High-pressure-resistant miniaturized pressure sensor

Abstract

The invention discloses a high-pressure-resistant miniaturized pressure sensor, and belongs to the technical field of pressure sensors. The circuit mainly comprises a connecting plug, a metal shell, a pressure core body and a flexible circuit board, an upper flexible board is electrically connected with a first shielding capacitor C14 on a VCC wire of a conditioning circuit, the other end of the first shielding capacitor C14 is electrically connected with one upper copper-clad hanging lug of the upper flexible board, the upper flexible board is electrically connected with a second shielding capacitor C9 on a GND wire of the conditioning circuit, and the other end of the second shielding capacitor C9 is electrically connected with the other end of the first shielding capacitor C14. The other end of the second shielding capacitor C9 is electrically connected with the other upper copper-coated hanging lug of the upper flexible plate; the side wall of the plug is covered with an upper metal ring, and / or the pressure core body is covered with a lower metal ring; and the inner side of the metal shell is provided with a metallized film of which one side is coated with a metal layer. According to the invention, the design is unique, the structural characteristics of the product and the capacitor forming principle are ingeniously utilized, the voltage resistance of the product is remarkably improved, the product volume is greatly reduced, and the market application prospect is wide.

Description

Technical Field

[0001] The present invention belongs to the technical field of pressure sensors. Specifically, it relates to a high-pressure miniaturized pressure sensor with a unique concept that cleverly utilizes the product's own structural characteristics and the principle of capacitor formation to convert the structural composition into a virtual capacitor with capacitive characteristics. This not only significantly improves the product's pressure resistance performance, but also greatly reduces the product's volume. Background Art

[0002] Pressure sensors used for gas pressure measurement are often installed in fluid pipelines and are used to detect real-time pressure signals of various media fluids. Pressure sensors generally include a joint, a housing, a connector, and a pressure core. The pressure core generally adopts a ceramic capacitor pressure core and a silicon piezoresistive pressure core, which is set in the housing. The housing is connected to the fluid pipeline through the joint. The pressure fluid enters the housing through the joint and acts on the pressure core. The pressure core generates an electrical signal and transmits it through the connector to detect the fluid pressure.

[0003] Changes in distributed capacitance can introduce interference signals into the pressure-sensitive element through parasitic coupling effects, manifesting as low-frequency drift and high-frequency noise in the detection signal, thereby reducing measurement stability. To suppress this drift, the pressure sensor's conditioning circuit is usually electrically connected to the sensor housing (the housing is grounded) to shield the parasitic coupling effect by providing a stable reference potential. However, the direct connection between the conditioning circuit and the housing forms a low-impedance path between the power supply, circuit, and housing. If the sensor's pressure resistance is insufficient, when the equipment is started or stopped, fails, or is struck by lightning or strong static electricity, instantaneous overvoltage will be transmitted through this path, causing the conditioning circuit or sensitive element to break down, thereby causing sensor failure. Currently, commercial pressure sensors require the pressure resistance between the electrical connector pin and the housing to reach AC1500V, without breakdown for 60 seconds, and a leakage current I≤5mA.

[0004] The patent document with the Chinese patent authorization announcement number CN107014525B discloses a ceramic capacitive pressure sensor that is resistant to conductive fluids and electromagnetic interference, and specifically discloses the following technical solutions: including a capacitive pressure detection component; a cylindrical shielding member, which is arranged outside the capacitive pressure detection component of the electrical connector pin, and the top and bottom ends of the cylindrical shielding member of the electrical connector pin have shielding member bending portions that bend inwardly; an insulating retaining ring, which is arranged at the bottom of the cylindrical shielding member and contacts the shielding member bending portion located at the bottom end of the cylindrical shielding member; an O-ring, which is arranged on the inner edge of the insulating retaining ring of the electrical connector pin; an electrically insulating sleeve is arranged outside the cylindrical shielding member of the electrical connector pin, and the top of the electrically insulating sleeve of the electrical connector pin has a sleeve bending portion that bends inwardly, and the electrically insulating sleeve of the electrical connector pin A sensor housing is provided on the outside; it also includes a conditioning circuit for converting a capacitance value into an output voltage signal, and the electrical connector pin conditioning circuit is provided on the top of the electrical connector pin capacitive pressure detection component; an electrical connector is provided above the electrical connector pin conditioning circuit and is electrically connected to the conditioning circuit; the electrical connector pin conditioning circuit and the electrical connector pin electrical connector are connected by a group of pins welded to the electrical connector; the electrical connector pin conditioning circuit also has a group of metal tongues, and the electrical connector pin tongues are connected to the side wall of the electrical connector pin electrical connector; the electrical connector pin capacitive pressure detection component includes a base, a pressure-sensitive film is provided at the bottom of the electrical connector pin base, a conductive shielding layer is provided at the bottom of the electrical connector pin pressure-sensitive film, and the bottom surface of the electrical connector pin conductive shielding layer is in contact with the bending portion of the shielding component at the bottom end of the cylindrical shielding component. When the shielding part is curled into a cylindrical shape, the tongue is in full contact with the cylindrical shielding part, and the cylindrical shielding part is in full contact with the conductive shielding layer of the capacitive pressure detection component, forming a conductive loop. The tongue serves to connect the conditioning circuit with the conductive loop, thereby enabling the cylindrical shielding part to prevent electromagnetic interference. Although the solution provided by this patent document is smaller in size than more traditional products, the miniaturized design is still not ideal. In addition, the anti-interference design of the conditioning circuit in this patent document is achieved by forming a conductive loop by fully contacting the cylindrical shielding part with the conductive shielding layer of the capacitive pressure detection component. As for the protection against transient overvoltage, it is achieved by using an insulating sleeve to insulate and isolate the conditioning circuit, pressure detection component and housing. On the one hand, its manufacturing process is relatively complex; on the other hand, it relies solely on the insulation performance of the insulating sleeve, has limited voltage resistance, and is difficult to effectively suppress the risk of overvoltage.

[0005] Chinese patent application publication number CN114459663A discloses a novel capacitive pressure sensor, specifically comprising an outer shell, an inner shell, an upper end cap, and connecting wires. The inner shell comprises a second housing chamber, in which a pressure sensing element and a circuit module are sequentially mounted, from bottom to top. The bottom of the inner shell comprises an inner shell through-hole that connects to the second housing chamber. The upper end cap cooperates with the opening of the second housing chamber to encapsulate the pressure sensing element and circuit module within the second housing chamber. The top of the upper end cap comprises a pin, the top of which is welded to the connecting wire and the bottom of which is connected to the circuit module. The outer shell comprises a first housing chamber, in which the inner shell is mounted. Potting compound is poured into the first housing chamber, encapsulating the inner shell and the upper end cap within the first housing chamber. The bottom of the outer shell comprises an outer shell through-hole that connects to the inner shell through-hole. Due to the need to ensure sufficient pressure resistance, this patented product has a large structural volume, making it difficult to achieve miniaturization. In addition, its manufacturing process is complicated and requires a large amount of consumables such as epoxy resin, resulting in high manufacturing costs.

[0006] The patent document of China Patent Authorization Announcement No. CN18424539B discloses a pressure sensor and a manufacturing method, and specifically discloses the following technical solutions: the pressure sensor includes a connector, a shell, a joint, a pressure core and a conditioning circuit, the two ends of the shell are respectively bent and covered on the joint and the connector; the pressure core is arranged in the shell, and the conditioning circuit is electrically connected to the pressure core and the connector; it is characterized in that the pressure sensor also includes a shielding shell and an insulating sleeve, the shielding shell is cup-shaped and is sleeved on the outside of the pressure core; the insulating sleeve is arranged between the shielding shell and the shell; a vent hole connected to the joint is opened at the bottom of the shielding shell, a first sealing ring is abutted between the outer bottom wall of the shielding shell and the joint, and a second sealing ring is abutted between the inner bottom wall of the shielding shell and the pressure core, and the first sealing ring and the second sealing ring are both around the vent hole; the connector A positioning flange is formed on one side of the connector and is located on the upper side of the pressure core. A first stop is circumferentially provided on the outer side of the positioning flange, and the top of the shielding shell abuts the first stop. An insulating flange is radially inwardly provided on the bottom of the insulating sleeve, and the insulating flange abuts between the connector and the bottom wall of the shielding shell. The conditioning circuit includes a first printed circuit board (PCB) and a second printed circuit board. The first PCB is electrically connected to the connector pins, and the second PCB is electrically connected to the pressure core. The first PCB is coaxially arranged on a side of the second PCB away from the pressure core, and the first and second PCBs are electrically connected. The first PCB is symmetrically connected to two first grounding lugs, and the second PCB is symmetrically connected to two second grounding lugs. The first grounding lug is bent toward the second PCB and then abuts against the second grounding lug. The first and second grounding lugs are electrically connected to the shielding shell. This patented product is large in size and has a complex structural design. Two sealing rings are required, resulting in a complex manufacturing process and high production costs. Summary of the Invention

[0007] The purpose of the present invention is to address the shortcomings of the existing technology and provide a high-voltage miniaturized pressure sensor with a unique concept, which cleverly utilizes the product's own structural characteristics and the principle of capacitor formation to convert the structural composition into a virtual capacitor with capacitive characteristics. It not only significantly improves the product's pressure resistance performance, but also greatly reduces the product volume.

[0008] The present invention is achieved through the following technical solutions: A high-pressure miniaturized pressure sensor includes a connection plug fixedly connected to an electrical connector pin, the connection plug and the metal shell covering the outside constitute an accommodating installation space, a pressure core and a flexible circuit board with a conditioning circuit are installed in the accommodating installation space; the flexible circuit board includes an upper flexible board electrically connected to the electrical connector pin, and a lower flexible board electrically connected to the pressure core, the upper flexible board is electrically connected to a first shielding capacitor C14 on the VCC trace of the conditioning circuit, the other end of the first shielding capacitor C14 is electrically connected to one of the upper copper hanging ears of the upper flexible board, the upper flexible board is electrically connected to a second shielding capacitor C9 on the GND trace of the conditioning circuit, and the second shielding capacitor C14 is electrically connected to the GND trace of the conditioning circuit. The other end of the container C9 is electrically connected to the other upper copper hanging ear of the upper flexible board, and the two upper copper hanging ears respectively pass through the two grooves provided on the side wall of the connecting plug; the side wall of the connecting plug is covered with a circle of upper metal ring electrically connected to the upper copper hanging ear along the circumferential direction, and / or the pressure core is covered with a circle of lower metal ring electrically connected to the upper copper hanging ear along the circumferential direction; the upper metal ring is electrically connected to the upper copper hanging ear, and the lower metal ring is electrically connected to the upper copper hanging ear; a metallized film with a single-sided metal layer is provided on the inner side of the metal shell, and the metal layer of the metallized film is electrically connected to the metal ring; a sealing ring is installed between the bottom surface of the pressure core and the metal shell to prevent fluid leakage.

[0009] Preferably, the upper copper hanging ear, metal ring, metalized film, and metal shell constitute a first virtual capacitor; the metal layer on the upper copper hanging ear, metal ring, and metalized film constitutes one of the metal electrodes of the first virtual capacitor, the insulating material of the metalized film constitutes the insulating medium of the first virtual capacitor, and the metal shell constitutes the other metal electrode of the first virtual capacitor.

[0010] Preferably, the upper copper hanging ear is designed with double-sided copper cladding.

[0011] Preferably, the upper end of the metallized film embedded inside the metal shell is higher than the upper port of the metal shell; the metal shell is wrapped with the upper end of the side wall in a crimping packaging manner to fix the metal shell to the connecting plug.

[0012] A high-pressure miniaturized pressure sensor, comprising a connection plug fixedly connected to an electrical connector pin, the connection plug and the metal shell covering the outside constitute an accommodating installation space, wherein a pressure core and a flexible circuit board provided with a conditioning circuit are installed in the accommodating installation space; the flexible circuit board comprises an upper flexible board electrically connected to the electrical connector pin, and a lower flexible board electrically connected to the pressure core, the lower flexible board is electrically connected to a third shielding capacitor C8 on the VCC trace of the conditioning circuit, the other end of the third shielding capacitor C8 is electrically connected to one of the lower copper-clad hanging ears of the lower flexible board, the lower flexible board is electrically connected to a fourth shielding capacitor C15 on the GND trace of the conditioning circuit, and the third shielding capacitor C8 is electrically connected to the lower copper-clad hanging ears of the lower flexible board. The other end of the four-shielding capacitor C15 is electrically connected to the other lower copper-clad ear of the lower flexible board, and both of the lower copper-clad ears extend beyond the edge of the pressure core; the side wall of the connecting plug is covered with an upper metal ring electrically connected to the lower copper-clad ear along the circumferential direction, and / or the pressure core is covered with a lower metal ring electrically connected to the lower copper-clad ear along the circumferential direction; the upper metal ring is electrically connected to the lower copper-clad ear, and the lower metal ring is electrically connected to the lower copper-clad ear; a metallized film with a single-sided metal layer is provided on the inner side of the metal shell, and the metal layer of the metallized film is electrically connected to the metal ring; a sealing ring is installed between the bottom surface of the pressure core and the metal shell to prevent fluid leakage.

[0013] Preferably, the lower copper-clad hanging ear, metal ring, metalized film, and metal shell constitute a second virtual capacitor; the lower copper-clad hanging ear, metal ring, and metal layer on the metalized film constitute one of the metal electrodes of the second virtual capacitor, the insulating material of the metalized film constitutes the insulating medium of the second virtual capacitor, and the metal shell constitutes the other metal electrode of the second virtual capacitor; the lower copper-clad hanging ear is a double-sided copper-clad design.

[0014] Preferably, the upper end of the metallized film embedded inside the metal shell is higher than the upper port of the metal shell; the metal shell is wrapped with the upper end of the side wall in a crimping packaging manner to fix the metal shell to the connecting plug.

[0015] A high-pressure miniaturized pressure sensor, comprising a connecting plug fixedly connected to an electrical connector pin, the connecting plug and the metal shell covering the outside constitute an accommodating installation space, a pressure core and a flexible circuit board provided with a conditioning circuit are installed in the accommodating installation space; the flexible circuit board comprises an upper flexible board electrically connected to the electrical connector pin, and a lower flexible board electrically connected to the pressure core, the upper flexible board is electrically connected to a first shielding capacitor C14 on the VCC trace of the conditioning circuit, the other end of the first shielding capacitor C14 is electrically connected to one of the upper copper hanging ears of the upper flexible board, the upper flexible board is electrically connected to a second shielding capacitor C9 on the GND trace of the conditioning circuit, the other end of the second shielding capacitor C9 is electrically connected to another upper copper hanging ear of the upper flexible board, the two upper copper hanging ears respectively extend from two slots provided on the side wall of the connecting plug; the lower flexible board is electrically connected to a third shielding capacitor C14 on the VCC trace of the conditioning circuit Capacitor C8, the other end of the third shielding capacitor C8 is electrically connected to one of the lower copper-clad ears of the lower flexible board, and the lower flexible board is electrically connected to the fourth shielding capacitor C15 on the GND trace of the conditioning circuit. The other end of the fourth shielding capacitor C15 is electrically connected to the other lower copper-clad ear of the lower flexible board, and both of the lower copper-clad ears extend beyond the edge of the pressure core; the upper copper-clad ear is electrically connected to the lower copper-clad ear; the side wall of the connecting plug is covered with an upper metal ring electrically connected to the copper-clad ear along the circumferential direction, and / or the pressure core is covered with a lower metal ring electrically connected to the copper-clad ear along the circumferential direction; the upper metal ring is electrically connected to the copper-clad ear, and the lower metal ring is electrically connected to the copper-clad ear; a metallized film with a single-sided metal layer is provided on the inner side of the metal shell, and the metal layer of the metallized film is electrically connected to the metal ring; a sealing ring is installed between the bottom surface of the pressure core and the metal shell to prevent fluid leakage.

[0016] Preferably, the copper-clad hanging ear, metal ring, metalized film, and metal shell constitute a third virtual capacitor; the copper-clad hanging ear, metal ring, and metal layer on the metalized film constitute one of the metal electrodes of the third virtual capacitor, the insulating material of the metalized film constitutes the insulating medium of the third virtual capacitor, and the metal shell constitutes the other metal electrode of the third virtual capacitor; the lower copper-clad hanging ear is a double-sided copper-clad design.

[0017] Preferably, the upper end of the metallized film embedded inside the metal shell is higher than the upper port of the metal shell; the metal shell is wrapped with the upper end of the side wall in a crimping packaging manner to fix the metal shell to the connecting plug.

[0018] Compared with the prior art, the present invention has the following beneficial effects: The essence of a capacitor is "metal electrode-insulating dielectric-metal electrode" (that is, a layer of insulating dielectric sandwiched between two metal electrodes). This invention cleverly utilizes the product's inherent structural characteristics and the principle of capacitor formation to convert the structure formed by the copper-clad ear, metal ring, metallized film, and metal shell into a virtual capacitor with capacitive characteristics. This is equivalent to connecting a capacitor in series between each shielding capacitor and the ground terminal Case. On the basis of excellent anti-interference performance, the product's voltage resistance performance is greatly improved.

[0019] This invention truly achieves miniaturized product design. Because the copper-clad mounting bracket, metallized film, and metal ring are all micron-level thick, the wall thickness of these components is much smaller than that of the metal shell, making it almost negligible, significantly reducing the product's size. Furthermore, due to the invention's excellent voltage resistance, the shielding capacitor in the conditioning circuit can be made of a very small, conventional capacitor (such as a 0603 or 0402 chip capacitor), further reducing the product's size. Furthermore, the invention requires only a single sealing ring, further minimizing the product's size.

[0020] The invention has a simple manufacturing process, the crimping packaging is performed only once, there are fewer steps, fewer assembly parts, and low production costs; the invention has a unique conception and strong practicality, promotes technological progress in the field of pressure sensors, and has broad market application prospects. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention (when the metal shell is not curled).

[0022] Figure 2 This is a schematic diagram of the structure of the present invention after the metal shell and the metallized film are hidden (one state).

[0023] Figure 3 It is a structural schematic diagram of the flexible circuit board of the present invention.

[0024] Figure 4 This invention Figure 2 Schematic diagram of the structure in three-dimensional direction.

[0025] Figure 5 This is a system block diagram of the electrical principles of Examples 1 to 3 of the present invention.

[0026] Figure 6 It is a schematic diagram of the cross-sectional structure of the present invention in Example 1.

[0027] Figure 7 This invention Figure 6 Enlarged view of point A in the middle.

[0028] Figure 8 It is a schematic structural diagram of the present invention in Example 2.

[0029] Figure 9 This invention Figure 8 Enlarged view of point B in the middle.

[0030] Figure 10 It is a schematic structural diagram of the present invention in Example 3.

[0031] Figure 11 This invention Figure 10 Enlarged view of point C in the middle.

[0032] Figure 12 It is a system block diagram of the electrical principles of Examples 4 to 6 of the present invention.

[0033] Figure 13 It is a schematic diagram of the cross-sectional structure of the present invention in Example 4.

[0034] Figure 14 This invention Figure 13 Enlarged view of point D in the middle.

[0035] Figure 15 It is a schematic diagram of the cross-sectional structure of the present invention in Example 5.

[0036] Figure 16 This invention Figure 15 Enlarged view of point E in the middle.

[0037] Figure 17 It is a schematic diagram of the cross-sectional structure of the present invention in Example 6.

[0038] Figure 18 This invention Figure 17 Enlarged view of point F in the middle.

[0039] Figure 19 It is a system block diagram of the electrical principles of Examples 7 to 9 of the present invention.

[0040] Figure 20 It is a schematic diagram of the cross-sectional structure of the present invention in Example 7.

[0041] Figure 21 This invention Figure 20 Enlarged view of point G in the middle.

[0042] Figure 22 It is a schematic diagram of the cross-sectional structure of the present invention in Example 8.

[0043] Figure 23 This invention Figure 22 Enlarged view of point H in the middle.

[0044] Figure 24 It is a schematic diagram of the cross-sectional structure of the present invention in Example 9.

[0045] Figure 25 This invention Figure 24 Enlarged view of point I in the middle.

[0046] In the figure: 10, connecting plug; 101, slot; 102, side wall; 11, electrical connector pin; 111, pin one; 112, pin two; 113, pin three; 20, metal shell; 31, pressure core; 32, flexible circuit board; 321, upper flexible board; 3211, upper copper hanging ear; 322, lower flexible board; 3221, lower copper hanging ear; 323, conditioning circuit; 3231, VCC routing; 3232, GND routing; 324, upper metal ring; 325, lower metal ring; 326, metalized film; 327, first virtual capacitor; 328, second virtual capacitor; 329, third virtual capacitor; 40, sealing ring. DETAILED DESCRIPTION

[0047] In order to enable readers to better understand the design purpose of the present invention, the technical solution of the present invention is further described below in conjunction with the accompanying drawings and embodiments. It should be noted that the directional nouns that may be involved in the following paragraphs, including but not limited to "up, down, left, right, front, back", etc., are based on the visual directions shown in the corresponding drawings of the specification, and should not be regarded as limiting the scope of protection or technical solution of the present invention. Its purpose is only to facilitate those skilled in the art to better understand the technical solution created by the present invention.

[0048] In the description of this specification, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this invention based on specific circumstances, in combination with common knowledge in the field, design specifications, standard documents, etc.

[0049] Example 1

[0050] like Figures 1 to 7 As shown, a high-pressure miniaturized pressure sensor includes a connection plug 10 fixed with an electrical connector pin 11, and the electrical connector pin 11 is commonly known as a "plug connector". Figure 5 、 Figure 6As shown, the electrical connector pin 11 has three pins, namely pin one 111 for connecting to the positive input terminal of the power supply, pin two 112 as the signal output terminal, and pin three 113 for connecting to the negative terminal of the power supply. The connecting plug 10 is a plastic part. The connecting plug 10 and the metal shell 20 wrapped on the outside form an accommodating installation space, in which a pressure core 31 and a flexible circuit board 32 with a conditioning circuit 323 are installed. The flexible circuit board 32 is a PCBA soft board. A sealing ring 40 is installed between the bottom surface of the pressure core 31 and the metal shell 20 to prevent fluid leakage. The flexible circuit board 32 includes an upper flexible board 321 electrically connected to the electrical connector pin 11, and a lower flexible board 322 electrically connected to the pressure core 31. As shown Figure 5 As shown, the upper flexible board 321 is electrically connected to the first shielding capacitor C14 on the VCC trace of the conditioning circuit 323, and the other end of the first shielding capacitor C14 is electrically connected to one of the upper copper-clad hanging ears 3211 of the upper flexible board 321. The upper flexible board 321 is electrically connected to the second shielding capacitor C9 on the GND trace of the conditioning circuit 323, and the other end of the second shielding capacitor C9 is electrically connected to another upper copper-clad hanging ear 3211 of the upper flexible board 321. The two upper copper-clad hanging ears 3211 respectively pass through the two slots 101 provided on the side wall 102 of the connecting plug 10. The protrusion design of the upper copper-clad hanging ear 3211 is to ensure good electrical contact with the metal ring. The upper copper-clad hanging ear 3211 can be a single-sided copper-clad design or a double-sided copper-clad design. The double-sided copper-clad design is preferred for greater versatility and flexibility.

[0051] In this embodiment, an upper metal ring 324 is circumferentially disposed on the sidewall 102 of the connection plug 10 and electrically connected to the upper copper hanging lug 3211. The upper metal ring 324 is formed by spraying or applying copper foil, and is electrically connected to the upper copper hanging lug 3211. Specifically, the upper copper hanging lug 3211 maintains electrical contact with the upper metal ring 324 by being folded up or down. Figure 7The solid center portion represents the upper metal ring 324. This figure is for illustrative purposes only, and the position of the upper metal ring 324 can be adjusted flexibly based on actual needs. For example, when the upper copper hanging lug 3211 is flipped upward, the upper metal ring 324 only needs to be placed on the side wall 102 where it contacts the upper copper hanging lug 3211, leaving the remaining non-contact areas uncovered. Similarly, when the upper copper hanging lug 3211 is flipped downward, the upper metal ring 324 only needs to be placed on the side wall 102 where it contacts the upper copper hanging lug 3211, leaving the remaining non-contact areas uncovered. A metallized film 326 with a metal layer coated on one side is provided on the inside of the metal housing 20. The base material of the metallized film 326 is a polyesteramide film with a metal layer coated on one side. The metal layer of the metallized film 326 contacts the upper metal ring 324 (the cross-section of the upper copper hook 3211 in the figure is for schematic purposes only. The upper copper hook 3211 is an extension of the flexible printed circuit board (FPCB), which is a thin printed circuit board made of a flexible substrate such as polyimide (PI) or polyester (PET). After the metal housing 20 is crimped and encapsulated, the metal layer of the metallized film 326 contacts the upper metal ring 324). The upper metal ring 324 contacts the upper copper hook 3211, thus maintaining a good electrical connection between the upper copper hook 3211, the upper metal ring 324, and the metal layer of the metallized film 326. Accordingly, the non-metallized side of the metallized film 326 contacts the inner wall of the metal housing 20, providing insulating properties. Thus, the upper copper hook 3211, the upper metal ring 324, the metallized film 326, and the metal housing 20 form a first virtual capacitor 327. The metal layer on the upper copper mounting bracket 3211, the upper metal ring 324, and the metal layer on the metallized film 326 constitute one metal electrode of the first virtual capacitor 327. The insulating material of the metallized film 326 constitutes the insulating medium of the first virtual capacitor 327. The metal housing 20 constitutes the other metal electrode of the first virtual capacitor 327. The metal housing 20 is electrically connected to the ground terminal Case.

[0052] The essence of a capacitor is "metal electrode-insulating dielectric-metal electrode" (i.e., a layer of insulating dielectric sandwiched between two metal electrodes). This embodiment cleverly leverages the product's inherent structural characteristics and the principles of capacitor formation to transform the structure formed by the overlying copper ear 3211, upper metal ring 324, metalized film 326, and metal housing 20 into a virtual capacitor with capacitive properties. This is equivalent to connecting a voltage-dividing capacitor (i.e., first virtual capacitor 327) in series between the first shielding capacitor C14 and the ground terminal Case, and between the second shielding capacitor C9 and the ground terminal Case, respectively. This effectively reduces the voltage across the shielding capacitors and alleviates insulation stress on the shielding capacitors. This significantly improves the product's withstand voltage performance while maintaining excellent anti-interference performance.

[0053] Currently, commercial pressure sensors meet the following voltage requirements: 1500V AC between the connector pins and the housing for 60 seconds without breakdown, and a leakage current of 5mA or less. Products that meet these requirements are considered qualified, while those that do not are considered unqualified.

[0054] Ten samples were randomly selected from the product prepared in Example 1 and tested under the following conditions and method: Pins 111, 212, and 313 were short-circuited and connected to one end of an AC2000V test voltage. The sample housing was then connected to the other end of an AC2000V test voltage for 60 seconds. All ten samples passed the withstand voltage and leakage current tests, with the leakage current fluctuating around 1.2mA.

[0055] In this embodiment, the upper end of the metalized film 326 embedded within the metal housing 20 protrudes 0.3mm-0.8mm (preferably 0.5mm) above the upper end of the metal housing 20 to ensure insulation between the metal housing 20 and other product components. The metal housing 20 is crimped to the upper end of the sidewall 102 of the connector plug 10, securing the connection. This crimping process is consistent with conventional methods. The clamping force generated by the crimping of the metal housing 20 ensures good electrical contact throughout the housing.

[0056] This embodiment truly achieves product miniaturization. Because the copper-clad mounting bracket, metallized film, and metal ring are all micron-level thick, the wall thickness of these components is much smaller than that of the metal shell, making it almost negligible, significantly reducing the product's size. Furthermore, due to the excellent voltage resistance of this embodiment, the shielding capacitor in the conditioning circuit can be made of very small, conventional capacitors (such as 0603 or 0402 chip capacitors), further reducing the product's size. Furthermore, this embodiment requires only a single sealing ring, further reducing the product's size from a structural perspective.

[0057] This embodiment has a simple process, the crimping package is only performed once, there are fewer steps, fewer assembly parts, and low production costs; it has a unique concept and strong practicality, promotes technological progress in the field of pressure sensors, and has broad market application prospects.

[0058] Example 2

[0059] This embodiment is relatively similar to the embodiment 1 as a whole, except that: Figure 8-Figure 9As shown, compared to Example 1, the metal ring of this embodiment is positioned differently. Instead of a metal ring on the sidewall 102, a lower metal ring 325 is circumferentially provided on the pressure core 31, electrically connected to the upper copper lug 3211. The lower metal ring 325 can be sprayed or applied with copper foil. The lower metal ring 325 is electrically connected to the upper copper lug 3211. Specifically, the upper copper lug 3211 is folded downward to contact and electrically connect with the lower metal ring 325, and the lower metal ring 325 is in contact and electrically connected with the metal layer of the metallized film 326. The metal layers of the upper copper lug 3211, the lower metal ring 325, and the metallized film 326 maintain good electrical connection. Thus, the upper copper lug 3211, the lower metal ring 325, the metallized film 326, and the metal housing 20 form a first virtual capacitor 327. The metal layer on the upper copper hanging ear 3211, the lower metal ring 325, and the metalized film 326 constitutes one of the metal electrodes of the first virtual capacitor 327, the insulating material of the metalized film 326 constitutes the insulating medium of the first virtual capacitor 327, and the metal shell 20 constitutes the other metal electrode of the first virtual capacitor 327. The metal shell 20 is electrically connected to the ground terminal Case. The working principle of this embodiment is consistent with that of Example 1, and it also has the beneficial effects described in Example 1. 10 samples were randomly selected from the products prepared by the solution of Example 2 for testing, and the test conditions and methods were the same as those of Example 1. After testing, the withstand voltage and leakage current tests of the 10 samples were all qualified, and the leakage current value also fluctuated around 1.2mA.

[0060] Example 3

[0061] This embodiment is similar to embodiment 1 and embodiment 2 in overall scheme, except that: Figure 10-11As shown, compared to Examples 1 and 2, this embodiment does not selectively include a single metal ring. Instead, an upper metal ring 324 is circumferentially provided on the sidewall 102 of the connection plug 10, electrically connected to the upper copper lug 3211, and a lower metal ring 325 is circumferentially provided on the pressure core 31, electrically connected to the upper copper lug 3211. The upper metal ring 324 is electrically connected to the upper copper lug 3211, and the lower metal ring 325 is electrically connected to the upper copper lug 3211. The upper copper lug 3211 is in electrical contact with the upper metal ring 324 and the lower metal ring 325, and the upper metal ring 324 and the lower metal ring 325 are in electrical contact with the metal layer of the metallized film 326. As a result, the metal layers of the upper copper lug 3211, the upper metal ring 324, the lower metal ring 325, and the metallized film 326 maintain good electrical connection. In this way, the upper copper hanging ear 3211, the metal ring, the metalized film 326, and the metal shell 20 constitute the first virtual capacitor 327; the upper copper hanging ear 3211, the upper metal ring 324, the lower metal ring 325, and the metal layer on the metalized film 326 constitute one of the metal electrodes of the first virtual capacitor 327, the insulating material of the metalized film 326 constitutes the insulating medium of the first virtual capacitor 327, and the metal shell 20 constitutes the other metal electrode of the first virtual capacitor 327. The metal shell 20 is electrically connected to the ground terminal Case. The working principle of this embodiment is consistent with that of Example 1, and it also has the beneficial effects described in Example 1. 10 samples were randomly selected from the products prepared by the solution of Example 3 for testing, and the test conditions and methods were the same as those of Example 1. After testing, the withstand voltage and leakage current tests of the 10 samples were all qualified, and the leakage current value fluctuated around 0.8mA.

[0062] Example 4

[0063] like Figures 12 to 14 As shown, a high-pressure miniaturized pressure sensor includes a connection plug 10 fixedly connected to an electrical connector pin 11. Figure 12 、 Figure 13As shown, the electrical connector pin 11 has three pins, namely pin one 111 for connecting to the positive input terminal of the power supply, pin two 112 as the signal output terminal, and pin three 113 for connecting to the negative terminal of the power supply. The connecting plug 10 is a plastic part. The connecting plug 10 and the metal shell 20 covering the outside form a storage installation space, in which the pressure core 31 and the flexible circuit board 32 with the conditioning circuit 323 are installed; the flexible circuit board 32 is a PCBA soft board. A sealing ring 40 is installed between the bottom surface of the pressure core 31 and the metal shell 20 to prevent fluid leakage. The flexible circuit board 32 includes an upper flexible board 321 electrically connected to the electrical connector pin 11, and a lower flexible board 322 electrically connected to the pressure core 31. The lower flexible board 322 is electrically connected to the third shielding capacitor C8 on the VCC trace 3231 of the conditioning circuit 323. The other end of the third shielding capacitor C8 is electrically connected to one of the lower copper-clad hanging ears 3221 of the lower flexible board 322. The lower flexible board 322 is electrically connected to the fourth shielding capacitor C15 on the GND trace 3232 of the conditioning circuit 323. The other end of the fourth shielding capacitor C15 is electrically connected to another lower copper-clad hanging ear 3221 of the lower flexible board 322. Both lower copper-clad hanging ears 3221 extend beyond the edge of the pressure core 31. The lower copper-clad hanging ear 3221 can be a single-sided copper-clad design or a double-sided copper-clad design. The double-sided copper-clad design is preferred for greater versatility and flexibility.

[0064] like Figure 13 、 Figure 14As shown, in this embodiment, an upper metal ring 324 is circumferentially coated on the side wall 102 of the connection plug 10, electrically connected to the lower copper-clad lug 3221. The upper metal ring 324 is achieved by spraying or applying copper foil. The upper metal ring 324 is electrically connected to the lower copper-clad lug 3221. Specifically, the lower copper-clad lug 3221 maintains electrical contact with the upper metal ring 324 by being flipped up. A metallized film 326 with a metal layer coated on one side is provided on the inside of the metal shell 20. The base material of the metallized film 326 is a polyesteramide film, and the polyesteramide film is coated with a metal layer on one side. The metal layer of the metallized film 326 is in contact with the upper metal ring 324, and the upper metal ring 324 is in contact with the lower copper-clad lug 3221. Therefore, the metal layers of the lower copper-clad lug 3221, the upper metal ring 324, and the metal layers of the metallized film 326 maintain a good electrical connection. Correspondingly, the non-metallized side of the metalized film 326 contacts the inner wall of the metal housing 20 and has insulating properties. Thus, the lower copper-clad mounting bracket 3221, upper metal ring 324, metalized film 326, and metal housing 20 form a second virtual capacitor 328. The metal layer on the lower copper-clad mounting bracket 3221, upper metal ring 324, and metalized film 326 constitutes one metal electrode of the second virtual capacitor 328. The insulating material of the metalized film 326 constitutes the insulating medium of the second virtual capacitor 328, and the metal housing 20 constitutes the other metal electrode of the second virtual capacitor 328. The metal housing 20 is electrically connected to the ground terminal Case.

[0065] The essence of a capacitor is "metal electrode-insulating dielectric-metal electrode" (i.e., a layer of insulating dielectric sandwiched between two metal electrodes). This embodiment cleverly leverages the product's inherent structural characteristics and the principle of capacitor formation to transform the structure formed by the lower copper mounting bracket 3221, upper metal ring 324, metalized film 326, and metal housing 20 into a virtual capacitor with capacitive properties. This is equivalent to connecting a voltage divider capacitor (i.e., a second virtual capacitor 328) in series between the third shielding capacitor C8 and the ground terminal Case, and between the fourth shielding capacitor C15 and the ground terminal Case, respectively. This effectively reduces the voltage across the shielding capacitors and alleviates insulation stress on the shielding capacitors. This embodiment achieves significant improvements in the product's withstand voltage performance while maintaining excellent anti-interference performance. Ten samples were randomly selected from the product prepared in Example 3 for testing. The test conditions and method were as follows: Pins 1 111, 2 112, and 3 113 were short-circuited and connected to one terminal of an AC 2000V test voltage. The sample housing was connected to the other terminal of an AC 2000V test voltage for 60 seconds. After testing, all 10 samples passed the voltage withstand and leakage current tests, with the leakage current value fluctuating around 1.2mA.

[0066] In this embodiment, the upper end of the metalized film 326 embedded within the metal housing 20 protrudes 0.3mm-0.8mm (preferably 0.5mm) above the upper end of the metal housing 20 to ensure insulation between the metal housing 20 and other product components. The metal housing 20 is crimped to the upper end of the sidewall 102 of the connector plug 10, securing the connection. This crimping process is consistent with conventional methods. The clamping force generated by the crimping of the metal housing 20 ensures good electrical contact throughout the housing.

[0067] This embodiment truly achieves product miniaturization. Because the copper-clad mounting bracket, metallized film, and metal ring are all micron-level thick, the wall thickness of these components is much smaller than that of the metal shell, making it almost negligible, significantly reducing the product's size. Furthermore, due to the excellent voltage resistance of this embodiment, the shielding capacitor in the conditioning circuit can be made of very small, conventional capacitors (such as 0603 or 0402 chip capacitors), further reducing the product's size. Furthermore, this embodiment requires only a single sealing ring, further reducing the product's size from a structural perspective.

[0068] This embodiment has a simple process, the crimping package is only performed once, there are fewer steps, fewer assembly parts, and low production costs; it has a unique concept and strong practicality, promotes technological progress in the field of pressure sensors, and has broad market application prospects.

[0069] Example 5

[0070] This embodiment is relatively similar to the embodiment 4 scheme as a whole, the difference is that: Figure 15-16As shown, compared to Example 4, the metal ring of this embodiment is set in a different position. In this embodiment, the metal ring is not covered on the side wall 102. Instead, a lower metal ring 325 is covered along the circumferential direction of the pressure core 31 and is electrically connected to the lower copper-clad hanging ear 3221. The lower metal ring 325 can be achieved by spraying or applying copper foil. The lower metal ring 325 is electrically connected to the lower copper-clad hanging ear 3221. Specifically, the lower copper-clad hanging ear 3221 is in contact and electrically connected with the lower metal ring 325, and the lower metal ring 325 is in contact and electrically connected with the metal layer on the metallized film 326. Therefore, the lower copper-clad hanging ear 3221, the lower metal ring 325, and the metal layer on the metallized film 326 maintain a good electrical connection. In this way, the lower copper-clad hanging ear 3221, the lower metal ring 325, the metallized film 326, and the metal shell 20 constitute the second virtual capacitor 328. The lower copper hanging ear 3221, the lower metal ring 32, and the metal layer on the metallized film 326 constitute one of the metal electrodes of the second virtual capacitor 328, the insulating material of the metallized film 326 constitutes the insulating medium of the second virtual capacitor 328, and the metal shell 20 constitutes the other metal electrode of the second virtual capacitor 328. The metal shell 20 is electrically connected to the ground terminal Case. The working principle of this embodiment is consistent with that of Example 4, and it also has the beneficial effects described in Example 4. 10 samples were randomly selected from the products prepared by the solution of Example 5 for testing, and the test conditions and methods were the same as those of Example 4. After testing, the withstand voltage and leakage current tests of the 10 samples were all qualified, and the leakage current value also fluctuated around 1.2mA.

[0071] Example 6

[0072] This embodiment is similar to the embodiments 4 and 5 in overall scheme, except that: Figure 17-18As shown, compared to Examples 4 and 5, this embodiment does not selectively include a single metal ring. Instead, an upper metal ring 324 is circumferentially provided on the sidewall 102 of the connection plug 10, electrically connected to the lower copper-clad lug 3221, and a lower metal ring 325 is circumferentially provided on the pressure core 31, electrically connected to the lower copper-clad lug 3221. The lower metal ring 325 is directly in electrical contact with the lower copper-clad lug 3221. The upper metal ring 324 is indirectly in electrical contact with the lower copper-clad lug 3221, while the upper metal ring 324 is in direct contact with the metal layer of the metallized film 326, and the metal layer of the metallized film 326 is in direct contact with the lower metal ring 325. As a result, the metal layers of the lower copper-clad lug 3221, lower metal ring 325, upper metal ring 324, and metallized film 326 maintain good electrical connectivity. In this way, the lower copper hanging ear 3221, the metal ring, the metalized film 326, and the metal shell 20 constitute the second virtual capacitor 328. The lower copper hanging ear 3221, the lower metal ring 325, the upper metal ring 324, and the metal layer on the metalized film 326 constitute one of the metal electrodes of the second virtual capacitor 328, the insulating material of the metalized film 326 constitutes the insulating medium of the second virtual capacitor 328, and the metal shell 20 constitutes the other metal electrode of the second virtual capacitor 328. The metal shell 20 is electrically connected to the ground terminal Case. The working principle of this embodiment is consistent with that of Example 4, and it also has the beneficial effects described in Example 4. 10 samples were randomly selected from the products prepared by the solution of Example 6 for testing, and the test conditions and methods were the same as those of Example 4. After testing, the withstand voltage and leakage current tests of the 10 samples were all qualified, and the leakage current value fluctuated around 0.8mA.

[0073] Example 7

[0074] like Figures 19 to 21 As shown, a high-pressure miniaturized pressure sensor includes a connection plug 10 fixedly connected to an electrical connector pin 11. Figure 19 、 Figure 20 As shown, the electrical connector pin 11 has three pins, namely pin one 111 for connecting to the positive input terminal of the power supply, pin two 112 as the signal output terminal, and pin three 113 for connecting to the negative terminal of the power supply. The connecting plug 10 is a plastic part. The connecting plug 10 and the metal shell 20 covering the outside form a storage installation space, in which the pressure core 31 and the flexible circuit board 32 with the conditioning circuit 323 are installed; the flexible circuit board 32 is a PCBA soft board. A sealing ring 40 is installed between the bottom surface of the pressure core 31 and the metal shell 20 to prevent fluid leakage. The flexible circuit board 32 includes an upper flexible board 321 electrically connected to the electrical connector pin 11, and a lower flexible board 322 electrically connected to the pressure core 31.

[0075] In this embodiment, the upper flexible board 321 is electrically connected to a first shielding capacitor C14 on the VCC trace 3231 of the conditioning circuit 323. The other end of the first shielding capacitor C14 is electrically connected to one of the upper copper mounting ears 3211 of the upper flexible board 321. The upper flexible board 321 is electrically connected to a second shielding capacitor C9 on the GND trace 3232 of the conditioning circuit 323. The other end of the second shielding capacitor C9 is electrically connected to another upper copper mounting ear 3211 of the upper flexible board 321. The two upper copper mounting ears 3211 extend through two slots 101 provided on the side wall 102 of the connection plug 10. The protrusion of the upper copper mounting ears 3211 is designed to ensure good electrical contact with the metal ring. The lower flexible board 322 is electrically connected to the third shielding capacitor C8 on the VCC trace 3231 of the conditioning circuit 323. The other end of the third shielding capacitor C8 is electrically connected to one of the lower copper-clad mounting ears 3221 of the lower flexible board 322. The lower flexible board 322 is electrically connected to the fourth shielding capacitor C15 on the GND trace 3232 of the conditioning circuit 323. The other end of the fourth shielding capacitor C15 is electrically connected to another lower copper-clad mounting ear 3221 of the lower flexible board 322. Both lower copper-clad mounting ears 3221 extend beyond the edge of the pressure core 31. The upper copper-clad mounting ear 3211 and the lower copper-clad mounting ear 3221 can be single-sided copper-clad or double-sided copper-clad. The double-sided copper-clad design is preferred for greater versatility and flexibility.

[0076] like Figure 20 、 Figure 21 As shown, in this embodiment, the sidewall 102 of the connection plug 10 is circumferentially coated with an upper metal ring 324 electrically connected to the copper-clad lug. The upper metal ring 324 is applied by spraying or applying copper foil. The upper metal ring 324 is electrically connected to the copper-clad lug. Specifically, the upper copper-clad lug 3211 is flipped up to maintain electrical contact with the upper metal ring 324, and the lower copper-clad lug 3221 is also flipped up to maintain electrical contact with the upper metal ring 324. A metalized film 326 with a metal layer coated on one side is provided on the inside of the metal shell 20. The metal layer of the metalized film 326 contacts the upper metal ring 324, maintaining good electrical connection between the metal layer of the metalized film 326, the upper metal ring 324, the lower copper-clad lug 3221, and the upper copper-clad lug 3211. Accordingly, the non-metalized side of the metalized film 326 contacts the inner wall of the metal shell 20 and has insulating properties. Thus, the copper-clad mounting bracket, upper metal ring 324, metalized film 326, and metal housing 20 form a third virtual capacitor 329. The metal layers on the lower copper-clad mounting bracket 3221, upper copper-clad mounting bracket 3211, upper metal ring 324, and metalized film 326 form one metal electrode of the third virtual capacitor 329. The insulating material of the metalized film 326 forms the insulating medium of the third virtual capacitor 329. The metal housing 20 forms the other metal electrode of the third virtual capacitor 329. The metal housing 20 is electrically connected to the ground terminal Case.

[0077] The essence of a capacitor is "metal electrode-insulating dielectric-metal electrode" (i.e., a layer of insulating dielectric sandwiched between two metal electrodes). This embodiment cleverly leverages the product's inherent structural characteristics and the principles of capacitor formation to transform the structure consisting of the copper-clad mounting bracket, upper metal ring 324, metalized film 326, and metal housing 20 into a virtual capacitor with capacitive properties. This is equivalent to connecting a voltage divider capacitor (i.e., third virtual capacitor 329) in series between the first shielding capacitor C14 and the ground terminal Case, between the second shielding capacitor C9 and the ground terminal Case, between the third shielding capacitor C8 and the ground terminal Case, and between the fourth shielding capacitor C15 and the ground terminal Case. This effectively reduces the voltage across the shielding capacitors and alleviates insulation stress on the shielding capacitors. This significantly improves the product's voltage resistance while maintaining excellent anti-interference performance.

[0078] Ten samples were randomly selected from the product prepared in Example 7 and tested under the following conditions and method: Pins 111, 212, and 313 were short-circuited and connected to one end of an AC 2000V test voltage. The sample housing was then connected to the other end of an AC 2000V test voltage for 60 seconds. All ten samples passed the withstand voltage and leakage current tests, with the leakage current fluctuating around 1.0 mA.

[0079] In this embodiment, the upper end of the metalized film 326 embedded in the inner side of the metal shell 20 is higher than the upper end of the metal shell 20; generally 0.3mm-0.8mm higher, to ensure the insulation between the metal shell 20 and other internal parts. The higher value is preferably 0.5mm. The metal shell 20 is wrapped around the side wall 102 by a crimping packaging method, so that the metal shell 20 is fixed to the connecting plug 10. The crimping packaging method of the metal shell 20 and the connecting plug 10 is the same as the traditional one. The clamping force generated by the crimping packaging of the metal shell 20 ensures that all internal places that need to maintain good electrical contact maintain good contact.

[0080] This embodiment truly achieves product miniaturization. Because the copper-clad mounting bracket, metallized film, and metal ring are all micron-level thick, the wall thickness of these components is much smaller than that of the metal shell, making it almost negligible, significantly reducing the product's size. Furthermore, due to the excellent voltage resistance of this embodiment, the shielding capacitor in the conditioning circuit can be made of very small, conventional capacitors (such as 0603 or 0402 chip capacitors), further reducing the product's size. Furthermore, this embodiment requires only a single sealing ring, further reducing the product's size from a structural perspective.

[0081] This embodiment has a simple process, the crimping package is only performed once, there are fewer steps, fewer assembly parts, and low production costs; it has a unique concept and strong practicality, promotes technological progress in the field of pressure sensors, and has broad market application prospects.

[0082] Example 8

[0083] This embodiment is similar to the embodiment 7 in general, except that: Figure 22 、 Figure 23 As shown, compared to Example 7, the placement of the metal ring in this embodiment differs. Instead of a metal ring on the sidewall 102, a lower metal ring 325 is circumferentially provided around the pressure core 31, electrically connected to the copper-clad lug. This lower metal ring 325 can be sprayed or applied with copper foil. The lower metal ring 325 is electrically connected to the copper-clad lug. Specifically, for example, the lower copper-clad lug 3221 is folded downward to connect to the lower metal ring 325; the upper copper-clad lug 3211 is directly in contact with the metal layer of the metallized film 326 for electrical connection. The upper copper-clad lug 3211 can also be folded downward to connect to the lower metal ring 325 (though in this case, it is best to stagger the position of the lower copper-clad lug 3221). As long as the metal layer of the metallized film 326, the metal ring, and the copper-clad lug maintain good electrical connection, the specific implementation method is not limited. In this way, the upper copper hanging ear 3211, the lower copper hanging ear 3221, the lower metal ring 325, the metalized film 326, and the metal shell 20 constitute the third virtual capacitor 329. The metal layer on the copper hanging ear, the lower metal ring 325, and the metalized film 326 constitutes one of the metal electrodes of the third virtual capacitor 329, the insulating material of the metalized film 326 constitutes the insulating medium of the third virtual capacitor 329, and the metal shell 20 constitutes the other metal electrode of the third virtual capacitor 329. The metal shell 20 is electrically connected to the ground terminal Case. The working principle of this embodiment is the same as that of Example 7, and it also has the beneficial effects described in Example 7. 10 samples were randomly selected from the products prepared by the solution of Example 8 for testing, and the test conditions and methods were the same as those of Example 7. After testing, the withstand voltage and leakage current tests of the 10 samples were all qualified, and the leakage current value also fluctuated around 1.0mA.

[0084] Example 9

[0085] This embodiment is relatively similar to the embodiments 7 and 8 in general, except that: Figure 24 、 Figure 25As shown, compared to Examples 7 and 8, this embodiment does not selectively cover one metal ring. Instead, an upper metal ring 324 is circumferentially covered on the side wall 102 of the connection plug 10, electrically connected to the copper-clad hanging lug, and a lower metal ring 325 is circumferentially covered on the pressure core 31, electrically connected to the copper-clad hanging lug. Both the upper metal ring 324 and the lower metal ring 325 are achieved by spraying or applying copper foil. Both the upper metal ring 324 and the lower metal ring 325 are electrically connected to the copper-clad hanging lug. Specifically, for example, the upper copper-clad hanging lug 3211 is electrically connected to the upper metal ring 324 by turning upward, and the lower copper-clad hanging lug 3221 is electrically connected to the lower metal ring 325 by turning downward. A metalized film 326 with a metal layer coated on one side is provided on the inside of the metal housing 20. The metal layer of the metalized film 326 contacts the metal ring, maintaining good electrical connection between the metal layer of the metalized film 326, the upper metal ring 324, the lower metal ring 325, the lower copper-clad hook 3221, and the upper copper-clad hook 3211. Accordingly, the non-metalized side of the metalized film 326 contacts the inner wall of the metal housing 20 and has insulating properties. Thus, the copper-clad hook, the metal ring, the metalized film 326, and the metal housing 20 form a third virtual capacitor 329. The metal layer on the upper copper-clad hook 3211, the lower copper-clad hook 3221, the upper metal ring 324, the lower metal ring 325, and the metalized film 326 constitute one metal electrode of the third virtual capacitor 329. The insulating material of the metalized film 326 constitutes the insulating medium of the third virtual capacitor 329, and the metal housing 20 constitutes the other metal electrode of the third virtual capacitor 329. The metal housing 20 is electrically connected to the ground terminal Case. The working principle of this embodiment is consistent with that of embodiment 7, and it also has the beneficial effects described in embodiment 7. After testing, all 10 samples passed the withstand voltage and leakage current tests, with the leakage current value fluctuating around 0.6mA.

[0086] In the present invention, the metal layer, metal ring, and copper-clad hanging ear of the metallized film 326 only need to maintain good electrical connection. The description in each embodiment that the copper-clad hanging ear maintains an electrical connection with the metal ring by turning up, turning down, or other methods is only for clarification and does not constitute a limitation on the scope of protection of the present invention.

[0087] In summary, the above are only preferred embodiments of the present invention and are not intended to limit the scope of implementation of the present invention. All equivalent changes and modifications in the shape, structure, characteristics and spirit of the claims of the present invention should be included in the scope of the claims of the present invention.

Claims

1. A high-pressure-resistant miniaturized pressure sensor, comprising a connection plug (10) fixedly connected to an electrical connector pin (11), the connection plug (10) and a metal shell (20) covering the outside forming a receiving and installing space, wherein a pressure core (31) and a flexible circuit board (32) provided with a conditioning circuit (323) are installed in the receiving and installing space; the flexible circuit board (32) comprises an upper flexible board (321) electrically connected to the electrical connector pin (11), and a lower flexible board (322) electrically connected to the pressure core (31), Its characteristics are: The upper flexible board (321) is electrically connected to a first shielding capacitor C14 on a VCC trace (3231) of a conditioning circuit (323), and the other end of the first shielding capacitor C14 is electrically connected to one of the upper copper hanging ears (3211) of the upper flexible board (321). The upper flexible board (321) is electrically connected to a second shielding capacitor C9 on a GND trace (3232) of the conditioning circuit (323), and the other end of the second shielding capacitor C9 is electrically connected to another upper copper hanging ear (3211) of the upper flexible board (321). The two upper copper hanging ears (3211) respectively extend out from two slots (101) provided on a side wall (102) of the connection plug (10); The side wall (102) of the connecting plug (10) is covered with an upper metal ring (324) electrically connected to the upper copper hanging ear (3211) along the circumferential direction, and / or the pressure core (31) is covered with a lower metal ring (325) electrically connected to the upper copper hanging ear (3211) along the circumferential direction; the upper metal ring (324) is electrically connected to the upper copper hanging ear (3211), and the lower metal ring (325) is electrically connected to the upper copper hanging ear (3211); A metalized film (326) having a metal layer coated on one side is provided on the inner side of the metal shell (20), and the metal layer of the metalized film (326) is electrically connected to the metal ring; A sealing ring (40) is installed between the bottom surface of the pressure core (31) and the metal shell (20) to prevent fluid leakage.

2. The high-pressure miniaturized pressure sensor according to claim 1, characterized in that: The upper copper hanging ear (3211), the metal ring, the metalized film (326), and the metal shell (20) constitute a first virtual capacitor (327); the metal layer on the upper copper hanging ear (3211), the metal ring, and the metalized film (326) constitutes one of the metal electrodes of the first virtual capacitor (327), the insulating material of the metalized film (326) constitutes the insulating medium of the first virtual capacitor (327), and the metal shell (20) constitutes the other metal electrode of the first virtual capacitor (327).

3. The high-pressure-resistant miniaturized pressure sensor according to claim 1, characterized in that: The upper copper hanging ear (3211) is designed to be double-sided copper-clad.

4. A high-pressure-resistant miniaturized pressure sensor according to any one of claims 1 to 3, characterized in that: The upper end of the metallized film (326) embedded in the inner side of the metal shell (20) is higher than the upper end of the metal shell (20); the metal shell (20) is wrapped with the upper end of the side wall (102) in a crimping packaging manner, so that the metal shell (20) is fixed to the connecting plug (10).

5. A high-pressure-resistant miniaturized pressure sensor, comprising a connection plug (10) fixedly connected to an electrical connector pin (11), the connection plug (10) and a metal shell (20) covering the outside forming a receiving and installing space, wherein a pressure core (31) and a flexible circuit board (32) provided with a conditioning circuit (323) are installed in the receiving and installing space; the flexible circuit board (32) comprises an upper flexible board (321) electrically connected to the electrical connector pin (11), and a lower flexible board (322) electrically connected to the pressure core (31), Its characteristics are: The lower flexible board (322) is electrically connected to a third shielding capacitor C8 on the VCC trace (3231) of the conditioning circuit (323), and the other end of the third shielding capacitor C8 is electrically connected to one of the lower copper-clad hanging ears (3221) of the lower flexible board (322). The lower flexible board (322) is electrically connected to a fourth shielding capacitor C15 on the GND trace (3232) of the conditioning circuit (323), and the other end of the fourth shielding capacitor C15 is electrically connected to another lower copper-clad hanging ear (3221) of the lower flexible board (322), and both of the lower copper-clad hanging ears (3221) extend beyond the edge of the pressure core (31); The side wall (102) of the connecting plug (10) is covered with an upper metal ring (324) electrically connected to the lower copper-clad hanging ear (3221) along the circumferential direction, and / or the pressure core (31) is covered with a lower metal ring (325) electrically connected to the lower copper-clad hanging ear (3221) along the circumferential direction; the upper metal ring (324) is electrically connected to the lower copper-clad hanging ear (3221), and the lower metal ring (325) is electrically connected to the lower copper-clad hanging ear (3221); A metalized film (326) having a metal layer coated on one side is provided on the inner side of the metal shell (20), and the metal layer of the metalized film (326) is electrically connected to the metal ring; A sealing ring (40) is installed between the bottom surface of the pressure core (31) and the metal shell (20) to prevent fluid leakage.

6. The high-pressure-resistant miniaturized pressure sensor according to claim 5, characterized in that: The lower copper hanging ear (3221), the metal ring, the metalized film (326), and the metal shell (20) constitute a second virtual capacitor (328); the lower copper hanging ear (3221), the metal ring, and the metal layer on the metalized film (326) constitute one of the metal electrodes of the second virtual capacitor (328), the insulating material of the metalized film (326) constitutes the insulating medium of the second virtual capacitor (328), and the metal shell (20) constitutes the other metal electrode of the second virtual capacitor (328); The lower copper-clad hanging ear (3221) is designed to be double-sided copper-clad.

7. A high-pressure-resistant miniaturized pressure sensor according to claim 5 or 6, characterized in that: The upper end of the metallized film (326) embedded in the inner side of the metal shell (20) is higher than the upper end of the metal shell (20); the metal shell (20) is wrapped with the upper end of the side wall (102) in a crimping packaging manner, so that the metal shell (20) is fixed to the connecting plug (10).

8. A high-pressure-resistant miniaturized pressure sensor, comprising a connecting plug (10) fixedly connected to an electrical connector pin (11), the connecting plug (10) and a metal shell (20) covering the outside forming an accommodating installation space, wherein a pressure core (31) and a flexible circuit board (32) provided with a conditioning circuit (323) are installed in the accommodating installation space; the flexible circuit board (32) comprises an upper flexible board (321) electrically connected to the electrical connector pin (11), and a lower flexible board (322) electrically connected to the pressure core (31), Its characteristics are: The upper flexible board (321) is electrically connected to a first shielding capacitor C14 on a VCC trace (3231) of a conditioning circuit (323), and the other end of the first shielding capacitor C14 is electrically connected to one of the upper copper hanging ears (3211) of the upper flexible board (321). The upper flexible board (321) is electrically connected to a second shielding capacitor C9 on a GND trace (3232) of the conditioning circuit (323), and the other end of the second shielding capacitor C9 is electrically connected to another upper copper hanging ear (3211) of the upper flexible board (321). The two upper copper hanging ears (3211) respectively extend out from two slots (101) provided on a side wall (102) of the connection plug (10); The lower flexible board (322) is electrically connected to a third shielding capacitor C8 on the VCC trace (3231) of the conditioning circuit (323), and the other end of the third shielding capacitor C8 is electrically connected to one of the lower copper-clad hanging ears (3221) of the lower flexible board (322). The lower flexible board (322) is electrically connected to a fourth shielding capacitor C15 on the GND trace (3232) of the conditioning circuit (323), and the other end of the fourth shielding capacitor C15 is electrically connected to another lower copper-clad hanging ear (3221) of the lower flexible board (322), and both lower copper-clad hanging ears (3221) extend beyond the edge of the pressure core (31); the upper copper-clad hanging ear (3211) is electrically connected to the lower copper-clad hanging ear (3221); The side wall (102) of the connecting plug (10) is covered with an upper metal ring (324) electrically connected to the copper-clad hanging ear along the circumferential direction, and / or the pressure core (31) is covered with a lower metal ring (325) electrically connected to the copper-clad hanging ear along the circumferential direction; the upper metal ring (324) is electrically connected to the copper-clad hanging ear, and the lower metal ring (325) is electrically connected to the copper-clad hanging ear; A metalized film (326) having a metal layer coated on one side is provided on the inner side of the metal shell (20), and the metal layer of the metalized film (326) is electrically connected to the metal ring; A sealing ring (40) is installed between the bottom surface of the pressure core (31) and the metal shell (20) to prevent fluid leakage.

9. The high-pressure-resistant miniaturized pressure sensor according to claim 8, characterized in that: The copper-clad hanging ear, the metal ring, the metalized film (326), and the metal shell (20) constitute a third virtual capacitor (329); the copper-clad hanging ear, the metal ring, and the metal layer on the metalized film (326) constitute one metal electrode of the third virtual capacitor (329), the insulating material of the metalized film (326) constitutes the insulating medium of the third virtual capacitor (329), and the metal shell (20) constitutes the other metal electrode of the third virtual capacitor (329); The lower copper-clad hanging ear (3221) is designed to be double-sided copper-clad.

10. A high-pressure-resistant miniaturized pressure sensor according to claim 8 or 9, characterized in that: The upper end of the metallized film (326) embedded in the inner side of the metal shell (20) is higher than the upper end of the metal shell (20); the metal shell (20) is wrapped with the upper end of the side wall (102) in a crimping packaging manner, so that the metal shell (20) is fixed to the connecting plug (10).

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