Immersed cooling system and cooling device

Abstract

The invention discloses an immersed cooling system and a cooling device. The cooling device comprises a cooling module, a radiating fin group, an inlet part and an outlet part, the cooling module is internally provided with a first cooling channel. The heat dissipation fin set is located on the cooling module and comprises a plurality of fins, and second cooling channels are formed in the fins. The inlet part is arranged on the radiating fin group or the cooling module; and the outlet part is arranged on the cooling module or the radiating fin group. And the first cooling channel, the second cooling channel, the inlet part and the outlet part are communicated. By means of the structure, fluid is subjected to heat exchange through the interior of the cooling module and the interior of the heat dissipation fin set.

Description

Technical Field

[0001] A cooling system, in particular an immersion cooling system and device. Background Art

[0002] With the rapid development of server performance, servers generate a large amount of heat during operation. To prevent the accumulation of heat energy and poor server performance, the motherboard inside the server is generally immersed in cooling fluid. The cooling fluid absorbs the heat generated by the heating elements on the motherboard and circulates the cooling fluid to the outside of the server case for heat exchange. Summary of the Invention

[0003] According to one embodiment, a cooling device is provided, including a cooling module, a heat dissipation fin assembly, an inlet, and an outlet. The cooling module defines a first cooling channel. A heat dissipation fin assembly is located on the cooling module and includes a plurality of fins, each of which defines a second cooling channel. The inlet is disposed on the heat dissipation fin assembly or the cooling module. The outlet is disposed on the cooling module or the heat dissipation fin assembly. The first cooling channel, the second cooling channel, the inlet, and the outlet are interconnected.

[0004] According to one embodiment, the heat dissipation fin group includes a partition, which includes a substrate and two cavities. Each cavity is located on both sides of the substrate. One side of each cavity has multiple diversion holes. The partition is combined with the cooling module, and each fin is respectively arranged on the partition.

[0005] According to one embodiment, each fin includes two connecting portions and an opening connected to the second cooling channel. Each cavity is respectively connected to each connecting portion, and the opening of each fin is respectively located opposite to the diversion hole of each cavity.

[0006] According to one embodiment, each fin includes a butt joint portion disposed between each coupling portion of each fin, and the separator includes a plurality of alignment portions located on the substrate, and each butt joint portion is respectively coupled to each alignment portion.

[0007] According to one embodiment, the cooling module has a support plate and multiple side walls connected to the support plate. The cooling module includes a base plate and multiple heat sinks located on the base plate. The base plate covers the openings between the side walls. The heat sinks are located between the side walls. A lower collecting chamber is formed between the support plate and the multiple side walls.

[0008] According to one embodiment, the other side of the cavity has a connecting hole, and the cooling module has a docking hole located on the support plate, which corresponds to the connecting hole and connects the cavity with the lower collecting chamber.

[0009] According to one embodiment, the cavity of the partition and the side wall of the cooling module are respectively provided with an inlet and an outlet, and the inlet and the outlet are away from the communicating hole and the docking hole and are respectively located on the same side of the cooling device.

[0010] According to one embodiment, the cavity of the partition and the side wall of the cooling module are respectively provided with an inlet and an outlet, and the inlet and the outlet are respectively located on two sides of the cooling device.

[0011] According to one embodiment, the partition comprises a baffle, which is disposed in the cavity to divide the cavity into two upper collecting chambers.

[0012] According to one embodiment, the other side of the cavity has a connecting hole connected to the upper collecting chamber, and the cooling module has a docking hole located on the support plate, which corresponds to the connecting hole and connects to one of the upper collecting chambers.

[0013] According to one embodiment, the inlet is provided in the cavity and communicates with another upper collecting chamber therein, the inlet is adjacent to the communicating hole and the docking hole, and the outlet is away from the communicating hole and the docking hole.

[0014] According to one embodiment, an immersion cooling system is provided, including a housing, a first heat transfer fluid, an electronic component, a cooling device, and a second heat transfer fluid. The first heat transfer fluid is located within the housing. The electronic component is located within the housing. The cooling device is located within the housing and contacts the electronic component. The cooling device includes a cooling module, a heat sink fin assembly, an inlet, and an outlet. The cooling module defines a first cooling channel. The heat sink fin assembly is located on the cooling module and includes a plurality of fins, each of which defines a second cooling channel. The inlet is located in the heat sink fin assembly or the cooling module. The outlet is located in the cooling module or the heat sink fin assembly. The first cooling channel, the second cooling channel, the inlet, and the outlet are interconnected. The second heat transfer fluid is located in the first and second cooling channels.

[0015] According to one embodiment, an immersion cooling system is provided, including a first housing, a first heat transfer fluid, an electronic component, a cooling device, a second housing, a second heat transfer fluid, a plurality of pipes, and a heat exchange device. The first heat transfer fluid is located in the first housing. The electronic component is located in the first housing. The cooling device is located in the first housing and contacts the electronic component. The cooling device includes a cooling module, a heat sink fin assembly, an inlet, and an outlet. The cooling module defines a first cooling channel. The heat sink fin assembly is located on the cooling module and includes a plurality of fins, each of which defines a second cooling channel. The inlet is provided in the heat sink fin assembly or the cooling module. The outlet is provided in the cooling module or the heat sink fin assembly. The first cooling channel, the second cooling channel, the inlet, and the outlet are interconnected. The second heat transfer fluid is located in the second housing, the first cooling channel, and the second cooling channel. One end of each pipe is connected to the inlet and the outlet, respectively, and the other end of each pipe is connected to the second housing. The heat exchange device includes a conduit, a pump and a heat exchange module. The conduit is connected to the pump, the heat exchange module and the first box or the second box.

[0016] In summary, according to some embodiments, the cooling device disposes a heat dissipation fin group above the cooling module, so that the second heat transfer fluid flows through the first cooling channel in the cooling module and the second cooling channel in the heat dissipation fin group for heat exchange. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1A FIG. 1 is a schematic diagram of an immersion cooling system applied to a cabinet according to an embodiment of the present invention.

[0018] Figure 1B FIG. 1 is a schematic diagram of an immersion cooling system applied to a cabinet according to an embodiment of the present invention.

[0019] Figure 2 FIG1 is a schematic diagram of the appearance of an immersion cooling system applied to a water tank according to one embodiment.

[0020] Figure 3 FIG. 4 is a schematic diagram of the appearance of a cooling device according to an embodiment.

[0021] Figure 4 FIG. 1 is an exploded schematic diagram of a cooling device from a top perspective according to an embodiment.

[0022] Figure 5 FIG. 1 is an exploded schematic diagram of a cooling device from a bottom perspective according to an embodiment.

[0023] Figure 6A This is a side cross-sectional schematic diagram of a cooling device according to one embodiment, wherein the heat sink fin group is provided with an inlet portion, the cooling module is provided with an outlet portion, and arrows are used to indicate the direction of fluid flow.

[0024] Figure 6B This is a side cross-sectional schematic diagram of a cooling device according to one embodiment, wherein the cooling module is provided with an inlet portion, the heat dissipation fin group is provided with an outlet portion, and arrows are used to indicate the direction of fluid flow.

[0025] Figure 7 1 is an exploded schematic diagram of a cooling device from a top perspective according to one embodiment, wherein an inlet and an outlet are located on two sides of the cooling device, respectively.

[0026] Figure 8 1 is an exploded schematic diagram of a cooling device from a bottom perspective according to one embodiment, wherein an inlet and an outlet are located on two sides of the cooling device, respectively.

[0027] Figure 9A It is shown as Figure 8 In an embodiment, a side cross-sectional schematic diagram of a cooling device is provided, wherein the heat dissipation fin group is provided with an inlet portion, the cooling module is provided with an outlet portion, and arrows are used to indicate the direction of fluid flow.

[0028] Figure 9B It is shown as Figure 8An embodiment of the present invention is a top cross-sectional schematic diagram of a cooling device, wherein the heat dissipation fin group is provided with an inlet portion, the cooling module is provided with an outlet portion, and arrows are used to indicate the direction of fluid flow.

[0029] Figure 10 1 is a schematic exploded view of a cooling device from a top perspective according to one embodiment, wherein the inlet and the outlet are located on both sides of the cooling module, respectively.

[0030] Figure 11 It is shown as Figure 10 In an embodiment, a side cross-sectional schematic diagram of a cooling device is provided, wherein the inlet and the outlet are respectively located on both sides of the cooling module, and arrows are used to indicate the direction of fluid flow.

[0031] Figure 12 This is an exploded schematic diagram of a cooling device from a top perspective according to one embodiment, wherein the inlet and the outlet are located on either side of a heat dissipation fin assembly.

[0032] Figure 13 It is shown as Figure 12 1 , a side cross-sectional schematic diagram of a cooling device, wherein the inlet and the outlet are respectively located on both sides of the heat dissipation fin group, and the arrows indicate the fluid flow direction.

[0033] Figure 14 FIG. 1 is a schematic diagram of the appearance of a cooling device according to an embodiment.

[0034] Figure 15 FIG. 1 is an exploded schematic diagram of a cooling device according to one embodiment.

[0035] Figure 16 This is a schematic side cross-sectional view of a cooling device according to one embodiment, wherein the side end of each fin is provided with an outlet portion, the cooling module is provided with an inlet portion, and the direction of fluid flow is indicated by arrows.

[0036] Figure 17 This is a schematic side cross-sectional view of a cooling device according to one embodiment, wherein the heat dissipation device is located above the heat dissipation fin group, and arrows are used to indicate the direction of fluid flow.

[0037] Figure 18 This is a schematic side cross-sectional view of a cooling device according to one embodiment, wherein the heat dissipation device is located at the side end of the heat dissipation fin group, and the arrows indicate the fluid flow direction.

[0038] Explanation of symbols:

[0039] 100: Cooling device

[0040] 201: First box

[0041] 202: Second box

[0042] 203: Electronic components

[0043] 204: Takeover

[0044] 300: Heat exchange device

[0045] 301: Catheter

[0046] 302: Pump

[0047] 304: Heat exchange module

[0048] 305: Condensation module

[0049] 800',800": Immersion Cooling System

[0050] 901: Cabinet

[0051] 902: Water Tank

[0052] 10a: Entrance

[0053] 10b: Export Department

[0054] 11: Cooling module

[0055] 110: First cooling channel

[0056] 111: Support plate

[0057] 1112: Docking hole

[0058] 112: Side wall

[0059] 1120: Lower collecting chamber

[0060] 1121: Open

[0061] 113: Bottom plate

[0062] 114:Heat sink

[0063] 12: Heat sink fin group

[0064] 120: Second cooling channel

[0065] 121:Separator

[0066] 1211:Substrate

[0067] 12112: Positioning unit

[0068] 1212: Cavity

[0069] 12120,12120',12120": Upper collecting chamber

[0070] 12121: diversion hole

[0071] 12122: Connecting hole

[0072] 1214: Baffle

[0073] 122: Fins

[0074] 1221: Joint

[0075] 12211: Opening

[0076] 1222: Docking

[0077] 13: Heat dissipation device

[0078] 91: First heat transfer fluid

[0079] 92: Second heat transfer fluid

[0080] X: first axis

[0081] Y: Second axis

[0082] Z: third axis DETAILED DESCRIPTION

[0083] The terms "connection" used in the following embodiments may refer to physical connections, or to direct or indirect connections between physical components. For a clearer illustration of this embodiment, in the schematic diagrams provided herein, the first axis X is the X-axis of the three-dimensional coordinate system, the second axis Y is the Y-axis of the three-dimensional coordinate system, and the third axis Z is the Z-axis of the three-dimensional coordinate system.

[0084] See also Figure 1A , is a schematic diagram of the architecture of an immersion cooling system 800' applied to a cabinet 901. The dashed area represents the first heat transfer fluid 91, and the dotted area represents the second heat transfer fluid 92. The heat exchange device 300 is connected to the first housing 201. In some embodiments, the immersion cooling system 800' is applied to the cabinet 901. The immersion cooling system 800' includes a housing installed within the cabinet 901 (hereinafter, the first housing 201 is used as an example), the first heat transfer fluid 91 within the first housing 201, electronic components 203, and a cooling device 100. The first housing 201 contains a rectangular enclosed tank. The first housing 201 is a 1U or 2U server chassis. The height of a standard server is measured in Us (1U is approximately 1.75 inches or 44.45 mm). The electronic component 203 is a central processing unit (CPU). The cooling device 100 is filled with a second heat transfer fluid 92 . The cooling device 100 is coupled above the electronic component 203 to absorb heat energy emitted by the electronic component 203 .

[0085] In this embodiment, the immersion cooling system 800' further includes a second housing 202 and a plurality of pipes 204 installed within the cabinet 901. The second housing 202 comprises a rectangular, enclosed tank containing a second heat transfer fluid 92. One end of each pipe 204 is connected to the cooling device 100, and the other end of each pipe 204 is connected to the second housing 202. The second heat transfer fluid 92 within the second housing 202 is transferred through the plurality of pipes 204 to the cooling device 100 within the first housing 201 for heat exchange. In other embodiments, the immersion cooling system 800' may omit the second housing 202 within the cabinet 901, or may require only a single housing within the cabinet 901, with the cooling device 100 housed within the housing. The housing may be either the first housing 201 or the second housing 202.

[0086] In some embodiments, the first heat transfer fluid 91 and the second heat transfer fluid 92 are non-conductors. The first heat transfer fluid 91 and the second heat transfer fluid 92 can be the same or different fluids. The second heat transfer fluid 92 can be a conductive fluid or a non-conductive fluid. When the first heat transfer fluid 91 is a non-conductive fluid, the second heat transfer fluid 92 can be a conductive fluid. Furthermore, the second heat transfer fluid 92 does not directly contact the electronic component 203, but is connected only to the circuit of the cooling device 100 and the heat exchange device 300.

[0087] See also Figure 1B , is a schematic diagram of the structure of an immersion cooling system 800" applied to a cabinet 901, wherein a heat exchange device 300 is connected to a second housing 202. In some embodiments, the immersion cooling system 800" includes a second housing 202, a plurality of pipes 204, and a heat exchange device 300. The second housing 202 contains a rectangular closed tank, and the second housing 202 is installed in the cabinet 901. One end of each pipe 204 is connected to the cooling device 100, and the other end of each pipe 204 is connected to the second housing 202. The second housing 202 contains a second heat transfer fluid 92, which flows into the cooling device 100 through each pipe 204. The heat exchange device 300 includes a conduit 301, a pump 302, and a heat exchange module 304. The conduit 301 is connected to the pump 302, the heat exchange module 304, and the second housing 202, but the present invention is not limited thereto. In some embodiments, the conduit 301 may also be connected to the first housing 201, such as Figure 1A As shown, the heat exchange device 300 is connected to the first box body 201 .

[0088] Figure 1B The system architecture of the embodiment is similar to the above Figure 1A The difference in the system architecture of the embodiments is that Figure 1A The heat exchange device 300 is connected to the first box 201, Figure 1BThe heat exchange device 300 is connected to the second box 202. Figure 1B In the embodiment, the immersion cooling system 800" further includes a first box 201 installed in a cabinet 901 and a cooling device 100 located in the first box 201. One end of each pipe 204 is connected to the cooling device 100, and the other end of each pipe 204 is connected to the second box 202. The second heat transfer fluid 92 in the second box 202 is transferred to the cooling device 100 through the multiple pipes 204 for heat exchange.

[0089] As described above, the cooling device 100 is connected to the second box 202 via the pipes 204, and the second box 202 is connected to the heat exchange device 300. When in use, a single second box 202 can be connected to multiple first boxes 201 ( Figure 1B The first housing 201 is shown as an example, and the cooling device 100 is used to remove the heat from the first housing 201 and concentrate it in the second housing 202, where it is then exchanged with the heat exchange device 300. In this configuration, the first housing 201 can be used without the heat exchange device 300.

[0090] See also Figure 2 FIG. 8 is a schematic diagram of an immersion cooling system 800' / 800" applied to a water tank 902. The dashed area represents the first heat transfer fluid 91, and the dotted area represents the second heat transfer fluid 92. In some embodiments, the immersion cooling system 800' / 800" is applied to a water tank 902 container. The first heat transfer fluid 91 is injected into the water tank 902, and a first housing 201 is disposed within the water tank 902, immersed in the first heat transfer fluid 91. The immersion cooling system 800' / 800" includes a condensing module 305 within the water tank 902. The condensing module 305 is a vapor region located above the liquid level of the first heat transfer fluid 91. The first housing 201 houses an electronic component 203 (not shown) and a cooling device 100. The cooling device 100 is filled with the second heat transfer fluid 92 and is coupled above the electronic component 203 to absorb heat energy emitted by the electronic component 203.

[0091] When the heat exchange device 300 is in operation, its pump 302 circulates heat exchange fluid between the heat exchange module 304 and the condensing module 305 via the conduit 301. The condensing module 305 and its cooling fluid have a lower temperature than the mixed gas-phase fluid, for example, lower than the dew point or boiling point of the working fluid. Therefore, when the gas-phase working fluid in the mixed gas-phase fluid contacts the condensing module 305, it exchanges heat with the condensing module 305. The gas-phase working fluid is cooled and condensed into a liquid-phase working fluid, which then returns to the first heat transfer fluid 91.

[0092] See also Figure 1B In some embodiments, when Figure 1B When the first heat transfer fluid 91 in the first box 201 above the cabinet 901 stops flowing, the second heat transfer fluid 92 in the second box 202 below the cabinet 901 is transferred to the cooling device 100 through the pipes 204 for heat exchange, thereby cooling the cooling device 100 and the heat source of the electronic components 203 below. This ensures that the first heat transfer fluid 91 in the first box 201 will not be affected by the heat source of the electronic components 203 and continue to heat up, thereby maintaining the temperature of other electronic components in the first box 201 that are immersed in the first heat transfer fluid 91. In some embodiments, when Figure 1B When the second heat transfer fluid 92 in the second box 202 below the cabinet 901 is not flowing, heat exchange can be performed outside the cooling device 100 through the first heat transfer fluid 91 in the first box 201 above the cabinet 901, thereby cooling the cooling device 100 and the heat source of the electronic components 203 below.

[0093] See also Figures 3 to 6A , Figure 3 is a schematic diagram of the appearance of the cooling device 100, Figure 4 is an exploded schematic diagram of the cooling device 100 from a top perspective, Figure 5 is an exploded schematic diagram of the cooling device 100 from a bottom perspective, Figure 6A This is a side cross-sectional schematic diagram of a cooling device 100. The heat dissipation fin assembly 12 is provided with an inlet portion 10a, and the cooling module 11 is provided with an outlet portion 10b. Arrows are used to indicate the direction of fluid flow. The cooling device 100 is generally rectangular in structure. The cooling device 100 includes a cooling module 11 (covering plate), a heat dissipation fin assembly 12 located on the cooling module 11, an inlet portion 10a, and an outlet portion 10b. The cooling module 11 has a first cooling channel 110 (e.g., a water channel) therein. The heat dissipation fin assembly 12 includes a plurality of fins 122, each of which has a second cooling channel 120 (e.g., a water channel) therein. Each fin 122 has a cooling channel therein, and the second cooling channel 120 is formed by the cooling channels within each fin 122. The inlet portion 10a is a water inlet pipe, and the outlet portion 10b is a water outlet pipe. The first cooling channel 110, the second cooling channel 120, the inlet portion 10a, and the outlet portion 10b are interconnected.

[0094] The inlet portion 10a and the outlet portion 10b can be disposed at any position of the cooling device 100 as required. For example, see Figure 6A The inlet portion 10a is the heat dissipation fin group 12 provided on the upper layer, and the outlet portion 10b is the cooling module 11 provided on the lower layer, but the present invention is not limited thereto. Figure 6BIn some embodiments, the inlet portion 10a is a cooling module 11 disposed at a lower layer, and the outlet portion 10b is a heat dissipation fin group 12 disposed at an upper layer.

[0095] See also Figures 3 to 6A In some embodiments, the heat dissipation fin group 12 includes a separator 121, the separator 121 is combined with the cooling module 11, and each fin 122 is as follows. Figure 4 As shown, the fins 122 are arranged at intervals along the first axis X direction, and each fin 122 is respectively disposed above the partition 121 , and the cooling module 11 and the heat dissipation fin group 12 are fixed by welding.

[0096] See Figures 3 to 6A In some embodiments, the separator 121 includes a substrate 1211 and two cavities 1212, each cavity 1212 is a rectangular frame and is as shown in FIG. Figure 4 As shown, the substrate 1211 extends along the first axis X direction, and each cavity 1212 is arranged along the third axis Z direction and is disposed on both sides of the substrate 1211. The substrate 1211 and the two cavities 1212 are roughly U-shaped when viewed from the first axis X direction. Each cavity 1212 is a rectangular frame extending along the first axis X direction. The interior of each cavity 1212 is hollow, and an upper collecting chamber 12120 (such as Figure 6A As shown). One side of each cavity 1212 (as shown Figure 4 The upper surface of the cavity 1212 shown in the figure has a plurality of diversion holes 12121 connected to each cavity 1212, and the diversion holes 12121 are arranged at intervals along the first axis X direction.

[0097] See Figures 3 to 6A In some embodiments, each fin 122 is hollow and has a second cooling channel 120. The appearance of each fin 122 is approximately T-shaped when viewed from the first axis X direction. Figure 6A When viewed along the first axis X, the fins 122 are roughly T-shaped. Each fin 122 includes two joints 1221 and an opening 12211. Each joint 1221 is a notch located at the corner of the bottom end of the fin 122. Furthermore, the total width of the notches along the first axis X is less than or equal to the total width of the cavity 1212 along the first axis X. Furthermore, each opening 12211 is located within the notches at each end of the fin 122 and is disposed on the inner wall along the third axis Z. The opening 12211 communicates with the second cooling channel 120, and the opening 12211 of each fin 122 corresponds to the diversion hole 12121 located in each cavity 1212.

[0098] See Figures 3 to 6AIn some embodiments, each fin 122 includes a docking portion 1222, which is an elongated protrusion extending along the third axis Z direction. Each docking portion 1222 is disposed between two coupling portions 1221 of each fin 122. The separator 121 includes a plurality of alignment portions 12112 located on the base plate 1211. Each alignment portion 12112 is an elongated slot extending along the third axis Z direction. Each docking portion 1222 is coupled to a respective alignment portion 12112 so that each elongated protrusion is correspondingly and constrainedly located within each elongated slot, but the present invention is not limited thereto. In some embodiments, the alignment portion 12112 is an elongated protrusion, and the docking portion 1222 is an elongated slot. When each fin 122 is assembled on the separator 121, each cavity 1212 is respectively limited to the joint portion 1221 on both sides of each fin 122, and each docking portion 1222 is respectively located at each alignment portion 12112, and each fin 122 is fixed to the separator 121 by welding.

[0099] See Figures 3 to 6A In some embodiments, the cooling module 11 comprises a support plate 111 (e.g., a flat plate) and a plurality of side walls 112 connected to the support plate 111. The support plate 111 and the side walls 112 are cross-sectionally formed to form a U-shaped appearance when viewed from the first axis X. The two opposite side walls 112 of the cooling module 11 are as follows: Figure 5 As shown, the two adjacent side walls 112 of the cooling module 11 extend along the first axis X direction and are parallel to each other. Figure 5 The cooling module 11 includes a bottom plate 113 and a plurality of heat sinks 114 located on the bottom plate 113. Each heat sink 114 is as shown. Figure 4 The rectangular sheet extends along the third axis Z direction, and the heat sinks 114 are arranged at intervals along the first axis X direction. When the bottom plate 113 covers the opening 1121 (such as Figure 6A As shown), each heat sink 114 is located between each side wall 112, and a lower collecting chamber 1120 is formed between the support plate 111 and each side wall 112, as shown Figure 6A As shown, lower collecting chambers 1120 are formed on the left and right sides of the cooling module 11 .

[0100] See Figures 3 to 6A In some embodiments, the other side of the cavity 1212 (eg Figure 5 The lower surface of the cavity 1212 (as shown) has a connecting hole 12122, which is an elongated hole extending along the first axis X. The cooling module 11 has a docking hole 1112 located on the carrier plate 111. The docking hole 1112 is an elongated hole extending along the first axis X. The docking hole 1112 corresponds to the connecting hole 12122 and connects the cavity 1212 with the lower manifold 1120.

[0101] In some embodiments, the length of the communicating hole 12122 is equal to the length of the docking hole 1112 , and the width of the communicating hole 12122 is smaller than the width of the docking hole 1112 , but the present invention is not limited thereto.

[0102] In some embodiments, the cavity 1212 of the partition 121 and the side wall 112 of the cooling module 11 are respectively provided with an inlet 10a and an outlet 10b, and the inlet 10a and the outlet 10b are away from the connecting hole 12122 and the docking hole 1112 and are respectively located on the same side of the cooling device 100. Figure 4 The inlet 10a is arranged near the left side of the left cavity 1212, and the outlet 10b is arranged at the center of the left side wall 112, so that the inlet 10a and the outlet 10b are projected at two points on the axis of the first axis X and are offset from each other.

[0103] In some embodiments, the cavity 1212 of the partition 121 is provided with an inlet 10a, and the side wall 112 of the cooling module 11 is provided with an outlet 10b, but the invention is not limited thereto. In some embodiments, the cavity 1212 of the partition 121 can be provided with an outlet 10b, and the side wall 112 of the cooling module 11 can be provided with an inlet 10a.

[0104] When the cooling device 100 performs heat exchange, Figure 6A It can be seen that the second heat transfer fluid 92 enters the second cooling channel 120 from the inlet 10a of the cooling device 100, and then enters the second cooling channel 120 of each fin 122 through a cavity 1212 on the upper layer. Figure 6A When the second heat transfer fluid 92 is in the cavity 1212 on the left side, it will turn and change direction in the cavity 1212 before flowing to the second cooling channel 120 of the upper heat dissipation fin group 12. The flow rate of the second heat transfer fluid 92 will slow down at the turning point of the cavity 1212. Then, the second heat transfer fluid 92 will flow from the second cooling channel 120 to the Figure 6A The second heat transfer fluid 92 flows into the cavity 1212 on the right side and then flows downward to the first cooling channel 110 in the lower cooling module 11. The second heat transfer fluid 92 turns and changes direction in the lower manifold 1120 of the cooling module 11, so that the flow rate of the second heat transfer fluid 92 at the turning point of the lower manifold 1120 will be slowed down. Figure 6A When the second heat transfer fluid 92 flows from the right lower plenum 1120 to the left lower plenum 1120, the narrow gaps between the heat sinks 114 allow the second heat transfer fluid 92 to pass through. Then, the second heat transfer fluid 92 flows out from the outlet 10b.

[0105] Based on the above, Figure 6AAs shown, the second heat transfer fluid 92 flows along the U-shaped second cooling channel 120 and the first cooling channel 110 that rotates 90 degrees counterclockwise (as viewed from the first axis X direction) to transfer heat energy (such as Figure 1A Thus, the second heat transfer fluid 92 flows through the first cooling channel 110 of the lower cooling module 11 and the second cooling channel 120 of the upper heat dissipation fin assembly 12 to enhance the heat dissipation effect.

[0106] In some embodiments, when the temperature of the second heat transfer fluid 92 (e.g., water) in the cooling device 100 is higher than that of the first heat transfer fluid 91 (e.g., immersion coolant), the cooling device 100 exchanges heat with the external first heat transfer fluid 91 through the upper heat dissipation fin assembly 12, causing the heat dissipation fin assembly 12 to be cooled and the temperature of the second heat transfer fluid 92 to be lowered. The second heat transfer fluid 92 then flows into the lower cooling module 11 for heat exchange, and removes heat from the electronic components 203 (not shown) below the cooling module 11. For example, when the ambient temperature of the first heat transfer fluid 91 is between approximately 25°C and 35°C (e.g., 27°C, 30°C, or 32°C), the inlet temperature of the second heat transfer fluid 92 entering through the inlet 10a is between approximately 50°C and 60°C (e.g., 52°C, 55°C, or 57°C). After the second heat transfer fluid 92 exchanges heat in the first cooling channel 110 and the second cooling channel 120 and removes heat energy from the electronic component 203, the temperature of the electronic component 203 can be controlled to between approximately 55°C and 65°C (e.g., 57°C, 60.5°C, or 62°C). Thus, the cooling device 100 is divided into two layers for heat exchange, and the excellent liquid properties of the two heat transfer fluids are utilized to achieve enhanced heat dissipation.

[0107] See Figure 6B , Figure 6BThis is a side cross-sectional diagram of the cooling device 100. The cooling module 11 has an inlet 10a, and the heat sink fin assembly 12 has an outlet 10b. Arrows indicate fluid flow. In some embodiments, when the temperature of the second heat transfer fluid 92 (e.g., water) within the cooling device 100 is lower than that of the first heat transfer fluid 91 (e.g., immersion coolant), the inlet 10a can be located in the lower cooling module 11, and the outlet 10b in the upper heat sink fin assembly 12. When the lower-temperature second heat transfer fluid 92 enters the lower cooling module 11 through the inlet 10a, the second heat transfer fluid 92 flows through the cooling module 11, exchanging heat with the high-temperature electronic components 203. The second heat transfer fluid 92 then flows to the upper heat sink fin assembly 12, removing heat from the electronic components 203 (not shown) below the cooling module 11. For example, when the ambient temperature of the first heat transfer fluid 91 is between approximately 35°C and 45°C (e.g., 37°C, 40°C, or 42°C), the inlet temperature of the second heat transfer fluid 92 entering from the inlet 10a is between approximately 25°C and 35°C (e.g., 27°C, 30°C, or 32°C). After the second heat transfer fluid 92 exchanges heat in the first cooling channel 110 and the second cooling channel 120 and removes heat energy from the electronic component 203, the temperature of the electronic component 203 can be controlled to be between approximately 35°C and 45°C (e.g., 37°C, 40.7°C, or 42°C).

[0108] See Figures 7 to 9B , Figure 7 This is an exploded schematic diagram of the cooling device 100 from a top perspective. The inlet 10a and the outlet 10b are located on both sides of the cooling device 100. Figure 8 This is an exploded schematic diagram of the cooling device 100 from the bottom perspective. The inlet 10a and the outlet 10b are located on both sides of the cooling device 100. Figure 9A The figure is a side cross-sectional view of the cooling device 100. The heat dissipation fin group 12 is provided with an inlet portion 10a, and the cooling module 11 is provided with an outlet portion 10b. The arrows indicate the direction of fluid flow. Figure 9B Draw as Figure 8 In an embodiment of the present invention, a schematic top view of a cross-sectional view of a cooling device 100 is shown, wherein the heat dissipation fin group 12 is provided with an inlet portion 10a, and the cooling module 11 is provided with an outlet portion 10b, with arrows indicating the direction of fluid flow. In some embodiments, the cavity 1212 of the partition 121 and the side wall 112 of the cooling module 11 are provided with an inlet portion 10a and an outlet portion 10b, respectively, so that the inlet portion 10a and the outlet portion 10b are located on the left and right sides of the cooling device 100, respectively. The partition 121 includes a baffle 1214, which is provided at a position such as Figure 7 In the left side cavity 1212, the baffle 1214 extends along the third axis Z direction and divides the cavity 1212 into two upper collecting chambers 12120' / 12120", the upper collecting chamber 12120' is located as shown in FIG. Figure 7On the left side of the cavity 1212, the upper collecting chamber 12120" is located as shown. Figure 7 As shown, on the right side of the cavity 1212 , the two upper collecting chambers 12120 ′ / 12120 ″ are respectively connected to the second cooling channel 120 of each fin 122 through a plurality of diversion holes 12121 .

[0109] In some embodiments, the other side of the cavity 1212 (eg Figure 9A The lower surface of the left cavity 1212 shown in the figure has a connecting hole 12122. The cooling module 11 has a docking hole 1112 located on the support plate 111. The length of the connecting hole 12122 is smaller than the length of the docking hole 1112, and the width of the connecting hole 12122 is smaller than the width of the docking hole 1112. The docking hole 1112 corresponds to the connecting hole 12122 and is connected to an upper collecting chamber 12120', so that the upper collecting chamber 12120' can be connected to the cooling module 11 through the docking hole 1112. Because the cavity 1212 at the position of the upper collecting chamber 12120" is not provided with a connecting hole 12122, it is not connected to the cooling module 11.

[0110] In some embodiments, the inlet 10a is disposed in the cavity 1212 and communicates with the upper collecting chamber 12120". The inlet 10a is adjacent to the connecting hole 12122 and the docking hole 1112, and the outlet 10b is away from the connecting hole 12122 and the docking hole 1112, but the present invention is not limited thereto. When the second heat transfer fluid 92 is supplied by Figure 7 After the inlet 10a on the left side of the cavity 1212 enters the upper collecting chamber 12120", the second heat transfer fluid 92 will pass through the following Figure 9B The second heat transfer fluid 92 flows into the second cooling channel 120 of each fin 122 below the heat dissipation fin group 12. Then, the second heat transfer fluid 92 flows into the second cooling channel 120 of each fin 122 below the heat dissipation fin group 12. Figure 9A In the cavity 1212 on the right side, Figure 9B The second heat transfer fluid 92 flows in the cavity 1212 on the right side toward the upward arrow. Then, it flows to the left through the second cooling channels 120 of the upper fins 122 of the heat dissipation fin assembly 12. At this point, the second heat transfer fluid 92 returns to the inlet 10a side and flows through the upper collecting chamber 12120', the connecting hole 12122, and the docking hole 1112 in sequence to the cooling module 11 on the lower layer. It then passes through the narrow gaps between the heat dissipation fins 114 in the cooling module 11 and flows into the cooling module 11 shown in FIG. Figure 9A and Figure 9B The outlet portion 10b on the right side allows the second heat transfer fluid 92 to flow through the first cooling channel 110 and the second cooling channel 120 of the extended water path to enhance heat dissipation.

[0111] The above-mentioned inlet portion 10a is arranged in the cavity 1212 and connected to the upper collecting chamber 12120", but the present invention is not limited thereto. In some embodiments, the positions of the inlet portion 10a and the outlet portion 10b can be swapped, and the outlet portion 10b can be arranged in the cavity 1212 and connected to the upper collecting chamber 12120", and the outlet portion 10b is adjacent to the connecting hole 12122 and the docking hole 1112, while the inlet portion 10a can be located on the side wall 112 of the cooling module 11 and away from the connecting hole 12122 and the docking hole 1112.

[0112] See Figure 10 and Figure 11 , Figure 10 This is a schematic diagram of an exploded view of the cooling device 100 from a top perspective. The inlet 10a and the outlet 10b are located on both sides of the cooling module 11. Figure 11 To illustrate Figure 10 In the embodiment of the present invention, a side cross-sectional diagram of the cooling device 100 is shown, wherein the inlet 10a and the outlet 10b are located on both sides of the cooling module 11, and the arrows indicate the direction of fluid flow. In some embodiments, the other side of each cavity 1212 (such as Figure 11 The lower surfaces of the left and right cavities 1212 shown in FIG. 1 are provided with two connecting holes 12122 connected to the inside of each cavity 1212, and the cooling module 11 has two docking holes 1112 located on the carrier plate 111, and each docking hole 1112 corresponds to each connecting hole 12122 and connects the inside of each cavity 1212 with the inside of the cooling module 11. Figure 11 The connecting hole 12122 and the docking hole 1112 on the left side are respectively adjacent to the inlet portion 10a on the left side of the cooling module 11. Figure 11 The right communicating hole 12122 and the docking hole 1112 are respectively adjacent to the right outlet portion 10 b of the cooling module 11 .

[0113] In some embodiments, the inlet 10a and the outlet 10b are respectively disposed on two opposite side walls 112 of the cooling module 11, but the present invention is not limited thereto. In some embodiments, the inlet 10a and the outlet 10b can be respectively disposed on two adjacent side walls 112 of the cooling module 11.

[0114] When the second heat transfer fluid 92 enters the Figure 11 After the lower collecting chamber 1120 on the left side, the second heat transfer fluid 92 will be divided into: (1) through the second cooling channel 120 of the fins 122 of the upper heat dissipation fin group 12 to the Figure 11 The liquid flows into the cavity 1212 on the right side of the housing 1212 and then flows into the cavity 1212 through the connecting hole 12122 and the docking hole 1112. Figure 11 (2) passing through the slits between the heat sinks 114 in the lower cooling module 11 and toward the outlet 10b; Figure 11 The liquid flows into the outlet portion 10b in the direction of the lower arrow.

[0115] See Figure 12 and Figure 13 , Figure 12 This is a schematic diagram of an exploded view of the cooling device 100 from a top perspective. The inlet 10a and the outlet 10b are located on both sides of the heat dissipation fin group 12. Figure 13 To illustrate Figure 12 In the embodiment of the present invention, a schematic side cross-sectional view of the cooling device 100 is shown, wherein the inlet 10a and the outlet 10b are located on both sides of the heat dissipation fin group 12, and the arrows indicate the direction of fluid flow. In some embodiments, the other side of each cavity 1212 (such as Figure 13 The lower surface of the cavity 1212 shown in the figure has two connecting holes 12122 connected to each cavity 1212, and the cooling module 11 has two docking holes 1112 located on the carrier plate 111, and each docking hole 1112 corresponds to each connecting hole 12122 and connects to each cavity 1212. Figure 13 The connecting hole 12122 and the docking hole 1112 on the left side are respectively adjacent to the inlet portion 10a on the left side of the partition 121. Figure 13 The right communicating hole 12122 and the docking hole 1112 are respectively adjacent to the right outlet portion 10 b of the partition 121 .

[0116] In some embodiments, the inlet 10a and the outlet 10b are located on both sides of the partition 121, and the inlet 10a is located at Figure 13 The cavity 1212 on the left side of the partition 121 shown in FIG. 1 is provided with the outlet portion 10b as shown in FIG. Figure 13 The cavity 1212 on the right side of the partition 121 is shown, but is not limited thereto.

[0117] When the second heat transfer fluid 92 enters the Figure 13 After entering the cavity 1212 on the left side, the second heat transfer fluid 92 will be divided into: (1) flowing through the second cooling channel 120 of the fins 122 of the upper heat dissipation fin group 12 to the Figure 13 The cavity 1212 on the right side of the chamber then flows into the outlet 10b; (2) through the Figure 13 The lower collecting chamber 1120 on the left side of the figure flows into the cooling module 11, passes through the slits between the heat sinks 114 and flows toward the cooling module 11. Figure 13 As shown in the right arrow direction, the liquid flows into the lower collecting chamber 1120 on the right, then flows upward into the cavity 1212 on the right, and then flows into the outlet portion 10b.

[0118] See also Figures 14 to 16 , Figure 14 is a schematic diagram of the appearance of the cooling device 100, Figure 15is an exploded schematic diagram of the cooling device 100, Figure 16 The figure is a side cross-sectional diagram of the cooling device 100. Each fin 122 has an outlet 10b at its side end, and the cooling module 11 has an inlet 10a. The arrows indicate the direction of fluid flow. In some embodiments, the heat dissipation fin assembly 12 includes a separator 121 and a plurality of fins 122. The separator 121 includes a base plate 1211 and a cavity 1212. The cavity 1212 is a rectangular frame and is as shown in FIG. Figure 14 As shown, the cavity 1212 extends along the first axis X direction, and is located at one end of the substrate 1211. A surface of the cavity 1212 has a plurality of diversion holes 12121. The partition 121 is combined with the cooling module 11. The fins 122 are respectively arranged on the partition 121. The side end of each fin 122 is provided with an outlet portion 10b. The side end of each fin 122 is not closed and is provided with a Figure 14 and Figure 15 When viewed in the direction of the third axis Z, the outlet portion 10 b is a vertical rectangular slot, and the cooling module 11 is provided with an inlet portion 10 a.

[0119] When the cooling device 100 performs heat exchange, Figure 16 It can be seen that the second heat transfer fluid 92 enters the first cooling channel 110 from the inlet 10a of the cooling module 11. Figure 16 The second heat transfer fluid 92 flows from the left lower plenum 1120 to the narrow gaps between the heat sinks 114 to the right lower plenum 1120. Then, the second heat transfer fluid 92 turns and flows to the upper cavity 1212 and then flows to the second cooling channel 120 of the upper heat sink fin group 12. The second heat transfer fluid 92 then flows from the Figure 16 The outlet 10b of each left fin 122 flows out, allowing the second heat transfer fluid 92 to flow along the first cooling channel 110 and the second cooling channel 120, which are U-shaped and rotated 90 degrees counterclockwise (as viewed from the first axis X direction), to remove heat energy.

[0120] See also Figure 17 , Figure 17 This is a side cross-sectional diagram of the cooling device 100. The heat sink 13 is located above the heat sink fin group 12. The arrows indicate the direction of fluid flow. In some embodiments, the cooling device 100 further includes a heat sink 13, which is a fan for liquid and is located above the heat sink fin group 12. However, this is not a limitation. Figure 18 In some embodiments, the cooling device 100 further includes a heat dissipation device 13 located at the side end of the heat dissipation fin group 12. The outlet of the heat dissipation device 13 faces the heat dissipation fin group 12. Figure 17 The heat dissipation device 13 transports the first heat transfer fluid 91 from top to bottom to the heat dissipation fin group 12. The first heat transfer fluid 91 flows out from both sides of the heat dissipation fin group 12, removing the heat source on the heat dissipation fin group 12. Figure 18 The heat dissipation device 13 transports the first heat transfer fluid 91 from the left side to the right side to the heat dissipation fin group 12, removing the heat source on the heat dissipation fin group 12. In this way, the heat dissipation device 13 is disposed on the heat dissipation fin group 12 to enhance convection and heat dissipation effects.

[0121] In summary, according to some embodiments, the cooling device arranges a heat dissipation fin group above the cooling module, so that the second heat transfer fluid flows through the first cooling channel in the cooling module and the second cooling channel in the heat dissipation fin group for heat exchange.

Claims

1. A cooling device comprising: A cooling module having a first cooling channel therein; a heat dissipation fin group, located on the cooling module, the heat dissipation fin group including a plurality of fins, each of which has a second cooling channel; An inlet portion is provided on the heat dissipation fin group or the cooling module; as well as An outlet portion is provided on the cooling module or the heat dissipation fin group; The first cooling channel, the second cooling channel, the inlet and the outlet are connected.

2. The cooling device according to claim 1, wherein the heat dissipation fin group includes a partition, the partition includes a substrate and two cavities, the two cavities are located on both sides of the substrate, and one side of each of the cavities has a plurality of diversion holes, the partition is combined on the cooling module, and each of the fins is respectively arranged on the partition.

3. The cooling device as claimed in claim 2, wherein each of the fins includes two connecting parts and an opening connected to the second cooling channel, each of the cavities is respectively connected to each of the connecting parts, and the opening of each of the fins is respectively located opposite to the diversion hole of each of the cavities.

4. The cooling device according to claim 3, wherein each of the fins includes a docking portion disposed between the two coupling portions of each of the fins, and the separator includes a plurality of alignment portions located on the substrate, and each of the docking portions is respectively coupled to each of the alignment portions.

5. The cooling device as claimed in claim 2, wherein the cooling module has a support plate and a plurality of side walls connected to the support plate, the cooling module includes a base plate and a plurality of heat sinks located on the base plate, the base plate covers the openings between the side walls, the heat sinks are located between the side walls, and a lower collecting chamber is formed between the support plate and the side walls.

6. The cooling device according to claim 5, wherein the other side of the cavity has a connecting hole, and the cooling module has a docking hole located on the support plate, and the docking hole corresponds to the connecting hole and connects the cavity with the lower collecting chamber.

7. The cooling device according to claim 6, wherein the cavity of the partition and the side wall of the cooling module are respectively provided with the inlet portion and the outlet portion, and the inlet portion and the outlet portion are away from the connecting hole and the docking hole and are respectively located on the same side of the cooling device.

8. The cooling device according to claim 5, wherein the cavity of the partition and the side wall of the cooling module are respectively provided with the inlet and the outlet, and the inlet and the outlet are respectively located on two sides of the cooling device. 9 . The cooling device according to claim 8 , wherein the partition comprises a baffle, and the baffle is disposed in the cavity to divide the cavity into two upper collecting chambers.

10. The cooling device according to claim 9, wherein the other side of the cavity has a connecting hole connected to one of the upper collecting chambers, and the cooling module has a docking hole located on the support plate, and the docking hole corresponds to the connecting hole and is connected to one of the upper collecting chambers.

11. The cooling device according to claim 10, wherein the inlet is provided in the cavity and communicates with another upper collecting chamber therein, the inlet is adjacent to the communicating hole and the docking hole, and the outlet is away from the communicating hole and the docking hole.

12. The cooling device according to claim 10, wherein the outlet portion is provided in the cavity and communicated with another upper collecting chamber therein, the outlet portion is adjacent to the communicating hole and the docking hole, and the inlet portion is away from the communicating hole and the docking hole.

13. The cooling device according to claim 5, wherein the other side of each of the cavities has two connecting holes connected to each of the cavities, and the cooling module has two docking holes located on the support plate, and each of the docking holes corresponds to each of the connecting holes and is connected to each of the cavities. 14 . The cooling device according to claim 13 , wherein the inlet and the outlet are respectively provided on two of the side walls of the cooling module, and the inlet and the outlet are respectively located on two sides of the cooling module. 15 . The cooling device according to claim 13 , wherein each of the cavities of the partition is provided with the inlet and the outlet, respectively, and the inlet and the outlet are located on both sides of the partition.

16. The cooling device according to claim 1, wherein the heat dissipation fin group includes a partition, the partition includes a substrate and a cavity, the cavity is located on one side of the substrate, one side of the cavity has a plurality of diversion holes, the partition is combined with the cooling module, each of the fins is respectively arranged on the partition, the side end of each of the fins is provided with the outlet portion, and the cooling module is provided with the inlet portion.

17. An immersion cooling system comprising: Box; A first heat transfer fluid is located in the box; electronic components, located in the box; A cooling device is located in the housing and contacts the electronic component, the cooling device comprising a cooling module, a heat dissipation fin group, an inlet portion, and an outlet portion, the cooling module having a first cooling channel therein, the heat dissipation fin group being located on the cooling module, the heat dissipation fin group comprising a plurality of fins, the fins having a second cooling channel therein, the inlet portion being provided at the heat dissipation fin group or the cooling module, the outlet portion being provided at the cooling module or the heat dissipation fin group, the first cooling channel, the second cooling channel, the inlet portion, and the outlet portion being connected; as well as The second heat transfer fluid is located in the first cooling channel and the second cooling channel.

18. The immersion cooling system according to claim 17, wherein the heat dissipation fin group includes a partition, the partition includes a base plate and two cavities, the two cavities are located on both sides of the base plate, and one side of each cavity has a plurality of diversion holes. The partition is combined with the cooling module, and each of the fins is respectively arranged on the partition; each of the fins includes two joints and an opening connected to the second cooling channel, the two cavities are respectively combined with each of the joints, and the opening of each of the fins is respectively aligned with the diversion holes of each of the cavities; each of the fins includes a docking portion provided at the Between the two joints, the partition includes a plurality of alignment parts located on the substrate, and each of the docking parts is respectively coupled to each of the alignment parts; the cooling module has a support plate and a plurality of side walls connected to the support plate, the cooling module includes a base plate and a plurality of heat sinks located on the base plate, the base plate covers the openings between each of the side walls, each of the heat sinks is located between each of the side walls, and a lower collecting chamber is formed between the support plate and the side walls; the other side of the cavity has a connecting hole, and the cooling module has a docking hole located on the support plate, and the docking hole corresponds to the connecting hole and connects the cavity with the lower collecting chamber.

19. An immersion cooling system comprising: first box; A first heat transfer fluid is located in the first box; Electronic components are located in the first box; a cooling device located in the first housing and in contact with the electronic component, the cooling device comprising a cooling module, a heat dissipation fin group, an inlet portion, and an outlet portion; the cooling module having a first cooling channel therein; the heat dissipation fin group being located on the cooling module; the heat dissipation fin group comprising a plurality of fins; the fins having a second cooling channel therein; the inlet portion being provided at the heat dissipation fin group or the cooling module; the outlet portion being provided at the cooling module or the heat dissipation fin group; the first cooling channel, the second cooling channel, the inlet portion, and the outlet portion being connected; Second box; A second heat transfer fluid is located in the second box, the first cooling channel, and the second cooling channel; a plurality of pipes, one end of each pipe being connected to the inlet and the outlet, and the other end of each pipe being connected to the second box; as well as The heat exchange device includes a conduit, a pump, and a heat exchange module. The conduit is connected to the pump, the heat exchange module, and the first box or the second box.

20. The immersion cooling system according to claim 19, wherein the heat dissipation fin group includes a partition, the partition includes a base plate and two cavities, the two cavities are located on both sides of the base plate, and one side of each cavity has a plurality of diversion holes. The partition is combined with the cooling module, and each of the fins is respectively arranged on the partition; each of the fins includes two joints and an opening connected to the second cooling channel, the two cavities are respectively combined with each of the joints, and the opening of each of the fins is respectively aligned with the diversion holes of each of the cavities; each of the fins includes a docking portion provided at each of the fins. Between the joints, the partition includes a plurality of alignment parts located on the substrate, and each of the docking parts is respectively coupled to each of the alignment parts; the cooling module has a support plate and a plurality of side walls connected to the support plate, the cooling module includes a base plate and a plurality of heat sinks located on the base plate, the base plate covers the openings between the side walls, each of the heat sinks is located between the side walls, and a lower collecting chamber is formed between the support plate and the side walls; the other side of the cavity has a connecting hole, and the cooling module has a docking hole located on the support plate, and the docking hole corresponds to the connecting hole and connects the cavity with the lower collecting chamber.

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