Hard disk device and heat dissipation unit for hard disk device

Abstract

At least one aspect of the disclosure relates to a hard disk device and a heat dissipation unit for the hard disk device. The invention provides a hard disk device. The hard disk device comprises a first shell, a second shell, a heat dissipation unit and at least one electronic component, the second housing is disposed at a position corresponding to the first housing. The heat dissipation unit is provided with a first surface, a second surface, a first extension assembly and a second extension assembly. Wherein the at least one electronic component is in contact with at least one of the first surface and the second surface; the first extension component is in contact with the first shell and the second shell, and the second extension component is in contact with the first shell and the second shell; and the first extension assembly and the second extension assembly serve as a third shell of the hard disk device.

Description

Technical Field

[0001] The present disclosure relates to a hard disk device and a heat dissipation unit for the hard disk device, in particular to a hard disk device and a heat dissipation unit for an electronic component of the hard disk device. Background Art

[0002] Currently, the heat dissipation methods of hard disk devices include those using enhanced thermal convection and increased contact with the outer casing to dissipate heat. For the method of enhancing thermal convection, a heat sink plus circulating airflow is used to conduct heat energy from the electronic components. This method can add a cooling fan to the heat sink to enhance the circulation of gas to conduct the heat out of the outer casing. However, the outer casing also needs to have air intake and exhaust holes to improve the heat dissipation efficiency. Therefore, the heat dissipation of the electronic components will also be affected by the position of the circulating air holes. For the method of increasing the contact with the outer casing to conduct heat, the heat can be dissipated by contacting the outer casing with a large area of ​​electronic components. For example, the surface of various chips can be brought into contact with the outer casing, and the outer casing can be a metal shell made of heat dissipation material or a shell with a heat dissipation effect to facilitate heat dissipation. However, for electronic components in the middle or inside of the hard disk device, they may not be able to contact the outer casing of the hard disk device, and the position of the heat conduction air holes of the outer casing may also be unfavorable for the circulation of air for the chips in the middle or inside. Summary of the Invention

[0003] In view of the shortcomings of the background technology, the present disclosure proposes a heat dissipation unit including a heat dissipation body, which is configured in a hard disk device and has an extension portion that can extend to the shell of the hard disk device. The heat dissipation body has a first distance from the shell of the hard disk device and is in contact with the electronic component. The electronic component has a second distance from the shell of the hard disk device. The extension portion can be in contact with the shell to increase contact with the shell to dissipate heat. The extension portion can also form a vent without contacting the shell to enhance convection to dissipate heat.

[0004] In an embodiment, the present disclosure provides a hard disk device comprising at least one housing, an electronic component, a heat dissipation unit having a heat dissipation unit body, and a printed circuit board. The heat dissipation unit body is located at a first distance from the housing and in contact with the electronic component. The electronic component is disposed on the printed circuit board and is located at a second distance from the housing. The heat dissipation unit further comprises an extension portion that can extend to the housing of the hard disk device. The extension portion can contact the housing to increase contact with the housing to dissipate heat. Alternatively, the extension portion can be free from contact with the housing to form a vent to enhance convection for heat dissipation.

[0005] In an embodiment, the present disclosure proposes a heat dissipation unit having an extension portion, wherein the heat dissipation unit body does not contact the outer shell, and the extension portion can extend beyond the inner surface of the outer shell, or is within the inner surface. The heat dissipation unit body can conduct heat energy from the electronic components to the extension portion, and the extension portion can circulate heat and dissipate heat outside the shell without contacting the outer shell or forming a closed shell with the outer shell.

[0006] In an embodiment, the present disclosure proposes a heat dissipation unit having an extension portion, wherein the heat dissipation unit body does not contact the outer shell, and the extension portion contacts the outer shell to form a closed housing. In this case, the heat dissipation unit body can conduct heat energy from the electronic components to the extension portion, and when the extension portion contacts the outer shell to form a closed housing, it can conduct heat energy to the outer shell. The extension portion itself can also serve as an outer shell to facilitate heat dissipation.

[0007] In an embodiment, the present disclosure proposes a heat dissipation unit having an extension portion, wherein the heat dissipation unit body does not contact the outer shell, and the extension portion can be arranged around the outer edge of the heat dissipation body of the heat dissipation unit, and the extension portion can extend beyond the inner surface of the outer shell, or be within the inner surface, the heat dissipation unit body can conduct the heat energy of the electronic component to the extension portion, and the extension portion can circulate heat and dissipate heat outside the shell when it does not contact the outer shell or does not form a closed shell with the outer shell; or when the extension portion contacts the outer shell to form a closed shell, the heat dissipation unit body can conduct the heat energy of the electronic component to the extension portion, and when the extension portion contacts the outer shell to form a closed shell, it can conduct heat energy to the outer shell, and the extension portion itself can also serve as an outer shell to facilitate heat dissipation.

[0008] The present disclosure proposes a hard disk device comprising a first shell, a second shell, a heat dissipation unit, and at least one electronic component. The first shell has a first connection surface. The second shell has a second connection surface and is arranged at a corresponding position of the first shell. The heat dissipation unit has a first surface, a second surface, a first extension component, and a second extension component. The at least one electronic component is in direct or indirect contact with the first surface to conduct the heat energy of the at least one electronic component from the at least one electronic component to the heat dissipation unit. The first extension component is in direct or indirect contact with the first connection surface and the second connection surface S, and the second extension component is in direct or indirect contact with the first connection surface and the second connection surface to conduct the heat energy from the first surface of the heat dissipation unit to the first extension component and the second extension component. The first extension component and the second extension component serve as a third shell of the hard disk device to dissipate the heat energy through the third shell.

[0009] According to an embodiment of the present disclosure, the present disclosure provides a hard disk device, comprising a first housing, a second housing, a heat dissipation unit, and at least one electronic component. The second housing is configured at a corresponding position of the first housing. The heat dissipation unit has a first surface, a second surface, a first extension component, and a second extension component. Wherein: the at least one electronic component is in contact with at least one of the first surface and the second surface; the first extension component is in contact with the first housing and the second housing, and the second extension component is in contact with the first housing and the second housing; and the first extension component and the second extension component serve as a third housing of the hard disk device.

[0010] According to an embodiment of the present disclosure, the present disclosure provides a heat dissipation unit for a hard disk device, wherein the hard disk device includes at least one electronic component, a first shell, and a second shell, and the heat dissipation unit includes a heat dissipation unit body, and at least one extension component, the at least one extension component extending from the heat dissipation unit body, wherein: the at least one electronic component is in contact with the heat dissipation unit body; the at least one extension component extends to the first shell and the second shell; and the at least one extension component serves as a third shell of the hard disk device.

[0011] According to an embodiment of the present disclosure, the present disclosure provides a heat dissipation unit for a hard disk device, wherein: the hard disk device includes a printed circuit board, two heat-generating electronic components respectively arranged on both sides of the printed circuit board, and a shell in contact with one of the two heat-generating electronic components; the shell has an inner surface and an outer surface; the other of the two heat-generating electronic components is at a distance from the inner surface; and the heat dissipation unit includes a heat dissipation unit body, which is in contact with the other heat-generating electronic component and extends beyond the inner surface.

[0012] According to an embodiment of the present disclosure, the present disclosure provides a heat dissipation unit for a hard disk device, wherein: the hard disk device has a shell and a plurality of internal heat-generating electronic components; at least one of the plurality of internal heat-generating electronic components is at a distance from the shell; the shell has an inner surface and an outer surface; and the heat dissipation unit is an intermediate extension piece, which contacts at least one of the plurality of internal heat-generating electronic components and extends beyond the inner surface.

[0013] Since electronic components such as chips are located deep inside the electronic device and do not contact the outer casing, the location of the heat dissipation vents may not be conducive to the heat dissipation of the chips in the middle or inside. The hard disk device and its heat dissipation unit disclosed in the present invention can improve the heat transfer efficiency and increase airflow ventilation to enhance the heat dissipation capacity.

[0014] In addition, compared to the heat dissipation unit of a traditional hard disk device, which cannot dissipate the heat energy of the chip deep inside the hard disk device that does not contact the heat sink or the housing, the heat dissipation unit proposed in the present disclosure can dissipate the heat energy of the chip deep inside the hard disk device that does not contact the heat sink or the housing.

[0015] For further description and advantages of the present disclosure, please refer to the subsequent drawings and embodiments to more clearly understand the technical solutions of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 FIG. 1 is a schematic diagram of a hard disk device according to a preferred embodiment of the present disclosure.

[0017] Figure 2 FIG. 1 is a schematic diagram of a hard disk device according to another preferred embodiment of the present disclosure.

[0018] Figure 3A This is a schematic diagram of an extension component of the heat dissipation unit extending beyond the corner of the heat dissipation device according to a preferred embodiment of the present disclosure.

[0019] Figure 3B According to the preferred embodiment of the present disclosure Figure 3A A schematic diagram of another embodiment of the present invention.

[0020] Figure 4 FIG. 1 is a schematic diagram of a heat dissipation unit with an opening according to a preferred embodiment of the present disclosure.

[0021] Figure 5 FIG. 4 is a schematic diagram of another heat dissipation unit with an opening according to a preferred embodiment of the present disclosure.

[0022] Figure 6 FIG. 1 is a schematic diagram of a hard disk device according to another preferred embodiment of the present disclosure.

[0023] Figure 7 FIG. 1 is a schematic diagram of a heat dissipation unit for a hard disk device according to a preferred embodiment of the present disclosure.

[0024] Figure 8A FIG2 is a schematic diagram of a heat dissipation unit for a hard disk device according to another preferred embodiment of the present disclosure.

[0025] Figure 8B Based on Figure 8A A schematic diagram of another embodiment of a heat dissipation unit.

[0026] Figure 8C Based on Figure 8B A schematic diagram of another embodiment of the heat dissipation unit 503.

[0027] Figure 9A FIG2 is a schematic diagram of a heat dissipation unit for a hard disk device according to another preferred embodiment of the present disclosure.

[0028] Figure 9B Based on Figure 9A A schematic diagram of another embodiment of a heat dissipation unit.

[0029] Figure 9C Based on Figure 9B A schematic diagram of another embodiment of a heat dissipation unit. DETAILED DESCRIPTION

[0030] Please read the following detailed description with reference to the drawings of the present disclosure, wherein the drawings of the present disclosure are used to introduce various embodiments of the present disclosure in an illustrative manner and to provide an understanding of how to implement the present disclosure. The embodiments of the present disclosure provide sufficient content for those skilled in the art to implement the embodiments disclosed in the present disclosure, or to implement embodiments derived from the contents disclosed in the present disclosure. It should be noted that the embodiments are not mutually exclusive, and some embodiments can be appropriately combined with one or more other embodiments to form new embodiments, that is, the implementation of the present disclosure is not limited to the embodiments disclosed below. In addition, for the sake of simplicity and clarity of illustration, the relevant details will not be excessively disclosed in each embodiment. Even if specific details are disclosed, they are only used as examples to make the reader understand. The relevant specific details in each embodiment are not intended to limit the disclosure of this case.

[0031] See also Figure 1 , which is a schematic diagram of a hard disk device 10 of a preferred embodiment of the present disclosure. The hard disk device 10 includes a first housing 101, a second housing 102, a heat dissipation unit 103, and at least one electronic component 12. The first housing 101 has a first connection surface 101S. The second housing 102 has a second connection surface 102S and is configured at a corresponding position of the first housing 101. The heat dissipation unit 103 has a first surface 103S1, a second surface 103S2, a first extension component 103EXT1, and a second extension component 103EXT2. The at least one electronic component 12 is in direct or indirect contact with the first surface 103S1 to conduct heat energy of the at least one electronic component 12 from the at least one electronic component 12 to the heat dissipation unit 103. The first extension element 130EXT1 is in direct or indirect contact with the first connection surface 101S and the second connection surface 102S, and the second extension element 103EXT2 is in direct or indirect contact with the first connection surface 101S and the second connection surface 102S, so as to conduct heat energy from the first surface 103S1 of the heat dissipation unit 103 to the first extension element 103EXT1 and the second extension element 103EXT2. The first extension element 103EXT1 and the second extension element 103EXT2 serve as the third housing 103SH1 and 103SH2 of the hard disk device 10, so as to dissipate the heat energy through the third housing 103SH1 and 103SH2.

[0032] In any embodiment of the present disclosure, the hard disk device 10 further includes a printed circuit board (PCB) 104 having a PCB surface 104S1 and a PCB surface 104S2. At least one electronic component 12 is disposed on the PCB surface 104S1 and electrically connected to the PCB 104. At least one other electronic component 16 is disposed on the PCB surface 104S2 and also electrically connected to the PCB 104. However, the other surface of the at least one other electronic component 106 contacts the inner surface 101IS of the first housing 101. The heat dissipation unit 103 includes a heat dissipation unit body 1030, which is spaced apart from and not in contact with both the first housing 101 and the second housing 102.

[0033] All hard disk devices disclosed herein may be electronic hard disk devices, such as solid-state drives (SSDs) and NVMe M.2 hard disk devices, magnetoresistive hard disk devices, or mechanical hard disk devices, such as hard disk devices with mechanical read / write arms and storage disks. Preferably, the hard disk devices are electronic hard disk devices.

[0034] See also Figure 2, which is a schematic diagram of a hard disk device 20 according to another preferred embodiment of the present disclosure. The hard disk device 20 includes a first housing 201, a second housing 202, a heat dissipation unit 203, and at least one electronic component 22, 24. The first housing 201 has a first connection surface 201S. The second housing 202 has a second connection surface 202S and is arranged at a corresponding position of the first housing 201. The heat dissipation unit 203 has a first surface 203S1, a second surface 203S2, a first extension component 203EXT1, and a second extension component 203EXT2. The at least one electronic component 22 is in direct or indirect contact with the first surface 203S1 to transfer heat energy of the at least one electronic component 22 from the at least one electronic component 22 to the heat dissipation unit 203, and the at least one electronic component 24 is in direct or indirect contact with the second surface 203S1 to transfer heat energy of the at least one electronic component 24 from the at least one electronic component 24 to the heat dissipation unit 203. The first extension element 203EXT1 is in direct or indirect contact with the first connection surface 201S and the second connection surface 202S, and the second extension element 203EXT2 is in direct or indirect contact with the first connection surface 201S and the second connection surface 202S, so as to conduct heat energy from the first surface 203S1 of the heat dissipation unit 203 to the first extension element 203EXT1 and the second extension element 203EXT2, and to conduct heat energy from the second surface 203S2 of the heat dissipation unit 203 to the first extension element 203EXT1 and the second extension element 203EXT2. The first extension element 203EXT1 and the second extension element 203EXT2 serve as the third housing 203SH1 and 203SH2 of the hard disk device 20, so as to dissipate heat through the third housing 203SH1 and 203SH2.

[0035] In any embodiment of the present disclosure, the hard disk device 20 further includes printed circuit boards (PCBs) 204, 205, wherein the PCB 204 has a PCB surface 204S1 and a PCB surface 104S2, and the PCB 205 has a PCB surface 205S1 and a PCB surface 105S2. At least one electronic component 22, 24 is respectively configured on the PCB surface 204S1, and the PCB surface 205S1 is electrically connected to the PCB 204 and the PCB 205, respectively. Another at least one electronic component 26, 28 is respectively configured on the PCB surface 204S2 and the PCB surface 205S2, and is electrically connected to the PCB 204 and the PCB 205, respectively. However, the other side of the another at least one electronic component 26, 28 contacts the inner surface 201IS of the first shell 201 and the inner surface 202IS of the second shell 202, respectively. The heat dissipation unit 203 includes a heat dissipation unit body 2030 . The heat dissipation unit body 2030 is spaced apart from the first housing 201 and the second housing 202 and does not contact the first housing 201 and the second housing 202 .

[0036] In any embodiment of the present disclosure, the at least one electronic component 12, 16, 22, 24, 26, 28 is a heat-generating electronic component, including at least one of a processor chip, a memory chip, a power management chip, a communication chip, and an application-specific integrated circuit (ASIC). A first heat-conducting element (not shown) is provided between the heat dissipation unit 103, 203 and the at least one electronic component 12, 16, 22, 24, 26, 28. A second heat-conducting element (not shown) is provided between the first extension element 103EXT1, 203EXT1 of the heat dissipation unit 103, 203 and the first connection surface 101S, 201S and the second connection surface 102S. A second heat-conducting element is provided between the second extension element 103EXT2, 203EXT2 of the heat dissipation unit 103, 203 and the first connection surface 101S, 201S and the second connection surface 102S, 202S. The first heat-conducting element and the second heat-conducting element include a heat dissipation medium. The first surface 103S1, 203S1 and the second surface 103S2, 203S2 of the heat dissipation unit 103, 203 do not contact the first housing 101, 201 and the second housing 102, 202. The first extension component 103EXT1, 203EXT1 and the second extension component 103EXT2, 203EXT2 can be components made of a different material than the heat dissipation body 1030, 2030, or can be components made of the same material as the heat dissipation body 1030, 2030 (e.g., integrally formed components). The first extension component 103EXT1, 203EXT1 and the second extension component 103EXT2, 203EXT2 are integrally formed with the heat dissipation unit 103, 203. For example, the heat dissipation unit 103, the first extension component 103EXT1, 203EXT1, and the second extension component 103EXT2, 203EXT2 are integrally formed. That is, the first extension component 103EXT1, 203EXT1 and the second extension component 103EXT2, 203EXT2 are part of the heat dissipation unit 103, 203, rather than additional components. The first extension component 103EXT1, 203EXT1 and the second extension component 103EXT2, 203EXT2 of the heat dissipation unit 103, 203 are disposed between the first housing 101, 201 and the second housing 102, 202.

[0037] In any embodiment of the present disclosure, the first extension member 103EXT1, 203EXT1 and the second extension member 103EXT2, 203EXT2 may both contact the first housing 101, 201 and the second housing 102, 202 to enhance heat dissipation efficiency, or may contact one of the two. The first extension member 103EXT1, 203EXT1 and the second extension member 103EXT2, 203EXT2 may also not contact the housing to form a vent to enhance convection heat dissipation. However, in embodiments where the first extension member and the second extension member do not contact the housing, other portions of the heat dissipation unit may also be designed to contact the housing to facilitate support of the heat dissipation unit.

[0038] In any embodiment of the present disclosure, the heat dissipation unit body 1030, 2030 does not contact the first housing 101, 201 and the second housing 102, 202, and the first extension member 103EXT1, 203EXT1 and the second extension member 103EXT2, 203EXT2 can extend beyond the inner surface 101IS, 201IS of the first housing 101, 201 and the inner surface 102IS, 202IS of the second housing 102, 202, respectively, or are within the inner surface 101IS, 201IS, 102IS, 202IS, and the heat dissipation unit body 1030 , 2030 can conduct the heat energy of the electronic components 12, 16, 22, 24, 26, 28 to the first extension component 103EXT1, 203EXT1 and the second extension component 103EXT2, 203EXT2, and the first extension component 103EXT1, 203EXT1 and the second extension component 103EXT2, 203EXT2 can circulate heat and dissipate heat outside the shell without contacting the first shell 101, 201 and the second shell 102, 202, or without forming a closed shell with the first shell 101, 201 and the second shell 102, 202.

[0039] In any embodiment of the present disclosure, the heat dissipation unit body 1030, 2030 does not contact the first housing 101, 201 and the second housing 102, 202, and the annular extension component can be arranged around the outer edge of the heat dissipation body 1030, 2030 of the heat dissipation unit, that is, Figure 1 and Figure 2The first extension component 103EXT1, 203EXT1 and the second extension component 103EXT2, 203EXT2 are regarded as an annular extension component, and the annular extension can extend beyond the inner surface 101IS, 201IS of the first housing 101, 201 and / or extend beyond the inner surface 102IS, 202IS of the second housing 102, 202, or within the inner surface 101IS, 201IS, 102IS, 202IS. The heat dissipation unit body 1030, 2030 can conduct heat energy of the electronic components 12, 16, 22, 24, 26, 28 to the annular extension component, and the annular extension component does not contact the first housing 101, 201 and the second housing 102, 202. Or when the annular extension component is not in contact with the first shell 101, 201 and the second shell 102, 202 to form a closed shell, the heat can be circulated and dissipated outside the shell; or when the annular extension component is in contact with the first shell 101, 201 and the second shell 102, 202 to form a closed shell, the heat dissipation unit body 1030, 2030 can conduct the heat energy of the electronic components 12, 16, 22, 24, 26, 28 to the annular extension component, and when the annular extension component is in contact with the first shell 101, 201 and the second shell 102, 202 to form a closed shell, the heat can be conducted to the first shell 101, 201 and the second shell 102, 202, and the annular extension component itself can also serve as a shell to facilitate heat dissipation.

[0040] See also Figure 3A , which is a schematic diagram showing an extension component of the heat dissipation unit 203 extending beyond a corner of the heat dissipation device 20 according to a preferred embodiment of the present disclosure. The hard disk device 20 has a first corner 20C1 and a second corner 20C2. The extension component 203EXT3 extends beyond the first corner 20C1 to contact the first connection surface 201S of the first housing 201. The extension component 203EXT4 extends beyond the second corner 20C2 to contact the first connection surface 201S of the first housing 201. The hard disk device 20 has a third corner 20C3 and a fourth corner 20C4. The extension component 203EXT3 extends beyond the third corner 20C3 to contact the second connection surface 202S of the second housing 202. The extension component 203EXT4 extends beyond the fourth corner 20C4 to contact the second connection surface 202S of the second housing 202.

[0041] See also Figure 3B , which is a preferred embodiment according to the present disclosure Figure 3ASchematic diagram of another embodiment. Extension assembly 203EXT3 and extension assembly 203EXT4 can be asymmetrical. For example, they can have different extension ranges. For example, extension assembly 203EXT3 extends beyond first corner 20C1 and third corner 20C3, while extension assembly 203EXT4 does not extend, or does not extend beyond second corner 20C2 and fourth corner 20C4. Of course, extension assemblies 203EXT3 and 203EXT4 can also extend only toward a single first housing 201 or only toward a single second housing 202.

[0042] See also Figure 4 and Figure 5 , which is a schematic diagram of a heat dissipation unit with openings according to a preferred embodiment of the present disclosure. The heat dissipation unit 203 has openings 203OP1 and 203OP2. The hard disk drive 20 further includes a first printed circuit board 204 and a second printed circuit board 205. The second printed circuit board 205 is electrically connected to the first printed circuit board 204 via at least one of a connector 206 and a flexible flat cable 207, wherein at least one of the connector 206 and the flexible flat cable 207 passes through the openings 203OP1 and 203OP2.

[0043] See also Figure 6 , which is a schematic diagram of a hard disk device 30 of another preferred embodiment of the present disclosure. The hard disk device 30 includes a first shell 301, a second shell 302, a heat dissipation unit 303, and at least one electronic component 32. The second shell 302 is arranged at a corresponding position of the first shell 301. The heat dissipation unit 303 has a first surface 303S1, a second surface 303S2, a first extension component 303EXT1, and a second extension component 303EXT2, wherein: the at least one electronic component 32 is in contact with at least one of the first surface 303S1 and the second surface 303S2: the first extension component 303EXT1 is in contact with the first shell 301 and the second shell 302, and the second extension component 303EXT2 is in contact with the first shell 301 and the second shell 302; and the first extension component 303EXT1 and the second extension component 303EXT2 serve as the third shell 303SH1, 303SH2 of the hard disk device 30.

[0044] In any embodiment of the present disclosure, the first extension member 103EXT1, 203ET1, 303EXT1 may extend just to a corner of the hard disk device 10, 20, 30, not beyond a corner of the hard disk device 10, 20, 30, or beyond a corner of the hard disk device 10, 20, 30.

[0045] In any embodiment of the present disclosure, the heat dissipation unit 103, 203, 303, the first housing 101, 201, 301, and the second housing 102, 202, 303 are made of a highly thermally conductive material, such as metal, or may be a housing with a heat dissipation effect. The at least one electronic component 32 is a heat-generating electronic component, which includes at least one of a processor chip, a memory chip, a power management chip, a communication chip, and an application-specific integrated circuit (ASIC). The at least one electronic component 32 is in direct or indirect contact with at least one of the first surface 303S1 and the second surface 303S2 to conduct heat energy from the at least one electronic component 32 to the heat dissipation unit 303. The first extension member 303EXT1 contacts the first housing 301 and the second housing 302, and the second extension member 303EXT2 contacts the first housing 301 and the second housing 302, thereby transferring heat from at least one of the first surface 303S1 and the second surface 303S2 of the heat dissipation unit 303 to the first extension member 303EXT1 and the second extension member 303EXT2. The first extension member 303EXT1 and the second extension member 303EXT2 serve as the third housing 303SH1 and 303SH2 of the hard disk drive 30, dissipating heat through the third housing 303SH1 and 303SH2. The first extension member 303EXT1 and the second extension member 303EXT2 are integrally formed with the heat dissipation unit 303.

[0046] In any embodiment of the present disclosure, a first thermally conductive element (not shown) is disposed between the heat dissipation unit 103, 203, 303 and the at least one electronic component 12, 16, 22, 24, 26, 28, 32. The first housing 101, 201, 301 and the second housing 102, 202, 302 respectively have a first connection surface 101S, 201S, 301S and a second connection surface 102S, 202S, 302S. A second thermally conductive element (not shown) is disposed between the first extension element 103EXT1, 203EXT1, 303EXT1 of the heat dissipation unit 103, 203, 303 and the first connection surface 101S, 201S, 301S and the second connection surface 102S, 202S, 302S. A second thermally conductive component is disposed between the second extension component 103EXT2, 203EXT2, 303EXT2 of each heat dissipation unit 103, 203, 303 and the first connection surface 101S, 201S, 301S and the second connection surface 102S, 202S, 302S. The first and second thermally conductive components contain a heat dissipation medium. In any embodiment of the present disclosure, the heat dissipation medium may be a heat dissipation grease, a heat dissipation pad, a heat dissipation gel, or the like.

[0047] In any embodiment of the present disclosure, the hard disk device 20, 30 has a first corner 20C1, 30C1 and a second corner 20C2, 30C2, the first extension component 203EXT1, 303EXT1 extends beyond the first corner 20C1, 30C1 and contacts the first connecting surface 201S, 301S of the first shell 201, 301, and the second extension component 203EXT2, 303EXT2 extends beyond the second corner 20C2, 30C2 and contacts the first connecting surface 201S, 301S of the first shell 201, 301. The hard disk device 20, 30 has a third corner 20C3, 30C3 and a fourth corner 20C4, 30C4. The first extension member 203EXT1, 303EXT1 extends beyond the third corner 20C3, 30C3 to contact the second connection surface 202S, 302S of the second housing 202, 302. The second extension member 203EXT2, 303EXT2 extends beyond the fourth corner 20C4, 30C4 to contact the second connection surface 202S, 302S of the second housing 202, 302. The heat dissipation unit 203 has openings 203OP1, 203OP2. The hard disk device 20, 30 further includes a first printed circuit board 204 and a second printed circuit board 205. The second printed circuit board 205 is electrically connected to the first printed circuit board 204 via at least one of a connector 206 and a flexible flat cable 207. At least one of the connector 206 and the flexible flat cable 207 passes through the openings 203OP1, 203OP2.

[0048] See also Figure 7 , which is a schematic diagram of a heat dissipation unit 403 for a hard disk device 40 according to a preferred embodiment of the present disclosure. The hard disk device 40 includes at least one electronic component 42, a first housing 401, and a second housing 402, and the heat dissipation unit 403 includes a heat dissipation unit body 4030 and at least one extension component 403EXT, including 403EXT1, 403EXT2, and 403EXT3. At least one extension component 403EXT extends from the heat dissipation unit body 4030, wherein: the at least one electronic component 42 is in contact with the heat dissipation unit body 4030; the at least one extension component 403EXT extends to the first housing 401 and the second housing 402; and the at least one extension component 403EXT serves as a third housing 403SH1, 403, SH2, 403SH3 of the hard disk device 40.

[0049] In any embodiment of the present disclosure, the extension component 403EXT1 and the extension component 403EXT2 can be regarded as annular extension components, and the extension component 403EXT3 can contact the connection surface 402S of the second housing 402, for example, the extension component 403EXT3 contacts the entire connection surface 402S. The heat dissipation unit body 4030 is at a distance D1 and D2 from both the first housing 401 and the second housing 402, and does not contact the first housing 401 and the second housing 402. The at least one electronic component 42 is at a distance D3 and D4 from both the first housing 401 and the second housing 402, and does not contact the first housing 401 and the second housing 402. The at least one extension component 403EXT contacts the first housing 401 and the second housing 402, for example, the extension component 403EXT1 and the extension component 403EXT2 contact the first housing 401, and the extension component 403EXT3 contacts the second housing 402.

[0050] In any embodiment of the present disclosure, the heat dissipation unit body 4030 has a first surface 403S1 and a second surface 403S2. The at least one electronic component 42 includes a first electronic component 22, 42 and a second electronic component 24. The first surface 403S1 is in direct or indirect contact with the first electronic component 22, 42, and the second surface 403S2 is in direct or indirect contact with the second electronic component 24. The at least one electronic component 12, 16, 22, 24, 26, 28, 32, 42 is at least one of a processor chip, a memory chip, a power management chip, a communication chip, and an application-specific integrated circuit (ASIC). The at least one extension component 403EXT includes a surrounding extension component surrounding the heat dissipation body 4030. For example, the extension component 403EXT1 and the extension component 403EXT2 can be considered the same surrounding extension component, and the other extension component 403EXT3 can also be considered another surrounding extension component. Alternatively, the at least one extension component 403EXT includes multiple extension components 403EXT1, 403EXT2, and 403EXT3. The surrounding extension components 403EXT1, 403EXT2, and 403EXT3 are integrally formed with the heat dissipation body 4030. The plurality of extension components 403EXT1, 403EXT2, and 403EXT3 contact the first housing 401 and the second housing 402. For example, the extension components 403EXT1 and 403EXT2 contact the first housing 401 and the second housing 402, while the extension component 403EXT3 contacts the second housing 402. A first heat conducting component (not shown) is disposed between the heat dissipation unit 103, 203, 303, and 403 and the at least one electronic component 12, 16, 22, 24, 26, 28, 32, and 42. The first housing 401 and the second housing 402 have a first connection surface 401S and a second connection surface 402S, respectively. A second thermally conductive element (not shown) is disposed between the plurality of extension elements 403EXT1, 403EXT2, and 403EXT3 of the heat dissipation unit 403 and the first connection surface 401S and the second connection surface 402S. The first and second thermally conductive elements contain a heat dissipation medium. The hard disk drive 40 has a first corner 40C1 and a second corner 40C2. The extension element 403EXT1 extends beyond the first corner 40C1 and contacts the first connection surface 401S of the first housing 401. The extension element 403EXT2 extends beyond the second corner 40C2 and contacts the first connection surface 401S of the first housing 401.The hard disk drive 40 has a third corner 40C3 and a fourth corner 40C4. The extension element 403EXT1 extends beyond the third corner 40C3 to contact the second connection surface 402S of the second housing 402. The extension element 403EXT2 extends beyond the fourth corner 40C4 to contact the second connection surface 402S of the second housing 402. The heat dissipation unit 40 has openings 203OP1 and 203OP2. The hard disk drives 10, 20, 30, and 40 further include a first printed circuit board 204 and a second printed circuit board 205. The second printed circuit board 205 is electrically connected to the first printed circuit board 204 via at least one of a connector 206 and a flexible flat cable 207. At least one of the connector 206 and the flexible flat cable 207 passes through the openings 203OP1 and 203OP2.

[0051] See also Figure 8A , which is a schematic diagram of a heat dissipation unit 503 for a hard disk device 50 according to another preferred embodiment of the present disclosure, wherein the hard disk device 50 includes a printed circuit board 504, two heat-generating electronic components 52, 56 respectively disposed on either side of the printed circuit board 504, and a housing 501 in contact with one of the two heat-generating electronic components 52, 56. The housing 501 has an inner surface 501IS and an outer surface 501ES. The other heat-generating electronic component 52 of the two heat-generating electronic components 52, 56 is located a distance D5 from the inner surface 501IS. The heat dissipation unit 503 includes a heat dissipation unit body 5030, which contacts the other heat-generating electronic component 52 and extends beyond the inner surface 501IS.

[0052] In any embodiment of the present disclosure, the other electronic component 52 is in direct contact with the heat dissipation unit 503 or is in indirect contact with the heat dissipation unit 503 via a heat conducting component (not shown). The heat dissipation unit 503 has an extension portion 503EXT1 that is in contact with the housing 501 .

[0053] See also Figure 8B , which is based on Figure 8A A schematic diagram of another embodiment of the heat dissipation unit 503. Figure 8B The extension portion 503EXT2 may have thicknesses T1 and T2 that are smaller than the thickness T of the heat dissipation unit body 5030 and may not contact the housing 501. In this case, the heat dissipation unit 503 may serve as a part of guiding the hot air flow.

[0054] See also Figure 8C , which is based on Figure 8B A schematic diagram of another embodiment of the heat dissipation unit 503. Figure 8CThe extension portion 503EXT2 may have thicknesses T1 and T2 equal to the thickness T of the heat dissipation unit body 5030 and may be in contact with the housing 501. In this case, the heat dissipation unit 503 may function as part of the contact conduction heat flow.

[0055] In any embodiment of the present disclosure, the thermally conductive component includes a heat dissipation medium; the housing 501 has at least one corner 50C1, 50C2, 50C3, 50C4, and the extension 503EXT of the heat dissipation unit 503 extends to the at least one corner 50C1, 50C2, 50C3, 50C4. The heat dissipation unit 503 has openings 203OP1, 203OP2. The hard disk drive 50 further includes another printed circuit board 205, which is electrically connected to the printed circuit board 204 via at least one of a connector 206 and a flexible flat cable 207, wherein at least one of the connector 206 and the flexible flat cable 207 passes through the openings 203OP1, 203OP2. The housing 501 can be a heat dissipation housing made of a heat dissipation material, such as a metal housing, or can be a housing with a heat dissipation effect. The housing 501 can also be a conventional housing without a heat dissipation material, in which case airflow can be used to dissipate heat.

[0056] See also Figure 9A , which is a schematic diagram of a heat dissipation unit 603 for a hard disk drive 60 according to another preferred embodiment of the present disclosure, wherein the hard disk drive 60 comprises a housing 601 and a plurality of internal heat-generating electronic components 62, 64. At least one of the plurality of internal heat-generating electronic components 62, 64 is spaced a distance D6 from the housing 601. The housing 601 comprises an inner surface 601IS and an outer surface 601ES. The heat dissipation unit 603 is an intermediate extension 603EXT that contacts at least one of the plurality of internal heat-generating electronic components 62, 64 and extends beyond the inner surface 601IS.

[0057] exist Figure 9A In the embodiment, the intermediate extension member 603EXT contacts the housing 601. The intermediate extension member 603EXT has an extension portion 603EXT1, and the extension portion 603EXT1 contacts the housing 601.

[0058] See also Figure 9B , which is based on Figure 9A Schematic diagram of another embodiment of the heat dissipation unit 603. The thicknesses T1 and T2 of the extension 603EXT2 may be smaller than the thickness T of the heat dissipation unit body 6030, and the extension 603EXT2 may not contact the housing 601. In this case, the heat dissipation unit 603 can serve as a part of guiding the thermal airflow.

[0059] See also Figure 9C , which is based on Figure 9B Schematic diagram of another embodiment of a heat dissipation unit 603. The thicknesses T1 and T2 of the extension 603EXT2 can be equal to the thickness T of the heat dissipation unit body 6030, and the extension 603EXT2 can contact the housing 601. In this case, the heat dissipation unit 603 can function as part of a contact conduction heat flow.

[0060] The multiple internal heat-generating electronic components 62, 64 are in direct contact with the heat dissipation unit 603, or indirectly contact the heat dissipation unit 603 via a heat conductive element (not shown). The heat conductive element includes a heat dissipation medium. The housing 601 has at least one corner 60C1, 60C2, 60C3, 60C4, and the intermediate extension 603EXT of the heat dissipation unit 603 extends to the at least one corner 60C1, 60C2, 60C3, 60C4. The heat dissipation unit 603 has openings 203OP1, 203OP2. The hard disk device 60 includes a printed circuit board 204. The printed circuit board 204 is electrically connected to the multiple heat-generating electronic components 62, 64 and is electrically connected to another printed circuit board 205 via at least one of a connector 206 and a flexible flat cable 207, wherein at least one of the connector 206 and the flexible flat cable 207 passes through the openings 203OP1, 203OP2.

[0061] Although the present invention is disclosed above with reference to several embodiments or examples, they are not intended to limit the present invention. Anyone skilled in the art may make slight changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

[0062] Explanation of symbols

[0063] 10, 20, 30, 40, 50, 60: Hard disk device

[0064] 101, 201, 301, 401: First shell

[0065] 102, 202, 302, 402: Second shell

[0066] 103, 203, 303, 403: cooling units

[0067] 101S, 201S, 301S, 401S: First connection surface

[0068] 102S, 202S, 302S, 402S: Second connection surface

[0069] 103S1, 203S1, 303S1, 403S1: First surface

[0070] 103S2, 203S2, 303S2, 403S2: Second surface

[0071] 103EXT1, 203EXT1, 303EXT1: First extension component

[0072] 103EXT2, 203EXT2, 303EXT2: Second extension component

[0073] 12, 16, 22, 24, 26, 28, 32: At least one electronic component

[0074] 1030, 2030, 3030, 4030: cooling unit body

[0075] 103SH1, 103SH2, 203SH1, 203SH2, 303SH1, 303SH2: Third housing

[0076] 104S1, 104S2, 204S1, 204S2, 205S1, 205S2: PCB surface

[0077] 104, 204, 205: Printed circuit board (PCB)

[0078] 203EXT3, 203EXT4: extension components

[0079] 20C1~20C4,30C1~30C4,40C1~40C4: at least one corner

[0080] 50C1~50C4,60C1~60C4: at least one corner

[0081] 203OP1, 203OP2: Opening

[0082] 206: Connector

[0083] 403EXT: At least one extension component

[0084] 403EXT1, 403EXT2: Extension component

[0085] 403SH1, 403SH2, 403SH3: Third shell

[0086] 403EXT3: Another extension component

[0087] D1, D2, D3, D4: distance

[0088] 503EXT1, 503EXT2: extension

[0089] T1, T2: Thickness of the extension

[0090] T: thickness of heat sink

[0091] 501,601: Shell

[0092] 501IS, 601IS: Inner surface of the shell

[0093] 503,603: cooling unit

[0094] 501ES, 601ES: Outer surface of the housing

[0095] 5030,6030: cooling unit body

[0096] 52,56: Two heat-generating electronic components

[0097] 62,64: Multiple internal heat-generating electronic components

[0098] 603EXT1, 603EXT2: extension

Claims

1. A hard disk device comprising: The first housing has a first connection surface: a second housing having a second connection surface and disposed at a corresponding position of the first housing; A heat dissipation unit having a first surface, a second surface, a first extension component, and a second extension component; as well as At least one electronic component, wherein: The at least one electronic component is in direct or indirect contact with at least one of the first surface and the second surface to conduct heat energy of the at least one electronic component from the at least one electronic component to the heat dissipation unit; The first extension component is in direct or indirect contact with the first connection surface and the second connection surface, and the second extension component is in direct or indirect contact with the first connection surface and the second connection surface, so as to conduct the heat energy from at least one of the first surface and the second surface of the heat dissipation unit to the first extension component and the second extension component; as well as The first extension component and the second extension component serve as a third housing of the hard disk device to dissipate the heat through the third housing.

2. The hard disk device according to claim 1, wherein: The at least one electronic component is a heat-generating electronic component comprising at least one of a processor chip, a memory chip, a power management chip, a communication chip, and an application-specific integrated circuit (ASIC); A first heat conducting component is provided between the heat dissipation unit and the at least one electronic component; A second heat conducting component is provided between the first extension component of the heat dissipation unit and the first connection surface and the second connection surface; The second heat conducting element is provided between the second extending element of the heat dissipation unit and the first connecting surface and the second connecting surface; The first heat-conducting component and the second heat-conducting component contain a heat dissipation medium; The first surface and the second surface of the heat dissipation unit are not in contact with the first housing and the second housing; The first extension component and the second extension component are integrally formed on the heat dissipation unit; The first extending component and the second extending component of the heat dissipation unit are disposed between the first housing and the second housing.

3. The hard disk device according to claim 1, wherein: The hard disk device has a first corner and a second corner, the first extension member extends beyond the first corner and contacts the first connection surface of the first housing, and the second extension member extends beyond the second corner and contacts the first connection surface of the first housing; The hard disk device has a third corner and a fourth corner, the first extension member extends beyond the third corner to contact the second connection surface of the second housing, and the second extension member extends beyond the fourth corner to contact the second connection surface of the second housing; The heat dissipation unit has an opening; and The hard disk device further comprises: a first printed circuit board; as well as The second printed circuit board is electrically connected to the first printed circuit board via at least one of a connector and a flexible flat cable, wherein at least one of the connector and the flexible flat cable passes through the opening.

4. A hard disk device comprising: First shell: a second housing, disposed at a position corresponding to the first housing; A heat dissipation unit having a first surface, a second surface, a first extension component, and a second extension component; as well as At least one electronic component, wherein: The at least one electronic component is in contact with at least one of the first surface and the second surface; The first extension member contacts the first housing and the second housing, and the second extension member contacts the first housing and the second housing; and The first extension component and the second extension component serve as a third housing of the hard disk device.

5. The hard disk device according to claim 4, wherein: The at least one electronic component is a heat-generating electronic component comprising at least one of a processor chip, a memory chip, a power management chip, a communication chip, and an application-specific integrated circuit (ASIC); The at least one electronic component is in direct or indirect contact with at least one of the first surface and the second surface to conduct heat energy of the at least one electronic component from the at least one electronic component to the heat dissipation unit; The first extension component is in contact with the first housing and the second housing, and the second extension component is in contact with the first housing and the second housing, so as to conduct the heat energy from at least one of the first surface and the second surface of the heat dissipation unit to the first extension component and the second extension component; The first extension component and the second extension component serve as a third housing of the hard disk device to dissipate the heat through the third housing; The first extension component and the second extension component are integrally formed on the heat dissipation unit; A first heat conducting component is provided between the heat dissipation unit and the at least one electronic component; The first shell and the second shell respectively have a first connecting surface and a second connecting surface; A second heat conducting component is provided between the first extension component of the heat dissipation unit and the first connection surface and the second connection surface; A second heat conducting component is provided between the second extending component of the heat dissipation unit and the first connecting surface and the second connecting surface; The first heat-conducting component and the second heat-conducting component contain a heat dissipation medium; The hard disk device has a first corner and a second corner, the first extension member extends beyond the first corner and contacts the first connection surface of the first housing, and the second extension member extends beyond the second corner and contacts the first connection surface of the first housing; The hard disk device has a third corner and a fourth corner, the first extension member extends beyond the third corner to contact the second connection surface of the second housing, and the second extension member extends beyond the fourth corner to contact the second connection surface of the second housing; The heat dissipation unit has an opening; and The hard disk device further comprises: a first printed circuit board; as well as The second printed circuit board is electrically connected to the first printed circuit board via at least one of a connector and a flexible flat cable, wherein at least one of the connector and the flexible flat cable passes through the opening.

6. A heat dissipation unit for a hard disk device, wherein the hard disk device comprises at least one electronic component, a first housing, and a second housing, and the heat dissipation unit comprises: a heat dissipation unit body; and At least one extension component extends from the heat dissipation unit body, wherein: The at least one electronic component is in contact with the heat dissipation unit body; The at least one extension member extends to the first housing and the second housing; and The at least one extension component serves as a third housing of the hard disk device.

7. The heat dissipation unit according to claim 6, wherein: The heat dissipation unit body is spaced apart from the first housing and the second housing, and does not contact the first housing and the second housing; The at least one electronic component is spaced apart from the first housing and the second housing, and does not contact the first housing and the second housing; The at least one extension member is in contact with the first housing and the second housing; The heat dissipation unit body has a first surface and a second surface; The at least one electronic component includes a first electronic component and a second electronic component, the first surface is in direct or indirect contact with the first electronic component, and the second surface is in direct or indirect contact with the second electronic component; The at least one electronic component is at least one of a processor chip, a memory chip, a power management chip, a communication chip, and an application-specific integrated circuit (ASIC); The at least one extension component includes a surrounding extension component surrounding the heat dissipation body, or the at least one extension component includes a plurality of extension components; The surrounding extension component is integrally formed with the heat dissipation body; The plurality of extension components are in contact with the first housing and the second housing; A first heat conducting component is provided between the heat dissipation unit and the at least one electronic component; The first shell and the second shell respectively have a first connecting surface and a second connecting surface; A second heat conducting element is provided between the plurality of extension elements of the heat dissipation unit and the first connection surface and the second connection surface; The first heat-conducting component and the second heat-conducting component contain a heat dissipation medium; The hard disk device has a first corner and a second corner, the first extension member extends beyond the first corner and contacts the first connection surface of the first housing, and the second extension member extends beyond the second corner and contacts the first connection surface of the first housing; The hard disk device has a third corner and a fourth corner, the first extension member extends beyond the third corner to contact the second connection surface of the second housing, and the second extension member extends beyond the fourth corner to contact the second connection surface of the second housing; The heat dissipation unit has an opening; and The hard disk device further comprises: a first printed circuit board; as well as The second printed circuit board is electrically connected to the first printed circuit board via at least one of a connector and a flexible flat cable, wherein at least one of the connector and the flexible flat cable passes through the opening.

8. A heat dissipation unit for a hard disk device, wherein: The hard disk device includes a printed circuit board, two heat-generating electronic components respectively disposed on both sides of the printed circuit board, and a housing in contact with one of the two heat-generating electronic components; The housing has an inner surface and an outer surface; The other of the two heat-generating electronic components is at a distance from the inner surface; and The heat dissipation unit includes a heat dissipation unit body, which contacts the other heat-generating electronic component and extends beyond the inner surface.

9. The heat dissipation unit according to claim 8, wherein: The other heat-generating electronic component is in direct contact with the heat dissipation unit, or is in indirect contact with the heat dissipation unit via a heat-conducting component; The heat dissipation unit has an extension portion, and the extension portion is in contact with the housing. The heat-conducting component includes a heat dissipation medium; The housing has at least one corner, and the extension portion of the heat dissipation unit extends to the at least one corner; The heat dissipation unit has an opening; and The hard disk device further comprises: Another printed circuit board is electrically connected to the printed circuit board via at least one of a connector and a flexible flat cable, wherein at least one of the connector and the flexible flat cable passes through the opening.

10. A heat dissipation unit for a hard disk device, wherein: The hard disk device has a housing and a plurality of internal heat-generating electronic components; At least one of the plurality of internal heat-generating electronic components is spaced apart from the housing; The housing has an inner surface and an outer surface; as well as The heat dissipation unit is an intermediate extension member that contacts at least one of the plurality of internal heat-generating electronic components and extends beyond the inner surface.

11. The heat dissipation unit according to claim 10, wherein: The intermediate extension is in contact with the housing; The plurality of internal heat-generating electronic components are in direct contact with the heat dissipation unit, or are in indirect contact with the heat dissipation unit via a heat-conducting component; The heat-conducting component includes a heat dissipation medium; The housing has at least one corner, and the intermediate extension piece of the heat dissipation unit extends to the at least one corner; The heat dissipation unit has an opening; and The hard disk device comprises: The printed circuit board is electrically connected to the plurality of heat-generating electronic components and is electrically connected to another printed circuit board via at least one of a connector and a flexible flat cable, wherein at least one of the connector and the flexible flat cable passes through the opening.

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