Connector device capable of preventing high-temperature oxidation

Abstract

The invention discloses a connector device capable of preventing high-temperature oxidation, which is used for testing module products and comprises an upper jig and a lower jig located on the lower side of the upper jig, the lower jig is provided with a product placing groove, a sealing ring is arranged on the outer side of the product placing groove, and the lower jig is further provided with a heater connecting plate; the upper jig is provided with contacts, a test needle and a switching circuit board, and the contacts are distributed on the lower side of the upper jig; during testing, the contact is in contact with the terminal of the module product, and the switching circuit board enables the terminal of the module product to be communicated with the testing needle through the contact. According to the connector device capable of preventing high-temperature oxidation, the terminal of the module product is led to the test needle located on the outer side of the connector device through the contact and the switching circuit board in a sealed state, so that the problem of oxidation of the module product in a high-temperature test environment is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic equipment testing, and in particular to a connector device resistant to high-temperature oxidation. Background Art

[0002] In the field of electronic equipment, socket devices (i.e., connectors) are key components for circuit connections. Their stability in high-temperature environments directly impacts device reliability. Currently, domestic and international technologies for preventing oxidation during high-temperature testing of socket devices used in high-temperature environments primarily utilize sealed covers for anti-oxidation treatment.

[0003] However, traditional technologies have a series of significant drawbacks. First, they are inefficient. The sealing cover requires manual installation and removal, which is cumbersome and cannot meet the needs of automated production. Second, the protection cost is high. The sealing material is easily worn and needs to be frequently replaced, increasing maintenance costs. Third, the sealing reliability is insufficient. Traditional sealing structures are prone to failure due to deviations in the processing technology. When oxidizing media such as oxygen and water vapor in the air invade, they will cause oxidation and rust on the copper surface of the module product, which in turn leads to poor contact, reduced conductivity, and even equipment failure. Finally, the level of intelligence is low, and there is a lack of real-time monitoring and temperature control functions, making it impossible to accurately control the test environment parameters.

[0004] Therefore, providing an efficient, reliable and intelligent high-temperature oxidation-resistant SOCKET device to solve the oxidation problem in high-temperature testing has become an urgent problem to be solved in the industry. Summary of the Invention

[0005] In view of the above-mentioned deficiencies of the SOCKET device (i.e., connector device) in current high-temperature testing, the present invention provides a connector device that is resistant to high-temperature oxidation. In a sealed state, the connector device leads the terminals of the module product to the test pins located outside the connector device through contacts and a transfer circuit board, thereby avoiding the oxidation problem of the module product in a high-temperature testing environment.

[0006] To achieve the above objectives, the embodiments of the present invention adopt the following technical solutions:

[0007] A connector device that is resistant to high-temperature oxidation and is used in testing module products, comprising an upper fixture and a lower fixture. The lower fixture has a product placement groove with a sealing ring provided on the outer side of the product placement groove, and the lower fixture also has a heater connection plate.

[0008] The upper fixture is provided with contacts, test pins and a transfer circuit board, and the contacts are distributed on the lower side of the upper fixture;

[0009] During testing, the module product is placed in the product placement slot, the contacts are in contact with the terminals of the module product, and the transfer circuit board connects the terminals of the module product to the test pins through the contacts.

[0010] According to one aspect of the present invention, the lower fixture is provided with an air inlet and an air outlet.

[0011] According to one aspect of the present invention, the air inlet valve of the air inlet is a one-way valve to prevent nitrogen from escaping.

[0012] According to one aspect of the present invention, the exhaust valve of the exhaust port is a one-way valve to prevent air from flowing back.

[0013] According to one aspect of the present invention, the contact protrudes from the lower plane of the upper fixture, and a receiving cavity is provided at the bottom of the upper fixture at a position corresponding to the product placement groove.

[0014] According to one aspect of the present invention, snap plates are provided on two opposite sides of the lower jig, and the snap plates are used to fasten and lock the upper jig and the lower jig.

[0015] According to one aspect of the present invention, the upper edge of the snap plate has a protrusion, and when locked, the protrusion is used to buckle the upper edge step position of the upper fixture to achieve a tight lock.

[0016] According to one aspect of the present invention, the test needle is located on the upper side of the upper fixture, and the heater connecting plate is arranged inside the lower fixture.

[0017] According to one aspect of the present invention, the upper fixture includes an upper shell and a lower shell, the upper shell and the lower shell are fixed by screws, and the transfer circuit board is fixedly arranged between the upper shell and the lower shell.

[0018] According to one aspect of the present invention, the sealing ring protrudes from the upper plane of the lower fixture.

[0019] Advantages of the implementation of the present invention: First, an enclosed space is formed by the upper jig, the lower jig and the sealing ring to isolate oxygen and water vapor, thereby avoiding the problem of oxidation of the module product at high temperature. Secondly, the design further provides an air inlet and an exhaust port, and during the test process, nitrogen is filled in through the air inlet and the residual air inside is discharged through the exhaust port, so that the module product is under nitrogen protection during the high-temperature test, further reducing the risk of oxidation of the module product during high-temperature testing. Thirdly, through the design of contacts and adapter circuit boards, the signal is transmitted losslessly to the outer test pin, replacing traditional manual wiring, and adapting to automated equipment for fast plug-in testing with high efficiency. Finally, a modular design is adopted, and the upper jig adopts a split shell, which is fixed by screws or locating pins and accurately installed. The lower jig integrates components such as heating and gas circuits, with a compact layout, simple structure and low cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0021] Figure 1 This is a schematic structural diagram of a high-temperature oxidation-resistant connector device according to the present invention;

[0022] Figure 2 This is a schematic diagram of the upper structure of the upper fixture of the present invention;

[0023] Figure 3 This is a schematic diagram of the lower side structure of the upper fixture of the present invention;

[0024] Figure 4 Schematic diagram of the lower fixture structure of the present invention.

[0025] Figure 5 This is a schematic diagram of a preferred embodiment of a high-temperature oxidation-resistant connector device of the present invention.

[0026] Figure 6 A schematic diagram showing another preferred embodiment of the invented connector device resistant to high temperature oxidation is shown.

[0027] Among them: 100, upper fixture, 101, contact, 102, adapter circuit board, 103, test pin, 104, upper shell, 105, lower shell, 106, accommodating cavity, 107, notch, 108, threaded hole, 200, lower fixture, 201, heater connecting plate, 202, sealing ring, 203, product placement groove, 204, air inlet, 205, exhaust port, 206, snap plate, 207, protrusion, 208, spring top column, 209, spring sheet. DETAILED DESCRIPTION

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0029] The first embodiment of the present invention:

[0030] like Figure 1 、 Figure 2 、 Figure 3 and Figure 4 As shown, a connector device resistant to high-temperature oxidation of the present invention is used in the testing of a module product 300, comprising an upper jig 100 and a lower jig 200, wherein the lower jig 200 is located at the lower side of the upper jig 100, the upper jig 100 is provided with contacts 101, a test pin 103 and a transfer circuit board 102, the lower jig 200 is provided with a product placement groove 203 and a sealing ring 202, the upper jig 100 is sealed on the product placement groove 203 of the lower jig 200, and the lower jig 200 is provided with an air inlet 204 and an exhaust port 205 connected to the product placement groove 203.

[0031] The contacts 101 are distributed on the lower side of the upper fixture 100 , and the sealing ring 202 surrounds the outer side of the module product placement groove 203 .

[0032] As can be understood, the sealing ring 202 protrudes from the upper surface of the lower jig 200. When the upper jig 100 is buckled onto the upper side of the lower jig 200, the sealing ring 202 is squeezed and deformed, clinging to the lower surface of the upper jig 100 to seal the product placement groove 203. Furthermore, the sealing ring 202 is made of high-temperature resistant material to ensure product reliability and longevity.

[0033] During testing, the module product 300 is placed in the product placement slot 203. The upper fixture 100 is firmly attached to the upper side of the lower fixture 200. Contacts 101 on the lower side of the upper fixture 100 make contact with the terminals of the module product 300. The transfer circuit board 102 transfers the terminals of the module product 300 to the test pins 103 via contacts 101. Nitrogen is then introduced into the product placement slot 203 through the air inlet 204. As nitrogen continues to be introduced, the remaining air in the slot is exhausted through the exhaust port 205 until the slot 203 is completely filled with nitrogen. This allows the module product 300 to remain protected by nitrogen during subsequent high-temperature testing, providing enhanced oxidation protection.

[0034] To facilitate contact between the contacts 101 and the terminals of the module product 300, in this embodiment, the contacts 101 protrude from the lower surface of the upper fixture 100. At the same time, the bottom portion of the upper fixture 100 corresponding to the product placement groove 203 is recessed to form a receiving cavity 106. This cavity 106 cooperates with the product placement groove 203 to facilitate the placement of the module product 300.

[0035] In the connector device with high-temperature oxidation resistance of the present invention, the lower fixture 200 further includes a heater connecting plate 201, which is equipped with electronic components for heating. During operation, the socket device heats the electronic components on the heater connecting plate 201 to bring the temperature within the product placement slot 203 to a preset range, thereby creating a high-temperature testing environment for the modular product 300. The heater connecting plate 201 is located within the lower fixture 200 and below the product placement slot 203, thereby achieving a better heating effect.

[0036] In this embodiment, the heater connecting plate 201 can heat the module product 300 to 175 degrees Celsius within fifteen minutes, and then perform dynamic and static tests on the module product 300 at this ambient temperature.

[0037] The heating electronic element can be a resistance wire, a heating tube, an electromagnetic induction coil or a magnetron, etc., and can be flexibly selected according to the requirements of the test environment temperature.

[0038] The adapter circuit board 102 includes a PCB board, and high-temperature resistant electronic components are provided on the PCB board. In this embodiment, the adapter circuit board 102 is the core signal transmission component of the high-temperature oxidation-resistant SOCKET device. The high-temperature resistant electronic components (such as resistors, capacitors, and connectors) are integrated through the PCB board to electrically connect the module product terminals and the test pins. During the test, the upper fixture contacts contact the module terminals, and the signal is transmitted losslessly to the external test pins through the internal circuit of the adapter board, thereby realizing the connection between the module circuit and the external test equipment. Its design ensures stable signal transmission under high temperature, avoids the influence of the oxidizing environment on electrical performance, and supports high-frequency signal switching in dynamic and static tests to improve test efficiency and reliability.

[0039] In this embodiment, the upper fixture 100 includes an upper housing 104 and a lower housing 105, with the adapter circuit board 102 fixedly disposed between the upper housing 104 and the lower housing 105. This can be fixed with set screws. Of course, to ensure precise positioning and secure connection of components, thereby guaranteeing product quality, screws and locating pins can also be used for positioning and installation. This design is not particularly limited.

[0040] During the positioning of circuit boards and housings, and the installation of electronic components, locating pins can ensure the correct installation and alignment of various components, effectively improving the reliability and performance of the equipment.

[0041] The upper shell 104 and the lower shell 105 are also provided with threaded holes 108. At the same time, for easier positioning, mutually cooperating positioning posts and positioning holes can be provided on the upper shell 104 and the lower shell 105. During assembly, the upper shell 104 and the lower shell 105 can be precisely fastened together using the positioning posts and the designated holes, and then screwed into the threaded holes 108. The number and position of the threaded holes 108 can be set as needed. In this embodiment, there are nine threaded holes 108, which are evenly distributed on the upper shell 104 and the lower shell 105.

[0042] The high-temperature oxidation-resistant connector device of the present invention also includes a locking mechanism. During testing of the modular product 300, this locking mechanism securely locks the upper fixture 100 and the lower fixture 200, thereby improving the sealing effect of the product placement slot 203. In this embodiment, the locking mechanism comprises snap plates 206 positioned on opposite sides of the lower fixture 200. The upper edges of the snap plates 206 have raised portions 207. When locked, the raised portions 207 engage the stepped portion of the upper edge of the upper fixture 100 to achieve a secure connection. In this embodiment, two raised portions 207 are symmetrically positioned on the inner sides of the snap plates 206.

[0043] To facilitate the fastening of the snap plate 206, the upper fixture 100 is provided with a notch 107 at the bottom edge position corresponding to the snap plate 206. In this way, when fastening, the notch 107 has a positioning and guiding function, making the fastening of the snap plate 206 easier.

[0044] When testing module product 300, the first step is to place module product 300 in the product placement slot 203 of the lower fixture 200. At this point, contacts 101 on the underside of the upper fixture 100 make contact with the terminals of module product 300, and the adapter circuit board 102 transfers the terminals of module product 300 to the test pins 103 via contacts 101. Second, the upper and lower fixtures 100 and 200 are fastened together using a locking mechanism. The sealing ring 202 seals module product 300 within the product placement slot 203. Third, the equipment is powered on, and the heater connection plate 201 heats the module product 300 within the product placement slot 203 until the temperature meets the test requirements for module product 300. Fourth, the probe card and test pins 103 in the dynamic and static equipment are connected, and dynamic and static testing is performed until the test is complete. Fifth, the probe card and test pins 103 in the dynamic and static equipment are disconnected, and heating is stopped until the temperature of module product 300 returns to normal. Step 6: Open the locking mechanism, separate the upper fixture 100 and the lower fixture 200 and take away the module product 300.

[0045] The air inlet 204 is provided with an air inlet valve that opens in one direction toward the product placement groove 203. The lower fixture 200 is provided with an air inlet 204 and an exhaust port 205, which are connected to the product placement groove 203. In this embodiment, the air inlet 204 and the exhaust port 205 are both provided on the side of the lower fixture 200 for easy operation.

[0046] Once the module product 300 is sealed, nitrogen is introduced into the product placement groove 203 through the air inlet 204. As nitrogen continues to be introduced, the remaining air in the product placement groove 203 is exhausted through the exhaust port 205 until the product placement groove 203 is completely filled with nitrogen. This allows the module product 300 to be protected by nitrogen during subsequent high-temperature testing, providing enhanced oxidation protection.

[0047] In order to further enhance the air tightness of the product placement tank 203, in this embodiment, the air inlet valve of the air inlet 204 is a one-way valve to prevent nitrogen from escaping, and the exhaust valve of the exhaust port 205 is also a one-way valve to prevent air backflow.

[0048] When testing module product 300, the first step is to place module product 300 in product placement slot 203 of lower fixture 200. Contacts 101 on the underside of upper fixture 100 come into contact with the terminals of module product 300, and adapter circuit board 102 transfers the terminals of module product 300 to test pins 103 via contacts 101. Second, the upper fixture 100 and lower fixture 200 are fastened and locked together using a locking mechanism. Sealing ring 202 seals module product 300 within product placement slot 203. Third, nitrogen is introduced into product placement slot 203 through air inlet 204. As nitrogen continues to be introduced, the remaining air in product placement slot 203 is expelled through exhaust port 205. Once a certain amount of nitrogen has been introduced, the remaining air in product placement slot 203 is completely expelled. Nitrogen injection is then stopped, and module product 300 is now in a nitrogen-protected state. In step 4, the equipment is powered on, and the heater connecting plate 201 heats the module product 300 in the product placement slot 203 until the temperature reaches the test temperature of the module product 300. In step 5, the probe plate and test needles 103 in the dynamic and static equipment are connected, and dynamic and static testing is performed until the test is completed. In step 6, the probe plate and test needles 103 in the dynamic and static equipment are disconnected, and the power is turned off to stop heating until the temperature of the module product 300 returns to normal. In step 7, the locking mechanism is released, the upper fixture 100 and the lower fixture 200 are disconnected, and the module product 300 is removed.

[0049] In order to ensure good contact between the contacts 101 on the lower side of the upper fixture 100 and the terminals of the module product 300 and prevent the two from making a poor test signal due to a false contact, as shown in FIG. Figure 5 and Figure 6As shown, an elastic element can be set at the bottom of the product placement groove 203 of the lower fixture 200. The elastic element presses the module product 300 in the product placement groove 203 upward, so that the terminals on the module product 300 are pressed and contacted with the contacts 101 on the lower side of the upper fixture 100. This improves electrical conductivity and prevents poor signal due to false contact between the terminals on the module product 300 and the contacts 101 on the lower side of the upper fixture 100. Figure 5 As shown, a countersink is provided at the bottom of the product placement slot 203, and a spring top column 208 is installed in the countersink. The upper end of the spring top column 208 presses the module product 300 upward. Figure 6 As shown, a countersunk groove is provided at the bottom of the product placement slot 203, and a spring piece 209 is installed in the countersunk hole. The upper end of the spring piece 209 is facing upward to press the module product 300. The lower end of the contact 101 can be configured as a rounded head, and the upper end of the contact 101 can be connected to a conductive spring piece, which connects the contact to the adapter circuit board 102. Because the upper end of the contact 101 is connected to the conductive spring piece, the contact 101 can move up and down a certain distance, and the contact 101 and the terminal on the module product 300 can maintain elastic and tight contact. In this way, the contact 101 will not scratch the terminal on the module product 300, but also reduce wear and tear, and ensure good contact.

[0050] Advantages of the implementation of the present invention: First, an enclosed space is formed by the upper fixture, the lower fixture and the sealing ring to isolate oxygen and water vapor, thereby avoiding the problem of module product oxidation at high temperature. Secondly, the design further provides an air inlet and an exhaust port, and during the test process, nitrogen is filled in through the air inlet and the residual air inside is discharged through the exhaust port, so that the module product is under nitrogen protection during the high-temperature test, further reducing the risk of oxidation of the module product during high-temperature testing. Thirdly, through the design of contacts and adapter circuit boards, the signal is transmitted losslessly to the outer test pin, replacing traditional manual wiring, and adapting to automated equipment for fast plug-in testing with high efficiency. Finally, a modular design is adopted, and the upper fixture adopts a split shell, which is fixed by screws or locating pins and accurately installed. The lower fixture integrates components such as heating and gas circuits, with a compact layout, simple structure and low cost. In short, the connector device that is resistant to high-temperature oxidation of the present invention can effectively solve the oxidation problem of module products under high-temperature environment testing, and has broad industrial application value.

[0051] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A connector device resistant to high temperature oxidation, used in testing a module product (300), comprising an upper fixture (100) and a lower fixture (200), wherein the upper fixture (100) is provided with contacts (101), a test needle (103) and a transfer circuit board (102), and the contacts (101) are distributed on the lower side of the upper fixture (100); characterized in that: The lower jig (200) has a product placement groove (203), a sealing ring (202) is provided around the product placement groove (203), the upper jig (100) is sealed on the product placement groove (203) of the lower jig (200), and the lower jig (200) is provided with an air inlet (204) and an air outlet (205) communicating with the product placement groove (203).

2. The high temperature oxidation resistant connector device according to claim 1, characterized in that: The lower fixture (200) further comprises a heater connecting plate (201).

3. The high temperature oxidation resistant connector device according to claim 1, characterized in that: The air inlet (204) is provided with an air inlet valve that opens in one direction toward the product placement groove (203).

4. The high temperature oxidation resistant connector device according to claim 1, characterized in that: The exhaust port (205) is provided with an exhaust valve that opens in one direction toward the outside of the product placement tank (203).

5. The high temperature oxidation resistant connector device according to claim 1, characterized in that: The contact point (101) protrudes from the lower plane of the upper fixture (100), and a receiving cavity (106) is provided at a position on the bottom of the upper fixture (100) corresponding to the product placement groove (203).

6. The high temperature oxidation resistant connector device according to claim 1, characterized in that: Snap plates (206) are provided on opposite sides of the lower jig (200), and the snap plates (206) are used to fasten and lock the upper jig (100) and the lower jig (200).

7. The high temperature oxidation resistant connector device according to claim 6, characterized in that: The upper edge of the snap plate (206) has a protrusion (207), and when locked, the protrusion (207) is used to buckle the upper edge step position of the upper fixture (100) to achieve a tight lock.

8. The high temperature oxidation resistant connector device according to claim 1, characterized in that: The test needle (103) is located on the upper side of the upper jig (100), and the heater connecting plate (201) is arranged inside the lower jig (201).

9. The high temperature oxidation resistant connector device according to claim 1, characterized in that: The upper fixture (100) comprises an upper shell (104) and a lower shell (105), wherein the upper shell (104) and the lower shell (105) are fixed by screws, and the transfer circuit board (102) is fixedly arranged between the upper shell (104) and the lower shell (105).

10. The high temperature oxidation resistant connector device according to any one of claims 1 to 9, characterized in that: The sealing ring (202) protrudes from the upper plane of the lower fixture (200).

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