device 51 drives the driving wheel to rotate, so as to drive the driven wheel to rotate, and the driven wheel can drive the magnetic needle plate 54 to rotate synchronously.

[0083] The deviation rectifying device 50 can realize driving the magnetic needle plate 54 to move along the length direction of the machine table 11, lifting the magnetic needle plate 54 up and down, and driving the magnetic needle plate 54 to rotate, so that the magnetic needle plate 54 can be adjusted in multiple directions and angles.

[0084] The outer bottom wall of the magnetic flow cavity 22 is provided with a groove recessed towards the direction close to the circuit board, and the groove has a separation part from the circuit board. Since the magnetic flow cavity 22 is provided with the groove, the magnetic needle plate 54 can be lifted into the groove by the second driving device 52, so that the distance between the magnetic needle plate 54 and the circuit board 40 is reduced.

[0085] Please refer to Figure 2 and Figure 3 Since the grating sensor 61 has the effect of high detection precision, the machine table 11 is provided with the grating sensor 61 corresponding to the deviation rectifying device 50, the grating sensor 61 is located on both sides of the deviation rectifying device 50, and is used to detect the value of the movement of the deviation rectifying device 50 along the length direction of the machine table 11, so as to facilitate accurate adjustment of the position of the magnetic needle plate 54 in the Y-axis direction.

[0086] After a plurality of wafers are positioned on the die bonding sites 41, the magnetic needle plate 54 can be reset by the deviation rectifying device 50. The deviation rectifying device 50 further comprises a photoelectric sensor 60, the photoelectric sensor 60 is located below the magnetic needle plate 54, and the photoelectric sensor 60 is used to sense the rotation angle of the magnetic needle plate 54 when the magnetic needle plate 54 is reset and rotated, so as to guarantee that the magnetic needle plate 54 is reset in place.

[0087] The light emitting surface of the photoelectric sensor 60 faces the magnetic needle plate 54. The sensing and detection principle of the photoelectric sensor 60 is the prior art, which will not be described here.

[0088] In some embodiments, please refer to Figure 1The camera device 70 comprises a camera 74, a Z-axis assembly 73 for driving the camera 74 to move up and down, a Y-axis assembly 72 for driving the camera 74 to move along the length direction of the machine table 11, and an X-axis assembly 71 for driving the camera 74 to move along the width direction of the machine table 11. The camera 74 is mounted on the movable body of the Z-axis assembly 73, the fixed body of the Z-axis assembly 73 is mounted on the movable body of the X-axis assembly 71, the fixed body of the X-axis assembly 71 is mounted on the movable body of the Y-axis assembly 72, and the fixed body of the Y-axis assembly 72 is mounted on the support frame 75, so that the camera 74 is located above the magnetic flow device 20.

[0089] The width direction of the machine table 11 is defined as the X-axis direction. The camera 74 of the camera device 70 can move in the X-axis direction, the Y-axis direction and the Z-axis direction, so as to conveniently adjust the position of the camera 74 to align the circuit board 40 of the magnetic flow device 20 or the magnetic needle plate 54 of the deviation rectifying device 50. The camera 74 can move in multiple directions, and the position adjustment of the camera 74 is flexible.

[0090] Please refer to Figure 8 The die bonder 100 further comprises a machine frame 10, and the machine table 11, the deviation rectifying device 50, the magnetic flow device 20 and the camera device 70 are all mounted in the machine frame 10, so as to reduce the odor overflow of the liquid flowing in the magnetic flow device 20.

[0091] The controller can be electrically connected with the camera device 70 and the deviation rectifying device 50.

[0092] The above description is only an exemplary embodiment of the present application, and does not limit the protection scope of the present application. Any equivalent structural transformation based on the technical concept of the present application, or direct / indirect application in other related technical fields is included in the protection scope of the present application.

Claims

1. A die bonder, characterized in that, include: Machine tool; A magnetofluidic device is movably mounted on the machine tool. The magnetofluidic device has a circuit board placed on it and a magnetofluidic cavity. The circuit board is confined within the magnetofluidic cavity and has multiple die-bonding positions for placing wafers. A correction device, disposed on the machine base and moving below the magnetofluid device, the correction device being equipped with a magnetic needle plate, the magnetic needle plate being equipped with multiple magnetic elements; and A camera device is movably mounted on the machine base and is used to photograph multiple die-bonding sites and the magnetic needle plate. When multiple magnetic elements of the magnetic needle plate correspond to multiple die-bonding positions, and the magnetic needle plate is located below the circuit board, liquid containing wafers flows in the magnetofluid cavity, and multiple wafers flow to the corresponding die-bonding positions and are positioned at the die-bonding positions.

2. The die bonder as described in claim 1, characterized in that, The magnetofluidic device has a flow channel, a recovery channel and a magnetofluidic cavity. The flow channel and the recovery channel are disposed opposite to each other on both sides of the magnetofluidic cavity. Both the flow channel and the recovery channel are connected to the magnetofluidic cavity. The magnetohydrodynamic cavity has an opening corresponding to the position of the circuit board, and the circuit board is exposed through the opening.

3. The die bonder as described in claim 2, characterized in that, The magnetohydrodynamic cavity has a guiding ramp; A boss protrudes from the inner bottom wall of the magnetohydrodynamic cavity on the side facing the flow channel. The flow channel is located on the boss. The guide ramp is located between the boss and the magnetohydrodynamic cavity. The guide ramp is inclined from the boss toward the inner bottom wall of the magnetohydrodynamic cavity. The circuit board is located on the inner bottom wall of the magnetohydrodynamic cavity. Alternatively, the inner bottom wall of the magnetohydrodynamic cavity forms the guide ramp, which is configured as a ramp structure extending obliquely from the flow channel to the recovery channel, and the circuit board is confined within the guide ramp.

4. The die bonder as described in claim 3, characterized in that, The magnetofluid cavity is provided with a drain outlet on the side away from the boss, and the drain outlet is connected to the recovery tank; the recovery tank extends along the lower part of the magnetofluid cavity and avoids the correction device. And / or, the side of the flow channel facing the circuit board is provided with multiple flow ports.

5. The die bonder as described in claim 2, characterized in that, The machine tool has a guide rail extending along the length of the machine tool. The magnetofluid device is equipped with a first moving mechanism, which is connected to the magnetofluid cavity. The first moving mechanism is movably mounted on the guide rail to move on the guide rail.

6. The die bonder as described in claim 2, characterized in that, Both the flow channel and the recovery channel can be detachably installed in the magnetohydrodynamic cavity; The bottom edge of the flow channel is provided with a first mounting protrusion, which is detachably connected to the inner bottom wall of the magnetohydrodynamic cavity; and / or, the top edge of the recovery channel is provided with a second mounting protrusion, which is detachably connected to the inner bottom wall of the magnetohydrodynamic cavity.

7. The die bonder as described in any one of claims 1 to 6, characterized in that, The correction device includes a first driving device, the output end of which is connected to the magnetic needle plate to drive the magnetic needle plate to rotate. The correction device further includes a second driving device and a third driving device. The second driving device is used to drive the magnetic needle plate and the first driving device to rise towards the circuit board. The third driving device is used to drive the magnetic needle plate, the first driving device and the second driving device to move along the length of the machine to below the magnetoflow device.

8. The die bonder as described in claim 7, characterized in that, The machine tool is equipped with grating sensors corresponding to the correction device. The grating sensors are located on both sides of the correction device and are used to detect the value of the correction device moving along the length direction of the machine tool.

9. The die bonder as described in claim 7, characterized in that, The correction device also includes a photoelectric sensor located below the magnetic needle plate. The photoelectric sensor is used to sense the rotation angle of the magnetic needle plate during its reset rotation.

10. The die bonder as described in any one of claims 1 to 6, characterized in that, The camera device includes a camera, a Z-axis assembly for driving the camera to move up and down, a Y-axis assembly for driving the camera to move along the length direction of the machine platform, and an X-axis assembly for driving the camera to move along the width direction of the machine platform. The camera is mounted on the movable body of the Z-axis assembly, the fixed body of the Z-axis assembly is mounted on the movable body of the X-axis assembly, and the fixed body of the X-axis assembly is mounted on the movable body of the Y-axis assembly. Support frames are installed on opposite sides of the machine platform, and the fixing body of the Y-axis assembly is installed on the support frames so that the camera is positioned above the magnetohydrodynamic device.

Images