Display device, method of manufacturing display device, and electronic device including display device

By adopting a multi-layer polymer structure in a flexible display device, the problems of wrinkles and increased thickness during folding are solved, achieving higher stability and reliability while reducing costs.

CN120676827APending Publication Date: 2025-09-19SAMSUNG DISPLAY CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202510289301.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2024-03-19
Filing Date
2025-03-12
Publication Date
2025-09-19

AI Technical Summary

Technical Problem

Flexible display devices are prone to wrinkles during folding, and as thickness increases, foldability and stability are limited.

Method used

A multi-layer polymer structure is adopted, in which the first polymer is in direct contact with the display panel and has a higher modulus, the second polymer is in direct contact with the window layer and has a lower modulus, and protrusions are set on the second polymer, and the third polymer covers part of the second polymer to form a multi-layer polymer layer to enhance adhesion and absorb impact.

Benefits of technology

The stability and reliability of the display device are improved, the damping layer and the bonding process are reduced, the process cost is reduced, and the display device is made thinner.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN120676827A_ABST
    Figure CN120676827A_ABST
Patent Text Reader

Abstract

The invention relates to a display device, a manufacturing method of the display device, and an electronic device including the display device. The display device includes: a display panel; a first polymer disposed on the display panel, in direct contact with the display panel, and having a first modulus; a second polymer disposed on the first polymer, in direct contact with the first polymer, and having a second modulus less than the first modulus; and a window layer disposed on the second polymer.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The present disclosure relates to a display device, a method for manufacturing a display device, and an electronic device including the display device. More particularly, the present disclosure relates to a display device that provides visual information, a method for manufacturing a display device, and an electronic device including the display device. Background Art

[0002] Flexible display devices can have advantages in space utilization, internal design, and external design, and have various application fields. Recently, these flexible display devices can be divided into bendable, rollable, foldable, etc., and there is a demand for converting them into stretchable forms that can be stretched in any direction.

[0003] As the thickness increases, flexible display devices formed using such flexible substrates have limitations in folding. In addition, wrinkles have been found to form due to bending during folding, and various studies are continuing to address these issues. Summary of the Invention

[0004] A feature of the present disclosure is to provide a display device with improved stability and reliability.

[0005] Another feature of the present disclosure is to provide a method for manufacturing the display device.

[0006] A display device according to an embodiment of the present disclosure includes: a display panel; a first polymer disposed on the display panel, in direct contact with the display panel and having a first modulus; a second polymer disposed on the first polymer, in direct contact with the first polymer and having a second modulus smaller than the first modulus; and a window layer disposed on the second polymer.

[0007] In an embodiment, the first modulus may be about 500 MPa or greater and about 2000 MPa or less.

[0008] In an embodiment, the second modulus may be about 30 MPa or less.

[0009] In an embodiment, a thickness of each of the first polymer and the second polymer may be about 30 μm or more and about 70 μm or less.

[0010] In an embodiment, the sum of the thicknesses of the first polymer and the second polymer may be about 100 μm or less.

[0011] In embodiments, the adhesive force of the first polymer may be greater than the adhesive force of the second polymer.

[0012] In an embodiment, the adhesive force between the first polymer and the display panel may be about 1500 g-force / inch or greater.

[0013] In embodiments, the second polymer may have an elastic recovery rate of about 90% or greater.

[0014] In embodiments, the second polymer may have a creep value of about 10% or less at about 1 hour.

[0015] In embodiments, the first polymer and the second polymer may be transparent.

[0016] In an embodiment, the display device may further include a third polymer disposed on the second polymer and covering at least a portion of the second polymer, and the second polymer may have a shape including a plurality of protrusions protruding in a direction of the window layer in a cross-sectional view.

[0017] In embodiments, the protrusions of the second polymer may be in direct contact with the window layer.

[0018] In an embodiment, the first polymer and the third polymer may comprise the same material.

[0019] In an embodiment, the thickness of each of the plurality of protrusions of the second polymer may be about 15 μm or more and about 20 μm or less.

[0020] In an embodiment, adjacent protrusions among the plurality of protrusions of the second polymer may have a constant pitch, and the pitch may be about 10 μm or more and about 50 μm or less.

[0021] A method for manufacturing a display device according to an embodiment of the present disclosure includes providing a display panel; forming a first polymer having a first modulus on the display panel; forming a second polymer having a second modulus smaller than the first modulus on the first polymer; and forming a window layer on the second polymer.

[0022] In an embodiment, the method may further include forming a protrusion pattern including a plurality of protrusions in the second polymer.

[0023] In an embodiment, the method may further include forming a third polymer on the second polymer to cover at least a portion of the second polymer.

[0024] In an embodiment, the thickness of each of the plurality of protrusions of the second polymer may be about 15 μm or more and about 20 μm or less.

[0025] In an embodiment, adjacent protrusions among the plurality of protrusions of the second polymer may have a constant interval, and the interval may be about 10 μm or more and about 50 μm or less.

[0026] An electronic device according to an embodiment of the present disclosure includes a display device and a processor driving the display device. The display device includes: a display panel; a first polymer disposed on the display panel, in direct contact with the display panel, and having a first modulus; a second polymer disposed on the first polymer, in direct contact with the first polymer, and having a second modulus smaller than the first modulus; and a window layer disposed on the second polymer.

[0027] The display device may include: a display panel; a first polymer disposed on the display panel, in direct contact with the display panel and having a first modulus; a second polymer disposed on the first polymer, in direct contact with the first polymer and having a second modulus smaller than the first modulus; and a window layer disposed on the second polymer.

[0028] As a result, a polymer layer including polymers having different moduli and formed of multiple layers is provided on the display device, thereby improving the adhesion between the polymer layer and the window layer and the display panel. In addition, impact applied to the display device can be effectively absorbed and / or dispersed by the polymer layer.

[0029] In addition, by providing a polymer layer having multiple layers, the damping layer and the adhesive for attaching the damping layer can be omitted, and the overall thickness of the display device can be reduced. In other words, the damping layer and the adhesive process for attaching the damping layer can be omitted, thereby reducing the manufacturing cost of the display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The accompanying drawings are included to provide a further understanding of the inventive concept, and are incorporated in and constitute a part of this specification and together with the description explain embodiments of the inventive concept.

[0031] Figure 1 is a plan view of a display device according to an embodiment of the present disclosure.

[0032] Figure 2 To show Figure 1 sectional view of the display device in the folded state shown in FIG.

[0033] Figure 3 To follow Figure 1 A cross-sectional view taken along line II'.

[0034] Figure 4 To show Figure 3 A cross-sectional view of a display panel.

[0035] Figure 5 To show Figure 3 Cross-sectional view of an example of a polymer layer.

[0036] Figure 6 To show Figure 3A cross-sectional view of another example of a polymer layer.

[0037] Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 and Figure 11 To show Figure 3 A view of a method for manufacturing a polymer layer.

[0038] Figure 12 is a block diagram for illustrating an electronic device according to an embodiment of the present disclosure.

[0039] Figure 13 For showing Figure 12 Schematic diagrams of electronic devices according to various embodiments. DETAILED DESCRIPTION

[0040] Illustrative, non-limiting embodiments will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings.

[0041] In this specification, a plane may be defined by a first direction D1 and a second direction D2 intersecting the first direction D1. For example, the second direction D2 may be perpendicular to the first direction D1. Furthermore, the third direction D3 may be a normal direction to the plane. That is, the third direction D3 may be perpendicular to the plane formed by the first direction D1 and the second direction D2. In this document, a "plan view" refers to a portion of a target object viewed from above, and a "cross-sectional view" refers to a portion of a target object cut vertically and viewed from the side.

[0042] Figure 1 is a plan view of a display device DD according to an embodiment of the present disclosure. Figure 2 To show Figure 1 sectional view of the display device DD in a folded state shown in FIG.

[0043] refer to Figure 1 and Figure 2 The top surface of the display device DD may be defined as a display surface DS. The display surface DS may have a plane defined by a first direction D1 and a second direction D2. An image generated by the display device DD may be provided to a user through the display surface DS.

[0044] The display surface DS may include a display area DA and a peripheral area SA. The display area DA may display an image, and the peripheral area SA may not display an image. The peripheral area SA may be disposed around the display area DA. For example, the peripheral area SA may surround the display area DA in a plan view.

[0045] The display device DD may be a flexible display device. The display device DD may be a foldable display device that can be folded or unfolded. The display device DD may include a first area NFA1, a second area NFA2, and a third area FA. The second area NFA2 may be spaced apart from the first area NFA1 along a second direction D2. The third area FA may be disposed between the first area NFA1 and the second area NFA2.

[0046] The third area FA may be bent about a folding axis FX parallel to the first direction D1 so that the display device DD is foldable. Figure 2 As shown in , the display device DD can be folded inward so that the display surface DS is not exposed to the outside. That is, when the display device DD is folded, the first area NFA1 and the second area NFA2 of the display surface DS may face each other. In an embodiment, the display device DD can be folded outward so that the display surface DS is exposed to the outside.

[0047] The first area NFA1, the second area NFA2 and the third area FA may be referred to as a first non-folding area, a second non-folding area and a folding area, respectively. Figure 1 , the display device DD is shown to include two non-folding areas (a first area NFA1 and a second area NFA2) and one folding area (a third area FA), but this is an example and the present disclosure is not necessarily limited thereto. For example, the display device DD may include three or more non-folding areas and two or more folding areas provided between the three or more non-folding areas.

[0048] Figure 3 To follow Figure 1 A cross-sectional view taken along line II'.

[0049] refer to Figure 3 , the display device DD may include a cover film CF, a plate PT, an adhesive film AF, a display panel DP, a polymer layer POL, a window layer WL, an adhesive layer PSA, and a protective film PL.

[0050] A cover film CF may be disposed on the back surface of the display device DD. The cover film CF can mitigate external impacts on the display device DD. The cover film CF may include at least one of sponge, expanded foam, thermoplastic polyurethane, and polydimethylacrylamide. These materials may be used alone or in combination. Optionally, the cover film CF may include a light-blocking material. Accordingly, the cover film CF can absorb light incident from the back surface of the display device DD.

[0051] The plate PT may be disposed on the cover film CF. The plate PT prevents the display panel DP from bending due to external forces. That is, even when external forces are applied from outside the display device DD, the plate PT maintains the display panel DP in a relatively flat state. The plate PT may comprise a rigid or semi-rigid material. For example, the plate PT may comprise at least one of iron, chromium, carbon, nickel, silicon, manganese, and molybdenum. These materials may be used alone or in combination. However, embodiments of the present disclosure are not necessarily limited to this.

[0052] An adhesive film AF may be provided on the panel PT. The adhesive film AF may attach the panel PT and the display panel DP. For example, the adhesive film AF may include at least one of a pressure-sensitive adhesive, an optically clear adhesive (OCA), and an optically clear resin (OCR). However, embodiments of the present disclosure are not necessarily limited thereto.

[0053] The display panel DP may be disposed on the adhesive film AF. The display panel DP may generate light based on the provided signal. Accordingly, the display panel DP may provide a visual image to a user of the display device DD. Figure 4 The display panel DP is described in detail.

[0054] The polymer layer POL may be disposed on the display panel DP. The polymer layer POL may attach the display panel DP and the window layer WL. In addition, the polymer layer POL may support the window layer WL from sagging and protect the display panel DP from external impact, etc. The polymer layer POL may have a single layer structure or a multi-layer structure. Figure 5 and Figure 6 The polymer layer POL is described in detail.

[0055] The window layer WL may be disposed on the polymer layer POL. The window layer WL may cover the front surface of the display device DD and protect the display panel DP. The window layer WL may include a substantially transparent material. For example, the window layer WL may be glass or plastic. However, embodiments of the present disclosure are not necessarily limited thereto.

[0056] The adhesive layer PSA may be disposed on the window layer WL. The adhesive layer PSA may adhere the window layer WL and the protective film PL. The adhesive layer PSA may include a transparent material. For example, the adhesive layer PSA may include at least one of a pressure-sensitive adhesive, an optically clear adhesive (OCA), and an optically clear resin (OCR). However, embodiments of the present disclosure are not necessarily limited thereto.

[0057] A protective film PL may be disposed on the adhesive layer PSA. The protective film PL may protect the window layer WL from external impacts and / or scratches. For example, the protective film PL may include a base layer and a hard coating layer. However, embodiments of the present disclosure are not necessarily limited thereto. The protective film PL may further include a low refractive index layer and / or an anti-fingerprint layer.

[0058] Figure 4To show Figure 3 sectional view of the display panel DP.

[0059] refer to Figure 1 and Figure 4 The display panel DP may include a substrate SUB, a buffer layer BUF, a gate insulating layer GI, a transistor TR, an interlayer insulating layer IL, a connection electrode CNE, a first through-hole layer VIA1, a second through-hole layer VIA2, a light emitting diode LED, a pixel defining layer PDL, and an encapsulation layer ENC.

[0060] The transistor TR may include an active layer ACT, a gate electrode GE, a source electrode SE, and a drain electrode DE. The light emitting diode LED may include a pixel electrode PE, a light emitting layer EL, and a common electrode CE.

[0061] The substrate SUB may include a glass substrate, a metal substrate, a plastic substrate, etc. However, the embodiments of the present disclosure are not necessarily limited thereto, and the substrate SUB may be an inorganic layer, an organic layer, or a composite material layer.

[0062] The buffer layer BUF may be disposed on the substrate SUB. The buffer layer BUF may prevent impurities such as oxygen and moisture from penetrating into the upper portion of the substrate SUB. The buffer layer BUF may include an inorganic insulating material.

[0063] The active layer ACT may be disposed on the buffer layer BUF. The active layer ACT may include an oxide semiconductor, a silicon semiconductor, an organic semiconductor, or the like. For example, the oxide semiconductor may include an oxide of at least one of indium (In), gallium (Ga), tin (Sn), zirconium (Zr), vanadium (V), hafnium (Hf), cadmium (Cd), germanium (Ge), chromium (Cr), titanium (Ti), and zinc (Zn). The silicon semiconductor may include amorphous silicon, polycrystalline silicon, or the like. The active layer ACT may include a source region, a drain region, and a channel region disposed between the source and drain regions.

[0064] The gate insulating layer GI may be disposed on the buffer layer BUF. Specifically, the gate insulating layer GI may cover the active layer ACT on the buffer layer BUF. The gate insulating layer GI may include an inorganic insulating material. In an embodiment, the gate insulating layer GI may be completely formed in the display area DA and the peripheral area SA.

[0065] The gate electrode GE may be disposed on the gate insulating layer GI. The gate electrode GE may at least partially overlap the channel region of the active layer ACT. The gate electrode GE may include a conductive material such as a metal, an alloy, a conductive metal nitride, a conductive metal oxide, or a transparent conductive material. Examples of conductive materials that can be used in the gate electrode GE include gold (Au), silver (Ag), aluminum (Al), platinum (Pt), nickel (Ni), titanium (Ti), palladium (Pd), magnesium (Mg), calcium (Ca), lithium (Li), chromium (Cr), tantalum (Ta), tungsten (W), copper (Cu), molybdenum (Mo), scandium (Sc), neodymium (Nd), iridium (Ir), aluminum-containing alloys, silver-containing alloys, copper-containing alloys, molybdenum-containing alloys, aluminum nitride (AlN), tungsten nitride (WN), titanium nitride (TiN), chromium nitride (CrN), tantalum nitride (TaN), strontium ruthenium oxide (SrRuO), zinc oxide (ZnO), indium tin oxide (ITO), tin oxide (SnO), indium oxide (InO), gallium oxide (GaO), indium zinc oxide (IZO), etc. These can be used alone or in combination with each other. In an embodiment, the gate electrode GE may have a single-layer structure or a multi-layer structure including a plurality of conductive layers.

[0066] The interlayer insulating layer IL may be disposed on the gate electrode GE. Specifically, the interlayer insulating layer IL may be disposed on the gate insulating layer GI and cover the gate electrode GE on the gate insulating layer GI. The interlayer insulating layer IL may include an inorganic insulating material.

[0067] A source electrode SE and a drain electrode DE may be disposed on the interlayer insulating layer IL. Each of the source electrode SE and the drain electrode DE may be connected to the active layer ACT. For example, the source electrode SE may contact a source region of the active layer ACT, and the drain electrode DE may contact a drain region of the active layer ACT. Each of the source electrode SE and the drain electrode DE may include a conductive material. The active layer ACT, the gate electrode GE, the source electrode SE, and the drain electrode DE may form a transistor TR.

[0068] The first via layer VIA1 may be disposed on the source electrode SE and the drain electrode DE. Specifically, the first via layer VIA1 may be disposed on the interlayer insulating layer IL and cover the source electrode SE and the drain electrode DE on the interlayer insulating layer IL. The first via layer VIA1 may include an organic insulating material. In an embodiment, the first via layer VIA1 may be formed only in the display area DA and a portion of the peripheral area SA adjacent to the display area DA.

[0069] The connection electrode CNE may be disposed on the first via layer VIA1. The connection electrode CNE may transmit a signal transmitted from the transistor TR to the light-emitting diode LED. The connection electrode CNE may include a metal, an alloy, a conductive metal nitride, a conductive metal oxide, a transparent conductive material, or the like. These materials may be used alone or in combination. However, embodiments of the present disclosure are not necessarily limited thereto.

[0070] The second via layer VIA2 may be disposed on the connection electrode CNE. Specifically, the second via layer VIA2 may be disposed on the first via layer VIA1 and cover the connection electrode CNE. The second via layer VIA2 may include a material substantially the same as that of the first via layer VIA1.

[0071] The pixel electrode PE may be disposed on the second through-hole layer VIA2. The pixel electrode PE may include a conductive material. The pixel electrode PE may be connected to the drain electrode DE through the connection electrode CNE. Accordingly, the pixel electrode PE may be electrically connected to the transistor TR.

[0072] The pixel defining layer PDL may be disposed on the second through hole layer VIA2. For example, the pixel defining layer PDL may expose at least a portion of the pixel electrode PE. The pixel defining layer PDL may include an inorganic insulating material or an organic insulating material.

[0073] The light-emitting layer EL may be disposed on the pixel electrode PE. Specifically, the light-emitting layer EL may be disposed within an opening defined by the pixel-defining layer PDL. That is, the light-emitting layer EL may be surrounded by the pixel-defining layer PDL. The light-emitting layer EL may include at least one of an organic light-emitting material and quantum dots. However, embodiments of the present disclosure are not necessarily limited thereto.

[0074] The common electrode CE may be disposed on the light-emitting layer EL. The common electrode CE may also be disposed on the pixel-defining layer PDL. That is, the common electrode CE may be disposed continuously on the light-emitting layer EL and the pixel-defining layer PDL. The common electrode CE may include a conductive material. The light-emitting layer EL may emit light based on a voltage difference between the pixel electrode PE and the common electrode CE.

[0075] The encapsulation layer ENC may be disposed on the common electrode CE. The encapsulation layer ENC may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. In an embodiment, the inorganic encapsulation layers and the organic encapsulation layers may be alternately disposed. For example, the organic encapsulation layer may include a cured polymer such as polyacrylate, epoxy resin, or silicone resin. For example, the inorganic encapsulation layer may include silicon oxide, silicon nitride, silicon carbide, aluminum oxide, tantalum oxide, hafnium oxide, zirconium oxide, titanium oxide, etc.

[0076] Figure 5 To show Figure 3 FIG. 1 is a cross-sectional view of an example of a polymer layer POL.

[0077] refer to Figure 3 and Figure 5 , the polymer layer POLa may include two different polymers. Figure 5As shown in FIG, the polymer layer POLa may include a first polymer POL1 and a second polymer POL2. For example, the first polymer POL1 and the second polymer POL2 may include a transparent material to allow light transmitted from the display panel DP to pass therethrough.

[0078] The second polymer POL2 may be disposed on the first polymer POL1. That is, the first polymer POL1 may be disposed on the display panel DP, and the second polymer POL2 may be disposed under the window layer WL. Specifically, the first polymer POL1 may be disposed to be aligned with the encapsulation layer (eg, Figure 4 The encapsulation layer ENC in the embodiment is in direct contact with the second polymer POL2, and the second polymer POL2 may be disposed in direct contact with the window layer WL and the first polymer POL1.

[0079] In an embodiment, the first polymer POL1 may have a first modulus, and the second polymer POL2 may have a second modulus smaller than the first modulus. The modulus of a material (also known as the elastic modulus or modulus of elasticity) is a measure of the elasticity of the material. The elastic modulus quantifies the material's resistance to non-permanent deformation or elastic deformation. Because the first polymer POL1 has the first modulus and is disposed at the lower portion of the polymer layer POLa, sagging of the window layer WL can be prevented, and sufficient adhesion between the display panel DP and the polymer layer POLa can be ensured. The second polymer POL2 has a second modulus and may be disposed at the upper portion of the polymer layer POLa to absorb and / or disperse impacts transmitted to the display panel DP.

[0080] For example, the first modulus of the first polymer POL1 may be about 500 MPa or more and about 2000 MPa or less. Preferably, the first modulus may be about 500 MPa or more and about 1,500 MPa or less. If the first modulus is less than the above range, the window layer WL may sag. In addition, if the first modulus is greater than the above range, wrinkles may appear when the display device DD is folded.

[0081] The second modulus of the second polymer POL2 may be about 30 MPa or less. If the second modulus is greater than the above range, the effect of absorbing and / or dispersing impact transmitted to the display panel DP may be reduced, which may cause adverse effects on the display device DD.

[0082] In an embodiment, each of the first thickness W1 of the first polymer POL1 and the second thickness W2 of the second polymer POL2 may be approximately 30 μm or greater and approximately 70 μm or less. If the first thickness W1 of the first polymer POL1 is less than the above range, the window layer WL may sag. When the first thickness W1 of the first polymer POL1 is greater than the above range, the foldability of the display device DD may be reduced. In addition, when the second thickness W2 of the second polymer POL2 is less than the above range, the property of the polymer layer POLa in dispersing external impacts may deteriorate. When the second thickness W2 of the second polymer POL2 is greater than the above range, the adhesion between the polymer layer POLa and the window layer WL may be reduced.

[0083] In an embodiment, the sum of the first thickness W1 of the first polymer POL1 and the second thickness W2 of the second polymer POL2 may be about 100 μm or less. When the sum of the first thickness W1 of the first polymer POL1 and the second thickness W2 of the second polymer POL2 is greater than the above range, the foldability of the display device DD may be deteriorated.

[0084] In an embodiment, the adhesive force between the first polymer POL1 and the display panel DP may be greater than about 1500 gf / inch. Preferably, the adhesive force between the first polymer POL1 and the display panel DP may be greater than about 2000 gf / inch. Because the adhesive force between the first polymer POL1 and the display panel DP satisfies the above range, when a user uses the display device DD, a lifting phenomenon between the first polymer POL1 and the display panel DP can be minimized.

[0085] In an embodiment, the elastic recovery rate of the second polymer POL2 may be approximately 90% or greater. Preferably, the elastic recovery rate of the second polymer POL2 may be approximately 95% or greater. The elastic recovery rate measures the degree to which a material returns to its original shape after deformation. If the elastic recovery rate of the second polymer POL2 is less than the above range, the shape of the second polymer POL2 may be deformed when a user uses the display device DD, and peeling may occur between the window layer WL and the second polymer POL2.

[0086] In embodiments, the second polymer POL2 may have a creep value of 10% or less over approximately one hour. Creep is a measure of the degree to which a material gradually and permanently deforms under long-term, constant stress. Because the creep value of the second polymer POL2 falls within the aforementioned range, deformation of the polymer layer POLa can be minimized even when the display device DD is folded.

[0087] By Figure 5The two-layer polymer layer POLa shown in FIG is disposed between the window layer WL and the display panel DP, which can prevent the window layer WL from sagging and absorb and / or disperse external impacts transmitted to the display panel DP. Accordingly, the stability and reliability of the display device DD can be improved.

[0088] Figure 6 To show Figure 3 FIG. 5 is a cross-sectional view of another example of a polymer layer POL.

[0089] refer to Figure 3 、 Figure 5 and Figure 6 , the polymer layer POLb may include a first polymer POL1 , a second polymer POL2 , and a third polymer POL3 .

[0090] like Figure 6 As shown in FIG, the second polymer POL2 may be provided on the first polymer POL1, and the third polymer POL3 may be provided on the second polymer POL2. Figure 5 Differently, the second polymer POL2 may have a shape including a plurality of protrusions PRT protruding in the third direction D3 in a cross-sectional view.

[0091] Specifically, the second polymer POL2 may have a shape including a plurality of protrusions PRT protruding in the direction of the window layer WL. The second polymer POL2 may include a first protrusion PRT1 and a second protrusion PRT2. The first protrusion PRT1 and the second protrusion PRT2 may be disposed adjacent to each other along the second direction D2.

[0092] In an embodiment, each of the plurality of protrusions PRT of the second polymer POL2 may have a third thickness W3 along the third direction D3. For example, the third thickness W3 may be about 15 μm or more and about 20 μm or less. However, embodiments of the present disclosure are not necessarily limited thereto.

[0093] In an embodiment, each of the plurality of protrusions PRT of the second polymer POL2 may be arranged at a constant pitch PC. Specifically, the first protrusion PRT1 and the second protrusion PRT2 may be arranged to be spaced apart from each other by a pitch PC along the second direction D2. That is, in a cross-sectional view, the distance between the center of the first protrusion PRT1 and the center of the second protrusion PRT2 may be a distance corresponding to the pitch PC. For example, the pitch PC may be about 10 μm or more and about 50 μm or less. Preferably, the pitch PC may be about 25 μm or more and about 35 μm or less. However, embodiments of the present disclosure are not necessarily limited thereto.

[0094] The third polymer POL3 may cover at least a portion of the second polymer POL2. That is, the second polymer POL2 is disposed on the first polymer POL1, and the third polymer POL3 is disposed on the second polymer POL2, such that the third polymer POL3 covers at least a portion of the second polymer POL2. Since the third polymer POL3 is disposed on the second polymer POL2 to increase the contact area between the window layer WL and the third polymer POL3, the adhesion between the polymer layer POLb and the window layer WL can be increased.

[0095] For example, at least a portion of the second polymer POL2 may be exposed without being covered by the third polymer POL3. That is, when the polymer layer POLb and the window layer WL are attached, the second polymer POL2 and the window layer WL may directly contact each other. Since the second polymer POL2 is not completely covered by the third polymer POL3 and is partially exposed, the second polymer POL2 may directly contact the window layer WL and may absorb and / or disperse impacts transmitted to the display panel DP.

[0096] In an embodiment, the third polymer POL3 may include the same material as that of the first polymer POL1. That is, the third polymer POL3 may have the first modulus like the first polymer POL1.

[0097] As a result, a first polymer POL1 having a first modulus, a second polymer POL2 having a second modulus, and a third polymer POL3 having a first modulus can be sequentially disposed on the display device DD. Since the first polymer POL1 and the third polymer POL3 directly contact the display panel DP and the window layer WL, respectively, adhesion can be improved. Furthermore, since the second polymer POL2 directly contacts the window layer WL and is disposed above the polymer layer POLb, the polymer layer POLb can absorb and / or disperse impacts transmitted to the display panel DP. Consequently, the stability and reliability of the display device DD can be improved.

[0098] Furthermore, by placing the multi-layer polymer layers POLa and POLb in direct contact with the window layer WL and the display panel DP, the damping layer and the bonding process for attaching the damping layer can be omitted, and the overall thickness of the display device DD can be thinner. In other words, since the damping layer and the bonding process for attaching the damping layer are omitted, the process cost of the display device DD is reduced.

[0099] [Table 1]

[0100]

[0101] Referring to Table 1, the modulus, elastic recovery rate, creep value, and adhesive force of each of the low modulus material and the high modulus material can be confirmed.

[0102] Low modulus materials can correspond to Figure 5 and Figure 6 Similarly, the high modulus material may correspond to the second polymer POL2 in Figure 5 and Figure 6 The first polymer POL1 and the third polymer POL3.

[0103] [Table 2]

[0104] Low modulus materials High modulus materials Pen drop height (cm) Comparative Example 1 X O 9-10 Example 1 LM1 HM1 13 Example 2 LM2 HM2 12-13 Example 3 LM2 HM2 12 Example 4 LM3 HM3 11-12 Example 5 LM3 HM3 10-11 Comparative Example 2 LM4 HM4 8-9

[0105] Refer to Table 2 and Figure 3 、 Figure 5 and Figure 6 In Examples 1 to 5 and Comparative Example 2, the low modulus materials and high modulus materials described in Table 1 are as follows: Figure 5 and Figure 6 The low-modulus material was laminated to a thickness of 60 μm, and the high-modulus material was laminated to a thickness of 40 μm. In other words, the polymer layer POL was laminated to a total thickness of 100 μm. A pen drop test was then performed on the polymer layer POL. This test involves dropping a pen weighing approximately 5.6 g from a certain height to determine whether the polymer layer POL is damaged.

[0106] Before carrying out Examples 1 to 5 and Comparative Example 2, Comparative Example 1 was prepared in which the polymer layer POL consisted of a single layer including only one of the high modulus materials shown in Table 1. According to Comparative Example 1, when consisting of a single layer including only one of the high modulus materials shown in Table 1, it was confirmed that the polymer layer POL was destroyed at a pen drop height of about 9 cm to about 10 cm in the pen drop test.

[0107] In Example 1, when the low modulus material was laminated with LM1 and the high modulus material was laminated with HM1, it was confirmed that the polymer layer POL was destroyed at a pen drop height of about 13 cm in the pen drop test.

[0108] In Example 2, when the low modulus material was laminated with LM2 and the high modulus material was laminated with HM2, it was confirmed that the polymer layer POL was destroyed at a pen drop height of about 12 cm to about 13 cm in the pen drop test.

[0109] In Example 3, when the low modulus material is laminated with LM2, the high modulus material is laminated with HM2 and the protrusion PRT is as shown in FIG. Figure 6 When patterning is performed as shown in , it can be confirmed that the polymer layer POL is destroyed at a pen drop height of about 12 cm in the pen drop test.

[0110] In Example 4, when the low modulus material was laminated with LM3 and the high modulus material was laminated with HM3, it was confirmed that the polymer layer POL was destroyed at a pen drop height of about 11 cm to about 12 cm in the pen drop test.

[0111] In Example 5, when the low modulus material is laminated with LM3, the high modulus material is laminated with HM3 and the protruding PRT is as shown in FIG. Figure 6 When patterning is performed as shown in , it can be confirmed that the polymer layer POL is destroyed at a pen drop height of about 10 cm to about 11 cm in the pen drop test.

[0112] In Comparative Example 2, when the low modulus material was laminated with LM4 and the high modulus material was laminated with HM4, it was confirmed that the polymer layer POL was destroyed at a pen drop height of about 8 cm to about 9 cm in the pen drop test.

[0113] As a result, it was confirmed that, in Examples 1 to 5, the impact resistance was further improved compared to Comparative Example 1, and in Comparative Example 2, it was confirmed that the impact resistance was not improved. Figure 5 and Figure 6 As described above, when the polymer layer POL satisfies Examples 1 to 5 of Table 2, it can be confirmed that the impact resistance of the polymer layer POL is improved. In other words, when the reference Figure 5 and Figure 6 When the numerical ranges of the first polymer POL1, the second polymer POL2, and the third polymer POL3 are described (eg, the first modulus of the first polymer POL1 is about 500 MPa or more and about 2000 MPa or less), it can be confirmed that the impact resistance of the polymer layer POL is improved.

[0114] Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 and Figure 11 To show Figure 3 A view of the manufacturing method of the polymer layer POL.

[0115] refer to Figure 7 A first polymer POL1 having a first modulus may be formed on the display panel DP. Specifically, the first polymer POL1 may be formed on the display panel DP by inkjet coating, spray coating, color coating, slit coating, etc.

[0116] After forming the first polymer POL1 on the display panel DP, the first polymer POL1 may be cured. The first polymer POL1 may be cured on the display panel DP by thermal curing, UV curing, etc. However, embodiments of the present disclosure are not necessarily limited thereto.

[0117] Further references Figure 8A second polymer POL2 having a second modulus may be formed on the first polymer POL1. The second modulus may be smaller than the first modulus. Like the first polymer POL1, the second polymer POL2 may be formed by inkjet coating, spray coating, color coating, slit coating, etc.

[0118] After forming the second polymer POL2 on the first polymer POL1, the second polymer POL2 may be cured. The second polymer POL2 may be cured on the first polymer POL1 by thermal curing, UV curing, etc. However, embodiments of the present disclosure are not necessarily limited thereto.

[0119] As the formation Figure 7 and Figure 8 The first polymer POL1 and the second polymer POL2 shown in FIG. Figure 5 The polymer layer POLa is shown in FIG.

[0120] Further references Figure 9 After curing the second polymer POL2, at least a portion of the second polymer POL2 is etched so that the second polymer POL2 may be formed into a protrusion pattern including a plurality of protrusions PRT protruding along a third direction D3 in a cross-sectional view. The protrusions PRT of the second polymer POL2 may be formed using a laser or the like.

[0121] Adjacent protrusions in the plurality of protrusions PRT may have a constant pitch PC. For example, the first protrusion PRT1 and the second protrusion PRT2 may be spaced apart from each other along the second direction D2 by a pitch PC. Specifically, the center of the first protrusion PRT1 and the center of the second protrusion PRT2 may be spaced apart by a distance of the pitch PC. The pitch PC may be approximately 10 μm or greater and approximately 50 μm or less. Preferably, the pitch PC may be approximately 25 μm or greater and approximately 35 μm or less.

[0122] In addition, each of the plurality of protrusions PRT may have a constant third thickness W3 along the third direction D3. For example, the third thickness W3 may be about 15 μm or more and about 20 μm or less.

[0123] Further references Figure 10 and Figure 11, the third polymer POL3 may be formed on the protrusion PRT of the second polymer POL2, and the window layer WL may be formed on the second polymer POL2 and the third polymer POL3. Specifically, the third polymer POL3 may be sprayed between the protrusions PRT of the second polymer POL2 to cover at least a portion of the second polymer POL2. For example, the third polymer POL3 may not completely cover the second polymer POL2 and may expose the top surface of the second polymer POL2. Because at least a portion of the second polymer POL2 is exposed, the window layer WL may be in direct contact with the second polymer POL2.

[0124] The third polymer POL3 may include the same material as the first polymer POL1. That is, the third polymer POL3 may have the first modulus. Since the third polymer POL3 directly contacts the window layer WL, the adhesion between the polymer layer POL and the window layer WL may be improved.

[0125] result, Figure 3 The polymer layer POL shown in FIG. Figures 7 to 11 The method of manufacturing is as follows.

[0126] Figure 12 1 is a block diagram illustrating an electronic device 10 according to an embodiment of the present disclosure.

[0127] refer to Figure 1 and Figure 12 The display device DD according to an embodiment of the present disclosure may be applied to various electronic devices 10. The electronic device 10 according to an embodiment may include the display device DD, and may further include a module or device having additional functions in addition to the display device DD.

[0128] The electronic device 10 may include a display module 11 , a processor 12 , a memory 13 , and a power module 14 .

[0129] The processor 12 may include at least one of a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), a communication processor (CP), an image signal processor (ISP), and a controller.

[0130] The memory 13 may store data information required for the operation of the processor 12 or the display module 11. When the processor 12 executes an application stored in the memory 13, image data signals and / or input control signals may be transmitted to the display module 11, and the display module 11 may process the received signals and output image information through the display screen.

[0131] The power module 14 may include: a power supply module, such as a power adapter or a battery device; and a power conversion module that converts the power supplied by the power supply module to generate power required for the operation of the electronic device 10 .

[0132] At least one of the components of the electronic device 10 described above may be included in the display device DD according to the above embodiment. Furthermore, some independent modules functionally included in one module may be included in the display device DD, and other components may be provided separately from the display device DD. For example, the display device DD may include the display module 11, and the processor 12, memory 13, and power module 14 may be provided as other devices within the electronic device 10 in addition to the display device DD.

[0133] Figure 13 For showing Figure 12 Schematic diagram of an electronic device 10 according to various embodiments.

[0134] refer to Figure 12 and Figure 13 Various electronic devices 10 to which the display device DD according to the embodiment is applied may include not only image display electronic devices (such as smart phones 10_1a, tablet personal computers 10_1b, laptop computers 10_1c, televisions 10_1d and desktop monitors 10_1e), but also wearable electronic devices containing a display module 11 (such as smart glasses 10_2a, head-mounted displays 10_2b and smart watches 10_2c), and in-vehicle electronic devices 10_3 containing a display module 11 (such as a CID (center information display) and an interior mirror display placed on the instrument panel, a center console or a dashboard of a car).

[0135] However, this is exemplary, and the electronic device 10 according to the embodiments of the present disclosure is not limited thereto. For example, the electronic device 10 may be implemented as a mobile phone, a videophone, a smart tablet, a smartwatch, a tablet personal computer, a car display, a computer display, a notebook computer, a head-mounted display, or the like. Furthermore, the electronic device 10 may be a television, a monitor, or a tablet computer. Furthermore, the electronic device 10 may be an automobile.

[0136] The present disclosure may be applied to display devices and electronic devices including display devices. For example, the present disclosure may be applied to high-resolution smartphones, mobile phones, smart tablets, smart watches, tablet personal computers, car navigation systems, televisions, computer monitors, laptop computers, and the like.

[0137] While the present disclosure has been particularly shown and described with reference to embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit or scope of the present disclosure as defined by the claims.

Claims

1. A display device, comprising: Display panel; a first polymer disposed on the display panel, in direct contact with the display panel and having a first modulus; a second polymer disposed on the first polymer, in direct contact with the first polymer and having a second modulus less than the first modulus; as well as The window layer is disposed on the second polymer. 2 . The display device according to claim 1 , wherein the first modulus is 500 MPa or more and 2000 MPa or less. The display device according to claim 1 , wherein the second modulus is 30 MPa or less. 4 . The display device according to claim 1 , wherein a thickness of each of the first polymer and the second polymer is 30 μm or more and 70 μm or less. 5 . The display device according to claim 1 , wherein a sum of thicknesses of the first polymer and the second polymer is 100 μm or less. The display device according to claim 1 , wherein an adhesive force of the first polymer is greater than an adhesive force of the second polymer. 7 . The display device according to claim 1 , wherein an adhesive force between the first polymer and the display panel is 1500 gf / inch or greater. The display device according to claim 1 , wherein the second polymer has an elastic recovery rate of 90% or more. 9 . The display device according to claim 1 , wherein a creep value of the second polymer for 1 hour is 10% or less. 10 . The display device according to claim 1 , wherein the first polymer and the second polymer are transparent.

11. The display device according to claim 10, further comprising: a third polymer disposed on and covering at least a portion of the second polymer, and The second polymer has a shape including a plurality of protrusions, and the plurality of protrusions protrude in a direction of the window layer in a cross-sectional view. 12 . The display device of claim 11 , wherein the protrusion of the second polymer is in direct contact with the window layer. 13 . The display device according to claim 11 , wherein the first polymer and the third polymer comprise the same material. 14 . The display device according to claim 11 , wherein a thickness of each of the plurality of protrusions of the second polymer is 15 μm or more and 20 μm or less.

15. The display device according to claim 11, wherein adjacent protrusions among the plurality of protrusions of the second polymer have a constant pitch, and wherein the pitch is 10 μm or more and 50 μm or less.

16. A method for manufacturing a display device, comprising: providing a display panel; forming a first polymer having a first modulus on the display panel; forming a second polymer having a second modulus less than the first modulus on the first polymer; as well as A window layer is formed on the second polymer.

17. The method according to claim 16, further comprising: A protrusion pattern including a plurality of protrusions is formed in the second polymer.

18. The method according to claim 17, further comprising: A third polymer is formed on the second polymer to cover at least a portion of the second polymer. 19 . The method according to claim 17 , wherein a thickness of each of the plurality of protrusions of the second polymer is 15 μm or more and 20 μm or less.

20. The method of claim 17, wherein adjacent protrusions of the plurality of protrusions of the second polymer have a constant pitch, and wherein the pitch is 10 μm or more and 50 μm or less.

21. An electronic device comprising: display device; and a processor driving the display device, and The display device is the display device according to any one of claims 1 to 15 or a display device manufactured by the method according to any one of claims 16 to 20.