Equipment shell, preparation method thereof and electronic equipment

Abstract

The invention relates to an equipment shell, a preparation method of the equipment shell and electronic equipment. The equipment shell comprises a first base material layer, a first adhesive layer, an acetate fiber layer, a second adhesive layer and a second base material layer which are sequentially stacked, wherein the first base material layer is a light-transmitting layer, the first adhesive layer is adhered between the first base material layer and the cellulose acetate fiber layer, and the second adhesive layer is adhered between the second base material layer and the cellulose acetate fiber layer. The equipment shell provided by the invention has various appearance effects and waterproof performance.

Description

Technical Field

[0001] The present disclosure relates to the field of terminal production technology, and in particular to a device housing, a preparation method thereof, and an electronic device. Background Art

[0002] With the rapid development of various devices, including electronic devices, product updates are occurring at a rapid pace, leading to fierce competition among brands. To increase product sales, it's crucial to enhance the aesthetics, fashion sense, and personalization of products. Cellulose acetate can replicate a variety of natural, random textures while also creating a stronger gloss and depth of field. Therefore, there's a pressing need to develop applications for cellulose acetate in the housings of various devices, including electronic devices, to enhance their aesthetic appeal. Summary of the Invention

[0003] The present disclosure provides a device housing, a method for preparing the device housing, and an electronic device to address deficiencies in the related art.

[0004] According to a first aspect of an embodiment of the present disclosure, a device housing is provided, comprising a first substrate layer, a first adhesive layer, an acetate layer, a second adhesive layer and a second substrate layer stacked in sequence; wherein the first substrate layer is a light-transmitting layer, the first adhesive layer is bonded between the first substrate layer and the acetate layer, and the second adhesive layer is bonded between the second substrate layer and the acetate layer.

[0005] Optionally, the second substrate layer is a light-transmitting layer.

[0006] Optionally, the first substrate layer and / or the second substrate layer is a resin layer.

[0007] Optionally, the first substrate layer and the second substrate layer are the same or different resin layers.

[0008] Optionally, the first substrate layer and / or the second substrate layer is a composite resin layer, and the composite resin layer includes at least two resin materials.

[0009] Optionally, the first adhesive layer and / or the second adhesive layer includes a photosensitive adhesive layer.

[0010] Optionally, the thickness of the cellulose acetate layer is in the range of 0.07 to 0.08 mm.

[0011] Optionally, the acetate fiber layer is obtained by directly slicing an acetate fiber board.

[0012] Optionally, the cellulose acetate sheet is prepared by the following method:

[0013] Treating cellulose with acetic anhydride to obtain cellulose acetate powder;

[0014] mixing the cellulose acetate powder and a plasticizer to obtain preformed cellulose acetate particles;

[0015] The preformed acetate fiber particles are added into a mold, and the acetate fiber sheet is obtained through a hot pressing process and a parquet reassembly process.

[0016] According to a second aspect of an embodiment of the present disclosure, there is provided a method for preparing a device housing, comprising the following steps:

[0017] obtaining an acetate layer and a first substrate layer;

[0018] After a first light-curing step, the first substrate layer and the acetate fiber layer are bonded together by a first adhesive layer to obtain a molded part;

[0019] After a second light-curing process, the second base material layer is bonded to the side of the cellulose acetate layer in the to-be-molded part that is away from the first base material layer through a second adhesive layer.

[0020] Optionally, the acetate fiber layer is prepared by the following method: directly slicing an acetate fiber sheet into the acetate fiber layer, and the thickness of the acetate fiber layer is in the range of 0.07 to 0.08 mm.

[0021] Optionally, the cellulose acetate sheet is prepared by the following method:

[0022] Treating cellulose with acetic anhydride to obtain cellulose acetate powder;

[0023] mixing the cellulose acetate powder and a plasticizer to obtain preformed cellulose acetate particles;

[0024] The preformed acetate fiber particles are added into a mold, and the acetate fiber sheet is obtained through a hot pressing process and a parquet reassembly process.

[0025] Optionally, during the preparation of the cellulose acetate material, the parquet reassembly process is performed multiple times.

[0026] Optionally, the preparation process of the cellulose acetate material also includes the introduction of a colorant.

[0027] Optionally, the colorant contains more than one color type.

[0028] Optionally, the thickness of the first substrate layer and / or the second substrate layer is within the range of 0.05 to 0.06 mm.

[0029] Optionally, the first adhesive layer and / or the second adhesive layer includes a photosensitive adhesive layer.

[0030] Optionally, the first substrate layer and / or the second substrate layer are the same or different resin layers.

[0031] Optionally, after the second substrate layer is bonded to the side of the cellulose acetate layer facing away from the first substrate layer, it can be further formed at high temperature and high pressure.

[0032] According to a third aspect of an embodiment of the present disclosure, there is provided an electronic device, comprising the aforementioned device housing, or a device housing obtained according to the aforementioned preparation method.

[0033] The technical solutions provided by the embodiments of the present disclosure may have the following beneficial effects:

[0034] It can be seen from the above embodiments that the present disclosure can provide a device housing including an acetate fiber layer and a preparation method thereof, wherein the device housing has rich and diverse appearance effects and waterproof performance.

[0035] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0037] Figure 1 The figure shows a structure of a device housing according to an exemplary embodiment.

[0038] Figure 2 is a structural diagram of another device housing according to an exemplary embodiment.

[0039] Figure 3 The figure is a flow chart of preparing a device housing according to an exemplary embodiment.

[0040] Figure 4 is another flowchart of preparing a device housing according to an exemplary embodiment. DETAILED DESCRIPTION

[0041] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all possible embodiments consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.

[0042] The terms used in this disclosure are for the purpose of describing specific embodiments only and are not intended to limit the disclosure. As used in this disclosure and the appended claims, the singular forms "a," "an," "the," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

[0043] In the present disclosure, the term "light-transmitting layer" refers to a material layer with high transparency (transmittance > 70%), which can better transmit light; its material can be glass, resin, glass fiber, etc., and its material selection is not subject to specific restrictions. The term "photosensitive adhesive" refers to the use of light energy to make the adhesive have the property of being sticky, which can be quickly cured under the irradiation of light to form a strong bonding layer. The term "resin" refers to a natural, naturally modified or synthetic substance that can be used directly or after cross-linking as a polymer material such as plastics, adhesives, coatings, etc., or as their main raw material component. The term "cellulose acetate" refers to the product after some of the hydroxyl groups in cellulose are esterified with acetate.

[0044] It should be understood that although the terms first, second, third, etc. may be used in this disclosure to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this disclosure, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining."

[0045] The present disclosure provides a device housing, such as Figure 1 As shown, the device housing includes a first substrate layer 1, a first adhesive layer 2, an acetate layer 3, a second adhesive layer 4, and a second substrate layer 5, which are stacked in sequence; wherein the acetate layer can provide the device housing with a rich and diverse appearance effect; the alternating arrangement of the two substrate layers and the two adhesive layers can provide the device housing with good waterproof performance, and the solution of enclosing the acetate layer between the first substrate layer and the second substrate layer through the gluing process to improve the waterproof performance can reduce the production cost of the device housing compared to the solution of forming the electroplated waterproof layer through the electroplating process.

[0046] The first substrate layer 1 is a light-transmitting layer. When the first substrate layer 1 serves as an exterior layer, the texture of the cellulose acetate layer 3 can be seen through the light-transmitting layer, enhancing the aesthetics of the device housing. The material of the light-transmitting layer is selected from glass, resin, glass fiber, or metal oxide. In some embodiments, the light-transmitting layer is selected from a resin layer. When the material of the light-transmitting layer is selected from a resin, the manufacturing cost of the device housing can be reduced compared to materials such as glass and metal oxide. In some embodiments, the first substrate layer 1 is a composite resin layer comprising at least two resin materials. The composite resin layer may include at least two of polypropylene (PP), epoxy resin (EP), polycarbonate (PC), polymethyl methacrylate (PMMA), polyvinyl alcohol (PVA), polyimide (PI), acrylonitrile-butadiene-styrene copolymer (ABS), and polystyrene (PS). For example, the composite resin layer may be a composite layer of polycarbonate and polymethyl methacrylate, but is not limited thereto.

[0047] In some embodiments, the thickness of the first substrate layer 1 is in the range of 0.05 to 0.06 mm.

[0048] The first adhesive layer 2 is used to bond to the first substrate layer 1 and the acetate layer 3; in some embodiments, the first adhesive layer 2 may include photosensitive adhesive, pressure-sensitive adhesive, anaerobic adhesive, heat-activated adhesive or hot melt adhesive; in some embodiments, the first adhesive layer 2 may include photosensitive adhesive, which has higher bonding strength and durability than traditional adhesives.

[0049] The acetate layer 3 can replicate various natural random textures and can present a stronger gloss and depth of field effect. In the present disclosure, the acetate layer 3 is obtained by directly slicing the acetate sheet. In some embodiments, the thickness of the acetate layer 3 is in the range of 0.07 to 0.08 mm. In some embodiments, the acetate sheet is prepared by the following method: treating cellulose with acetic anhydride to obtain acetate powder; mixing it with a plasticizer to obtain preformed acetate particles; adding the preformed acetate particles to a mold, and obtaining the acetate sheet through a hot pressing process and a parquet reassembly process. In some embodiments, the preformed acetate particles and a colorant are added to the mold together.

[0050] The second adhesive layer 4 is used to bond to the second substrate layer 5 and the acetate layer 3. In some embodiments, the second adhesive layer 4 comprises the same material as the first adhesive layer 2. In some embodiments, the second adhesive layer 4 has the same thickness as the first adhesive layer 2. In some embodiments, the second adhesive layer 4 may comprise a photosensitive adhesive, a pressure-sensitive adhesive, an anaerobic adhesive, a heat-activated adhesive, or a hot melt adhesive. In some embodiments, the second adhesive layer 4 may comprise a photosensitive adhesive, which has higher bonding strength and durability than traditional adhesives.

[0051] In some embodiments, the second substrate layer 5 may be a light-transmitting layer, the material of which is selected from glass, resin, glass fiber, or metal oxide. In some embodiments, the light-transmitting layer is selected from a resin layer; when the material of the light-transmitting layer is selected from a resin, it can reduce the production cost of the device housing relative to materials such as glass and metal oxide. In some embodiments, the second substrate layer 5 is a resin layer or a composite resin layer comprising at least one, two, or more resin materials, and the resin layer or composite resin layer may include at least one of polypropylene (PP), epoxy resin (EP), polycarbonate (PC), polymethyl methacrylate (PMMA), polyvinyl alcohol (PVA), polyimide (PI), acrylonitrile-butadiene-styrene copolymer (ABS), and polystyrene (PS). For example, the resin layer may be a resin layer comprising polycarbonate, but is not limited thereto. In some embodiments, the second substrate layer 5 has the same material as the first substrate layer 1.

[0052] In some embodiments, the second substrate layer 5 may also be a light-proof layer. The light-proof layer is selected from metal, resin, wood or metal oxide, but is not limited thereto.

[0053] In some embodiments, the thickness of the second substrate layer 5 is in the range of 0.05 to 0.06 mm. In some embodiments, the second substrate layer 5 has the same thickness as the first substrate layer 1 .

[0054] The present disclosure also provides a device housing, such as Figure 2 As shown, the device comprises a sequentially stacked flow coating / rubbing layer 11, a first substrate layer 1, a first adhesive layer 2, an acetate layer 3, a second adhesive layer 4, a second substrate layer 5, a UV transfer layer 51, and a coating layer 52. The flow coating / rubbing layer 11 is obtained by subjecting the first substrate layer 1 to a flow coating and / or rubbing process. The flow coating process sequentially comprises: applying a flow coating liquid, baking, and UV curing. In some embodiments, the flow coating liquid comprises at least one of polyurethane acrylate, fluorosilicone polymer, butyl acetate, and n-butanol. In some embodiments, the baking temperature is selected from 35°C to 95°C. In some embodiments, the UV curing time is 1 to 30 seconds, and the UV energy used is 150 to 950 mJ. The rubbing process comprises: applying the material to be rubbed onto a mold of a rubbing device, and then pressing the material onto the first substrate layer 1 by rubbing. After the flow coating and / or rubbing process, a hardened or otherwise surface-modified first substrate layer is obtained.

[0055] like Figure 2 As shown, the first substrate layer 1 is a composite board comprising two resin layers (PMMA resin layer and PC resin layer), wherein the PC resin layer is used for bonding with the acetate fiber layer, and the PMMA resin layer is used for flow coating and / or rubbing process; the second substrate layer 5 is a PC resin layer.

[0056] like Figure 2 As shown, the first adhesive layer 2 and the second adhesive layer 4 are made of the same material as UV adhesive. The UV adhesive contains a polymer backbone bonded to a photoinitiator. Even if the photoinitiator does not participate in the complete reaction, it is still present on the polymer backbone and will not be freed, thus not producing odor. In addition, the UV adhesive uses the short-wave UVC band for light curing. Sunlight does not contain this band, so it will not be polymerized when exposed to sunlight. In some embodiments, the UV adhesive includes a polyurethane acrylic resin with a curing energy of 1000 to 1500 mj / cm 2 .

[0057] like Figure 2 As shown, a UV transfer process and a coating process can also be performed on the side of the second substrate layer 5 facing away from the acetate layer 3 to obtain a UV transfer layer 51 and a coating layer 52; wherein the UV transfer process includes: outputting the designed texture pattern into a photo-drawing film or a glass film using a laser photoplotter, coating a UV transfer layer 51 on the side of the second substrate layer 5 facing away from the acetate layer 3, coating UV glue on the UV transfer layer 51, and closely laminating the coated UV glue to the photo-drawing film or the glass film, performing exposure imaging, and then forming a texture pattern. The coating process includes depositing a coating medium, such as titanium, chromium, zirconium, silicon oxide, indium oxide, tin oxide, zirconium oxide, titanium oxide, copper oxide, or aluminum oxide, onto the side of the second substrate layer 5 facing away from the cellulose acetate layer 3 through a coating process such as optical coating, physical vapor deposition (PVD), chemical vapor deposition (CVD), plasma-enhanced chemical vapor deposition (PECVD), reactive DC lithography, RF sputtering, or magnetron sputtering, thereby forming a coating layer 52. The UV transfer layer 51 and / or the coating layer 52 can further impart a textured, three-dimensional appearance to the device housing.

[0058] In some embodiments, a magnetic texture layer can be applied to the side of the first substrate layer 1 facing away from the acetate layer 3 and / or the side of the second substrate layer 5 facing away from the acetate layer 3. The magnetic texture layer can be formed by magnetic spraying, whereby a magnetic field is used to control the distribution of the magnetic material during the spraying process to form a desired texture pattern. In some embodiments, a thermal transfer texture layer can be applied to the side of the first substrate layer 1 facing away from the acetate layer 3 and / or the side of the second substrate layer 5 facing away from the acetate layer 3. The thermal transfer texture layer can be applied by applying a PVC thermal transfer film to the substrate or gradient color layer, baking it at a preset temperature for 30-50 minutes, and then peeling off the PVC film to obtain the thermal transfer texture. In some embodiments, an ink layer can be applied to the side of the first substrate layer 1 facing away from the acetate layer 3 and / or the side of the second substrate layer 5 facing away from the acetate layer 3. The ink layer can be applied using at least one of screen printing, roller printing, or inkjet printing techniques. The magnetic texture layer, thermal transfer texture layer, and ink layer can further enhance the appearance of the device housing.

[0059] In the present disclosure, the UV transfer layer 51, the coating layer 52, the magnetic texture layer, the thermal transfer texture layer and the ink layer can be selected and arranged according to actual needs; their relative positions are not limited to Figure 2 As shown in .

[0060] The present disclosure provides a method for preparing a device housing, such as Figure 3 As shown, the preparation method comprises the following steps:

[0061] In step 105 , a first substrate layer and an acetate layer are obtained, and the first substrate layer and the acetate layer obtained in step 104 are subjected to a first light curing process, and the first substrate layer and the acetate layer are bonded together by a first adhesive layer.

[0062] Step 106 , subjecting the molded part obtained in step 105 to a second light curing process, wherein the second substrate layer is bonded to the side of the cellulose acetate layer facing away from the first substrate layer via a second adhesive layer.

[0063] The present disclosure also provides a method for preparing a device housing, such as Figure 4 As shown, the preparation method comprises the following steps:

[0064] Step 101: Provide cellulose and acetic anhydride, and use acetic anhydride to treat the cellulose to obtain cellulose acetate powder.

[0065] Step 102: Mixing cellulose acetate powder and a plasticizer to obtain preformed cellulose acetate particles.

[0066] Step 103 : Add the preformed acetate fiber particles into a mold, and obtain an acetate fiber sheet through a hot pressing process and a parquet reassembly process.

[0067] Step 104 : directly slicing the acetate fiber board into acetate fiber layers, wherein the thickness of the acetate fiber layers is within a range of 0.07 to 0.08 mm.

[0068] In step 105 , a first substrate layer and an acetate layer are obtained, and the first substrate layer and the acetate layer obtained in step 104 are subjected to a first light curing process, and the first substrate layer and the acetate layer are bonded together by a first adhesive layer to obtain a molded part.

[0069] Step 106 , subjecting the molded part obtained in step 105 to a second light curing process, and bonding the second substrate layer to the side of the acetate layer in the molded part facing away from the first substrate layer via a second adhesive layer.

[0070] In some embodiments, the cellulose in step 101 is a pure fraction extracted from trees and cotton waste; however, the source of the cellulose is not limited thereto.

[0071] In some embodiments, the addition of a plasticizer can impart desired thermal processability, flexibility, and ductility to the acetate powder.

[0072] In some embodiments, in step 102, additives such as light stabilizers, heat stabilizers, and colorants (dyes, pigments, pearlescent powder, etc.) may also be added; the types and contents of the above additives may be selected according to actual needs.

[0073] In some embodiments, in step 103 , the parquet reassembly process is performed multiple times.

[0074] In some embodiments, in step 103, a pre-colorant and preformed acetate particles may be added to the mold together; the type and amount of the pre-colorant may be selected based on actual needs. In some embodiments, acetate particles of varying shapes and colors undergo a hot pressing process and a patchwork reassembly process, where their irregular textures and rich colors collide to create a variety of different patterns and textures.

[0075] In some embodiments, after step 104, the prepared cellulose acetate layer may be subjected to processes such as baking, flattening, and packaging.

[0076] In some embodiments, in step 105 and step 106, the first adhesive layer and the second adhesive layer are made of the same UV adhesive. In some embodiments, the UV adhesive used in step 105 and step 106 includes polyurethane acrylic resin, which is cured by ultraviolet light with a curing energy of 1000 to 1500 mj / cm 2 .

[0077] In some embodiments, the first substrate layer is a composite layer comprising two resin layers (a PMMA resin layer and a PC resin layer); wherein the PC resin layer is used for bonding with the acetate fiber layer.

[0078] In some embodiments, the first substrate layer has a thickness of 0.38 mm.

[0079] In some embodiments, the second substrate layer is a PC resin layer; and the thickness of the second substrate layer is 0.125 mm.

[0080] In some embodiments, the second substrate layer further includes a UV transfer layer and a coating layer on a side facing away from the acetate layer.

[0081] In some embodiments, after step 106, the following steps are further included:

[0082] Step 107: Place the device housing obtained in step 106 into a high-pressure molding machine for high-pressure and high-temperature molding; the molding temperature is 135°C to 145°C, and the time is 8s±5s; the specific parameters of the high-pressure and high-temperature molding can be selected according to actual needs.

[0083] Step 108: The surface of the device housing obtained in step 107 is subjected to decorative processing such as high-gloss curtain coating, curtain coating AG, or rubbing flash sand.

[0084] In some embodiments, the device housing provided by the present disclosure may be a back cover of a mobile phone.

[0085] Other embodiments of the present disclosure will readily occur to those skilled in the art after considering the specification and practicing the disclosure herein. This disclosure is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the present disclosure being indicated by the following claims.

[0086] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes can be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A device housing, characterized in that: It includes a first substrate layer, a first adhesive layer, an acetate fiber layer, a second adhesive layer and a second substrate layer stacked in sequence; wherein the first substrate layer is a light-transmitting layer, the first adhesive layer is bonded between the first substrate layer and the acetate fiber layer, and the second adhesive layer is bonded between the second substrate layer and the acetate fiber layer.

2. The device housing according to claim 1, wherein: The first substrate layer and / or the second substrate layer is a resin layer.

3. The device housing according to claim 2, characterized in that The first substrate layer and / or the second substrate layer is a composite resin layer, and the composite resin layer includes at least two resin materials.

4. The device housing according to claim 1, wherein: The first adhesive layer and / or the second adhesive layer comprises a photosensitive adhesive layer.

5. The device housing according to claim 1, wherein: The thickness of the cellulose acetate layer is in the range of 0.07 to 0.08 mm.

6. The device housing according to claim 1, wherein: The acetate fiber layer is obtained by directly slicing the acetate fiber board.

7. The device housing according to claim 6, characterized in that The cellulose acetate sheet is prepared by the following method: Treating cellulose with acetic anhydride to obtain cellulose acetate powder; mixing the cellulose acetate powder and a plasticizer to obtain preformed cellulose acetate particles; The preformed acetate fiber particles are added into a mold, and the acetate fiber sheet is obtained through a hot pressing process and a parquet reassembly process.

8. A method for preparing a device housing, characterized in that: The following steps are involved: obtaining an acetate layer and a first substrate layer; After a first light-curing step, the first substrate layer and the acetate fiber layer are bonded together by a first adhesive layer to obtain a molded part; After a second light-curing process, the second base material layer is bonded to the side of the cellulose acetate layer in the to-be-molded part that is away from the first base material layer through a second adhesive layer.

9. The method according to claim 8, characterized in that The cellulose acetate layer is prepared by the following method: The cellulose acetate sheet is directly sliced ​​into the cellulose acetate layer, and the thickness of the cellulose acetate layer is within the range of 0.07 to 0.08 mm.

10. The method according to claim 8, characterized in that The cellulose acetate sheet is prepared by the following method: Treating cellulose with acetic anhydride to obtain cellulose acetate powder; mixing the cellulose acetate powder and a plasticizer to obtain preformed cellulose acetate particles; The preformed acetate fiber particles are added into a mold, and the acetate fiber sheet is obtained through a hot pressing process and a parquet reassembly process.

11. The method according to any one of claims 8 to 10, characterized in that: The method satisfies at least one of the following conditions: (1) During the preparation of the cellulose acetate material, the parquet reorganization step is repeated multiple times; (2) The thickness of the first substrate layer and / or the second substrate layer is within the range of 0.05 to 0.06 mm; (3) the first adhesive layer and / or the second adhesive layer includes a photosensitive adhesive layer; (4) The first base material layer and / or the second base material layer are the same or different resin layers.

12. An electronic device, characterized in that: The electronic device comprises the device housing according to any one of claims 1 to 7, and / or the device housing obtained by the preparation method according to any one of claims 8 to 11.

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