A robotic arm and wafer cleaning process for testing various types of wafer products.

Abstract

This invention relates to the field of wafer fabrication technology, and proposes a robotic arm and wafer cleaning process for testing various types of wafer products. The robotic arm includes side grippers, a middle gripper, a first power component, and a second power component. Two side grippers are provided, each with both elastic and rigid gripping portions. The middle gripper is positioned between the two side grippers and also has a rigid gripping portion. The first power component adjusts the Y-axis distance between the two side grippers and simultaneously adjusts the X-axis distance between the side grippers and the middle gripper. The second power component drives the side grippers to rotate about the Z-axis. By incorporating a first power component, this invention allows adjustment of the distance between the two side grippers, thus accommodating the gripping of wafers of different sizes and specifications, and enabling the removal of wafers from stacking containers, making it highly convenient to use. Furthermore, it facilitates adjustment of the gripping direction of the side grippers, further improving the ease of application.

Description

Technical Field

[0001] This invention relates to the field of wafer fabrication technology, and in particular to a robotic arm and wafer cleaning process for testing various types of wafer products. Background Technology

[0002] With the technological development of electronic products, thinning has long been a mainstream development trend, so wafer thinning is also an inevitable requirement. During the wafer fabrication process, because wafers are hard and very brittle, they are prone to damage or even breakage during transfer and transportation, which can affect product yield. As a result, higher requirements are placed on wafer transfer equipment.

[0003] The existing invention patent application with publication number CN115122378A discloses a titanium alloy fixing claw for wafer clamping, in which a suction cup is used to pick up the wafer; another invention patent application with publication number CN115188701A discloses a clamping mechanism and a wafer gripping device, which uses a clamping claw to grip the wafer.

[0004] In the first solution, the wafer needs to be gripped from the side when the suction cup picks it up. However, existing wafers are often stacked in wafer containers and need to be removed from one side, making it impossible to grip them with a suction cup. Although the second solution grips the wafer from the side, the wafer container also limits or supports the wafer from the side, and the grippers in this solution cannot enter the container to clamp the side of the wafer. Therefore, none of the above solutions can be applied to the stacked wafer container structure, limiting their application. In addition, the second solution relies on changing contact blocks to grip wafers of different sizes, which is not convenient to operate. Summary of the Invention

[0005] In view of this, the present invention proposes a robotic arm and wafer cleaning process that can clamp stacked wafers, is versatile and easy to operate, and can be used for testing various types of wafer products, in order to solve the problems of limited application and inconvenient operation of existing wafer clamping devices.

[0006] The technical solution of this invention is implemented as follows:

[0007] On one hand, the present invention provides a robotic arm for testing various types of wafer products, including a side gripper, a middle gripper, a first power component, and a second power component, wherein...

[0008] There are two side grippers, and each side gripper has an elastic gripping part and a rigid gripping part;

[0009] The intermediate gripper is positioned between the two side grippers, and the intermediate gripper has a rigid clamping part;

[0010] The first power component is used to adjust the Y-axis distance between the two side grippers and simultaneously adjust the X-axis distance between the side grippers and the middle gripper.

[0011] The second power component is used to drive the side gripper to rotate around the Z-axis.

[0012] Based on the above technical solutions, preferably, it also includes a carrier frame, which comprises a top frame, a first linear module, a base frame, and a connecting frame, wherein...

[0013] The first power unit is installed on the top frame;

[0014] The first linear module is connected to the top frame;

[0015] The base frame is connected to the movable end of the first linear module;

[0016] The connecting frame is connected to the base frame and to the movable end of the first power component;

[0017] The second power unit is mounted on the base frame;

[0018] The middle gripper is hinged to the base frame.

[0019] Based on the above technical solutions, preferably, a third power component is also included. The third power component is used for spray cleaning of the wafer, or for adjusting the Y-axis distance between the two side grippers and simultaneously adjusting the X-axis distance between the side grippers and the middle gripper.

[0020] Based on the above technical solutions, preferably, it also includes a connecting rod and a bearing housing, wherein,

[0021] The third power component is a water pump, which is mounted on the base frame. The water pump's outlet pipe passes through the base frame and is rotatably connected to one end of a connecting rod. The other end of the connecting rod is hinged to the middle clamp.

[0022] The bearing housing is mounted on the base frame and rotates in conjunction with the outlet pipe of the water pump motor.

[0023] Based on the above technical solutions, preferably, it also includes a connecting rod and a bearing housing, wherein,

[0024] The third power component is a motor, which is mounted on the base frame. The output shaft of the motor passes through the base frame and is fixedly connected to one end of the connecting rod. The other end of the connecting rod is hinged to the middle gripper.

[0025] The bearing housing is mounted on the base frame and rotates with the output shaft of the motor.

[0026] The first power component is a cylinder. The connecting bracket is slidably connected to the piston rod of the cylinder, and the connecting bracket can be positioned relative to the piston rod of the cylinder.

[0027] Based on the above technical solutions, preferably, the system also includes a detection component and an industrial camera. The detection component includes a laser, a reflector, and a laser target.

[0028] There are two bearing housings arranged opposite each other;

[0029] The laser and the laser target are each mounted on a bearing housing;

[0030] The laser target is set on the middle gripper;

[0031] The industrial camera is mounted on the top frame, and the industrial camera corresponds to the middle gripper.

[0032] Based on the above technical solutions, preferably, the side gripper includes a support frame, a rodless cylinder, a second linear module, a bracket, and a gripper, wherein,

[0033] The support frame is connected to the output end of the second power component;

[0034] Both the rodless cylinder and the second linear module are connected to the support frame;

[0035] The bracket is connected to the movable end of the rodless cylinder and the second linear module;

[0036] There are two clamps on the bracket, which are opposite each other and can be opened and closed.

[0037] Based on the above technical solutions, preferably, the side gripper further includes an electromagnetic telescopic rod, an elastic element, an elastic sheet, a cleaning element, and a reset sheet, wherein,

[0038] The electromagnetic telescopic rod is connected to the bracket, and the movable end of the electromagnetic telescopic rod passes through the bracket and is connected to the clamp; the elastic element is set between the clamp and the bracket.

[0039] An elastic plate is provided at the end of the chuck, the elastic plate is an elastic clamping part, and the chuck is a rigid clamping part;

[0040] The cleaning component is disposed on one of the chucks, and the cleaning component is detachably embedded in the other chuck;

[0041] The reset plate is laid on the elastic plate and the clamp.

[0042] Based on the above technical solutions, preferably, the cleaning component includes a telescopic cylinder, a push block, a connecting block, and a telescopic rod, wherein,

[0043] The chuck has slots on both sides;

[0044] The telescopic cylinder is installed in the slot of one of the clamps;

[0045] The push block is connected to the piston rod of the telescopic cylinder, the push block is flush with the clamp on which the telescopic cylinder is installed, and is detachably embedded in another clamp;

[0046] The connecting block is set in the slot on the other side of the chuck, and the connecting block corresponds to the rodless cylinder;

[0047] One end of the telescopic rod is connected to the connecting block, and the other end is connected to the push block.

[0048] On the other hand, the present invention provides a wafer cleaning process, which utilizes the aforementioned robotic arm for testing various types of wafer products, and includes the following steps:

[0049] S1. The relative positions of the side gripper and the middle gripper are detected by the detection component to determine their initial positions.

[0050] S2. According to the wafer specifications, adjust the relative distance between the side grippers and the middle grippers using the first power component.

[0051] S3. According to the wafer specifications, adjust the orientation of the side grippers using the second power unit.

[0052] S4. With the middle gripper open, the robotic arm approaches the wafer, clamps it using the elastic gripping parts of the side grippers, and removes the wafer from the storage device.

[0053] S5. The wafer is held by the rigid clamping part of the middle gripper, and then the wafer is sent into the cleaning station by the movement of the robotic arm. The elastic clamping part of the side gripper is released.

[0054] S6. The third power unit uses a water pump. The water outlet pipe of the water pump is connected to the nozzle, and then the cleaning fluid is supplied to the water pump and sprayed onto the wafer for cleaning.

[0055] During operation, industrial cameras monitor the relative positions of the robotic arm's components and the wafer position in real time.

[0056] The robotic arm and wafer cleaning process of the present invention for testing various types of wafer products have the following advantages over the prior art:

[0057] (1) By setting the first power component, the distance between the two side grippers can be adjusted, so as to adapt to the gripping work of wafers of different sizes and specifications, and to make it convenient to grip the wafer from one side, and to take the wafer out of the stacking container, which is very convenient to use; at the same time, the side grippers can be rotated under the drive of the second power component, so as to make it convenient to adjust the gripping direction of the side grippers, further improving the convenience of application.

[0058] (2) By setting an intermediate clamp, after the side clamps take the wafer out of the container through the elastic clamping part, the intermediate clamps can then clamp the wafer through the rigid clamping part. In this way, the wafer can be protected from damage by the elastic clamping and the wafer position can be stabilized by the rigid clamping of the intermediate clamp, which is beneficial to improving the wafer transfer position accuracy.

[0059] By setting a third power component, which can be a motor, and the first power component, which can be a cylinder, the carrier for mounting the second power component and the side gripper is slidably connected to the piston rod of the cylinder through a connecting frame and can be positioned relative to the piston rod of the cylinder. In this way, the position of the middle gripper and the side gripper can be adjusted by selecting the first or third power component according to the working conditions, which further improves the convenience of application.

[0060] (3) By setting a third power component, which can be a water pump, it can be connected to the liquid supply pipeline and the nozzle to spray the wafer to achieve wafer cleaning. This eliminates the need for additional nozzles at the wafer cleaning station, further improving the integration of the equipment and reducing space occupation. At the same time, driven by the first power component, the third power component can be adjusted to adapt to the cleaning of wafers of different sizes and specifications.

[0061] (4) By setting up a detection component consisting of a laser, a reflector and a laser target, the position correction of the middle gripper and the side gripper can be realized, which helps to ensure the displacement accuracy of the gripper and thus avoids the deviation of the gripper; at the same time, the laser and the laser target are integrated on the bearing seat used to fix the third power component, which ensures the compactness of the structure.

[0062] (5) By setting up a cleaning component, it can scrape off the residue on the chuck and elastic sheet, thereby ensuring clamping accuracy and avoiding wafer damage. At the same time, the cleaning component is highly integrated inside the chuck, which has the advantages of small size and small space occupation.

[0063] (6) In this wafer cleaning process, during wafer transfer, the position of each gripper is corrected by the detection component, and the relative position of each component and the wafer is monitored in real time by an industrial camera. This can effectively improve the wafer transfer accuracy, thereby avoiding wafer damage and ensuring the normal operation of the cleaning work. Attached Figure Description

[0064] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0065] Figure 1 This is a perspective view of the robotic arm for testing various types of wafer products according to the present invention;

[0066] Figure 2 For the present invention Figure 1 Enlarged view of the structure at point A in the image;

[0067] Figure 3 This is a front view of the robotic arm for testing various types of wafer products according to the present invention.

[0068] Figure 4 This is a top view of the robotic arm for testing various types of wafer products according to the present invention;

[0069] Figure 5 This is a side view of the robotic arm for testing various types of wafer products according to the present invention;

[0070] Figure 6 This is a perspective view of the side gripper of the robotic arm for testing various types of wafer products according to the present invention;

[0071] Figure 7 This is a diagram showing the internal structure of the side gripper of the robotic arm used for testing various types of wafer products according to the present invention.

[0072] Figure 8 This is a diagram showing the open structure of the side gripper of the robotic arm for testing various types of wafer products according to the present invention.

[0073] Figure 9 For the present invention Figure 8 Enlarged view of the structure at point B;

[0074] Figure 10 This is a back view of the side gripper structure of the robotic arm for testing various types of wafer products according to the present invention;

[0075] Figure 11 This is a structural diagram of the third power component of the robotic arm for testing various types of wafer products according to the present invention;

[0076] In the diagram: 1. Side gripper; 11. Support frame; 12. Rodless cylinder; 13. Second linear module; 14. Bracket; 15. Clamp; 16. Electromagnetic telescopic rod; 17. Elastic element; 18. Elastic sheet; 19. Cleaning component; 111. Reset piece; 191. Telescopic cylinder; 192. Push block; 193. Connecting block; 194. Telescopic rod; 101. Groove; 2. Intermediate gripper; 3. First power component; 4. Second power component; 5. Carrier frame; 51. Top frame; 52. First linear module; 53. Base frame; 54. Connecting frame; 6. Third power component; 7. Connecting rod; 8. Bearing seat; 9. Detection component; 91. Laser; 92. Reflector; 93. Laser target; 10. Industrial camera. Detailed Implementation

[0077] The technical solutions of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0078] like Figures 1-11 As shown, the robotic arm for testing various types of wafer products of the present invention includes a side gripper 1, a middle gripper 2, a first power component 3, a second power component 4, a carrier 5, a third power component 6, a connecting rod 7, a bearing seat 8, a detection component 9, and an industrial camera 10. The robotic arm for testing various types of wafer products of the present invention can be applied in various processes of wafer processing, such as wafer marking, drilling, cutting laser equipment, laser testing equipment, wafer cleaning equipment, etc., and can also be used in wafer stacking equipment.

[0079] like Figures 1-5 As shown, there are two side grippers 1, each with an elastic gripping portion and a rigid gripping portion; the middle gripper 2 is positioned between the two side grippers 1, and the middle gripper 2 has a rigid gripping portion; the first power member 3 is used to adjust the Y-axis distance between the two side grippers 1, and simultaneously adjust the X-axis distance between the side grippers 1 and the middle gripper 2; the second power member 4 is used to drive the side grippers 1 to rotate around the Z-axis.

[0080] As described above, there are two side grippers 1. The Y-axis spacing between the two side grippers 1 can be adjusted by the first power component 3, so as to make the two side grippers 1 relatively close or far apart. In this way, wafers of different sizes can be gripped, thus ensuring good versatility.

[0081] Meanwhile, it is convenient to clamp the wafer from one side, and can remove the wafer from the stacking container, which is very convenient to use; and the side gripper 1 can rotate under the drive of the second power component 4, which makes it easy to adjust the clamping direction and is beneficial for clamping smaller wafers. It can clamp the wafer not only from one side, but also from both sides, which further improves the convenience of application.

[0082] In specific operation, after the side jaw 1 takes the wafer out of the container through the elastic clamping part, the middle jaw 2 clamps the wafer through the rigid clamping part. In this way, the elastic clamping can be used to avoid damage to the wafer, and the rigid clamping of the middle jaw can be used to ensure the stability of the wafer position, which is conducive to improving the wafer transfer position accuracy.

[0083] In this structure, the intermediate gripper 2 will also move in response to the action of the first power component 3, thereby adaptively adjusting its distance on the X-axis to adapt to the wafer gripping operation and improve the reliability of the operation.

[0084] like Figures 1-4 As shown, the carrier 5 includes a top frame 51, a first linear module 52, a base frame 53, and a connecting frame 54. A first power component 3 is mounted on the top frame 51; the first linear module 52 is connected to the top frame 51; the base frame 53 is connected to the movable end of the first linear module 52; the connecting frame 54 is connected to the base frame 53 and also to the movable end of the first power component 3; a second power component 4 is mounted on the base frame 53; and the intermediate gripper 2 is hinged to the base frame 53.

[0085] As described above, the top frame 51 serves as a connection base, connecting to wafer processing equipment such as a cleaning machine. Specifically, the top frame 51 connects to a three-axis displacement mechanism, such as a robotic arm, and then connects to wafer processing equipment such as a cleaning machine through the three-axis displacement mechanism.

[0086] The first linear module 52 uses a slide rail slider. The slide rail is connected to the top frame 51, the slider slides with the slide rail, and is connected to the base frame 53, thereby mounting the second power component 4 and the side gripper 1.

[0087] The connecting frame 54 serves as a connector so that the movement of the first power component 3 can drive the base frame 53, the second power component 4, and the side grippers 1 to move, thereby adjusting the distance between the two side grippers 1.

[0088] Specifically, the first power component 3 is a cylinder;

[0089] The middle gripper 2 is hinged to the base frame 53 to avoid interfering with the adjustment of the two side grippers 1.

[0090] like Figure 11 As shown, the third power component 6 is used for spray cleaning of the wafer, or for adjusting the Y-axis distance between the two side grippers 1, and simultaneously adjusting the X-axis distance between the side grippers 1 and the middle gripper 2.

[0091] As described above, the third power component 6 is a functional component that can be selected according to specific needs. It can be used as an adjustment power component or a cleaning power component to adjust the position of the grippers or to perform spray cleaning on the wafer.

[0092] Specifically, the third power component 6 is a water pump, which is mounted on the base frame 53. The water pump's outlet pipe passes through the base frame 53 and is rotatably connected to one end of the connecting rod 7. The other end of the connecting rod 7 is hinged to the intermediate gripper 2. The bearing seat 8 is mounted on the base frame 53 and is rotatably engaged with the water pump motor's outlet pipe.

[0093] As described above, in some embodiments, the third power component 6 is configured as a water pump, and its end outlet pipe is rotatably connected to the connecting rod 7. The connecting rod 7 is also rotatably connected to the intermediate gripper 2. Thus, when the spacing between the two side grippers 1 is adjusted, the intermediate gripper 2 will move on the X-axis under the drive of the connecting rod 7, which can avoid interference with the adjustment action and also realize the adjustment of the relative wafer position.

[0094] In this structure, the water outlet pipe is used as a rotating shaft and also for spraying. When the third power component 6 is a water pump, it can be connected to the liquid supply pipeline and the water outlet pipe can be connected to the nozzle to spray the wafer for cleaning. This eliminates the need for additional nozzles at the wafer cleaning station, further improving the integration of the equipment and reducing space occupation. At the same time, driven by the first power component 3, the water pump of the third power component 6 can be adjusted to adapt to the cleaning of wafers of different sizes and specifications.

[0095] In some embodiments, the spraying device for spray cleaning is integrated into the cleaning station, which can prevent the spray liquid from spilling out. In this case, the water pump can be replaced with an air pump to dry the cleaned wafers.

[0096] When adjusting the distance between the two side jaws 1, for larger wafers, the distance between the two side jaws 1 is larger. As the two side jaws 1 open, the middle jaw 2 will also approach the wafer. After the elastic clamping part of the side jaws 1 pulls the wafer out of the container, the rigid clamping part of the middle jaw 2 clamps the wafer. This can ensure the stability of wafer clamping.

[0097] Specifically, the elastic clamping part also has a certain rigidity to avoid unstable clamping of the wafer. It is used to compensate for the assembly error of the transfer system and the structural error of the wafer container. This can avoid wafer displacement or slight angular flipping interference that could damage the container caused by direct rigid clamping.

[0098] When dealing with smaller wafers, the distance between the two side grippers 1 is small. As the two side grippers 1 get closer, the middle gripper 2 will move away from the wafer. At this time, only the side grippers 1 are needed to hold the wafer, and the middle gripper 2 does not need to participate. This optimizes the gripping process and can also avoid interference with other components during the transfer process when the middle gripper 2 is too close.

[0099] Among them, the bearing housing 8 is used to improve the stability of the installation of the third power component 6.

[0100] Specifically, during the clamping action, if the wafer is stuck and fixed, it is clamped and pulled out by the elastic clamping part, and then clamped by the middle jaw 2. This can avoid the problem of a part of the wafer being lifted up and interfering with the container when it is clamped.

[0101] If the wafer is simply held in place, it can also be directly clamped by the rigid clamping part of the side gripper 1; preferably, a soft pad is provided on the clamping surface of the rigid clamping part.

[0102] In some embodiments, the third power component 6 is a motor, which is mounted on the base frame 53 and the output shaft of the motor passes through the base frame 53 and is fixedly connected to one end of the connecting rod 7. The other end of the connecting rod 7 is hinged to the intermediate gripper 2. The bearing seat 8 is mounted on the base frame 53 and rotates with the output shaft of the motor. The first power component 3 is a cylinder, and the connecting frame 54 is slidably connected to the piston rod of the cylinder. The connecting frame 54 can be positioned relative to the piston rod of the cylinder.

[0103] As described above, the third power component 6 is a motor, and its output shaft is fixedly connected to the connecting rod 7. In this way, when the two third power components 6 move synchronously, the position of the middle gripper 2 on the Y-axis will not change, but the position of the two side grippers 1 on the Y-axis will change, so that the two side grippers 1 move closer or further away from the middle gripper 2 synchronously, thereby achieving position adjustment.

[0104] Specifically, in this structure, the connecting frame 54 is to slide with the piston rod of the cylinder that serves as the first power component 3, so that when the third power component 6 is activated, the cylinder does not need to extend or retract synchronously, thereby achieving single-power component drive adjustment;

[0105] Specifically, the connecting bracket 54 can be selectively positioned with the piston rod, so that in the event of a failure of the third power component 6, the motor can be removed, and the position adjustment of the side gripper 1 and the middle gripper 2 can be achieved by relying on the first power component 3.

[0106] Specifically, in this structure, the middle gripper 2 slides with the carrier 5 through a linear module to prevent the middle gripper 2 and the side gripper 1 from deviating to one side simultaneously.

[0107] Specifically, either the first power component 3 or the third power component 6 can be used for driving, and the appropriate option can be selected based on the working conditions, thereby improving the convenience of application.

[0108] like Figure 3 As shown, the detection component 9 includes a laser 91, a reflector 92, and a laser target 93. There are two bearing seats 8 arranged opposite each other. The laser 91 and the laser target 93 are each set on one bearing seat 8. The laser target 93 is set on the intermediate gripper 2. The industrial camera 10 is set on the top frame 51 and corresponds to the intermediate gripper 2.

[0109] As described above, the detection component 9 is used to detect the relative position of the two side grippers 1 and the middle gripper 2;

[0110] Specifically, during operation, the laser 91 is fixed relative to one of the side grippers 1 via the bearing seat 8 and the carrier 5, the laser target 93 is fixed relative to the other side gripper 1, and the reflector 92 is fixed relative to the middle gripper 2. Thus, during operation, the laser emitted by the laser 91 is reflected by the reflector 92 and received by the laser target 93. By observing the position of the laser landing point on the laser target 93, the optical path angle and the attitude of the connecting rod 7 can be determined, thereby determining the relative position of the side gripper 1 and the middle gripper 2. This enables the position correction of the three grippers and real-time monitoring to determine the action accuracy, which helps to ensure the transfer accuracy of the wafer.

[0111] The industrial camera 10 is mounted on the top frame 51, which allows it to detect the position of each gripper and the wafer position in real time, thereby ensuring that the operation is carried out normally.

[0112] like Figures 6-10 As shown, the side gripper 1 includes a support frame 11, a rodless cylinder 12, a second linear module 13, a bracket 14, and a clamp 15. The support frame 11 is connected to the output end of the second power component 4. The rodless cylinder 12 and the second linear module 13 are both connected to the support frame 11. The bracket 14 is connected to the movable ends of the rodless cylinder 12 and the second linear module 13. Two clamps 15 are arranged opposite each other on the bracket 14, and the two clamps 15 can be opened and closed.

[0113] As described above, the support frame 11 serves as a carrier for integrating other components of the side gripper 1;

[0114] The second linear module 13 is used to mount the bracket 14, and the chuck 15 is mounted on the bracket 14. The rodless cylinder 12 is connected to the support frame 11, and its movable end is connected to the bracket 14. Thus, when the rodless cylinder 12 is working, it can drive the chuck 15 to slide through the second linear module 13, thereby realizing the adjustment of the side gripper 1 on the X-axis, thereby further improving the degree of freedom of movement.

[0115] The chuck 15 is used to hold the wafer.

[0116] like Figure 7 As shown, the side gripper 1 also includes an electromagnetic telescopic rod 16, an elastic element 17, an elastic sheet 18, a cleaning element 19, and a reset piece 111. The electromagnetic telescopic rod 16 is connected to the bracket 14, and the movable end of the electromagnetic telescopic rod 16 passes through the bracket 14 and is connected to the gripper 15. The elastic element 17 is disposed between the gripper 15 and the bracket 14. The elastic sheet 18 is disposed at the end of the gripper 15, and the elastic sheet 18 is an elastic clamping part, while the gripper 15 is a rigid clamping part. The cleaning element 19 is disposed on one of the grippers 15, and the cleaning element 19 is detachably embedded in the other gripper 15. The reset piece 111 is laid on the elastic sheet 18 and the gripper 15.

[0117] As described above, in the side gripper 1 structure, the electromagnetic telescopic rod 16 is used to drive the two grippers 15 to separate relative to each other. Then, the coil of the electromagnetic telescopic rod 16 is de-energized, and the two grippers 15 are driven to move closer together by the action of the elastic element 17, thereby clamping the wafer.

[0118] Among them, the elastic element 17 adopts a spring and a guide rod. One end of the guide rod is connected to the clamp 15, and the other end passes through the bracket 14 to realize sliding guidance. The spring is sleeved on the guide rod and placed between the clamp 15 and the bracket 14. Specifically, the bracket 14 adopts a U-shaped frame with a side opening to facilitate the installation of two clamps 15.

[0119] Among them, the chuck 15 is a rigid clamping part, and an elastic piece 18 is installed at its end as an elastic clamping part to realize the clamping operation of the wafer; specifically, the middle jaw 2 has the same structure as the side jaw 1, but the middle jaw 2 does not have an elastic piece 18.

[0120] The device also includes a cleaning component 19, which is disposed on one of the chucks 15 and is detachably embedded in the other chuck 15. When the two chucks 15 are separated, the cleaning component 19 can clean the clamping surfaces of the chucks 15 and the elastic sheet 18, thereby preventing residues from affecting the wafer quality.

[0121] The reset piece 111 is used to correct the posture of the elastic piece 18. The reset piece 111 is composed of shape memory metal and heating wire. When the elastic piece 18 is deformed due to long-term use, the heating wire is energized to heat the shape memory metal, thereby driving the elastic piece 18 to reset. This can correct the shape of the flexible clamping part.

[0122] In some embodiments, the electromagnetic telescopic rod 16 is replaced by an electric push rod.

[0123] like Figures 7-10 As shown, the cleaning component 19 includes a telescopic cylinder 191, a push block 192, a connecting block 193, and a telescopic rod 194. The clamps 15 have slots 101 on both sides. The telescopic cylinder 191 is disposed within the slot 101 of one of the clamps 15. The push block 192 is connected to the piston rod of the telescopic cylinder 191, and is flush with the clamp 15 on which the telescopic cylinder 191 is mounted, and is detachably embedded within the other clamp 15. The connecting block 193 is disposed within the slot 101 on the other side of the clamp 15, and corresponds to the rodless cylinder 12. One end of the telescopic rod 194 is connected to the connecting block 193, and the other end is connected to the push block 192.

[0124] As described above, in order to ensure a compact structure, a slot 101 is provided on the chuck 15 for installing the cleaning component 19;

[0125] The telescopic cylinder 191 is installed in the slot 101 of one of the clamps 15, and is used to drive the push block 192 to move, such as... Figure 9 As shown, one side of the push block 192 abuts against the clamping surface of the chuck 15. After the coil of the electromagnetic telescopic rod 16 is energized, the two chucks 15 separate relative to each other, and wafer clamping can be performed. At this time, the part of the push block 192 that is embedded in the chuck 15 is also dislodged. With the action of the telescopic cylinder 191, the push block 192 is pushed between the two chucks 15. The coil of the electromagnetic telescopic rod 16 is de-energized. Under the elastic action of the elastic element 17, the two chucks 15 clamp the push block 192. At this time, the electric telescopic cylinder 191 continues to push the push block 192 to move, which can scrape the chuck 15 and the elastic sheet 18, thereby achieving the cleaning work.

[0126] The connecting block 193 is used to install the telescopic rod 194, which is also connected to the push block 192. This works in conjunction with the telescopic cylinder 191 to guide the push block 192, thereby ensuring the stability of the action.

[0127] Specifically, the connecting block 193 is not used as a driving component. It can be set to be relatively small and corresponds to the rodless cylinder 12. When the rodless cylinder 12 is activated, the slot 101 where the connecting block 193 is installed also serves as a clearance slot. When the chuck 15 moves into the support frame 11, the end of the rodless cylinder 12 can enter the slot 101. This simplifies the overall structure, makes it more compact and reasonable, and avoids component interference problems.

[0128] The wafer cleaning process of the present invention, using the robotic arm described above for testing various types of wafer products, includes the following steps:

[0129] S1. The relative positions of the side gripper 1 and the middle gripper 2 are detected by the detection component 9 to determine their initial positions.

[0130] S2. According to the wafer specifications, adjust the relative distance between the side gripper 1 and the middle gripper 2 using the first power component 3.

[0131] S3. According to the wafer specifications, adjust the orientation of the side gripper 1 using the second power unit 4.

[0132] S4. With the intermediate gripper 2 in the open state, the robotic arm then approaches the wafer, clamps the wafer using the elastic gripping part of the side gripper 1, and removes the wafer from the storage device.

[0133] S5. The wafer is held by the rigid clamping part of the middle gripper 2, and then the wafer is sent into the cleaning station by the movement of the robotic arm. The elastic clamping part of the side gripper 1 is released.

[0134] S6 and the third power unit 6 use a water pump. The water outlet pipe of the water pump is connected to the nozzle, and then cleaning fluid is supplied to the water pump and sprayed onto the wafer for cleaning.

[0135] During operation, the industrial camera 10 monitors the relative positions of the robotic arm components and the wafer position in real time.

[0136] Specifically, this robotic arm is mounted on a three-axis displacement platform to further improve the degree of freedom of movement.

[0137] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A robot for testing a plurality of categories of wafer products, characterized by: Including side clamping jaw (1), intermediate clamping jaw (2), first power element (3), second power element (4) and third power element (6), wherein, The side clamping jaw (1) is provided with two, and the side clamping jaw (1) has a resilient clamping part and a rigid clamping part, the side clamping jaw (1) is provided with two chuck (15), two chuck (15) can be opened and closed, the chuck (15) is the rigid clamping part; The intermediate clamping jaw (2) is arranged between the two side clamping jaws (1), the intermediate clamping jaw (2) is the same as the side clamping jaw (1) in structure, the intermediate clamping jaw (2) has a rigid clamping part, and the intermediate clamping jaw (2) is not provided with a resilient clamping part; The first power element (3) is used for adjusting the Y axis spacing of the two side clamping jaws (1), and synchronously adjusting the X axis spacing of the side clamping jaw (1) and the intermediate clamping jaw (2); The second power element (4) is used for driving the side clamping jaw (1) to rotate around the Z axis; The third power element (6) is used for spraying and cleaning the wafer, or is used for adjusting the Y axis spacing of the two side clamping jaws (1), and synchronously adjusting the X axis spacing of the side clamping jaw (1) and the intermediate clamping jaw (2).

2. The robot for multi-species wafer product testing of claim 1, wherein: Further comprising a carrier (5), the carrier (5) comprises a top frame (51), a first linear module (52), a bottom frame (53) and a connecting frame (54), wherein, The first power element (3) is arranged on the top frame (51); The first linear module (52) is connected with the top frame (51); The bottom frame (53) is connected with the movable end of the first linear module (52); The connecting frame (54) is connected with the bottom frame (53) and the movable end of the first power element (3); The second power element (4) is arranged on the bottom frame (53); The intermediate clamping jaw (2) is hinged with the bottom frame (53).

3. The robot for multi-species wafer product testing of claim 2, wherein: Further comprising a connecting rod (7) and a bearing seat (8), wherein, The third power element (6) is a water pump, the water pump is arranged on the bottom frame (53), and the water outlet pipe of the water pump penetrates through the bottom frame (53) and is rotatably connected with one end of the connecting rod (7), the other end of the connecting rod (7) is hinged with the intermediate clamping jaw (2); The bearing seat (8) is arranged on the bottom frame (53) and is rotatably matched with the water outlet pipe of the water pump motor.

4. The robot for multi-species wafer product testing of claim 2, wherein: Further comprising a connecting rod (7) and a bearing seat (8), wherein, The third power element (6) is a motor, the motor is arranged on the bottom frame (53), and the output shaft of the motor penetrates through the bottom frame (53) and is fixedly connected with one end of the connecting rod (7), the other end of the connecting rod (7) is hinged with the intermediate clamping jaw (2); The bearing seat (8) is arranged on the bottom frame (53) and is rotatably matched with the output shaft of the motor; The first power element (3) is a gas cylinder, the connecting frame (54) is slidably connected with the piston rod of the gas cylinder, and the connecting frame (54) can be positioned relative to the piston rod of the gas cylinder.

5. The robot for multi-species wafer product testing of claim 3, wherein: Further comprising a detection assembly (9) and an industrial camera (10), the detection assembly (9) comprises a laser (91), a mirror (92) and a laser target (93), wherein, The bearing seat (8) is oppositely provided with two; The laser (91) and the laser target (93) are respectively arranged on one of the bearing seats (8); The laser target (93) is arranged on the middle clamp jaw (2); The industrial camera (10) is arranged on the top frame (51), and the industrial camera (10) corresponds to the middle clamp jaw (2).

6. The robot for testing of multi-type wafer products according to any one of claims 1 to 5, wherein: The side clamp jaw (1) comprises a support frame (11), a rodless cylinder (12), a second linear module (13) and a bracket (14), wherein, The support frame (11) is connected with the output end of the second power member (4); The rodless cylinder (12) and the second linear module (13) are both connected with the support frame (11); The bracket (14) is connected with the movable end of the rodless cylinder (12) and the second linear module (13); The chuck (15) is arranged on the bracket (14).

7. The robot for multi-species wafer product testing of claim 6, wherein: The side clamp jaw (1) further comprises an electromagnetic telescopic rod (16), an elastic member (17), an elastic sheet (18), a cleaning member (19) and a reset sheet (111), wherein, The electromagnetic telescopic rod (16) is connected with the bracket (14), and the movable end of the electromagnetic telescopic rod (16) penetrates through the bracket (14) and is connected with the chuck (15); The elastic member (17) is arranged between the chuck (15) and the bracket (14); The elastic sheet (18) is arranged at the end of the chuck (15), the elastic sheet (18) is the elastic clamping part, and the chuck (15) is the rigid clamping part; The cleaning member (19) is arranged on one of the chucks (15), and the cleaning member (19) is detachably embedded in the other chuck (15); The reset sheet (111) is laid on the elastic sheet (18) and the chuck (15).

8. The robot for multi-species wafer product testing of claim 7, wherein: The cleaning member (19) comprises a telescopic cylinder (191), a push block (192), a connecting block (193) and a telescopic rod (194), wherein, Both sides of the chuck (15) are provided with notches (101); The telescopic cylinder (191) is arranged in the notch (101) of one of the chucks (15); The push block (192) is connected with the piston rod of the telescopic cylinder (191), the push block (192) is flush with the chuck (15) on which the telescopic cylinder (191) is arranged, and the push block (192) is detachably embedded in the other chuck (15); The connecting block (193) is arranged in the notch (101) on the other side of the chuck (15), and the connecting block (193) corresponds to the rodless cylinder (12); One end of the telescopic rod (194) is connected with the connecting block (193), and the other end is connected with the push block (192).

9. A wafer cleaning process using the robot for testing a plurality of wafer products according to claim 5, wherein, The method comprises the following steps: S1, detecting the relative position of the side clamping jaw (1) and the middle clamping jaw (2) by the detection assembly (9), and determining the initial position of the two, S2, adjusting the relative distance between the side clamping jaw (1) and the middle clamping jaw (2) by the first power component (3) according to the wafer specification, S3, adjusting the orientation of the side clamping jaw (1) by the second power component (4) according to the wafer specification, S4, the middle clamping jaw (2) is in an open state, then the mechanical arm approaches the wafer, the wafer is clamped by the elastic clamping part of the side clamping jaw (1), and the wafer is taken out from the storage device, S5, the wafer is clamped by the rigid clamping part of the middle clamping jaw (2), then the wafer is sent into the cleaning station by moving the mechanical arm, and the elastic clamping part of the side clamping jaw (1) is loosened, S6, the third power component (6) adopts a water pump, the water outlet pipe of the water pump is connected to a spray head, then cleaning liquid is supplied to the water pump, and the wafer is sprayed and cleaned by the spray head. Wherein, in the working process, the industrial camera (10) detects the relative position of each part of the mechanical arm and the position of the wafer in real time.

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