Vehicle thermal management integrated device, vehicle thermal management system and vehicle

Abstract

The invention discloses a vehicle heat management integrated device, a vehicle heat management system and a vehicle, the vehicle heat management integrated device comprises a compressor assembly and a plate heat exchanger and liquid accumulator assembly, and the plate heat exchanger and liquid accumulator assembly and the compressor assembly are integrated into a whole. According to the technical scheme, the integration level of the thermal management integrated device for the vehicle can be improved.

Description

Technical Field

[0001] The present invention relates to the field of vehicle technology, and in particular to a vehicle thermal management integrated device, a vehicle thermal management system, and a vehicle. Background Art

[0002] At present, the various components in the existing vehicle thermal management system are arranged as loose parts, and the components are connected by pipe sections, which increases the total volume of the flow channel in the thermal management system and leads to an increase in the amount of refrigerant added. However, due to the safety requirements of refrigerant use, especially highly flammable refrigerants, a larger amount of refrigerant added will significantly reduce the safety of the thermal management system, affecting the safe driving of the vehicle. Summary of the Invention

[0003] The main purpose of the present invention is to provide a vehicle thermal management integrated device, aiming to improve the integration level of the vehicle thermal management integrated device.

[0004] To achieve the above objectives, the present invention proposes an integrated vehicle thermal management device, comprising:

[0005] compressor assembly; and

[0006] A plate heat exchanger and liquid accumulator assembly is integrated with the compressor assembly into a whole.

[0007] Optionally, the compressor assembly has a gas receiving end, and the plate heat exchanger and liquid storage assembly are connected to the gas receiving end.

[0008] Optionally, the plate heat exchanger and liquid storage assembly are provided with independent refrigerant circuits and water cooling circuits, the air receiving end is provided with an air outlet and an air inlet, and the compressor assembly is provided with a refrigerant flow path, and the refrigerant flow path is connected to the refrigerant circuit through the air outlet and the air inlet.

[0009] Optionally, the plate heat exchanger and liquid reservoir assembly includes a stacked liquid reservoir and plate heat exchanger group.

[0010] Optionally, the plate heat exchanger group includes a stacked condenser and an evaporator, and the liquid reservoir is located between the condenser and the evaporator.

[0011] Optionally, the plate heat exchanger group further includes a subcooler, and the liquid reservoir is provided between the subcooler and the evaporator, or between the subcooler and the condenser.

[0012] Optionally, the plate heat exchanger and liquid reservoir assembly further includes a first expansion valve, and the first expansion valve is used to control the flow of refrigerant from the condenser to the evaporator.

[0013] Optionally, the first expansion valve is integrated into the liquid reservoir.

[0014] Optionally, the refrigerant circuit is used to sequentially pass the refrigerant through the condenser, the liquid reservoir, and the evaporator for heat exchange, and is also used to sequentially pass the refrigerant after heat exchange through the liquid reservoir and the condenser to re-enter the refrigerant flow path to participate in the circulation;

[0015] And / or, the water cooling circuit includes a first water cooling circuit and a second water cooling circuit, the first water cooling circuit is formed in the condenser, and the second water cooling circuit is formed in the evaporator.

[0016] Optionally, a first thermal insulation pad is provided on the outside of the evaporator;

[0017] And / or, a second thermal insulation pad is provided on the outer periphery of the plate heat exchanger and liquid reservoir assembly.

[0018] Optionally, the refrigerant flow path includes a main flow path and a first return flow path, the high-pressure side of the main flow path is connected to the air outlet, and the first return flow path is connected to the low-pressure side of the main flow path and the air inlet.

[0019] Optionally, the compressor assembly includes a casing, in which a high-pressure chamber and a low-pressure chamber are provided that are connected to each other to form the main flow path, and the high-pressure chamber is arranged close to the plate heat exchanger and the liquid reservoir assembly.

[0020] Optionally, the housing is provided with a first protrusion, and the first return air flow path is formed in the first protrusion.

[0021] Optionally, the housing is further provided with a second protrusion, and a second return air flow path communicating with the high-pressure chamber and the low-pressure chamber is formed in the second protrusion.

[0022] Optionally, an air suction buffer cavity is further formed in the second protrusion, and the second return air flow path is connected to the low-pressure cavity through the air suction buffer cavity; or, the air suction buffer cavity is configured as the second return air flow path.

[0023] Optionally, the size of the second return air flow path is smaller than the size of the suction buffer chamber, and the size of the suction buffer chamber is smaller than the size of the low-pressure chamber.

[0024] Optionally, a third thermal insulation pad is provided on the outside of the first protrusion and the second protrusion.

[0025] Optionally, the compressor assembly further includes a second expansion valve, which is used to control the refrigerant to flow from the second return air path to the low-pressure chamber.

[0026] Optionally, an exhaust silencer is provided between the casing and the plate heat exchanger and liquid reservoir assembly.

[0027] Optionally, the compressor assembly further includes a temperature and pressure sensor for monitoring the pressure and temperature of the refrigerant flow path.

[0028] Optionally, the vehicle thermal management integrated device further includes a protective shell, which wraps the compressor assembly and the plate heat exchanger and liquid reservoir assembly and is provided with through holes for the coolant to enter and exit.

[0029] Optionally, the protective shell includes a protective cover and a sealing bottom plate, and the through hole is provided in either the protective cover or the sealing bottom plate.

[0030] Optionally, the vehicle thermal management integrated device further includes a refrigerant detection sensor, which is disposed close to the sealing bottom plate.

[0031] Optionally, a buffer component is connected to the outside of the protective shell;

[0032] And / or, a first support frame for supporting the compressor assembly and a second support frame for supporting the plate heat exchanger and liquid reservoir assembly are provided in the protective shell.

[0033] The present invention also provides a vehicle thermal management system, which includes the vehicle thermal management integrated device as described above.

[0034] The present invention also provides a vehicle, which includes the vehicle thermal management system as described above.

[0035] In the technical solution of the present invention, the integrated assembly of the vehicle thermal management integrated device and the connectivity of the internal flow paths are achieved by directly connecting the compressor assembly and the plate heat exchanger and liquid reservoir assembly, ensuring that the vehicle thermal management integrated device can achieve temperature control of the vehicle's functional systems. Moreover, compared with using connecting pipes to connect the various components, the number of connecting pipes can be reduced, the integration level of the vehicle thermal management integrated device can be improved, and the total volume of the flow channel in the vehicle thermal management integrated device can be reduced, reducing the risk of refrigerant leakage. At the same time, the refrigerant filling amount can be greatly reduced and the structural strength of the device can be increased, thereby improving the safety of the thermal management system. In addition, the assembly method of integrating the two assemblies can save assembly hours for the vehicle thermal management system and meet the hierarchical assembly of the general assembly line. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0037] Figure 1 This is a schematic structural diagram of an embodiment of a vehicle thermal management integrated device according to the present invention from a first perspective;

[0038] Figure 2 A schematic structural diagram of a vehicle thermal management integrated device from a second perspective;

[0039] Figure 3 A first-person perspective diagram of the assembly of the compressor assembly, plate heat exchanger, and liquid receiver assembly;

[0040] Figure 4 A second perspective schematic diagram of the assembly of the compressor assembly, the plate heat exchanger, and the liquid receiver assembly;

[0041] Figure 5 This is a schematic diagram of the assembly of the components of the plate heat exchanger and liquid receiver assembly;

[0042] Figure 6 This is a schematic diagram of the refrigerant flow in the vehicle thermal management integrated device.

[0043] Description of Figure Numbers:

[0044]

[0045]

[0046] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments. DETAILED DESCRIPTION

[0047] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0048] In the present invention, unless otherwise specified or limited, the terms "connection" and "fixation" should be understood in a broad sense. For example, "fixation" can mean fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will be able to understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0049] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly.

[0050] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of such features. In addition, the meaning of "and / or" appearing in the full text is to include three parallel solutions. Taking "A and / or B as an example", it includes solution A, or solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0051] The present invention provides a vehicle thermal management integrated device.

[0052] Reference Figures 1 to 6 In an embodiment of the present invention, the vehicle thermal management integrated device includes a compressor assembly 10 and a plate heat exchanger and liquid reservoir assembly 20, and the plate heat exchanger and liquid reservoir assembly 20 is integrated with the compressor assembly 10 into a whole.

[0053] It can be understood that the vehicle thermal management integrated device is mainly connected to the functional system of the vehicle and is used to control the temperature of the functional system of the vehicle. Among them, the compressor assembly 10 is mainly formed by the relevant compressor components that can compress the low-pressure gaseous refrigerant into the high-pressure gaseous refrigerant, and the plate heat exchanger and liquid reservoir assembly 20 is mainly formed by the relevant heat exchange components that can achieve temperature control. It improves the integration and structural strength of the compressor assembly 10 and the plate heat exchanger and liquid reservoir assembly 20, and also helps to improve the total volume of the internal flow path of the compressor assembly 10 and the plate heat exchanger and liquid reservoir assembly 20, which is convenient for reducing the amount of refrigerant to be added. Furthermore, by integrating the two independently set compressor assemblies The compressor assembly 10 and the plate heat exchanger and liquid reservoir assembly 20 are integrated into a whole, that is, the compressor assembly 10 and the plate heat exchanger and liquid reservoir assembly 20 are directly connected to realize the assembly of the vehicle thermal management integrated device and the communication of the internal flow path. Compared with using connecting pipes to connect various components, the number of connecting pipes is reduced, the integration level of the vehicle thermal management integrated device is improved, and the total volume of the flow path within the vehicle thermal management integrated device is reduced, reducing the risk of refrigerant leakage. At the same time, the refrigerant filling volume can be greatly reduced and the structural strength of the device can be increased, thereby improving the safety of the thermal management system. In addition, the integrated assembly method between the two assemblies can save assembly hours for the vehicle thermal management system and meet the hierarchical assembly requirements of the general assembly line. The reduction in the refrigerant filling volume can increase the safety of the flammable and explosive thermal management system and improve the safety level of the entire vehicle.

[0054] It should be noted that the functional systems of the vehicle can be the electric drive system, battery system, temperature control system or dehumidification system in the passenger compartment, etc., so as to utilize the refrigerant in the vehicle thermal management integrated device for heat exchange to achieve effective temperature control of the entire vehicle's electric drive system, battery system, and passenger compartment.

[0055] In the technical solution of the present invention, by directly connecting the compressor assembly 10 and the plate heat exchanger and liquid storage assembly 20, the integrated assembly of the vehicle thermal management integrated device and the connection of the internal flow path are realized, ensuring that the vehicle thermal management integrated device can realize temperature control of the functional system of the vehicle. Moreover, compared with using connecting pipes to connect the various components, the number of connecting pipes can be reduced, the integration degree of the vehicle thermal management integrated device can be improved, and the total volume of the flow channel in the vehicle thermal management integrated device can be reduced, reducing the risk of refrigerant leakage. At the same time, the refrigerant filling amount can be greatly reduced and the structural strength of the device can be increased, thereby improving the safety of the thermal management system. In addition, the assembly method of integrating the two assemblies can save the assembly time of the vehicle thermal management system and meet the hierarchical assembly of the general assembly line.

[0056] Specifically, in one embodiment, the compressor assembly 10 has an air connecting end 111a, and the plate heat exchanger and liquid reservoir assembly 20 is connected to the air connecting end 111a. It can be understood that the end face formed by the air connecting end 111a is connected to the surface of the plate heat exchanger and liquid reservoir assembly 20, so that the air outlet and the air inlet integrated in the air connecting end 111a are connected to the refrigerant circuit on the plate heat exchanger and liquid reservoir assembly 20, ensuring the normal circulation of the refrigerant in the vehicle thermal management integrated device, while reducing the use of connecting pipes and reducing the overall volume of the vehicle thermal management integrated device; the integrated assembly of the compressor assembly 10 and the plate heat exchanger and liquid reservoir assembly 20 is achieved by adopting methods such as bolt connection, snap connection, and plug-in connection, thereby improving the connection reliability of the compressor assembly 10 and the plate heat exchanger and liquid reservoir assembly 20, and thereby further ensuring the circulation reliability of the internal refrigerant.

[0057] The compressor also includes an electrical connection 111b, which is used to connect to the vehicle's power supply. When the electrical connection 111b is positioned opposite the gas connection 111a, that is, the plate heat exchanger and liquid reservoir assembly 20 is located on the side of the compressor assembly 10 facing away from the electrical connection 111b, the installation space on that side can be rationally utilized. In other words, it can effectively reduce the space occupied on other sides of the vehicle thermal management integrated device, freeing up space for the assembly of other components and reducing interference. Of course, in other embodiments, depending on the specific distribution of the air outlet and air inlet of the compressor assembly 10, the plate heat exchanger and liquid reservoir assembly 20 can semi-surround the compressor assembly 10 or be connected to the side of the compressor assembly 10.

[0058] like Figure 3 As shown, a connector for connecting to a power source is provided on the power terminal 111b, and the connector includes a high-voltage connector and a low-voltage connector spaced apart from top to bottom.

[0059] Optionally, in one embodiment, the plate heat exchanger and liquid reservoir assembly 20 are provided with independent refrigerant circuits and water cooling circuits, the air receiving end 111a is provided with an air outlet and an air inlet, and the compressor assembly 10 is provided with a refrigerant flow path, and the refrigerant flow path is connected to the refrigerant circuit through the air outlet and the air inlet, so that the refrigerant in the refrigerant flow path flows into the refrigerant circuit of the plate heat exchanger and liquid reservoir assembly 20 through the air outlet, and performs heat exchange with the coolant in the water cooling circuit. The refrigerant after heat exchange re-enters the compressor assembly 10 through the air inlet, completing a cycle.

[0060] Specifically, there is at least one water cooling circuit in the plate heat exchanger and liquid reservoir assembly 20, and each water cooling circuit corresponds to each functional system, and is connected to the refrigerant circuit in a closed loop. In this way, the refrigerant of a refrigerant circuit is used to exchange heat with the coolant of multiple water cooling circuits to achieve effective temperature control of the vehicle's electric drive system, battery system, and passenger compartment, which helps to improve the functional integration of the plate heat exchanger and liquid reservoir assembly 20, further simplify the system flow path, and reduce costs.

[0061] Reference Figure 5 In one embodiment, the plate heat exchanger and reservoir assembly 20 includes a stacked reservoir 21 and a plate heat exchanger group. The plate heat exchanger group includes multiple plate heat exchangers, each corresponding to a functional system, thereby enhancing the functional integration of the plate heat exchanger and reservoir assembly 20. By utilizing the structural characteristics of the plate heat exchanger, namely, the close arrangement of the plates to form flow channels for the hot and cold fluids, plate heat exchangers have a smaller footprint and space requirement compared to other types of heat exchangers. This, combined with the stacked arrangement of the reservoir 21, can reduce the space occupied by the plate heat exchanger and reservoir assembly 20 to a certain extent. At the same time, effective temperature control is achieved through heat exchange between the refrigerant and coolant entering the plate heat exchanger and reservoir assembly 20. The reservoir and plate heat exchanger group can be integrally connected, for example, by brazing.

[0062] like Figure 5 As shown, in one embodiment, the plate heat exchanger group includes a stacked condenser 22 and an evaporator 24, and the liquid reservoir 21 is located between the condenser 22 and the evaporator 24. Since the refrigerant flowing out of the condenser 22 is in a two-phase state, the built-in flow channel of the liquid reservoir 21 can be used to separate the liquid refrigerant and the gaseous refrigerant in the liquid reservoir 21, and then the liquid refrigerant flows out through the bottom corner hole of the liquid reservoir 21 and flows to the evaporator 24, ensuring the evaporation amount of the evaporator 24, ensuring that the refrigerant expands in the evaporator 24 and fully absorbs the heat of the coolant, thereby improving the heat exchange efficiency between the refrigerant circuit and the water cooling circuit.

[0063] The liquid reservoir 21 is placed between the condenser 22 and the evaporator 24, and the flow paths between the liquid reservoir 21, the condenser 22 and the evaporator 24 are reasonably designed to ensure that the connecting flow paths between the condenser 22 and the liquid reservoir 21 and between the liquid reservoir 21 and the evaporator 24 are as short as possible. This helps to simplify the flow paths within the plate heat exchanger and the liquid reservoir assembly 20, avoid excessive loss of pressure and heat due to a too long flow path, and improve the flow smoothness of the refrigerant and the heat exchange efficiency with the corresponding coolant.

[0064] Specifically, in this embodiment, the water cooling circuit flowing through the condenser 22 can be used to control the temperature and humidity in the passenger compartment, and the water cooling circuit flowing through the evaporator 24 can be used to control the temperature of the battery system and the temperature and humidity in the passenger compartment. The remaining water cooling circuits can be equipped with additional plate heat exchangers or independent off-cabin radiators to control the temperature of the electric drive system so that the various functional systems of the vehicle can reach a good operating state, ensure the driving and riding comfort of the driver and passengers, and also ensure the stable and reliable operation of the vehicle.

[0065] Furthermore, in one embodiment, the plate heat exchanger group also includes a subcooler 23, and the liquid reservoir 21 is provided between the subcooler 23 and the evaporator 24, or between the subcooler 23 and the condenser 22. The setting of the subcooler 23 can perform secondary heat exchange between the condensed saturated liquid and the coolant, further increasing the subcooling degree of the refrigerant and reducing the flash gas generated by the refrigerant during the throttling process, thereby helping to increase the evaporation amount of the evaporator 24 and improve the heat exchange efficiency.

[0066] like Figure 5 As shown, the subcooler 23 is located between the liquid reservoir 21 and the condenser 22. In this case, a through hole 231 is provided on the subcooler 23. The through hole 231 is used to connect the condensation outlet of the condenser 22 and the condensation inlet of the liquid reservoir 21, serving as a channel connecting the condenser 22 and the liquid reservoir 21, ensuring that the refrigerant flowing out of the condenser 22 can pass through the subcooler 23 (without heat exchange), enter and separate the liquid refrigerant and the gaseous refrigerant in the liquid reservoir 21. The liquid reservoir 21 also has a bottom corner hole connected to the subcooling inlet of the subcooler 23, ensuring that the liquid refrigerant flows through the bottom corner hole and the subcooling inlet in sequence into the subcooler 23 for secondary heat exchange, and flows out of the subcooler 23 through the subcooling outlet on the subcooler 23. The subcooling outlet is connected to the throttling inlet of a throttling device such as an expansion valve. Of course, in other embodiments, the subcooler 23 is located between the liquid reservoir 21 and the evaporator 24.

[0067] In order to achieve flow regulation of the refrigerant entering the evaporator 24 and throttling of the refrigerant before entering the evaporator 24, in one embodiment, the plate heat exchanger and liquid reservoir assembly 20 also includes a first expansion valve 25, which is used to control the flow of refrigerant from the condenser 22 to the evaporator 24. The first expansion valve 25 is arranged at the inlet of the evaporator 24. On the one hand, it controls the flow of refrigerant entering the evaporator 24, ensures that the refrigerant flowing out of the outlet of the evaporator 24 is gaseous, reduces the content of liquid refrigerant, and thereby reduces the possibility of liquid hammer caused by the refrigerant entering the compressor assembly 10, and avoids insufficient refrigeration due to too small a refrigerant flow rate, thereby ensuring the cooling capacity of the evaporator 24 and improving the heat exchange efficiency. On the other hand, the low-temperature and high-pressure liquid refrigerant can be throttled through the throttling hole of the first expansion valve 25 to become a low-temperature and low-pressure mist liquid refrigerant, which meets the evaporation conditions of the liquid refrigerant and thereby improves the evaporation heat absorption efficiency.

[0068] In order to further improve the integration level of the plate heat exchanger and the liquid reservoir assembly 20, in one embodiment, the first expansion valve 25 is integrated into the liquid reservoir 21. It can be understood that Figure 6 As shown, a throttling channel is integrated on the liquid reservoir 21, and the throttling channel and the built-in channel of the liquid reservoir 21 are independently arranged and do not communicate with each other. The throttling channel is provided with a throttling inlet connected to the subcooling outlet of the subcooler 23, and a throttling outlet connected to the inlet of the evaporator 24. The throttling channel is also provided with a first valve seat 251 connecting the throttling inlet and the throttling outlet. The first valve seat 251 is used to fix the first expansion valve 25, so that the pressure regulation and flow regulation of the refrigerant flowing from the condenser 22 to the evaporator 24 can be achieved. At the same time, it helps to improve the integration of the liquid reservoir 21 and the first expansion valve 25, reduce external pipes, and thereby improve the integration level of the plate heat exchanger and the liquid reservoir assembly 20, and reduce the space occupied by the plate heat exchanger and the liquid reservoir assembly 20.

[0069] Optionally, in one embodiment, the refrigerant circuit is used to sequentially pass the refrigerant through the condenser 22, the liquid reservoir 21, and the evaporator 24 for heat exchange, and is also used to sequentially pass the refrigerant after heat exchange through the liquid reservoir 21 and the condenser 22 to re-enter the refrigerant flow path for circulation, thereby reducing the number of connecting pipes and improving the integration of the flow paths within the plate heat exchanger and liquid reservoir assembly 20; and / or, the water-cooling circuit includes a first water-cooling circuit and a second water-cooling circuit, the first water-cooling circuit being formed in the condenser 22 and the second water-cooling circuit being formed in the evaporator 24. However, in other embodiments, the refrigerant circuit sequentially passes the refrigerant through the condenser 22, the liquid reservoir 21, the first expansion valve 25, and the evaporator 24 for heat exchange.

[0070] It can be understood that by utilizing the structural characteristics of the plate heat exchanger, that is, utilizing the stacking arrangement of the plates, the gaps between the adjacent plates form a first inter-plate flow channel and a second inter-plate flow channel that are not connected to each other. The first inter-plate flow channel is configured as a refrigerant circuit for the flow of refrigerant, and is connected to the air outlet of the compressor assembly 10 through the corner holes on the plates. The second inter-plate flow channel is configured as a water cooling circuit for the flow of coolant, and is connected to the corresponding functional system. The refrigerant and the coolant exchange heat through the plates.

[0071] Specifically, if Figures 1 to 2 and Figure 6 As shown, taking the subcooler 23 located at the liquid reservoir 21 and the condenser 22 as an example, the first inlet 221 and the first outlet 222 on the condenser 22 are connected through the first water-cooling circuit and are used to connect the corresponding functional system, thereby using the refrigerant in the refrigerant circuit of the condenser 22 to perform heat exchange on the coolant in the first water-cooling circuit; the second inlet 241 and the second outlet 242 on the evaporator 24 are connected through the second water-cooling circuit and are used to connect the corresponding functional system, thereby using the refrigerant in the refrigerant circuit of the evaporator 24 to perform heat exchange on the coolant in the second water-cooling circuit.

[0072] During ordinary cooling and heating processes, since the plate heat exchanger and liquid storage assembly 20 are connected to the compressor assembly 10 through the condenser 22, the refrigerant inlet of the condenser 22 is directly connected to the air outlet of the compressor assembly 10, so that the refrigerant directly enters the condenser 22 through the refrigerant inlet (air outlet), is liquefied and releases heat to the coolant, completing heat exchange. In order to avoid refrigerant leakage, a first sealing ring 61 is set between the refrigerant inlet and the air outlet.

[0073] Since the liquid reservoir 21 is located between the evaporator 24 and the subcooler 23, and in order to ensure that the refrigerant entering the subcooler 23 is liquid, the through hole 231 passing through the subcooler 23 is used as a section of the refrigerant circuit. The low-temperature refrigerant that is liquefied and releases heat through the condenser 22 enters the liquid reservoir 21 through the through hole 231, and the liquid refrigerant and the gaseous refrigerant are separated in the liquid reservoir 21; and the liquid refrigerant flows out through the bottom corner hole of the liquid reservoir 21, and because the bottom corner hole is connected to the subcooling inlet of the subcooler 23, the liquid refrigerant directly enters the subcooler 23 through the bottom corner hole (subcooling inlet). In the subcooler 23, the liquid refrigerant and the coolant undergo secondary heat exchange, thereby increasing the subcooling degree of the liquid refrigerant.

[0074] Since the first expansion valve 25 is integrated on the liquid reservoir 21, the throttling inlet and the throttling outlet are opened on the liquid reservoir 21, and the subcooling outlet of the subcooler 23 is connected to the throttling inlet. The liquid refrigerant directly enters the throttling channel through the subcooling outlet (throttling inlet). Under the action of the first expansion valve 25, the refrigerant realizes throttling and flow regulation of the refrigerant, and flows into the evaporator 24 through the throttling outlet; under the action of the evaporator 24, the refrigerant expands and vaporizes and absorbs the heat of the coolant.

[0075] In order to ensure that the refrigerant that has completed heat absorption flows back to the compressor assembly 10 and re-participates in the circulation, the liquid reservoir 21 is provided with a through hole connecting the evaporator 24 and the condenser 22. The through hole is connected to the partial refrigerant circuit formed by the stacking of the corner holes on the evaporator 24 and the partial refrigerant circuit formed by the stacking of the corner holes on the condenser 22, so that the refrigerant that has completed heat absorption passes through the evaporator 24, the liquid reservoir 21, the subcooler 23, and the condenser 22 in turn, and enters the compressor assembly 10 through the air inlet, cooperating with the refrigerant flow path in the compressor assembly 10 to complete a cycle.

[0076] To ensure the reliability of heat exchange in the plate heat exchanger and the liquid storage assembly 20, in one embodiment, as shown in FIG. Figure 5 As shown, the outside of the evaporator 24 is provided with a first thermal insulation pad 26, which is specifically arranged between the evaporator 24 and the liquid reservoir 21. When the refrigerant undergoes a vaporization reaction in the evaporator 24, the refrigerant is prevented from absorbing heat in the liquid reservoir 21 to a certain extent. When the first thermal insulation pad 26 completely wraps the evaporator 24, the refrigerant is prevented from absorbing heat around the evaporator 24 to a certain extent, such as heat in the liquid reservoir 21 and heat in the external environment. It can also reduce the heat dissipation of the refrigerant that has completed heat absorption, thereby reducing the impact on the rear-end circulation.

[0077] In one embodiment, if Figure 4 As shown, a second thermal insulation pad 27 is provided on the periphery of the plate heat exchanger and liquid reservoir assembly 20, and the second thermal insulation pad 27 wraps the evaporator 24, the liquid reservoir 21, the subcooler 23 and the condenser 22 to improve the thermal insulation effect of the plate heat exchanger and liquid reservoir assembly 20.

[0078] Reference Figures 3 to 6 In one embodiment, the refrigerant flow path includes a main flow path 11a and a first return flow path 11b. The high-pressure side of the main flow path 11a is connected to the air outlet, and the first return flow path 11b is connected to the low-pressure side of the main flow path 11a and the air inlet. In this way, the low-temperature and low-pressure gaseous refrigerant flows from the low-pressure side of the main flow path 11a to the high-pressure side, forming a high-temperature and high-pressure gaseous refrigerant. The high-temperature and high-pressure gaseous refrigerant enters the refrigerant circuit in the plate heat exchanger and the liquid storage assembly 20 through the air outlet for heat exchange, generating a low-temperature and low-pressure gaseous refrigerant. The low-temperature and low-pressure gaseous refrigerant flows into the first return flow path 11b through the air inlet, and flows back to the low-pressure side of the main flow path 11a, completing a cycle.

[0079] Specifically, in one embodiment, the compressor assembly 10 includes a casing 11, and a high-pressure chamber 112a and a low-pressure chamber 112b are provided in the casing 11 to form the main flow path 11a. The high-pressure chamber 112a is arranged close to the plate heat exchanger and liquid reservoir assembly 20 to ensure that the generated high-temperature and high-pressure gaseous refrigerant flows to the plate heat exchanger and liquid reservoir assembly 20 in the shortest path, thereby reducing heat and pressure loss, and simplifying the flow path between the plate heat exchanger and liquid reservoir assembly 20 and the compressor assembly 10.

[0080] Furthermore, the casing 11 is provided with a first protrusion 113, and the first return air flow path 11b is formed in the first protrusion 113. In this way, the first protrusion 113 can be used as a processing carrier of the first return air flow path 11b to form the first return air flow path 11b connected to the refrigerant circuit through the air inlet. It is also convenient for the first return air flow path 11b to connect with the low-pressure chamber 112b in the casing 11 to ensure the normal operation of the cooling and heating cycles. Moreover, compared with the use of connecting pipes to connect the plate heat exchanger and the liquid storage assembly 20 and the compressor assembly 10, the number of connecting pipes is effectively reduced, the integration of the compressor assembly 10 is improved, the occupied space is reduced, and at the same time, the reliable circulation of the refrigerant is ensured.

[0081] In addition, since the plate heat exchanger and liquid storage assembly 20 is docked with the compressor assembly 10 through the condenser 22, the refrigerant outlet of the condenser 22 and the compressor assembly 10 are directly docked with the air inlet of the compressor assembly 10, so that the refrigerant directly enters the compressor assembly 10 through the refrigerant outlet (air inlet). In order to avoid refrigerant leakage, a second sealing ring 62 is set between the refrigerant outlet and the air inlet.

[0082] The first protrusion 113 is a part of the casing 11 and is located on the outside of the main flow path 11a. When the casing 11 includes a low-pressure shell portion forming a low-pressure chamber 112b and a high-pressure shell portion forming a high-pressure chamber 112a, the first protrusion 113 includes a first protrusion connected to the low-pressure shell portion and a second protrusion connected to the high-pressure shell portion. In order to prevent the reflux refrigerant from flowing into the main flow path 11a through the joint between the high-pressure shell portion and the low-pressure shell portion, in this embodiment, a third sealing ring 63 is provided between the first protrusion and the second protrusion.

[0083] Reference Figure 6In one embodiment, the housing 11 is further provided with a second protrusion 114, and a second return air flow path 11c is formed in the second protrusion 114 to connect the high-pressure chamber 112a and the low-pressure chamber 112b. It can be understood that the second protrusion 114 is a part of the housing 11 and is located outside the main flow path 11a. The second protrusion 114 is used as a processing carrier of the second return air flow path 11c to form the second return air flow path 11c passing through the high-pressure chamber 112a and the low-pressure chamber 112b, which helps to improve the compressor assembly. The internal flow path integration of 10 can also enable a part of the refrigerant that has not reached high temperature and high pressure to flow back to the main flow path 11a through the second return flow path 11c when a part of the refrigerant flowing out of the high-pressure chamber 112a flows toward the plate heat exchanger and the liquid storage assembly 20, and is fully mixed with the refrigerant flowing back to the main flow path 11a through the first return flow path 11b, and re-pressurization and heating operations are performed, which helps to increase the total flow rate flowing through the compressor assembly 10, thereby improving the output power of the compressor and improving the heating capacity of the thermal management system.

[0084] In addition, the second protrusion 114 includes a third protrusion connected to the low-pressure shell portion and a fourth protrusion connected to the high-pressure shell portion. In order to prevent the backflow of refrigerant from flowing into the main flow path 11a through the joint between the high-pressure shell portion and the low-pressure shell portion, in this embodiment, a fourth sealing ring 64 is provided between the third protrusion and the fourth protrusion.

[0085] Furthermore, an intake buffer chamber 11d is formed in the second protrusion 114, and the second return air flow path 11c is connected to the low-pressure chamber 112b through the intake buffer chamber 11d; or, the intake buffer chamber 11d is configured as the second return air flow path 11c. It can be understood that when the intake buffer chamber 11d is connected to the second return air flow path 11c and the low-pressure chamber 112b, the intake buffer chamber 11d serves as a buffer chamber between the second return air flow path 11c and the low-pressure chamber 112b, or, when the intake buffer chamber 11d is configured as the second return air flow path 11c, the intake buffer chamber 11d serves as a buffer chamber between the high-pressure chamber 112a and the low-pressure chamber 112b, which can buffer the refrigerant flowing from the high-pressure chamber 112a toward the low-pressure chamber 112b, and then reduce the impact of the sudden change in volume from the second return air flow path 11c to the low-pressure chamber 112b by controlling the pressure of the refrigerant, thereby effectively reducing the pressure fluctuation of the refrigerant and enhancing the flow stabilization effect.

[0086] Specifically, the size of the second return air flow path 11c is smaller than that of the intake buffer chamber 11d, and the size of the intake buffer chamber 11d is smaller than that of the low-pressure chamber 112b. The intake buffer chamber 11d serves as a transition chamber between the high-pressure chamber 112a and the low-pressure chamber 112b, effectively avoiding the sudden change in volume caused by sudden size reduction, reliably controlling the refrigerant pressure, reducing the pressure fluctuation of the refrigerant, and ensuring the smooth flow of the refrigerant entering the low-pressure chamber 112b.

[0087] Optionally, in one embodiment, a third thermal insulation pad 15 is provided outside the first protrusion 113 and the second protrusion 114 to reduce the impact of the refrigerant in the first return air flow path 11b and the second return air flow path 11c on the ambient temperature.

[0088] In order to achieve flow regulation and pressure regulation of the refrigerant entering the low-pressure chamber 112b from the second return air path 11c, in one embodiment, the compressor assembly 10 further includes a second expansion valve 13. The second expansion valve 13 is used to control the refrigerant to flow from the second return air path 11c to the low-pressure chamber 112b. The second expansion valve 13 is provided at the outlet of the second return air path 11c to control the flow of the refrigerant entering the low-pressure chamber 112b and to control the low-temperature and high-pressure refrigerant to become a low-temperature and low-pressure refrigerant after throttling. Specifically, Figure 6 As shown, a second valve seat 131 is provided at the outlet of the second return air flow path 11 c , communicating with the second return air flow path 11 c and the low-pressure chamber 112 b . The second valve seat 131 is used to fix the second expansion valve 13 .

[0089] In addition, the second expansion valve 13 is mainly opened under low temperature conditions, that is, the second expansion valve 13 is opened to connect the second return air flow path 11c and the low-pressure chamber 112b, so that the low-temperature refrigerant is pressurized and heated to become a high-temperature refrigerant through circulation, thereby ensuring that the refrigerant circulation can meet the heating needs and improve the heating capacity of the thermal management system.

[0090] Optionally, in one embodiment, an exhaust muffler 12 is provided between the housing 11 and the plate heat exchanger and liquid accumulator assembly 20, thereby reducing the noise of the compressor assembly 10. Specifically, the exhaust muffler 12 is provided between the condenser 22 and the high-pressure housing portion of the housing 11, and is connected to the high-pressure chamber 112a and the refrigerant circuit via an air outlet formed in the exhaust muffler 12, and is connected to the refrigerant circuit and the first return air path 11b via an air inlet formed in the exhaust muffler 12, thereby ensuring the normal operation of the refrigerant circulation; in addition, the exhaust muffler 12 is also used to connect the high-pressure chamber 112a and the second return air path 11c, ensuring that low-pressure refrigerant can enter the second return air path 11c under low temperature conditions, thereby meeting heating requirements.

[0091] In addition, in order to prevent the backflow of refrigerant from flowing into the main flow path 11a through the joint between the high-pressure shell and the exhaust muffler 12, in this embodiment, a fifth sealing ring 65 is provided between the exhaust muffler 12 and the second protrusion, and a sixth sealing ring 66 is provided between the exhaust muffler 12 and the fourth protrusion.

[0092] Reference Figures 3 to 4In one embodiment, the compressor assembly 10 further includes a temperature and pressure sensor 14 for monitoring the pressure and temperature of the refrigerant flow path. Two temperature and pressure sensors 14 are provided, and are respectively arranged on the high-pressure side and the low-pressure side of the refrigerant flow path. They are specifically installed at the air outlet of the compressor assembly 10, and the air inlet or the first return air flow path 11b, so as to monitor the pressure and temperature of the refrigerant flow path in real time as an input signal for the thermal management system adjustment, thereby improving the control efficiency of the thermal management system. The temperature and pressure sensor 14 can be configured as an integrated sensor. In other embodiments, the temperature and pressure sensor 14 can be provided on the plate heat exchanger and the liquid reservoir assembly 20.

[0093] Reference Figures 1 to 2 In one embodiment, the vehicle thermal management integrated device further includes a protective shell 30, which wraps the compressor assembly 10 and the plate heat exchanger and liquid reservoir assembly 20, and is provided with through holes for the coolant to enter and exit. The through holes are provided with four, and are respectively connected to the first inlet 221, the first outlet 222, the second inlet 241 and the second outlet 242. With this arrangement, on the one hand, the protective shell 30 plays a protective role, improving the safety of the plate heat exchanger and liquid reservoir assembly 20 and the compressor assembly 10, and when the protective shell 30 is made of thermal insulation material, it can also play a thermal insulation role. On the other hand, the plate heat exchanger and liquid reservoir assembly 20 and the compressor assembly 10 are integrated in the protective shell 30, which is convenient for assembly as a whole, saving assembly time of the vehicle thermal management system and facilitating the transportation of the vehicle thermal management integrated device. It is also convenient to connect the functional system through the through holes to complete the heat exchange between the refrigerant and the coolant.

[0094] Specifically, the protective shell 30 includes a protective cover 31 and a sealing bottom plate 32. The through hole is provided in either the protective cover 31 or the sealing bottom plate 32. The sealing bottom plate 32 is used to support and fix the plate heat exchanger and the liquid reservoir assembly 20 and the compressor assembly 10. The protective cover 31 is connected to the sealing bottom plate 32 to form a sealed cavity, and the connection method includes but is not limited to bolt connection, buckle connection, and plug-in connection.

[0095] Based on the arrangement of the condenser 22 and the evaporator 24 and the corresponding locations of the first inlet 221, the first outlet 222, the second inlet 241, and the second outlet 242, in this embodiment, each via hole is provided in the protective cover 31. However, in other embodiments, each via hole is provided in the sealing bottom plate 32, or each via hole is provided in both the protective cover 31 and the sealing bottom plate 32.

[0096] Optionally, in one embodiment, the vehicle thermal management integrated device further includes a refrigerant detection sensor 40, which is disposed near the sealing bottom plate 32 to facilitate detection of refrigerant leakage in the thermal management integrated device and to issue a corresponding alarm signal based on the detection information.

[0097] Optionally, in one embodiment, a buffer assembly 50 is externally connected to the protective housing 30 to cushion vibrations transmitted from the outside to the integrated vehicle thermal management device, as well as vibrations transmitted outward from the compressor assembly 10 , thereby reducing noise while ensuring the overall stability of the integrated vehicle thermal management device. The buffer assembly 50 may include a bushing 51 and a vibration isolation pad 52.

[0098] Optionally, in one embodiment, a first support frame 33 for supporting the compressor assembly 10 and a second support frame 34 for supporting the plate heat exchanger and liquid reservoir assembly 20 are provided in the protective shell 30, wherein the first support frame 33 and the second support frame 34 are fixed on the sealing bottom plate 32, and can pass through the sealing bottom plate 32 to connect to the buffer assembly 50, thereby improving the overall support effect and shock absorption effect.

[0099] The present invention also proposes a vehicle thermal management system, which includes a vehicle thermal management integrated device. The specific structure of the vehicle thermal management integrated device refers to the above-mentioned embodiment. Since this vehicle thermal management system adopts all the technical solutions of all the above-mentioned embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above-mentioned embodiments, which will not be repeated here one by one.

[0100] The present invention also proposes a vehicle, which includes a vehicle thermal management system. The specific structure of the vehicle thermal management system refers to the above-mentioned embodiments. Since this vehicle adopts all the technical solutions of all the above-mentioned embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above-mentioned embodiments, which will not be repeated here one by one.

[0101] The above descriptions are merely optional embodiments of the present invention and do not limit the patent scope of the present invention. All equivalent structural transformations made using the contents of the present description and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included in the patent protection scope of the present invention.

Claims

1. A vehicle thermal management integrated device, characterized in that: include: compressor assembly; and A plate heat exchanger and liquid accumulator assembly is integrated with the compressor assembly into a whole.

2. The vehicle thermal management integrated device according to claim 1, characterized in that: The compressor assembly has a gas receiving end, and the plate heat exchanger and liquid storage assembly are connected to the gas receiving end.

3. The vehicle thermal management integrated device according to claim 2, characterized in that: The plate heat exchanger and liquid storage assembly are provided with independent refrigerant circuits and water cooling circuits, the air receiving end is provided with an air outlet and an air inlet, and the compressor assembly is provided with a refrigerant flow path, and the refrigerant flow path is connected to the refrigerant circuit through the air outlet and the air inlet.

4. The vehicle thermal management integrated device according to claim 3, characterized in that: The plate heat exchanger and liquid reservoir assembly includes a liquid reservoir and a plate heat exchanger group that are stacked.

5. The vehicle thermal management integrated device according to claim 4, characterized in that: The plate heat exchanger group includes a stacked condenser and an evaporator, and the liquid reservoir is located between the condenser and the evaporator.

6. The vehicle thermal management integrated device according to claim 5, characterized in that: The plate heat exchanger group further includes a subcooler, and the liquid reservoir is provided between the subcooler and the evaporator, or between the subcooler and the condenser.

7. The vehicle thermal management integrated device according to claim 5, characterized in that: The plate heat exchanger and liquid reservoir assembly further includes a first expansion valve, which is used to control the flow of refrigerant from the condenser to the evaporator.

8. The vehicle thermal management integrated device according to claim 7, characterized in that: The first expansion valve is integrated with the liquid reservoir.

9. The vehicle thermal management integrated device according to claim 5, characterized in that: The refrigerant circuit is used to supply the refrigerant to sequentially pass through the condenser, the liquid reservoir and the evaporator for heat exchange, and is also used to supply the refrigerant after heat exchange to sequentially pass through the liquid reservoir and the condenser to re-enter the refrigerant flow path to participate in the circulation; And / or, the water cooling circuit includes a first water cooling circuit and a second water cooling circuit, the first water cooling circuit is formed in the condenser, and the second water cooling circuit is formed in the evaporator.

10. The vehicle thermal management integrated device according to claim 5, characterized in that: A first thermal insulation pad is provided on the outside of the evaporator; And / or, a second thermal insulation pad is provided on the outer periphery of the plate heat exchanger and liquid reservoir assembly.

11. The vehicle thermal management integrated device according to claim 3, characterized in that: The refrigerant flow path includes a main flow path and a first return flow path. The high-pressure side of the main flow path is connected to the air outlet, and the first return flow path is connected to the low-pressure side of the main flow path and the air inlet.

12. The vehicle thermal management integrated device according to claim 11, characterized in that: The compressor assembly includes a casing, wherein a high-pressure chamber and a low-pressure chamber are provided in the casing so as to form the main flow path, and the high-pressure chamber is arranged close to the plate heat exchanger and the liquid reservoir assembly.

13. The vehicle thermal management integrated device according to claim 12, wherein: The housing is provided with a first protrusion, and the first return air flow path is formed in the first protrusion.

14. The vehicle thermal management integrated device according to claim 13, wherein: The housing is further provided with a second protrusion, wherein a second return air flow path communicating with the high-pressure chamber and the low-pressure chamber is formed in the second protrusion.

15. The vehicle thermal management integrated device according to claim 14, characterized in that: An air intake buffer cavity is further formed in the second protrusion, and the second return air flow path is connected to the low-pressure cavity through the air intake buffer cavity; alternatively, the air intake buffer cavity is configured as the second return air flow path.

16. The vehicle thermal management integrated device according to claim 15, characterized in that: The size of the second return air flow path is smaller than that of the air suction buffer chamber, and the size of the air suction buffer chamber is smaller than that of the low-pressure chamber.

17. The vehicle thermal management integrated device according to claim 14, wherein: A third thermal insulation pad is provided on the outside of the first protrusion and the second protrusion.

18. The vehicle thermal management integrated device according to claim 14, wherein: The compressor assembly further includes a second expansion valve, which is used to control the refrigerant to flow from the second return air path to the low-pressure chamber.

19. The vehicle thermal management integrated device according to claim 12, wherein: An exhaust silencer is provided between the casing and the plate heat exchanger and liquid reservoir assembly.

20. The vehicle thermal management integrated device according to claim 11, characterized in that: The compressor assembly also includes a temperature and pressure sensor for monitoring the pressure and temperature of the refrigerant flow path.

21. The vehicle thermal management integrated device according to claim 1, wherein: The vehicle thermal management integrated device further includes a protective shell, which wraps the compressor assembly and the plate heat exchanger and liquid reservoir assembly and is provided with a through hole for the coolant to enter and exit.

22. The vehicle thermal management integrated device according to claim 21, characterized in that: The protective shell includes a protective cover and a sealing bottom plate, and the through hole is provided in either the protective cover or the sealing bottom plate.

23. The vehicle thermal management integrated device according to claim 22, wherein: The vehicle thermal management integrated device further includes a refrigerant detection sensor, which is disposed close to the sealing bottom plate.

24. The vehicle thermal management integrated device according to claim 21, wherein: The protective shell is externally connected to a buffer component; And / or, a first support frame for supporting the compressor assembly and a second support frame for supporting the plate heat exchanger and liquid reservoir assembly are provided in the protective shell.

25. A vehicle thermal management system, characterized in that: The vehicle thermal management integrated device comprises the vehicle thermal management integrated device according to any one of claims 1 to 24.

26. A vehicle, characterized in that: Comprising the vehicle thermal management system as claimed in claim 25.

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