A low-acid-value modified epoxy acrylic resin solder resist ink and its preparation method

Abstract

This invention provides a low-acid-value modified epoxy acrylate resin solder resist ink and its preparation method, comprising composition A and composition B. Composition A comprises the following components: acrylic resin, low-acid-value modified epoxy acrylate resin, modified boron nitride, acrylate monomer, photoinitiator, additives, and solvent. Composition B comprises the following components in parts by weight: alicyclic epoxy resin, additives, and solvent. The modified boron nitride is adamantane derivative-modified hexagonal boron nitride. This invention's low-acid-value modified epoxy acrylate resin solder resist ink is a compound of multiple components, including low-acid-value modified epoxy acrylate resin and modified boron nitride, effectively improving the ink's stability, dispersibility, coating strength, adhesion, and other properties. It solves the shortcomings and problems of existing technologies and is of great significance to the development of solder resist inks.

Description

Technical Field

[0001] This invention relates to the field of solder resist inks, specifically to a low-acid-value modified epoxy acrylate resin solder resist ink and its preparation method. Background Technology

[0002] Epoxy acrylic resin is an important film-forming material for solder resist inks, combining the high adhesion and heat resistance of epoxy resins with the UV curing properties of acrylic resins. The epoxy groups in its molecular structure provide excellent chemical stability and mechanical strength, while the acrylic double bonds impart photocurability, allowing the ink to cure rapidly under UV irradiation, improving production efficiency. Furthermore, this resin enhances the adhesion of the ink to the PCB substrate and forms a dense protective layer, resisting the high temperatures, moisture, and chemical corrosion of solder. Some modified epoxy acrylic resins can also optimize flexibility, reduce curing shrinkage, prevent coating cracking, and ensure the reliability of circuit insulation.

[0003] Epoxy acrylic resins are typically obtained through the polymerization reaction of epoxy resins and acrylic monomers. Due to factors such as the type of epoxy resin and the ratio of reactants, most current epoxy acrylic resin products have a high acid value (greater than 80 mg KOH / g). While a high acid value can increase the transparency of the system, a large number of hydrophilic groups can affect the water resistance and stability of the cured coating, and the stability of the ink system is also difficult to guarantee after long-term storage.

[0004] In addition, existing solder resist ink products have problems such as poor bonding strength between high content of inorganic fillers and resin, insufficient film performance, and poor storage effect. Even after conventional modification of inorganic fillers, the overall performance improvement of the coating film is still not ideal, which can hardly meet the ever-increasing performance requirements of the field and affect the further promotion and application of solder resist inks.

[0005] In conclusion, there is an urgent need to develop a new technical solution to address the problems existing in the current technology. Summary of the Invention

[0006] This invention provides a low-acid-value modified epoxy acrylate resin solder resist ink and its preparation method. The low-acid-value modified epoxy acrylate resin solder resist ink is compounded from multiple components such as low-acid-value modified epoxy acrylate resin and modified boron nitride. It effectively improves the stability, dispersibility, coating strength, adhesion and other properties of the ink, solves the shortcomings and problems in the prior art, and is of great significance to the development of solder resist ink.

[0007] One object of the present invention is to provide a low-acid-value modified epoxy acrylate resin solder resist ink, the low-acid-value modified epoxy acrylate resin solder resist ink comprising composition A and composition B.

[0008] The composition A comprises the following components in parts by weight:

[0009] 5-10 parts of acrylic resin

[0010] 10-30 parts of low acid value modified epoxy acrylic resin

[0011]

[0012] The composition B comprises the following components in parts by weight:

[0013] 1-10 parts of alicyclic epoxy resin

[0014] 1-10 parts of auxiliary agent

[0015] Solvent 1-10 parts;

[0016] in,

[0017] The modified boron nitride is hexagonal boron nitride modified with adamantane derivative.

[0018] Furthermore, the modified boron nitride is obtained by reacting a silane coupling agent with hexagonal boron nitride, followed by a reaction with epoxy resin and adamantane derivative.

[0019] Furthermore, the epoxy resin is a multifunctional epoxy resin, the silane coupling agent is an aminosilane coupling agent, and the adamantane derivative is an amino-containing adamantane derivative.

[0020] Preferably, the multifunctional epoxy resin is pentaerythritol glycidyl ether.

[0021] Preferably, the aminosilane coupling agent is KH-550 (γ-aminopropyltriethoxysilane).

[0022] Preferably, the adamantane derivative is selected from adamantaneamine or 3-aminoadamantane-1-ol.

[0023] Furthermore, the acid value of the low-acid-value modified epoxy acrylate resin is ≤40mgKOH / g.

[0024] Furthermore, the acrylate monomer is an acrylate having a monofunctional group or a polyfunctional group.

[0025] Furthermore, the additives are selected from one or more of pigments, leveling agents, defoamers, toughening agents, dispersants, and ultraviolet absorbers.

[0026] Furthermore, the preparation method of the low-acid-value modified epoxy acrylate resin solder resist ink includes the following steps:

[0027] S1. Mix bisphenol epoxy resin and initiator and heat to react, then add vinyl monomer and heat to react to obtain modified epoxy acrylic resin.

[0028] S2. Mix hexagonal boron nitride and silane coupling agent, heat and react, then continue to mix and react with epoxy resin to obtain intermediate product;

[0029] S3. The intermediate product and the adamantane derivative are mixed and heated to react, and then modified boron nitride is obtained.

[0030] S4. Mix acrylic resin, low-acid-value modified epoxy acrylic resin, modified boron nitride, acrylate monomer, photoinitiator, additives and solvent to obtain composition A; mix alicyclic epoxy resin, additives and solvent to obtain composition B; then mix composition A and composition B to obtain low-acid-value modified epoxy acrylic resin solder resist ink.

[0031] Further, in step S1, the vinyl monomer comprises acrylic acid, alkyl acrylate and styrene in a mass ratio of (1-4):(2-5):(2-5);

[0032] The mass ratio of the bisphenol epoxy resin to the vinyl monomer is (0.8-1.2):1.

[0033] Further, in step S2, the mass ratio of hexagonal boron nitride to epoxy resin is (0.5-2):1.

[0034] Further, in step S3, the mass ratio of the intermediate product to the adamantane derivative is (4-8):1.

[0035] The present invention has the following beneficial effects:

[0036] This invention provides a low-acid-value modified epoxy acrylate resin solder resist ink, containing components such as low-acid-value modified epoxy acrylate resin and modified boron nitride. The low-acid-value modified epoxy acrylate resin is prepared by adjusting and optimizing the ratio of epoxy resin and acrylic monomers, as well as the reaction temperature and time, resulting in an acid value below 40 mg KOH / g. This significantly improves the stability of the ink and the water resistance of the film, enhancing its universal applicability to various environments. The modified boron nitride is produced by modifying boron nitride with a silane coupling agent to introduce amino groups, followed by reaction with a multifunctional epoxy resin to coat the surface with an epoxy resin layer. Finally, it is reacted with epoxy groups and amino-containing adamantane derivatives to graft adamantane groups. The resulting product has a large number of ether bonds, ester groups, and other structures, which improves compatibility with the host resin and helps to improve the stability and uniformity of the ink. On the other hand, the modified boron nitride also introduces a large number of active functional groups such as epoxy groups and hydroxyl groups, which can crosslink with other groups and bind through hydrogen bonds during curing, enhancing the bonding strength between different components and promoting the improvement of film adhesion, toughness, and strength. The introduced adamantane groups also contribute to the further improvement of the mechanical properties of the film.

[0037] This invention also uses alicyclic epoxy resin as a component, which reduces the content of benzene rings. When compounded with adamantyl groups, it can further improve the overall performance of the ink, especially the anti-yellowing effect of the film. Detailed Implementation

[0038] To more clearly illustrate the technical solution of the present invention, the following embodiments are provided. Unless otherwise stated, the raw materials, reactions, and post-processing methods appearing in the embodiments are all commercially available raw materials and technical methods well known to those skilled in the art.

[0039] The terms "preferred," "more preferably," and "more suitable" used in this invention refer to embodiments of the invention that provide certain beneficial effects under certain circumstances. However, other embodiments may also be preferred under the same or other circumstances. Furthermore, the description of one or more preferred embodiments does not imply that other embodiments are unavailable, nor is it intended to exclude other embodiments from the scope of this invention.

[0040] It should be understood that, except in any operational instance or otherwise indicated, the amounts or all figures representing ingredients used, for example, in the specification and claims, should be understood to be modified by the term "about" in all cases. Therefore, unless otherwise stated, the numerical parameters set forth in the following specification and appended claims are approximate values ​​varying according to the desired performance to be obtained according to the invention.

[0041] The acrylic resin used in this embodiment of the invention is Sartoma CN104 NS.

[0042] In the embodiments of the present invention, the acrylate monomer is methyl acrylate.

[0043] The photoinitiator in this embodiment of the invention is ITX and UVI-6976 in a mass ratio of 1:1.

[0044] In this embodiment of the invention, additive 1 is a pigment (titanium dioxide) and a leveling agent (isopropanol) in a mass ratio of 4:1; additive 2 is a leveling agent (isopropanol).

[0045] The solvent used in the embodiments of the present invention is a divalent ester.

[0046] The alicyclic epoxy resin in this embodiment of the invention is 4,5-epoxytetrahydrophthalic acid diglycidyl ester.

[0047] In the embodiments of the present invention, both the first initiator and the second initiator are BPO (benzoyl peroxide).

[0048] In the embodiments of this invention, "parts" refers to parts by mass.

[0049] Example 1

[0050] A low-acid-value modified epoxy acrylate resin solder resist ink, comprising composition A and composition B.

[0051] The composition A comprises the following components in parts by weight:

[0052]

[0053] The composition B comprises the following components in parts by weight:

[0054] 5 parts alicyclic epoxy resin

[0055] Additive 2 1 part

[0056] Solvent 5 parts.

[0057] The preparation method of the above-mentioned low acid value modified epoxy acrylic resin solder resist ink includes the following steps:

[0058] S1. Using n-butanol as solvent, E-44 epoxy resin and the first initiator were added and reacted at 90°C for 0.5 h. Then, acrylic acid, butyl acrylate, styrene and the second initiator were added and reacted at 110°C for 5 h. The solvent was removed to obtain a low acid value modified epoxy acrylic resin with an acid value of 31.37 mgKOH / g.

[0059] The mass ratio of E-44 epoxy resin, the first initiator, acrylic acid, butyl acrylate, styrene, and the second initiator is 3:0.01:0.9:1:1:0.16.

[0060] S2. Using ethanol and water in a volume ratio of 5:1 as solvents, add hexagonal boron nitride and KH-550 in a mass ratio of 1:2, reflux in an oil bath at 90°C for 12 hours, filter, wash and dry to obtain a solid product.

[0061] Using NMP as solvent, the solid product, pentaerythritol glycidyl ether, and DMAP (4-dimethylaminopyridine) were mixed (the mass ratio of hexagonal boron nitride, pentaerythritol glycidyl ether, and DMAP was 0.7:1:0.01), reacted at 95°C for 6 h, and then filtered and dried to obtain the intermediate product.

[0062] S3. Using NMP as solvent, the intermediate product, 3-aminoadamantane-1-ol and DMAP in a mass ratio of 5:1:0.01 were mixed and reacted at 95°C for 6 hours. After filtration and drying, modified boron nitride was obtained.

[0063] S4. According to the above-mentioned mass proportions, mix acrylic resin, low-acid-value modified epoxy acrylic resin, modified boron nitride, acrylate monomer, photoinitiator, additives and solvent to obtain composition A; mix alicyclic epoxy resin, additives and solvent to obtain composition B; then mix composition A and composition B, stir and disperse evenly, grind to a fineness ≤20μm, and pass through a 500-mesh sieve to obtain low-acid-value modified epoxy acrylic resin solder resist ink.

[0064] Example 2

[0065] A low-acid-value modified epoxy acrylate resin solder resist ink, comprising composition A and composition B.

[0066] The composition A comprises the following components in parts by weight:

[0067]

[0068] The composition B comprises the following components in parts by weight:

[0069] 8 parts of alicyclic epoxy resin

[0070] Additive 2 (2 parts)

[0071] Solvent 7 parts.

[0072] The preparation method of the above-mentioned low acid value modified epoxy acrylic resin solder resist ink includes the following steps:

[0073] S1. Using n-butanol as solvent, E-44 epoxy resin and the first initiator were added and reacted at 90°C for 0.5 h. Then, acrylic acid, butyl acrylate, styrene and the second initiator were added and reacted at 110°C for 5 h. The solvent was removed to obtain a low acid value modified epoxy acrylic resin with an acid value of 31.37 mgKOH / g.

[0074] The mass ratio of E-44 epoxy resin, the first initiator, acrylic acid, butyl acrylate, styrene, and the second initiator is 3:0.01:0.9:1:1:0.16.

[0075] S2. Using ethanol and water in a volume ratio of 5:1 as solvents, add hexagonal boron nitride and KH-550 in a mass ratio of 1:2, reflux in an oil bath at 90°C for 12 hours, filter, wash and dry to obtain a solid product.

[0076] Using NMP as solvent, the solid product, pentaerythritol glycidyl ether, and DMAP were mixed (the mass ratio of hexagonal boron nitride, pentaerythritol glycidyl ether, and DMAP was 0.7:1:0.01), reacted at 95°C for 6 hours, and then filtered and dried to obtain the intermediate product.

[0077] S3. Using NMP as solvent, the intermediate product, 3-aminoadamantane-1-ol and DMAP in a mass ratio of 5:1:0.01 were mixed and reacted at 95°C for 6 hours. After filtration and drying, modified boron nitride was obtained.

[0078] S4. According to the above-mentioned mass proportions, mix acrylic resin, low-acid-value modified epoxy acrylic resin, modified boron nitride, acrylate monomer, photoinitiator, additives and solvent to obtain composition A; mix alicyclic epoxy resin, additives and solvent to obtain composition B; then mix composition A and composition B, stir and disperse evenly, grind to a fineness ≤20μm, and pass through a 500-mesh sieve to obtain low-acid-value modified epoxy acrylic resin solder resist ink.

[0079] Example 3

[0080] A low-acid-value modified epoxy acrylate resin solder resist ink, comprising composition A and composition B.

[0081] The composition A comprises the following components in parts by weight:

[0082]

[0083] The composition B comprises the following components in parts by weight:

[0084] 10 parts alicyclic epoxy resin

[0085] 2-3 parts of auxiliary agent

[0086] 10 parts solvent.

[0087] The preparation method of the above-mentioned low acid value modified epoxy acrylic resin solder resist ink includes the following steps:

[0088] S1. Using n-butanol as solvent, E-44 epoxy resin and the first initiator were added and reacted at 90°C for 0.5 h. Then, acrylic acid, butyl acrylate, styrene and the second initiator were added and reacted at 110°C for 5 h. The solvent was removed to obtain a low acid value modified epoxy acrylic resin with an acid value of 31.37 mgKOH / g.

[0089] The mass ratio of E-44 epoxy resin, the first initiator, acrylic acid, butyl acrylate, styrene, and the second initiator is 3:0.01:0.9:1:1:0.16.

[0090] S2. Using ethanol and water in a volume ratio of 5:1 as solvents, add hexagonal boron nitride and KH-550 in a mass ratio of 1:2, reflux in an oil bath at 90°C for 12 hours, filter, wash and dry to obtain a solid product.

[0091] Using NMP as solvent, the solid product, pentaerythritol glycidyl ether, and DMAP were mixed (the mass ratio of hexagonal boron nitride, pentaerythritol glycidyl ether, and DMAP was 0.7:1:0.01), reacted at 95°C for 6 hours, and then filtered and dried to obtain the intermediate product.

[0092] S3. Using NMP as solvent, the intermediate product, 3-aminoadamantane-1-ol and DMAP in a mass ratio of 5:1:0.01 were mixed and reacted at 95°C for 6 hours. After filtration and drying, modified boron nitride was obtained.

[0093] S4. According to the above-mentioned mass proportions, mix acrylic resin, low-acid-value modified epoxy acrylic resin, modified boron nitride, acrylate monomer, photoinitiator, additives and solvent to obtain composition A; mix alicyclic epoxy resin, additives and solvent to obtain composition B; then mix composition A and composition B, stir and disperse evenly, grind to a fineness ≤20μm, and pass through a 500-mesh sieve to obtain low-acid-value modified epoxy acrylic resin solder resist ink.

[0094] Comparative Example 1

[0095] A low-acid-value modified epoxy acrylic resin solder resist ink. The difference between this comparative example and Example 1 is that steps S2-S3 are modified as follows:

[0096] Using ethanol and water in a volume ratio of 5:1 as solvents, hexagonal boron nitride and KH-560 (γ-glycidyl etheroxypropyltrimethoxysilane) in a mass ratio of 1:2 were added. The mixture was reacted at 70°C for 12 h, and after filtration, washing, and drying, a solid product was obtained.

[0097] Using NMP as solvent, the solid product, 3-aminoadamantane-1-ol and DMAP in a mass ratio of 5:1:0.01 were mixed and reacted at 95°C for 6 hours. After filtration and drying, modified boron nitride was obtained.

[0098] The dosage of other ingredients and the preparation method are the same as in Example 1.

[0099] Comparative Example 2

[0100] A low-acid-value modified epoxy acrylic resin solder resist ink. The difference between this comparative example and Example 1 is that step S3 is modified as follows:

[0101] Using NMP as solvent, the intermediate product, lauric acid and DMAP in a mass ratio of 5:1:0.01 were mixed and reacted at 95°C for 6 hours. After filtration and drying, modified boron nitride was obtained.

[0102] The dosage of other ingredients and the preparation method are the same as in Example 1.

[0103] Comparative Example 3

[0104] A low-acid-value modified epoxy acrylic resin solder resist ink. The difference between this comparative example and Example 1 is that step S1 is modified as follows:

[0105] Using n-butanol as a solvent, E-44 epoxy resin and the first initiator were added and reacted at 90°C for 0.5 h. Then, acrylic acid, butyl acrylate, styrene and the second initiator were added and reacted at 110°C for 3 h. The solvent was removed to obtain the modified epoxy acrylic resin with an acid value of 84.65 mgKOH / g.

[0106] The mass ratio of E-44 epoxy resin, the first initiator, acrylic acid, butyl acrylate, styrene, and the second initiator is 7:0.02:1:1:1:0.2.

[0107] The dosage of other ingredients and the preparation method are the same as in Example 1.

[0108] Test case

[0109] The performance of the solder resist ink samples prepared in Examples 1-3 and Comparative Examples 1-3 was tested.

[0110] The testing method is as follows:

[0111] Stability test: Take 200mL of each solder resist ink sample, put it in a transparent container and seal it. Place it at 50℃ for 30 days, and observe whether there are any changes in appearance after returning to room temperature.

[0112] The solder resist inks prepared in the examples and comparative examples were coated onto PCB boards and cured with light for 1 hour (wavelength 395nm, intensity 25.0mW / cm²).2 (Ultraviolet light), then heat-cured at 150℃ for 1 hour to form a 0.7mm thick film.

[0113] Adhesion: Use a needle tip to draw an "X" shape on the film, then apply cellophane tape to the marks and pull it. Evaluate according to the following criteria:

[0114] Pass: Not torn off;

[0115] Unacceptable: Too many pieces were torn off.

[0116] Bending resistance: The solder resist film was bent 180° with the outside facing outwards, and then returned to a horizontal position. This bending was repeated 5 times, and the results were evaluated according to the following criteria:

[0117] Pass: No cracks on the film;

[0118] Unacceptable: The film has cracks.

[0119] Water resistance: At 20℃, the PCB circuit board coated with solder resist ink was immersed in deionized water for 120 hours. After removal, the coating condition and adhesion were evaluated, and the judgment criteria were as follows:

[0120] Pass: No changes or slight changes were found;

[0121] Unacceptable: The coating shows swelling or swelling and peeling.

[0122] Acid resistance: At 20°C, a PCB board coated with solder resist ink is immersed in a 10% sulfuric acid solution. After 3 hours, it is removed, and the state and adhesion of the coating are evaluated. The judgment criteria are as follows:

[0123] Pass: No changes or slight changes were found;

[0124] Unacceptable: The coating shows swelling or swelling and peeling.

[0125] Heat resistance: Thermal shock performance was tested according to the method in IPC-SM-840E, and the judgment criteria are as follows:

[0126] Pass: No bubbles or cracks;

[0127] Unacceptable: Bubbles or cracks appear.

[0128] Anti-yellowing performance: The reflectance of the sample was measured after three reflow solderings. The reflow soldering conditions were: 190℃*3min, 220℃*2min, 240℃*3min, 280℃*4min, for a total of 12min.

[0129] The testing instrument used was an X-RITE colorimeter, model SP62. The larger the ΔB value, the more severe the yellowing.

[0130] The test results are shown in Table 1.

[0131] Table 1 Performance Test Results

[0132]

[0133] The test results above show that the low-acid-value modified epoxy acrylate resin solder resist ink prepared in the embodiments of the present invention exhibits excellent stability, adhesion, flexural strength, solvent resistance, and other properties, as well as strong anti-yellowing ability, demonstrating good overall performance. Comparative Examples 1-2 replaced the modified boron nitride, leading to a decrease in the bonding effect between ink components and the performance of the modified boron nitride. This resulted in varying degrees of decline in the adhesion, strength, and anti-yellowing properties of the film. Comparative Example 3, with its high epoxy acrylate resin, exhibited defects in the water resistance and acid resistance of the film. Furthermore, the increased acid value also negatively impacted the stability of the ink and the anti-yellowing function of the film, resulting in relatively poor overall performance.

[0134] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within the present invention.

[0135] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A low acid value modified epoxy-acrylic resist ink, characterized by, The low-acid-value modified epoxy-acrylic resin solder resist ink comprises composition A and composition B, The composition A comprises ingredients in mass fractions as follows: acrylic resin 5-10 parts low-acid-value modified epoxy-acrylic resin 10-30 parts modified boron nitride 20-40 parts acrylate monomer 20-40 parts photoinitiator 1-2 parts auxiliary agent 1-10 parts solvent 20-50 parts; The composition B comprises ingredients in mass fractions as follows: cycloaliphatic epoxy resin 1-10 parts auxiliary agent 1-10 parts solvent 1-10 parts; wherein, the modified boron nitride is hexagonal boron nitride modified by adamantane derivative; the modified boron nitride is obtained by reacting silane coupling agent with hexagonal boron nitride, and then reacting with epoxy resin and adamantane derivative; the epoxy resin is multifunctional epoxy resin, the silane coupling agent is amino silane coupling agent, and the adamantane derivative is amino-containing adamantane derivative; The preparation method of the low-acid-value modified epoxy-acrylic resin comprises the following steps: mixing and heating bisphenol epoxy resin and initiator to react, then adding vinyl monomer to react at elevated temperature, to obtain low-acid-value modified epoxy-acrylic resin; The low-acid-value modified epoxy-acrylic resin has an acid value of ≤40 mgKOH / g.

2. The low acid value modified epoxy-acrylate resist ink according to claim 1, characterized in that, The acrylate monomer is acrylic ester with single or multiple functional groups.

3. The low acid value modified epoxy-acrylate resist ink of claim 1, wherein, The auxiliary agent is selected from one or more of pigments, leveling agents, defoaming agents, toughening agents, dispersants, and ultraviolet absorbers.

4. The low acid value modified epoxy-acrylate resist ink of claim 1, wherein, The preparation method of the low-acid-value modified epoxy-acrylic resin solder resist ink comprises the following steps: S1, mixing and heating bisphenol epoxy resin and initiator to react, then adding vinyl monomer to react at elevated temperature, to obtain low-acid-value modified epoxy-acrylic resin; S2, mixing hexagonal boron nitride and silane coupling agent, heating to react, and then mixing with multifunctional epoxy resin to obtain intermediate product; S3, mixing the intermediate product and adamantane derivative, heating to react, to obtain modified boron nitride; S4, mixing acrylic resin, low-acid-value modified epoxy-acrylic resin, modified boron nitride, acrylate monomer, photoinitiator, auxiliary agent, and solvent to obtain composition A; mixing cycloaliphatic epoxy resin, auxiliary agent, and solvent to obtain composition B; then mixing the composition A and composition B to obtain low-acid-value modified epoxy-acrylic resin solder resist ink.

5. The low acid value modified epoxy-acrylate resist ink of claim 4, wherein, In step S1, the vinyl monomer comprises acrylic acid, alkyl acrylate, and styrene in a mass ratio of (1-4):(2-5):(2-5); The mass ratio of bisphenol epoxy resin to vinyl monomer is (0.8-1.2):

1.

6. The low acid value modified epoxy-acrylate resist ink of claim 4, wherein, In step S2, the mass ratio of hexagonal boron nitride to multifunctional epoxy resin is (0.5-2):

1.

7. The low acid value modified epoxy-acrylate resist ink of claim 4, wherein, In step S3, the mass ratio of intermediate product to adamantane derivative is (4-8):1.

Images