Wafer center-adjustable alignment device and alignment method thereof

Abstract

The invention belongs to the technical field of semiconductor wafer process treatment, and particularly relates to a wafer center-adjustable alignment device and an alignment method thereof, an upper adsorption disc body is mounted at the top in a high-temperature vacuum cavity, and a lifting pin is fixed at the bottom of the high-temperature vacuum cavity and located below the upper adsorption disc body; the multiple telescopic rods are located between the upper adsorption disc body and the lifting pin in the height direction and arranged on the periphery of the lifting pin in the circumferential direction, and the lifting pin ascends to the middle of the telescopic rods when the mechanical arm is fed into the upper wafer or the lower wafer; the telescopic rods are all installed on the cooling platform and comprise a fixed gear telescopic rod A, a fixed gear telescopic rod B, a supporting telescopic rod B, a buffering gear telescopic rod B, a notch gear telescopic rod, a buffering gear telescopic rod A and a supporting telescopic rod A which are sequentially arranged in the circle direction. According to the invention, self-aligning alignment in the high-temperature vacuum cavity is realized, and the problem that vision and centering alignment cannot be applied in the high-temperature vacuum cavity is solved.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor wafer processing, in particular to a wafer centering alignment device and an alignment method thereof. Background Art

[0002] Currently, vision alignment or centering alignment mechanisms are commonly used in semiconductor production equipment for bonding processes on the market. Vision alignment primarily uses a camera to capture images of the wafer or its edge to locate the wafer's center. An XYW three-axis alignment platform then translates the wafer to the target position. Automatic centering alignment, on the other hand, uses a linkage mechanism to simultaneously clamp the wafer edge at three or four points, then simultaneously open them to ensure alignment between the wafer and the target center.

[0003] Because the bonding process needs to be carried out in a high-temperature vacuum environment, visual alignment has certain limitations in high-temperature vacuum environments and cannot meet the operating conditions of 200°C and 10^(-4)Pa vacuum. This makes it impossible to install the visual alignment system inside a high-temperature vacuum chamber. Although the centering alignment structure can achieve centering action in a high-temperature vacuum chamber, due to the limitations of the bonding process, to avoid subsequent process anomalies, the upper and lower wafers to be bonded often need to be misaligned at the notch (slot), so centering alignment cannot meet the requirements. Summary of the Invention

[0004] To address the aforementioned issues with the alignment structures used in existing semiconductor manufacturing equipment for bonding processes, the present invention aims to provide a wafer alignment device and method. This device can be installed within a 200°C high-temperature, 10^(-4)Pa vacuum chamber, achieving high-precision alignment and positioning for wafers placed within the chamber, meeting the alignment and positioning requirements of the bonding process.

[0005] The object of the present invention is achieved through the following technical solutions:

[0006] The centerable alignment device of the present invention is located in a high-temperature vacuum chamber, and the centerable alignment device includes an upper adsorption disc, a cooling platform, a lifting pin and a telescopic rod, wherein the upper adsorption disc is installed on the top of the high-temperature vacuum chamber, and the lifting pin is fixed at the bottom of the high-temperature vacuum chamber and is located below the upper adsorption disc; there are multiple telescopic rods, which are located between the upper adsorption disc and the lifting pin in the height direction and are arranged on the periphery of the lifting pin along the circumferential direction. The lifting pin rises to the middle of each telescopic rod when the robot feeds in the upper wafer or the lower wafer; the telescopic rods are all installed on the cooling platform, and the telescopic rods include a fixed gear telescopic rod A, a fixed gear telescopic rod B, a supporting telescopic rod B, a buffer gear telescopic rod B, a notch gear telescopic rod, a buffer gear telescopic rod A and a supporting telescopic rod A arranged in sequence along the circular direction.

[0007] Among them: the connecting line between the fixed gear telescopic rod A and the buffer gear telescopic rod B, the connecting line between the fixed gear telescopic rod B and the buffer gear telescopic rod A, and the connecting line between the support telescopic rod A and the support telescopic rod B intersect at one point, and the connecting line between the fixed gear telescopic rod A and the buffer gear telescopic rod B is perpendicular to the connecting line between the fixed gear telescopic rod B and the buffer gear telescopic rod A, and the notch gear telescopic rod is located between the buffer gear telescopic rod A and the buffer gear telescopic rod B.

[0008] The fixed gear telescopic rod A, the fixed gear telescopic rod B, the buffer gear telescopic rod A, the buffer gear telescopic rod B and the notch gear telescopic rod are arranged at the same height and are higher than the height of the supporting telescopic rod A and the supporting telescopic rod B.

[0009] The cooling platform includes a cooling platform A and a cooling platform B. Both cooling platform A and cooling platform B are annular and concentrically arranged. Cooling platform B is located on the periphery of cooling platform A and lower than cooling platform A. The cooling platform A and cooling platform B have the same structure and are both provided with cooling water channels inside. Both cooling platform A and cooling platform B are provided with water inlets and outlets connected to the cooling water channels. The fixed gear telescopic rod A, fixed gear telescopic rod B, buffer gear telescopic rod A, buffer gear telescopic rod B and notch gear telescopic rod are respectively fixed on cooling platform A, and the supporting telescopic rod A and supporting telescopic rod B are respectively fixed on cooling platform B.

[0010] The outer diameter of the upper end of the lifting pin is smaller than the inner diameter of the cooling platform A and the cooling platform B.

[0011] The fixed-gear telescopic rod A and the fixed-gear telescopic rod B have the same structure, both including an electric cylinder A, a base A and a push rod A. The base A is fixed on the cooling platform, the electric cylinder A is installed on the base A, one end of the push rod A is connected to the output end of the electric cylinder A, and the electric cylinder A drives the push rod A to slide back and forth on the base A. The other end of the push rod A is used to contact the upper wafer or the lower wafer.

[0012] The buffer gear telescopic rod A and the buffer gear telescopic rod B have the same structure, both including an electric cylinder B, a base B, a fixed seat A, a connecting shaft A, a spring A and a push rod B. The base B is fixed on the cooling platform, and the electric cylinder B is installed on the base B. The bottom of the fixed seat A is connected to the output end of the electric cylinder B. The electric cylinder B drives the fixed seat A to slide back and forth on the base B. The top of the fixed seat A is installed with a connecting shaft A. One end of the push rod B is connected to the connecting shaft A so as to be relatively movably, and a spring A is sleeved on the connecting shaft A between one end of the push rod B and the top of the fixed seat A. The two ends of the spring A are respectively in contact with one end of the push rod B and the top of the fixed seat A, and the other end of the push rod B is used to contact the upper wafer or the lower wafer.

[0013] The notch gear telescopic rod includes an electric cylinder D, a base D, a fixed seat B, a connecting shaft B, a spring B and a push rod C. The base D is fixed on the cooling platform, the electric cylinder D is installed on the base D, the bottom of the fixed seat B is connected to the output end of the electric cylinder D, the electric cylinder D drives the fixed seat B to slide back and forth on the base D, and the top of the fixed seat B is installed with a connecting shaft B. One end of the push rod C is connected to the connecting shaft B so as to be relatively movably, and a spring B is sleeved on the connecting shaft B between one end of the push rod C and the top of the fixed seat B. The two ends of the spring B are respectively in contact with one end of the push rod C and the top of the fixed seat B. The other end of the push rod C is provided with a roller for contacting the upper wafer notch or the lower wafer notch.

[0014] The supporting telescopic rod A and the supporting telescopic rod B have the same structure, both comprising an electric cylinder C, a base C and a support plate, wherein the base C is fixed on the cooling platform, the electric cylinder C is mounted on the base C, one end of the support plate is connected to the output end of the electric cylinder C, and the electric cylinder C drives the support plate to slide back and forth on the base C, and the other end of the support plate is in a "U" shape, and both sides of the "U"-shaped opening are provided with columns (36) for contacting the upper wafer or the lower wafer.

[0015] The wafer centering alignment device alignment method of the present invention comprises the following steps:

[0016] Step A, preparing for the upper wafer alignment; the lifting pin rises to the middle of each telescopic rod, the robot places the upper wafer on the lifting pin, the supporting telescopic rod A and the supporting telescopic rod B extend below the upper wafer, the lifting pin falls below the supporting telescopic rod A and the supporting telescopic rod B, and the upper wafer falls on the supporting telescopic rod A and the supporting telescopic rod B;

[0017] Step B, aligning the upper wafer; the notch gear telescopic rod is extended and stuck in the notch of the upper wafer, the fixed gear telescopic rod A and the fixed gear telescopic rod B are extended at the same time and contact the edge of the upper wafer. Under the action of the fixed gear telescopic rod A and the fixed gear telescopic rod B, the notch gear telescopic rod will passively retract; then, the buffer gear telescopic rod A and the buffer gear telescopic rod B are extended, contact the edge of the upper wafer, and knock the upper wafer to correct the upper wafer; the buffer gear telescopic rod A and the buffer gear telescopic rod B are retracted and reset, the notch gear telescopic rod is retracted and reset, and the fixed gear telescopic rod A and the fixed gear telescopic rod B are retracted and reset at the same time;

[0018] Step C, upper wafer adsorption; the lifting pin rises, and the upper wafer is lifted up by the supporting telescopic rod A and the supporting telescopic rod B to the lower surface of the upper adsorption disk. The upper adsorption disk adsorbs the upper wafer, and the lifting pin descends and resets;

[0019] Step D, preparing for the alignment of the lower wafer; the lifting pin rises to the middle of each telescopic rod, the robot places the lower wafer on the lifting pin, the supporting telescopic rod A and the supporting telescopic rod B extend below the lower wafer, the lifting pin falls below the supporting telescopic rod A and the supporting telescopic rod B, and the lower wafer falls on the supporting telescopic rod A and the supporting telescopic rod B;

[0020] Step E, aligning the lower wafer; the notch gear telescopic rod is extended and stuck in the notch of the lower wafer, and the fixed gear telescopic rod A and the fixed gear telescopic rod B are extended at the same time and contact the edge of the lower wafer. Compared with the alignment of the upper wafer in step B, the fixed gear telescopic rod A and the fixed gear telescopic rod B will extend less than the set distance Xmm; under the action of the fixed gear telescopic rod A and the fixed gear telescopic rod B, the notch gear telescopic rod will passively retract; thereafter, the buffer gear telescopic rod A and the buffer gear telescopic rod B are extended, contact the edge of the lower wafer, and knock the lower wafer, so that the lower wafer is misaligned with the upper wafer by Xmm; the buffer gear telescopic rod A and the buffer gear telescopic rod B are retracted and positioned, the notch gear telescopic rod is retracted and positioned, and the fixed gear telescopic rod A and the fixed gear telescopic rod B are retracted and positioned at the same time;

[0021] Step F, laminating the lower wafer; the lifting pin rises, and the lower wafer is lifted up by the supporting telescopic rod A and the supporting telescopic rod B to the lower surface of the upper wafer, so as to achieve staggered lamination of the upper and lower wafers.

[0022] The advantages and positive effects of the present invention are:

[0023] 1. The present invention realizes centering and alignment in a high-temperature (200°C) vacuum (10^(-4) Pa) chamber, solving the problem that vision and centering alignment cannot be applied in a high-temperature vacuum chamber.

[0024] 2. The present invention enables the upper wafer and the lower wafer to be staggered and fitted, thereby avoiding the risk of fragmentation in subsequent processes and improving production yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic diagram of the internal structure of the centering and positioning device of the present invention;

[0026] Figure 2 This is a schematic structural diagram of the layout of the telescopic rods in the center-adjustable alignment device of the present invention;

[0027] Figure 3 for Figure 2 Schematic diagram of the structure of the fixed-gear telescopic rod A and the fixed-gear telescopic rod B;

[0028] Figure 4 for Figure 2 Schematic diagram of the structure of the middle buffer gear telescopic rod A and the buffer gear telescopic rod B;

[0029] Figure 5 for Figure 2 Schematic diagram of the structure of the telescopic lever in the middle notch gear position;

[0030] Figure 6 for Figure 2 Schematic diagram of the structure of the middle support telescopic rod A and the support telescopic rod B;

[0031] Figure 7 for Figure 6 A top view of the structure;

[0032] Figure 8 Schematic diagram of the wafer staggered lamination pattern of the present invention;

[0033] Among them: 1 is a high-temperature vacuum chamber, 2 is an upper adsorption plate, 3 is a cooling platform A, 4 is a fixed gear telescopic rod A, 5 is a fixed gear telescopic rod B, 6 is a buffer gear telescopic rod A, 7 is a buffer gear telescopic rod B, 8 is a notch gear telescopic rod, 9 is a support telescopic rod A, 10 is a support telescopic rod B, 11 is a lifting pin (pillar), 12 is an upper wafer, 13 is a lower wafer, 14 is an upper wafer notch, 15 is a lower wafer notch, 16 is an electric cylinder A, 17 is a base A, 18 is a push rod A, 19 is a slide rail A, 20 is a slider A, 21 1 is the electric cylinder B, 22 is the base B, 23 is the slide rail B, 24 is the slider B, 25 is the fixed seat A, 26 is the slide rail C, 27 is the slider C, 28 is the connecting shaft A, 29 is the spring A, 30 is the push rod B, 31 is the electric cylinder C, 32 is the base C, 33 is the slide rail D, 34 is the slider D, 35 is the support plate, 36 is the column, 37 is the electric cylinder D, 38 is the base D, 39 is the slide rail E, 40 is the slider E, 41 is the fixed seat B, 42 is the slide rail F, 43 is the slider F, 44 is the connecting shaft B, 45 is the spring B, 46 is the push rod C, 47 is the roller, and 48 is the cooling platform B. DETAILED DESCRIPTION

[0034] The present invention will be further described below in conjunction with the accompanying drawings.

[0035] The center-adjustable alignment device of the present invention is a device for high-precision, fully automatic center-adjustable alignment in a high-temperature vacuum environment for use in the temporary bonding process of wafers. Figure 1 、 Figure 2 As shown, the centering alignment device is located in the high-temperature vacuum chamber 1, including an upper adsorption disc 2, a cooling platform, a lifting pin 11 and a telescopic rod, wherein the upper adsorption disc 2 is installed at the top of the high-temperature vacuum chamber 1, and the lifting pin 11 is fixed at the bottom of the high-temperature vacuum chamber 1 and is located below the upper adsorption disc 2; there are multiple telescopic rods, which are located between the upper adsorption disc 2 and the lifting pin 11 in the height direction and are arranged on the periphery of the lifting pin 11 along the circumferential direction. The lifting pin 11 rises to the middle of each telescopic rod when the robot feeds in the upper wafer 12 or the lower wafer 13; the telescopic rods are all installed on the cooling platform, and the telescopic rods include a fixed gear telescopic rod A4, a fixed gear telescopic rod B5, a supporting telescopic rod B10, a buffer gear telescopic rod B7, a notch gear telescopic rod 8, a buffer gear telescopic rod A6 and a supporting telescopic rod A9 arranged in sequence along the circular direction.

[0036] In this embodiment, the connecting line between the fixed gear telescopic rod A4 and the buffer gear telescopic rod B7, the connecting line between the fixed gear telescopic rod B5 and the buffer gear telescopic rod A6, and the connecting line between the support telescopic rod A9 and the support telescopic rod B10 intersect at one point, and the connecting line between the fixed gear telescopic rod A4 and the buffer gear telescopic rod B7 is perpendicular to the connecting line between the fixed gear telescopic rod B5 and the buffer gear telescopic rod A6, and the notch gear telescopic rod 8 is located between the buffer gear telescopic rod A6 and the buffer gear telescopic rod B7.

[0037] In this embodiment, the fixed gear telescopic rod A4, the fixed gear telescopic rod B5, the buffer gear telescopic rod A6, the buffer gear telescopic rod B7 and the notch gear telescopic rod 8 are arranged at the same height and are higher than the supporting telescopic rod A9 and the supporting telescopic rod B10.

[0038] The cooling platform of this embodiment is based on existing technology and includes a cooling platform A3 and a cooling platform B48, each of which is fixed within the high-temperature vacuum chamber 1. Both cooling platforms A3 and B48 are annular and concentrically arranged, with cooling platform B48 located outside and below cooling platform A3. Cooling platforms A3 and B48 have identical structures, each equipped with internal cooling water channels. Both cooling platforms A3 and B48 are equipped with water inlets and outlets connected to the cooling water channels. Fixed-gear telescopic rod A4, fixed-gear telescopic rod B5, buffer-gear telescopic rod A6, buffer-gear telescopic rod B7, and notch-gear telescopic rod 8 are each fixed to cooling platform A3, while supporting telescopic rod A9 and supporting telescopic rod B10 are each fixed to cooling platform B48. Cooling platforms A3 and B48 cool each telescopic rod to prevent it from overheating. The outer diameter of the upper end of the lifting pin 11 is smaller than the inner diameter of the cooling platform A3 and the cooling platform B48 to prevent the lifting pin 11 from colliding with the cooling platform A3 and the cooling platform B48 when rising.

[0039] like Figures 1 to 3 As shown, the fixed-gear telescopic rod A4 of this embodiment has the same structure as the fixed-gear telescopic rod B5, both of which include an electric cylinder A16, a base A17 and a push rod A18. The base A17 is fixed on the cooling platform A3, and the electric cylinder A16 is installed on the base A17. One end of the push rod A18 is connected to the output end of the electric cylinder A16, and a slider A20 is fixed to the bottom of one end of the push rod A18. A slide rail A19 is fixed to the base A17. The push rod A18 is slidably connected to the base A17 through the slider A20 and the slide rail A19. The electric cylinder A16 drives the push rod A18 to slide back and forth on the base A17. The push rod A18 slides radially along the cooling platform A3, and the other end of the push rod A18 is used to contact the upper wafer 12 or the lower wafer 13.

[0040] like Figure 1 、 Figure 2and Figure 4 As shown, the buffer gear telescopic rod A6 and the buffer gear telescopic rod B7 of this embodiment have the same structure, both including an electric cylinder B21, a base B22, a fixed seat A25, a connecting shaft A28, a spring A29 and a push rod B30. The base B22 is fixed on the cooling platform A3, the electric cylinder B21 is installed on the base B22, the bottom of the fixed seat A25 is connected to the output end of the electric cylinder B21, and a slider B24 is fixed to the bottom of the fixed seat A25, and a slide rail B23 is fixed to the base B22. The fixed seat A25 is slidably connected to the base B22 through the slider B24 and the slide rail B23, and the electric cylinder B21 drives the fixed seat A25 to slide back and forth on the base B22; the top of the fixed seat A25 is installed with a connecting shaft A28, and the connecting shaft A2 The two ends of 8 are respectively located on both sides of the top of the fixed seat A25, one end of the push rod B30 is connected to the connecting shaft A28 so as to be relatively movably, and a spring A29 is sleeved on the connecting shaft A28 between one end of the push rod B30 and the top of the fixed seat A25, and the two ends of the spring A29 are respectively abutted against one end of the push rod B30 and the top of the fixed seat A25, and a slider C27 is fixed to the bottom of one end of the push rod B30, and a slide rail C26 is fixed to the fixed seat A25, the push rod B30 is slidably connected to the fixed seat A25 through the slider C27 and the slide rail C26, the push rod B30 and the fixed seat A25 both slide along the radial direction of the cooling platform A3, and the other end of the push rod B30 is used to contact the upper wafer 12 or the lower wafer 13.

[0041] like Figure 1 、 Figure 2 and Figure 5As shown, the notch gear telescopic rod 8 of this embodiment includes an electric cylinder D37, a base D38, a fixed base B41, a connecting shaft B44, a spring B45 and a push rod C46. The base D38 is fixed on the cooling platform A3, the electric cylinder D37 is installed on the base D38, the bottom of the fixed base B41 is connected to the output end of the electric cylinder D37, and a slider E40 is fixed to the bottom of the fixed base B41. A slide rail E39 is fixed to the base D38. The fixed base B41 is slidably connected to the base D38 through the slider E40 and the slide rail E39. The electric cylinder D37 drives the fixed base B41 to slide back and forth on the base D38; a connecting shaft B44 is installed on the top of the fixed base B41, and the two ends of the connecting shaft B44 are respectively located on the fixed base On both sides of the top of B41, one end of the push rod C46 is connected to the connecting shaft B44 so as to be relatively movably, and a spring B45 is sleeved on the connecting shaft B44 between one end of the push rod C46 and the top of the fixed seat B41, and the two ends of the spring B45 are respectively abutted against one end of the push rod C46 and the top of the fixed seat B41, and the bottom of one end of the push rod C46 is fixed to the slider F43, and the fixed seat B41 is fixed with a slide rail F42. The push rod C46 is slidably connected to the fixed seat B41 through the slider F43 and the slide rail F42. The push rod C46 and the fixed seat B41 both slide along the radial direction of the cooling platform A3, and the other end of the push rod C46 is provided with a roller 47 for contacting the upper wafer slot 14 or the lower wafer slot 15.

[0042] like Figure 1 、 Figure 2 、 Figure 6 and Figure 7 As shown, the supporting telescopic rods A9 and B10 of this embodiment have the same structure, both comprising an electric cylinder C31, a base C32, and a support plate 35. Base C32 is fixed to cooling platform B48, and electric cylinder C31 is mounted on base C32. One end of support plate 35 is connected to the output end of electric cylinder C31, and a slider D34 is fixed to the bottom of one end of support plate 35. A slide rail D33 is fixed to base C32. Support plate 35 is slidably connected to base C32 via slider D34 and slide rail D33. Electric cylinder C31 drives support plate 35 to slide back and forth on base C32. The other end of support plate 35 is U-shaped, and columns 36 are provided on both sides of the U-shaped opening for contact with upper wafer 12 or lower wafer 13. Support plate 35 is located below cooling platform A3.

[0043] The wafer centering alignment device alignment method of the present invention comprises the following steps:

[0044] Step A, prepare the upper wafer 12 for alignment; the lifting pin 11 rises to the middle of the telescopic rods, and the robot places the upper wafer 12 on the lifting pin 11. The electric cylinder C31 in the supporting telescopic rods A9 and B10 works, driving the support plate 35 to extend into the cooling platform A3 and below the upper wafer 12. After the lifting pin 11 falls below the supporting telescopic rods A9 and B10, the upper wafer 12 falls on the columns 36 of the supporting telescopic rods A9 and B10.

[0045] Step B, aligning the upper wafer 12; the electric cylinder D37 in the notch gear telescopic rod 8 works, driving the fixed seat B41 to extend, so that the roller 47 at the other end of the push rod C46 is stuck in the upper wafer notch 14; the electric cylinder A16 in the fixed gear telescopic rod A4 and the fixed gear telescopic rod B5 works simultaneously, driving their respective push rods A18 to extend simultaneously, so that the other end of the push rod A18 contacts the edge of the upper wafer 12. Under the action of the fixed gear telescopic rod A4 and the fixed gear telescopic rod B5, the push rod C46 in the notch gear telescopic rod 8 will passively retract; Afterwards, the electric cylinders B21 in the buffer gear telescopic rods A6 and B7 work simultaneously, driving the fixed seat A25 to extend, so that the other end of the push rod B30 contacts the edge of the upper wafer 12 and knocks the upper wafer 12 to correct the upper wafer 12; the electric cylinders B21 in the buffer gear telescopic rods A6 and B7 work in the reverse direction and retract to the original position; the electric cylinder D37 in the notch gear telescopic rod 8 works in the reverse direction and retracts to the original position; the electric cylinders A16 in the fixed gear telescopic rods A4 and B5 work in the reverse direction and retract to the original position;

[0046] Step C, the upper wafer 12 is adsorbed; the lifting pin 11 rises, and the upper wafer 12 is lifted up by the support telescopic rod A9 and the support telescopic rod B10 on the column 36 to the lower surface of the upper adsorption disk 2, the upper adsorption disk 2 adsorbs the upper wafer 12, and the lifting pin 11 drops and resets;

[0047] Step D, prepare the lower wafer 13 for alignment; the lifting pin 11 rises to the middle of the telescopic rods, and the robot places the lower wafer 13 on the lifting pin 11. The electric cylinder C31 in the supporting telescopic rods A9 and B10 works, driving the support plate 35 to extend into the cooling platform A3 and below the lower wafer 13. After the lifting pin 11 falls below the supporting telescopic rods A9 and B10, the lower wafer 13 falls on the columns 36 of the supporting telescopic rods A9 and B10.

[0048] Step E, align the lower wafer 13; the electric cylinder D37 in the notch gear telescopic rod 8 works, driving the fixed seat B41 to extend, so that the roller 47 at the other end of the push rod C46 is stuck in the lower wafer notch 15; the electric cylinder A16 in the fixed gear telescopic rod A4 and the fixed gear telescopic rod B5 works at the same time, driving their respective push rods A18 to extend at the same time, so that the other end of the push rod A18 contacts the edge of the lower wafer 13, compared to the upper wafer in step B 12, the push rod A18 in the fixed gear telescopic rod A4 and the fixed gear telescopic rod B5 will extend less than the set distance Xmm (the illusion position alignment distance X can be set as needed); under the action of the fixed gear telescopic rod A4 and the fixed gear telescopic rod B5, the push rod C46 in the notch gear telescopic rod 8 will passively retract; after that, the electric cylinder B21 in the buffer gear telescopic rod A6 and the buffer gear telescopic rod B7 work at the same time to drive the fixed seat A25 to extend, so that the other end of the push rod B30 contacts the edge of the lower wafer 13 and knocks the lower wafer 13, so that the lower wafer 13 is misaligned with the upper wafer 12 by Xmm; the electric cylinder B21 in the buffer gear telescopic rod A6 and the buffer gear telescopic rod B7 work in the reverse direction and retract to return to the original position, the electric cylinder D37 in the notch gear telescopic rod 8 works in the reverse direction and retracts to return to the original position, and the electric cylinder A16 in the fixed gear telescopic rod A4 and the fixed gear telescopic rod B5 work in the reverse direction and retract to return to the original position;

[0049] lifting pin11 rises, and lifts the lower wafer13 from the support telescopic rod A9 and the support telescopic rod B10 on the column 36 to the lower surface of the upper wafer 12, achieving the upper wafer12 and the lower wafer13 misaligned fit.

Claims

1. A wafer centering and alignment device, located in a high-temperature vacuum chamber (1), characterized in that: The centering and alignment device comprises an upper adsorption disc (2), a cooling platform, a lifting pin (11) and a telescopic rod, wherein the upper adsorption disc (2) is installed on the top of a high-temperature vacuum chamber (1), and the lifting pin (11) is fixed on the bottom of the high-temperature vacuum chamber (1) and is located below the upper adsorption disc (2); the telescopic rods are multiple, and are located between the upper adsorption disc (2) and the lifting pin (11) in the height direction and are arranged on the periphery of the lifting pin (11) along the circumferential direction. The lifting pin (11) rises to the middle of each telescopic rod when the robot arm feeds the upper wafer (12) or the lower wafer (13); the telescopic rods are all installed on the cooling platform, and the telescopic rods comprise a fixed gear telescopic rod A (4), a fixed gear telescopic rod B (5), a supporting telescopic rod B (10), a buffer gear telescopic rod B (7), a notch gear telescopic rod (8), a buffer gear telescopic rod A (6) and a supporting telescopic rod A (9) arranged in sequence along the circumferential direction.

2. The wafer centering and alignment device according to claim 1, characterized in that: The connecting line between the fixed gear telescopic rod A (4) and the buffer gear telescopic rod B (7), the connecting line between the fixed gear telescopic rod B (5) and the buffer gear telescopic rod A (6), and the connecting line between the supporting telescopic rod A (9) and the supporting telescopic rod B (10) intersect at one point, and the connecting line between the fixed gear telescopic rod A (4) and the buffer gear telescopic rod B (7) is perpendicular to the connecting line between the fixed gear telescopic rod B (5) and the buffer gear telescopic rod A (6), and the notch gear telescopic rod (8) is located between the buffer gear telescopic rod A (6) and the buffer gear telescopic rod B (7).

3. The wafer centering and alignment device according to claim 1, characterized in that: The fixed gear telescopic rod A (4), the fixed gear telescopic rod B (5), the buffer gear telescopic rod A (6), the buffer gear telescopic rod B (7) and the notch gear telescopic rod (8) are arranged at the same height and are higher than the height of the supporting telescopic rod A (9) and the supporting telescopic rod B (10).

4. The wafer centering and alignment device according to claim 1, characterized in that: The cooling platform includes a cooling platform A (3) and a cooling platform B (48), wherein the cooling platform A (3) and the cooling platform B (48) are both annular and concentrically arranged, and the cooling platform B (48) is located outside the cooling platform A (3) and lower than the cooling platform A (3); the cooling platform A (3) and the cooling platform B (48) have the same structure and are both provided with cooling water channels inside, and the cooling platform A (3) and the cooling platform B (48) are both provided with water inlets and water outlets connected to the cooling water channels; the fixed gear telescopic rod A (4), the fixed gear telescopic rod B (5), the buffer gear telescopic rod A (6), the buffer gear telescopic rod B (7) and the notch gear telescopic rod (8) are respectively fixed on the cooling platform A (3), and the supporting telescopic rod A (9) and the supporting telescopic rod B (10) are respectively fixed on the cooling platform B (48).

5. The wafer centering and alignment device according to claim 4, characterized in that: The outer diameter of the upper end of the lifting pin (11) is smaller than the inner diameter of the cooling platform A (3) and the cooling platform B (48).

6. The wafer centering and alignment device according to claim 1, characterized in that: The fixed-gear telescopic rod A (4) and the fixed-gear telescopic rod B (5) have the same structure, both comprising an electric cylinder A (16), a base A (17) and a push rod A (18), wherein the base A (17) is fixed on the cooling platform, the electric cylinder A (16) is mounted on the base A (17), one end of the push rod A (18) is connected to the output end of the electric cylinder A (16), the electric cylinder A (16) drives the push rod A (18) to slide back and forth on the base A (17), and the other end of the push rod A (18) is used to contact the upper wafer (12) or the lower wafer (13).

7. The wafer centering and alignment device according to claim 1, characterized in that: The buffer gear telescopic rod A (6) and the buffer gear telescopic rod B (7) have the same structure, and both include an electric cylinder B (21), a base B (22), a fixed seat A (25), a connecting shaft A (28), a spring A (29) and a push rod B (30). The base B (22) is fixed on the cooling platform, and the electric cylinder B (21) is installed on the base B (22). The bottom of the fixed seat A (25) is connected to the output end of the electric cylinder B (21). The electric cylinder B (21) drives the fixed seat A (25) to slide back and forth on the base B (22). A connecting shaft A (28) is installed on the top of the fixed seat A (25), one end of the push rod B (30) is connected to the connecting shaft A (28) so as to be relatively movably, and a spring A (29) is sleeved on the connecting shaft A (28) between one end of the push rod B (30) and the top of the fixed seat A (25), the two ends of the spring A (29) respectively abut against one end of the push rod B (30) and the top of the fixed seat A (25), and the other end of the push rod B (30) is used to contact the upper wafer (12) or the lower wafer (13).

8. The wafer centering and alignment device according to claim 1, characterized in that: The notch gear telescopic rod (8) includes an electric cylinder D (37), a base D (38), a fixed seat B (41), a connecting shaft B (44), a spring B (45) and a push rod C (46), wherein the base D (38) is fixed on the cooling platform, the electric cylinder D (37) is installed on the base D (38), the bottom of the fixed seat B (41) is connected to the output end of the electric cylinder D (37), the electric cylinder D (37) drives the fixed seat B (41) to slide back and forth on the base D (38), and the top of the fixed seat B (41) is installed A connecting shaft B (44) is provided, one end of the push rod C (46) is connected to the connecting shaft B (44) so ​​as to be relatively movable, and a spring B (45) is sleeved on the connecting shaft B (44) between one end of the push rod C (46) and the top of the fixed seat B (41), the two ends of the spring B (45) respectively abutting against one end of the push rod C (46) and the top of the fixed seat B (41), and the other end of the push rod C (46) is provided with a roller (47) for contacting the upper wafer notch (14) or the lower wafer notch (15).

9. The wafer centering and alignment device according to claim 1, characterized in that: The supporting telescopic rod A (9) and the supporting telescopic rod B (10) have the same structure, both comprising an electric cylinder C (31), a base C (32) and a support plate (35), wherein the base C (32) is fixed on the cooling platform, the electric cylinder C (31) is mounted on the base C (32), one end of the support plate (35) is connected to the output end of the electric cylinder C (31), and the electric cylinder C (31) drives the support plate (35) to slide back and forth on the base C (32), and the other end of the support plate (35) is in a "U" shape, and both sides of the "U"-shaped opening are provided with columns (36) for contacting the upper wafer (12) or the lower wafer (13).

10. A method for aligning a wafer with an adjustable centering device according to any one of claims 1 to 9, characterized in that: Includes the following steps Step A, preparing the upper wafer (12) for alignment; the lifting pin (11) rises to the middle of each telescopic rod, the robot places the upper wafer (12) on the lifting pin (11), the supporting telescopic rod A (9) and the supporting telescopic rod B (10) extend below the upper wafer (12), and after the lifting pin (11) falls below the supporting telescopic rod A (9) and the supporting telescopic rod B (10), the upper wafer (12) falls on the supporting telescopic rod A (9) and the supporting telescopic rod B (10); Step B, the upper wafer (12) is aligned; the notch gear telescopic rod (8) is extended and stuck in the upper wafer notch (14); the fixed gear telescopic rod A (4) and the fixed gear telescopic rod B (5) are extended at the same time and contact the edge of the upper wafer (12); under the action of the fixed gear telescopic rod A (4) and the fixed gear telescopic rod B (5), the notch gear telescopic rod (8) will be passively retracted; thereafter, the buffer gear telescopic rod A (6) and the buffer gear telescopic rod B (7) are extended and contact the edge of the upper wafer (12) to knock the upper wafer (12) to return the upper wafer (12) to its original position; the buffer gear telescopic rod A (6) and the buffer gear telescopic rod B (7) are retracted and reset, the notch gear telescopic rod (8) is retracted and reset, and the fixed gear telescopic rod A (4) and the fixed gear telescopic rod B (5) are retracted and reset at the same time; Step C, the upper wafer (12) is adsorbed; the lifting pin (11) rises, and the upper wafer (12) is lifted up by the supporting telescopic rod A (9) and the supporting telescopic rod B (10) to the lower surface of the upper adsorption disk (2); the upper adsorption disk (2) adsorbs the upper wafer (12), and the lifting pin (11) descends and resets; Step D, preparing the lower wafer (13) for alignment; the lifting pin (11) rises to the middle of each telescopic rod, the robot places the lower wafer (13) on the lifting pin (11), the supporting telescopic rod A (9) and the supporting telescopic rod B (10) extend below the lower wafer (13), and after the lifting pin (11) falls below the supporting telescopic rod A (9) and the supporting telescopic rod B (10), the lower wafer (13) falls on the supporting telescopic rod A (9) and the supporting telescopic rod B (10); In step E, the lower wafer (13) is aligned; the notch gear telescopic rod (8) is extended and stuck in the lower wafer notch (15); the fixed gear telescopic rod A (4) and the fixed gear telescopic rod B (5) are extended at the same time and contact the edge of the lower wafer (13); compared with the alignment of the upper wafer (12) in step B, the fixed gear telescopic rod A (4) and the fixed gear telescopic rod B (5) are extended less by a set distance Xmm; under the action of the fixed gear telescopic rod A (4) and the fixed gear telescopic rod B (5), the The notch gear telescopic rod (8) will be passively retracted; then, the buffer gear telescopic rod A (6) and the buffer gear telescopic rod B (7) are extended, contact the edge of the lower wafer (13) and knock the lower wafer (13), so that the lower wafer (13) and the upper wafer (12) are displaced by Xmm; the buffer gear telescopic rod A (6) and the buffer gear telescopic rod B (7) are retracted and reset, the notch gear telescopic rod (8) is retracted and reset, and the fixed gear telescopic rod A (4) and the fixed gear telescopic rod B (5) are retracted and reset at the same time; Step F, laminating the lower wafer (13); the lifting pin (11) rises, and the lower wafer (13) is lifted up by the supporting telescopic rod A (9) and the supporting telescopic rod B (10) to the lower surface of the upper wafer (12), so as to achieve staggered lamination of the upper wafer (12) and the lower wafer (13).

Images