Server heat dissipation device

Abstract

The invention provides a server heat dissipation device which is arranged in a 4U rack-mounted server case shell and comprises a circuit board, first power supply position groups and second power supply position groups are arranged on the circuit board, and the first power supply position groups and the second power supply position groups are alternately arranged in the long edge direction of the circuit board; the first connector is mounted on the first power supply position group; the second connector is mounted on the second power supply position group; the third connector is mounted on the first power supply position group; the first fan module is electrically connected with the first power supply position group through the first connector; and the second fan module is electrically connected with the second power supply position group through the second connector or electrically connected with the first power supply position group through the third connector. The technical problem that a traditional heat dissipation device is poor in circuit board compatibility is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of server heat dissipation, and more particularly to a server heat dissipation device. Background Art

[0002] In the current server cooling field, the adaptability and cost control of cooling modules are key challenges. In traditional server cooling devices, fan boards are usually designed separately for cooling modules of specific specifications. Cooling modules of different shapes and specifications, such as fan combinations of different numbers and sizes, require the development of multiple corresponding circuit boards, which significantly increases R&D costs and affects production efficiency. Due to the lack of a unified and flexible connection solution, the compatibility between fan boards and cooling modules is poor. When the server needs to replace or upgrade the cooling module, it is often difficult to adapt directly and the circuit board needs to be redesigned and developed, which not only consumes time and resources, but may also result in the server's overall cooling performance not being fully utilized and unable to meet the cooling requirements under different power consumption. Summary of the Invention

[0003] The purpose of the present invention is to overcome the defects of the prior art and provide a server heat dissipation device, which aims to solve the technical problem of poor compatibility of circuit boards in traditional heat dissipation devices.

[0004] To achieve the above object, the present invention adopts the following technical solutions:

[0005] A server heat dissipation device is provided in a 4U rack-mounted server chassis housing, comprising:

[0006] A circuit board, wherein a first power supply bit group and a second power supply bit group are provided on the circuit board, and the first power supply bit group and the second power supply bit group are alternately arranged along the long side of the circuit board;

[0007] a first connector, the first connector being mounted on the first power supply bit group;

[0008] a second connector, the second connector being mounted on the second power supply bit group;

[0009] a third connector, the third connector being mounted on the first power supply bit group;

[0010] a first fan module, wherein the first fan module is electrically connected to the first power supply bit group via the first connector;

[0011] The second fan module is electrically connected to the second power supply bit group through the second connector or is electrically connected to the first power supply bit group through the third connector.

[0012] In one embodiment, the first power supply potential group and the second power supply potential group are staggered in a front-to-back manner along the short side of the circuit board.

[0013] In one embodiment, the first power supply position group includes five first hole position groups, and the five first hole position groups are evenly distributed in a straight line along the long side of the circuit board.

[0014] In one embodiment, the first connector is an elbow connector, and the first connector is provided with a bent pin end, the bent pin end is vertically plugged into the first hole group, and the power interface of the first fan module is horizontally plugged into the horizontal end of the first connector.

[0015] In one embodiment, the second power supply position group includes four second hole groups, which are evenly distributed in a straight line along the long side of the circuit board, and the first hole group and the second hole group are arranged at intervals on the circuit board.

[0016] In one embodiment, the second fan module is a four-fan module or a five-fan module, the four-fan module is electrically connected to the second hole group through the second connector, and the five-fan module is electrically connected to the first hole group through the third connector.

[0017] In one embodiment, the second connector is a straight connector, the pins of the second connector are vertically inserted into the second hole group, and the other end is connected to the power interface of the four-fan module.

[0018] In one embodiment, the third connector is a straight connector, one end of the third connector is vertically plugged into the first hole group, and the other end is connected to the power interface of the five-fan module.

[0019] In one embodiment, the pins of the first connector and the pins of the third connector are spliced ​​into a coplanar solder foot, and the coplanar solder foot is electrically connected to the first hole position group.

[0020] In one embodiment, the circuit board is provided with a plurality of hanging through holes, and the circuit board is passed through the hanging through holes by hanging screws so that the circuit board is connected to the chassis shell.

[0021] Compared with the prior art, the present invention has the following advantages: by alternating the first power supply group and the second power supply group along the long side of the circuit board, and matching the first connector, the second connector, and the third connector, a variety of connection solutions are provided for different fan modules. The first fan module is connected to the first power supply group via the first connector, and the second fan module can choose to connect to the second power supply group via the second connector or the first power supply group via the third connector according to its own specifications. As a result, the circuit board can adapt to heat dissipation modules of different shapes and specifications, improving the versatility of the circuit board, avoiding the development of multiple circuit boards for different modules, reducing costs, and also improving the flexibility and applicability of the server cooling system to meet different cooling needs.

[0022] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the following preferred embodiments are specifically cited and described in detail as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of the overall structure of a server heat dissipation device provided by the present invention;

[0024] Figure 2 This is a structural schematic diagram of a server heat dissipation device provided by the present invention without the second fan module;

[0025] Figure 3 A schematic diagram of the connection between a first fan module and a circuit board of a server heat dissipation device provided by the present invention;

[0026] Figure 4 A schematic diagram of the connection between the second fan module and the circuit board of a server heat dissipation device provided by the present invention;

[0027] Figure 5 A schematic diagram of the connection between the second fan module and the circuit board in another embodiment of a server heat dissipation device provided by the present invention;

[0028] Figure 6 A schematic structural diagram of a server heat dissipation device provided by the present invention in which a second fan module is installed in reverse;

[0029] Figure 7 A schematic diagram of the connection between a first connector and a circuit board of a server heat dissipation device provided by the present invention;

[0030] Figure 8 A schematic diagram of the connection between a second connector and a circuit board of a server heat dissipation device provided by the present invention;

[0031] Figure 9A schematic diagram of the connection between a third connector and a circuit board of a server heat dissipation device provided by the present invention;

[0032] Figure 10 This is a partial schematic diagram of the connection between a first connector, a third connector and a circuit board of a server heat dissipation device provided by the present invention.

[0033] Reference numerals

[0034] 1. Chassis shell; 2. Circuit board; 21. First power supply bit group; 211. First hole group; 22. Second power supply bit group; 221. Second hole group; 23. Mounting hole; 24. Mounting screw; 3. First connector; 31. Bent pin end; 4. Second connector; 5. Third connector; 6. First fan module; 7. Second fan module; 71. Four-fan module; 72. Five-fan module; 8. Power connector. DETAILED DESCRIPTION

[0035] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0036] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0037] It will be understood that when used in this specification and the appended claims, the terms “comprises” and “comprising” indicate the presence of described features, integers, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof.

[0038] It should also be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the present invention. As used in the specification and appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms unless the context clearly indicates otherwise.

[0039] It should be further understood that the term "and / or" used in the present description and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

[0040] See also Figures 1 to 10As shown, an embodiment of the present invention discloses a server heat dissipation device, which is arranged in a 4U rack-type server chassis housing 1, comprising:

[0041] A circuit board 2, wherein a first power supply bit group 21 and a second power supply bit group 22 are provided on the circuit board 2, wherein the first power supply bit group 21 and the second power supply bit group 22 are alternately arranged along the long side of the circuit board 2;

[0042] A first connector 3 , the first connector 3 is installed on the first power supply bit group 21 ;

[0043] A second connector 4 , the second connector 4 is installed on the second power supply bit group 22 ;

[0044] A third connector 5 , the third connector 5 being installed on the first power supply bit group 21 ;

[0045] A first fan module 6, wherein the first fan module 6 is electrically connected to the first power supply bit group 21 via the first connector 3;

[0046] The second fan module 7 is electrically connected to the second power supply bit group 22 through the second connector 4 or is electrically connected to the first power supply bit group 21 through the third connector 5 .

[0047] Specifically, the server cooling device includes a circuit board 2 disposed within a chassis housing 1. A first power supply group 21 and a second power supply group 22 are arranged alternately along the longitudinal direction of the circuit board 2. A first connector 3, a second connector 4, and a third connector 5 are mounted on different power supply groups, respectively. Furthermore, a first fan module 6 and a second fan module 7 are electrically connected to the power supply groups via the first connector 3, the second connector 4, and the third connector 5. By rationally arranging the power supply groups and connectors, flexible connection of different fan modules is achieved. When the server is operating, a power connector 8 on the circuit board 2 is connected to a power source, and power is supplied to the fan modules via the different power supply groups and corresponding connectors, enabling operation and heat dissipation. The layout and combination of the first power supply group 21, the second power supply group 22, the first connector 3, the second connector 4, and the third connector 5 enable a single circuit board 2 to accommodate power supply installations for multiple fan modules, improving compatibility. It is understood that the alternating arrangement of the first power supply group 21 and the second power supply group 22 can be adjusted to accommodate the space available within the chassis to accommodate the connection of different fan modules.

[0048] Furthermore, the heat dissipation device in this embodiment is used in 4U rack-mounted servers with high performance and high heat dissipation requirements. When a 4U rack-mounted server is in operation, a large amount of heat is generated. If the heat is not dissipated in a timely and effective manner, the performance and stability of the server will be seriously affected. The server heat dissipation device of this embodiment plays a key role in this scenario. The first power supply bit group 21 and the second power supply bit group 22 of the server heat dissipation device are alternately arranged along the long side direction of the circuit board 2. This layout is designed based on the compact space structure inside the 4U rack-mounted server, which can make full use of the space of the circuit board 2 and rationally plan the power supply line of the fan module.

[0049] The first fan module 6 is a front fan module. When the server is running, the first fan module 6 runs at high speed to draw in cold air from the front and quickly take away the heat generated by the front-end equipment of the server.

[0050] The second fan module 7 is a center-mounted fan module, selected based on the actual server load. During low-load operations, the center-mounted four-fan module 71 is used to assist the first fan module 6 in dissipating heat from the central area of ​​the server, ensuring a balanced temperature across the server. However, when the server is under high load, heat generation increases significantly, and the center-mounted five-fan module 72 is switched to increase heat dissipation in the central area of ​​the server, ensuring stable operation even in high-temperature environments.

[0051] During the entire operation process, various components work together to adjust the heat dissipation capacity according to the actual needs of the server, ensuring that the temperature of the server is always within a reasonable range during high-performance computing, ensuring the stable operation of the server, improving data processing efficiency, and meeting the data center's requirements for high performance and high reliability of the server.

[0052] In one embodiment, the first power supply potential group 21 and the second power supply potential group 22 are staggered in a front-to-back manner along the short side of the circuit board 2 .

[0053] Specifically, the first power supply bit group 21 and the second power supply bit group 22 are staggered in the front and back direction along the short side of the circuit board 2, so that different connectors and fan modules can be better arranged within the limited space of the circuit board 2 to avoid mutual interference. During operation, this staggered distribution does not affect power supply and signal transmission, and can make the installation of the fan module more compact, thereby optimizing the space utilization of the circuit board 2 and improving the compactness of the overall structure. It is understandable that in actual implementation, due to the limited internal space of the 4U rack server, this staggered distribution can better adapt to the internal layout of the chassis. However, in other embodiments, if the chassis space permits, other non-interference distribution methods, such as parallel distribution, can also be adopted.

[0054] In one embodiment, the first power supply position group 21 includes five first hole position groups 211 , and the five first hole position groups 211 are evenly distributed in a straight line along the long side of the circuit board 2 .

[0055] Specifically, the first power supply bit group 21 includes five groups of first hole groups 211, and is evenly distributed in a straight line along the long side direction of the circuit board 2 to accurately match the installation holes of a specific fan module and ensure the stability of the connection. During the actual installation process, technicians can easily align the first connector 3 with the hole group for installation, which greatly improves the accuracy and convenience of installation. Moreover, this evenly distributed hole group can ensure that the current is evenly transmitted to each fan, avoiding the problem of inconsistent fan speed due to uneven power supply, thereby ensuring the overall heat dissipation effect of the first fan module 6. It can be understood that in this embodiment, the first fan module 6 is a front five-fan module 72, thereby matching the number of the first power supply bit group 21. Among them, the power of the first fan module 6 should be selected according to actual needs, and the distribution of the first hole group 211 can accurately adapt to its installation requirements.

[0056] In one embodiment, the first connector 3 is an elbow connector, and the second connector 4 is provided with a bent pin end 31, the bent pin end 31 is vertically plugged into the first hole group 211, and the power interface of the first fan module 6 is horizontally plugged into the horizontal end of the first connector 3.

[0057] Specifically, the first connector 3 is an elbow connector. The first connector 3 is provided with a bent pin end 31 that is vertically plugged into the first hole group 211. The power interface of the first fan module 6 is horizontally plugged into the horizontal end of the first connector 3, thereby using the elbow connector to change the connection direction, facilitating the horizontal installation of the first fan module 6, so that the first fan module 6 can be horizontally installed at the front of the chassis, so that cold air can be directly sucked in from the front of the chassis, and after being accelerated by the fan module, it is quickly and effectively blown to the heating components at the front end of the server. During operation, current is transmitted from the circuit board 2 to the first fan module 6 through the first connector 3, which is easy to install and ensures stable electrical connection. It can be understood that in this embodiment, the heat dissipation device is used in a 4U server, and the use of an elbow connector can better adapt to the installation position and direction of the front fan module.

[0058] In one embodiment, the second power supply position group 22 includes four second hole groups 221 , which are evenly distributed in a straight line along the long side of the circuit board 2 , and the first hole group 211 and the second hole group 221 are spaced apart on the circuit board 2 .

[0059] Specifically, the second power supply group 22 includes four second hole groups 221 evenly distributed along the long side and spaced apart from the first hole group 211. This provides an independent installation and power supply location for the second fan module 7, avoiding interference with the connection of the first fan module 6 and ensuring stable power supply and installation of the second fan module 7. It will be understood that in the server cooling device, the arrangement of the second power supply group 22 ensures that the connection between the central four-fan module 71 and the front five-fan module 72 does not affect each other.

[0060] In one embodiment, the second fan module 7 is a four-fan module 71 or a five-fan module 72 , the four-fan module 71 is electrically connected to the second hole group 221 through the second connector 4 , and the five-fan module 72 is electrically connected to the first hole group 211 through the third connector 5 .

[0061] Specifically, the second fan module 7 is a four-fan module 71 or a five-fan module 72, which is electrically connected to the second hole group 221 or the first hole group 211 through the second and third connectors, respectively. In actual applications, the four-fan module 71 or the five-fan module 72 should be flexibly selected for installation and power supply according to the different power consumption requirements of the server to meet the heat dissipation requirements in different power consumption scenarios. It is understandable that in the 4U rack server operation scenario of this embodiment, the second fan module 7 can be flexibly switched between the four-fan module 71 and the five-fan module 72 according to the real-time power consumption requirements of the server, and the electrical connection with the corresponding hole group is achieved through the second connector 4 and the third connector 5, respectively. When the server is in a low-power operating state, the heat generated by the internal components of the server is relatively small. At this time, the central four-fan module 71 is selected and connected to the second hole group 221 of the second power supply group 22 through the second connector 4, which can meet the heat dissipation requirements of the central area of ​​the server. The four-fan module 71 operates at a relatively low power, effectively reducing energy consumption. When the server enters a high-load computing state, it generates significant heat. At this point, the centrally located five-fan module 72 is switched to connect to the first socket group 211 of the first power supply group 21 via the third connector 5. Operating with higher power and greater airflow, the five-fan module 72 quickly dissipates significant heat from the central portion of the server, preventing component performance degradation or failure due to overheating and effectively ensuring stable server operation. This design, which allows for flexible fan module selection based on the server's power consumption requirements, significantly improves the adaptability of the cooling system, ensuring that the server maintains optimal performance under varying workloads.

[0062] In one embodiment, the second connector 4 is a straight connector, the pins of the second connector 4 are vertically inserted into the second hole group 221 , and the other end is connected to the power interface of the four-fan module 71 .

[0063] Specifically, the second connector 4, a key component connecting the circuit board 2 and the four-fan module 71, utilizes a straight connector design. Its pins plug vertically into the second hole group 221 and connect to the power port of the four-fan module 71, providing a stable and reliable electrical connection for the four-fan module 71. During the manufacturing process of 4U rack-mount servers, the straight connector design simplifies and expedited installation. Technicians can simply align the pins of the second connector 4 with the second hole group 221 and insert it vertically. This simple and direct connection reduces installation complexity and reduces the risk of connection failures due to improper installation.

[0064] In one embodiment, the third connector 5 is a straight connector. One end of the third connector 5 is vertically plugged into the first hole group 211 , and the other end is connected to the power interface of the five-fan module 72 .

[0065] Specifically, the third connector 5 is a straight connector, one end of which plugs vertically into the first hole group 211 and the other end connects to the power port of the five-fan module 72, thus providing a stable connection and power supply for the five-fan module 72. During installation, technicians can easily insert the third connector 5 vertically into the first hole group 211 and then connect it to the power port of the five-fan module 72, making the operation simple and convenient. During server operation, current is stably transmitted from the first power supply group 21 through the third connector 5 to the five-fan module 72, providing sufficient power support for the high-speed operation of the five-fan module 72.

[0066] In one embodiment, the pins of the first connector 3 and the pins of the third connector 5 are spliced ​​into a coplanar solder foot, and the coplanar solder foot is electrically connected to the first hole group 211 .

[0067] Specifically, when a 4U rack-mounted server is used in a high-load work scenario, a large amount of heat will be generated inside the server, and extremely high heat dissipation efficiency is required. At this time, it is necessary to enable the front five-fan module 72 and the middle five-fan module 72 at the same time to ensure stable operation of the server. The front five-fan module 72 and the middle five-fan module 72 are both installed on the first power supply position group 21. The first connector 3 and the third connector 5 adopt a coplanar solder foot design, and the pins of the first connector 3 and the third connector 5 are spliced ​​into coplanar solder feet and electrically connected to the first hole position group 211, thereby reducing the number of holes in the first hole position group 211 on the circuit board 2, saving space on the circuit board 2 and reducing costs. During operation, the coplanar solder feet realize the electrical connection of the first connector 3 and the third connector 5 to the first hole position group 211 at the same time, while ensuring electrical performance, optimizing the design of the circuit board 2.

[0068] In one embodiment, a plurality of hanging through holes 23 are provided on the circuit board 2 , and the circuit board 2 is passed through the hanging through holes 23 by hanging screws 24 so that the circuit board 2 is connected to the chassis housing 1 .

[0069] Specifically, the circuit board 2 is provided with a mounting hole 23, which is connected to the chassis housing 1 via mounting screws 24, thereby providing a stable mounting method for the circuit board 2. During operation, the mounting screws 24 pass through the mounting hole 23 to secure the circuit board 2 within the chassis housing 1, preventing vibration and other factors from affecting the normal operation of the heat dissipation device.

[0070] Furthermore, the internal space layout of a 4U rack-mounted server is complex, and the design of the mounting holes 23 can flexibly cope with these complex situations. The server's first fan module 6 adopts the specifications of a five-fan module 72. If the space in the front of the chassis is relatively ample, the circuit board 2 is installed from the front to better guide the airflow. In this case, the mounting screws 24 are used to pass through the mounting holes 23 on the circuit board 2 to fix the circuit board 2 to the chassis shell 1 from the front. The relative position of the first fan module 6 and other components in the chassis is more conducive to the smooth entry of cold air into the server from the front, effectively dissipating heat for components such as the hard disk and part of the circuit board 2 at the front.

[0071] In the installation scenario of the second fan module 7 of the server, the central position needs to take into account the heat dissipation of the front and rear components, and may be affected by other internal structural parts. For example, when the cables inside the server are concentrated in the central area, in order to avoid interference between the installation of the second fan module 7 and the cables, the circuit board 2 needs to be installed on the reverse side, and the mounting screws 24 are passed through the mounting holes 23, but the fan board is fixed to the chassis shell 1 from the inside of the chassis. The second fan module 7 avoids the cables in a reverse installation manner, and at the same time, it can effectively discharge the hot air according to the air duct design inside the chassis, ensuring the heat dissipation needs of the central and rear components. The use of the mounting holes 23 to achieve the forward and reverse installation of the second fan module 7 allows technicians to flexibly choose the installation direction of the circuit board 2 according to the internal structure after each adjustment, without the need to redesign or replace the structure of the chassis and fan board, which greatly improves the adaptability and maintainability of the server, ensuring that the server can maintain good heat dissipation performance and stable operation in various complex application scenarios.

[0072] In summary, a server cooling device in this embodiment is applied to a 4U rack-mounted server, and its working process is as follows: when the server is running, the power supply supplies power to the circuit board 2 through the power connector 8, and the current is transmitted to the corresponding fan module through different connectors through the first and second power supply bit groups that are alternately arranged and distributed along the long side on the circuit board 2. The five groups of first hole groups 211 of the first power supply bit group 21 and the four groups of second hole groups 221 of the second power supply bit group 22 respectively cooperate with the first, second, and third connectors to realize power supply to the first fan module 6 and the second fan module 7. The first fan module 6 always performs cooling work for the server. When under low load, the second fan module 7 adopts a central four-fan module 71, which is connected to the second hole group 221 through the second connector 4 to assist in heat dissipation; when under high load, the second fan module 7 adopts a central five-fan module 72, which is connected to the first hole group 211 through the third connector 5 to enhance heat dissipation. The first connector 3 is an angled connector, facilitating horizontal installation of the first fan module 6. The second and third connectors are straight connectors, ensuring stable power supply to the second fan module 7. Furthermore, the first and third connectors utilize coplanar solder pins to connect to the first hole group 211, saving space on the circuit board 2 under high loads. The circuit board 2 is connected to the chassis housing 1 via mounting holes 23 and mounting screws 24. This allows for reverse installation depending on the server's internal layout, allowing the fan module to better adapt to the chassis' internal structure. The various components work together to adjust heat dissipation based on server load, ensuring stable operation and a reasonable temperature range for the server under varying operating conditions.

[0073] The above examples are merely provided to further illustrate the technical content of the present invention for easier understanding by the reader, but do not limit the embodiments of the present invention to these examples. Any extension or re-creation of the technology based on the present invention is protected by the present invention. The scope of protection of the present invention shall be determined by the claims.

Claims

1. A server heat dissipation device, arranged in a 4U rack-mounted server chassis, characterized in that: include: A circuit board, wherein a first power supply bit group and a second power supply bit group are provided on the circuit board, and the first power supply bit group and the second power supply bit group are alternately arranged along the long side of the circuit board; a first connector, the first connector being mounted on the first power supply bit group; a second connector, the second connector being mounted on the second power supply bit group; a third connector, the third connector being mounted on the first power supply bit group; a first fan module, wherein the first fan module is electrically connected to the first power supply bit group via the first connector; The second fan module is electrically connected to the second power supply bit group through the second connector or is electrically connected to the first power supply bit group through the third connector.

2. The server heat dissipation device according to claim 1, characterized in that: The first power supply potential group and the second power supply potential group are staggered in front and back along the short side of the circuit board.

3. The server heat dissipation device according to claim 1, wherein: The first power supply position group includes five first hole position groups, and the five first hole position groups are evenly distributed in a straight line along the long side of the circuit board.

4. The server heat dissipation device according to claim 3, characterized in that: The first connector is an elbow connector, and a bent pin end is provided on the first connector. The bent pin end is vertically plugged into the first hole group, and the power interface of the first fan module is horizontally plugged into the horizontal end of the first connector.

5. The server heat dissipation device according to claim 3, characterized in that: The second power supply position group includes four second hole position groups, which are evenly distributed in a straight line along the long side of the circuit board. The first hole position group and the second hole position group are arranged on the circuit board at intervals.

6. The server heat dissipation device according to claim 5, characterized in that: The second fan module is a four-fan module or a five-fan module. The four-fan module is electrically connected to the second hole position group through the second connector, and the five-fan module is electrically connected to the first hole position group through the third connector.

7. The server heat dissipation device according to claim 6, characterized in that: The second connector is a straight connector, the pins of the second connector are vertically inserted into the second hole group, and the other end is connected to the power interface of the four-fan module.

8. The server heat dissipation device according to claim 7, characterized in that: The third connector is a straight connector. One end of the third connector is vertically plugged into the first hole group, and the other end is connected to the power interface of the five-fan module.

9. The server heat dissipation device according to claim 8, characterized in that: The pins of the first connector and the pins of the third connector are spliced ​​into a coplanar solder foot, and the coplanar solder foot is electrically connected to the first hole position group.

10. The server heat dissipation device according to claim 1, wherein: The circuit board is provided with a plurality of hanging through holes, and the circuit board is passed through the hanging through holes by hanging screws so that the circuit board is connected to the chassis shell.

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