Improvement method for grinding and detecting ceramic manipulator of character carving machine

Abstract

The invention discloses an improvement method for a ceramic manipulator of a grinding and detecting character carving machine, and particularly relates to the technical field of manipulator control, which comprises the following steps: S1, constructing a stepped vacuum channel; s2, assembling a composite functional ceramic chip; s3, integrating an intelligent sensing system; s4, dynamic sealing compensation is implemented; s5, deploying an intelligent diagnosis system; s6, implanting a thermal management module; and S7, carrying out surface functionalization treatment. By means of the integrated micro-channel sensing network and the intelligent diagnosis system, the manipulator can accurately capture and position extremely tiny vacuum leakage or sealing failure in real time, early warning of faults is achieved, accidental displacement or damage of a silicon wafer in the machining process is avoided, a built-in self-repairing mechanism is combined, and the machining efficiency is improved. By means of the method, some tiny interface damage caused by vibration or thermal circulation can be automatically repaired in the operation process, the non-planned shutdown requirement is lowered, the stability and reliability of long-term operation are enhanced, and dependence on external manual inspection tour and passive maintenance is reduced.

Description

Technical Field

[0001] The invention relates to the technical field of manipulator control, in particular to a method for improving a ceramic manipulator of a grinding, inspection and engraving machine. Background Art

[0002] In the semiconductor packaging process, the ceramic manipulator of the grinding, inspection and engraving machine is responsible for the picking, positioning and transportation of high-precision silicon wafers. Traditional manipulators are made of homogeneous ceramic materials (such as alumina), and their vacuum adsorption channels are mostly designed with equal depth. During high-speed operation, the adsorption force may fluctuate due to airflow separation, causing micro-displacement or even breakage of the silicon wafer. At the same time, the local high temperature (above 80°C) generated by the engraving process causes a 0.1mm sealing gap between the ceramic and the metal body due to the difference in thermal expansion coefficient, and the risk of vacuum leakage is significant. Although existing technologies have tried to alleviate the problem by adding sealing rings or optimizing the structure, they face three bottlenecks:

[0003] First, there is a lack of thermal management. The low thermal conductivity of ceramics causes heat to accumulate on the adsorption surface, and thermal deformation continues to accumulate and cannot be compensated in real time. Secondly, the perception ability is weak. Leak detection relies on external air pressure sensors, which cannot locate submillimeter damage points. Microcrack expansion is difficult to warn, and the durability is insufficient. Frequent contact with silicon wafers causes scratches on the ceramic surface, and the decline of silicon-repellent performance causes adhesion residue, requiring frequent shutdowns for maintenance. In addition, when traditional robots deal with high-frequency vibrations (above 200Hz), micron-level fatigue cracks are prone to occur on the mortise and tenon connection interface, and manual maintenance cannot intervene in such hidden damage in time.

[0004] Therefore, there is an urgent need for a systematic improvement solution that integrates intelligent perception, dynamic compensation and self-repair functions to meet the stringent requirements of semiconductor manufacturing for "zero particulate contamination and zero silicon wafer damage". Summary of the Invention

[0005] The main purpose of the present invention is to provide a method for improving the ceramic manipulator of a grinding and inspection cutting plotter, which can effectively solve the problems in the above-mentioned background technology.

[0006] To achieve the above object, the technical solution adopted by the present invention is:

[0007] A method for improving a ceramic manipulator for a grinding and inspection plotter includes the following steps:

[0008] S1. Construction of stepped vacuum channel: A step-type vacuum channel with gradually varying depth is machined on the surface of the robot body. A 0.1-0.3mm step difference is formed at the bottom of the channel. The channel sidewalls are machined with a 45° chamfer and laser micro-textured. A 0.5mm diameter buffer cavity is set at the end of the channel.

[0009] S2. Assembly of composite functional ceramic sheets: The silicon nitride-zirconia composite ceramic sheet is embedded in the mounting groove. A mortise and tenon positioning structure is set on the bottom of the ceramic sheet to match the mounting groove. A 0.05mm thick conductive graphene layer is integrated on the top. A self-healing adhesive containing microcapsules is injected using a vacuum-assisted capillary infiltration process.

[0010] S3, Intelligent Sensing System Integration: Self-test microchannels with a width of 0.2 mm are arranged parallel to both sides of the vacuum channel. MEMS pressure sensor arrays are arranged at equal intervals within the channel. The sensors form a closed loop with the external diagnostic module through the conductive graphene layer;

[0011] S4. Dynamic sealing compensation implementation: Plasma activation treatment is used to enhance the activity of the bonding surface. A shape memory alloy compensation ring is set on the edge of the ceramic sheet. When the temperature is 80-85°C, a radial expansion of 0.05-0.08mm is generated to compensate for thermal deformation.

[0012] S5. Intelligent Diagnostic System Deployment: Deploy a diagnostic model based on an LSTM neural network, integrating pressure sensor data with manipulator motion parameters in real time, and visualizing the leak location through a 3D heat map with a positioning accuracy of 0.1mm.

[0013] S6. Thermal management module implantation: A micro heat pipe array with a diameter of 0.5 mm is embedded inside the ceramic sheet. The heat pipe is filled with a paraffin-based material with a phase change temperature of 58°C. The evaporation section is in contact with the heat source area of ​​the vacuum channel, and the condensation section extends to the heat dissipation fins on the edge of the manipulator.

[0014] S7. Surface functionalization treatment: A 2μm thick diamond-like silicophobic coating is deposited on the surface of the ceramic wafer using a magnetron sputtering process with a contact angle of 150°-155°. At the same time, ion implantation is performed to form a surface compressive stress layer, and the residual stress value is controlled at -200 to -300 MPa.

[0015] Preferably, the depth difference of the gradual vacuum channel in the S1 step is 0.1-0.3 mm, the chamfer angle is 45±2°, the laser micro-texturing treatment forms a regular hexagonal pit array with a pit depth of 10-15 μm and a spacing of 50 μm. The buffer cavity is hemispherical with a diameter of 0.5 mm and a distance from the end of the channel to 0.8 mm. The surface of the cavity is subjected to a chemical vapor deposition silicon carbide coating with a thickness of 2 μm.

[0016] Preferably, the silicon nitride content of the composite ceramic sheet in step S2 is 60-65 vol%, the mortise and tenon structure comprises three groups of asymmetric dovetail tenons, the tenon height is 0.2 mm, and the inclination angle is 55°, the conductive graphene layer is grown by chemical vapor deposition, and silver nanowires are embedded between the layers with a wire diameter of 40-50 nm, and the self-healing adhesive contains two-component microcapsules, including an epoxy resin repair agent and a curing agent, and the capsule diameter is 10-15 μm.

[0017] Preferably, the center distance between the self-inspection microchannel and the vacuum channel in step S3 is 0.5 mm, and MEMS piezoresistive sensors are arranged every 2 mm in the channel. The sensors are connected through the interdigital electrodes of the conductive graphene layer to form a three-wire measurement circuit, and the sensor sampling frequency is 1-1.2 kHz.

[0018] Preferably, the shape memory alloy compensation ring in step S4 is a Ti-Ni-Cu alloy with a phase transition temperature of 80±2°C, the expansion amount is regulated by laser selective melting, and the ring body is provided with a wavy pleated structure with a pleat amplitude of 0.1mm and a wavelength of 0.5mm.

[0019] Preferably, the LSTM neural network in step S5 comprises three hidden layers, the input dimension is [pressure, temperature, vibration frequency, displacement velocity], the output layer is connected to the visualization engine, and the generated thermal map adopts a pseudo-color coding leakage location algorithm that integrates time-frequency analysis and wavelet transform.

[0020] Preferably, the micro heat pipe array in step S6 adopts a gradient porosity sintered core, 0.5 wt% graphene nanosheets are added to the phase change material, and an indium-based thermal pad with a thickness of 0.1 mm is provided between the heat pipe and the heat dissipation fin.

[0021] Preferably, the sp of the diamond-like coating 3 The bond content is 70%-75%, and the surface compressive stress layer is formed by nitrogen ion implantation with an implantation energy of 50keV and a dose of 5×10 17 ions / cm 2 The coating surface is processed with a micron-scale pyramid structure with a base length of 20 μm and a height of 5 μm.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] 1. Through the integrated microfluidic sensor network and intelligent diagnostic system, the present invention enables the manipulator to accurately capture and locate extremely small vacuum leaks or sealing failures in real time. This not only achieves early warning of faults and avoids accidental displacement or damage to silicon wafers during processing, but also combines a built-in self-repair mechanism so that certain minor interface damage caused by vibration or thermal cycling can be automatically repaired during operation, significantly reducing the need for unplanned downtime, enhancing the stability and reliability of long-term operation, and reducing dependence on external manual inspections and passive maintenance.

[0024] 2. This invention integrates active thermal management with passive intelligent compensation to ensure that the key sealing interface can maintain excellent fit even under severe temperature fluctuations, effectively preventing seal failure caused by thermal stress. At the same time, surface functionalization (such as a high-hardness, highly silicophobic diamond-like coating combined with a compressive stress layer) greatly improves the wear and scratch resistance of the ceramic surface and minimizes the risk of residue and adhesion during silicon wafer desorption. These measures work synergistically to significantly improve the robot's ability to maintain performance under harsh working conditions and effectively extend the service life of core components. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the overall process of the present invention. DETAILED DESCRIPTION

[0026] In order to make the technical means, creative features, objectives and effects achieved by the present invention easier to understand, the present invention is further described below in conjunction with specific implementation methods.

[0027] As shown in the figure, a method for improving the ceramic manipulator of a grinding and inspection plotter includes the following steps:

[0028] S1. Construction of stepped vacuum channel: A step-type vacuum channel with gradually varying depth is machined on the surface of the robot body. A 0.1-0.3mm step difference is formed at the bottom of the channel. The channel sidewalls are machined with a 45° chamfer and laser micro-textured. A 0.5mm diameter buffer cavity is set at the end of the channel.

[0029] S2. Assembly of composite functional ceramic sheets: The silicon nitride-zirconia composite ceramic sheet is embedded in the mounting groove. A mortise and tenon positioning structure is set on the bottom of the ceramic sheet to match the mounting groove. A 0.05mm thick conductive graphene layer is integrated on the top. A self-healing adhesive containing microcapsules is injected using a vacuum-assisted capillary infiltration process.

[0030] S3, Intelligent Sensing System Integration: Self-test microchannels with a width of 0.2 mm are arranged parallel to both sides of the vacuum channel. MEMS pressure sensor arrays are arranged at equal intervals within the channel. The sensors form a closed loop with the external diagnostic module through the conductive graphene layer;

[0031] S4. Dynamic sealing compensation implementation: Plasma activation treatment is used to enhance the activity of the bonding surface. A shape memory alloy compensation ring is set on the edge of the ceramic sheet. When the temperature is 80-85°C, a radial expansion of 0.05-0.08mm is generated to compensate for thermal deformation.

[0032] S5. Intelligent Diagnostic System Deployment: Deploy a diagnostic model based on an LSTM neural network, integrating pressure sensor data with manipulator motion parameters in real time, and visualizing the leak location through a 3D heat map with a positioning accuracy of 0.1mm.

[0033] S6. Thermal management module implantation: A micro heat pipe array with a diameter of 0.5 mm is embedded inside the ceramic sheet. The heat pipe is filled with a paraffin-based material with a phase change temperature of 58°C. The evaporation section is in contact with the heat source area of ​​the vacuum channel, and the condensation section extends to the heat dissipation fins on the edge of the manipulator.

[0034] S7. Surface functionalization treatment: A 2μm thick diamond-like silicophobic coating is deposited on the surface of the ceramic wafer using a magnetron sputtering process with a contact angle of 150°-155°. At the same time, ion implantation is performed to form a surface compressive stress layer, and the residual stress value is controlled at -200 to -300 MPa.

[0035] The depth difference of the gradient vacuum channel in the S1 step is 0.1-0.3 mm, and the chamfer angle is 45±2°. The laser microtexturing treatment forms a regular hexagonal pit array with a pit depth of 10-15 μm and a spacing of 50 μm. The buffer cavity is hemispherical with a diameter of 0.5 mm and a distance from the end of the channel to 0.8 mm. The surface of the cavity is subjected to a chemical vapor deposition silicon carbide coating with a thickness of 2 μm.

[0036] Specifically, the depth difference design of the gradient vacuum channel combined with a 45° chamfer forms a laminar flow guiding structure, effectively reducing the airflow separation phenomenon. The hexagonal pit array produced by laser micro-texturing forms a microscopic air cushion layer, reducing the contact area of ​​the silicon wafer while maintaining the adsorption force. The hemispherical design of the buffer cavity combined with the silicon carbide coating achieves a smooth transition of the airflow velocity and avoids the displacement of the silicon wafer caused by sudden changes in local vacuum degree.

[0037] The silicon nitride content of the composite ceramic sheet in step S2 is 60-65 vol%. The mortise and tenon structure includes three groups of asymmetric dovetail joints with a tenon height of 0.2 mm and an inclination angle of 55°. The conductive graphene layer is grown by chemical vapor deposition, and silver nanowires with a wire diameter of 40-50 nm are embedded between the layers. The self-healing adhesive contains two-component microcapsules, including an epoxy resin repair agent and a curing agent, and the capsule diameter is 10-15 μm.

[0038] The silicon nitride-zirconia gradient composite structure improves thermal shock resistance through phase change toughening mechanism. The volume effect produced by the zirconia phase change can inhibit crack propagation. The asymmetric dovetail design realizes the self-locking function of assembly and prevents the displacement accumulation caused by high-frequency vibration. Silver nanowires are embedded in the graphene layer to form a three-dimensional conductive network, which reduces the surface resistance to the level of 0.5Ω / sq, ensuring the stable transmission of weak sensor signals.

[0039] The center distance between the self-inspection microchannel and the vacuum channel in step S3 is 0.5 mm, and MEMS piezoresistive sensors are arranged every 2 mm in the channel. The sensors are connected through interdigital electrodes of the conductive graphene layer to form a three-wire measurement circuit, and the sensor sampling frequency is 1-1.2 kHz.

[0040] Furthermore, the parallel microchannel design forms a differential pressure detection system, which eliminates interference from environmental pressure fluctuations through real-time calculation of the pressure difference ratio between the main / detection channels. The interdigitated electrode layout combined with the three-wire measurement circuit reduces the influence of wire resistance by more than 90%. The 1-1.2kHz sampling frequency covers the spectral characteristics of the robot movement, ensuring that transient leakage events at the 10ms level are captured.

[0041] The shape memory alloy compensation ring in step S4 is a Ti-Ni-Cu alloy with a phase transition temperature of 80±2° C. The expansion amount is controlled by laser selective melting. The ring body is provided with a wavy pleated structure with a pleat amplitude of 0.1 mm and a wavelength of 0.5 mm.

[0042] The narrow hysteresis characteristics of Ti-Ni-Cu alloy (<5°C) ensure the shape recovery consistency when the temperature drops. The wavy pleated structure provides space for axial deformation compensation to avoid stress concentration in the ring body. The 0.05-0.08mm expansion amount has been optimized by finite element analysis and can maintain a sealing surface fit of 0.01mm at 80-85°C working conditions.

[0043] The LSTM neural network in step S5 contains three hidden layers, the input dimensions are [pressure, temperature, vibration frequency, displacement velocity], and the output layer is connected to the visualization engine. The generated thermal map adopts the pseudo-color coding leakage location algorithm to fuse time-frequency analysis and wavelet transform.

[0044] Furthermore, the three-dimensional convolutional LSTM network architecture can simultaneously process spatiotemporal features, screen effective vibration frequency components through a gating mechanism, and the pseudo-color coding engine maps the pressure gradient into the HSV color space to achieve visual highlighting of 0.1mm-level leak points. The time-frequency analysis module uses the S-transform algorithm to simultaneously locate abnormal signal components in the time and frequency domains.

[0045] The micro heat pipe array in step S6 uses a gradient porosity sintered core, and 0.5 wt% graphene nanosheets are added to the phase change material. An indium-based thermal pad with a thickness of 0.1 mm is provided between the heat pipe and the heat dissipation fin.

[0046] The gradient porosity sintered core creates a capillary pressure difference, driving the working fluid to penetrate rapidly in the evaporation section. Graphene nanosheets form a heat conduction chain in the phase change material, increasing the thermal conductivity to 8.2W / m·K. The plastic deformation characteristics of the indium-based thermal pad compensate for the assembly tolerance between the heat pipe and the heat sink fins, reducing the interface thermal resistance to 0.05K·cm 2 / W.

[0047] The sp 3 The bond content is 70%-75%, and the surface compressive stress layer is formed by nitrogen ion implantation with an implantation energy of 50keV and a dose of 5×10 17 ions / cm 2The coating surface is processed with a micron-scale pyramid structure with a base length of 20 μm and a height of 5 μm.

[0048] The pyramidal surface texture reduces the photon absorption rate through the geometric light trapping effect, which reduces the thermal radiation loss by 15%. The compressive stress field induced by nitrogen ion implantation and the high sp 3 The bond content works synergistically to increase the critical scratch load to 35N, and the surface energy is controlled to make the contact angle hysteresis of the silicon wafer less than 5°, ensuring clean separation during the desorption process.

[0049] Example 2

[0050] Implementation scenario: High-precision silicon wafer manufacturing workshop

[0051] Inside a Class 1,000 cleanroom at a semiconductor packaging factory, a grinding, inspection, and engraving machine was processing 150mm silicon wafers at a rate of 30 wafers per minute. The robot experienced unstable adsorption when frequently picking and placing the wafers, causing micro-displacement or edge cracking in 0.5% of the wafers. Simultaneously, the high-temperature engraving process (locally reaching 80°C) caused thermal deformation of the ceramic wafers and failure of the vacuum seal. To address this issue, a team of engineers launched a ceramic robot improvement project, with the goal of increasing adsorption stability to 99.98% and compensating for thermal deformation to 0.01mm.

[0052] S1: Constructing a stepped vacuum channel

[0053] First, the surface of the robot body (aluminum nitride ceramic substrate) is precision-machined, and an ultra-precision cutting process is used to etch a depth-gradient vacuum channel on the adsorption surface. A 0.2mm step difference is formed at the bottom of the channel (design value 0.1-0.3mm), and the side wall is processed with a 43° chamfer (tolerance ±2°) and laser micro-texturing treatment: a femtosecond laser is used to create a hexagonal pit array with a depth of 12μm and a spacing of 50μm on the inner wall of the channel.

[0054] A hemispherical buffer cavity with a diameter of 0.5 mm is machined 0.8 mm at the end of the channel, and a 2 μm silicon carbide coating is covered on the surface of the cavity by chemical vapor deposition. This structure guides laminar flow through step differences, and the pit array forms an air cushion effect. The buffer cavity smoothes out airflow mutations, reducing the fluctuation of silicon wafer adsorption force by 40%.

[0055] S2: Assembling composite functional ceramic sheets

[0056] A prefabricated silicon nitride-zirconia composite ceramic sheet (silicon nitride content 63 vol%) was embedded in the manipulator mounting slot. Three sets of asymmetric dovetail tenons (0.2 mm in height and 55° inclination) were designed on the bottom of the ceramic sheet, which precisely engaged with the mortise in the slot to achieve self-locking. A 0.05 mm thick conductive graphene layer was grown on the top of the ceramic sheet by chemical vapor deposition, and 45 nm diameter silver nanowires were embedded between the layers to form a three-dimensional conductive network. Subsequently, a vacuum-assisted capillary infiltration process was used to inject a self-healing adhesive containing two-component microcapsules (epoxy resin repair agent + curing agent, diameter 12 μm) into the mortise and tenon gaps. The adhesive filled the 0.1 mm microgap under capillary action. This structure reduced the surface resistance of the ceramic sheet to 0.5 Ω / sq, while giving the interface cracks the ability to self-heal.

[0057] S3: Integrated Intelligent Perception System

[0058] A self-test microchannel with a width of 0.2 mm was etched parallel to the vacuum channel at a distance of 0.5 mm on both sides. A MEMS piezoresistive sensor (32 in total) was arranged every 2 mm in the channel. The sensors were connected to form a three-wire circuit through interdigital electrodes on the graphene layer, and the sampling frequency was set to 1.1 kHz.

[0059] When the robot absorbs the silicon wafer, the main vacuum channel and the detection microchannel form a differential pressure system. The sensor compares the pressure difference ratio on both sides in real time, eliminating the interference of ambient air pressure fluctuations, and the influence of wire resistance is suppressed by more than 90%.

[0060] S4: Implementing dynamic seal compensation

[0061] The edge bonding surface of the ceramic sheet was activated by argon plasma to increase the surface energy to 72mN / m. Then, a Ti-Ni-Cu shape memory alloy compensation ring (phase change temperature 80°C) was installed. The ring body was designed with a wavy pleated structure (amplitude 0.1mm, wavelength 0.5mm).

[0062] When the engraving heat source raises the temperature to 82°C, the alloy ring expands radially by 0.06mm (design value 0.05-0.08mm), and the pleated structure releases the axial stress, so that the sealing gap between the ceramic sheet and the robot body is always maintained within 0.01mm.

[0063] S5: Deployment of intelligent diagnostic systems

[0064] A neural network based on three-dimensional convolutional LSTM is deployed: the input layer receives four-dimensional data: pressure, temperature (80°C operating conditions), vibration frequency (200Hz), and displacement velocity (0.5m / s); the three hidden layers filter effective features through a gating mechanism; and the output layer connects to the visualization engine.

[0065] When a sensor detects a pressure differential abnormality, the system activates the S-transform time-frequency analysis algorithm to locate the leak point within 10ms, and maps the pressure gradient into the HSV color space through pseudo-color coding, highlighting the 0.1mm leak location in red in the three-dimensional thermal map.

[0066] S6: Implanting thermal management module

[0067] A 0.5mm-diameter microchannel array is drilled into the composite ceramic sheet, embedded within it. A sintered copper powder gradient porosity heat pipe (60% porosity in the evaporation section, 40% in the condensation section) is then filled with a paraffin-based phase-change material (melting point 58°C) infused with 0.5wt% graphene nanosheets. The evaporation section aligns with the heat source area of ​​the vacuum channel, while the condensation section extends to the aluminum heat sink fins at the edge of the manipulator, separated by a 0.1mm-thick indium-based thermal pad.

[0068] Tests show that this structure increases the thermal conductivity of the heat pipe to 8.2W / m·K, reduces the temperature of the engraving area from 82°C to 75°C, and reduces thermal deformation by 70%.

[0069] S7: Surface functionalization

[0070] Finally, the surface of the ceramic sheet was subjected to magnetron sputtering deposition, and a 2 μm thick diamond-like coating (sp 3 bond content 72%, contact angle 152°), and then nitrogen ion implantation (energy 50keV, dose 5×10 17 ions / cm 2 ) to form a -250MPa compressive stress layer. Finally, a micron-scale pyramid array (base 20μm, height 5μm) was engraved by laser.

[0071] After treatment, the critical load of surface scratches reaches 35N, and the silicon-phobic properties make the silicon wafer desorption residue less than 5 particles / cm 2 , and the pyramid structure reduces thermal radiation loss by 15% through the light trapping effect.

[0072] The improved robotic arm operated continuously on the production line for 72 hours, handling 15,000 silicon wafers. The intelligent diagnostic system successfully detected three 0.15mm micro-leaks (all caused by vibration-induced changes in the gap between the mortise and tenon joints), and the self-healing adhesive sealed the cracks within 20 minutes. The shape memory alloy ring maintained a consistent expansion of 0.012mm over 81 temperature cycles, and the heat pipe array controlled the ceramic wafer temperature within a ±1°C fluctuation range. Ultimately, the silicon wafer displacement rate was reduced to 0.008%, the edge fracture rate was zero, and annual maintenance costs were reduced by 53%.

[0073] It should be noted that Figure 1 The one-way arrows represent the main process flow, and the two-way arrows represent the key coordination mechanisms.

[0074] The basic principles, main features, and advantages of the present invention are shown and described above. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and modifications are intended to fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A method for improving a ceramic manipulator for a grinding and inspection plotter, comprising the following steps: S1. Construction of stepped vacuum channel: A step-type vacuum channel with gradually varying depth is machined on the surface of the robot body. A 0.1-0.3mm step difference is formed at the bottom of the channel. The channel sidewalls are machined with a 45° chamfer and laser micro-textured. A 0.5mm diameter buffer cavity is set at the end of the channel. S2. Assembly of composite functional ceramic sheets: The silicon nitride-zirconia composite ceramic sheet is embedded in the mounting groove. A mortise and tenon positioning structure is set on the bottom of the ceramic sheet to match the mounting groove. A 0.05mm thick conductive graphene layer is integrated on the top. A self-healing adhesive containing microcapsules is injected using a vacuum-assisted capillary infiltration process. S3, Intelligent Sensing System Integration: Self-test microchannels with a width of 0.2 mm are arranged parallel to both sides of the vacuum channel. MEMS pressure sensor arrays are arranged at equal intervals within the channel. The sensors form a closed loop with the external diagnostic module through the conductive graphene layer; S4. Dynamic sealing compensation implementation: Plasma activation treatment is used to enhance the activity of the bonding surface. A shape memory alloy compensation ring is set on the edge of the ceramic sheet. When the temperature is 80-85°C, a radial expansion of 0.05-0.08mm is generated to compensate for thermal deformation. S5. Intelligent Diagnostic System Deployment: Deploy a diagnostic model based on an LSTM neural network, integrating pressure sensor data with manipulator motion parameters in real time, and visualizing the leak location through a 3D heat map with a positioning accuracy of 0.1mm. S6. Thermal management module implantation: A micro heat pipe array with a diameter of 0.5 mm is embedded inside the ceramic sheet. The heat pipe is filled with a paraffin-based material with a phase change temperature of 58°C. The evaporation section is in contact with the heat source area of ​​the vacuum channel, and the condensation section extends to the heat dissipation fins on the edge of the manipulator. S7. Surface functionalization treatment: A 2μm thick diamond-like silicophobic coating is deposited on the surface of the ceramic wafer using a magnetron sputtering process with a contact angle of 150°-155°. At the same time, ion implantation is performed to form a surface compressive stress layer, and the residual stress value is controlled at -200 to -300 MPa.

2. The method for improving the ceramic manipulator of a grinding and inspection cutting plotter according to claim 1, characterized in that: The depth difference of the gradient vacuum channel in the S1 step is 0.1-0.3 mm, and the chamfer angle is 45±2°. The laser microtexturing treatment forms a regular hexagonal pit array with a pit depth of 10-15 μm and a spacing of 50 μm. The buffer cavity is hemispherical with a diameter of 0.5 mm and a distance from the end of the channel to 0.8 mm. The surface of the cavity is subjected to a chemical vapor deposition silicon carbide coating with a thickness of 2 μm.

3. The method for improving the ceramic manipulator of a grinding and inspection plotter according to claim 1, characterized in that: The silicon nitride content of the composite ceramic sheet in step S2 is 60-65 vol%. The mortise and tenon structure includes three groups of asymmetric dovetail joints with a tenon height of 0.2 mm and an inclination angle of 55°. The conductive graphene layer is grown by chemical vapor deposition, and silver nanowires with a wire diameter of 40-50 nm are embedded between the layers. The self-healing adhesive contains two-component microcapsules, including an epoxy resin repair agent and a curing agent, and the capsule diameter is 10-15 μm.

4. The method for improving a ceramic manipulator for a grinding and inspection plotter according to claim 1, characterized in that: The center distance between the self-inspection microchannel and the vacuum channel in step S3 is 0.5 mm, and MEMS piezoresistive sensors are arranged every 2 mm in the channel. The sensors are connected through interdigital electrodes of the conductive graphene layer to form a three-wire measurement circuit, and the sensor sampling frequency is 1-1.2 kHz.

5. The method for improving the ceramic manipulator of a grinding and inspection plotter according to claim 1, characterized in that: The shape memory alloy compensation ring in step S4 is a Ti-Ni-Cu alloy with a phase transition temperature of 80±2° C. The expansion amount is controlled by laser selective melting. The ring body is provided with a wavy pleated structure with a pleat amplitude of 0.1 mm and a wavelength of 0.5 mm.

6. The method for improving a ceramic manipulator for a grinding and inspection plotter according to claim 1, characterized in that: The LSTM neural network in step S5 contains three hidden layers, the input dimensions are [pressure, temperature, vibration frequency, displacement velocity], and the output layer is connected to the visualization engine. The generated thermal map adopts the pseudo-color coding leakage location algorithm to fuse time-frequency analysis and wavelet transform.

7. The method for improving a ceramic manipulator for a grinding and inspection plotter according to claim 1, characterized in that: The micro heat pipe array in step S6 uses a gradient porosity sintered core, and 0.5 wt% graphene nanosheets are added to the phase change material. An indium-based thermal pad with a thickness of 0.1 mm is provided between the heat pipe and the heat dissipation fin.

8. The method for improving a ceramic manipulator for a grinding and inspection plotter according to claim 1, characterized in that: The sp 3 The bond content is 70%-75%, and the surface compressive stress layer is formed by nitrogen ion implantation with an implantation energy of 50keV and a dose of 5×10 17 ions / cm 2 The coating surface is processed with a micron-scale pyramid structure with a base length of 20 μm and a height of 5 μm.

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