Miniature three-dimensional printing device

Abstract

A micro three-dimensional printing apparatus is provided. The micro three-dimensional printing apparatus includes: a micro LED display projector configured to emit image light; a material platform facing the micro LED display projector and configured to receive the image light; a movable printing plate configured to hold a three-dimensional printing object; and a moving mechanism connected with the movable printing plate and configured to move the movable printing plate.

Description

[0001] This patent application is a divisional application of Chinese patent application No. CN 202280100588.0, with the filing date of September 29, 2022, and the title “Micro 3D Printing Device”, which entered the Chinese national phase on March 28, 2025 in accordance with the PCT Treaty. Technical Field

[0002] The present disclosure relates generally to three-dimensional printing technology, and more particularly to a micro three-dimensional printing device. Background Art

[0003] The self-emissive micro-LED display panel, a micro-display module, includes a micro-LED (light-emitting diode) array and an integrated circuit (IC) backplane. The IC backplane connects each micro-LED, which serves as a pixel in the micro-LED array, to display images. The semiconductor technology of this invention enables the micro-LEDs to have a diameter of less than 5 microns, thereby improving the integrity and image quality of the display panel compared to traditional display panels such as LCDs (liquid crystal displays).

[0004] Various technologies are used to manufacture three-dimensional structures. For example, 3D printing devices use DLP (Digital Light Processing) projectors or laser scanners to cover large areas, with the resin reservoir moving in the x- or y-direction accordingly. However, alignment processes are required to correct the tilt, position, and size of the projected image from the DLP projector or scanner. Furthermore, the bulk of the DLP projector prevents the 3D printing device from being reduced, hindering its miniaturization and hindering its application in portable devices.

[0005] The above content is only used to help understand the technical solutions of the present disclosure and does not constitute an admission that the above content is prior art. Summary of the Invention

[0006] In order to overcome the above shortcomings, the present disclosure provides a micro 3D printing device and a manufacturing method thereof to reduce the size of the micro 3D printing device.

[0007] Embodiments of the present disclosure provide a micro 3D printing device comprising: a micro LED display projector configured to emit image light; a material platform facing the micro LED display projector and configured to receive the image light; a movable printing plate configured to hold a 3D printed object; and a moving mechanism connected to the movable printing plate and configured to move the movable printing plate.

[0008] Numerous other advantages and features of the present disclosure will be further appreciated from the following detailed description and accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Embodiments and aspects of the present disclosure are presented in the following detailed description and accompanying drawings.The various features shown in the drawings are not drawn to scale.

[0010] Figure 1 is a structural view of an exemplary micro 3D printing device according to some embodiments of the present disclosure.

[0011] Figure 2 is a cross-sectional structure of an exemplary micro display module according to some embodiments of the present disclosure.

[0012] Figure 3 is a cross-sectional structure illustrating an exemplary micro LED display projector according to some embodiments of the present disclosure.

[0013] Figure 4 is a schematic diagram of an exemplary image light rotation element according to some embodiments of the present disclosure.

[0014] Figure 5 An exemplary transmissive lens rotated about the X-axis according to some embodiments of the present disclosure is shown.

[0015] Figure 6 An exemplary transmissive lens rotated about the Y-axis according to some embodiments of the present disclosure is shown.

[0016] Figure 7 Schematic diagrams of exemplary microdisplay systems according to some embodiments of the present disclosure are shown.

[0017] Figure 8 A pixel region of a micro-LED array according to some embodiments of the present disclosure is shown.

[0018] Figure 9 The position of a pixel sub-image shifted from a target pixel point in a pixel area according to some embodiments of the present disclosure is shown.

[0019] Figure 10 A target image formed from target image data according to some embodiments of the present disclosure is shown.

[0020] Figure 11 The position of each sub-image displaced from the target image is shown according to some embodiments of the present disclosure.

[0021] Figure 12 The positions of sub-images displaced from a target image are shown according to some embodiments of the present disclosure.

[0022] Figure 13is a formula relationship between the distance by which a sub-image is shifted from a target image and the rotation angle of a transmission lens based on a specific axis according to some embodiments of the present disclosure.

[0023] Figure 14A and Figure 14B A flow chart of a micro-LED image display method according to some embodiments of the present disclosure is shown.

[0024] Figure 15 A block diagram illustrating a side cross-sectional view of an exemplary micro LED display panel according to some embodiments of the present disclosure is presented.

[0025] Figure 16 Shown are some embodiments according to the present disclosure. Figure 15 A structural diagram of a top view of a micro LED display panel is shown in FIG.

[0026] Figure 17 Shown are some embodiments according to the present disclosure. Figure 15 Structural diagram of a side cross-sectional view of a micro LED display chip shown in .

[0027] Figure 18 A block diagram illustrating a side cross-sectional view of another exemplary micro-LED display panel according to some embodiments of the present disclosure is presented.

[0028] Figure 19 Shown are some embodiments according to the present disclosure. Figure 18 A structural diagram of a top view of a micro LED display panel is shown in FIG.

[0029] Figure 20 Shown are some embodiments according to the present disclosure. Figure 18 A structural diagram of a side cross-sectional view of a variation of the exemplary micro LED display panel shown in FIG.

[0030] Figure 21 Shown are some embodiments according to the present disclosure. Figure 18 A structural diagram of a side cross-sectional view of another variation of the exemplary micro LED display panel shown in FIG.

[0031] Figure 22 Shown are some embodiments according to the present disclosure. Figure 18 A structural diagram of a side cross-sectional view of another variation of the exemplary micro LED display panel shown in FIG.

[0032] Figure 23 A block diagram illustrating a side cross-sectional view of another exemplary micro-LED display panel according to some embodiments of the present disclosure is presented.

[0033] Figure 24 Shown are some embodiments according to the present disclosure. Figure 23 A structural diagram of a top view of a micro LED display panel is shown in FIG.

[0034] Figure 25 Shown are some embodiments according to the present disclosure. Figure 23 A structural diagram of a side cross-sectional view of a variation of the exemplary micro LED display panel shown in FIG.

[0035] Figure 26 is a cross-sectional structural view of another micro LED display module according to some embodiments of the present disclosure.

[0036] Figure 27 is a cross-sectional structural view of another micro LED display projector according to some embodiments of the present disclosure.

[0037] Figure 28 is a cross-sectional structural view of another micro LED display projector according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0038] Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. The following description refers to the accompanying drawings, in which the same numbers in different figures represent the same or similar elements, unless otherwise indicated. The implementations set forth in the following description of the exemplary embodiments do not represent all implementations consistent with the present disclosure. Instead, they are merely examples of devices and methods related to the present invention that are consistent with the aspects listed in the appended claims. Specific aspects of the present disclosure are described in more detail below. In the event of a conflict with terms and / or definitions incorporated by reference, the terms and definitions provided herein shall prevail.

[0039] Figure 1 FIG is a structural view of an exemplary micro 3D printing device 100 according to some embodiments of the present disclosure. Figure 1As shown in FIG, a 3D printing device 100 includes a micro LED display projector 110, a material platform 120, a movable printing plate 130, and a moving mechanism 140. The micro 3D printing device 100 further includes a movement controller (not shown) electrically connected to the moving mechanism 140 and controlling the movement of the moving mechanism 140. The micro LED display projector 110 emits image light toward the material platform 120. The material platform 120 faces the micro LED display projector 110 and contains printing material. The movable printing plate 130 is used to hold a 3D printing object A. The moving mechanism 140 is connected to the movable printing plate 130 and is used to move the movable printing plate 130 so that it faces the material platform 120. During the printing process, the 3D printing object A can be printed on the movable printing plate 130. In other words, the printing material can be cured using the image light emitted from the micro LED display projector 110 and formed layer by layer on the surface of the movable printing plate 130. In some embodiments, the 3D printing device 100 can be a 3D printing device with a top-down or bottom-up build orientation. For the convenience of description, in the following description, a bottom-up directional three-dimensional printing device will be taken as an example for description.

[0040] The printing material in the material platform 120 can be selected from one or more photopolymerizable materials. For example, the photopolymerizable material includes one or more free radical photopolymerizable materials, cationic photopolymerizable materials, styrene compounds, vinyl ethers, and the like. Free radical photopolymerizable materials can include acrylic acid, methacrylic acid, N-vinyl pyrrolidone, acrylamide, styrene, olefins, halogenated olefins, cyclic olefins, maleic anhydride, olefins, alkynes, and the like. In some embodiments, cationic photopolymerizable materials can include epoxide groups and vinyl ether groups. Using the printing material, a three-dimensional object can be formed (e.g., printed) on the surface of the movable print plate 130.

[0041] During the printing process, the 3D printing apparatus 100 can print the 3D object layer by layer. Each printed layer can have the same or different thicknesses. Figure 1In this example, a three-dimensional printed object A is printed on the bottom surface of the movable printing plate 130. The moving mechanism 140 can be connected to the movable printing plate 130 by one or more mechanical structures (e.g., screws) to move the movable printing plate 130, which is not limited herein. After printing one layer, the movable printing plate 130 can be moved upward by the distance of one layer. The next layer of the three-dimensional object can then be printed using a printed pattern generated by the image light emitted from the micro LED display projector 110. The micro LED display projector 110 can project the image / pattern layer by layer until the three-dimensional object is completely printed. It can now be understood that the image / pattern projected by the micro LED display projector 110 corresponds to the layer to be printed and is consistent with the movement of the movable printing plate 130. In some embodiments, the image light and movement of the movable printing plate can be controlled by a computer program to be consistent with the design of the three-dimensional object to be printed.

[0042] In some embodiments, the material platform 120 is transparent. In some embodiments, the emitted light from the micro LED display projector 110 can be transmitted through the material platform 120 into the printed material. Figure 1 , the material platform 120 is formed above the micro LED display projector 110. Therefore, the emitted light from the micro LED display projector 110 can provide light to the printing material for curing the printing material during the three-dimensional printing process.

[0043] The movement controller is electrically connected to the movement mechanism 140 and is used to control the movement of the movement mechanism 140. During the 3D printing process, the movable printing plate 130 can be moved by the movement mechanism 140 to face the material platform 120 and the micro-LED display projector 110. The focal plane of the micro-LED display projector 110 is located on the surface of the material platform 120, for example, on the bottom surface for a bottom-up printing process, or on the top surface for a top-down printing process. In this example, the focal plane of the micro-LED display projector 110 is located on the bottom surface of the material platform 120.

[0044] The micro-LED display projector 110 may further include a micro-LED display module for emitting patterned light. The micro-LED display module may further include a micro-LED display panel. The micro-LED display panel may be an AM (active matrix) micro-LED display panel or a PM (passive matrix) micro-LED display panel. To cure the printed material, the wavelength of light emitted from the micro-LED display panel does not exceed 4430 nm. In some embodiments, the emitted light is ultraviolet light.

[0045] Still refer to Figure 1, a pocket bracket 150 is further provided to support the micro LED display projector 110 and the material platform 120. The micro LED display projector 110 is set in the pocket bracket 150, and the material platform 120 is set on the top of the pocket bracket 150. Through the pocket bracket 150, the micro LED display projector 110 and the material platform 120 can be integrated together. Therefore, the three-dimensional printing device 100 can be portable. In addition, a top opening opposite to the micro LED display projector 110 is formed on the top surface of the pocket bracket 150 to receive the material platform 120. The material platform 120 is set in the top opening.

[0046] Further details of the micro LED display projector including the micro LED display module will be further described below.

[0047] Figure 2 is a cross-sectional structure of an exemplary micro LED display module 200 according to some embodiments of the present disclosure. Figure 2The micro LED display module 200 includes a micro LED display panel 210. The micro LED display module 200 also includes an image light rotation element 220. A reinforcing plate 250 is formed on the back of the micro LED display panel 210 to support the micro LED display panel 210. A mounting frame 240 connects the reinforcing plate 250 to the image light rotation element 220. Furthermore, the mounting frame 240 includes a first cavity 241 and a second cavity 242. The image light rotation element 220 is disposed in the first cavity 241, and the micro LED display panel 210 is disposed in the first cavity 241, facing the image light rotation element 220. In some embodiments, the micro LED display panel 210 is disposed at an edge of the first cavity 241, and an edge of the reinforcing plate 250 is adhered to one edge of the mounting frame 240 using conventional bonding methods (e.g., glue or any other adhesive). Furthermore, the first cavity 241 and the second cavity 242 are separated by an internal protrusion 243 protruding from the inner sidewall of the mounting frame 240. In some embodiments, the inner protrusion 243 is formed on the inner wall of the mounting frame 240 as a ring-shaped protrusion. In some embodiments, the inner protrusion 243 may include multiple discrete segments. The first chamber 241 and the second chamber 242 are connected to form a light channel L through which image light can be emitted. Therefore, the protrusion 243 does not block the image light emitted from the transmissive lens (not shown). The edge of the image light rotation element 220 is adhered to one sidewall of the inner protrusion 243 using conventional bonding methods (such as glue or any other adhesive). The micro-LED display panel 210 may further include an IC (integrated circuit) backplane and a micro-LED array area having one or more micro-LEDs. The micro-LED array area is formed on the surface of the IC backplane, and each micro-LED is electrically connected to the IC backplane. In some embodiments, the micro-LED array area is bonded to the surface of the IC backplane using a metal bond.

[0048] Figure 3 is a cross-sectional view illustrating an exemplary micro LED display projector 300 according to some embodiments of the present disclosure. Figure 3The aforementioned micro LED display module 200 can be embedded in a micro display projector 300. In some embodiments, the micro LED display projector 300 includes the aforementioned micro LED display module 200 and a lens assembly 330. The lens assembly 330 is positioned facing the micro LED display module 200 and is configured to receive image light emitted from the micro LED display module 200. The lens assembly 330 is arranged and supported within a pillar structure. The edge 331 of the pillar structure is secured to the mounting frame 240. Furthermore, the edge 331 of the pillar structure is inserted into and adhered to the other sidewall of the protrusion 243 in the second chamber 242. Furthermore, the main body of the pillar structure extends outside the second chamber 242. In some embodiments, the diameter of at least one lens of the lens assembly 330 is no less than the diagonal length of the micro LED array area and no less than the diameter of the transmissive lens (not shown). In some embodiments, the micro LED display module 200 further includes a control unit 260. The control unit 260 is electrically connected to the micro LED display panel 210 and the image light rotation element 220.

[0049] Figure 4 is a schematic diagram of an exemplary image light rotation element 220 according to some embodiments of the present disclosure. Figure 4 The image light rotating element 220 includes a transmissive lens 221 and a lens position rotating actuator 222. The transmissive lens 221 is arranged to face the micro LED array area. Figure 2 The lens position rotation actuator 222 is connected to the transmissive lens 221 via at least one preset axis. In some embodiments, the preset axis is parallel to the micro LED array area. In some embodiments, as Figure 4 As shown, the preset axes include the X-axis and the Y-axis.

[0050] Figure 5 A transmissive lens 221 is shown configured to rotate about the X-axis according to some embodiments of the present disclosure. Figure 5 , the transmissive lens 221 can be rotated by a lens position actuator (e.g., Figure 4 The lens position rotation actuator 222 in the lens position rotation actuator 221 rotates about the X-axis. For example, the lens position rotation actuator generates a magnetic field to rotate the transmissive lens 221 about the X-axis. This is understood by those skilled in the art and will not be described here. In some embodiments, the X-axis is parallel to the micro-LED array area in the first direction.

[0051] Figure 6 A transmissive lens 221 is shown configured to rotate about the Y axis according to some embodiments of the present disclosure. Figure 6 , the transmissive lens 221 can be further rotated by a lens position actuator (e.g., Figure 2The lens position rotation actuator 222 in the lens position rotation actuator 221 rotates about the Y-axis. For example, the lens position rotation actuator generates a magnetic field to rotate the transmissive lens 221 about the Y-axis, which is understood by those skilled in the art and will not be described here. As disclosed herein, the Y-axis is parallel to the micro-LED array area in the second direction. The first direction is not parallel to the second direction. In some embodiments, the first direction is perpendicular to the second direction, such that the X-axis is perpendicular to the Y-axis. For example, the X-axis is horizontal, while the Y-axis is vertical.

[0052] refer to Figure 5 and Figure 6 The rotation angles of transmissive lens 221 can be designed to be +X° (about the X-axis), -X° (about the X-axis), +Y° (about the Y-axis), and -Y° (about the Y-axis). In some embodiments, X° is no greater than 15°, and Y° is no greater than 15°. In three-dimensional space, the rotation angles of transmissive lens 221 can be (-X°, +Y°), (+X°, +Y°), (+X°, -Y°), and (-X°, -Y°).

[0053] In some embodiments, the micro LED display module further includes an actuator controller electrically connected to the lens position rotation actuator 222, which is used to control the rotation direction and rotation frequency of the lens position rotation actuator 222, so that the transmission lens 221 can be rotated at different angles around the X-axis and / or Y-axis, and the emitted light of each pixel of the micro LED display panel 210 can be shifted at different positions to increase the resolution of the pixel.

[0054] Figure 7 A schematic diagram of an exemplary microdisplay system 700 according to some embodiments of the present disclosure is shown. Figure 7, the above-mentioned micro LED display module can be applied to a micro display system 700. The micro display system 700 includes a micro LED display module 710 and a control unit 720. The control unit 720 is connected to a micro LED display panel 711 and an image light rotation element 712. The micro LED display panel 711 includes a micro LED array area 711a and an IC (integrated circuit) backplane 711b, which is formed (such as by metal bonding) at the bottom of the micro LED array area 711a and is electrically connected to each micro LED. The image light rotation element 712 includes a transmissive lens 712a and an actuator controller 712b. The control unit 720 is connected to the IC backplane 711b and the actuator controller 712b for sending signals to the IC backplane 711b and the actuator controller 712b. The control unit 720 is configured to process the target image data to form N sub-image data, calculate the rotation direction and rotation frequency of the transmissive lens 712a for each sub-image data based on the refresh frequency of the target image data, transmit the rotation direction and rotation frequency to the actuator controller 712b, and transmit the sub-image data and rotation frequency to the IC backplane 711b. The actuator controller 712b is configured to receive the rotation direction and rotation frequency of the transmissive lens 712a for each sub-image data. The actuator controller 712b is further configured to control a lens position rotation actuator (not shown) and the transmissive lens 712a to perform rotation processing based on the rotation direction and rotation frequency for each sub-image data. The IC backplane 711b is configured to synchronously control the micro LED display panel 711 to display the sub-image according to the sub-image data and the rotation frequency.

[0055] The sub-images, the shifted positions of the sub-images, and the relationship between the rotation of the transmissive lens and the shifted positions of the sub-images are described in further detail below.

[0056] Each pixel point in the micro LED array area is formed in a corresponding pixel area, and each pixel area includes N pixel sub-images. The pixel sub-images of the pixel points are shifted in a shift order in the pixel area of ​​the pixel points. The N sub-images are shifted in the same shift order as the pixel sub-images, where N is an integer and not less than 2. The rotation frequency of the sub-image data is M times the refresh frequency of the target image data; where M is an integer and not less than 2. In some embodiments, M is equal to N. In some embodiments, M is an even integer. In some embodiments, the shift direction is clockwise. The refresh frequency of the target image data is 50 Hz to 70 Hz. In some embodiments, M can be less than 1, for example, 0.5.

[0057] Figure 8 An exemplary pixel region 800 of a micro-LED array according to some embodiments of the present disclosure is shown. Figure 8, shows an initial pixel image without transmission lens rotation. Figure 8 As shown, the large block shows the pixel area 800, and the small block shows the pixel points 810 of the pixel area 800 as dot-shaped small blocks. Figure 9 illustrative positions of pixel sub-images shifted from target pixel points in a pixel region according to some embodiments of the present disclosure are shown. Figure 9 , shows the pixel sub-image with the transmission lens rotation. Figure 9 As shown, the dashed blocks represent the initial pixels that have not moved in the target image. The pixel region includes a first pixel sub-image 901, a second pixel sub-image 902, a third pixel sub-image 903, and a fourth pixel sub-image 904. The first pixel sub-image 901 is shifted to the upper left relative to the pixel 910 (dashed block) in the target image 920 in the pixel region. The second pixel sub-image 902 is shifted to the upper right relative to the pixel 910 in the target image in the pixel region. The third pixel sub-image 903 is shifted to the lower right relative to the pixel 910 in the target image in the pixel region. The fourth pixel sub-image 904 is shifted to the lower left relative to the pixel 910 in the target image in the pixel region.

[0058] As disclosed herein, in some embodiments, the transmissive lens is rotated at a frequency four times the refresh rate of the target image data. The rotation angles of the transmissive lens are (-X°, +Y°), (+X°, +Y°), (+X°, -Y°), (-X°, -Y°), so that the sub-images corresponding to each rotation angle are displayed clockwise from left to right and from top to bottom.

[0059] Figure 10 A target image formed from target image data according to some embodiments of the present disclosure is shown. Figure 10 , the target image is formed by the different grayscale values ​​of the micro LED array. The micro LED array of the micro LED display panel is an M×N matrix, wherein M is a positive integer greater than 2, and N is a positive integer greater than 2. In some embodiments, the micro LED array is a 1280×680 matrix. Figure 10 As shown, four pixels (e.g., 1001 to 1004) correspond to four micro-LEDs. This is merely an example of a micro-LED array used to describe a target image and sub-images and is not intended to limit the scope of this disclosure. In some embodiments, the width or length of the micro-LED display panel is no greater than 5 µm, and the diagonal of the micro-LED array area is no greater than 5 cm. Therefore, the micro-LED display panel can be designed to be small.

[0060] Figure 11: shows an exemplary position of each sub-image shifted relative to a pixel point in the target image according to some embodiments of the present disclosure. Figure 11 , the target image data is processed to form four sub-image data: a first sub-image 1101, a second sub-image 1102, a third sub-image 1103 and a fourth sub-image 1104. Figure 11 As shown in the figure, the dotted blocks represent the pixels of each sub-image in the target image. The sub-image formed by the sub-image data is Figure 11 are shown separately.

[0061] refer to Figure 9 and Figure 11 , each pixel region includes a first pixel image 901, a second pixel image 902, a third pixel image 903, and a fourth pixel image 904. The first pixel image 901 is shifted to the upper left relative to the pixels in the target image within the pixel region; the second pixel image 902 is shifted to the upper right relative to the pixels in the target image within the pixel region; the third pixel image 903 is shifted to the lower right relative to the pixels in the target image within the pixel region; and the fourth pixel image 904 is shifted to the lower left relative to the pixels in the target image within the pixel region. Therefore, the first sub-image 1101 is shifted to the upper left relative to the target image within the target image region; the second sub-image 1102 is shifted to the upper right relative to the target image within the target image region; the third sub-image 1103 is shifted to the lower right relative to the target image within the target image region; and the fourth sub-image 1104 is shifted to the lower left relative to the target image within the target image region. The target image region is identical to the micro LED array region and does not change during the display process.

[0062] like Figure 11 As described, as the transmission lens rotates in sequence at rotation angles of (-Xº, +Yº), (+Xº, +Yº), (+Xº, -Yº), (-Xº, -Yº), the position of the sub-image shifts in a clockwise direction from left to right and from top to bottom. That is, the position of the sub-image is moved by rotating the transmission lens; and the position of the sub-image is determined by the rotation angle of the transmission lens. In some embodiments, the sub-image formed by the sub-image data is the same as the target image formed by the target image data, thereby ensuring the quality of the displayed target image. In addition, the grayscale values ​​of all pixel sub-images of the same pixel point are the same as the grayscale values ​​of the target pixel image of the same pixel point in the target image data, such as Figure 11 In another example, the grayscale value of at least one pixel sub-image at the same pixel point is different from the grayscale of the target pixel image at the same pixel point in the target image data. In some embodiments, one pixel corresponds to one micro-LED.

[0063] Figure 12The position of the sub-image shifted relative to the target image according to some embodiments of the present disclosure is shown. A control unit (e.g., Figure 7 The control unit 720 in the embodiment is configured to send the four sub-image data and the rotation frequency to the IC backplane, and send the rotation angle and the rotation frequency to the actuator controller. Figure 12 , the dotted blocks (e.g., 1210) represent the pixels of the target image. The actuator controller (e.g., Figure 7 The actuator controller 712b in the embodiment controls the transmissive lens to rotate at a rotation angle of (-X°, +Y°) based on a rotation frequency (eg, 240 Hz), and the IC backplane (eg, Figure 7 The IC backplane 711b in FIG1 controls the micro LED display panel to display the first sub-image based on the rotation frequency, as shown in the first target image 1201. The actuator controller controls the transmissive lens to rotate at a rotation angle (+X°, +Y°) based on the rotation frequency, and the IC backplane controls the micro LED display panel to display the second sub-image based on the rotation frequency, as shown in the second target image 1202. Similarly, the display of the third sub-image is shown in the third target image 1203, and similarly, the display of the fourth sub-image is shown in the fourth target image 1204. Because the rotation frequency is very fast, the human eye cannot see the transformation of the four sub-images, and only sees the following. Figure 12 The final target image shown in the fourth target image 1204 in FIG. 1 is similar to Figure 10 The four sub-images are combined together in a clockwise direction to form the final target image shown in the fourth target image 1204.

[0064] Figure 13 The formula relationship between the distance that a sub-image is shifted from a target image and the rotation angle of a transmissive lens based on a specific axis according to some embodiments of the present disclosure is shown. Figure 13 , the relationship between the displacement distance and the rotation angle is as follows:

[0065] ;

[0066] Where Δy is the shift distance, θ is the rotation angle, t is the center thickness of the transmissive lens, and n is the refractive index of the transmissive lens. In some embodiments, the shift distance between adjacent sub-images is, for example, 50% to 100% of the pixel pitch. Therefore, the rotation angle can be calculated using the above formula.

[0067] Figure 14A 1 is a flow chart showing a micro-LED image display method 1400A according to some embodiments of the present disclosure. Figure 14A, a micro-LED image display method 1400A using the above-mentioned micro-LED display module includes the following steps 1401A to 1404A.

[0068] At step 1401A, target image data is obtained. The target image data may be obtained by a control unit (e.g., control unit 720) for further processing. In some embodiments, the target image data may be stored in a memory and may be obtained by the control unit via a network. In some embodiments, the memory is an external memory.

[0069] In step 1402A, the target image data is processed to generate N sub-image data, where N is not less than 2. For example, four sub-image data are generated. The four sub-image data are identical, and the four sub-images formed based on the sub-image data are identical, such as Figure 10 shown.

[0070] In step 1403A, N sub-images are displayed in sequence according to the N sub-image data based on the rotation frequency and preset rotation direction of the transmission lens of each sub-image data, where N is an integer and not less than 2. In addition, the pixel sub-image of the pixel point is shifted in the pixel area of ​​the pixel point in a shift order; the N sub-images are shifted in the same shift order as the pixel sub-images. The rotation frequency of the sub-image data is M times the refresh frequency of the target image data. In some embodiments, N is an integer and not less than 2, and M is an integer not less than 2. In some embodiments, M is equal to N. In some embodiments, M is an even integer. For example, the rotation frequency of the transmission lens is four times the refresh frequency of the target image data. The refresh frequency of the target image data is, for example, 50 Hz to 70 Hz. In this example, the shift direction is clockwise. The sub-image formed by the sub-image data is the same as the target image formed by the target image data.

[0071] In some embodiments, the actuator controller is configured to rotate the transmissive lens at a rotation angle of (-X°, +Y°) based on a rotation frequency (e.g., 240 Hz), and the IC backplane is configured to control the micro LED display panel displaying the first sub-image 1101 based on the rotation frequency, such as Figure 11 The actuator controller is configured to rotate the transmissive lens at a rotation angle (+X°, +Y°) based on the rotation frequency, and the IC backplane is configured to control the micro LED display panel displaying the second sub-image 1102 based on the rotation frequency, as shown. Figure 11 A similar display of the third sub-image 1103 and a similar display of the fourth sub-image 1104 are also shown. Figure 11 Shown in.

[0072] In some embodiments, the IC backplane includes an IC driver circuit for driving each of the micro-LEDs. In some embodiments, the IC driver circuit is driven and controlled by a PWM (pulse width modulation) signal and a current source. In some embodiments, the grayscale value of each micro-LED is controlled by the PWM signal.

[0073] Reference Figure 14A , in step 1404A, steps 1401A and 1403A are repeated until all target image data are displayed.

[0074] For example, by repeating steps 1401A to 1403A, a plurality of target images may be displayed.

[0075] Figure 14B Another micro-LED image display method 1400B using the aforementioned micro-LED display module according to some embodiments of the present disclosure is shown. The method 1400B includes the following steps 1401B to 1404B.

[0076] At step 1401B, at least one target image data is obtained.

[0077] At step 1402B, each target image data is processed to generate N sub-image data for each target image data.

[0078] In step 1403B, based on the rotation frequency of the transmission lens and the preset rotation direction for each sub-image data, N sub-images of the target image data are sequentially displayed according to the sub-image data of the target image data, where N is an integer not less than 2.

[0079] In step 1404B, the sub-image of the next target image data is displayed in sequence by looping step 1403B until all target images are displayed.

[0080] The details of steps 1402B to 1403B can be referred to steps 1402A to 1403A and will not be repeated here.

[0081] Figures 15 to 25 A micro LED display panel is shown, which can be implanted as a display panel 210 in a Figure 2 and Figure 3 middle. Figure 15 FIG1 shows a block diagram of a side cross-sectional view of an exemplary micro LED display panel 1500 showing a micro LED display chip according to some embodiments of the present disclosure. Figure 15As shown, micro LED display panel 1500 includes a micro LED display chip 1530, a top cover plate 1540, and a sealing structure 1550. Micro LED display chip 1530 includes a micro LED array area 1532 and an integrated circuit (IC) substrate 1531. Micro LED array area 1532 is located on IC substrate 1531, forming the image display area of ​​micro LED display chip 1530. The remaining area of ​​IC substrate 1531 not covered by micro LED array area 1532 is a non-functional area. Top cover plate 1540 is positioned above the micro LED display chip and supported by sealing structure 1550. Top cover plate 1540 covers at least a portion of the image display area (e.g., micro LED array area 1532) and the non-functional area. Therefore, light emitted from the image display area is transmitted upward to top cover plate 1540. Sealing structure 1550 is formed between the edges of micro LED display chip 1530 and top cover plate 1540. It will be appreciated that the sealing structure 1550 forms an enclosed area on the micro LED display chip 1530 (more specifically, on the IC substrate 1531) and surrounds the image display area (e.g., the micro LED array area 1532). In some embodiments, the outer sidewalls of the sealing structure 1550 are vertically aligned with the sidewalls of the top cover plate 1540. In some embodiments, the micro LED display chip 1530 is a self-emissive micro LED display chip.

[0082] For the micro LED display panel 1500 , the sealing structure 1550 can prevent light from being emitted from the image display area to the outside through the gap between the top cover plate 1540 and the micro LED display chip 1530 .

[0083] In some embodiments, the distance between the top cover plate 1540 and the micro LED display chip 1530 (e.g., the distance between the bottom surface of the top cover plate 1540 and the top surface of the micro LED array region 1532) is no greater than the thickness of the micro LED display chip 1530. For example, the thickness of the micro LED display chip 1530 is 500 μm to 5 mm. In some embodiments, the distance between the top cover plate 1540 and the micro LED display chip 1530 (e.g., the distance between the bottom surface of the top cover plate 1540 and the top surface of the micro LED array region 1532) is no greater than the thickness of the top cover plate 1540. For example, the thickness of the top cover plate 1540 is no greater than 1500 μm. More specifically, the thickness of the top cover plate 1540 is in the range of 200 μm to 1500 μm. In some embodiments, the distance between the top cover plate 1540 and the micro LED display chip 1530 is the same as the thickness of the top cover plate 1540. For example, the distance between the top cover plate 1540 and the micro LED display chip 1530 is in the range of 200 μm to 1500 μm. In some embodiments, the distance between the top cover plate 1540 and the micro LED display chip 1530 is in the range of 3 μm to 5 μm. In some embodiments, the top cover plate 1540 is transparent. For example, the material of the top cover plate 1540 can be organic glass or inorganic glass. In some embodiments, the top cover plate 1540 is a glass cover.

[0084] In some embodiments, the sealing structure 1550 is formed on the non-functional area of ​​the micro LED display chip 1530. That is, the sealing structure 1550 connects the IC substrate 1531 and the top cover plate 1540. The height of the sealing structure 1550 can be equal to the distance between the top cover plate 1540 and the non-functional area (e.g., the top of the IC substrate 1531). In some embodiments, the sealing structure 1550 can include a light-absorbing material, such as a combination of a film-forming agent composed of a resin, a polymer, and a photosensitizer. The light-absorbing material can include a film-forming agent. The film-forming agent can include one or more of a resin, a polymer, a photosensitizer, or a combination thereof. Using the light-absorbing material, the sealing structure 1550 can further absorb light emitted from the image display area to improve image quality.

[0085] In some embodiments, sealing structure 1550 may include a sealant 1551 and a plurality of spacers 1552. Sealing structure 1550 may be a combination of sealant 1551 and the plurality of spacers 1552. The material of sealant 1551 may include one or more of a resin and a polymer. For example, the resin may be epoxy, and the polymer may be silicone. Spacers 1552 may be small spheres of the same diameter. Because sealant 1551 is flowable, top cover plate 1540 can be pressed down as close to micro LED display chip 1530 as possible. Therefore, the diameter of the spheres can define the height of sealing structure 1550, or in other words, the distance between top cover plate 1540 and non-functional areas (e.g., the top of IC substrate 1531). Using this sealing structure 1550, the distance between top cover plate 1540 and micro LED display chip 1530 can be effectively maintained or adjusted based on the thickness of spacers 1552 (e.g., the diameter of the spheres).

[0086] In some embodiments, the micro LED display panel 1500 may further include a support substrate formed below the bottom of the micro LED display chip 1530. The support substrate is rigid, thereby providing a stable base for the micro LED display chip 1530.

[0087] Figure 16 Shown are some embodiments according to the present disclosure. Figure 15 15. A structural diagram of a top view of a micro LED display panel 1500 is shown in FIG. Figure 17 Shown are some embodiments according to the present disclosure. Figure 15 FIG. 1 is a side cross-sectional view of a micro LED display panel 1500 shown in FIG. Figure 16 and Figure 17 The micro LED display chip 1530 includes a micro LED array area 1532 and an IC substrate 1531. The IC substrate is formed at the bottom of the micro LED array area 1532 and has a portion extending outside the micro LED array area 1532. The micro LED array area 1532 forms an image display area, and the extended portion of the IC substrate 1531 forms a non-functional area. The micro LED array area 1532 further includes a plurality of micro LEDs 1533 arranged in an array. A plurality of signal metal pads and dummy metals may be further formed on the surface of the non-functional area. The signal metal pads may include a plurality of IO (input / output) metal pads 1591 and a plurality of dummy metal pads 1592.

[0088] The IO metal pad 1591 can be conductively connected to the IC substrate 1531. The micro LEDs 1533 in the micro LED array region 1532 are connected to the IC substrate 1531 through a plurality of first metal connection holes 1593. That is, each micro LED 1533 is connected to the IC substrate 1531 through one first metal connection hole 1593. The corresponding top of the first metal connection hole 1593 is connected one-to-one with the micro LED 1533. Therefore, the plurality of first metal connection holes 1593 correspond to the plurality of micro LEDs 1533. Figure 16 As shown, first metal connection holes 1593 are formed in the same array as the micro LED array, and first metal connection holes 1593 are formed as the first connection area on IC substrate 1531 corresponding to the micro LED array area (e.g., the image display area). The bottoms of the signal metal pads, namely IO metal pad 1591 and dummy metal pad 1592, are connected to IC substrate 1531 via a plurality of second metal connection holes 1594. The bottoms of second metal connection holes 1594 of IO metal pad 1591 are conductively connected to the bottoms of first metal connection holes 1593 (via connections not shown). Thus, IO metal pad 1591 is conductively connected to micro LED 1533 through second metal connection holes 1594, IC substrate 1531, and first metal connection holes 1593. The bottoms of second metal connection holes 1594 of dummy metal pad 1592 are conductively connected to the top electrodes of micro LED 1533. Second metal connection holes 1594 are formed as the second connection area in the non-functional area. The second connection region is spaced apart from the first connection region and is located near the edge of the IC substrate 1531. In some embodiments, the first connection region is referred to as an internal connection region, and the second connection region is referred to as an external connection region. A first metal connection hole 1593 and a second metal connection hole 1594 are formed in the top layer 1534 of the IC substrate 1531. Note that the IC substrate 1531 may further include conventional metal interconnect layers to connect the IO metal pads 1591 of each micro LED 1533. Those skilled in the art will understand the metal interconnect layers and will not be described here.

[0089] refer to Figure 15 and Figure 16 Since the sealing structure 1550 is formed on the non-functional area, the first connection area and the second connection area are further separated by the sealing structure 1550. For example, the second connection area is formed between the sealing structure 1550 and the edge of the IC substrate 1531. The second connection area is not covered by the sealing structure 1550. Figure 16As shown, IO metal pads 1591 are formed in a one-dimensional array (e.g., in a straight line) on the second connection region. At least some of dummy metal pads 1592 are formed on the second connection region, and the dummy metal pads are arranged in a one-dimensional array. In some embodiments, all of dummy metal pads 1592 and IO metal pads 1591 are formed on the second connection region.

[0090] refer to Figure 15 and Figure 16 , micro LED display panel 1500 further includes bonding wires 1570. Bonding wires 1570 connect signal metal pads on the second connection region, such as IO metal pads 1591 and dummy metal pads 1592, to external circuits. Thus, IC substrate 1531 and micro LEDs 1533 in micro LED array region 1532 can be conductively connected to external circuits via bonding wires 1570. Since only the signal metal pads on the second connection region are used for connection to external circuits, interference from IO metal pads 1591 can be reduced, facilitating external design.

[0091] Return Reference Figure 15 In some embodiments, the micro LED display panel 1500 further includes a protective layer 1580. The protective layer 1580 is formed on the surface of the second connection area and covers the surface of the bonding wire 1570 to protect the connection between the second connection area and the external circuit. The bonding wire 1570 can also be protected by the protective layer 1580. In some embodiments, the top of the protective layer 1580 is lower than the top of the top cover plate 1540. Therefore, the protective layer 1580 cannot contact the top cover plate 1540. In some embodiments, the top of the protective layer 1580 can be lower than the top of the micro LED array area 1532. The material of the protective layer 1580 can include resin and polymer. For example, the resin is epoxy resin and the polymer is silicone. In some embodiments, the sidewalls of the protective layer 1580 are connected to the sidewalls of the sealing structure 1550. Therefore, the protective layer 1580 and the sealing structure 1550 are connected, and there is no exposed non-functional area between the protective layer 1580 and the sealing structure 1550.

[0092] In some embodiments, the micro LED display panel 1500 further includes an external circuit board 1520. External circuits are formed on the external circuit board 1520. The external circuit board 1520 is formed at the bottom of the micro LED display chip 1530, with a portion extending outside the micro LED display chip 1530. A protective layer 1580 is further formed on the surface of the extended portion of the external circuit board 1520. In some embodiments, a support substrate 1510 is further formed below the bottom of the external circuit board 1520. The support substrate 1510 is rigid, thereby providing a stable base for the micro LED display chip 1530 and the external circuit board 1520.

[0093] In some embodiments, the external circuit board 1520 is formed outside the bottom of the micro LED display chip 1530, surrounding the micro LED display chip 1530. That is, the circuit board 1520 and the micro LED display chip 1530 are integrated in the same plane. As a result, the micro LED display panel 1500 can be more compact. The protective layer 1580 is further formed on a portion of the external circuit board 1520. In this example, the support substrate 1510 can be formed under the external circuit board 1520 and the micro LED display chip 1530. In some embodiments, the external circuit board 1520 is made of a flexible material. For example, the external circuit board 1520 is made of a flexible printed circuit.

[0094] Figures 18 to 22 FIG2 shows a structural diagram illustrating a variation of another exemplary micro LED display panel 1800 according to some embodiments of the present disclosure. Figures 18 to 22 , the micro LED display panel 1800 includes a micro LED display chip 1830, a top cover plate 1840 and a light shielding layer 1860. The micro LED display chip 1830 includes a micro LED array area 1832 and an IC substrate 1831. The micro LED array area 1832 is located on the IC substrate 1831 to form an image display area of ​​the micro LED display chip 1830. The remaining area on the IC substrate 1831 not covered by the micro LED array area 1832 is formed as a non-functional area. The top cover plate 1840 is formed above the micro LED display chip 1830. Light emitted from the image display area is transmitted upward to the top cover plate 1840. The light shielding layer 1860 is formed on the edge surface of the top cover plate 1840. It can be understood that the light shielding layer 1860 extends along the periphery of the top cover plate 1840. The light shielding layer 1860 can be formed on the top edge surface of the top cover plate 1840 (such as Figure 18 as shown) or on the bottom edge surface of the top cover plate 1840 (as shown Figure 21 The projection of the light shielding layer 1860 on the micro LED display chip 1830 in the vertical direction covers at least a portion of the non-functional area. Figure 19 Shown are some embodiments according to the present disclosure. Figure 18 or Figure 20 FIG. 1 is a top view of a micro LED display panel 1800. Figure 19 As shown, when viewed from the top, a light shielding layer 1860 is formed around the top cover plate 1840 and covers at least a portion of the non-functional area, exposing the image display area. The shape of the light shielding layer 1860 is a closed geometric structure that exposes at least the image display area, such as a rectangular frame, a circular frame, an oval frame, or any other geometric shape. Figure 19 The light shielding layer 1860 shown in FIG is rectangular with an opening that exposes at least the image display area. In some embodiments, because the image display area (e.g., the micro LED array area 1832) may not be located at the center of the micro LED display chip 1830, the center of the opening (e.g., the center of the display area or the center of the micro LED array area 1832) is not aligned with the center of the top cover plate 1840.

[0095] Therefore, light emitted from the image display area and transmitted to the top cover plate 1840 formed with the light shielding layer 1860 cannot be reflected back to the micro LED display chip 1830 to improve image quality.

[0096] In some embodiments, the projection of light shielding layer 1860 on the non-functional area covers the 10 metal pad and the dummy metal pad. Therefore, no light is reflected back from the 10 metal pad and the dummy metal pad, or further reflected outward from micro LED display chip 1830 by the 10 metal pad and the dummy metal pad. In some embodiments, the projection of light shielding layer 1860 on the non-functional area further covers the dummy metal formed on the non-functional area to prevent reflection from the dummy metal.

[0097] In some embodiments, the outer edge of the light shielding layer 1860 is vertically aligned with the sidewall of the top cover plate 1840. This means that the light shielding layer 1860 extends to the farthest edge of the top cover plate 1840. In some embodiments, the inner edge of the light shielding layer 1860 is vertically aligned with the sidewall of the image display area. Therefore, the projection area of ​​the light shielding layer 1860 on the micro LED display chip 1830 covers the non-functional area as much as possible. In addition, the projection area of ​​the light shielding layer 1860 on the micro LED display chip 1830 covers the entire non-functional area.

[0098] In some embodiments, light shielding layer 1860 is an anti-reflective coating. For example, the material of the light shielding layer is black photoresist. The thickness of light shielding layer 1860 is no greater than half the thickness of top cover plate 1840. For example, the thickness of light shielding layer 1860 is in the range of 0.3 μm to 5 μm. Light shielding layer 1860 can be a spin-on coating on top cover plate 1840. That is, light shielding layer 1860 is spin-coated on top cover plate 1840.

[0099] In some embodiments, as Figure 18 As shown, a light shielding layer 1860 is formed on the top edge surface of the top cover plate 1840. Since the top cover plate 1840 is transparent, the light shielding layer 1860 on the top edge surface can also prevent reflection of the transmitted light. Figure 20 FIG2 shows a block diagram illustrating a side cross-sectional view of another variation of an exemplary micro LED display panel 1800 according to some embodiments of the present disclosure. Figure 20 As shown, a light shielding layer 1860 is further formed on the side wall of the top cover plate 1840 to further prevent the light emitted from the image display area from being reflected by the side wall of the top cover plate 1840. This further improves the image quality.

[0100] like Figure 18 and Figure 20 As shown in , the micro LED display panel 1800 may further include a sealing structure 1850. The sealing structure 1850 is formed between the top surface of the non-functional area and the bottom surface of the top cover plate 1840, thereby forming a closed space between the micro LED display chip 1830 and the top cover plate 1840 around the image display area. In some embodiments, the distance between the micro LED display chip 1830 and the top cover plate 1840 is no greater than the thickness of the micro LED display chip 1830 or the thickness of the top cover plate 1840. Due to the thickness of the light shielding layer 1860, the height of the sealing structure 1850 is equal to the distance between the non-functional area (e.g., the top of the IC substrate 1831) and the top cover plate 1840.

[0101] Figure 21 FIG2 shows a block diagram illustrating a side cross-sectional view of another variation of an exemplary micro LED display panel 1800 according to some embodiments of the present disclosure. Figure 21 As shown, a light shielding layer 1860 is formed on the bottom edge surface of the top cover plate 1840. The projection of the light shielding layer 1860 in the vertical direction covers at least a portion of the non-functional area. Figure 22 FIG2 shows a block diagram illustrating a side cross-sectional view of another variation of an exemplary micro LED display panel 1800 according to some embodiments of the present disclosure. Figure 22 As shown, the light shielding layer 1860 is formed on the bottom edge surface of the top cover plate 440 and is further formed on the sidewalls of the top cover plate 1840 .

[0102] like Figure 21 and Figure 22 As shown in FIG, the micro LED display panel 1800 further includes a sealing structure 1850. The sealing structure 1850 is formed between the top surface of the non-functional area and the bottom surface of the light shielding layer 1860 to form an enclosed space between the micro LED display chip 1830 and the top cover plate 1840 surrounding the image display area. In some embodiments, the distance between the micro LED display chip 1830 and the top cover plate 1840 is no greater than the thickness of the micro LED display chip 1830 or the thickness of the top cover plate 1840. Due to the thickness of the light shielding layer 1860, the height of the sealing structure 1850 is less than the distance between the non-functional area (e.g., the top of the IC substrate 1831) and the top cover plate 1840.

[0103] In some embodiments, anti-reflective material can be integrated at the edge of the top cover plate to form a light shielding layer integrated with the top cover plate.

[0104] like Figures 18 to 22 As shown, the micro LED display panel 1800 may further include a support substrate 1810, an external circuit board 1820, one or more bonding wires 1870, and a protective layer 1880. Further details about the support substrate 1810, the external circuit board 1820, the sealing structure 1850, the bonding wires 1870, the protective layer 1880, and the signal metal pads can be found in the reference Figure 15 The description of the illustrated embodiment can be found in the accompanying drawings and will not be described further here.

[0105] Figures 23 to 25 A structural diagram illustrating a variation of another exemplary micro LED display panel according to some embodiments of the present disclosure is shown. Figures 23 to 25 The micro LED display panel 2300 includes a micro LED display chip 2330, a top cover plate 2340, and a light shielding layer 2360. The micro LED display chip 2330 includes a micro LED array region 2332 and an IC substrate 2331. The micro LED array region 2332 is located on the IC substrate 2331 to form an image display region of the micro LED display chip 2330. The remaining area of ​​the IC substrate 2331 not covered by the micro LED array region 2332 forms a non-functional region. The light shielding layer 2360 is formed on at least a portion of the surface of the non-functional region. Therefore, light emitted from the image display region and reflected by the top cover plate 2340 to the non-functional region cannot be reflected again. In some embodiments, the top of the light shielding layer 2360 is lower than the top of the micro LED display chip 2330 (e.g., the top of the micro LED array region 2332).

[0106] In some embodiments, an IO metal pad is further formed on the surface of the non-functional area, and the IO metal pad is covered by a light shielding layer 2360. Therefore, light reflected to the non-functional area cannot be reflected again by the IO metal pad, thereby improving the quality of the micro LED display panel.

[0107] In some embodiments, dummy metal is further formed on the surface of the non-functional area, and the dummy metal is further covered by the light shielding layer 2360. In some embodiments, the light shielding layer 2360 covers the entire non-functional area.

[0108] In some embodiments, the outer edge of the light shielding layer 2360 is vertically aligned with a portion of the sidewall of the micro LED display chip 2330. Furthermore, the outer edge of the light shielding layer 2360 is vertically aligned with a portion of the non-functional area. In some embodiments, the light shielding layer 2360 covers the non-functional area except for one edge surface exposed for connecting the bonding wire 2370. In some embodiments, the inner edge of the light shielding layer 2360 is vertically aligned with the sidewall of the image display area. That is, the light shielding layer 2360 contacts the micro LED array area 2332. Therefore, the light shielding layer 2360 covers the non-functional area as much as possible.

[0109] Figure 24 Shown are some embodiments according to the present disclosure. Figure 23 The top view of the micro LED display panel is shown in FIG. Figure 24 As shown, as viewed from the top, a light shielding layer 2360 is formed on a non-functional area of ​​the IC substrate 2331, exposing the image display area. The shape of the light shielding layer 2360 is a closed geometric structure that exposes at least the image display area, such as a rectangular frame, a circular frame, an oval frame, or any other geometric shape. Figure 24 The shape of the light shielding layer 2360 shown in FIG. 2 is a rectangle having an opening that exposes at least the image display area.

[0110] In some embodiments, the light shielding layer 2360 is an anti-reflective coating. For example, the material of the light shielding layer is black photoresist. The thickness of the light shielding layer 2360 is no greater than half the thickness of the top cover plate 2340. For example, the thickness of the light shielding layer 2360 is in the range of 0.3 μm to 5 μm.

[0111] In some embodiments, the micro LED display panel 2300 may further include a sealing structure 2350. The sealing structure 2350 is formed between the top surface of the light shielding layer 2360 and the bottom surface of the edge of the top cover plate 2340, surrounding the image display area, to form a closed space between the micro LED display chip 2330 and the top cover plate 2340 surrounding the image display area. In some embodiments, the distance between the micro LED display chip 2330 and the top cover plate 2340 is no greater than the thickness of the micro LED display chip 2330 or the thickness of the top cover plate 2340. Due to the thickness of the light shielding layer 2360, the height of the sealing structure 2350 is less than the distance between the non-functional area (e.g., the top of the IC substrate 2331) and the top cover plate 2340.

[0112] Figure 25 FIG2 shows a block diagram illustrating a side cross-sectional view of another variation of an exemplary micro LED display panel 2300 according to some embodiments of the present disclosure. Figure 25 As shown, the light shielding layer 2360 can be further formed on the side wall of the top cover plate 2340.

[0113] like Figures 23 to 25 As shown, the micro LED display panel 2300 may further include a support substrate 2310, an external circuit board 2320, one or more bonding wires 2370, and a protective layer 2380. Further details about the support substrate 2310, the external circuit board 2320, the sealing structure 2350, the bonding wires 2370, the protective layer 2380, and the signal metal pads can be found in the reference Figure 15 The description of the illustrated embodiment can be found in the accompanying drawings and will not be described further here.

[0114] Figure 26 is a cross-sectional structural view of another micro display module according to some embodiments of the present disclosure. Figure 26, the micro LED display module includes three monochrome micro LED display panels (for example, a red micro LED display panel, a blue micro LED display panel, and a green micro LED display panel) 2611, 2612, 2613, and an optical combination unit 2660 for combining the three-color images into one target image. The three monochrome micro LED display panels 2611, 2612, 2613 are arranged around the optical combination unit 2660. The supporting frame 2650' includes a central cavity and four openings surrounding the central cavity. The optical combination unit 2660 is arranged in the central cavity. The red micro LED display panel 2611, the blue micro LED display panel 2612, and the green micro LED display panel 2613 are respectively fixed at the edges of the three openings, and another opening is used to transmit image light outward. The other opening is arranged to face one of the three openings and to face one of the three micro LED display panels (for example, 2611). The other opening faces the transmission lens, so that the image light emitted from the optical combination unit can be transmitted into the transmission lens (the arrow indicates the transmission direction of the image light). For example, as Figure 26 As shown, image light E1 emitted from micro LED display panel 2611, image light E2 emitted from micro LED display panel 2612, and image light E3 emitted from micro LED display panel 2613 are combined by optical combination unit 2660 and emitted in emission guide E4. As disclosed herein, optical combination unit 2660 is an optical combination prism, such as a color combination prism. The back surface of the reinforcing plate (not shown) is not outside the edge of the support frame 2650'. Figure 26 As shown, dotted line L1 represents the plane of the back surface of the micro LED display panel 2612, and dotted line L2 represents the plane of the edge of the support frame 2650'. The micro LED display module may further include an image light rotating element 2620 and a mounting frame 2640. Further details about the image light rotating element 2620 and the mounting frame 2640 can be found in the reference Figure 2 and Figure 3 The description of the embodiment shown in FIG can be found in the accompanying drawings and will not be described further here.

[0115] Figure 27 is a cross-sectional structural view of another micro display projector according to some embodiments of the present disclosure. Figure 27 , the micro LED display projector includes a lens group 2630 and Figure 26The aforementioned micro LED display module is shown in FIG. Lens assembly 2630 is arranged facing the color combining prism (optical combination unit 2660) to receive the combined image light emitted from micro LED display panels 2611, 2612, and 2613. The diameter of at least one lens in lens assembly 2630 is no less than the diagonal length of the micro LED array area. The diameter of at least one lens in lens assembly 2630 can be less than the width of the color combining prism. Further details of the micro LED display panel, image light rotation element, and lens assembly can be found in the previous description and are not repeated here.

[0116] Figure 28 is a cross-sectional structural view of another micro display projector according to some embodiments of the present disclosure. Figure 28 A micro LED display projector includes a reinforcing plate 2650, a micro LED display panel 2610, and a lens group 2630. The lens group 2630 is positioned facing the micro LED display panel 2610. The micro LED display panel 2610 can be seen in the aforementioned Figures 15 to 25 The description of the micro LED display panel will not be repeated here.

[0117] It should be understood by those skilled in the art that the micro LED display module or micro LED display panel is not limited to the above structure and may include more or fewer components than shown, or may combine some components, or may use different components.

[0118] The micro 3D printing device with a micro LED display projector disclosed herein can be reduced in size. The micro LED display module improves image accuracy, thereby improving the performance of micro 3D printing.

[0119] It should be noted that relational terms in this document, such as "first" and "second", are used only to distinguish an entity or operation from another entity or operation, and do not require or imply any actual relationship or order between these entities or operations. In addition, the words "comprising", "having", "containing", and "including" and other similar forms are intended to be equivalent in meaning and are open-ended, and one or more items following any of these words does not mean an exhaustive list of such one or more items, or means limited to the listed one or more items.

[0120] As used herein, unless expressly stated otherwise, the term "or" encompasses all possible combinations unless not feasible. For example, if it is stated that a database may include either A or B, then unless expressly stated otherwise or not feasible, the database may include either A, or B, or A and B. As a second example, if it is stated that a database may include either A, B, or C, then unless expressly stated otherwise or not feasible, the database may include either A, or B, or C, or A and B, or A and C, or B and C, or A, B, and C.

[0121] In the foregoing description, embodiments have been described with reference to many specific details, which may vary depending on the implementation. Certain changes and modifications may be made to the described embodiments. Other embodiments will be clear to those skilled in the art in view of the description and practice of the invention disclosed herein. The description and examples are intended to be regarded as merely exemplary, with the true scope and spirit of the invention being indicated by the following claims. The order of steps shown in the accompanying drawings is also intended to be for illustrative purposes only and is not intended to be limited to any particular order of steps. Therefore, it will be understood by those skilled in the art that these steps may be performed in different orders while implementing the same method.

[0122] In the drawings and the specification, exemplary embodiments have been disclosed. However, many variations and modifications may be made to these embodiments. Therefore, although specific terms are employed, they are used in a general and descriptive sense only and not for the purpose of limitation.

Claims

1. A micro package structure comprising: A micro LED panel comprising an IC (integrated circuit) substrate and a micro LED array region formed on the IC substrate, wherein the IC substrate comprises a first connection region corresponding to the micro LED array region and a second connection region remote from the first connection region, and a plurality of signal metal pads are formed on the second connection region; a top cover plate formed above the micro LED panel such that light emitted from the micro LED array area is transmitted upwardly to the top cover plate; as well as One or more bonding wires for connecting the signal metal pad to an external circuit.

2. The micro package structure according to claim 1, wherein: The signal metal pads include a plurality of IO (Input / Output) metal pads and a plurality of dummy metal pads; and at least some of all of the IO metal pads and the dummy metal pads are formed on the second connection region.

3. The micro package structure according to claim 2, wherein: All of the dummy metal pads are formed on the second connection region.

4. The micro package structure according to claim 1, wherein: The micro LED array area includes a plurality of micro LEDs; and the IC substrate includes: a plurality of first metal connection holes connecting the plurality of micro LEDs and the IC substrate, and A plurality of second metal connection vias are connected to the plurality of signal metal pads. 5 . The micro package structure according to claim 1 , further comprising a protection layer formed on a surface of the second connection region and covering around a surface of the one or more bonding wires. 6 . The micro-package structure according to claim 5 , further comprising an external circuit board formed at the bottom of the micro LED panel and having a protruding portion extending to an outside of the micro LED panel.

7. The micro package structure according to claim 6, wherein: The protective layer is further formed on the surface of the protruding portion. 8 . The micro package structure according to claim 6 , further comprising a support substrate formed at a bottom of the external circuit board.

9. The micro package structure according to claim 8, wherein: The support substrate is rigid. 10 . The micro package structure according to claim 5 , further comprising an external circuit board formed to extend to an outer side of a bottom of the micro LED panel.

11. The micro package structure according to claim 10, wherein: The protection layer is further formed on a portion of the external circuit board. 12 . The micro package structure according to claim 4 , further comprising a support substrate formed at a bottom surface of the micro LED panel.

13. The micro package structure according to claim 12, wherein: The support substrate is rigid.

14. The micro package structure according to claim 5, wherein: The top of the protection layer is lower than the top of the top cover plate.

15. The micro package structure according to claim 14, wherein: The top of the protection layer is lower than the top of the micro LED array area.

16. The micro package structure according to claim 5, wherein: Materials of the protective layer include resins and polymers.

17. The micro package structure according to claim 16, wherein: The resin is epoxy and the polymer is silicone.

18. The micro package structure according to any one of claims 4 to 17, wherein: The top cover plate is transparent.

19. The micro package structure according to claim 18, wherein: The material of the top cover plate is organic glass or inorganic glass.

20. The micro package structure according to claim 18 or 19, wherein: The thickness of the top cover plate is no greater than the thickness of the micro LED panel.

21. The micro package structure according to claim 20, wherein: The thickness of the top cover plate is not greater than 1500 μm.

22. The micro package structure according to claim 20, wherein: The thickness of the top cover plate is in the range of 200 μm to 1500 μm.

Images