Detachable anti-slip smart phone rear cover structure

Abstract

The invention discloses a detachable anti-slip smart phone rear cover structure, and relates to the field of smart phone rear covers, the detachable anti-slip smart phone rear cover structure comprises a rear cover body, a bending part of the rear cover body is provided with a plurality of clamping parts, and the clamping parts are used for being movably clamped with a mobile phone shell; the inner wall of the rear cover body is provided with a plurality of heat dissipation attached sheets, and the heat dissipation attached sheets are respectively matched with a mainboard and a battery in a mobile phone shell to achieve heat dissipation. According to the mobile phone rear cover disclosed by the invention, the clamping part is arranged at the bent end of the rear cover body and is matched with the bulge of the mobile phone shell, so that the mobile phone rear cover and the mobile phone shell are detachably mounted; after the rear cover body is installed, the heat dissipation attached piece is attached to a main board and a battery in the mobile phone shell, so that the heat dissipation effect of the mobile phone is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of smartphone back covers, in particular to a detachable anti-skid smartphone back cover structure. Background Art

[0002] As a removable component, the back cover of a smartphone primarily houses internal components, provides heat dissipation, and provides drop protection. However, as smartphone performance continues to improve, increased power consumption has led to a significant increase in heat generated during operation, making the device prone to overheating an increasingly prominent issue. Because the phone case and screen hinder heat dissipation, the back cover becomes the most effective way to dissipate heat. Therefore, high-end models often use metal back covers to enhance heat dissipation. However, metal is not only expensive, making it difficult to popularize in low-end, price-sensitive devices, but it is also inherently impact-resistant and has poor cushioning and shock absorption properties, making it inadequate for protecting the phone. Summary of the Invention

[0003] The purpose of this section is to summarize some aspects of the embodiments of the present invention and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the abstract and title of this application to avoid obscuring the purpose of this section, the abstract and the title of the invention, and such simplifications or omissions should not be used to limit the scope of the present invention.

[0004] In order to solve the above-mentioned problems, the present invention provides the following technical solutions:

[0005] A detachable, non-slip smartphone back cover structure includes a back cover body, a bent portion of which is provided with a plurality of latching portions for movably latching with a mobile phone shell; an inner wall of the back cover body is provided with a plurality of heat dissipation attachments, which respectively cooperate with a motherboard and a battery in the mobile phone shell to achieve heat dissipation.

[0006] As a preferred solution of the detachable non-slip smartphone back cover structure described in the present invention, the locking portion includes a first locking slot, a second locking slot and a third locking slot of different shapes, and the first locking slot, the second locking slot and the third locking slot are respectively engaged with the protrusions on the outer edge of the mobile phone shell.

[0007] As a preferred solution of the detachable non-slip smartphone back cover structure described in the present invention, the back cover body includes an outer layer, a metal thin layer, a paraffin layer, a heat-absorbing splint, a fiber layer and an insulating layer from the outside to the inside, the outer layer is silicon dioxide, and the outer surface of the outer layer adopts a process.

[0008] As a preferred solution of the detachable non-slip smartphone back cover structure described in the present invention, a heat-absorbing splint is provided between the metal thin layer and the fiber layer, the heat-absorbing splint is made of copper, and has a continuous raised structure of a splint top surface, a splint inclined surface, and a splint bottom surface, the paraffin layer is sealed between the metal thin layer and the fiber layer, and the paraffin layer is cast in the continuous raised structure of the heat-absorbing splint.

[0009] As a preferred solution of the detachable non-slip smartphone back cover structure described in the present invention, the top surface of the heat-absorbing splint is bonded to the metal thin layer, and the bottom surface of the heat-absorbing splint is bonded to the fiber layer.

[0010] As a preferred solution of the detachable non-slip smartphone back cover structure described in the present invention, there is an arc chamfer between the top surface of the splint and the splint inclined surface, and there is an arc chamfer between the splint inclined surface and the splint bottom surface.

[0011] As a preferred solution of the detachable non-slip smartphone back cover structure of the present invention, the inclined surface of the heat-absorbing splint is provided with openings at equal intervals.

[0012] As a preferred solution of the detachable non-slip smartphone back cover structure described in the present invention, the heat-absorbing splint is bonded to the heat-dissipating sheet, the fiber layer is bonded with an insulating layer, and the insulating layer is an aluminum oxide coating.

[0013] As a preferred solution of the detachable non-slip smartphone back cover structure described in the present invention, the heat dissipation attachment has an attachment top surface, an attachment inclined surface and an attachment bottom surface, the attachment top surface is in contact with the top surface of the splint, the attachment inclined surface is in contact with the splint inclined surface, and the attachment inclined surface is in contact with the splint bottom surface.

[0014] As a preferred solution of the detachable non-slip smartphone back cover structure of the present invention, the heat dissipation attachment sheet is an aluminum nitride ceramic layer.

[0015] The beneficial effects of the present invention are: the back cover of the mobile phone and the mobile phone shell are detachably mounted by providing a locking portion at the bent end of the back cover body and cooperating with the protrusion of the mobile phone shell;

[0016] The heat dissipation attachment is installed by fitting the inner wall of the back cover body. After the back cover body is installed, the heat dissipation attachment is fitted with the motherboard and the battery in the mobile phone case to improve the heat dissipation effect of the mobile phone. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. Those skilled in the art can also derive other drawings based on these drawings without inventive effort. Among them:

[0018] Figure 1 It is a three-dimensional diagram of the entire embodiment.

[0019] Figure 2 For this embodiment Figure 1 A partial schematic diagram of .

[0020] Figure 3 This is a structural diagram of the back cover body of this embodiment.

[0021] Figure 4 For this embodiment Figure 3 Partial schematic diagram.

[0022] Figure 5 For this embodiment Figure 3 Partial schematic diagram.

[0023] Figure 6 For this embodiment Figure 3 A three-dimensional diagram of the middle heat-absorbing splint.

[0024] Figure 7 For this embodiment Figure 6 A partial schematic diagram of .

[0025] In the figure; the back cover body 100, the outer layer 100a, the metal thin layer 100b, the paraffin layer 100c, the heat absorbing splint 100d, the splint top surface 100d-1, the splint inclined surface 100d-2, the splint bottom surface 100d-3, the opening 100d-4, the arc chamfer 100d-5, the fiber layer 100e, and the insulating layer 100f;

[0026] Bending end 101, locking portion 101a, first locking slot 101a-1, second locking slot 101a-2, third locking slot 101a-3, heat dissipation attachment 102, attachment top surface 102-1, attachment inclined surface 102-2, attachment bottom surface 102-3. DETAILED DESCRIPTION

[0027] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0028] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0029] Secondly, the term "one embodiment" or "embodiment" herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in various places throughout this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive of other embodiments.

[0030] Example

[0031] Reference Figures 1 to 7 , is an embodiment of the present invention, which provides a detachable non-slip smartphone back cover structure, including a back cover body 100, wherein a bent portion 101 of the back cover body 100 is provided with a plurality of latching portions 101a for movably latching with a mobile phone housing; the inner wall of the back cover body 100 is provided with a plurality of heat dissipation attachments 102, which respectively cooperate with the motherboard and battery in the mobile phone housing to achieve heat dissipation;

[0032] Specifically, the bent end 101 of the back cover body 100 is provided with a locking portion 101a that cooperates with the protrusion of the mobile phone shell to achieve detachable installation of the mobile phone back cover and the mobile phone shell, and the heat dissipation sheet 102 is installed by fitting the inner wall of the back cover body 100. After the back cover body 100 is installed, the heat dissipation sheet 102 fits with the motherboard and battery in the mobile phone shell to improve the heat dissipation effect of the mobile phone;

[0033] Exemplarily, the card-setting portion 101a includes a first card slot 101a-1, a second card slot 101a-2 and a third card slot 101a-3 of different shapes. The first card slot 101a-1, the second card slot 101a-2 and the third card slot 101a-3 are respectively engaged with the protrusions on the outer edge of the mobile phone shell. The first card slot 101a-1, the second card slot 101a-2 and the third card slot 101a-3 are completely matched according to the structure of the mobile phone shell. At the same time, the card slot referred to here does not mean that a card slot is to be opened on the back cover body 100. Sometimes a "card slot" will be opened on the mobile phone shell, and the corresponding protrusions will be set on the back cover body 100 to enable the mobile phone shell to cooperate with the back cover body 100 to achieve detachable installation.

[0034] For example, the back cover body 100 includes, from the outside to the inside, an outer layer 100a, a metal thin layer 100b, a paraffin layer 100c, a heat-absorbing splint 100d, a fiber layer 100e, and an insulating layer 100f. The outer layer 100a is silicon dioxide, and the outer surface of the outer layer 100a adopts the AG process. The outer layer 100a of the back cover body 100 adopts silicon dioxide as the outermost layer. After the silicon dioxide surface is matte-treated, its anti-slip performance can usually be significantly improved. This is highly consistent with the principle of using the AG process (anti-glare process) to achieve anti-slip on the glass back cover of the mobile phone. The AG process is to form a uniform and dense microscopic concave-convex structure on the originally smooth glass surface through physical or chemical methods, thereby achieving the anti-slip effect of the back cover body 100.

[0035] It is worth mentioning that the outermost layer 100a of the back cover body 100 uses high-purity silicon dioxide (the main component of glass) as the base material. In order to significantly improve the anti-slip performance and optimize the feel, its outer surface has undergone a special AG (anti-glare) process. The core of the AG process is to create a uniform and dense micro-concave and convex structure on the originally smooth silicon dioxide surface through physical or chemical methods (such as precision etching or spraying). This micro-texture greatly increases the actual contact area and friction resistance between the finger and the back cover surface, thereby effectively preventing the phone from accidentally slipping during use. This anti-slip mechanism is completely consistent with the AG process principle widely used in the current high-end mobile phone glass back cover. It not only provides excellent grip stability, but also gives the back cover a delicate matte texture, reducing fingerprint residue and visual glare;

[0036] For example, a heat absorbing splint 100d is provided between the metal thin layer 100b and the fiber layer 100e. The heat absorbing splint 100d is made of copper and has a continuous convex structure of a splint top surface 100d-1, a splint inclined surface 100d-2 and a splint bottom surface 100d-3. The paraffin layer 100c is sealed between the metal thin layer 100b and the fiber layer 100e, and the paraffin layer 100c is cast on the heat absorbing splint 100d. The paraffin layer passively absorbs and stores heat in the continuous convex structure, thereby preventing or slowing down the rapid rise of the heat source temperature. The top surface 100d-1 of the heat-absorbing splint 100d is attached to the metal thin layer 100b, and the bottom surface 100d-3 of the heat-absorbing splint 100d is attached to the fiber layer 100e to form a three-layer structure with a mesh structure. This structure not only plays a buffering role of a single metal layer (metal thin layer 100b), but also plays a buffering role of a single metal layer (metal thin layer 100b). The problem of poor buffering effect of a single metal plate is solved, and the problem of poor toughness of a single metal layer and easy breakage of the back cover of the mobile phone during disassembly or installation is also made up. The paraffin layer 100c is filled in the three-layer structure of the mesh structure. Paraffin is in a solid state at room temperature and serves as the filling medium of the three-layer structure. Paraffin can be elastically buffered by solid-state rupture and the bending of the copper material to absorb the heat of the splint 100d, which can make up for the poor buffering effect of a single metal plate. At the same time, the paraffin (paraffin layer 100c) can absorb the high heat initially released by the mobile phone when the mobile phone is hot, and then efficiently dissipate heat for the mobile phone through heat conduction of the metal thin layer 100b and the heat-absorbing splint 100d. In this way, the three-layer structure of the metal thin layer 100b, the fiber layer 100e and the heat-absorbing splint 100d can greatly reduce the use of metal material as a single metal layer, reduce costs, and is suitable for high-end and low-end mobile phones, with wider practicality.

[0037] It is worth mentioning that the heat-absorbing splint 100d, as the core heat dissipation buffer unit, is made of high-thermal-conductivity pure copper foil that is precision-stamped into a continuous trapezoidal raised structure, including the splint top surface 100d-1, the splint slope 100d-2 with a 45° inclination, and the splint bottom surface 100d-3, forming a periodic wave peak array with a height of 1.2mm and a spacing of 3mm. This structure is bonded to the metal thin layer 100b (0.3mm aluminum alloy layer) and the fiber layer 100e (0.5mm carbon fiber reinforced layer) through thermal conductive gel to form a closed three-layer sandwich skeleton; the paraffin layer 100c with a phase change temperature of 52°C is completely filled with the raised cavity through a vacuum casting process to form a "copper skeleton-paraffin core" composite system. This structure simultaneously achieves three breakthrough functions:

[0038] Mechanical strengthening: The copper wave crest elastically deforms to absorb impact energy, solid paraffin disperses stress through micro-cracks, and the carbon fiber layer inhibits metal fatigue, solving the problem of easy cracking of the metal back cover;

[0039] Intelligent thermal management: When the phone heats up, paraffin absorbs 200 J / g of latent heat, undergoing a solid-liquid phase transition. This rapidly suppresses the motherboard's temperature rise. The liquid paraffin then conducts the heat to the copper skeleton, where it is efficiently radiated through the thin metal layer.

[0040] Lightweight and cost-effective: Copper usage is 60% less than all-metal solutions, and the total thickness of the three interlayers is 2.0mm. This reduces costs and weight while ensuring performance, making it suitable for mass production of mobile phones of all grades.

[0041] For example, the top surface 100d-1 of the heat-absorbing splint 100d is bonded to the metal thin layer 100b, and the bottom surface 100d-3 of the heat-absorbing splint 100d is bonded to the fiber layer 100e, and the bonding is performed by adhesive bonding with thermal conductive gel.

[0042] There is an arc chamfer 100d-5 between the top surface 100d-1 of the splint and the splint inclined surface 100d-2, and there is an arc chamfer 100d-5 between the splint inclined surface 100d-2 and the splint bottom surface 100d-3. By adding the arc chamfer 100d-5, the toughness of the bending part of the heat-absorbing splint 100d can be improved, and the heat-absorbing splint 100d can have a better elastic buffering effect under the premise of copper material.

[0043] It is worth mentioning that the top surface 100d-1 of the heat-absorbing splint 100d and the metal thin layer 100b, as well as the bottom surface 100d-3 of the splint and the fiber layer 100e are bonded together by a 0.1mm thick high thermal conductivity gel (silicone matrix + 40vol% aluminum nitride microspheres, thermal conductivity 5.8W / m·K), to build a strong interface coupling and an efficient thermal path (thermal resistance 0.25K·cm 2 / W); at the same time, an R0.3mm arc chamfer 100d-5 is set at the intersection of the top surface of the splint - the inclined surface 100d-1 / 100d-2 and the inclined surface - the bottom surface 100d-2 / 100d-3. After laser grain refinement treatment, the stress concentration coefficient in the bending area is reduced and the elastic buffering efficiency is improved, realizing the functional unity of "rigid support-elastic deformation" of the copper splint under impact load.

[0044] The inclined surface 100d-2 of the heat-absorbing splint 100d is provided with openings 100d-4 at equal intervals. The openings 100d-4 can improve the bonding degree of the three-layer structure of the paraffin layer 100c, the metal thin layer 100b, the fiber layer 100e and the heat-absorbing splint 100d, and can ensure that the solidified paraffin remains and distributes the stress throughout the paraffin layer 100b after being impacted, so that it can maximize the dispersion of stress, and at the same time ensure that the paraffin after absorbing heat will evenly transmit the heat, thereby improving its heat absorption and conduction efficiency.

[0045] It is worth mentioning that openings 100d-4 are opened at equal intervals on the inclined surface 100d-2 of the heat-absorbing splint 100d, which improves the bonding strength by strengthening the mechanical interlocking of the paraffin layer 100c and the three-layer structure, and promotes the solid paraffin to form a multi-directional stress dispersion path when impacted to maximize the buffering effect. At the same time, it ensures that the paraffin after absorbing heat establishes a uniform heat conduction channel through the openings, significantly optimizing the overall heat dissipation efficiency.

[0046] The heat absorbing splint 100d is bonded to the heat dissipation attachment 102, and the fiber layer 100e is bonded to the insulating layer 100f. The insulating layer 100f is an aluminum oxide coating. Aluminum oxide has good insulation and thermal conductivity. The heat dissipation attachment 102 has an attachment top surface 102-1, an attachment inclined surface 102-2 and an attachment bottom surface 102-3. The attachment top surface 102-1 is bonded to the splint top surface 100d-1, and the attachment inclined surface 102-2 is bonded to the splint inclined surface 10 0d-2 is fitted, and the attached piece inclined surface 102-2 is fitted with the clamping plate bottom surface 100d-3, and the heat dissipation attached piece 102 is used to dissipate heat from the heating part of the mobile phone. In addition, the heat dissipation attached piece 102 is an aluminum nitride ceramic layer. The aluminum nitride ceramic layer has a thermal conductivity comparable to that of metal aluminum and is not easy to bend and deform after being subjected to high temperature, so that it can better fit the heating part of the mobile phone to conduct heat. At the same time, the aluminum nitride ceramic layer also has good insulation properties and is insulated from the back cover of the mobile phone;

[0047] It is worth mentioning that the top surface 102-1, the inclined surface 102-2 and the bottom surface 102-3 of the heat dissipation attachment 102 are tightly fitted with the corresponding surfaces of the heat-absorbing splint 100d, namely the top surface 100d-1 / inclined surface 100d-2 / bottom surface 100d-3. Its aluminum nitride ceramic material has both high thermal conductivity and high-temperature deformation resistance comparable to metallic aluminum, ensuring stable contact and heat transfer with the heating parts of the mobile phone. At the same time, the alumina insulation layer 100f covered with the fiber layer 100e achieves overall insulation protection for the back cover of the mobile phone through a double insulation barrier of ceramic + alumina, and maintains an efficient thermal path.

[0048] It is important to note that the construction and arrangement of the present application shown in a number of different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, it should be readily understood by those who refer to this disclosure that many modifications are possible (e.g., the size, scale, structure, shape and proportion of various elements, as well as parameter values ​​(e.g., temperature, pressure, etc.), mounting arrangements, use of materials, color, directional changes, etc.) without departing substantially from the novel teachings and advantages of the subject matter described in this application. For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of the element may be inverted or otherwise changed, and the nature or number or position of the discrete elements may be altered or changed. Therefore, all such modifications are intended to be included within the scope of the present invention. The order or sequence of any process or method steps may be changed or reordered according to alternative embodiments. In the claims, any "means plus function" clause is intended to cover the structure described herein that performs the function, and is not only structurally equivalent but also equivalent structures. Other replacements, modifications, changes, and omissions may be made in the design, operating conditions, and arrangement of the exemplary embodiments without departing from the scope of the present invention. Therefore, the invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.

[0049] Additionally, in order to provide a concise description of exemplary embodiments, all features of an actual embodiment (i.e., those features that are not relevant to the best mode presently contemplated for carrying out the invention or those that are not relevant to implementing the invention) may not be described.

[0050] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A detachable, non-slip smartphone back cover structure, characterized by: The invention comprises a back cover body (100), wherein a bent portion (101) of the back cover body (100) is provided with a plurality of latching portions (101a) for movably latching with a mobile phone shell; and an inner wall of the back cover body (100) is provided with a plurality of heat dissipation attachments (102) which respectively cooperate with a mainboard and a battery in the mobile phone shell to achieve heat dissipation.

2. The detachable non-slip smartphone back cover structure according to claim 1, wherein: The clamping portion (101a) comprises a first clamping slot (101a-1), a second clamping slot (101a-2) and a third clamping slot (101a-3) of different shapes; the first clamping slot (101a-1), the second clamping slot (101a-2) and the third clamping slot (101a-3) are respectively engaged with protrusions on the outer edge of the mobile phone housing.

3. The detachable non-slip smartphone back cover structure according to claim 1, wherein: The back cover body (100) comprises, from outside to inside, an outer layer (100a), a metal thin layer (100b), a paraffin layer (100c), a heat-absorbing splint (100d), a fiber layer (100e) and an insulating layer (100f); the outer layer (100a) is silicon dioxide, and the outer surface of the outer layer (100a) adopts an AG process.

4. The detachable non-slip smartphone back cover structure according to claim 3, wherein: A heat-absorbing splint (100d) is provided between the metal thin layer (100b) and the fiber layer (100e). The heat-absorbing splint (100d) is made of copper and has a continuous convex structure comprising a splint top surface (100d-1), a splint inclined surface (100d-2), and a splint bottom surface (100d-3). The paraffin layer (100c) is sealed between the metal thin layer (100b) and the fiber layer (100e), and the paraffin layer (100c) is cast in the continuous convex structure of the heat-absorbing splint (100d).

5. The detachable non-slip smartphone back cover structure according to claim 4, characterized in that: The top surface (100d-1) of the heat-absorbing splint (100d) is bonded to the metal thin layer (100b), and the bottom surface (100d-3) of the heat-absorbing splint (100d) is bonded to the fiber layer (100e).

6. The detachable non-slip smartphone back cover structure according to claim 5, wherein: An arc chamfer (100d-5) is provided between the splint top surface (100d-1) and the splint inclined surface (100d-2), and an arc chamfer (100d-5) is provided between the splint inclined surface (100d-2) and the splint bottom surface (100d-3).

7. The detachable non-slip smartphone back cover structure according to claim 5, wherein: The splint inclined surface (100d-2) of the heat absorbing splint (100d) is provided with openings (100d-4) at equal intervals.

8. The detachable non-slip smartphone back cover structure according to claim 4, wherein: The heat-absorbing clamping plate (100d) is bonded to the heat-dissipating attachment sheet (102); the fiber layer (100e) is bonded to an insulating layer (100f); and the insulating layer (100f) is an aluminum oxide coating.

9. The detachable non-slip smartphone back cover structure according to claim 8, wherein: The heat dissipation attachment (102) comprises an attachment top surface (102-1), an attachment inclined surface (102-2) and an attachment bottom surface (102-3); the attachment top surface (102-1) is bonded to the splint top surface (100d-1), the attachment inclined surface (102-2) is bonded to the splint inclined surface (100d-2), and the attachment inclined surface (102-2) is bonded to the splint bottom surface (100d-3).

10. The detachable non-slip smartphone back cover structure according to claim 9, wherein: The heat dissipation attachment (102) is an aluminum nitride ceramic layer.

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